JP2011021193A - ダイシング・ダイボンドフィルム - Google Patents
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Abstract
【解決手段】基材上に粘着剤層を有するダイシングフィルムと、ダイシングフィルム上に設けられたダイボンドフィルムとを有するダイシング・ダイボンドフィルムであって、粘着剤層は、10〜30mol%のヒドロキシル基含有モノマーを含むアクリル系ポリマーに、ヒドロキシル基含有モノマーに対し70〜90mol%の範囲内のラジカル反応性炭素−炭素二重結合を有するイソシアネート化合物を付加反応させたポリマーと、ヒドロキシル基に対し反応性を示す官能基を分子中に2個以上備え、かつ、ポリマー100重量部に対し含有量が2〜20重量部の架橋剤を含み、ダイボンドフィルムはエポキシ樹脂を含み構成される。
【選択図】 図1
Description
本発明の実施の形態について、図1及び図2を参照しながら説明する。図1は、本実施の形態に係るダイシング・ダイボンドフィルムを示す断面模式図である。図2は、本実施の形態に係る他のダイシング・ダイボンドフィルムを示す断面模式図である。但し、説明に不要な部分は省略し、また、説明を容易にする為に拡大又は縮小等して図示した部分がある。
次に、本発明のダイシング・ダイボンドフィルムの製造方法について、ダイシング・ダイボンドフィルム10を例にして説明する。先ず、基材1は、従来公知の製膜方法により製膜することができる。当該製膜方法としては、例えばカレンダー製膜法、有機溶媒中でのキャスティング法、密閉系でのインフレーション押出法、Tダイ押出法、共押出し法、ドライラミネート法等が例示できる。
本発明のダイシング・ダイボンドフィルム10、11は、ダイボンドフィルム3、3’上に任意に設けられたセパレータを適宜に剥離して、次の様に使用される。以下では、図3を参照しながらダイシング・ダイボンドフィルム11を用いた場合を例にして説明する。
<ダイシングフィルムの作製>
冷却管、窒素導入管、温度計および撹拌装置を備えた反応容器に、アクリル酸2−エチルヘキシル(以下、「2EHA」という。)86.4部、アクリル酸−2−ヒドロキシエチル(以下、「HEA」という。)13.6部、過酸化ベンゾイル0.2部及びトルエン65部を入れ、窒素気流中で61℃にて6時間重合処理をし、アクリル系ポリマーAを得た。前記HEAは、20mol%とした。
アクリル酸エチル−メチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(根上工業(株)製、商品名;パラクロンW−197CM)100部に対して、エポキシ樹脂1(JER(株)製、エピコート1004)59部、エポキシ樹脂2(JER(株)製、エピコート827)53部、フェノール樹脂(三井化学(株)製、商品名:ミレックスXLC−4L)121部、球状シリカ(アドマテックス(株)製、商品名;SO−25R)222部をメチルエチルケトンに溶解して、濃度23.6重量%となる様に調製した。
各実施例2〜9については、下記表1に示す組成及び含有量に変更したこと以外は、前記実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
2EHA:アクリル酸2−エチルヘキシル
HEA:2−ヒドロキシエチルアクリレート
4HBA:4−ヒドロキシブチルアクリレート
AOI:2−アクリロイルオキシエチルイソシアネート
C/L:ポリイソシアネート化合物(商品名「コロネートL」、日本ポリウレタン(株)製)
C2030:商品名「コロネート2030」、日本ポリウレタン(株)社製)
各比較例1〜6については、下記表2に示す組成及び含有量に変更したこと以外は、前記実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
各実施例及び比較例のそれぞれダイシング・ダイボンドフィルムを用いて、以下の要領で、実際に半導体ウェハのダイシングを行い、各ダイシング・ダイボンドフィルムの性能を評価した。
研削装置:ディスコ社製 DFG−8560
半導体ウェハ:8インチ径(厚さ0.6mmから0.15mmに裏面研削)
貼り付け装置:日東精機製、MA−3000II
貼り付け速度計:10mm/min
貼り付け圧力:0.15MPa
貼り付け時のステージ温度:40℃
ダイシング装置:ディスコ社製、DFD−6361
ダイシングリング:2−8−1(ディスコ社製)
ダイシング速度:80mm/sec
ダイシングブレード:
Z1;ディスコ社製2050HEDD
Z2;ディスコ社製2050HEBB
ダイシングブレード回転数:
Z1;40,000rpm
Z2;40,000rpm
ブレード高さ:
Z1;0.215mm(半導体ウェハの厚みによる(ウェハ厚みが75μmの場合、0.170mm))
Z2;0.085mm
カット方式:Aモード/ステップカット
ウェハチップサイズ:1.0mm角
各実施例及び比較例のそれぞれダイシング・ダイボンドフィルムを用いて、以下の要領で、実際に半導体ウェハのダイシングを行った後にピックアップを行い、各ダイシング・ダイボンドフィルムの性能を評価した。
研削装置:ディスコ社製 DFG−8560
半導体ウェハ:8インチ径(厚さ0.6mmから0.075mmに裏面研削)
貼り付け装置:日東精機製、MA−3000II
貼り付け速度計:10mm/min
貼り付け圧力:0.15MPa
貼り付け時のステージ温度:40℃
ダイシング装置:ディスコ社製、DFD−6361
ダイシングリング:2−8−1(ディスコ社製)
ダイシング速度:80mm/sec
ダイシングブレード:
Z1;ディスコ社製2050HEDD
Z2;ディスコ社製2050HEBB
ダイシングブレード回転数:
Z1;40,000rpm
Z2;40,000rpm
ブレード高さ:
Z1;0.170mm(半導体ウェハの厚みによる(ウェハ厚みが75μmの場合、0.170mm))
Z2;0.085mm
カット方式:Aモード/ステップカット
ウェハチップサイズ:10.0mm角
紫外線(UV)照射装置:日東精機(商品名、UM−810製)
紫外線照射積算光量:300mJ/cm2
尚、紫外線照射はポリオレフィンフィルム側から行った。
ピックアップ条件については、下記表3に示す条件A及び条件Bによりそれぞれ行った。
ダイシングフィルムをダイシングリングから剥がし、ダイシングリングに糊残りが発生しているか否かを目視により確認した。糊残りが確認されたものを×とし、確認されなかったものを○とした。
2 粘着剤層
3 ダイボンドフィルム
4 半導体ウェハ
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
9 ヒートブロック
10、11 ダイシング・ダイボンドフィルム
Claims (4)
- 基材上に粘着剤層を有するダイシングテープと、該粘着剤層上に設けられたダイボンドフィルムとを備えるダイシング・ダイボンドフィルムのダイボンドフィルムの形成に用いられるダイ接着用接着剤組成物であって、
熱可塑性アクリル樹脂とエポキシ樹脂とフェノール樹脂とを少なくとも含有するダイ接着用接着剤組成物。 - 前記フェノール樹脂が、フェノールノボラック樹脂又はフェノールアラルキル樹脂である請求項1に記載のダイ接着用接着剤組成物。
- 前記エポキシ樹脂が、ノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、トリスヒドロキシフェニルメタン型樹脂及びテトラフェニロールエタン型エポキシ樹脂からなる群より選択される少なくとも1種である請求項1又は2に記載のダイ接着用接着剤組成物。
- 前記エポキシ樹脂中のエポキシ基1当量当たり前記フェノール樹脂中の水酸基が0.8〜1.2当量である請求項1〜3のいずれか1項に記載のダイ接着用接着剤組成物。
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JP4717052B2 (ja) | 2011-07-06 |
KR20100134738A (ko) | 2010-12-23 |
JP2009135378A (ja) | 2009-06-18 |
CN101855711B (zh) | 2012-02-22 |
JP4790074B2 (ja) | 2011-10-12 |
JP2010212704A (ja) | 2010-09-24 |
KR101370771B1 (ko) | 2014-03-06 |
DE112008003020T5 (de) | 2010-10-07 |
KR20100049694A (ko) | 2010-05-12 |
US20100239866A1 (en) | 2010-09-23 |
KR20130122026A (ko) | 2013-11-06 |
KR101370687B1 (ko) | 2014-03-05 |
CN101855711A (zh) | 2010-10-06 |
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