JP2011014837A5 - - Google Patents

Claims (7)

主表面及び前記主表面と反対側の裏面とを有する発熱部品と、
前記主表面上に配置され、前記発熱部品を駆動するための実装部品が搭載された回路基板と、
前記裏面上に配置され、前記発熱部品が発生する熱を放熱するためのヒートシンクとを備えた電子機器において、
前記主表面上から前記ヒートシンクまで延在する熱伝導体を有し、前記回路基板と前記発熱部品との間に配置された補助ベースを備えたことを特徴とする電子機器。 A heat generating component having a main surface and a back surface opposite to the main surface;
A circuit board disposed on the main surface and mounted with a mounting component for driving the heat-generating component;
In an electronic device comprising a heat sink disposed on the back surface and dissipating heat generated by the heat-generating component,
An electronic apparatus comprising: a heat conductor extending from the main surface to the heat sink, and an auxiliary base disposed between the circuit board and the heat generating component. 前記ヒートシンクには前記熱伝導体を通過せしめる貫通孔が前記発熱部品の一方の側に設けられ、前記熱伝導体は前記ヒートシンク側に突出することを特徴とする請求項１記載の電子機器。   2. The electronic apparatus according to claim 1, wherein the heat sink is provided with a through hole through which the heat conductor passes, on one side of the heat generating component, and the heat conductor protrudes toward the heat sink. 前記熱伝導体は第１熱伝導体群及び第２熱伝導体群より成り、前記第１熱伝導体群は前記貫通孔を通過し、
前記ヒートシンクの前記一方の側とは反対側の他方の側には前記第熱２伝導体群を通過せしめる第２の貫通孔が設けられたことを特徴とする請求項２記載の電子機器。 The heat conductor includes a first heat conductor group and a second heat conductor group, and the first heat conductor group passes through the through hole,
The electronic device according to claim 2, wherein a second through hole through which the second thermal second conductor group passes is provided on the other side of the heat sink opposite to the one side. 前記補助ベースは前記回路基板を固定する固定手段を備えたことを特徴とする請求項１乃至３のいずれか１項に記載の電子機器。 The auxiliary base electronic device according to any one of claims 1 to 3, further comprising a fixing means for fixing the circuit board. 前記熱伝導体は、前記発熱部品が発生する熱及び前記実装部品が発生する熱を前記ヒートシンクに伝えることを特徴とする請求項１乃至４のいずれか１項に記載の電子機器。 Wherein the heat conductor, the electronic device according to any one of claims 1 to 4, characterized in that transfer heat to heat and the mounting part in which the heat generating component is generated is generated in the heat sink. 前記ヒートシンクには、第1の方向に冷媒が流れていることを特徴とする請求項１乃至
５のいずれか１項に記載の電子機器。 Wherein the heat sink, an electronic device according to any one of claims 1 to 5, characterized in that the refrigerant flows in the first direction. 前記熱伝導体は前記第１の方向と平行な方向に扁平する扁平部を備えたことを特徴とする請求項６記載の電子機器。

The electronic apparatus according to claim 6, wherein the heat conductor includes a flat portion that is flat in a direction parallel to the first direction.