JP2010534413A5 - - Google Patents
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- Publication number
- JP2010534413A5 JP2010534413A5 JP2010518114A JP2010518114A JP2010534413A5 JP 2010534413 A5 JP2010534413 A5 JP 2010534413A5 JP 2010518114 A JP2010518114 A JP 2010518114A JP 2010518114 A JP2010518114 A JP 2010518114A JP 2010534413 A5 JP2010534413 A5 JP 2010534413A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- aluminum
- metal layer
- copper
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
Description
上記金属層3は、比較的に優れた反射度を有するアルミニウム(Al)又は銀(Ag)により形成されるものとしてもよい。或いはまた、上記金属層3は、銅(Cu)といったような導電性金属の上に上記アルミニウム又は銀をコーティングすることによって形成されるものとしてもよい。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070074399A KR101283282B1 (ko) | 2007-07-25 | 2007-07-25 | 발광 소자 패키지 및 그 제조방법 |
KR10-2007-0074399 | 2007-07-25 | ||
PCT/KR2008/004308 WO2009014376A2 (en) | 2007-07-25 | 2008-07-23 | Light emitting device package and method of manufacturing the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014154033A Division JP2014222771A (ja) | 2007-07-25 | 2014-07-29 | 発光素子パッケージ及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010534413A JP2010534413A (ja) | 2010-11-04 |
JP2010534413A5 true JP2010534413A5 (ja) | 2014-03-27 |
JP5620269B2 JP5620269B2 (ja) | 2014-11-05 |
Family
ID=40281979
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010518114A Expired - Fee Related JP5620269B2 (ja) | 2007-07-25 | 2008-07-23 | 発光素子パッケージ及びその製造方法 |
JP2012000145U Expired - Lifetime JP3175474U (ja) | 2007-07-25 | 2012-01-13 | 発光素子パッケージ |
JP2012000462U Expired - Lifetime JP3176890U (ja) | 2007-07-25 | 2012-01-31 | 発光素子パッケージ |
JP2014154033A Pending JP2014222771A (ja) | 2007-07-25 | 2014-07-29 | 発光素子パッケージ及びその製造方法 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012000145U Expired - Lifetime JP3175474U (ja) | 2007-07-25 | 2012-01-13 | 発光素子パッケージ |
JP2012000462U Expired - Lifetime JP3176890U (ja) | 2007-07-25 | 2012-01-31 | 発光素子パッケージ |
JP2014154033A Pending JP2014222771A (ja) | 2007-07-25 | 2014-07-29 | 発光素子パッケージ及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8624268B2 (ja) |
EP (1) | EP2176895B8 (ja) |
JP (4) | JP5620269B2 (ja) |
KR (1) | KR101283282B1 (ja) |
CN (1) | CN101755348A (ja) |
DE (3) | DE202008018180U1 (ja) |
WO (1) | WO2009014376A2 (ja) |
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KR101637581B1 (ko) * | 2010-03-09 | 2016-07-07 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US8525213B2 (en) * | 2010-03-30 | 2013-09-03 | Lg Innotek Co., Ltd. | Light emitting device having multiple cavities and light unit having the same |
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KR101659357B1 (ko) * | 2010-05-12 | 2016-09-23 | 엘지이노텍 주식회사 | 발광소자패키지 |
US8766526B2 (en) * | 2010-06-28 | 2014-07-01 | Lg Innotek Co., Ltd. | Light-emitting device package providing improved luminous efficacy and uniform distribution |
KR101208174B1 (ko) * | 2010-07-28 | 2012-12-04 | 엘지이노텍 주식회사 | 광학시트 및 이를 포함하는 발광소자패키지 |
US8564000B2 (en) | 2010-11-22 | 2013-10-22 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US8575639B2 (en) | 2011-02-16 | 2013-11-05 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
US9300062B2 (en) | 2010-11-22 | 2016-03-29 | Cree, Inc. | Attachment devices and methods for light emitting devices |
US9490235B2 (en) | 2010-11-22 | 2016-11-08 | Cree, Inc. | Light emitting devices, systems, and methods |
US8624271B2 (en) | 2010-11-22 | 2014-01-07 | Cree, Inc. | Light emitting devices |
US8455908B2 (en) * | 2011-02-16 | 2013-06-04 | Cree, Inc. | Light emitting devices |
JP5175956B2 (ja) * | 2011-07-06 | 2013-04-03 | シャープ株式会社 | 発光装置および表示装置 |
JP5228089B2 (ja) * | 2011-07-06 | 2013-07-03 | シャープ株式会社 | 発光装置および表示装置 |
KR20130014887A (ko) | 2011-08-01 | 2013-02-12 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조 방법 |
KR20140097284A (ko) | 2011-11-07 | 2014-08-06 | 크리,인코포레이티드 | 고전압 어레이 발광다이오드(led) 장치, 기구 및 방법 |
JP2013110273A (ja) * | 2011-11-21 | 2013-06-06 | Sharp Corp | 半導体発光装置 |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
WO2013185836A1 (en) * | 2012-06-15 | 2013-12-19 | Sferrum Gmbh | Led package and method for producing the same |
CN104813489B (zh) * | 2012-11-23 | 2018-01-02 | 首尔伟傲世有限公司 | 发光二极管及其制造方法 |
KR102075109B1 (ko) * | 2012-12-18 | 2020-02-10 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US9345091B2 (en) | 2013-02-08 | 2016-05-17 | Cree, Inc. | Light emitting device (LED) light fixture control systems and related methods |
CN105867013A (zh) * | 2015-01-24 | 2016-08-17 | 鸿富锦精密工业(深圳)有限公司 | 显示装置以及光源模组 |
KR102407329B1 (ko) * | 2015-08-05 | 2022-06-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 광원 모듈 및 이를 구비한 조명 장치 |
KR102528300B1 (ko) | 2016-03-10 | 2023-05-04 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
DE102016115630A1 (de) * | 2016-08-23 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
JP6729254B2 (ja) * | 2016-09-30 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置及び表示装置 |
USD823492S1 (en) | 2016-10-04 | 2018-07-17 | Cree, Inc. | Light emitting device |
CN111341750B (zh) * | 2018-12-19 | 2024-03-01 | 奥特斯奥地利科技与***技术有限公司 | 包括有导电基部结构的部件承载件及制造方法 |
JP7317635B2 (ja) * | 2019-08-29 | 2023-07-31 | 株式会社ジャパンディスプレイ | 表示装置 |
US11830833B2 (en) | 2020-07-24 | 2023-11-28 | Innolux Corporation | Electronic substrate and electronic device |
Family Cites Families (36)
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JPS59166535A (ja) | 1983-03-14 | 1984-09-19 | Nissan Motor Co Ltd | 樹脂成型物の塗装方法 |
JP3505353B2 (ja) | 1997-07-02 | 2004-03-08 | 株式会社東芝 | 半導体発光装置 |
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JP2001111165A (ja) | 1999-08-05 | 2001-04-20 | Matsushita Electronics Industry Corp | 半導体発光装置,光ヘッド装置及び光ディスク装置 |
JP2001196644A (ja) | 2000-01-11 | 2001-07-19 | Nichia Chem Ind Ltd | 光半導体装置及びその製造方法 |
JP4222017B2 (ja) | 2001-12-18 | 2009-02-12 | 日亜化学工業株式会社 | 発光装置 |
KR20030055625A (ko) | 2001-12-27 | 2003-07-04 | 에스케이 텔레콤주식회사 | 이동 통신망에서의 ppg를 이용한 단말 대 단말간콘텐츠 전송 시스템 |
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JP2005285899A (ja) | 2004-03-29 | 2005-10-13 | Kawaguchiko Seimitsu Co Ltd | 発光ダイオードのパッケージ構造 |
JP2005311153A (ja) | 2004-04-23 | 2005-11-04 | Harison Toshiba Lighting Corp | 発光素子の外囲器 |
KR100586968B1 (ko) | 2004-05-28 | 2006-06-08 | 삼성전기주식회사 | Led 패키지 및 이를 구비한 액정표시장치용 백라이트어셈블리 |
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KR101139891B1 (ko) * | 2005-01-31 | 2012-04-27 | 렌슬러 폴리테크닉 인스티튜트 | 확산 반사면을 구비한 발광 다이오드 소자 |
EP1686630A3 (en) * | 2005-01-31 | 2009-03-04 | Samsung Electronics Co., Ltd. | Led device having diffuse reflective surface |
JP2006253288A (ja) | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | 発光装置及びその製造方法 |
JP4655735B2 (ja) | 2005-04-20 | 2011-03-23 | パナソニック電工株式会社 | Ledユニット |
JP4343137B2 (ja) | 2005-04-25 | 2009-10-14 | 株式会社フジクラ | 発光素子実装用基板、光源、照明装置、表示装置及び交通信号機、発光素子実装用基板の製造方法 |
JP2006324438A (ja) * | 2005-05-18 | 2006-11-30 | Hitachi Cable Precision Co Ltd | ヒートシンク付表面実装型ledパッケージの製造方法 |
KR100719072B1 (ko) | 2005-10-28 | 2007-05-16 | (주) 아모센스 | 엘이디 패키지의 세라믹의 경사면 형성 방법 |
JP5214128B2 (ja) * | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
JP2007157805A (ja) | 2005-12-01 | 2007-06-21 | Stanley Electric Co Ltd | Ledパッケージ、発光装置及びledパッケージの製造方法 |
JP4817820B2 (ja) * | 2005-12-01 | 2011-11-16 | スタンレー電気株式会社 | Ledパッケージ、発光装置及びledパッケージの製造方法 |
KR100746783B1 (ko) * | 2006-02-28 | 2007-08-06 | 엘지전자 주식회사 | 발광소자 패키지 및 그 제조방법 |
EP1843194A1 (en) * | 2006-04-06 | 2007-10-10 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device, semiconductor device, and electronic appliance |
JP2007305785A (ja) * | 2006-05-11 | 2007-11-22 | Nichia Chem Ind Ltd | 発光装置 |
KR20090012493A (ko) * | 2007-07-30 | 2009-02-04 | 삼성전기주식회사 | 광자결정 발광소자 |
-
2007
- 2007-07-25 KR KR1020070074399A patent/KR101283282B1/ko active IP Right Grant
-
2008
- 2008-07-23 DE DE202008018180U patent/DE202008018180U1/de not_active Expired - Lifetime
- 2008-07-23 EP EP08792864.4A patent/EP2176895B8/en active Active
- 2008-07-23 DE DE202008018212U patent/DE202008018212U1/de not_active Expired - Lifetime
- 2008-07-23 WO PCT/KR2008/004308 patent/WO2009014376A2/en active Application Filing
- 2008-07-23 US US12/668,996 patent/US8624268B2/en active Active
- 2008-07-23 CN CN200880100063A patent/CN101755348A/zh active Pending
- 2008-07-23 DE DE202008018233U patent/DE202008018233U1/de not_active Expired - Lifetime
- 2008-07-23 JP JP2010518114A patent/JP5620269B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-13 JP JP2012000145U patent/JP3175474U/ja not_active Expired - Lifetime
- 2012-01-31 JP JP2012000462U patent/JP3176890U/ja not_active Expired - Lifetime
-
2013
- 2013-11-22 US US14/088,180 patent/US9287466B2/en not_active Expired - Fee Related
-
2014
- 2014-07-29 JP JP2014154033A patent/JP2014222771A/ja active Pending
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