JP2010267785A5 - - Google Patents

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Publication number
JP2010267785A5
JP2010267785A5 JP2009117666A JP2009117666A JP2010267785A5 JP 2010267785 A5 JP2010267785 A5 JP 2010267785A5 JP 2009117666 A JP2009117666 A JP 2009117666A JP 2009117666 A JP2009117666 A JP 2009117666A JP 2010267785 A5 JP2010267785 A5 JP 2010267785A5
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JP
Japan
Prior art keywords
solder
opening
side wall
jetted
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009117666A
Other languages
Japanese (ja)
Other versions
JP5410835B2 (en
JP2010267785A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2009117666A priority Critical patent/JP5410835B2/en
Priority claimed from JP2009117666A external-priority patent/JP5410835B2/en
Priority to CN201010174193.4A priority patent/CN101888746B/en
Publication of JP2010267785A publication Critical patent/JP2010267785A/en
Publication of JP2010267785A5 publication Critical patent/JP2010267785A5/ja
Application granted granted Critical
Publication of JP5410835B2 publication Critical patent/JP5410835B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

はんだ収容部に収容された溶融はんだを噴流手段により、ノズルから噴流させ、その噴流されたはんだにガスを吹き付ける噴流はんだ槽において、
前記ノズルを挿入する開口部と当該開口部より外側に位置する側壁とを有し、前記はんだ収容部の少なくとも一部を覆うカバー本体部と、
前記側壁の方向に向けて前記ガスを供給する複数の供給口を有し、前記開口部の周囲を囲うように当該開口部と前記側壁との間に設けられる供給管とを備えることを特徴とする噴流はんだ槽。
In the jet solder bath in which the molten solder accommodated in the solder accommodating portion is jetted from the nozzle by the jet means, and gas is blown to the jetted solder,
A cover main body having an opening for inserting the nozzle and a side wall located outside the opening, and covering at least a part of the solder housing;
A plurality of supply ports for supplying the gas toward the side wall, and a supply pipe provided between the opening and the side wall so as to surround the opening. injection flow solder bath you.
JP2009117666A 2009-05-14 2009-05-14 Jet solder bath Active JP5410835B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009117666A JP5410835B2 (en) 2009-05-14 2009-05-14 Jet solder bath
CN201010174193.4A CN101888746B (en) 2009-05-14 2010-05-13 Jet solder vessel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009117666A JP5410835B2 (en) 2009-05-14 2009-05-14 Jet solder bath

Publications (3)

Publication Number Publication Date
JP2010267785A JP2010267785A (en) 2010-11-25
JP2010267785A5 true JP2010267785A5 (en) 2012-05-24
JP5410835B2 JP5410835B2 (en) 2014-02-05

Family

ID=43074396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009117666A Active JP5410835B2 (en) 2009-05-14 2009-05-14 Jet solder bath

Country Status (2)

Country Link
JP (1) JP5410835B2 (en)
CN (1) CN101888746B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801809B (en) * 2014-01-29 2018-09-14 气体产品与化学公司 Device and method for providing inert gas during welding
CN108817588A (en) * 2018-05-30 2018-11-16 苏州精美科光电材料有限公司 A kind of pipe target applying method
JP7249215B2 (en) 2019-06-19 2023-03-30 株式会社デンソーテン Soldering machine and control method for soldering machine
CN114850714B (en) * 2022-04-12 2023-08-08 深圳市林鑫达智能装备有限公司 Welding equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
JP3420283B2 (en) * 1993-06-07 2003-06-23 株式会社タムラ製作所 Method and apparatus for controlling oxygen concentration in soldering apparatus for inert atmosphere
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
JP2000071066A (en) * 1998-08-28 2000-03-07 Tokyo Seisan Giken Kk Nitrogen package integrated solder tank
JP2001119134A (en) * 1999-10-22 2001-04-27 Nihon Dennetsu Keiki Co Ltd Soldering device
JP2002057449A (en) * 2000-08-11 2002-02-22 Air Liquide Japan Ltd Gas-supplying and soldering devices
JP3867511B2 (en) * 2001-04-05 2007-01-10 スズキ株式会社 Partial soldering equipment

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