JP2010245250A - Substrate-sorting device - Google Patents

Substrate-sorting device Download PDF

Info

Publication number
JP2010245250A
JP2010245250A JP2009091801A JP2009091801A JP2010245250A JP 2010245250 A JP2010245250 A JP 2010245250A JP 2009091801 A JP2009091801 A JP 2009091801A JP 2009091801 A JP2009091801 A JP 2009091801A JP 2010245250 A JP2010245250 A JP 2010245250A
Authority
JP
Japan
Prior art keywords
substrate
random access
buffer device
access buffer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009091801A
Other languages
Japanese (ja)
Inventor
Tomonori Shida
倫教 志田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp filed Critical IHI Corp
Priority to JP2009091801A priority Critical patent/JP2010245250A/en
Priority to TW099108178A priority patent/TWI520252B/en
Priority to CN2010101551249A priority patent/CN101857126B/en
Publication of JP2010245250A publication Critical patent/JP2010245250A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To suppress retention of a substrate on a transfer line, without having to move the substrate out of a transfer path, even when substrates for different transfer places are mixed. <P>SOLUTION: A random access buffer device 5 is interposed between the transfer line 3, through which two substrates A101 and B101 are carried in, and a process device 9 for processing the substrate A101. Then the substrate A101 and B101 which are carried in the transfer line 3 are inserted to a vacant holding part 11 of the random access buffer device 5, in the order, by a substrate support mechanism 12 on the carry-in side. On the substrate support mechanism 12 on the carry-out side, only the substrate A101 is removed from the holding part 11 and is sent out to the process device 9 via a carry-in conveyer CV. After all the substrate A101 are cleared away from the holding part 11, the process device 9 is replaced with one for processing the substrate B101, and all the remaining substrates B101 are taken out from the holding part 11 to the process device 9. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、基板の搬送ラインからその下流の処理装置に基板を搬送する基板仕分け装置に関するものである。   The present invention relates to a substrate sorting apparatus for transporting a substrate from a substrate transport line to a downstream processing apparatus.

例えば半導体の基板をプロセス装置等の処理装置に搬送する枚葉搬送ラインにおける基板の滞留の対策としては、基板を一時的に保管するバッファ装置を利用するのが効果的である。従来から提案されているバッファ装置には、昇降するカセット式のラックと搬送ラインとの間でアームやフォークにより基板を移送するものや（例えば、特許文献１）、搬送ライン上に昇降式のラックを組み込んだインラインバッファ装置（例えば、特許文献２）がある。   For example, as a countermeasure against retention of a substrate in a single wafer transfer line for transferring a semiconductor substrate to a processing apparatus such as a process apparatus, it is effective to use a buffer device that temporarily stores the substrate. Conventionally proposed buffer devices include one that transfers a substrate by an arm or a fork between a cassette-type rack that moves up and down and a transfer line (for example, Patent Document 1), and a lift-type rack that is placed on the transfer line. There is an in-line buffer device (for example, Patent Document 2) in which is incorporated.

ラックと搬送ラインとの間で基板を移送するバッファ装置の場合は、搬送ライン上の基板にアクセスするために、搬送ラインとは別にアームやフォークを必要とし、また、ラックの各段に対して基板を出し入れするために、ラックを昇降させる機構が必要となる。これらの構成を連動させなければならないバッファ装置は複雑で大がかりなものとなる。また、搬送経路の外にあるラックに対して基板を受け渡す必要があるため、その際に基板が損傷しないようにするための対策も必要となる。   In the case of a buffer device that transfers a substrate between a rack and a transfer line, an arm or a fork is required separately from the transfer line to access the substrate on the transfer line. In order to take in and out the substrate, a mechanism for raising and lowering the rack is required. The buffer device that must link these configurations is complicated and large. In addition, since it is necessary to deliver the substrate to the rack outside the transport path, it is necessary to take measures to prevent the substrate from being damaged at that time.

これに対し、インラインバッファ装置の場合は、搬送ライン上に組み込まれるため、アームやフォークが不要であり装置の複雑化を避けることができる。また、基板のバッファリングを搬送ライン上で行うことから、搬送経路の外にあるラックに対する基板の受け渡しとその際の基板損傷対策とを不要とすることができる。以上の点でインラインバッファ装置は先のバッファ装置よりも利点がある。しかし、ラックを一段ずつ昇降させながら基板を出し入れするので、ラックに対する基板の出し入れが先入れ後出し方式となってしまう。このため、搬送先が異なる基板が混在する場合は、搬送先別に基板を仕分ける工程を別途設けなければならない。   On the other hand, in the case of the inline buffer device, since it is incorporated on the transport line, an arm and a fork are unnecessary, and the complexity of the device can be avoided. In addition, since the buffering of the substrate is performed on the transfer line, it is possible to eliminate the need for the transfer of the substrate to the rack outside the transfer path and the substrate damage countermeasure at that time. In the above points, the inline buffer device has advantages over the previous buffer device. However, since the substrate is taken in and out while raising and lowering the rack one step at a time, the loading and unloading of the substrate with respect to the rack becomes a first-in last-out method. For this reason, when substrates with different transport destinations coexist, a process of sorting the substrates according to the transport destination must be provided separately.

基板を搬送先別に仕分ける際には、例えばクロスコンベヤを用いることができる（例えば、特許文献３）。しかし、仕分けした基板が仕分け先の搬送ライン上で滞留すると、やがて、滞留した基板の列がクロスコンベヤを超えてその手前にまで達し、基板が滞留していない搬送ラインにも基板を仕分けられなくなる。   When sorting substrates according to transport destination, for example, a cross conveyor can be used (for example, Patent Document 3). However, if the sorted substrates stay on the sorting line, the line of the staying substrates will eventually reach the front of the cross conveyor and will not be able to be sorted even on the carrying line where the substrates are not staying. .

特許第３８９２４９４号公報Japanese Patent No. 3894494 特開２００７−１５７８９号公報JP 2007-15789 A 特開２００６−３１２５０７号公報JP 2006-31507 A

上述したような枚葉搬送ラインにおける基板の滞留を抑制するに当たっては、搬送経路の外に基板を移動させる必要がなく、かつ、搬送先が異なる基板が混在する場合でも適切に対応できる構成とすることが望ましい。   In order to suppress the retention of the substrate in the single wafer conveyance line as described above, it is not necessary to move the substrate outside the conveyance path, and it is possible to appropriately cope with a case where substrates having different conveyance destinations coexist. It is desirable.

本発明は前記事情に鑑みなされたもので、本発明の目的は、搬送先が異なる基板が混在する場合であっても、搬送経路の外に基板を移動させずに搬送ラインにおける基板の滞留を抑制することができる基板仕分け装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object of the present invention is to retain a substrate in a transport line without moving the substrate out of the transport path even when substrates having different transport destinations are mixed. An object of the present invention is to provide a substrate sorting apparatus that can be suppressed.

上記目的を達成するため、請求項１に記載した本発明の基板仕分け装置は、
基板の搬送ラインからその下流の処理装置に、該処理装置によって処理する種類の基板を選別して搬送する基板仕分け装置であって、
前記搬送ラインと前記処理装置との間に介設されて基板を一時的に保持するバッファ装置を備えており、
前記バッファ装置が、基板を保持する複数の保持部のうち任意の保持部に前記搬送ラインから基板を受け入れ、かつ、任意の保持部から基板を前記処理装置に払い出すことが可能なランダムアクセスバッファ装置であり、
前記ランダムアクセスバッファ装置が、前記各保持部に受け入れた基板のうち、前記処理装置によって処理する種類の基板を選別して該処理装置に払い出す、
ことを特徴とする。 In order to achieve the above object, a substrate sorting apparatus according to the present invention described in claim 1 includes:
A substrate sorting device for sorting and transporting a substrate of a type to be processed by the processing device from a substrate transport line to a downstream processing device,
A buffer device interposed between the transfer line and the processing apparatus to temporarily hold the substrate;
Random access buffer in which the buffer device can receive a substrate from the transfer line in an arbitrary holding portion among a plurality of holding portions that hold the substrate, and discharge the substrate from the arbitrary holding portion to the processing apparatus. Device,
The random access buffer device sorts out the types of substrates to be processed by the processing device out of the substrates received by the holding units, and pays out to the processing device.
It is characterized by that.

請求項１に記載した本発明の基板仕分け装置によれば、搬送ラインから処理装置に基板を搬送する際に、ランダムアクセスバッファ装置に受け入れた基板のうち処理装置によって処理する種類の基板が、ランダムアクセスバッファ装置から選別して処理装置に払い出される。   According to the substrate sorting apparatus of the present invention described in claim 1, when the substrate is transferred from the transfer line to the processing device, the type of substrate processed by the processing device among the substrates received in the random access buffer device is random. Sorted out from the access buffer device and paid out to the processing device.

なお、処理装置によって処理しない種類の基板は、例えば、ランダムアクセスバッファ装置に受け入れたまま保持させておくことができる。そして、受け入れたままランダムアクセスバッファ装置に保持させた他の種類の基板は、例えば、その種類の基板を処理する装置に処理装置が交換された際に、ランダムアクセスバッファ装置から選別して払い出すことができる。   In addition, the kind of board | substrate which is not processed with a processing apparatus can be hold | maintained as received in the random access buffer apparatus, for example. Then, other types of substrates received and held in the random access buffer device are sorted out from the random access buffer device when, for example, the processing device is replaced with a device that processes that type of substrate. be able to.

したがって、搬送ラインにより搬送される基板を一時的に保持するバッファ処理と、処理装置で処理する種類の基板を選別する仕分け処理とを、ランダムアクセスバッファ装置において両方実現することができる。このため、搬送先が異なる基板が搬送ラインに混在していても、搬送ラインからライン外に基板を移動させずに基板の滞留を確実に抑制することができる。   Therefore, both the buffer processing for temporarily holding the substrate transported by the transport line and the sorting processing for selecting the type of substrate to be processed by the processing device can be realized in the random access buffer device. For this reason, even if the board | substrate from which a conveyance destination differs is mixed in a conveyance line, retention of a board | substrate can be suppressed reliably, without moving a board | substrate from a conveyance line out of a line.

また、請求項２に記載した本発明の基板仕分け装置は、請求項１に記載した本発明の基板仕分け装置において、前記搬送ラインの下流の位置を含む複数の位置間で前記ランダムアクセスバッファ装置を移動させる移動ユニットをさらに備えており、前記処理装置が、前記複数の位置のうち所定位置の下流に配置されており、前記ランダムアクセスバッファ装置は、前記搬送ラインの下流の位置において該搬送ラインから前記各保持部に受け入れた基板のうち、前記処理装置によって処理する種類の基板を選別して、前記所定位置において前記処理装置に払い出すことを特徴とする。   A substrate sorting apparatus according to a second aspect of the present invention is the substrate sorting apparatus according to the first aspect of the present invention, wherein the random access buffer device is placed between a plurality of positions including a position downstream of the transfer line. A moving unit that moves the processing device; the processing device is disposed downstream of the predetermined position among the plurality of positions; and the random access buffer device is located at a position downstream of the transport line from the transport line. Of the substrates received in the holding units, a type of substrate to be processed by the processing device is selected and dispensed to the processing device at the predetermined position.

請求項２に記載した本発明の基板仕分け装置によれば、請求項１に記載した本発明の基板仕分け装置において、移動ユニットによって搬送ラインの下流の位置に移動されたランダムアクセスバッファ装置が、複数の種類が混在した基板を搬送ラインから各保持部に受け入れる。また、移動ユニットによって所定位置に移動されたランダムアクセスバッファ装置が、各保持部に受け入れた基板のうち処理装置によって処理する種類の基板を選別して払い出す。   According to the substrate sorting apparatus of the present invention described in claim 2, in the substrate sorting apparatus of the present invention described in claim 1, a plurality of random access buffer devices moved to a position downstream of the transfer line by the moving unit are provided. Substrate mixed in is received from the transfer line to each holding unit. Further, the random access buffer device moved to a predetermined position by the moving unit selects and pays out the type of substrate to be processed by the processing device among the substrates received by the holding units.

なお、処理装置によって処理しない種類の基板は、移動ユニットによって所定位置以外の位置に移動されたランダムアクセスバッファ装置によって、種類別に選別して払い出すことができる。例えば、ランダムアクセスバッファ装置が移動した所定位置以外の位置の下流に他の搬送ラインが配置されている場合は、その搬送ラインにおいて搬送する対象の種類の基板を選別して払い出すことができる。   Note that the types of substrates that are not processed by the processing device can be sorted out by type by the random access buffer device that has been moved to a position other than the predetermined position by the moving unit. For example, when another transfer line is arranged downstream of a position other than the predetermined position where the random access buffer device has moved, it is possible to select and pay out the target type of substrate to be transferred in the transfer line.

したがって、ランダムアクセスバッファ装置を移動ユニットによって適宜移動させることで、ランダムアクセスバッファ装置に受け入れた基板を種類別にそれぞれの搬送先に仕分けることができる。   Accordingly, by appropriately moving the random access buffer device by the moving unit, the substrates received in the random access buffer device can be sorted into the respective transport destinations by type.

さらに、請求項３に記載した本発明の基板仕分け装置は、請求項２に記載した本発明の基板仕分け装置において、前記複数の位置のうち前記所定位置とは異なる位置の下流に配置され、前記処理装置とは処理する基板の種類が異なる他の処理装置をさらに備えており、前記ランダムアクセスバッファ装置が、前記搬送ラインから前記各保持部に受け入れた基板のうち、前記他の処理装置によって処理する種類の基板を選別して、前記所定位置とは異なる位置において前記他の処理装置に払い出すことを特徴とする。   Furthermore, the substrate sorting apparatus of the present invention described in claim 3 is the substrate sorting apparatus of the present invention described in claim 2, and is disposed downstream of the plurality of positions different from the predetermined position, The apparatus further includes another processing apparatus having a different type of substrate to be processed from the processing apparatus, and the random access buffer apparatus performs processing by the other processing apparatus among the substrates received from the transfer line to the holding units. The type of the substrate to be selected is selected and delivered to the other processing apparatus at a position different from the predetermined position.

請求項３に記載した本発明の基板仕分け装置によれば、請求項２に記載した本発明の基板仕分け装置において、移動ユニットによって所定位置とは異なる位置に移動されたランダムアクセスバッファ装置が、各保持部に受け入れた基板のうち他の処理装置によって処理する種類の基板を選別して払い出す。   According to the substrate sorting apparatus of the present invention described in claim 3, in the substrate sorting apparatus of the present invention described in claim 2, each of the random access buffer devices moved to a position different from the predetermined position by the moving unit, Of the substrates received in the holding unit, a substrate of a type to be processed by another processing apparatus is selected and dispensed.

したがって、ランダムアクセスバッファ装置を移動ユニットによって適宜移動させることで、ランダムアクセスバッファ装置に受け入れた基板を種類別にそれぞれの基板に対する処理を行う処理装置に仕分けることができる。   Accordingly, by appropriately moving the random access buffer device by the moving unit, the substrates received in the random access buffer device can be sorted into processing devices that perform processing on each substrate by type.

本発明の基板仕分け装置によれば、搬送先が異なる基板が混在する場合であっても、搬送ラインからライン外に基板を移動させずに搬送ラインにおける基板の滞留を抑制することができる。   According to the substrate sorting apparatus of the present invention, even when substrates with different transfer destinations coexist, the retention of the substrate in the transfer line can be suppressed without moving the substrate from the transfer line to the outside of the line.

本発明の一実施形態に係る基板仕分け装置の概略構成を示す平面図である。It is a top view showing a schematic structure of a substrate sorting device concerning one embodiment of the present invention. 図１のランダムアクセスバッファ装置の構成を示す斜視図である。It is a perspective view which shows the structure of the random access buffer apparatus of FIG. 図１の基板仕分け装置の動作を示す平面図である。It is a top view which shows operation | movement of the board | substrate sorting apparatus of FIG. 本発明の他の実施形態に係る基板仕分け装置の概略構成を示す平面図である。It is a top view which shows schematic structure of the board | substrate sorting apparatus which concerns on other embodiment of this invention. 本発明のさらに他の実施形態に係る基板仕分け装置の概略構成を示す平面図である。It is a top view which shows schematic structure of the board | substrate sorting apparatus which concerns on further another embodiment of this invention.

以下、本発明の実施形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は本発明の一実施形態に係る基板仕分け装置の構成を示す平面図である。図１中引用符号１で示す本実施形態の基板仕分け装置は、複数種類の基板１０１が混在して搬送される搬送ライン３と、搬送ライン３上の基板１０１を仕分けるランダムアクセスバッファ装置５とを有している。   FIG. 1 is a plan view showing a configuration of a substrate sorting apparatus according to an embodiment of the present invention. The substrate sorting apparatus of this embodiment indicated by reference numeral 1 in FIG. 1 includes a transport line 3 in which a plurality of types of substrates 101 are mixed and a random access buffer device 5 that sorts the substrates 101 on the transport line 3. Have.

搬送ライン３は複数のコンベアＣＶ，ＣＶ，…で構成されており、図中一番左の搬入側のコンベアＣＶから基板１０１が搬入される。また、搬送ライン３の図中一番右の搬出側のコンベアＣＶには、ランダムアクセスバッファ装置５の搬入側が接続されている。ランダムアクセスバッファ装置５の下流側にはプロセス装置９（請求項中の処理装置に相当）が配置されている。プロセス装置９の上流側及び下流側には、基板１０１の搬入用と搬出用の各コンベアＣＶが接続されている。ランダムアクセスバッファ装置５は、搬送ライン３上の基板１０１を、プロセス装置９で処理する種類の基板１０１とプロセス装置９で処理しない種類の基板１０１とに仕分ける。   The conveyance line 3 is composed of a plurality of conveyors CV, CV,..., And the substrate 101 is carried in from the leftmost conveyor CV in the drawing. In addition, the carry-in side of the random access buffer device 5 is connected to the conveyor CV on the rightmost carry-out side of the transfer line 3 in the drawing. On the downstream side of the random access buffer device 5, a process device 9 (corresponding to a processing device in claims) is arranged. On the upstream side and downstream side of the process apparatus 9, conveyors CV for carrying in and carrying out the substrate 101 are connected. The random access buffer device 5 sorts the substrate 101 on the transfer line 3 into a type of substrate 101 that is processed by the process device 9 and a type of substrate 101 that is not processed by the process device 9.

図２はランダムアクセスバッファ装置５の具体的な構成を示す斜視図である。図２に示すようにランダムアクセスバッファ装置５は、基板１０１を保持する複数の保持部１１の両側側に昇降可能な基板支持機構１２を備えており、この基板支持機構１２により、複数の保持部１１のうちの任意の保持部１１への基板１０１の挿入が可能であって、かつ、保持している複数の基板１０１のうちの任意の基板の取り出しが可能に構成されている。基板支持機構１２は、制御装置によって制御される。   FIG. 2 is a perspective view showing a specific configuration of the random access buffer device 5. As shown in FIG. 2, the random access buffer device 5 includes a substrate support mechanism 12 that can move up and down on both sides of a plurality of holding portions 11 that hold the substrate 101, and the substrate supporting mechanism 12 allows the plurality of holding portions to be moved. 11 is configured such that the substrate 101 can be inserted into any holding unit 11 and that any of the plurality of held substrates 101 can be taken out. The substrate support mechanism 12 is controlled by a control device.

なお、このランダムアクセスバッファ装置の構成については、本願出願人が先に提案した特開２００５−１７０６７５公報及び特開２００５−１７５４２９公報に記載されている。   The configuration of the random access buffer device is described in Japanese Patent Laid-Open Nos. 2005-170675 and 2005-175429 previously proposed by the applicant of the present application.

図２のランダムアクセスバッファ装置５を用いた図１の基板仕分け装置１では、搬送ライン３の搬入側のコンベアＣＶに搬入した基板１０１を、搬送ライン３の搬出側のコンベアＣＶから受け取って、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に順次挿入する。その際、基板１０１に貼付したＩＣタグを読み取る等して、基板１０１の種類を判別する。以後の説明においては、搬送ライン３に２種類の基板Ａ１０１、基板Ｂ１０１が搬入されるものとする。また、図１のプロセス装置９では基板Ａ１０１に対する処理を行うものとする。   In the substrate sorting apparatus 1 of FIG. 1 using the random access buffer device 5 of FIG. 2, the substrate 101 carried into the carry-in conveyor CV of the transfer line 3 is received from the carry-out conveyor CV of the carry line 3 and loaded. The board is sequentially inserted into the vacant holding unit 11 of the random access buffer device 5 by the side substrate support mechanism 12. At that time, the type of the substrate 101 is determined by reading an IC tag attached to the substrate 101. In the following description, it is assumed that two types of substrates A101 and B101 are carried into the transfer line 3. Further, it is assumed that the process apparatus 9 of FIG. 1 performs processing on the substrate A101.

２種類の基板Ａ１０１及び基板Ｂ１０１が保持部１１に順次挿入されたランダムアクセスバッファ装置５では、搬出側の基板支持機構１２によって基板Ａ１０１のみを保持部１１から取り出して、搬入用のコンベアＣＶを介してプロセス装置９に払い出す。このとき、基板Ａ１０１のプロセス装置９への払い出しは、プロセス装置９による基板Ａ１０１の処理ペースに合わせたペースで行う。   In the random access buffer device 5 in which the two types of substrates A101 and B101 are sequentially inserted into the holding unit 11, only the substrate A101 is taken out from the holding unit 11 by the substrate support mechanism 12 on the carry-out side, and is passed through the carry-in conveyor CV. To the process device 9. At this time, the substrate A101 is discharged to the process apparatus 9 at a pace that matches the processing pace of the substrate A101 by the process apparatus 9.

したがって、プロセス装置９で処理しない基板Ｂ１０１や、プロセス装置９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１は、ランダムアクセスバッファ装置５の保持部１１に空きがある限り一時的に保持（バッファリング）される。   Therefore, the substrate B101 that is not processed by the process device 9 or the substrate A101 that is carried into the transfer line 3 at a pace that exceeds the processing pace of the process device 9 is temporary as long as the holding unit 11 of the random access buffer device 5 has an empty space. Held (buffered).

ランダムアクセスバッファ装置５の保持部１１から基板Ａ１０１が全て払い出されて、保持部１１が基板Ｂ１０１のみとなったならば、プロセス装置９を、基板Ａ１０１に対する処理を行うものから基板Ｂ１０１に対する処理を行うものに入れ替える。   If all the substrates A101 are discharged from the holding unit 11 of the random access buffer device 5 and the holding unit 11 is only the substrate B101, the process device 9 performs processing on the substrate B101 from what performs processing on the substrate A101. Replace with what you want to do.

そして、図３の説明図に示すように、ランダムアクセスバッファ装置５の搬出側の基板支持機構１２によって基板Ｂ１０１を保持部１１から取り出して、搬入用のコンベアＣＶを介してプロセス装置９に払い出す。これと並行して、搬送ライン３に搬入された基板Ａ１０１や基板Ｂ１０１を、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に挿入する。   Then, as shown in the explanatory diagram of FIG. 3, the substrate support mechanism 12 on the carry-out side of the random access buffer device 5 takes out the substrate B101 from the holding unit 11 and pays it out to the process device 9 via the carry-in conveyor CV. . In parallel with this, the substrate A101 and the substrate B101 carried into the transfer line 3 are inserted into the vacant holding unit 11 of the random access buffer device 5 by the substrate support mechanism 12 on the carry-in side.

したがって、プロセス装置９で処理しない基板Ａ１０１や、プロセス装置９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ｂ１０１は、ランダムアクセスバッファ装置５の保持部１１に空きがある限り一時的に保持（バッファリング）される。   Therefore, the substrate A101 that is not processed by the process device 9 and the substrate B101 that is carried into the transfer line 3 at a pace that exceeds the processing pace of the process device 9 are temporarily as long as the holding unit 11 of the random access buffer device 5 has an empty space. Held (buffered).

ランダムアクセスバッファ装置５の保持部１１から基板Ｂ１０１が全て払い出されて、保持部１１が基板Ａ１０１のみとなったならば、プロセス装置９を、基板Ｂ１０１に対する処理を行うものから基板Ａ１０１に対する処理を行うものに再び入れ替える。   If all the substrates B101 are paid out from the holding unit 11 of the random access buffer device 5 and the holding unit 11 is only the substrate A101, the process device 9 performs processing on the substrate A101 from what performs processing on the substrate B101. Replace again with what you want to do.

そして、図１の説明図に示すように、ランダムアクセスバッファ装置５の搬出側の基板支持機構１２によって基板Ａ１０１を保持部１１から取り出して、搬入用のコンベアＣＶを介してプロセス装置９に払い出す。これと並行して、搬送ライン３に搬入された基板Ａ１０１や基板Ｂ１０１を、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に挿入する。   Then, as shown in the explanatory view of FIG. 1, the substrate support mechanism 12 on the carry-out side of the random access buffer device 5 takes out the substrate A101 from the holding unit 11 and pays it out to the process device 9 via the carry-in conveyor CV. . In parallel with this, the substrate A101 and the substrate B101 carried into the transfer line 3 are inserted into the vacant holding unit 11 of the random access buffer device 5 by the substrate support mechanism 12 on the carry-in side.

以上の動作を、搬送ライン３への基板Ａ１０１や基板Ｂ１０１の搬入が終了するまで繰り返す。搬送ライン３への基板Ａ１０１や基板Ｂ１０１の搬入が終了したならば、この時点でランダムアクセスバッファ装置５に接続されているプロセス装置９に対して、そのプロセス装置９で処理する基板Ａ１０１（又は基板Ｂ１０１）の払い出しを終了させる。ここで、そのプロセス装置９で処理しない基板Ｂ１０１（又は基板Ａ１０１）が保持部１１に残っている場合は、プロセス装置９の入れ替えを行った後、保持部１１に残っている基板Ｂ１０１（又は基板Ａ１０１）をプロセス装置９に全て払い出す。   The above operation is repeated until the loading of the substrate A101 and the substrate B101 into the transport line 3 is completed. When the carrying of the substrate A101 or the substrate B101 into the transfer line 3 is completed, the substrate A101 (or substrate) to be processed by the process device 9 is processed with respect to the process device 9 connected to the random access buffer device 5 at this time. B101) is terminated. Here, when the substrate B101 (or substrate A101) not processed by the process apparatus 9 remains in the holding unit 11, the substrate B101 (or substrate) remaining in the holding unit 11 is replaced after the process apparatus 9 is replaced. A101) is all paid out to the process apparatus 9.

以上のように構成した本実施形態の基板仕分け装置１によれば、例えば、基板Ａ１０１に対する処理を行うプロセス装置９がランダムアクセスバッファ装置５に接続されている場合に、ランダムアクセスバッファ装置５の保持部１１に挿入した２種類の基板Ａ１０１及び基板Ｂ１０１のうち、プロセス装置９で処理しない基板Ｂ１０１を、ランダムアクセスバッファ装置５でそのまま保持して基板Ａ１０１と仕分けることができる。   According to the substrate sorting apparatus 1 of the present embodiment configured as described above, for example, when the process apparatus 9 that performs processing on the substrate A101 is connected to the random access buffer apparatus 5, the random access buffer apparatus 5 is held. Of the two types of substrates A101 and B101 inserted into the section 11, the substrate B101 that is not processed by the process device 9 can be held as it is by the random access buffer device 5 and sorted from the substrate A101.

これと同時に、プロセス装置９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１をランダムアクセスバッファ装置５に一時的に保持（バッファリング）して、プロセス装置９の手前に基板Ａ１０１や基板Ｂ１０１が滞留するのを防ぐことができる。   At the same time, the substrate A101 carried into the transfer line 3 at a pace exceeding the processing pace in the process device 9 is temporarily held (buffered) in the random access buffer device 5, and the substrate A101 is placed in front of the process device 9. And the substrate B101 can be prevented from staying.

同様に、本実施形態の基板仕分け装置１によれば、例えば、基板Ｂ１０１に対する処理を行うプロセス装置９がランダムアクセスバッファ装置５に接続されている場合に、ランダムアクセスバッファ装置５の保持部１１に挿入した２種類の基板Ａ１０１及び基板Ｂ１０１のうち、プロセス装置９で処理しない基板Ａ１０１を、ランダムアクセスバッファ装置５でそのまま保持して基板Ｂ１０１と仕分けることができる。   Similarly, according to the substrate sorting apparatus 1 of the present embodiment, for example, when the process device 9 that performs the process on the substrate B101 is connected to the random access buffer device 5, the holding unit 11 of the random access buffer device 5 is connected. Of the two types of inserted substrates A101 and B101, the substrate A101 that is not processed by the process device 9 can be held as it is by the random access buffer device 5 and separated from the substrate B101.

これと同時に、プロセス装置９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ｂ１０１をランダムアクセスバッファ装置５に一時的に保持（バッファリング）して、プロセス装置９の手前に基板Ａ１０１や基板Ｂ１０１が滞留するのを防ぐことができる。   At the same time, the substrate B101 carried into the transfer line 3 at a pace exceeding the processing pace in the process device 9 is temporarily held (buffered) in the random access buffer device 5, and the substrate A101 is placed in front of the process device 9. And the substrate B101 can be prevented from staying.

このため、搬送先が異なる２種類の基板Ａ１０１及び基板Ｂ１０１が搬送ライン３に混在していても、搬送ライン３からライン外に基板Ａ１０１及び基板Ｂ１０１を移動させずに、基板Ａ１０１及び基板Ｂ１０１の滞留を確実に抑制することができる。   For this reason, even if two types of substrates A101 and B101 having different transfer destinations exist in the transfer line 3, the substrate A101 and the substrate B101 are not moved from the transfer line 3 to the outside of the line. Residence can be reliably suppressed.

なお、ランダムアクセスバッファ装置５の保持部１１から基板Ａ１０１が全て払い出されて、保持部１１が基板Ｂ１０１のみとなったとき、基板Ｂ１０１がプロセス装置での処理を必要としないものである場合は、基板Ａ１０１に対する処理を行うプロセス装置９をコンベアＣＶに交換すればよい。プロセス装置９をコンベアＣＶに交換した後は、ランダムアクセスバッファ装置５の搬出側の基板支持機構１２によって基板Ｂ１０１を保持部１１から取り出して、搬入用のコンベアＣＶやそれに続くコンベヤＣＶに払い出すことになる。勿論これと並行して、搬送ライン３に搬入された基板Ａ１０１や基板Ｂ１０１を、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に挿入する。   When all the substrates A101 are paid out from the holding unit 11 of the random access buffer device 5 and the holding unit 11 is only the substrate B101, the substrate B101 does not require processing in the process apparatus. The process device 9 that performs processing on the substrate A101 may be replaced with the conveyor CV. After the process device 9 is replaced with the conveyor CV, the substrate B101 is taken out from the holding unit 11 by the substrate support mechanism 12 on the carry-out side of the random access buffer device 5, and is discharged to the carry-in conveyor CV and the subsequent conveyor CV. become. Of course, in parallel with this, the substrate A101 and the substrate B101 carried into the transport line 3 are inserted into the vacant holding unit 11 of the random access buffer device 5 by the substrate support mechanism 12 on the carry-in side.

また、上述した実施形態では、ランダムアクセスバッファ装置５が固定式である場合について説明したが、ランダムアクセスバッファ装置５を移動式とすることもできる。そのように構成したのが、図４の平面図で示す本発明の他の実施形態に係る基板仕分け装置である。   In the above-described embodiment, the case where the random access buffer device 5 is fixed is described. However, the random access buffer device 5 may be mobile. Such a configuration is a substrate sorting apparatus according to another embodiment of the present invention shown in the plan view of FIG.

図４中引用符号１Ａで示す本実施形態の基板仕分け装置では、基板Ａ１０１に対する処理を行うプロセス装置Ａ９と基板Ｂ１０１に対する処理を行うプロセス装置Ｂ９とを同時に運用する。そのために、本実施形態の基板仕分け装置は、ランダムアクセスバッファ装置５を第１位置と第２位置との相互間で移動させる移動ユニット１３を有している。この移動ユニット１３は、例えば、ランダムアクセスバッファ装置５を載置したスライダをレール上でモータ等により移動させるものである。   In the substrate sorting apparatus of this embodiment indicated by reference numeral 1A in FIG. 4, a process apparatus A9 that performs processing on the substrate A101 and a process apparatus B9 that performs processing on the substrate B101 are operated simultaneously. For this purpose, the substrate sorting apparatus according to this embodiment includes a moving unit 13 that moves the random access buffer device 5 between the first position and the second position. For example, the moving unit 13 moves a slider on which the random access buffer device 5 is mounted on a rail by a motor or the like.

本実施形態のランダムアクセスバッファ装置５は、移動ユニット１３により第１位置と第２位置との間を移動する。第１位置（請求項中の「搬送ラインの下流の位置」及び「所定位置」に相当）では、搬入側の基板支持機構１２が搬送ライン３の搬出側のコンベアＣＶから基板Ａ１０１や基板Ｂ１０１を受け取ることができる。また、第１位置では、搬出側の基板支持機構１２がプロセス装置Ａ９の搬入用のコンベアＣＶに基板Ａ１０１を払い出すことができる。第２位置（請求項中の「所定位置とは異なる位置」に相当）では、搬出側の基板支持機構１２がプロセス装置Ａ９の搬入用のコンベアＣＶに基板Ａ１０１を払い出すことができる。   The random access buffer device 5 of this embodiment moves between the first position and the second position by the moving unit 13. In the first position (corresponding to “position downstream of the transfer line” and “predetermined position” in the claims), the substrate support mechanism 12 on the carry-in side removes the substrate A101 and the substrate B101 from the conveyer CV on the carry-out side of the transfer line 3. Can receive. In the first position, the substrate support mechanism 12 on the carry-out side can pay out the substrate A101 to the carry-in conveyor CV of the process apparatus A9. In the second position (corresponding to “a position different from the predetermined position” in the claims), the substrate support mechanism 12 on the carry-out side can deliver the substrate A101 to the carry-in conveyor CV of the process apparatus A9.

図４の基板仕分け装置１Ａでは、移動ユニット１３によりランダムアクセスバッファ装置５を第１位置に移動させる。そして、搬送ライン３の搬入側のコンベアＣＶに搬入した基板Ａ１０１や基板Ｂ１０１を、搬送ライン３の搬出側のコンベアＣＶから受け取って、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に順次挿入する。その際、基板Ａ１０１や基板Ｂ１０１に貼付したＩＣタグを読み取る等して、基板Ａ１０１や基板Ｂ１０１の種類を判別する。   In the substrate sorting apparatus 1A of FIG. 4, the random access buffer device 5 is moved to the first position by the moving unit 13. Then, the substrate A101 and the substrate B101 carried into the carry-in conveyor CV of the transfer line 3 are received from the carry-out conveyor CV of the carry line 3, and the random access buffer device 5 is opened by the carry-in substrate support mechanism 12. The holders 11 are sequentially inserted. At that time, the type of the substrate A101 or the substrate B101 is determined by reading an IC tag attached to the substrate A101 or the substrate B101.

基板Ａ１０１や基板Ｂ１０１が保持部１１に順次挿入されたランダムアクセスバッファ装置５では、第１位置にいる間、搬出側の基板支持機構１２によって基板Ａ１０１のみを保持部１１から取り出して、搬入用のコンベアＣＶを介してプロセス装置Ａ９に払い出す。このとき、基板Ａ１０１のプロセス装置Ａ９への払い出しは、プロセス装置Ａ９による基板Ａ１０１の処理ペースに合わせたペースで行う。   In the random access buffer device 5 in which the substrate A101 and the substrate B101 are sequentially inserted into the holding unit 11, only the substrate A101 is taken out from the holding unit 11 by the substrate support mechanism 12 on the carry-out side while being in the first position. Dispensed to the process apparatus A9 via the conveyor CV. At this time, the substrate A101 is discharged to the process apparatus A9 at a pace that matches the processing pace of the substrate A101 by the process apparatus A9.

したがって、プロセス装置Ａ９で処理しない基板Ｂ１０１や、プロセス装置Ａ９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１は、ランダムアクセスバッファ装置５の保持部１１に空きがある限り一時的に保持（バッファリング）される。   Therefore, the substrate B101 that is not processed by the process apparatus A9 or the substrate A101 that is carried into the transfer line 3 at a pace that exceeds the processing pace of the process apparatus A9 is temporary as long as the holding unit 11 of the random access buffer device 5 has an empty space. Held (buffered).

搬送ライン３への基板Ａ１０１や基板Ｂ１０１の搬入が終了したならば、ランダムアクセスバッファ装置５の保持部１１から基板Ａ１０１が全て払い出されて、保持部１１が基板Ｂ１０１のみとなった時点で、移動ユニット１３によりランダムアクセスバッファ装置５を第１位置から第２位置に移動させる。そして、ランダムアクセスバッファ装置５の保持部１１に残っている基板Ｂ１０１を搬出側の基板支持機構１２によって取り出して、搬入用のコンベアＣＶを介してプロセス装置Ｂ９に払い出す。   When the loading of the substrate A101 and the substrate B101 into the transport line 3 is completed, when all the substrates A101 are discharged from the holding unit 11 of the random access buffer device 5 and the holding unit 11 becomes only the substrate B101, The random access buffer device 5 is moved from the first position to the second position by the moving unit 13. And the board | substrate B101 which remains in the holding | maintenance part 11 of the random access buffer apparatus 5 is taken out by the board | substrate support mechanism 12 by the carrying-out side, and it pays out to process apparatus B9 via the conveyor CV for carrying in.

以上のように構成した本実施形態の基板仕分け装置１Ａによれば、ランダムアクセスバッファ装置５の保持部１１に挿入した２種類の基板Ａ１０１及び基板Ｂ１０１のうち、基板Ａ１０１を第１位置においてプロセス装置Ａ９に払い出し、基板Ｂ１０１を第２位置においてプロセス装置Ｂ９に払い出すことで、２種類の基板Ａ１０１及び基板Ｂ１０１を仕分けることができる。   According to the substrate sorting apparatus 1A of the present embodiment configured as described above, of the two types of substrates A101 and B101 inserted into the holding unit 11 of the random access buffer device 5, the substrate A101 is a process apparatus at the first position. By discharging to A9 and discharging the substrate B101 to the process apparatus B9 at the second position, the two types of substrates A101 and B101 can be sorted.

これと同時に、プロセス装置Ａ９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１をランダムアクセスバッファ装置５に一時的に保持（バッファリング）して、プロセス装置Ａ９の手前に基板Ａ１０１や基板Ｂ１０１が滞留するのを防ぐことができる。   At the same time, the substrate A101 carried into the transfer line 3 at a pace exceeding the processing pace in the process apparatus A9 is temporarily held (buffered) in the random access buffer device 5, and the substrate A101 is placed in front of the process apparatus A9. And the substrate B101 can be prevented from staying.

このため、搬送先が異なる２種類の基板Ａ１０１、基板Ｂ１０１が搬送ライン３に混在していても、搬送ライン３からライン外に基板Ａ１０１や基板Ｂ１０１を移動させずに、基板Ａ１０１や基板Ｂ１０１の滞留を確実に抑制することができる。   For this reason, even if two types of substrates A101 and B101 having different transfer destinations exist in the transfer line 3, the substrate A101 and the substrate B101 are not moved from the transfer line 3 to the outside of the line. Residence can be reliably suppressed.

なお、図４の実施形態では、ランダムアクセスバッファ装置５が第１位置と第２位置との間を移動する構成を、２種類のプロセス装置Ａ９及びプロセス装置Ｂ９に対してそれぞれの処理対象の基板Ａ１０１及び基板Ｂ１０１を仕分けるのに利用した場合について説明した。しかし、プロセス装置Ａ９しか存在しない場合にも、ランダムアクセスバッファ装置５が第１位置と第２位置との間を移動する構成を利用することができる。   In the embodiment of FIG. 4, the configuration in which the random access buffer device 5 moves between the first position and the second position is a substrate to be processed for each of the two types of process apparatuses A9 and B9. A case where the A101 and the substrate B101 are used for sorting has been described. However, even when only the process device A9 exists, a configuration in which the random access buffer device 5 moves between the first position and the second position can be used.

図５はそのように構成した本発明のさらに他の実施形態に係る基板仕分け装置の平面図である。図５中引用符号１Ｂで示す本実施形態の基板仕分け装置では、ランダムアクセスバッファ装置５の第２位置の下流に、複数のコンベアＣＶ，ＣＶ，…によるバイパスラインＶＰを配置している。   FIG. 5 is a plan view of a substrate sorting apparatus according to still another embodiment of the present invention configured as described above. In the substrate sorting apparatus of the present embodiment indicated by reference numeral 1B in FIG. 5, a bypass line VP including a plurality of conveyors CV, CV,... Is arranged downstream of the second position of the random access buffer device 5.

図５の基板仕分け装置１Ｂでは、移動ユニット１３によりランダムアクセスバッファ装置５を第１位置に移動させる。そして、搬送ライン３の搬入側のコンベアＣＶに搬入した基板Ａ１０１や基板Ｂ１０１を、搬送ライン３の搬出側のコンベアＣＶから受け取って、搬入側の基板支持機構１２によってランダムアクセスバッファ装置５の空いている保持部１１に順次挿入する。その際、基板Ａ１０１や基板Ｂ１０１に貼付したＩＣタグを読み取る等して、基板Ａ１０１や基板Ｂ１０１の種類を判別する。   In the substrate sorting apparatus 1B of FIG. 5, the random access buffer device 5 is moved to the first position by the moving unit 13. Then, the substrate A101 and the substrate B101 carried into the carry-in conveyor CV of the transfer line 3 are received from the carry-out conveyor CV of the carry line 3, and the random access buffer device 5 is opened by the carry-in substrate support mechanism 12. The holders 11 are sequentially inserted. At that time, the type of the substrate A101 or the substrate B101 is determined by reading an IC tag attached to the substrate A101 or the substrate B101.

基板Ａ１０１や基板Ｂ１０１が保持部１１に順次挿入されたランダムアクセスバッファ装置５では、第１位置にいる間、搬出側の基板支持機構１２によって基板Ａ１０１のみを保持部１１から取り出して、搬入用のコンベアＣＶを介してプロセス装置Ａ９に払い出す。このとき、基板Ａ１０１のプロセス装置Ａ９への払い出しは、プロセス装置Ａ９による基板Ａ１０１の処理ペースに合わせたペースで行う。   In the random access buffer device 5 in which the substrate A101 and the substrate B101 are sequentially inserted into the holding unit 11, only the substrate A101 is taken out from the holding unit 11 by the substrate support mechanism 12 on the carry-out side while being in the first position. Dispensed to the process apparatus A9 via the conveyor CV. At this time, the substrate A101 is discharged to the process apparatus A9 at a pace that matches the processing pace of the substrate A101 by the process apparatus A9.

したがって、プロセス装置Ａ９で処理しない基板Ｂ１０１や、プロセス装置Ａ９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１は、ランダムアクセスバッファ装置５の保持部１１に空きがある限り一時的に保持（バッファリング）される。   Therefore, the substrate B101 that is not processed by the process apparatus A9 or the substrate A101 that is carried into the transfer line 3 at a pace that exceeds the processing pace of the process apparatus A9 is temporary as long as the holding unit 11 of the random access buffer device 5 has an empty space. Held (buffered).

搬送ライン３への基板Ａ１０１や基板Ｂ１０１の搬入が終了したならば、ランダムアクセスバッファ装置５の保持部１１から基板Ａ１０１が全て払い出されて、保持部１１が基板Ｂ１０１のみとなった時点で、移動ユニット１３によりランダムアクセスバッファ装置５を第１位置から第２位置に移動させる。そして、ランダムアクセスバッファ装置５の保持部１１に残っている基板Ｂ１０１を搬出側の基板支持機構１２によって取り出して、バイパスラインＶＰのコンベアＣＶに払い出す。   When the loading of the substrate A101 and the substrate B101 into the transport line 3 is completed, when all the substrates A101 are discharged from the holding unit 11 of the random access buffer device 5 and the holding unit 11 becomes only the substrate B101, The random access buffer device 5 is moved from the first position to the second position by the moving unit 13. And the board | substrate B101 which remains in the holding | maintenance part 11 of the random access buffer apparatus 5 is taken out by the board | substrate support mechanism 12 by the carrying-out side, and it pays out to the conveyor CV of the bypass line VP.

以上のように構成した本実施形態の基板仕分け装置１Ｂによれば、ランダムアクセスバッファ装置５の保持部１１に挿入した２種類の基板Ａ１０１及び基板Ｂ１０１のうち、基板Ａ１０１を第１位置においてプロセス装置Ａ９に払い出し、基板Ｂ１０１を第２位置においてバイパスラインＶＰに払い出すことで、２種類の基板Ａ１０１及び基板Ｂ１０１を仕分けることができる。   According to the substrate sorting apparatus 1B of the present embodiment configured as described above, of the two types of substrates A101 and B101 inserted into the holding unit 11 of the random access buffer device 5, the substrate A101 is a process apparatus at the first position. By discharging to A9 and discharging the substrate B101 to the bypass line VP at the second position, the two types of substrates A101 and B101 can be sorted.

これと同時に、プロセス装置Ａ９での処理ペースを上回るペースで搬送ライン３に搬入された基板Ａ１０１をランダムアクセスバッファ装置５に一時的に保持（バッファリング）して、プロセス装置Ａ９の手前に基板Ａ１０１や基板Ｂ１０１が滞留するのを防ぐことができる。   At the same time, the substrate A101 carried into the transfer line 3 at a pace exceeding the processing pace in the process apparatus A9 is temporarily held (buffered) in the random access buffer device 5, and the substrate A101 is placed in front of the process apparatus A9. And the substrate B101 can be prevented from staying.

このため、搬送先が異なる２種類の基板Ａ１０１、基板Ｂ１０１が搬送ライン３に混在していても、搬送ライン３からライン外に基板Ａ１０１や基板Ｂ１０１を移動させずに、基板Ａ１０１や基板Ｂ１０１の滞留を確実に抑制することができる。   For this reason, even if two types of substrates A101 and B101 having different transfer destinations exist in the transfer line 3, the substrate A101 and the substrate B101 are not moved from the transfer line 3 to the outside of the line. Residence can be reliably suppressed.

１ 基板仕分け装置
１Ａ 基板仕分け装置
１Ｂ 基板仕分け装置
３ 搬送ライン
５ ランダムアクセスバッファ装置
９ プロセス装置
１１ 保持部
１２ 基板支持機構
１３ 移動ユニット
１０１ 基板
ＣＶ コンベア
ＶＰ バイパスライン 1 Substrate Sorting Device 1A Substrate Sorting Device 1B Substrate Sorting Device 3 Transfer Line 5 Random Access Buffer Device 9 Process Device 11 Holding Unit 12 Substrate Support Mechanism 13 Moving Unit 101 Substrate CV Conveyor VP Bypass Line

Claims (3)

基板の搬送ラインからその下流の処理装置に、該処理装置によって処理する種類の基板を選別して搬送する基板仕分け装置であって、
前記搬送ラインと前記処理装置との間に介設されて基板を一時的に保持するバッファ装置を備えており、
前記バッファ装置は、基板を保持する複数の保持部のうち任意の保持部に前記搬送ラインから基板を受け入れ、かつ、任意の保持部から基板を前記処理装置に払い出すことが可能なランダムアクセスバッファ装置であり、
前記ランダムアクセスバッファ装置は、前記各保持部に受け入れた基板のうち、前記処理装置によって処理する種類の基板を選別して該処理装置に払い出す、
ことを特徴とする基板仕分け装置。 A substrate sorting device for sorting and transporting a substrate of a type to be processed by the processing device from a substrate transport line to a downstream processing device,
A buffer device interposed between the transfer line and the processing apparatus to temporarily hold the substrate;
The buffer device receives a substrate from the transfer line in an arbitrary holding unit among a plurality of holding units that hold the substrate, and can discharge the substrate from the arbitrary holding unit to the processing apparatus. Device,
The random access buffer device sorts out the types of substrates to be processed by the processing device out of the substrates received by the holding units and pays out to the processing device.
A substrate sorting apparatus characterized by that. 前記搬送ラインの下流の位置を含む複数の位置間で前記ランダムアクセスバッファ装置を移動させる移動ユニットをさらに備えており、前記処理装置は、前記複数の位置のうち所定位置の下流に配置されており、前記ランダムアクセスバッファ装置は、前記搬送ラインの下流の位置において該搬送ラインから前記各保持部に受け入れた基板のうち、前記処理装置によって処理する種類の基板を選別して、前記所定位置において前記処理装置に払い出すことを特徴とする請求項１記載の基板仕分け装置。   The apparatus further includes a moving unit that moves the random access buffer device between a plurality of positions including a position downstream of the transport line, and the processing device is disposed downstream of a predetermined position among the plurality of positions. The random access buffer device selects a substrate of a type to be processed by the processing device from substrates received by the holding units from the transfer line at a position downstream of the transfer line, and 2. The substrate sorting apparatus according to claim 1, wherein the substrate sorting apparatus pays out to a processing apparatus. 前記複数の位置のうち前記所定位置とは異なる位置の下流に配置され、前記処理装置とは処理する基板の種類が異なる他の処理装置をさらに備えており、前記ランダムアクセスバッファ装置は、前記搬送ラインから前記各保持部に受け入れた基板のうち、前記他の処理装置によって処理する種類の基板を選別して、前記所定位置とは異なる位置において前記他の処理装置に払い出すことを特徴とする請求項２記載の基板仕分け装置。   The processing apparatus further includes another processing apparatus that is disposed downstream of the plurality of positions different from the predetermined position, and that is different from the processing apparatus in the type of substrate to be processed. A substrate of a type to be processed by the other processing apparatus is selected from the substrates received by the holding units from a line, and is discharged to the other processing apparatus at a position different from the predetermined position. The substrate sorting apparatus according to claim 2.
JP2009091801A 2009-04-06 2009-04-06 Substrate-sorting device Pending JP2010245250A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009091801A JP2010245250A (en) 2009-04-06 2009-04-06 Substrate-sorting device
TW099108178A TWI520252B (en) 2009-04-06 2010-03-19 Substrate discrimination device
CN2010101551249A CN101857126B (en) 2009-04-06 2010-03-31 Substrate classifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009091801A JP2010245250A (en) 2009-04-06 2009-04-06 Substrate-sorting device

Publications (1)

Publication Number Publication Date
JP2010245250A true JP2010245250A (en) 2010-10-28

Family

ID=42943331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009091801A Pending JP2010245250A (en) 2009-04-06 2009-04-06 Substrate-sorting device

Country Status (3)

Country Link
JP (1) JP2010245250A (en)
CN (1) CN101857126B (en)
TW (1) TWI520252B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106477306A (en) * 2016-12-01 2017-03-08 东旭（昆山）显示材料有限公司 Cassette bogey, liquid crystal panel production system and its cassette transport method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104495305B (en) * 2014-12-09 2017-01-25 福耀玻璃（重庆）配件有限公司 Automatic sheet feeding production line with function of cutting original sheet into two parts
CN110391161A (en) * 2019-06-25 2019-10-29 福建省福联集成电路有限公司 A kind of intelligence system of storing wafer, device and method
CN114408452B (en) * 2022-01-27 2023-08-04 赛美特科技有限公司 Wafer conveying method and device, electronic equipment and storage medium

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5411487U (en) * 1977-06-27 1979-01-25
JPS5658721U (en) * 1980-09-29 1981-05-20
JPS6444035A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Production using single wafer carrier
JPH10146744A (en) * 1996-09-19 1998-06-02 Dainippon Screen Mfg Co Ltd Substrate processing device and method
JP2003243474A (en) * 2002-02-15 2003-08-29 Tokyo Electron Ltd Unmanned conveying cart system
JP2005170675A (en) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd Substrate carrying device, substrate storage and carrying device, substrate carrying-in system, substrate carrying-out system, and substrate carrying-in/carrying-out system
JP2007230757A (en) * 2006-03-03 2007-09-13 Murata Mach Ltd Carrying vehicle
JP2007250671A (en) * 2006-03-14 2007-09-27 Tokyo Electron Ltd Substrate buffer device, substrate buffering method, substrate processor, control program, and computer readable storage medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4023543B2 (en) * 2003-05-29 2007-12-19 東京エレクトロン株式会社 Substrate transfer apparatus, substrate transfer method, and vacuum processing apparatus
JP4461960B2 (en) * 2003-11-21 2010-05-12 株式会社Ｉｈｉ Substrate storage and transfer device, substrate carry-in system, substrate carry-out system, and substrate carry-in / carry-out system
JP2007015789A (en) * 2005-07-05 2007-01-25 Micronics Japan Co Ltd In-line buffer device
JP2008098198A (en) * 2006-10-05 2008-04-24 Ihi Corp Substrate conveyor
WO2009037754A1 (en) * 2007-09-19 2009-03-26 Hirata Corporation Substrate transfer system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5411487U (en) * 1977-06-27 1979-01-25
JPS5658721U (en) * 1980-09-29 1981-05-20
JPS6444035A (en) * 1987-08-12 1989-02-16 Hitachi Ltd Production using single wafer carrier
JPH10146744A (en) * 1996-09-19 1998-06-02 Dainippon Screen Mfg Co Ltd Substrate processing device and method
JP2003243474A (en) * 2002-02-15 2003-08-29 Tokyo Electron Ltd Unmanned conveying cart system
JP2005170675A (en) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd Substrate carrying device, substrate storage and carrying device, substrate carrying-in system, substrate carrying-out system, and substrate carrying-in/carrying-out system
JP2007230757A (en) * 2006-03-03 2007-09-13 Murata Mach Ltd Carrying vehicle
JP2007250671A (en) * 2006-03-14 2007-09-27 Tokyo Electron Ltd Substrate buffer device, substrate buffering method, substrate processor, control program, and computer readable storage medium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106477306A (en) * 2016-12-01 2017-03-08 东旭（昆山）显示材料有限公司 Cassette bogey, liquid crystal panel production system and its cassette transport method

Also Published As

Publication number Publication date
CN101857126A (en) 2010-10-13
TWI520252B (en) 2016-02-01
TW201104780A (en) 2011-02-01
CN101857126B (en) 2012-07-11

Similar Documents

Publication Publication Date Title
JP5628371B2 (en) Semiconductor element handling system
JP5187274B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
US8251635B2 (en) Apparatus and method for supplying articles to processing tool
JP2007088286A5 (en)
JP2008030914A (en) Clean stocker and article storage method
JP5223778B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
JP2011124564A5 (en) Vacuum processing apparatus and operating method of vacuum processing apparatus
CN107785288B (en) Substrate processing apparatus and substrate processing method
JP2010245250A (en) Substrate-sorting device
JP2013102235A5 (en)
JP2010052938A (en) Conveyance control device and conveyance control method
JP2004303916A (en) Transfer apparatus and method of manufacturing object
JP2004304003A (en) Processing system
JP4566574B2 (en) Substrate processing equipment
US20030226251A1 (en) Fitting system and method of fitting substrates with components
JP5348290B2 (en) Substrate processing apparatus, substrate processing method, and storage medium
JP5115501B2 (en) Substrate sorting apparatus and substrate sorting method
JP2007019085A (en) Carrier system
JP6084241B2 (en) Board transfer system for electronic component mounting equipment
JPH11224894A (en) Manufacturing equipment of semiconductor device
JP3139273U (en) Transport device
JP2004304056A (en) Transport system for manufacturing facility
KR20140142395A (en) Apparatus for processing glass substrate
JP2006188305A (en) Tray conveying system
JP2004175484A (en) Article transferring equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130402

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130723