JP2010205523A - Connector for memory card - Google Patents

Connector for memory card Download PDF

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JP2010205523A
JP2010205523A JP2009048798A JP2009048798A JP2010205523A JP 2010205523 A JP2010205523 A JP 2010205523A JP 2009048798 A JP2009048798 A JP 2009048798A JP 2009048798 A JP2009048798 A JP 2009048798A JP 2010205523 A JP2010205523 A JP 2010205523A
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card
memory card
contact
recess
contact portion
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Koichiro Ejiri
孝一郎 江尻
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SMK Corp
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SMK Corp
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Priority to JP2009048798A priority Critical patent/JP2010205523A/en
Priority to CN 200910170687 priority patent/CN101826669A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector for a memory card with a low profile without enlarging a mounting area for it to be mounted on a printed wiring board as to one enabled to connect memory cards with two kinds of sizes. <P>SOLUTION: A connection area 9 of a second card housing recess part 6 from which a second contact part 4a of a second contact 4 is protruded is formed at a site of a housing body 2 in a perpendicular direction of a first memory card 50 housed in a first card housing recess part 7, and the second housing recess part 6 is formed at a site of the housing body 2 where the second memory card 60 housed in the second card housing recess part 6 and a connection area 8 from which a first contact part 3a of a first contact 3 is protruded do not overlap each other in a perpendicular direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、携帯電話機、デジタルカメラ等の携帯電子機器に搭載されるメモリーカード用コネクタに関し、特に、２種類の大きさのメモリーカードと同時に接続するメモリーカード用コネクタに関するものである。   The present invention relates to a memory card connector mounted on a portable electronic device such as a mobile phone or a digital camera, and more particularly to a memory card connector that is connected simultaneously with two types of memory cards.

近年、携帯電話機、ゲーム機、デジタルカメラ等の携帯電子機器には、使用者の個人情報等が記憶された情報管理用のメモリーカードと、カメラで撮像した画像などの種々の情報を記憶する記録用のメモリーカードとを接続することが要望され、携帯電子機器に搭載するコネクタとして、２種類のメモリーカードをそれぞれ同時に接続可能なメモリーカード用コネクタが知られている。   2. Description of the Related Art In recent years, portable electronic devices such as mobile phones, game machines, and digital cameras store information management memory cards that store personal information of users and various types of information such as images captured by cameras. As a connector mounted on a portable electronic device, a memory card connector capable of simultaneously connecting two types of memory cards is known.

このメモリーカード用コネクタは、２種類のメモリーカードを挿入するために、それぞれ独立した２種類のカード収容凹部がハウジング本体に形成されるが、コネクタを実装するプリント配線基板側の実装面積を拡大することなく、また、小型化が望まれる携帯電子機器内内に搭載されるものであることから、従来、２種類のカード収容凹部は、ハウジング本体のプリント配線基板の実装面に直交する鉛直方向の２段に分けて重ねて形成されている（特許文献１）。   In this memory card connector, in order to insert two types of memory cards, two independent card receiving recesses are formed in the housing body, but the mounting area on the printed wiring board side on which the connector is mounted is enlarged. In addition, the two types of card housing recesses are conventionally mounted in a vertical direction perpendicular to the mounting surface of the printed wiring board of the housing body. It is formed by being divided into two stages (Patent Document 1).

図７の左側の図及び図９乃至図１２は、この従来のメモリーカード用コネクタ１００を示し、情報管理用のメモリーカードである図１３（ａ）に示すＳＩＭ（Ｓｕｂｓｃｒｉｂｅｒ Ｉｄｅｎｔｉｔｙ Ｍｏｄｕｌｅ）カード５０と、記録用のメモリーカードである同図（ｂ）に示すＭｉｃｒｏＳＤ（Ｓｅｃｕｒｅ Ｄｉｇｉｔａｌ）カード６０とが同時に接続可能となっている。   7 and FIG. 9 to FIG. 12 show the conventional memory card connector 100, a SIM (Subscriber Identity Module) card 50 shown in FIG. 13A, which is a memory card for information management, A microSD (Secure Digital) card 60 shown in FIG. 2B, which is a recording memory card, can be connected simultaneously.

メモリーカード用コネクタ１００のハウジング本体は、絶縁プレート１０１と、絶縁プレート１０１の表面側に平行に取り付けられる第１カバー１０２及び第２カバー１０３とにより構成され、図８に示すように、絶縁プレート１０１の表面と第１カバー１０２との間に、前方から挿入するＳＩＭカード５０を収容する第１カード収容凹部１０４が、第１カバー１０２の側方で、絶縁プレート１０１の表面と第２カバー１０３との間に、図中左方から挿入するＭｉｃｒｏＳＤカード６０を収容する第２カード収容凹部１０５がそれぞれ鉛直方向の２段に形成されている。   The housing body of the memory card connector 100 includes an insulating plate 101, and a first cover 102 and a second cover 103 attached in parallel to the surface side of the insulating plate 101. As shown in FIG. A first card receiving recess 104 for receiving the SIM card 50 inserted from the front is provided between the surface of the insulating plate 101 and the second cover 103 on the side of the first cover 102. The second card accommodating recesses 105 for accommodating the MicroSD card 60 to be inserted from the left in the figure are formed in two steps in the vertical direction.

絶縁プレート１０１には、自由端側の第１接触部１０６ａが第１カード収容凹部１０４内に突出する８本のＬ字コンタクト１０６と、自由端側の第２接触部１０７ａが第２カード収容凹部１０５内に突出する８本の細長帯状コンタクト１０７が一体に片持ち支持され、それぞれ第１カード収容凹部１０４に収容されるＳＩＭカード５０の６個の電極５１と、第２カード収容凹部１０５に収容されるＭｉｃｒｏＳＤカード６０の８個の電極６１に弾性接触するようにしている。   The insulating plate 101 includes eight L-shaped contacts 106 having a first contact portion 106a on the free end side protruding into the first card receiving recess 104, and a second contact portion 107a on the free end side serving as a second card receiving recess. Eight elongated strip-like contacts 107 projecting into 105 are cantilevered integrally, and are accommodated in the six electrodes 51 of the SIM card 50 accommodated in the first card accommodating recess 104 and in the second card accommodating recess 105, respectively. The eight electrodes 61 of the MicroSD card 60 to be made are in elastic contact.

ＭｉｃｒｏＳＤカード６０の８個の電極６１は、図１３（ｂ）に示すように、その一面の一辺に沿って直線上に露出し、８本の細長帯状コンタクト１０７は、その長手方向に沿って折り曲げ形成することにより、互いのコンタクト１０７間が接触することなく、絶縁プレート１０１との固定端から第２接触部１０７ａまで充分なバネスパンを得て、電極６１に弾性接触する。   As shown in FIG. 13B, the eight electrodes 61 of the MicroSD card 60 are exposed on a straight line along one side of the surface, and the eight strip-shaped contacts 107 are bent along the longitudinal direction. By forming, a sufficient spring span is obtained from the fixed contact with the insulating plate 101 to the second contact portion 107a without contact between the contacts 107, and the electrode 61 is elastically contacted.

一方、ＳＩＭカード５０の一面に露出する６個の電極５１は、１列３個毎の２列で平面状に分散して露出しているので、絶縁プレート１０１に固定される固定端から前方（カード挿入方向）に片持ち支持されるＬ字コンタクト１０６は、互いのコンタクト１０６間が接触しないように、図１１に示すように、第１接触部１０６ａをＳＩＭカード５０の挿入方向に直交する方向から支持して、電極５１へ弾性接触させている。その結果、Ｌ字コンタクト１０６の第１接触部１０６ａには、支持方向に対して直交する方向にＳＩＭカード５０の挿入力が加わるので、カード挿入方向の力によるＬ字コンタクト１０６の変形を防止するとともに、第１接触部１０６ａを鉛直方向に撓ませ、ＳＩＭカード５０の電極５１へ弾性接触させるため、各第１接触部１０６ａには、図１２に示すように、カード挿入方向に対して上方に傾斜する傾斜面１０６ｂが形成されている。   On the other hand, the six electrodes 51 exposed on one surface of the SIM card 50 are exposed by being distributed in a plane in two rows every three rows, so that the front (from the fixed end fixed to the insulating plate 101 ( As shown in FIG. 11, the L-shaped contacts 106 that are cantilevered in the card insertion direction) are arranged in a direction orthogonal to the insertion direction of the SIM card 50 as shown in FIG. 11 so that the contacts 106 do not contact each other. And is in elastic contact with the electrode 51. As a result, since the insertion force of the SIM card 50 is applied to the first contact portion 106a of the L-shaped contact 106 in a direction orthogonal to the support direction, the deformation of the L-shaped contact 106 due to the force in the card insertion direction is prevented. At the same time, the first contact portions 106a are bent in the vertical direction and elastically contacted with the electrodes 51 of the SIM card 50. Therefore, as shown in FIG. An inclined surface 106b that is inclined is formed.

このように構成されたメモリーカード用コネクタ１００は、図１０に示すように、下段側の第１カード収容凹部１０４に前方からＳＩＭカード５０を収容すると、その背面に平面上に分散して露出する６個の電極５１に、対応部位に突出する８本のＬ字コンタクト１０６の各第１接触部１０６ａが弾性接触する。また、ＳＩＭカード５０が収容された第１カード収容凹部１０４の上段の第２カード収容凹部１０５へ、第１カバー１０２の表面に沿って図中左方からＭｉｃｒｏＳＤカード６０を収容すると、その背面に直線上に露出する８個の電極６１が、対応部位に突出する８本の細長帯状コンタクト１０７の各第２接触部１０７ａが弾性接触する。これにより、メモリーカード用コネクタ１００の鉛直方向の外形は、ＳＩＭカード５０の外形よりわずかに大きいだけのものとなり、プリント配線基板１１０上へ実装する実装面積を拡大せず、２種類のメモリーカード５０、６０を同時に接続できる。   As shown in FIG. 10, when the SIM card 50 is received from the front in the first card receiving recess 104 on the lower stage side, the memory card connector 100 configured as described above is dispersedly exposed on the back surface of the SIM card 50. The first contact portions 106a of the eight L-shaped contacts 106 projecting to the corresponding portions are in elastic contact with the six electrodes 51. Further, when the MicroSD card 60 is received from the left side of the drawing along the surface of the first cover 102 into the second card receiving recess 105 in the upper stage of the first card receiving recess 104 in which the SIM card 50 is received, The eight electrodes 61 exposed on the straight line elastically contact the second contact portions 107a of the eight strip-shaped contacts 107 protruding to the corresponding portions. As a result, the vertical outer shape of the memory card connector 100 is slightly larger than the outer shape of the SIM card 50, and the mounting area to be mounted on the printed wiring board 110 is not enlarged, so that the two types of memory cards 50 are used. , 60 can be connected simultaneously.

特開２００５−１７３９４３号公報JP 2005-173943 A

上記メモリーカード用コネクタ１００に備えられる各Ｌ字コンタクト１０６の第１接触部１０６ａは、平面上に分散して露出するＳＩＭカード５０の各電極５１に弾性接触し、かつ、互いに接触せずに絶縁プレート１０１から引き出す必要があることから、ＳＩＭカード５０の挿入方向に直交する方向から支持して、傾斜面１０６ｂに沿って挿入するＳＩＭカード５０を当接させている。従って、Ｌ字コンタクト１０６の第１接触部１０６ａに、ＳＩＭカード５０が当接している間に、所定の接触圧を得るための鉛直方向の変位δを生じさせる傾斜面１０６ｂを形成する必要があり、また、第１接触部１０６ａは、曲げ応力に加えて捩り応力が加わる第１接触部１０６ａの塑性変形を防止する為に、高さがδ以上の大型形状となっていた。   The first contact portions 106a of the L-shaped contacts 106 provided in the memory card connector 100 are in elastic contact with the electrodes 51 of the SIM card 50 that are distributed and exposed on a plane, and are insulated without contacting each other. Since it is necessary to pull out from the plate 101, the SIM card 50 to be inserted along the inclined surface 106b is supported by being supported from a direction orthogonal to the insertion direction of the SIM card 50. Therefore, it is necessary to form the inclined surface 106b that generates the vertical displacement δ for obtaining a predetermined contact pressure while the SIM card 50 is in contact with the first contact portion 106a of the L-shaped contact 106. Further, the first contact portion 106a has a large shape with a height of δ or more in order to prevent plastic deformation of the first contact portion 106a to which torsional stress is applied in addition to bending stress.

このため、絶縁プレート１０１には、ＳＩＭカード５０を第１カード収容凹部１０４へ収容した際に、第１接触部１０６ａが退避するために充分な、少なくともδより長い所定高さｈの退避スペース１０８を形成する必要があり、このことが、上下２段の収容凹部１０４、１０５に収容されるＳＩＭカード５０とＭｉｃｒｏＳＤカード６０の高さを加えたメモリーカード用コネクタ１００全体の低背化の障害となっていた。   For this reason, in the insulating plate 101, when the SIM card 50 is accommodated in the first card accommodating recess 104, the retracting space 108 having a predetermined height h that is at least longer than δ is sufficient for the first contact portion 106a to retract. This is an obstacle to lowering the overall height of the memory card connector 100 including the height of the SIM card 50 and the MicroSD card 60 accommodated in the upper and lower housing recesses 104 and 105. It was.

また、図９に示すように、細長帯状コンタクト１０７の第２接触部１０７ａが突出する第２カード収容凹部１０５を、第２カード収容凹部１０５から退避する第２接触部１０７ａがＳＩＭカード５０と干渉しないように、第１カード収容凹部１０４の側方に形成していて、その分、鉛直方向の外形も拡大し、プリント配線基板１１０への実装面積が増加するものとなった。   Further, as shown in FIG. 9, the second card housing recess 105 from which the second contact portion 107 a of the elongated strip contact 107 protrudes and the second contact portion 107 a retracted from the second card housing recess 105 interferes with the SIM card 50. In order to avoid this, it is formed on the side of the first card receiving recess 104, and the vertical outer shape is enlarged accordingly, and the mounting area on the printed wiring board 110 is increased.

本発明は、このような従来の問題点を考慮してなされたものであり、２種類の大きさのメモリーカードを同時に接続可能とするメモリーカード用コネクタで、プリント配線基板上へ実装する実装面積を拡大させずに、更に低背化させたメモリーカード用コネクタを提供することを目的とする。   The present invention has been made in consideration of such conventional problems, and is a memory card connector that allows two types of memory cards to be connected simultaneously, and is mounted on a printed wiring board. An object of the present invention is to provide a memory card connector that is further reduced in height without increasing the size of the memory card.

上述の目的を達成するため、請求項１のメモリーカード用コネクタは、第１メモリーカードを収容する第１カード収容凹部と、第１メモリーカードより小型の第２メモリーカードを収容する第２カード収容凹部とが、互いに平行に鉛直方向の２段に分けて形成されたハウジング本体と、前記ハウジング本体に片持ち支持され、第１メモリーカードの一面に平面状に分散して露出する複数の第１電極にそれぞれ弾性接触するように、自由端側の第１接触部が第１カード収容凹部内に突出する複数の第１コンタクトと、前記ハウジング本体に支持され、第２メモリーカードに直線状に露出する複数の第２電極にそれぞれ接触するように、第２接触部が第２カード収容凹部内に突出する複数の第２コンタクトとを備えたメモリーカード用コネクタであって、
第２コンタクトの第２接触部が突出する第２カード収容凹部の接続領域は、第１カード収容凹部に収容される第１メモリーカードの鉛直方向のハウジング本体の部位に形成されるとともに、第２カード収容凹部は、第２カード収容凹部に収容される第２メモリーカードと、第１コンタクトの第１接触部が突出する第１カード収容凹部の接続領域とが鉛直方向で重ならないハウジング本体の部位に形成されていることを特徴とする。 In order to achieve the above object, a memory card connector according to claim 1 includes a first card housing recess for housing a first memory card and a second card housing for housing a second memory card smaller than the first memory card. And a plurality of first portions that are cantilevered by the housing body and are dispersed and exposed in a planar manner on one surface of the first memory card. The first contact portion on the free end side protrudes into the first card receiving recess and is supported by the housing body so as to be elastically contacted with the electrodes, and is exposed linearly to the second memory card. A memory card connector including a plurality of second contacts, the second contact portion projecting into the second card receiving recess so as to contact each of the plurality of second electrodes. I,
The connection area of the second card accommodation recess from which the second contact portion of the second contact protrudes is formed at a portion of the housing body in the vertical direction of the first memory card received in the first card accommodation recess, and the second The card receiving recess is a portion of the housing body in which the second memory card received in the second card receiving recess and the connection area of the first card receiving recess from which the first contact portion of the first contact protrudes do not overlap in the vertical direction. It is characterized by being formed.

第２コンタクトの第２接触部が突出する第２カード収容凹部の接続領域を、第１カード収容凹部に収容される第１メモリーカードの鉛直方向のハウジング本体の部位に形成するので、鉛直方向の投影面積が拡大しない。   Since the connection area of the second card accommodation recess where the second contact portion of the second contact protrudes is formed in the vertical housing body portion of the first memory card accommodated in the first card accommodation recess, The projected area does not expand.

第２メモリーカードは第１メモリーカードより小型であるので、第２カード収容凹部に収容される第２メモリーカードと、第１コンタクトの第１接触部が突出する第１カード収容凹部の接続領域とが鉛直方向で重ならないハウジング本体の部位に第２カード収容凹部が形成でき、第１接触部が退避しても第２メモリーカードと干渉しない。   Since the second memory card is smaller than the first memory card, the second memory card accommodated in the second card accommodation recess, and the connection area of the first card accommodation recess from which the first contact portion of the first contact protrudes Can be formed in a portion of the housing main body that does not overlap in the vertical direction, and does not interfere with the second memory card even if the first contact portion is retracted.

また、直線上に露出する第２メモリーカードの複数の第２電極に対してそれぞれ接触する第２コンタクトは、細長帯状の長手方向に沿って折り曲げることにより互いに接触することなく充分に長いバネスパンが得られ、第２接触部に第２電極に向けた凸部を形成する必要がない。従って、第２接触部が退避する退避スペースの高さは、細長帯状の厚さ分で充分であり、第１接触部が退避するハウジング本体の厚み内に、第２接触部が退避する退避スペースと第２メモリーカードを収容する第２メモリーカード収容凹部の少なくとも一部を形成できる。   In addition, the second contacts that are in contact with the plurality of second electrodes of the second memory card that are exposed on a straight line are bent along the longitudinal direction of the elongated strip so that a sufficiently long spring span is obtained without contacting each other. Therefore, it is not necessary to form a convex portion facing the second electrode in the second contact portion. Accordingly, the height of the retreat space where the second contact portion retreats is sufficient for the thickness of the elongated band, and the retreat space where the second contact portion retreats within the thickness of the housing body where the first contact portion retreats. And at least part of the second memory card receiving recess for receiving the second memory card.

請求項２のメモリーカード用コネクタは、複数の第１コンタクトと複数の第２コンタクトは、第１接触部と第２接触部が、鉛直方向の一面と他面から互いに反対方向に突出して、一枚の絶縁プレートに片持ち支持され、第１接触部が突出する前記絶縁プレートの一面と、前記絶縁プレートに取り付けられた第１カバーとの間に第１カード収容凹部が形成され、第２接触部が突出する前記絶縁プレートの他面と、前記絶縁プレートに取り付けられた第２カバーとの間に第２カード収容凹部が形成されていることを特徴とする。   According to another aspect of the memory card connector of the present invention, the plurality of first contacts and the plurality of second contacts are such that the first contact portion and the second contact portion protrude in opposite directions from one surface and the other surface in the vertical direction. A first card receiving recess is formed between one surface of the insulating plate that is cantilevered by a single insulating plate and from which the first contact portion protrudes, and a first cover attached to the insulating plate; A second card receiving recess is formed between the other surface of the insulating plate from which the portion protrudes and a second cover attached to the insulating plate.

同一の絶縁プレートに複数の第１コンタクトと複数の第２コンタクトを片持ち支持するので、複数の第１コンタクトと複数の第２コンタクトとを絶縁プレートの成型の際にインサート成形し、一工程で第１コンタクトと第２コンタクトが片持ち支持された絶縁プレートを形成できる。   Since the plurality of first contacts and the plurality of second contacts are cantilevered on the same insulating plate, the plurality of first contacts and the plurality of second contacts are insert-molded when forming the insulating plate, An insulating plate in which the first contact and the second contact are cantilevered can be formed.

第１カード収容凹部と第２カード収容凹部は、絶縁プレートの一面側と他面側に分かれて形成されるので、第１メモリーカードと第２メモリーカードが互いに干渉されることなく、同時に接続でき、第１接触部が退避する絶縁プレートの厚み内に、第２接触部が退避する退避スペースと第２メモリーカードを収容する第２メモリーカード収容凹部の少なくとも一部を形成できる。   Since the first card accommodation recess and the second card accommodation recess are formed separately on one side and the other side of the insulating plate, the first memory card and the second memory card can be connected simultaneously without interfering with each other. In the thickness of the insulating plate in which the first contact portion is retracted, at least a part of the retracting space in which the second contact portion is retracted and the second memory card accommodating recess for accommodating the second memory card can be formed.

請求項３のメモリーカード用コネクタは、第１メモリーカードがＳＩＭカードであり、第２メモリーカードがｍｉｃｒｏＳＤカードであることを特徴とする。   The memory card connector according to claim 3 is characterized in that the first memory card is a SIM card and the second memory card is a microSD card.

ｍｉｃｒｏＳＤカードは、ＳＩＭカードより小型であり、複数の第２電極は直線状に露出するので、第２電極に第２コンタクトの第２接触部が接触する接続領域を、第１カード収容凹部に収容されるＳＩＭカードの鉛直方向のハウジング本体の部位に形成することができるとともに、第２カード収容凹部を、第２カード収容凹部に収容されるｍｉｃｒｏＳＤカードと、ＳＩＭカードの第１電極に第１コンタクトの第１接触部が突出する接続領域とが鉛直方向で重ならないハウジング本体の部位に形成できる。   Since the microSD card is smaller than the SIM card and the plurality of second electrodes are exposed in a straight line, the connection area where the second contact portion of the second contact contacts the second electrode is accommodated in the first card accommodating recess. The SIM card can be formed in a portion of the housing body in the vertical direction of the SIM card, and the second card receiving recess is provided with a first contact with the microSD card received in the second card receiving recess and the first electrode of the SIM card. It can form in the site | part of the housing main body which does not overlap with the connection area | region where the 1st contact part protrudes in a perpendicular direction.

請求項１の発明によれば、第２カード収容凹部の接続領域を、第１カード収容凹部に収容される第１メモリーカードの鉛直方向投影面内に形成するので、鉛直方向をプリント配線基板への実装面とする実装面積が拡大しない。   According to the first aspect of the present invention, since the connection area of the second card accommodation recess is formed in the vertical projection plane of the first memory card accommodated in the first card accommodation recess, the vertical direction to the printed wiring board. The mounting area of the mounting surface does not increase.

また、第１接触部が退避しても第２メモリーカードと干渉することなく、第１接触部を退避させるハウジング本体の厚み内に、第２接触部が退避する退避スペースと第２メモリーカードを収容する第２メモリーカード収容凹部の少なくとも一部を形成できるので、全体を低背化させ小型化できる。   In addition, even if the first contact portion is retracted, the retraction space for retracting the second contact portion and the second memory card are within the thickness of the housing body that retracts the first contact portion without interfering with the second memory card. Since at least a part of the second memory card accommodating recess to be accommodated can be formed, the whole can be reduced in height and reduced in size.

請求項２の発明によれば、複数の第１コンタクトと複数の第２コンタクトとを、絶縁プレートの成型の際にインサート成形することにより、絶縁プレートの成型工程で同時に複数の第１コンタクトと複数の第２コンタクトとを絶縁プレートに片持ち支持できる。このインサート成形の成型工程で、第１コンタクトの第１接触部が突出する第１カード収容凹部の接続領域と、第２コンタクトの第２接触部が突出する第２カード収容凹部の接続領域は、鉛直方向で重ならないので、複数の第１コンタクトと複数の第２コンタクトとを、鉛直方向で重ならない部位で片持ち支持することにより、スライド金型を用いない簡易構造の金型で、一枚の絶縁プレートに第１コンタクトと第２コンタクトを一体成形できる。   According to the second aspect of the present invention, the plurality of first contacts and the plurality of second contacts are insert-molded at the time of molding the insulating plate, whereby the plurality of first contacts and the plurality of contacts are simultaneously formed in the insulating plate molding step. The second contact can be cantilevered on the insulating plate. In the insert molding process, the connection area of the first card receiving recess where the first contact portion of the first contact protrudes and the connection area of the second card receiving recess where the second contact portion of the second contact protrudes are: Since it does not overlap in the vertical direction, a single mold with a simple structure that does not use a slide mold by supporting a plurality of first contacts and a plurality of second contacts in a cantilevered part at a position that does not overlap in the vertical direction. The first contact and the second contact can be integrally formed on the insulating plate.

請求項３の発明によれば、低背化させたメモリーカード用コネクタへ、情報管理用のＳＩＭカードと記録用のｍｉｃｒｏＳＤカードとを同時に接続できる。   According to the invention of claim 3, the SIM card for information management and the microSD card for recording can be simultaneously connected to the low-profile memory card connector.

本発明の一実施の形態に係るメモリーカード用コネクタ１へ、ＳＩＭカード５０とｍｉｃｒｏＳＤカード６０を接続した状態を示す斜視図である。1 is a perspective view showing a state in which a SIM card 50 and a microSD card 60 are connected to a memory card connector 1 according to an embodiment of the present invention. 金属カバー５の斜視図である。3 is a perspective view of a metal cover 5. FIG. ６本のＬ字コンタクト３と８本の細長帯状コンタクト４が片持ち支持された絶縁プレート２の斜視図である。FIG. 6 is a perspective view of an insulating plate 2 in which six L-shaped contacts 3 and eight strip-like contacts 4 are cantilevered. 絶縁プレート２に取り付けられるＬ字コンタクト３と細長帯状コンタクト４の配置位置を示す平面図である。FIG. 3 is a plan view showing the arrangement positions of an L-shaped contact 3 and an elongated strip-shaped contact 4 attached to the insulating plate 2. 金属カバー５の図示を省略したメモリーカード用コネクタ１へ、ｍｉｃｒｏＳＤカード６０を接続した状態を示す斜視図である。FIG. 3 is a perspective view showing a state in which a microSD card 60 is connected to a memory card connector 1 in which a metal cover 5 is not shown. ＳＩＭカード５０の挿入方向に直交する方向に沿って切断したメモリーカード用コネクタ１の縦断面図である。3 is a longitudinal sectional view of the memory card connector 1 cut along a direction orthogonal to the insertion direction of the SIM card 50. FIG. 本発明に係るメモリーカード用コネクタ１と従来のメモリーカード用コネクタ１００の大きさを比較した模式図である。It is the schematic diagram which compared the magnitude | size of the connector 1 for memory cards which concerns on this invention, and the connector 100 for conventional memory cards. 他の実施の形態に係るメモリーカード用コネクタ２０の縦断面図である。It is a longitudinal cross-sectional view of the connector 20 for memory cards which concerns on other embodiment. ＳＩＭカード５０の挿入方向に直交する方向で切断した従来のメモリーカード用コネクタ１００の縦断面図である。3 is a longitudinal sectional view of a conventional memory card connector 100 cut in a direction orthogonal to the insertion direction of the SIM card 50. FIG. 従来のメモリーカード用コネクタ１００へ、ＳＩＭカード５０とｍｉｃｒｏＳＤカード６０を接続した状態を示す斜視図である。It is a perspective view which shows the state which connected the SIM card 50 and the microSD card 60 to the conventional memory card connector 100. FIG. 従来のメモリーカード用コネクタ１００の斜視図である。It is a perspective view of the conventional connector 100 for memory cards. ＳＩＭカード５０の挿入方向に沿って切断したメモリーカード用コネクタ１００の要部縦断面図である。4 is a longitudinal sectional view of a main part of the memory card connector 100 cut along the insertion direction of the SIM card 50. FIG. ２種類のメモリーカードを示し、（ａ）は、ＳＩＭカード５０、（ｂ）は、ｍｉｃｒｏＳＤカード６０の平面図である。Two types of memory cards are shown, (a) is a plan view of a SIM card 50, and (b) is a plan view of a microSD card 60. FIG.

以下、本発明の一実施の形態に係るメモリーカード用コネクタ１を、図１乃至図７を用いて説明する。このメモリーカード用コネクタ１００に挿入して接続する２種類のメモリーカードは、前述した従来のメモリーカード用コネクタ１に接続する同一のＳＩＭカード５０とｍｉｃｒｏＳＤカード６０であるので、同一番号を付してメモリーカード用コネクタ１の説明に用いる。また、メモリーカード用コネクタ１の各部は、図４において、下方、上方を前方及び後方と、左右方向を左右方向と、図４の紙面に直交する奥行き方向を下方と、同手前方向を上方として説明する。   A memory card connector 1 according to an embodiment of the present invention will be described below with reference to FIGS. The two types of memory cards that are inserted into and connected to the memory card connector 100 are the same SIM card 50 and microSD card 60 that are connected to the conventional memory card connector 1 described above. This is used to explain the memory card connector 1. Further, in FIG. 4, each part of the memory card connector 1 has a lower side, an upper side as front and rear, a left-right direction as left-right direction, a depth direction perpendicular to the paper surface of FIG. explain.

メモリーカード用コネクタ１は、絶縁プレート２と、絶縁プレート２にそれぞれ片持ち支持された６本のＬ字コンタクト３及び８本の細長帯状コンタクト４と、一対のスイッチコンタクト１０と、絶縁プレート２の周囲を覆う金属カバー５とからなっている。   The memory card connector 1 includes an insulating plate 2, six L-shaped contacts 3 and eight strip-shaped contacts 4 that are cantilevered on the insulating plate 2, a pair of switch contacts 10, and an insulating plate 2. It consists of a metal cover 5 covering the periphery.

絶縁プレート２は、絶縁プラスチックにより外形が長方形薄板状に形成され、その上面に、ＭｉｃｒｏＳＤカード６０の側面を囲う上枠部２ａと、下面に、ＳＩＭカード５０の側面を囲う下枠部２ｂとが、それぞれ前方側を開口させたコの字状に一体に形成されている。メモリーカード用コネクタ１のハウジング本体は、このように形成された絶縁プレート２と、長方形薄板状の絶縁プレート２の前面と後面を除く周囲を覆うように、図２に示す角筒状に折り曲げ形成された金属カバー５とから構成される。   The insulating plate 2 is formed of an insulating plastic in the shape of a rectangular thin plate, and has an upper frame portion 2a surrounding the side surface of the MicroSD card 60 on its upper surface and a lower frame portion 2b surrounding the side surface of the SIM card 50 on its lower surface. These are integrally formed in a U shape with the front side opened. The housing body of the memory card connector 1 is formed into a rectangular tube shape as shown in FIG. 2 so as to cover the insulating plate 2 formed in this way and the periphery excluding the front and rear surfaces of the rectangular thin plate-like insulating plate 2. It is comprised from the metal cover 5 made.

金属カバー５は、絶縁プレート２の前方から装着され、前面に沿って折り曲げられたストッパー片５ａが絶縁プレート２の前面に当接する位置で、左右の側面から内側に切り起こされた切り起こし片５ｂが絶縁プレート２の両側面の凹溝に嵌入して、絶縁プレート２に固定される。金属カバー５を絶縁プレート２に固定することにより、上枠部２ａで囲われる絶縁プレート２の上面と金属カバー５との間にＭｉｃｒｏＳＤカード６０を収容する上カード収容凹部６が、下枠部２ｂで囲われる絶縁プレート２の下面と金属カバー５との間にＳＩＭカード５０を収容する下カード収容凹部７が、絶縁プレート２を介した上下二段に形成される。   The metal cover 5 is mounted from the front of the insulating plate 2, and is a cut-and-raised piece 5b cut and raised inward from the left and right side surfaces at a position where the stopper piece 5a bent along the front surface comes into contact with the front surface of the insulating plate 2. Is fitted into the concave grooves on both side surfaces of the insulating plate 2 and fixed to the insulating plate 2. By fixing the metal cover 5 to the insulating plate 2, the upper card accommodating recess 6 for accommodating the MicroSD card 60 between the upper surface of the insulating plate 2 surrounded by the upper frame portion 2a and the metal cover 5 is formed in the lower frame portion 2b. A lower card receiving recess 7 for receiving the SIM card 50 is formed between the lower surface of the insulating plate 2 surrounded by the metal plate 5 and the metal cover 5 in two upper and lower stages via the insulating plate 2.

６本の各Ｌ字コンタクト３は、図４に示すように、幅広で下面が突曲面となった凸面接触部３ａと、凸面接触部３ａの左側に連結し、後方Ｌ字状に屈曲する支持部３ｂと、支持部３ｂから絶縁プレート２の後方に引き出され、プリント配線基板１１０のパターンに接続する脚部３ｃと、凸面接触部３ａの右側に接続する位置決め片３ｄとが、ここでは、りん青銅からなる導電性薄肉金属板を鉛直方向に打ち抜いて形成される。支持部３ｂ、脚部３ｃ、位置決め片３ｄは、同一の細幅帯状に打ち抜いて形成され、凸面接触部３ａは、幅広に打ち抜いた帯状部分の中央を下方に向けて打ち出し、所定の接触圧を得るために高さをδ以上とした下方に突出する凸面接触部３ａが形成される。   As shown in FIG. 4, each of the six L-shaped contacts 3 is connected to the convex contact portion 3a having a wide, lower surface and a projecting curved surface, and to the left side of the convex contact portion 3a, and is supported to be bent in a rear L shape. Here, the portion 3b, the leg portion 3c that is pulled out from the support portion 3b to the rear of the insulating plate 2 and is connected to the pattern of the printed wiring board 110, and the positioning piece 3d that is connected to the right side of the convex contact portion 3a It is formed by punching a conductive thin metal plate made of bronze in the vertical direction. The support part 3b, the leg part 3c, and the positioning piece 3d are formed by punching into the same narrow band shape, and the convex contact part 3a is punched downward with the center of the wide band part punched out to give a predetermined contact pressure. In order to obtain this, a convex contact portion 3a projecting downward with a height of δ or more is formed.

図３に示すように、絶縁プレート２の上カード収容凹部６を避けた左側には、前後方向に沿って長方形の輪郭の第１コンタクト収容孔２ｃが２列に分けて形成され、インサート成形により、互いに絶縁して絶縁プレート２に片持ち支持される６本の各Ｌ字コンタクト３は、３本毎に各第１コンタクト収容孔２ｃに支持部３ｂの中間が右方に突出するように片持ち支持される。   As shown in FIG. 3, first contact receiving holes 2 c having a rectangular outline are formed in two rows along the front-rear direction on the left side avoiding the upper card receiving recess 6 of the insulating plate 2. The six L-shaped contacts 3 that are insulated from each other and cantilevered by the insulating plate 2 are separated so that the middle of the support portion 3b protrudes to the right in each first contact receiving hole 2c. It is supported.

片持ち支持される支持部３ｂとその自由端側の凸面接触部３ａは、固定端から下方に傾斜するようにプレストレスが付与され、凸面接触部３ａが第１コンタクト収容孔２ｃの下方で下カード収容凹部７内に突出した状態で、先端の位置決め片３ｄが第１コンタクト収容孔２ｃの周縁に当接し、位置決めされる。凸面接触部３ａの前方下面側は、後方に向かって下方に傾斜する傾斜面となり、後方に向かって挿入されるＳＩＭカード５０が凸面接触部３ａ当接すると、支持部３ｂがδ撓み、上方の第１コンタクト収容孔２ｃ内に退避する。従って、絶縁プレート２の厚みに相当する第１コンタクト収容孔２ｃの高さは、少なくとも撓み量δより高いｈとなっている。   The cantilevered support portion 3b and the convex contact portion 3a on the free end thereof are prestressed so as to incline downward from the fixed end, and the convex contact portion 3a is located below the first contact receiving hole 2c. The positioning piece 3d at the tip abuts on the peripheral edge of the first contact receiving hole 2c and is positioned in a state of protruding into the card receiving recess 7. The front lower surface side of the convex contact portion 3a is an inclined surface that is inclined downward toward the rear. When the SIM card 50 inserted rearward comes into contact with the convex contact portion 3a, the support portion 3b bends by δ, Retreat into the first contact housing hole 2c. Accordingly, the height of the first contact accommodating hole 2c corresponding to the thickness of the insulating plate 2 is h which is at least higher than the deflection amount δ.

６本の各Ｌ字コンタクト３の各凸面接触部３ａは、ＳＩＭカード５０の６個の電極５１の露出位置に対応する下カード収容凹部７内に突出させたものであり、図１３（ａ）に示すＳＩＭカード５０の上面の左側で３行２列のマトリックス状に分散して露出する６個の電極５１の露出位置と、下カード収容凹部７内に各凸面接触部３ａが突出するＳＩＭ接続領域８が個々に対応している。各凸面接触部３ａのＳＩＭ接続領域８が平面上に分散するＬ字コンタクト３は、同一方向の後方に引き出されるが、支持部３ｂをＬ字状として、凸面接触部３ａをＳＩＭカード５０の挿入方向に対して直交する左右方向で支持するので、各Ｌ字コンタクト３を互いに絶縁し、鉛直方向で重ねずに、絶縁プレート２に配置できる。   Each convex contact portion 3a of each of the six L-shaped contacts 3 protrudes into the lower card accommodating recess 7 corresponding to the exposed position of the six electrodes 51 of the SIM card 50, and FIG. The SIM card 50 is exposed on the left side of the upper surface of the SIM card 50 in the form of a matrix of 3 rows and 2 columns, and the exposed positions of the six electrodes 51 and the SIM connection in which each convex contact portion 3a protrudes into the lower card housing recess 7. Regions 8 correspond individually. The L-shaped contact 3 in which the SIM connection region 8 of each convex surface contact portion 3a is dispersed on a plane is drawn out rearward in the same direction, but the support portion 3b is L-shaped and the convex surface contact portion 3a is inserted into the SIM card 50. Since it supports in the left-right direction orthogonal to the direction, the L-shaped contacts 3 can be arranged on the insulating plate 2 without being insulated from each other and overlapping in the vertical direction.

８本の細長帯状コンタクト４は、それぞれ図４に示すように、全体が細幅帯状に形成され、後方の先端に向かって上方に傾斜して支持される板バネ接触部４ａと、板バネ接触部４ａの前方に連結し、Ｕ字状に後方に折り返された支持部４ｂと、支持部４ｂから絶縁プレート２の後方に引き出され、プリント配線基板１１０のパターンに接続する脚部４ｃが、同様に、りん青銅からなる導電性薄肉金属板を鉛直方向に打ち抜いて形成される。   As shown in FIG. 4, each of the eight strip-shaped contacts 4 is formed in a narrow strip shape, and is supported by being inclined upward toward the rear end, and a leaf spring contact portion. The support part 4b connected to the front of the part 4a and folded back in the U-shape, and the leg part 4c that is pulled out from the support part 4b to the back of the insulating plate 2 and is connected to the pattern of the printed wiring board 110 are the same. In addition, a conductive thin metal plate made of phosphor bronze is punched in the vertical direction.

８本の細長帯状コンタクト４は、Ｌ字コンタクト３とともに絶縁プレート２にインサート成形され、図３に示すように、絶縁プレート２に片持ち支持されるもので、上枠部２ａで囲われる絶縁プレート２の上面に横長長方形の輪郭で形成される第２コンタクト収容孔２ｄの前縁で支持部４ｂを片持ち支持し、その先端側に連結する板バネ接触部４ａを後方に向かって上方に傾斜させて、上カード収容凹部６内に突出させている。   The eight strip-like contacts 4 are insert-molded on the insulating plate 2 together with the L-shaped contact 3 and are cantilevered on the insulating plate 2 as shown in FIG. 3, and are insulated by the upper frame portion 2a. The support portion 4b is cantilevered at the front edge of the second contact receiving hole 2d formed in the shape of a horizontally long rectangle on the upper surface of the plate 2, and the leaf spring contact portion 4a connected to the tip side thereof is inclined upward and rearward. It is made to protrude in the upper card accommodation recessed part 6.

８本の細長帯状コンタクト４の各板バネ接触部４ａは、直線上に露出するＭｉｃｒｏＳＤカード６０の８個の電極６１の露出位置に対応する上カード収容凹部６内に突出させたものであり、図１３（ｂ）に示すＭｉｃｒｏＳＤカード６０の下面の一辺に沿って直線状に露出する８個の電極６１の露出位置と、上カード収容凹部６内に各板バネ接触部４ａが突出するＳＤ接続領域９が個々に対応している。これにより、ＳＤ接続領域９において、上カード収容凹部６に挿入されるＭｉｃｒｏＳＤカード６０の各電極６１に８本の細長帯状コンタクト４の各板バネ接触部４ａが弾性接触する。   Each leaf spring contact portion 4a of the eight strip-like contacts 4 is projected into the upper card accommodating recess 6 corresponding to the exposed position of the eight electrodes 61 of the MicroSD card 60 exposed on a straight line, The exposed position of the eight electrodes 61 exposed linearly along one side of the lower surface of the MicroSD card 60 shown in FIG. 13B and the SD connection in which each leaf spring contact portion 4a protrudes into the upper card housing recess 6. Regions 9 correspond to each other. Thereby, in the SD connection area 9, the leaf spring contact portions 4 a of the eight strip-like contacts 4 are in elastic contact with the electrodes 61 of the MicroSD card 60 inserted into the upper card housing recess 6.

絶縁プレート２に一体成形される６本の各Ｌ字コンタクト３及び８本の細長帯状コンタクト４は、それぞれの脚部３ｃ、４ｃを絶縁プレート２の後端面の異なる位置へ引き出しているが、図４に示すように、鉛直方向で互いに重なる箇所がないように各コンタクト３、４を配列しているので、鉛直方向に分割する金型のみでインサート成形が可能となり、複雑構造の金型を用いずに一体成形できる。   The six L-shaped contacts 3 and the eight strip-shaped contacts 4 formed integrally with the insulating plate 2 lead out the respective leg portions 3c and 4c to different positions on the rear end surface of the insulating plate 2. As shown in FIG. 4, since the contacts 3 and 4 are arranged so that there are no overlapping portions in the vertical direction, insert molding is possible only with the mold divided in the vertical direction, and a mold having a complicated structure is used. Can be formed integrally.

尚、上カード収容凹部６へＭｉｃｒｏＳＤカード６０が挿入されたことを検知する為の一対の板バネ片からなるスイッチコンタクト１０は、上記Ｌ字コンタクト３及び細長帯状コンタクト４をインサート成形した絶縁プレート２に対して、図示する位置へ圧入して取り付けている。   The switch contact 10 made up of a pair of leaf spring pieces for detecting the insertion of the MicroSD card 60 into the upper card receiving recess 6 is an insulating plate 2 in which the L-shaped contact 3 and the elongated strip-shaped contact 4 are insert-molded. On the other hand, it is press-fitted and attached to the position shown in the figure.

このように構成されたメモリーカード用コネクタ１に、図１に示すように、ＳＩＭカード５０を前方から下カード収容凹部７へ挿入すると、ＳＩＭ接続領域８において、下カード収容凹部７内に突出する６本のＬ字コンタクト３の各凸面接触部３ａの傾斜面にＳＩＭカード５０が当接し、支持部３ｂが上方に撓むことにより、各凸面接触部３ａは、第１コンタクト収容孔２ｃ内に退避しながら、ＳＩＭカード５０の対応する各電極５１に弾性接触する。   As shown in FIG. 1, when the SIM card 50 is inserted into the lower card accommodation recess 7 from the front into the memory card connector 1 configured as described above, the SIM card is projected into the lower card accommodation recess 7 in the SIM connection area 8. The SIM card 50 comes into contact with the inclined surface of each convex contact portion 3a of the six L-shaped contacts 3, and the support portion 3b bends upward so that each convex contact portion 3a is placed in the first contact receiving hole 2c. While retracting, it makes elastic contact with the corresponding electrodes 51 of the SIM card 50.

また、ＳＩＭカード５０を挿入して接続したメモリーカード用コネクタ１の上カード収容凹部６に、更に、ＭｉｃｒｏＳＤカード６０を前方から挿入すると、ＳＤ接続領域９において、上カード収容凹部６内で後方に向かって上方に傾斜する８本の細長帯状コンタクト４の各板バネ接触部４ａにＭｉｃｒｏＳＤカード６０が当接し、各板バネ接触部４ａは、第２コンタクト収容孔２ｄ内の下方に撓みながら、ＭｉｃｒｏＳＤカード６０の対応する各電極６１に弾性接触する。これにより、同一方向から挿入されるＳＩＭカード５０及びＭｉｃｒｏＳＤカード６０は、上下の２段に分けて収容され、各カード５０、６０の電極５１、６１が対応するコンタクト３、４に電気接続する。   Further, when the MicroSD card 60 is further inserted from the front into the upper card receiving recess 6 of the memory card connector 1 to which the SIM card 50 has been inserted and connected, the SD connection area 9 is moved backward in the upper card receiving recess 6. The microSD card 60 comes into contact with the leaf spring contact portions 4a of the eight strip-shaped contacts 4 inclined upward, and the leaf spring contact portions 4a bend downward in the second contact housing hole 2d while microSD. Elastic contact is made with each corresponding electrode 61 of the card 60. Thereby, the SIM card 50 and the MicroSD card 60 inserted from the same direction are accommodated in two upper and lower stages, and the electrodes 51 and 61 of each card 50 and 60 are electrically connected to the corresponding contacts 3 and 4.

上述の実施の形態によれば、ＳＩＭカード５０を挿入する下カード収容凹部７の鉛直方向領域内に、ＭｉｃｒｏＳＤカード６０を挿入する上カード収容凹部６を形成し、ＳＤ接続領域９を下カード収容凹部７に収容されるＳＩＭカード５０の鉛直方向領域内に形成するので、２種類のメモリーカード５０、６０をそれぞれ同時に接続可能なメモリーカード用コネクタ１であっても、ＳＩＭカード５０の外形よりわずかに大きいだけであり、鉛直方向に実装するプリント配線基板１１０上の実装面積が拡大しない。   According to the above-described embodiment, the upper card accommodation recess 6 for inserting the MicroSD card 60 is formed in the vertical direction area of the lower card accommodation recess 7 for inserting the SIM card 50, and the SD connection area 9 is accommodated in the lower card accommodation. Since it is formed in the vertical direction area of the SIM card 50 accommodated in the recess 7, even the memory card connector 1 capable of simultaneously connecting two types of memory cards 50 and 60 is slightly smaller than the outer shape of the SIM card 50. The mounting area on the printed wiring board 110 mounted in the vertical direction is not enlarged.

また、Ｌ字コンタクト３の凸面接触部３ａは、所定の高さδ以上の高さで突状に形成され、ＳＩＭカード５０が挿入されている間にこの凸面接触部３ａを退避させる第１コンタクト収容孔２ｃの高さは、少なくともδ以上のｈの高さとなっているが、上カード収容凹部６が、凸面接触部３ａが突出するＳＩＭ接続領域８と鉛直方向で重ならない絶縁プレート２の部位に形成されているので、凸面接触部３ａが第１コンタクト収容孔２ｃ内に退避しても上カード収容凹部６に収容されるＭｉｃｒｏＳＤカード６０と干渉しない。   Further, the convex contact portion 3a of the L-shaped contact 3 is formed in a protruding shape with a height equal to or higher than a predetermined height δ, and the first contact that retracts the convex contact portion 3a while the SIM card 50 is inserted. The height of the receiving hole 2c is at least δ or more h, but the portion of the insulating plate 2 in which the upper card receiving recess 6 does not overlap the SIM connection region 8 from which the convex contact portion 3a protrudes in the vertical direction. Therefore, even if the convex contact portion 3a is retracted into the first contact accommodating hole 2c, it does not interfere with the MicroSD card 60 accommodated in the upper card accommodating recess 6.

図７は、上述した従来のメモリーカード用コネクタ１００と本実施の形態に係るメモリーカード用コネクタ１の外形を比較して示すものであり、従来のメモリーカード用コネクタ１００が、細長帯状コンタクト１０７の第２接触部１０７ａが突出する第２カード収容凹部１０５が、第１カード収容凹部１０４の側方に形成されているのに対し、本実施の形態に係るメモリーカード用コネクタ１では、細長帯状コンタクト４の板バネ接触部４ａが突出する上カード収容凹部６は、下カード収容凹部７の鉛直方向領域内に形成されているので、鉛直方向投影面積が拡大しない。   FIG. 7 shows a comparison of the outer shape of the conventional memory card connector 100 described above and the memory card connector 1 according to the present embodiment. The conventional memory card connector 100 includes a strip-shaped contact 107. The second card receiving recess 105 from which the second contact portion 107a protrudes is formed on the side of the first card receiving recess 104, whereas in the memory card connector 1 according to the present embodiment, the elongated strip contact Since the upper card accommodation recess 6 from which the 4 leaf spring contact portions 4a protrude is formed in the vertical region of the lower card accommodation recess 7, the vertical projection area does not increase.

また、従来のメモリーカード用コネクタ１００の実装基板面からの高さは、ＭｉｃｒｏＳＤカード６０を収容する上カード収容凹部６を形成する金属カバー５の厚みｄ１、上カード収容凹部６の高さｄ２、ＳＩＭカード５０を収容する下カード収容凹部７を形成する金属カバー５の厚みｄ３、下カード収容凹部７の高さｄ４、凸面接触部３ａを退避させる第１コンタクト収容孔２ｃの高さに等しい絶縁プレート２の厚みｄ５の和となっている。   Further, the height of the conventional memory card connector 100 from the mounting board surface is such that the thickness d1 of the metal cover 5 that forms the upper card accommodation recess 6 for accommodating the MicroSD card 60, the height d2 of the upper card accommodation recess 6; Insulation equal to the thickness d3 of the metal cover 5 forming the lower card accommodation recess 7 for accommodating the SIM card 50, the height d4 of the lower card accommodation recess 7 and the height of the first contact accommodation hole 2c for retracting the convex contact portion 3a. This is the sum of the thickness d5 of the plate 2.

一方、本実施の形態に係るメモリーカード用コネクタ１では、ＭｉｃｒｏＳＤカード６０を収容する上カード収容凹部６を、凸面接触部３ａを退避させる第１コンタクト収容孔２ｃの高さに等しい絶縁プレート２の厚み内に形成するので、実装基板面からの高さは、上カード収容凹部６を形成する金属カバー５の厚みｄ１、凸面接触部３ａを退避させる絶縁プレート２の厚みｄ５、下カード収容凹部７の高さｄ４、下カード収容凹部７を形成する金属カバー５の厚みｄ３との和となり、上カード収容凹部６の高さｄ２分が低背化される。尚、図７から明らかなように、メモリーカード用コネクタ１を実装するプリント配線基板１１０の実装面で下カード収容凹部７の一面を覆うことができれば、本実施の形態で下カード収容凹部７の下面を覆う金属カバー５が不要となり、更に低背化が可能となる。   On the other hand, in the memory card connector 1 according to the present embodiment, the upper card accommodating recess 6 that accommodates the MicroSD card 60 is formed of the insulating plate 2 equal to the height of the first contact accommodating hole 2c that retracts the convex contact portion 3a. Since it is formed within the thickness, the height from the mounting board surface is as follows: the thickness d1 of the metal cover 5 that forms the upper card housing recess 6, the thickness d5 of the insulating plate 2 that retracts the convex contact portion 3a, and the lower card housing recess 7 Height d4 and the thickness d3 of the metal cover 5 that forms the lower card receiving recess 7, and the height d2 of the upper card receiving recess 6 is lowered. As can be seen from FIG. 7, if the mounting surface of the printed wiring board 110 on which the memory card connector 1 is mounted can cover one surface of the lower card housing recess 7, The metal cover 5 that covers the lower surface becomes unnecessary, and the height can be further reduced.

上述の実施の形態では、絶縁ハウジングの上方に、ＭｉｃｒｏＳＤカード６０を収容する上カード収容凹部６を、下方にＳＩＭカード５０を収容する下カード収容凹部７を形成しているが、上下２段に分けた収容凹部は、対応構成を同一番号で付して示す図８のメモリーカード用コネクタ２０のように、上下逆であってもよい。   In the above-described embodiment, the upper card accommodating recess 6 for accommodating the MicroSD card 60 is formed above the insulating housing, and the lower card accommodating recess 7 for accommodating the SIM card 50 is formed below. The divided receiving recesses may be upside down as in the memory card connector 20 of FIG.

また、細長帯状コンタクト４は、上カード収容凹部６内に板バネ接触部４ａを突出させるものであれば、絶縁プレート２側で片持ち支持せず、上カード収容凹部６を囲う金属カバー５を絶縁カバーで形成し、この絶縁カバー側で支持してもよい。   Further, if the strip-like contact 4 is a member that projects the leaf spring contact portion 4a into the upper card receiving recess 6, the metal cover 5 surrounding the upper card receiving recess 6 is not supported on the insulating plate 2 side. The insulating cover may be formed and supported on the insulating cover side.

更に、２種類のメモリーカードは、上述のＳＩＭカード５０及びＭｉｃｒｏＳＤカード６０に限らず、他方のメモリーカードに比較して、大型のメモリーカードの電極が、２次元平面に分散して露出するメモリーカードであれば、他の種類であってもよい。   Further, the two types of memory cards are not limited to the above-described SIM card 50 and MicroSD card 60, but are memory cards in which the electrodes of a large memory card are distributed and exposed in a two-dimensional plane as compared to the other memory card. Any other type may be used.

本発明は、２種類の大きさのメモリーカードと同時に接続するメモリーカード用コネクタに適している。   The present invention is suitable for a memory card connector that is connected simultaneously with two types of memory cards.

１ メモリーカード用コネクタ
２ 絶縁プレート（ハウジング本体）
３ Ｌ字コンタクト（第１コンタクト）
３ａ 凸面接触部（第１接触部）
４ 細長帯状コンタクト（第２コンタクト）
４ａ 板バネ接触部（第２接触部）
５ 金属カバー（ハウジング本体）
６ 上カード収容凹部（第２カード収容凹部）
７ 下カード収容凹部（第１カード収容凹部）
８ ＳＩＭ接続領域（第１カード収容凹部の接続領域）
９ ＳＤ接続領域（第２カード収容凹部の接続領域）
５０ ＳＩＭカード（第１メモリーカード）
５１ 第１電極
６０ ＳＤカード（第２メモリーカード）
６１ 第２電極 1 Memory card connector 2 Insulation plate (housing body)
3 L-shaped contact (first contact)
3a Convex surface contact portion (first contact portion)
4 Narrow strip contact (second contact)
4a Leaf spring contact part (second contact part)
5 Metal cover (housing body)
6 Upper card receiving recess (second card receiving recess)
7 Lower card receiving recess (first card receiving recess)
8 SIM connection area (connection area of the first card receiving recess)
9 SD connection area (connection area of the second card receiving recess)
50 SIM card (first memory card)
51 First electrode 60 SD card (second memory card)
61 Second electrode

Claims (3)

第１メモリーカードを収容する第１カード収容凹部と、第１メモリーカードより小型の第２メモリーカードを収容する第２カード収容凹部とが、互いに平行に鉛直方向の２段に分けて形成されたハウジング本体と、
前記ハウジング本体に片持ち支持され、第１メモリーカードの一面に平面状に分散して露出する複数の第１電極にそれぞれ弾性接触するように、自由端側の第１接触部が第１カード収容凹部内に突出する複数の第１コンタクトと、
前記ハウジング本体に支持され、第２メモリーカードに直線状に露出する複数の第２電極にそれぞれ接触するように、第２接触部が第２カード収容凹部内に突出する複数の第２コンタクトとを備えたメモリーカード用コネクタであって、
第２コンタクトの第２接触部が突出する第２カード収容凹部の接続領域は、第１カード収容凹部に収容される第１メモリーカードの鉛直方向のハウジング本体の部位に形成されるとともに、
第２カード収容凹部は、第２カード収容凹部に収容される第２メモリーカードと、第１コンタクトの第１接触部が突出する第１カード収容凹部の接続領域とが鉛直方向で重ならないハウジング本体の部位に形成されていることを特徴とするメモリーカード用コネクタ。 A first card housing recess for housing the first memory card and a second card housing recess for housing a second memory card smaller than the first memory card are formed in two steps in parallel in the vertical direction. A housing body;
The first contact portion on the free end side accommodates the first card so as to elastically contact each of the plurality of first electrodes that are cantilevered by the housing body and are distributed and exposed on one surface of the first memory card. A plurality of first contacts protruding into the recess;
A plurality of second contacts that are supported by the housing body and project into the second card receiving recesses so as to contact the plurality of second electrodes that are linearly exposed to the second memory card. A memory card connector comprising:
The connection area of the second card accommodation recess from which the second contact portion of the second contact protrudes is formed in a portion of the housing body in the vertical direction of the first memory card accommodated in the first card accommodation recess,
The second card housing recess has a housing body in which the second memory card housed in the second card housing recess and the connection area of the first card housing recess from which the first contact portion of the first contact protrudes do not overlap in the vertical direction. A connector for a memory card, characterized in that it is formed at a portion of the memory card. 複数の第１コンタクトと複数の第２コンタクトは、第１接触部と第２接触部が、鉛直方向の一面と他面から互いに反対方向に突出して、一枚の絶縁プレートに片持ち支持され、
第１接触部が突出する前記絶縁プレートの一面と、前記絶縁プレートに取り付けられた第１カバーとの間に第１カード収容凹部が形成され、
第２接触部が突出する前記絶縁プレートの他面と、前記絶縁プレートに取り付けられた第２カバーとの間に第２カード収容凹部が形成されていることを特徴とする請求項１に記載のメモリーカード用コネクタ。 The plurality of first contacts and the plurality of second contacts, the first contact portion and the second contact portion protrude in opposite directions from one surface and the other surface in the vertical direction, are cantilevered by a single insulating plate,
A first card receiving recess is formed between one surface of the insulating plate from which the first contact portion protrudes and a first cover attached to the insulating plate;
The second card receiving recess is formed between the other surface of the insulating plate from which the second contact portion projects and a second cover attached to the insulating plate. Memory card connector. 第１メモリーカードが、ＳＩＭカードであり、第２メモリーカードがｍｉｃｒｏＳＤカードである請求項１又は請求項２に記載のメモリーカード用コネクタ。 The memory card connector according to claim 1 or 2, wherein the first memory card is a SIM card and the second memory card is a microSD card.
JP2009048798A 2009-03-03 2009-03-03 Connector for memory card Pending JP2010205523A (en)

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JPH03130287U (en) * 1990-04-12 1991-12-27
JP2001297810A (en) * 2000-04-12 2001-10-26 Japan Aviation Electronics Industry Ltd Compound connector
JP2008027906A (en) * 2006-07-21 2008-02-07 ▲東▼莞捷仕美▲電▼子有限公司 Two-in-one connector between cellular phone sim card and memory card

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Publication number Priority date Publication date Assignee Title
CN113747695A (en) * 2020-05-27 2021-12-03 台达电子工业股份有限公司 Electronic device and insulating sheet thereof
CN113747695B (en) * 2020-05-27 2023-02-28 台达电子工业股份有限公司 Electronic device and insulating sheet thereof

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