JP2010192877A5 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
JP2010192877A5
JP2010192877A5 JP2009291547A JP2009291547A JP2010192877A5 JP 2010192877 A5 JP2010192877 A5 JP 2010192877A5 JP 2009291547 A JP2009291547 A JP 2009291547A JP 2009291547 A JP2009291547 A JP 2009291547A JP 2010192877 A5 JP2010192877 A5 JP 2010192877A5
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JP
Japan
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region
insulating layer
layer
semiconductor layer
semiconductor
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JP2009291547A
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Japanese (ja)
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JP5490515B2 (en
JP2010192877A (en
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Priority to JP2009291547A priority Critical patent/JP5490515B2/en
Priority claimed from JP2009291547A external-priority patent/JP5490515B2/en
Publication of JP2010192877A publication Critical patent/JP2010192877A/en
Publication of JP2010192877A5 publication Critical patent/JP2010192877A5/en
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Publication of JP5490515B2 publication Critical patent/JP5490515B2/en
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Claims (1)

基板上にトランジスタを有する半導体装置であって、A semiconductor device having a transistor on a substrate,
前記トランジスタは、導電層と、第1の絶縁層と、第2の絶縁層と、半導体層と、を有し、The transistor includes a conductive layer, a first insulating layer, a second insulating layer, and a semiconductor layer.
前記導電層は、前記第1の絶縁層と前記第2の絶縁層とを介して、前記半導体層と重なる領域を有し、The conductive layer has a region overlapping with the semiconductor layer via the first insulating layer and the second insulating layer,
前記第1の絶縁層は、窒素と珪素とを含み、The first insulating layer contains nitrogen and silicon,
前記第2の絶縁層は、酸素と珪素とを含み、The second insulating layer contains oxygen and silicon,
前記半導体層は、The semiconductor layer is
前記基板表面の法線方向に沿って成長した結晶を有する第1の領域と、A first region having a crystal grown along the normal direction of the substrate surface;
非晶質を有する第2の領域と、A second region having an amorphous state;
前記第1の領域と前記第2の領域の間に設けられ、前記結晶と非晶質とが混在した第3の領域と、を有し、And a third region provided between the first region and the second region and in which the crystal and the amorphous are mixed,
前記半導体層において、二次イオン質量分析法によって計測される窒素濃度は、前記第1の領域と前記第3の領域との界面近傍においてピークを有することを特徴とする半導体装置。In the semiconductor layer, a nitrogen concentration measured by secondary ion mass spectrometry has a peak in the vicinity of an interface between the first region and the third region.
JP2009291547A 2009-01-21 2009-12-23 Semiconductor device Expired - Fee Related JP5490515B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009291547A JP5490515B2 (en) 2009-01-21 2009-12-23 Semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009011402 2009-01-21
JP2009011402 2009-01-21
JP2009291547A JP5490515B2 (en) 2009-01-21 2009-12-23 Semiconductor device

Publications (3)

Publication Number Publication Date
JP2010192877A JP2010192877A (en) 2010-09-02
JP2010192877A5 true JP2010192877A5 (en) 2012-11-08
JP5490515B2 JP5490515B2 (en) 2014-05-14

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Family Applications (1)

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JP2009291547A Expired - Fee Related JP5490515B2 (en) 2009-01-21 2009-12-23 Semiconductor device

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JP (1) JP5490515B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5848918B2 (en) * 2010-09-03 2016-01-27 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR102088462B1 (en) 2013-07-03 2020-05-28 삼성디스플레이 주식회사 Thin film transistor display panel and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0017471D0 (en) * 2000-07-18 2000-08-30 Koninkl Philips Electronics Nv Thin film transistors and their manufacture
JP2004146691A (en) * 2002-10-25 2004-05-20 Chi Mei Electronics Corp Method for forming microcrystal thin film, method for manufacturing thin-film transistor, and thin-film transistor, and picture display device using the same

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