JP2010135424A - Plasma treatment device - Google Patents

Plasma treatment device Download PDF

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JP2010135424A
JP2010135424A JP2008307853A JP2008307853A JP2010135424A JP 2010135424 A JP2010135424 A JP 2010135424A JP 2008307853 A JP2008307853 A JP 2008307853A JP 2008307853 A JP2008307853 A JP 2008307853A JP 2010135424 A JP2010135424 A JP 2010135424A
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rectifying wall
mounting table
wall
substrate
processing apparatus
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JP5141520B2 (en
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Masahito Minami
雅人 南
Yoshihiko Sasaki
芳彦 佐々木
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to KR1020090117851A priority patent/KR101133880B1/en
Priority to TW098140992A priority patent/TWI403222B/en
Priority to CN2009102243628A priority patent/CN101752172B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma treatment device reducing entrainment of a deposit occurring in plasma treatment to reduce pollution of a treating object. <P>SOLUTION: In the plasma treatment device where processing gas is turned into plasma between an anode electrode and a cathode electrode for treatment of the treating object S, an upper straightening wall 51 and a lower rectifying wall 52 are stacked vertically on a mounting base 3 serving as an electrode on one side to surround the circumference of the treating object S placed on the mounting base 3, and an elevating mechanism moves the upper rectifying wall 51 upward and downward between the mounting position on the lower side rectifying wall 52 and a position separated upward from the lower rectifying wall 52. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、処理容器内において、例えばＦＰＤ(フラットパネルディスプレイ)用のガラス基板や半導体ウエハなどの被処理体に対して処理ガスを供給し、この処理ガスにより前記被処理体に対して所定の処理を行う技術に関する。   The present invention supplies a processing gas to a target object such as a glass substrate for an FPD (flat panel display) or a semiconductor wafer in a processing container, and the processing gas supplies a predetermined value to the target object. The present invention relates to processing technology.

ＬＣＤ（Liquid Crystal Display；液晶ディスプレイ）の製造工程においては、ガラス基板上に形成されたアルミニウム（Ａｌ）膜に対してエッチング処理を施す工程がある。この工程を行うエッチング処理装置の一例を図９に基づいて簡単に説明すると、図中１は真空チャンバであり、この真空チャンバ１の内部には、下部電極をなし、被処理体である例えばＦＰＤ基板Ｓ（以下、基板Ｓと略記する）を載置するための載置台１１が設けられると共に、この載置台１１に対向するように上部電極をなす処理ガス供給部１２が設けられている。そして処理ガス供給部１２から真空チャンバ１内に例えば塩素（Ｃｌ２）系ガスよりなるエッチングガスを供給し、排気路１３を介して図示しない真空ポンプにより真空チャンバ１内を真空引きする一方、高周波電源１４から前記載置台１１に高周波電力を印加することにより基板Ｓの上方の空間にエッチングガスのプラズマが形成され、これにより基板Ｓに対するエッチング処理が行われる。 In the manufacturing process of LCD (Liquid Crystal Display), there is a process of performing an etching process on an aluminum (Al) film formed on a glass substrate. An example of an etching processing apparatus that performs this process will be briefly described with reference to FIG. 9. In FIG. 9, reference numeral 1 denotes a vacuum chamber. Inside the vacuum chamber 1, a lower electrode is formed and an object to be processed, for example, FPD A mounting table 11 for mounting a substrate S (hereinafter abbreviated as “substrate S”) is provided, and a processing gas supply unit 12 serving as an upper electrode is provided to face the mounting table 11. Then, an etching gas made of, for example, chlorine (Cl 2 ) -based gas is supplied from the processing gas supply unit 12 into the vacuum chamber 1, and the vacuum chamber 1 is evacuated by a vacuum pump (not shown) through the exhaust path 13, while high frequency By applying high frequency power from the power source 14 to the mounting table 11, plasma of an etching gas is formed in the space above the substrate S, whereby the etching process for the substrate S is performed.

ところでＡｌ膜のエッチングでは、供給律速、即ちエッチングガスの供給量とエッチング量とが比例しているため、ローディング効果により基板Ｓの周縁部のエッチング速度が極端に早くなり、エッチング量が多くなってしまうという現象が発生する。つまり図１０に符号１５で示す基板Ｓの周縁部では、エッチャントであるＣｌラジカルから見ると、符号１６にて示す同じ面積の中央領域に比べてエッチング面積が約半分であり、このため中央領域１６に供給される流量と同じ流量でエッチングガスが供給されると、周縁部１５では中央領域１６に比べてエッチング量が約２倍になってしまう。   By the way, in the etching of the Al film, the rate of supply is controlled, that is, the amount of etching gas supplied is proportional to the amount of etching. Therefore, the etching rate of the peripheral portion of the substrate S becomes extremely fast due to the loading effect, and the amount of etching increases. Phenomenon occurs. That is, in the peripheral portion of the substrate S indicated by reference numeral 15 in FIG. 10, when viewed from the Cl radical as an etchant, the etching area is about half that of the central area having the same area indicated by reference numeral 16. If the etching gas is supplied at the same flow rate as that supplied to the peripheral portion 15, the etching amount at the peripheral portion 15 is about twice that of the central region 16.

このため従来、例えば図９及び図１１（ａ）に示すように基板Ｓを囲んで高さ１０ｍｍ〜１５０ｍｍ程度の整流壁１７を載置台１１上に設けることにより、基板Ｓの周縁部近傍のエッチングガスの流れを整流壁１７にて遮り、基板Ｓの周囲にガス溜まりを形成する対策が採られてきた。これにより当該領域におけるエッチングガス流速を低下させ、基板面内におけるエッチング速度の均一性を高めることができる。   For this reason, conventionally, for example, as shown in FIGS. 9 and 11A, a rectifying wall 17 having a height of about 10 mm to 150 mm surrounding the substrate S is provided on the mounting table 11, thereby etching the vicinity of the peripheral portion of the substrate S. Measures have been taken to block the gas flow at the rectifying wall 17 to form a gas pool around the substrate S. Thereby, the etching gas flow rate in the said area | region can be reduced and the uniformity of the etching rate in a substrate surface can be improved.

この際、例えば真空チャンバ１の側壁部に設けられた搬入出口１０から載置台１１の上方側に至るまでの基板Ｓの搬送高さよりも整流壁１７の上端の位置の方が高い場合には、搬送中の基板Ｓと整流壁１７とが干渉してしまう。そこでこうした整流壁１７を備えたエッチング処理装置においては、例えば図９に示すように整流壁１７を昇降自在として整流壁１７を基板Ｓの搬送路から退避可能としたものがある。本例では、例えば整流壁１７の側面に載置台１１の外方に伸び出すように突出部１７１を設け、各々の突出部１７１の下面に昇降用の支持棒１８１を接続して、これら各支持棒１８１を昇降機１８にて昇降させることにより整流壁１７を昇降させることができる。   At this time, for example, when the position of the upper end of the rectifying wall 17 is higher than the transport height of the substrate S from the loading / unloading port 10 provided on the side wall of the vacuum chamber 1 to the upper side of the mounting table 11, The substrate S being transported and the rectifying wall 17 interfere with each other. Therefore, in some etching processing apparatuses provided with such a rectifying wall 17, for example, as shown in FIG. 9, the rectifying wall 17 can be moved up and down so that the rectifying wall 17 can be retracted from the conveyance path of the substrate S. In this example, for example, a protruding portion 171 is provided on the side surface of the rectifying wall 17 so as to extend outward from the mounting table 11, and a support rod 181 for raising and lowering is connected to the lower surface of each protruding portion 171. The rectifying wall 17 can be raised and lowered by raising and lowering the rod 181 with the elevator 18.

整流壁１７を昇降自在としたエッチング処理装置では、例えば図１１（ｂ）に示すように基板Ｓの搬入時には整流壁１７を載置台１１から上昇させた状態で載置台１１と整流壁１７との間の隙間を介して基板Ｓを搬入し、基板Ｓを載置台１１上に載置してから当該整流壁１７を下降させる一方、搬出時には整流壁１７を載置台１１より上昇させてから前記隙間を介して基板Ｓを搬出する動作が行われる。   In the etching processing apparatus in which the rectifying wall 17 is movable up and down, for example, as shown in FIG. 11B, when the substrate S is carried in, the rectifying wall 17 is raised from the mounting table 11 and the mounting table 11 and the rectifying wall 17 are moved. The substrate S is carried in through a gap between the substrates, and the rectifying wall 17 is lowered after the substrate S is placed on the placing table 11. On the other hand, when unloading, the rectifying wall 17 is raised from the placing table 11 and then the gap An operation for unloading the substrate S is performed.

ところでＡｌ膜の塩素系ガスによるエッチング処理では、Ａｌの塩化物が生成し、これが整流壁１７や載置台１１にも付着する（以下、付着物という）。特に、図１２（ａ）に示す載置台１１の上面と整流壁１７の内壁面とに挟まれて窪んだ状態となっている領域（以下、窪み部５００という）では、平坦な整流壁１７の壁面などと比べて付着物Ｄが次第に堆積していきやすい。   By the way, in the etching process of the Al film with a chlorine-based gas, an Al chloride is generated and adheres to the rectifying wall 17 and the mounting table 11 (hereinafter referred to as an adhering substance). In particular, in a region (hereinafter referred to as a dent portion 500) that is sandwiched between the upper surface of the mounting table 11 and the inner wall surface of the rectifying wall 17 shown in FIG. The deposit D is likely to gradually accumulate as compared with a wall surface or the like.

ところが従来のエッチング処理装置では、こうした付着物Ｄの堆積しやすい領域を形成している一方側の部材である整流壁１７を昇降させて基板Ｓの搬入出動作を行っていることから、この昇降動作の際に窪み部５００に堆積した付着物Ｄを巻き上げ、基板Ｓを汚染してしまうおそれが高かった（図１２（ｂ））。   However, in the conventional etching processing apparatus, since the rectifying wall 17 that is a member on one side forming the region where the deposit D is easily deposited is moved up and down, the substrate S is carried in and out. There was a high possibility that the deposit D deposited in the depression 500 during the operation was rolled up and contaminated the substrate S (FIG. 12B).

ここで特許文献１には、基板に対するエッチング処理を均一にするための整流壁を備えたエッチング処理装置が記載されているが、載置台上に基板や整流壁を載置する動作に関する記載は無く、上述の窪み部における付着物の巻き上げといった問題についても着目されていない。   Here, Patent Document 1 describes an etching processing apparatus having a rectifying wall for making the etching process on the substrate uniform, but there is no description regarding the operation of mounting the substrate or the rectifying wall on the mounting table. Also, no attention has been paid to the problem of winding up the adhering matter in the above-described depression.

また特許文献２には、半導体ウエハのドライエッチングを行うためのエッチング処理装置において、載置台を兼用する下部電極における半導体ウエハの載置面から筒状のリングを突没させることにより、半導体ウエハの周囲に整流壁を配置して処理ガスや反応生成物の流れを制御し、エッチング処理を均一化する方法が記載されている。しかし、このエッチング処理装置においても半導体ウエハの載置面と筒状のリングとの交差する領域に窪み部が存在しているので、リングを載置面から突没させる動作の際にこの窪み部から付着物が巻き上げられるおそれが高い。   Further, in Patent Document 2, in an etching processing apparatus for performing dry etching of a semiconductor wafer, a cylindrical ring is protruded from a semiconductor wafer mounting surface in a lower electrode that also serves as a mounting table, so that the semiconductor wafer A method is described in which a flow straightening wall is arranged around the periphery to control the flow of the processing gas and reaction products to make the etching process uniform. However, even in this etching processing apparatus, since there is a depression in the region where the mounting surface of the semiconductor wafer and the cylindrical ring intersect, this depression is used when the ring is protruded from the mounting surface. There is a high possibility that adhering matter will be rolled up.

さらに特許文献３にはプラズマ処理時に電極間に形成される電界の分布を調整するために、図９に示した整流壁１７とほぼ同様に構成され、昇降機構により下部電極（基板の載置台）から昇降可能に構成された整流壁を備えたエッチング処理装置が記載されているが、やはり整流壁を昇降させる際の窪み部に堆積した付着物の巻き上げといった問題には着目されていない。
特開２００３−２４３３６４号公報；第００４１段落第１行目〜第１１行目、第００４６段落第１行目〜第４行目、図１、図３ 特開平７−７４１５５号公報；第００１０段落第６行目〜第１９行目、第００１１段落第８行目〜第１１行目、図１、図３ 特開２００７−４２７４４号公報；第００３２段落、第００３４段落 Further, in Patent Document 3, in order to adjust the distribution of the electric field formed between the electrodes during the plasma processing, it is configured in substantially the same manner as the rectifying wall 17 shown in FIG. 9, and the lower electrode (substrate mounting table) is formed by a lifting mechanism. Although an etching processing apparatus having a rectifying wall configured to be able to move up and down is described, attention has not been paid to the problem of winding up deposits accumulated in the recess when the rectifying wall is raised and lowered.
JP, 2003-243364, A; 0041 paragraph 1st line-11th line, 0046 paragraph 1st line-4th line, FIG. 1, FIG. JP-A-7-74155; paragraph 0010, 6th to 19th line, paragraph 0011, 8th to 11th line, FIG. 1, FIG. JP 2007-42744 A; 0032 paragraph, 0034 paragraph

本発明はこのような事情に鑑みてなされたものであり、その目的は、プラズマ処理の際に生成する付着物の巻き上げを抑え、被処理体の汚染を低減することの可能なプラズマ処理装置を提供することにある。   The present invention has been made in view of such circumstances, and an object of the present invention is to provide a plasma processing apparatus capable of suppressing the winding of deposits generated during the plasma processing and reducing the contamination of the object to be processed. It is to provide.

本発明に係るプラズマ処理装置は、処理容器内に互いに対向して設けられたアノード電極及びカソード電極間に高周波電力を印加して処理ガスをプラズマ化し、被処理体に対してプラズマ処理を行うプラズマ処理装置において、
前記処理容器の内部に設けられ、アノード電極及びカソード電極の一方をなすと共に、被処理体を載置するための載置台と、
この載置台上に載置された被処理体の周縁に沿って、この被処理体を囲むように当該載置台上に設けられた下側整流壁と、
この下側整流壁上に載置され、当該下側整流壁と共に前記載置台上の被処理体を囲む上側整流壁と、を備え、
この上側整流壁は、下側整流壁上にて被処理体を囲む位置から退避可能に構成されていることを特徴とする。 The plasma processing apparatus according to the present invention is a plasma for applying a high-frequency power between an anode electrode and a cathode electrode provided opposite to each other in a processing container to convert the processing gas into plasma and performing plasma processing on the object to be processed. In the processing device,
A mounting table provided inside the processing container, forming one of an anode electrode and a cathode electrode, and for mounting an object to be processed;
A lower rectifying wall provided on the mounting table so as to surround the processing object along the periphery of the processing object mounted on the mounting table,
An upper rectifying wall placed on the lower rectifying wall and surrounding the object to be processed on the mounting table together with the lower rectifying wall;
The upper rectifying wall is configured to be retractable from a position surrounding the object to be processed on the lower rectifying wall.

そしてプラズマ処理装置は、前記上側整流壁を昇降させる昇降機構を備え、当該上側整流壁はこの昇降機構によって前記下側整流壁から上方側に離れた位置へと上昇することにより、被処理体を囲む位置から退避可能にするとよい。このとき被処理体は、前記下側整流壁と、この下側整流壁から上方側に離れた位置まで上昇させた上側整流壁との間の隙間を介して、前記処理容器とその外部との間を搬送するとよい。また前記下側整流壁は、載置台上における被処理体の載置面からの高さが１０ｍｍ以上、５０ｍｍ以下であることが好適であり、さらに前記下側整流壁における被処理体側の壁面と、上側整流壁における被処理体側壁面とは、両整流壁の接触部を跨いで面一になっていることが好ましい。   The plasma processing apparatus includes an elevating mechanism that raises and lowers the upper rectifying wall, and the upper rectifying wall is raised to a position away from the lower rectifying wall by the elevating mechanism, thereby It is better to be able to retreat from the surrounding position. At this time, the object to be processed is connected between the processing container and the outside through a gap between the lower rectifying wall and the upper rectifying wall raised to a position away from the lower rectifying wall. It is good to carry between. Further, the lower rectifying wall preferably has a height from the mounting surface of the object to be processed on the mounting table of 10 mm or more and 50 mm or less, and further, a wall on the processing object side in the lower rectifying wall and It is preferable that the side wall surface of the object to be processed in the upper rectifying wall is flush with the contact portion of both rectifying walls.

さらにまた前記載置台は、この載置台の一部を構成し、当該載置台上に載置される被処理体の周縁部に位置するように設けられた絶縁体からなるフォーカスリングを備え、前記下側整流壁は、このフォーカスリングと一体に形成され、当該フォーカスリングの上面から上方へと突出している構成となっていてもよい。   Furthermore, the mounting table comprises a focus ring made of an insulator that constitutes a part of the mounting table and is provided so as to be positioned at the peripheral edge of the object to be processed mounted on the mounting table, The lower rectifying wall may be formed integrally with the focus ring and project upward from the upper surface of the focus ring.

本発明によれば、被処理体を囲む位置から退避可能に構成された上側整流壁が載置台の上面から離れた位置に配置されているので、載置台上に直接載置された整流壁を動かす場合と比較して、付着物の少ない位置にて上側整流壁の退避動作を行うことが可能となり、当該動作に伴う付着物の巻き上げを抑え、被処理体の汚染を低減することができる。   According to the present invention, since the upper rectifying wall configured to be retractable from the position surrounding the object to be processed is disposed at a position away from the upper surface of the mounting table, the rectifying wall mounted directly on the mounting table is Compared with the case of moving, it is possible to perform the retreat operation of the upper rectifying wall at a position where there is little deposit, and it is possible to prevent the deposit from being rolled up and to reduce the contamination of the object to be processed.

以下、図１〜図３を参照しながら本実施の形態に係わるプラズマ処理装置であるエッチング処理装置２の構成について説明する。図１の縦断面図に示したエッチング処理装置２は、被処理体、例えば角型のＦＰＤ基板である基板Ｓの表面に形成されたアルミニウム（Ａｌ）膜に対してエッチング処理を行う装置として構成されている。   The configuration of the etching processing apparatus 2 that is a plasma processing apparatus according to the present embodiment will be described below with reference to FIGS. The etching processing apparatus 2 shown in the longitudinal sectional view of FIG. 1 is configured as an apparatus for performing an etching process on an object to be processed, for example, an aluminum (Al) film formed on the surface of a substrate S which is a square FPD substrate. Has been.

エッチング処理装置２は、その内部において基板Ｓにエッチング処理を施すための真空チャンバである処理容器２０を備えている。本実施の形態に係わるエッチング処理装置２は、例えば少なくとも長辺が２ｍ以上の大型の角型基板を処理することが可能なように、処理容器２０の平面形状についても例えば角型となっており、例えば水平断面の一辺が３．５ｍ、他辺が３．０ｍ程度の大きさに形成されている。処理容器２０は例えばアルミニウムなどの熱伝導性及び導電性の良好な材質により構成されていると共に当該処理容器２０は接地されている。また処理容器２０の一つの側壁部２１には、処理容器２０内に基板Ｓを搬入するための搬入出口２２が形成されており、この搬入出口２２はゲートバルブ２３により開閉自在に構成されている。   The etching processing apparatus 2 includes a processing container 20 that is a vacuum chamber for performing an etching process on the substrate S therein. In the etching processing apparatus 2 according to the present embodiment, the planar shape of the processing vessel 20 is also square, for example, so that a large square substrate having a long side of 2 m or more can be processed, for example. For example, the horizontal cross section is formed to have a size of about 3.5 m on one side and about 3.0 m on the other side. The processing container 20 is made of a material having good thermal conductivity and conductivity, such as aluminum, and the processing container 20 is grounded. Further, a loading / unloading port 22 for loading the substrate S into the processing container 20 is formed in one side wall portion 21 of the processing container 20, and the loading / unloading port 22 is configured to be opened and closed by a gate valve 23. .

処理容器２０の内部には、その上面に基板Ｓを載置するための載置台本体３が配置されている。載置台本体３は、プラズマ発生用の第１の高周波電源部３１１及びプラズマ中のイオン引き込み用の第２の高周波電源部３１２と電気的に接続されており、処理容器２０内にプラズマを発生させ、また当該プラズマ中のイオンを基板Ｓ表面に引き込む役割を果たす。載置台本体３は、絶縁部材３２を介して処理容器２０の底面上に配置されており、これにより下部電極である載置台本体３は処理容器２０から電気的に浮いた状態となっていて、後述の上部電極４との間でプラズマを発生するカソード電極の役割を果たす。   A placement table main body 3 for placing the substrate S is placed on the upper surface of the processing container 20. The mounting table body 3 is electrically connected to the first high frequency power supply unit 311 for generating plasma and the second high frequency power supply unit 312 for drawing ions in the plasma, and generates plasma in the processing vessel 20. Also, it plays the role of drawing ions in the plasma into the surface of the substrate S. The mounting table main body 3 is disposed on the bottom surface of the processing container 20 via the insulating member 32, whereby the mounting table main body 3, which is the lower electrode, is in an electrically floating state from the processing container 20. It plays the role of a cathode electrode for generating plasma with the upper electrode 4 described later.

また載置台本体３の周縁部及び側面は、載置台本体３上方にてプラズマを均一に形成するための、例えばセラミック材料により構成されたフォーカスリング３３により覆われている。フォーカスリング３３は基板Ｓの周縁の領域のプラズマ状態を調整する役割、例えば基板Ｓ上にプラズマを集中させてエッチング速度を向上させる役割を果たす。本実施の形態では、載置台本体３とフォーカスリング３３とが一体となって本発明の載置台を構成しており、基板Ｓが載置される載置領域は、例えば載置台本体３の上面と、その周囲のフォーカスリング３３の上面の一部とを含む領域にまたがって形成されていて、基板Ｓを載置領域に載置すると、フォーカスリング３３は基板Ｓの周縁部下方側に位置することとなる。   Further, the peripheral edge and side surfaces of the mounting table main body 3 are covered with a focus ring 33 made of, for example, a ceramic material for uniformly forming plasma above the mounting table main body 3. The focus ring 33 serves to adjust the plasma state in the peripheral region of the substrate S, for example, to concentrate the plasma on the substrate S to improve the etching rate. In the present embodiment, the mounting table main body 3 and the focus ring 33 are integrated to form the mounting table of the present invention, and the mounting area on which the substrate S is mounted is, for example, the upper surface of the mounting table main body 3. And a part of the upper surface of the surrounding focus ring 33, and when the substrate S is placed on the placement region, the focus ring 33 is positioned below the peripheral edge of the substrate S. It will be.

さらに載置台本体３には、外部に設けられた図示しない搬送装置と当該載置台本体３との間で基板Ｓの受け渡しを行うための昇降ピン３４が設けられている。昇降ピン３４は、載置台本体３の表面から自在に突没させるための昇降機構３５と接続されており、基板Ｓの受け渡しが行われる位置と、既述の載置領域との間で基板Ｓを昇降させることができる。   Further, the mounting table main body 3 is provided with lifting pins 34 for transferring the substrate S between a transfer device (not shown) provided outside and the mounting table main body 3. The elevating pins 34 are connected to an elevating mechanism 35 for freely projecting and retracting from the surface of the mounting table body 3, and the substrate S is positioned between the position where the substrate S is transferred and the mounting area described above. Can be moved up and down.

一方載置台本体３の上方には、この載置台本体３の上面と対向するように、平板状の上部電極４が設けられており、この上部電極４は角板状の上部電極ベース４１に支持されている。これら上部電極４及び上部電極ベース４１は、例えばアルミニウムにより構成され、上部電極ベース４１の上面が処理容器２０の天井部に接続されている。この結果、上部電極４は接地された処理容器２０と電気的に導通した状態となり、カソード電極である載置台本体３に対向してプラズマを発生するアノード電極として機能する。またさらにこれら上部電極ベース４１及び上部電極４により囲まれた空間はエッチングガスのガス拡散空間４２を構成している。以下、これら上部電極４、ガス拡散空間４２を纏めてガスシャワーヘッド４０と呼ぶ。   On the other hand, a flat plate-like upper electrode 4 is provided above the mounting table main body 3 so as to face the upper surface of the mounting table main body 3, and this upper electrode 4 is supported by a square plate-shaped upper electrode base 41. Has been. The upper electrode 4 and the upper electrode base 41 are made of, for example, aluminum, and the upper surface of the upper electrode base 41 is connected to the ceiling portion of the processing container 20. As a result, the upper electrode 4 is electrically connected to the grounded processing vessel 20 and functions as an anode electrode that generates plasma in opposition to the mounting table body 3 that is a cathode electrode. Further, a space surrounded by the upper electrode base 41 and the upper electrode 4 constitutes a gas diffusion space 42 for etching gas. Hereinafter, the upper electrode 4 and the gas diffusion space 42 are collectively referred to as a gas shower head 40.

処理容器２０の天井部には、前記ガス拡散空間４２に接続されるように処理ガス供給路４３が設けられており、この処理ガス供給路４３の他端側は処理ガス供給部４４に接続されている。そして処理ガス供給部４４からガス拡散空間４２にエッチングガスが供給されると、そのエッチングガスは上部電極４に設けられたガス供給孔４５を介して基板Ｓ上方の処理空間に供給され、プラズマ化されて基板Ｓに対するエッチング処理を行うことができる。一方、処理容器２０の底壁にはガス排気部を成す排気路２４の一端側が接続されており、その他端側には例えば図示しない真空ポンプが接続されていて、処理容器２０内のエッチングガスはこの排気路２４から排気されることとなる。   A processing gas supply path 43 is provided on the ceiling of the processing container 20 so as to be connected to the gas diffusion space 42, and the other end side of the processing gas supply path 43 is connected to the processing gas supply section 44. ing. When the etching gas is supplied from the processing gas supply unit 44 to the gas diffusion space 42, the etching gas is supplied to the processing space above the substrate S through the gas supply hole 45 provided in the upper electrode 4 and is converted into plasma. Thus, the etching process on the substrate S can be performed. On the other hand, one end side of an exhaust passage 24 that constitutes a gas exhaust portion is connected to the bottom wall of the processing vessel 20, and a vacuum pump (not shown) is connected to the other end side, and the etching gas in the processing vessel 20 is The air is exhausted from the exhaust path 24.

さらに本実施の形態に係わるエッチング処理装置２は、背景技術にて説明したローディング対策用の整流壁部５を備えており、この整流壁部５は処理容器２０内を搬送される基板Ｓとの干渉を避ける動作を行う際に、プラズマ処理に伴って生成する付着物の巻き上げを抑え、基板Ｓの汚染を低減することが可能な構成となっている。以下、当該整流壁部５の詳細について説明する。   Furthermore, the etching processing apparatus 2 according to the present embodiment includes a rectifying wall portion 5 for countermeasure against loading described in the background art, and this rectifying wall portion 5 is connected to the substrate S transported in the processing container 20. When performing an operation for avoiding interference, it is possible to suppress the contamination of the substrate S from being curled up by deposits generated with the plasma treatment. Hereinafter, the detail of the said rectifying wall part 5 is demonstrated.

整流壁部５は、例えば図１〜図３に示すように、載置台本体３上に載置された基板Ｓを囲むように配置される角型の枠組み状の部材を、上側整流壁５１と下側整流壁５２とに上下に分割した構造となっている。下側整流壁５２は、基板Ｓの各辺に沿って伸びる細長い板状の部材を例えば４枚連結して、当該基板を囲む角型の枠組み状に形成されると共に、載置台上、例えば載置台の一部を構成するフォーカスリング３３上に配置されている。下側整流壁５２は例えばアルミナ焼結体などの誘電体からなり、この下側整流壁５２は基板Ｓの載置面を構成するフォーカスリング３３の上面からの高さが例えば１０ｍｍ以上、５０ｍｍ以下の範囲の例えば３０ｍｍ、厚さは例えば１０ｍｍとなっている。   For example, as shown in FIGS. 1 to 3, the rectifying wall portion 5 is a rectangular frame-like member arranged so as to surround the substrate S placed on the mounting table body 3, and the upper rectifying wall 51. The lower rectifying wall 52 is vertically divided. The lower rectifying wall 52 is formed, for example, by connecting four elongated plate-like members extending along each side of the substrate S to form a square frame surrounding the substrate, and on the mounting table, for example, It is arranged on a focus ring 33 that constitutes a part of the mounting table. The lower rectifying wall 52 is made of a dielectric such as an alumina sintered body, and the lower rectifying wall 52 has a height from the upper surface of the focus ring 33 constituting the mounting surface of the substrate S, for example, 10 mm or more and 50 mm or less. For example, the thickness is 30 mm, and the thickness is 10 mm, for example.

一方、上側整流壁５１は、例えば既述の下側整流壁５２とほぼ同サイズの平面形状を備えた角型の枠組み状の部材であり、上側整流壁５１についても下側整流壁５２と同様に例えばアルミナ焼結体などの誘電体から構成されている。そして、上側整流壁５１の高さは例えば１０ｍｍ以上、１００ｍｍ以下の範囲の例えば７０ｍｍ、その厚さは例えば下側整流壁５２と同じ１０ｍｍとなっており、上側整流壁５１が下側整流壁５２上に載置されることにより、載置台本体３上の基板Ｓの周囲には、上側整流壁５１と下側整流壁５２とが一体となった、全体の高さが２０ｍｍ〜１５０ｍｍの範囲の例えば１００ｍｍの整流壁（整流壁部５）が形成される。   On the other hand, the upper rectifying wall 51 is, for example, a square frame-like member having a planar shape substantially the same size as the lower rectifying wall 52 described above, and the upper rectifying wall 51 is the same as the lower rectifying wall 52. For example, it is comprised from dielectric materials, such as an alumina sintered compact. The height of the upper rectifying wall 51 is, for example, 70 mm in the range of 10 mm or more and 100 mm or less, and the thickness thereof is, for example, 10 mm, which is the same as the lower rectifying wall 52. As a result of being placed on, the upper rectifying wall 51 and the lower rectifying wall 52 are integrated around the substrate S on the mounting table main body 3, and the overall height is in the range of 20 mm to 150 mm. For example, a 100 mm straightening wall (rectifying wall portion 5) is formed.

このように下側整流壁５２上に上側整流壁５１を載置することにより、例えば図５（ａ）に示すように載置台の表面（本例においてはフォーカスリング３３の表面）よりも高い位置にこれら上側整流壁５１と下側整流壁５２との接触部が位置することとなる。また本実施の形態に係る上側整流壁５１及び下側整流壁５２は、基板Ｓに対向する内壁面側の各辺の長さが等しくなっており、例えば上側整流壁５１と下側整流壁５２との接触部においてこれら両整流壁５１、２の内壁面がその接触部を跨いで面一となるように上下に積み上げられている。   By placing the upper rectifying wall 51 on the lower rectifying wall 52 in this way, for example, as shown in FIG. 5A, a position higher than the surface of the mounting table (the surface of the focus ring 33 in this example). Thus, the contact portion between the upper rectifying wall 51 and the lower rectifying wall 52 is located. Further, in the upper rectifying wall 51 and the lower rectifying wall 52 according to the present embodiment, the lengths of the respective sides on the inner wall surface facing the substrate S are equal, for example, the upper rectifying wall 51 and the lower rectifying wall 52. The inner wall surfaces of both the rectifying walls 51 and 2 are stacked up and down so as to be flush with each other across the contact portions.

かかる構成を備えた整流壁部５の上側整流壁５１は、基板Ｓ搬送時の搬送経路と干渉しないように上下に昇降させて搬送経路から退避させることが可能な構成となっている。即ち上側整流壁５１は、例えば角型の枠組み形状の四隅の下縁部に、例えば搬入出口２２から見て左右両側に水平に突出する例えばアルミナ焼結体などセラミック製の板状の支持部材５３が設けられており、これらの支持部材５３の先端部には、当該支持部材５３を介して上側整流壁５１を昇降させるための支持棒５４が接続されている。各支持棒５４は処理容器２０の底面を貫通しており、昇降板６２を介して処理容器２０の外部に設けられた昇降機６１と接続されている。そしてこれら昇降機６１により各支持棒５４を同期させながら昇降させることにより、下側整流壁５２の上面（載置位置）とその上方の位置との間で上側整流壁５１を昇降させることができる。ここで各支持棒５４が処理容器２０を貫通している部位には、例えば当該処理容器２０と昇降板６２とを接続し、支持棒５４を覆うベローズ６３が設けられており処理容器２０内の真空度を維持できるようになっている。本例において支持部材５３、支持棒５４及び昇降機６１は上側整流壁５１の昇降機構を構成している。   The upper rectifying wall 51 of the rectifying wall portion 5 having such a configuration is configured to be lifted up and down and retracted from the transport path so as not to interfere with the transport path when the substrate S is transported. That is, the upper rectifying wall 51 is formed of, for example, a ceramic plate-like support member 53 such as an alumina sintered body that protrudes horizontally on the left and right sides when viewed from the loading / unloading port 22, for example, at the lower edges of the four corners of a square frame shape. The support rods 54 for raising and lowering the upper rectifying wall 51 are connected to the tip portions of the support members 53 via the support members 53. Each support bar 54 penetrates the bottom surface of the processing container 20 and is connected to an elevator 61 provided outside the processing container 20 via an elevator plate 62. The upper rectifying wall 51 can be moved up and down between the upper surface (mounting position) of the lower rectifying wall 52 and the position above the upper rectifying wall 52 by raising and lowering the support bars 54 in synchronization with the elevator 61. Here, for example, a bellows 63 that connects the processing container 20 and the lifting plate 62 and covers the support bar 54 is provided at a portion where each support bar 54 penetrates the processing container 20. The degree of vacuum can be maintained. In this example, the support member 53, the support bar 54, and the elevator 61 constitute an elevating mechanism for the upper rectifying wall 51.

搬入出口２２から搬入出される基板Ｓは、上側整流壁５１を上昇させて形成される下側整流壁５２との間の隙間を介して搬送されることになるが、上側整流壁５１を昇降させる支持棒５４が支持部材５３の介在により搬入出口２２から見て上側整流壁５１から左右に離れて設けられていることにより、これらの支持棒５４と干渉せずに基板Ｓを搬送することができる。なお図１においては、便宜上搬入出口２２に対向する面の上側整流壁５１に支持部材５３や支持棒５４などを設けてあるように図示してあるが、実際には図２、図３に示すように搬入出口２２とは対向していない面の上側整流壁５１にこれらを設けた構成となっている。   The substrate S carried in / out from the carry-in / out port 22 is transported through a gap between the upper rectifying wall 51 formed by raising the upper rectifying wall 51, but the upper rectifying wall 51 is moved up and down. Since the support bar 54 is provided left and right away from the upper rectifying wall 51 as viewed from the loading / unloading port 22 through the support member 53, the substrate S can be transported without interfering with these support bars 54. . In FIG. 1, for convenience, the upper rectifying wall 51 on the surface facing the loading / unloading port 22 is illustrated as being provided with a support member 53, a support rod 54, and the like. Thus, it has the structure which provided these in the upper side rectification wall 51 of the surface which is not facing the loading / unloading port 22.

エッチング処理装置２の全体の説明に戻ると、図１に示すように、エッチング処理装置２は制御部７と接続されている。制御部７は例えば図示しないＣＰＵと記憶部とを備えたコンピュータからなり、記憶部には当該エッチング処理装置２の動作、つまり、処理容器２０内に基板Ｓを搬入し、載置台本体３上に載置された基板Ｓにエッチング処理を施してから搬出するまでの動作に係わる制御などについてのステップ（命令）群が組まれたプログラムが記憶されている。このプログラムは、例えばハードディスク、コンパクトディスク、マグネットオプティカルディスク、メモリーカードなどの記憶媒体に格納され、そこからコンピュータにインストールされる。   Returning to the overall description of the etching processing apparatus 2, the etching processing apparatus 2 is connected to a control unit 7 as shown in FIG. 1. The control unit 7 includes, for example, a computer having a CPU and a storage unit (not shown). The operation of the etching processing apparatus 2, that is, the substrate S is carried into the processing container 20 and is placed on the mounting table main body 3. A program is stored in which a group of steps (commands) for control and the like related to operations from the time when the placed substrate S is subjected to an etching process to the time of unloading is stored. This program is stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card, and installed in the computer therefrom.

以下、本実施の形態に係わるエッチング処理装置２の動作について説明する。初めに不図示の操作部を介し、ユーザが制御部７に対して目的のエッチング処理のプロセスレシピを選択すると、制御部７ではこのプロセスレシピに基づいてエッチング処理装置２の各部に制御信号を出力し、こうして基板に対して所定のエッチング処理が行われる。なお、以下の説明に用いる図４（ａ）、図４（ｂ）では、図示の便宜上、支持部材５３や支持棒５４、昇降ピン３４などの記載を適宜省略してある。   Hereinafter, the operation of the etching processing apparatus 2 according to the present embodiment will be described. First, when a user selects a desired process recipe for etching processing with respect to the control unit 7 via an operation unit (not shown), the control unit 7 outputs a control signal to each unit of the etching processing apparatus 2 based on this process recipe. Thus, a predetermined etching process is performed on the substrate. In FIGS. 4A and 4B used for the following description, the description of the support member 53, the support bar 54, the elevating pin 34, and the like is omitted as appropriate for the convenience of illustration.

先ず図４（ａ）に示すように、処理容器２０内への基板Ｓの搬入に先立って各昇降機６１を作動させて支持棒５４を上昇させ、上側整流壁５１の下端が基板Ｓの搬送経路と干渉しない高さ位置まで上側整流壁５１を持ち上げた状態で、当該上側整流壁５１を下側整流壁５２から上方側に離れた位置にて待機させる。次いでゲートバルブ２３を開き、図示しない外部の搬送手段により、表面にＡｌ膜が形成された基板Ｓを処理容器２０内に搬入し、載置台本体３の載置領域の上方側の受け渡し位置まで搬送する。   First, as shown in FIG. 4A, prior to loading the substrate S into the processing container 20, each elevator 61 is operated to raise the support bar 54, and the lower end of the upper rectifying wall 51 is the transfer path of the substrate S. In a state where the upper rectifying wall 51 is lifted up to a height position that does not interfere with the upper rectifying wall 51, the upper rectifying wall 51 is put on standby at a position away from the lower rectifying wall 52. Next, the gate valve 23 is opened, and the substrate S on which the Al film is formed is carried into the processing container 20 by an external conveyance means (not shown) and conveyed to a transfer position above the placement area of the placement table body 3. To do.

基板Ｓが受け渡し位置に到達したら、昇降ピン３４を上昇させて搬送手段から当該昇降ピン３４に基板Ｓを受け渡し、基板Ｓを受け渡した搬送手段は処理容器２０外に退出し、昇降ピン３４を下降させて基板Ｓを載置領域に載置する。その後ゲートバルブ２３を上昇させて搬入出口２２を閉じる一方、図４（ｂ）に示すように各昇降機６１を作動させて上側整流壁５１を載置位置まで降下させ、下側整流壁５２上に当該上側整流壁５１を載置した状態で停止する。   When the substrate S reaches the transfer position, the lift pins 34 are raised to transfer the substrate S from the transfer means to the lift pins 34, and the transfer means that has transferred the substrates S moves out of the processing container 20 and lowers the lift pins 34. Thus, the substrate S is placed on the placement region. Thereafter, the gate valve 23 is raised and the loading / unloading port 22 is closed. On the other hand, as shown in FIG. 4B, each elevator 61 is operated to lower the upper rectifying wall 51 to the mounting position, and on the lower rectifying wall 52. It stops in the state where the upper flow straightening wall 51 is placed.

基板のＳ搬入を終えたら、真空ポンプを稼動させて処理容器２０の内部空間を所定の圧力に調整し、既述の処理ガス供給部４４からエッチング処理用のエッチングガス、例えば塩素ガスを基板Ｓに向けて吐出する。そして第１、第２の高周波電源部３１１、３１２から載置台本体３に高周波電力を供給して基板Ｓの上方側の空間にプラズマを形成し、下記（１）式に示す主要な反応に基づいて基板Ｓに対するエッチング処理を実行する。
３Ｃｌ＊＋Ａｌ→ＡｌＣｌ３ …（１） After completing the S loading of the substrate, the vacuum pump is operated to adjust the internal space of the processing container 20 to a predetermined pressure, and an etching gas for etching processing, for example, chlorine gas is supplied from the processing gas supply unit 44 described above to the substrate S. Discharge toward Then, high-frequency power is supplied from the first and second high-frequency power supply units 311 and 312 to the mounting table body 3 to form plasma in the space above the substrate S, and based on the main reaction shown in the following formula (1). Then, the etching process for the substrate S is performed.
3Cl * + Al → AlCl 3 (1)

ガスシャワーヘッド４０から供給されたエッチングガスは、処理容器２０内を降下して基板Ｓに到達し、その表面にてエッチング処理が進行する。そして、エッチングガスは基板Ｓの表面を伝いながら周縁部側へと流れ、基板Ｓを取り囲むように載置された整流壁部５に到達したところで流れが遮られる。整流壁部５にて流れが遮られることにより、当該整流壁部５の内側の領域、即ち基板Ｓの周縁部にはエッチングガスの流速が遅くなるガス溜まり領域が形成されて、基板Ｓ周縁部のエッチング速度を遅くすることができる。この結果、基板Ｓの中央側とのエッチング速度の差が小さくなって、ローディング効果が抑制されることとなる。   The etching gas supplied from the gas shower head 40 descends in the processing container 20 and reaches the substrate S, and the etching process proceeds on the surface thereof. Then, the etching gas flows along the surface of the substrate S toward the peripheral edge, and the flow is blocked when the etching gas reaches the rectifying wall portion 5 placed so as to surround the substrate S. When the flow is blocked by the rectifying wall portion 5, a gas pool region in which the flow rate of the etching gas is reduced is formed in the inner region of the rectifying wall portion 5, that is, the peripheral portion of the substrate S. The etching rate can be reduced. As a result, the difference in etching rate with the center side of the substrate S is reduced, and the loading effect is suppressed.

整流壁部５の内側にできたガス溜まりは、やがて上下に積み上げられた上側整流壁５１及び下側整流壁５２を越えて整流壁部５の外側へ溢流し、フォーカスリング３３と処理容器２０との間の空間を通って排気路２４に流れ込み、処理容器２０の外へと排気される。このようにしてプロセスレシピに基づいて所定時間エッチング処理を行ったら、エッチングガスや高周波電力の供給を停止し、処理容器２０内の圧力を元の状態に戻した後、搬入時とは逆の順序で基板Ｓを載置台本体３から外部の搬送手段に受け渡してエッチング処理装置２から搬出し、一連のエッチング処理を終了する。   The gas pool formed inside the rectifying wall portion 5 overflows to the outside of the rectifying wall portion 5 over the upper rectifying wall 51 and the lower rectifying wall 52 that are stacked up and down, and the focus ring 33 and the processing vessel 20 Flows into the exhaust path 24 through the space between the two and is exhausted out of the processing vessel 20. After performing the etching process for a predetermined time based on the process recipe in this manner, the supply of the etching gas and the high frequency power is stopped, the pressure in the processing container 20 is returned to the original state, and the order reverse to that at the time of carrying in is performed. Then, the substrate S is transferred from the mounting table main body 3 to an external transfer means and carried out of the etching processing apparatus 2 to complete a series of etching processes.

以上に説明した本実施の形態に係るエッチング処理装置２の一連の動作において、基板Ｓは下側整流壁５２と、この下側整流壁５２から上方側に離れた位置まで上昇させた上側整流壁５１との間に形成される隙間を介して搬入出されるところ、これらの整流壁５１、５２の接触部は、例えば図５（ａ）に示すように背景技術にて説明した窪み部５００よりも下側整流壁５２の高さ分、例えば１０ｍｍ〜５０ｍｍの範囲の例えば３０ｍｍだけ高い位置にある。背景技術にて説明したように窪み部５００は付着物Ｄが堆積しやすい。   In the series of operations of the etching processing apparatus 2 according to the present embodiment described above, the substrate S is raised to the lower rectifying wall 52 and to the position away from the lower rectifying wall 52 to the upper side. When being carried in / out through a gap formed between the rectifying walls 51 and 51, the contact portions of the rectifying walls 51 and 52 are, for example, as shown in FIG. The height of the lower rectifying wall 52 is, for example, 30 mm higher in the range of 10 mm to 50 mm. As described in the background art, the deposit D is likely to be deposited in the recess portion 500.

これに対して上述の上側整流壁５１と下側整流壁５２との接触部が存在する位置は、窪み部５００よりも載置台本体３から離れているため窪み部５００と比較して付着物Ｄが堆積しにくく、例えば図５（ｂ）に示すように処理容器２０内に基板Ｓを搬入出する際に上側整流壁５１の昇降動作を行っても当該接触部からは付着物Ｄの巻き上げが殆どなく、基板Ｓの汚染を引き起こしにくい構成となっている。   On the other hand, the position where the contact portion between the upper rectifying wall 51 and the lower rectifying wall 52 exists is farther from the mounting table body 3 than the dent portion 500, so that the deposit D is present in comparison with the dent portion 500. For example, as shown in FIG. 5B, even if the upper rectifying wall 51 is moved up and down when the substrate S is carried in and out of the processing container 20, the adhering matter D is wound up from the contact portion. There is hardly any contamination of the substrate S.

さらに本実施の形態では、図５（ｂ）に示すように窪み部５００を構成する一方側の部材である下側整流壁５２が載置台（フォーカスリング３３）上に置かれたまま昇降しないため、付着物Ｄがこの窪み部５００内に堆積していたとしても、基板Ｓの搬入出動作に付随してこれらの付着物Ｄが巻き上げられるといったおそれが少なく、この点においても基板Ｓの汚染を引き起こしにくい。   Further, in the present embodiment, as shown in FIG. 5B, the lower rectifying wall 52, which is a member on one side constituting the hollow portion 500, does not move up and down while being placed on the mounting table (focus ring 33). Even if the deposits D are deposited in the hollow portion 500, there is little possibility that these deposits D are rolled up in association with the loading / unloading operation of the substrate S. In this respect as well, contamination of the substrate S is prevented. Hard to cause.

ここで下側整流壁５２の高さが１０ｍｍよりも低いと、上側整流壁５１と下側整流壁５２との接触部の位置が窪み部５００に近くなって当該壁面に付着物Ｄが付着し、また例えば窪み部５００にて形成された付着物Ｄが接触部の位置まで堆積して両整流壁５１、５２の接触部に到達してしまい基板Ｓの汚染を引き起こすおそれが高くなる。一方、下側整流壁５２の高さが５０ｍｍよりも高いと、下側整流壁５２の上端が基板Ｓの搬送経路を遮り、基板Ｓ搬入出時の障害となる。   Here, if the height of the lower rectifying wall 52 is lower than 10 mm, the position of the contact portion between the upper rectifying wall 51 and the lower rectifying wall 52 is close to the recessed portion 500 and the deposit D adheres to the wall surface. In addition, for example, the deposit D formed in the depression 500 accumulates up to the position of the contact portion and reaches the contact portion of both the rectifying walls 51 and 52, thereby increasing the possibility of causing contamination of the substrate S. On the other hand, if the height of the lower rectifying wall 52 is higher than 50 mm, the upper end of the lower rectifying wall 52 blocks the transport path of the substrate S, which becomes an obstacle when the substrate S is carried in and out.

本実施の形態によれば以下の効果がある。昇降可能に構成された上側整流壁５１が下側整流壁５２を介して載置台（例えば本例ではフォーカスリング３３）の上面から離れた位置に配置されているので、例えば載置台上に直接載置された整流壁を昇降させる場合（例えば本例における下側整流壁５２を昇降させる場合に相当する）と比較して、付着物Ｄの少ない位置にて上側清流壁部５１を昇降させることが可能となり、昇降動作に伴う付着物の巻き上げを抑え、被処理体の汚染を低減することができる。   The present embodiment has the following effects. Since the upper rectifying wall 51 configured to be movable up and down is disposed at a position away from the upper surface of the mounting table (for example, the focus ring 33 in this example) via the lower rectifying wall 52, for example, it is directly mounted on the mounting table. As compared with the case where the placed rectifying wall is moved up and down (e.g., corresponding to the case where the lower rectifying wall 52 in this example is moved up and down), the upper clear flow wall portion 51 can be moved up and down at a position where there is little deposit D. Therefore, it is possible to suppress the winding of the deposit accompanying the lifting operation and reduce the contamination of the object to be processed.

ここで上側整流壁５１と下側整流壁５２の接触面は水平に限定されるものではなく、斜めでも、階段状になっていてもよい。さらに上側整流壁５１及び下側整流壁５６の厚みも同じ厚さに形成される場合に限定されるものではなく、例えば図６（ａ）、図６（ｂ）に示すように、例えば下側整流壁５２を載置台（本例ではフォーカスリング３３）の周縁部とほぼ同じ位置まで伸びだす扁平な部材にて構成し、この扁平な下側整流壁５２の上面に上側整流壁５１が載置されるようにしてもよい。このように下側整流壁５２を扁平な部材として構成する場合などには、例えば図７に示すように下側整流壁５２をフォーカスリング３３と一体に構成し、例えば下側整流壁５２がフォーカスリング３３の上面から上方へと突出させて、基板Ｓを囲むようにしてもよい。   Here, the contact surface of the upper rectifying wall 51 and the lower rectifying wall 52 is not limited to be horizontal, and may be oblique or stepped. Further, the thickness of the upper rectifying wall 51 and the lower rectifying wall 56 is not limited to the case where they are formed to the same thickness. For example, as shown in FIGS. The rectifying wall 52 is formed of a flat member that extends to substantially the same position as the peripheral portion of the mounting table (in this example, the focus ring 33), and the upper rectifying wall 51 is mounted on the upper surface of the flat lower rectifying wall 52. You may be made to do. For example, when the lower rectifying wall 52 is configured as a flat member, the lower rectifying wall 52 is configured integrally with the focus ring 33 as shown in FIG. The substrate S may be surrounded by protruding upward from the upper surface of the ring 33.

このほか、基板Ｓに対向する上側整流壁５１と下側整流壁５２との内壁面は面一となっている場合に限定されず、また例えば図８に示すように下側整流壁５２の上端の外周部を切り欠いて、この切り欠いた部分に上側整流壁５１の下端を嵌合させ、接合部からガスを洩れにくくした構成としてもよい。   In addition, the inner wall surfaces of the upper rectifying wall 51 and the lower rectifying wall 52 facing the substrate S are not limited to being flush with each other. For example, as shown in FIG. It is good also as a structure which made the lower end of the upper side rectification wall 51 fit in this notched part, and to make it difficult to leak gas from a junction part.

これらに加え、基板Ｓの搬送経路との干渉を避けるため上側整流壁５１を退避させる手法は、昇降機構を用いて上側整流壁５１を昇降させる場合に限定されない。例えば搬入出口２２に対向する位置に設けられた面の上側整流壁５１を当該搬入出口２２に向けて傾倒可能に構成し、基板Ｓの搬入出時には当該面の上側整流壁５１を倒すことにより退避させてもよい。またこれとは反対に、搬入出口２２に対向する位置に設けられた面の上側整流壁５１の上端を軸支して、基板Ｓの搬入出時には当該面の上側整流壁５１を撥ね上げることにより退避させてもよい。これらの場合には、例えば搬入出側口２２側の整流壁部５のみを上側整流壁５１と下側整流壁５２とに分割し、残る３面の整流壁部５は上下に分割しない構成としてもよい。   In addition to these, the method of retracting the upper rectifying wall 51 in order to avoid interference with the transport path of the substrate S is not limited to the case where the upper rectifying wall 51 is moved up and down using an elevating mechanism. For example, the upper rectifying wall 51 on the surface provided at a position facing the loading / unloading port 22 is configured to be tiltable toward the loading / unloading port 22, and the upper rectifying wall 51 on the surface is retracted when the substrate S is loaded / unloaded. You may let them. On the contrary, the upper rectifying wall 51 on the surface provided at a position facing the loading / unloading port 22 is pivotally supported, and the upper rectifying wall 51 on the surface is repelled when the substrate S is loaded / unloaded. It may be evacuated. In these cases, for example, only the rectifying wall portion 5 on the carry-in / out side port 22 side is divided into an upper rectifying wall 51 and a lower rectifying wall 52, and the remaining three rectifying wall portions 5 are not divided vertically. Also good.

なおエッチング処理装置２は、載置台本体３をカソード電極とする場合に限定されず、上部電極４を接地された処理容器２０から電気的に浮いた状態としてプラズマ発生用の第１の高周波電源部３１１に接続する一方、載置台本体３を接地側とすることにより、上部電極４をカソード電極、載置台本体３をアノード電極としてもよい。また、載置台本体３にフォーカスリング３３が設けられていなくてもよい。   The etching processing apparatus 2 is not limited to the case where the mounting table body 3 is used as a cathode electrode, and the first high-frequency power supply unit for generating plasma with the upper electrode 4 electrically floating from the grounded processing container 20. The upper electrode 4 may be a cathode electrode and the mounting table body 3 may be an anode electrode by connecting the mounting table body 311 to the ground side. Further, the focus ring 33 may not be provided on the mounting table body 3.

さらにまた本発明の処理装置はアルミニウム膜のエッチング処理のみならず、アルミニウム合金、チタン、チタン合金などの金属膜や絶縁膜、半導体膜のエッチングやこれらの積層膜にも適用される。またエッチング処理以外の例えばアッシングやＣＶＤ（Chemical Vapor Deposition）など、他の処理ガスを用いて被処理体に対して処理を行う処理に適用することができる。さらにまた被処理体としては角型の基板には限られず、ＦＰＤ基板の他、例えば円形の半導体ウエハなどであってもよい。   Furthermore, the processing apparatus of the present invention is applicable not only to etching treatment of aluminum films, but also to etching of metal films such as aluminum alloys, titanium, titanium alloys, insulating films, semiconductor films, and laminated films thereof. Further, the present invention can be applied to a process for processing an object to be processed using another process gas such as ashing or CVD (Chemical Vapor Deposition) other than the etching process. Furthermore, the object to be processed is not limited to a square substrate, and may be, for example, a circular semiconductor wafer in addition to an FPD substrate.

実施の形態に係わるエッチング処理装置の構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the etching processing apparatus concerning embodiment. 前記エッチンング処理装置の処理容器内部の構造を示す平面図である。It is a top view which shows the structure inside the processing container of the said etching processing apparatus. 前記処理容器内部の構造を示す斜視図である。It is a perspective view which shows the structure inside the said process container. 前記エッチング処理装置の作用を示す縦断側面図である。It is a vertical side view which shows the effect | action of the said etching processing apparatus. 前記エッチング処理装置に設けられている整流壁部の作用を示す拡大縦断面図である。It is an enlarged longitudinal cross-sectional view which shows the effect | action of the rectification | straightening wall part provided in the said etching processing apparatus. 前記整流壁部の他の例を示す拡大縦断面図である。It is an expanded longitudinal cross-sectional view which shows the other example of the said rectifying wall part. 前記整流壁部のさらに他の例を示す拡大縦断面図である。It is an expanded longitudinal cross-sectional view which shows the other example of the said baffle wall part. 前記この他の例に係る整流壁部の変形例を示す拡大縦断面図である。It is an expanded longitudinal cross-sectional view which shows the modification of the rectification | straightening wall part which concerns on the said other example. 従来のエッチング処理装置の構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the conventional etching processing apparatus. 前記従来のエッチング処理装置で処理される基板の平面図である。It is a top view of the board | substrate processed with the said conventional etching processing apparatus. 前記従来のエッチング処理装置の処理容器内部の構造を示す斜視図である。It is a perspective view which shows the structure inside the processing container of the said conventional etching processing apparatus. 前記従来のエッチング処理装置に設けられている整流壁部の作用を示す拡大縦断面図である。It is an expanded longitudinal cross-sectional view which shows the effect | action of the rectification | straightening wall part provided in the said conventional etching processing apparatus.

符号の説明Explanation of symbols

Ｓ ＦＰＤ基板（基板）
２ エッチング処理装置
３ 載置台
４ 上部電極
５ 整流壁
７ 制御部
２０ 処理容器
３３ フォーカスリング
４０ ガスシャワーヘッド
５１ 上側整流壁
５２ 下側整流壁
５３ 支持部材
５４ 支持棒
６１ 昇降機
５００ 窪み部 S FPD substrate (substrate)
2 Etching apparatus 3 Mounting table 4 Upper electrode 5 Rectifier wall 7 Control unit 20 Processing vessel 33 Focus ring 40 Gas shower head 51 Upper rectifier wall 52 Lower rectifier wall 53 Support member 54 Support rod 61 Elevator 500 Elevator

Claims (6)

処理容器内に互いに対向して設けられたアノード電極及びカソード電極間に高周波電力を印加して処理ガスをプラズマ化し、被処理体に対してプラズマ処理を行うプラズマ処理装置において、
前記処理容器の内部に設けられ、アノード電極及びカソード電極の一方をなすと共に、被処理体を載置するための載置台と、
この載置台上に載置された被処理体の周縁に沿って、この被処理体を囲むように当該載置台上に設けられた下側整流壁と、
この下側整流壁上に載置され、当該下側整流壁と共に前記載置台上の被処理体を囲む上側整流壁と、を備え、
この上側整流壁は、下側整流壁上にて被処理体を囲む位置から退避可能に構成されていることを特徴とするプラズマ処理装置。 In a plasma processing apparatus that applies high frequency power between an anode electrode and a cathode electrode that are provided to face each other in a processing container to convert a processing gas into plasma and perform plasma processing on an object to be processed,
A mounting table provided inside the processing container, forming one of an anode electrode and a cathode electrode, and for mounting an object to be processed;
A lower rectifying wall provided on the mounting table so as to surround the processing object along the periphery of the processing object mounted on the mounting table,
An upper rectifying wall placed on the lower rectifying wall and surrounding the object to be processed on the mounting table together with the lower rectifying wall;
The upper rectifying wall is configured to be retractable from a position surrounding the object to be processed on the lower rectifying wall. 前記上側整流壁を昇降させる昇降機構を備え、当該上側整流壁はこの昇降機構によって前記下側整流壁から上方側に離れた位置へと上昇することにより、被処理体を囲む位置から退避することを特徴とする請求項１に記載のプラズマ処理装置。   An elevating mechanism for elevating and lowering the upper rectifying wall is provided, and the upper rectifying wall is retreated from a position surrounding the object by being lifted to a position away from the lower rectifying wall by the elevating mechanism. The plasma processing apparatus according to claim 1. 被処理体は、前記下側整流壁と、この下側整流壁から上方側に離れた位置まで上昇させた上側整流壁との間の隙間を介して、前記処理容器とその外部との間を搬送されることを特徴とする請求項２に記載のプラズマ処理装置。   The object to be processed is between the processing container and the outside through a gap between the lower rectifying wall and the upper rectifying wall raised to a position away from the lower rectifying wall. The plasma processing apparatus according to claim 2, wherein the plasma processing apparatus is conveyed. 前記下側整流壁は、載置台上における被処理体の載置面からの高さが１０ｍｍ以上、５０ｍｍ以下であることを特徴とする請求項１ないし３のいずれか一つに記載のプラズマ処理装置。   The plasma processing according to any one of claims 1 to 3, wherein the lower rectifying wall has a height from a mounting surface of an object to be processed on the mounting table of 10 mm or more and 50 mm or less. apparatus. 前記下側整流壁における被処理体側の壁面と、上側整流壁における被処理体側壁面とは、両整流壁の接触部を跨いで面一になっていることを特徴とする請求項１ないし４のいずれか一つに記載のプラズマ処理装置。   The wall surface of the lower rectifying wall on the workpiece side and the processed object side wall surface of the upper rectifying wall are flush with each other across the contact portions of the rectifying walls. The plasma processing apparatus according to any one of the above. 前記載置台は、この載置台の一部を構成し、当該載置台上に載置される被処理体の周縁部に位置するように設けられた絶縁体からなるフォーカスリングを備え、前記下側整流壁は、このフォーカスリングと一体に形成され、当該フォーカスリングの上面から上方へと突出していることを特徴とする請求項１ないし５のいずれか一つに記載のプラズマ処理装置。   The mounting table includes a focus ring made of an insulator that constitutes a part of the mounting table and is located on a peripheral edge of a target object to be mounted on the mounting table. The plasma processing apparatus according to claim 1, wherein the rectifying wall is formed integrally with the focus ring and protrudes upward from the upper surface of the focus ring.
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