JP2010135126A - Led lighting device - Google Patents

Led lighting device Download PDF

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JP2010135126A
JP2010135126A JP2008308274A JP2008308274A JP2010135126A JP 2010135126 A JP2010135126 A JP 2010135126A JP 2008308274 A JP2008308274 A JP 2008308274A JP 2008308274 A JP2008308274 A JP 2008308274A JP 2010135126 A JP2010135126 A JP 2010135126A
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lighting device
substrate
led
device housing
mounting substrate
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JP4812828B2 (en
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Yuichiro Ito
雄一郎 伊藤
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting device that more efficiently dissipates heat, generated from an LED element, by a simple configuration. <P>SOLUTION: The LED lighting device includes a substrate 2 mounted with a plurality of LED elements 1 and a lighting-device casing 3 storing the substrate 2. The substrate 2 has a shape that at least one side face 2c is continuously inclined. The lighting-device casing 3 has a shape that the inner side face 2d corresponding to the one side face of the substrate is inclined at the same inclination angle as that of the one side face. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、照明用光源としてＬＥＤ素子を用いた照明装置に関し、特にＬＥＤ素子から発生した熱の放熱技術に関する。   The present invention relates to an illuminating device using an LED element as an illumination light source, and more particularly to a technique for radiating heat generated from the LED element.

近年、白熱電球や蛍光灯に代わる次世代の照明用光源として、ＬＥＤ素子を用いたＬＥＤ照明器具が多数提案されている。このようなＬＥＤ照明器具は長寿命、省エネルギーという利点があり、注目されている。ＬＥＤ照明においては、従来からも、より高輝度なものが望まれており、そのためには基板に実装するＬＥＤ素子の数を多くしたり、ＬＥＤ素子に流す電流を増加させる必要がある。   In recent years, many LED lighting fixtures using LED elements have been proposed as next-generation lighting sources that replace incandescent bulbs and fluorescent lamps. Such LED lighting fixtures have the advantages of long life and energy saving, and are attracting attention. Conventionally, LED lighting with higher brightness has been desired. To that end, it is necessary to increase the number of LED elements mounted on a substrate or to increase the current flowing through the LED elements.

ＬＥＤ素子に大きな電流を流す場合、ＬＥＤ素子からの発熱によってＬＥＤ素子の封止材料の劣化、ＬＥＤ素子の電極と基板の配線パターンとを接続する半田材料の劣化等が発生する恐れがある。このためＬＥＤ素子の放熱を適切にしなければならない。例えば、ＬＥＤ素子の温度を十分に低下させるにはＬＥＤ素子に大型放熱フィンを設ければよいが、照明器具の大型化・高コスト化につながるため実用的ではない。   When a large current is passed through the LED element, heat generation from the LED element may cause deterioration of the sealing material of the LED element, deterioration of a solder material that connects the electrode of the LED element and the wiring pattern of the substrate, or the like. For this reason, the heat radiation of the LED element must be made appropriate. For example, in order to sufficiently lower the temperature of the LED element, a large heat dissipation fin may be provided in the LED element, but this is not practical because it leads to an increase in the size and cost of the lighting fixture.

そこで第１の従来例として、回路基板と、回路基板の片面に実装された複数のＬＥＤ素子を備え、ＬＥＤ素子が実装されていない基板裏面をヒートシンクなどの熱伝導部材に接触させることにより照明装置の筐体に熱を逃がすようにしたものが提案されている（例えば、特許文献１参照）。   Accordingly, as a first conventional example, a lighting device is provided by including a circuit board and a plurality of LED elements mounted on one side of the circuit board, and contacting the back surface of the board on which the LED elements are not mounted with a heat conducting member such as a heat sink. There has been proposed one in which heat is released to the housing (see, for example, Patent Document 1).

これによりＬＥＤ素子の発熱を熱伝導部材を介して照明装置筐体に逃がし、放熱を行っている。しかしながらこのような方式では、熱伝導部材と照明装置筐体との接触面積が小さく、ＬＥＤ素子の放熱は十分とはいえなかった。   As a result, the heat generated by the LED element is released to the luminaire housing through the heat conducting member to dissipate heat. However, in such a system, the contact area between the heat conducting member and the lighting device housing is small, and the heat dissipation of the LED element cannot be said to be sufficient.

この問題を解決する第２の従来例として、ＬＥＤが配列された基板と、その基板を取り付ける底部を有する照明装置筐体とを有し、基板が底部に放熱固定板を介して取り付けられてなるＬＥＤ照明装置であって、放熱固定板の上記基板が取り付けられた面と対向する面に照明装置筐体の底部との接触面積を増大させるように凸部を形成したものが提案されている（例えば、特許文献２参照）。   As a second conventional example for solving this problem, the substrate has a substrate on which LEDs are arranged and a lighting device housing having a bottom portion to which the substrate is attached, and the substrate is attached to the bottom portion through a heat radiation fixing plate. An LED lighting device has been proposed in which a convex portion is formed so as to increase the contact area with the bottom of the lighting device housing on the surface of the heat radiation fixing plate that faces the surface on which the substrate is mounted ( For example, see Patent Document 2).

この方式では基板と照明装置筐体の底部との間に凸部を形成した放熱固定板を設けることにより照明装置筐体の底部との接触面積が大きくなり、ＬＥＤ素子の発熱を照明装置の筐体に効率的に逃がすことができる。   In this method, by providing a heat radiation fixing plate having a convex portion between the substrate and the bottom of the illuminating device casing, the contact area with the bottom of the illuminating device casing is increased, and the heat generated by the LED element is reduced. Can escape efficiently to the body.

特開２００３−１２４５２８号公報（段落００２２〜００２７、図３〜図５）JP 2003-124528 A (paragraphs 0022 to 0027, FIGS. 3 to 5) 特開２００２−２９９７００号公報（段落００１１〜００１８、図１、図５）JP 2002-299700 A (paragraphs 0011 to 0018, FIGS. 1 and 5)

しかしながら、放熱固定板と照明装置筐体に凹凸部を設け、嵌合させる構造においては、構造が複雑になるばかりでなく、嵌合する凸部は凹部に対して幅寸法を若干小さくしなければ凸部を凹部に挿入することができないため、高い加工精度が要求される。また、そのような理由から両者の接合部を完全に密着させることは困難であり、凸部と凹部の接合部に空気層ができることによる接触熱抵抗の増加が懸念される。   However, in the structure in which uneven portions are provided on the heat radiation fixing plate and the lighting device housing to be fitted, not only the structure becomes complicated, but the width of the fitting convex portion has to be slightly reduced relative to the concave portion. Since the convex portion cannot be inserted into the concave portion, high machining accuracy is required. Further, it is difficult for the reasons to make the two bonded portions completely adhere to each other, and there is a concern that the contact thermal resistance is increased due to the formation of an air layer at the bonded portion between the convex portion and the concave portion.

本発明は、上記のような課題を解決するためになされたもので、ＬＥＤ素子から発生した熱を簡単な構成により効率よく放熱することができるＬＥＤ照明装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an LED lighting device that can efficiently dissipate heat generated from an LED element with a simple configuration.

本発明に係るＬＥＤ照明装置は、複数のＬＥＤ素子が実装された基板と、前記基板を収容する照明装置筐体とを備え、前記基板は、少なくとも一方の側面が連続的に傾斜した形状を有し、前記照明装置筐体は、前記基板の一方の側面に対応する内側側面が該一方の側面の傾斜角度と同一角度で傾斜した形状を有するものである。   An LED illumination device according to the present invention includes a substrate on which a plurality of LED elements are mounted, and an illumination device housing that houses the substrate, and the substrate has a shape in which at least one side surface is continuously inclined. And the said illuminating device housing | casing has the shape where the inner side surface corresponding to one side surface of the said board | substrate inclined at the same angle as the inclination angle of this one side surface.

本発明によれば、少なくとも一方の側面が連続的に傾斜した形状を有する基板と、基板を収める照明装置筐体の内側側面が、基板の一方の側面の傾斜角度と同一角度で傾斜した形状を有するので、所定の位置で基板側面と照明装置筐体の内側側面が接触する。これにより基板と照明装置筐体の接触面積が大きくなり、ＬＥＤ素子で発生した熱を簡単な構成により照明装置筐体に効率よく逃がすことができる。   According to the present invention, a substrate having a shape in which at least one side surface is continuously inclined, and an inner side surface of a lighting device housing that accommodates the substrate are inclined at the same angle as the inclination angle of one side surface of the substrate. Therefore, the side surface of the substrate and the inner side surface of the lighting device housing come into contact with each other at a predetermined position. Thereby, the contact area of a board | substrate and an illuminating device housing | casing becomes large, and the heat which generate | occur | produced by the LED element can be efficiently escaped to an illuminating device housing | casing with a simple structure.

以下、本発明に係るＬＥＤ照明装置の実施の形態について図面を参照して説明する。   Hereinafter, embodiments of an LED lighting device according to the present invention will be described with reference to the drawings.

実施の形態１．
図１は、本発明の実施の形態１に係るＬＥＤ照明装置の斜視図である。また、図２はＬＥＤ照明装置の主要部品を分解して示す正面図で、（ａ）は実装基板の正面図、（ｂ）は照明装置筐体の正面図である。
本実施の形態１に係るＬＥＤ照明装置は、ＬＥＤ素子１と、複数のＬＥＤ素子１を実装した基板（実装基板）２と、実装基板２を収める照明装置筐体３と、光を拡散または集光するための透光性カバー（図示せず）とを備えている。図中、１０は実装基板２を照明装置筐体３に固定するためのネジ、１１は実装基板２に設けられたネジ１０を通すための長穴、１２は照明装置筐体３の底面に設けられたネジ穴である。 Embodiment 1 FIG.
FIG. 1 is a perspective view of the LED illumination device according to Embodiment 1 of the present invention. 2 is an exploded front view showing the main components of the LED lighting device, where (a) is a front view of the mounting substrate, and (b) is a front view of the lighting device housing.
The LED illumination device according to the first embodiment includes an LED element 1, a substrate (mounting substrate) 2 on which a plurality of LED elements 1 are mounted, an illumination device housing 3 that houses the mounting substrate 2, and light diffusion or collection. A translucent cover (not shown) for illuminating. In the figure, 10 is a screw for fixing the mounting substrate 2 to the lighting device housing 3, 11 is a long hole for passing the screw 10 provided on the mounting substrate 2, and 12 is provided on the bottom surface of the lighting device housing 3. Screw holes.

図１に示されるような長方形のライン形状の照明器具に搭載される実装基板２は、少なくとも一辺に設けた、例えば図２の右側から左側にかけて基板の幅が狭くなり、連続的に傾斜している側面２ｃを有する形状となっている。すなわち、実装基板２は、上面から見て台形形状をなし、先端面２ａの長さ（基板の幅）が後端面２ｂより漸次短くなるように少なくとも一方の側面２ｃが連続的に傾斜した面を有している。他方の側面２ｄは、この例では先端面２ａおよび後端面２ｂに対して直角をなすようにストレートに形成されているが、先端面２ａ側が先細となるように、ある角度（側面２ｃの傾斜角度と同じでなくてもよい）で傾斜した形状でもかまわない。なお、実装基板２の側面というのは、後述するように実装基板２の挿入方向に沿う側面を指す。この実装基板２は例えばガラスエポキシ樹脂、またはより熱伝導率の高い金属材料、例えばアルミニウムから形成されている。   A mounting board 2 mounted on a rectangular line-shaped lighting fixture as shown in FIG. 1 is provided on at least one side, for example, the board width decreases from the right side to the left side in FIG. It has a shape having a side surface 2c. That is, the mounting substrate 2 has a trapezoidal shape when viewed from above, and has a surface in which at least one side surface 2c is continuously inclined so that the length of the front end surface 2a (the width of the substrate) becomes gradually shorter than the rear end surface 2b. Have. In this example, the other side surface 2d is formed so as to be perpendicular to the front end surface 2a and the rear end surface 2b. However, the other side surface 2d has a certain angle (inclination angle of the side surface 2c) so that the front end surface 2a side is tapered. It does not have to be the same as). Note that the side surface of the mounting substrate 2 refers to a side surface along the insertion direction of the mounting substrate 2 as described later. The mounting substrate 2 is made of, for example, glass epoxy resin or a metal material having higher thermal conductivity, such as aluminum.

実装基板２を収める照明装置筐体３は、側壁３ａ、３ｂと底壁３ｃとを有する溝形の部材から構成され、一方の側壁３ｂの内側側面３ｄは実装基板２の傾斜した側面２ｃと一致するように同一角度で連続的に傾斜した面を有する。この傾斜面からなる内側側面３ｄの高さは実装基板２の厚さと同等以上であることが望ましい。他方の側壁３ａは、実装基板２の他方の側面２ｄに合致するように長手方向にストレートな内側側面３ｅとなっている。このように構成される照明装置筐体３は熱伝導率の高い金属材料、例えばアルミニウムから形成されている。   The lighting device housing 3 for housing the mounting substrate 2 is composed of a groove-shaped member having side walls 3a, 3b and a bottom wall 3c, and the inner side surface 3d of one side wall 3b coincides with the inclined side surface 2c of the mounting substrate 2. Thus, it has a continuously inclined surface at the same angle. The height of the inner side surface 3d made of this inclined surface is preferably equal to or greater than the thickness of the mounting board 2. The other side wall 3 a is an inner side surface 3 e that is straight in the longitudinal direction so as to match the other side surface 2 d of the mounting substrate 2. The illuminating device housing 3 configured as described above is formed of a metal material having high thermal conductivity, for example, aluminum.

実装基板２上に実装されるＬＥＤ素子１は、例えばサファイア基板上に窒化ガリウム系の発光層から形成され、各層に接続された電極（図示せず）を実装基板２の上面に形成された配線部（図示せず）と電気的に接続して電力を供給するようになっている。さらに、ＬＥＤ素子１はエポキシ材やシリコーン材などからなる透明あるいは半透明の樹脂で覆われており、特に、紫外光などに対して劣化速度が緩やかなものなど、耐候性の強いものを使用することが望ましい。   The LED element 1 mounted on the mounting substrate 2 is formed of, for example, a gallium nitride-based light emitting layer on a sapphire substrate, and an electrode (not shown) connected to each layer is formed on the upper surface of the mounting substrate 2. An electric power is supplied by being electrically connected to a portion (not shown). Further, the LED element 1 is covered with a transparent or translucent resin made of an epoxy material, a silicone material, or the like, and in particular, a highly weather resistant material such as a material having a slow deterioration rate against ultraviolet light or the like is used. It is desirable.

次に、実装基板２と照明装置筐体３の取り付けについて図３を参照して説明する。実装基板２を照明装置筐体３に取り付けるときには、実装基板２の幅の狭い方、すなわち先端面２ａ側（図では左側）を照明装置筐体３の基板収納箇所の幅の広い方（図では右側）から矢印のように横方向に挿入し、実装基板２をスライドさせていき、実装基板２の傾斜した側面２ｃと照明装置筐体３の傾斜した内側側面３ｄとが接触し、止まるところまで挿入する。これにより、実装基板２の側面２ｃと照明装置筐体３の内側側面３ｄの傾斜面の作用により、実装基板２の側面２ｃ、２ｄは照明装置筐体３の内側側面３ｄ、３ｅの間に挟み付けられた状態となるため、実装基板２の側面２ｃ、２ｄと照明装置筐体３の内側側面３ｄ、３ｅとは確実に密着する。またこのとき、実装基板２と照明装置筐体３の接触面に熱伝導性グリスを塗布すれば、より接触熱抵抗を低減することができる。そしてこの位置にて実装基板２と照明装置筐体３を図１のようにネジ１０等で固定する。   Next, attachment of the mounting substrate 2 and the lighting device housing 3 will be described with reference to FIG. When the mounting substrate 2 is attached to the lighting device housing 3, the narrower one of the mounting substrate 2, that is, the tip surface 2a side (left side in the figure) is the wider one of the board housing locations of the lighting device housing 3 (in the drawing). From the right side), the mounting substrate 2 is inserted in the horizontal direction as shown by the arrow, and the inclined side surface 2c of the mounting substrate 2 and the inclined inner side surface 3d of the lighting device housing 3 come into contact with each other and stop. insert. Accordingly, the side surfaces 2c and 2d of the mounting substrate 2 are sandwiched between the inner side surfaces 3d and 3e of the lighting device housing 3 by the action of the inclined surfaces of the side surface 2c of the mounting substrate 2 and the inner side surface 3d of the lighting device housing 3. Since it is in the attached state, the side surfaces 2c and 2d of the mounting substrate 2 and the inner side surfaces 3d and 3e of the lighting device housing 3 are securely adhered to each other. At this time, if thermal conductive grease is applied to the contact surface between the mounting substrate 2 and the lighting device housing 3, the contact thermal resistance can be further reduced. At this position, the mounting substrate 2 and the lighting device housing 3 are fixed with screws 10 or the like as shown in FIG.

以上、本実施の形態１に係るＬＥＤ照明装置の構成について説明した。次に、本実施の形態１に係るＬＥＤ照明装置の放熱効果について説明する。   The configuration of the LED lighting device according to the first embodiment has been described above. Next, the heat radiation effect of the LED lighting device according to the first embodiment will be described.

従来の長方形のライン形状の実装基板を基板と同一形状の筐体に収納する場合、ＬＥＤ素子が実装されていない基板裏面を筐体の内側底面に接触させ、ＬＥＤ素子から発生した熱を、基板を介して筐体に逃がしていたが、さらにＬＥＤ素子の発熱を基板側面からも筐体に逃がすために、基板の側面と筐体の内側の側面を密着させることは形状が長方形である場合、一般的に困難である。   When a conventional rectangular line-shaped mounting board is housed in a housing having the same shape as the board, the back surface of the board on which the LED element is not mounted is brought into contact with the inner bottom surface of the housing, and the heat generated from the LED element is If the shape of the LED is in a rectangular shape, the side surface of the substrate and the inner side surface of the housing are brought into close contact with each other in order to release the heat generated from the LED element from the side surface of the substrate to the housing. Generally difficult.

これは長方形の実装基板を同一形状の照明装置筐体に収める場合、基板の幅寸法を照明装置筐体の基板収納部の幅寸法よりも小さくしなければ基板を筐体に収めることができず、実装基板と筐体間に熱を伝えにくい隙間（空隙）が発生するからである。一方、実装基板の側面を筐体内側の側面に密着させるためには高い加工精度が要求され、加工や基板の取り付けが難しくなる。   This is because when a rectangular mounting board is housed in a lighting device housing of the same shape, the substrate cannot be housed in the housing unless the width of the substrate is made smaller than the width of the substrate housing portion of the lighting device housing. This is because a gap (air gap) is formed between the mounting substrate and the housing that is difficult to transfer heat. On the other hand, high processing accuracy is required to bring the side surface of the mounting substrate into close contact with the side surface inside the housing, which makes it difficult to process and attach the substrate.

本実施の形態では、少なくとも一辺に設けた、例えば図２（ａ）のように基板の右側から左側にかけて基板の幅が狭くなる、連続的に傾斜している側面２ｃを有する実装基板２と、図２（ｂ）のように実装基板２を収める照明装置筐体３の内側側面３ｄが、実装基板２の傾斜した側面２ｃと一致するように同一角度で連続的に傾斜させた面を有するので、実装基板２を照明装置筐体３に装着する場合、実装基板２を照明装置筐体３の基板収納箇所の幅の広い方から横方向に挿入し、実装基板２をスライドさせることにより、所定の位置で実装基板２の傾斜した側面２ｃと照明装置筐体３の傾斜した内側側面３ｄとが密接に接触する。   In the present embodiment, the mounting substrate 2 having a continuously inclined side surface 2c provided on at least one side, the width of the substrate narrowing from the right side to the left side of the substrate as shown in FIG. 2A, for example. As shown in FIG. 2B, the inner side surface 3d of the lighting device housing 3 that houses the mounting substrate 2 has a surface that is continuously inclined at the same angle so as to coincide with the inclined side surface 2c of the mounting substrate 2. When mounting the mounting substrate 2 on the lighting device housing 3, the mounting substrate 2 is inserted in the lateral direction from the wider side of the substrate storage location of the lighting device housing 3, and the mounting substrate 2 is slid to be predetermined. The inclined side surface 2c of the mounting substrate 2 and the inclined inner side surface 3d of the lighting device casing 3 are in close contact with each other at the position.

この位置で照明装置筐体３の内側側面３ｄ、３ｅと実装基板２の側面２ｃ、２ｄとが完全に接触することになる。ここで実装基板２を照明装置筐体３とネジ止め等で固定することにより、実装基板裏面と基板側面の両方が照明装置筐体３に密着するため、実装基板２と照明装置筐体３との接触面積が大きくなり、ＬＥＤ素子１で発生した熱を筐体に効率よく逃がすことができる。   At this position, the inner side surfaces 3d and 3e of the lighting device housing 3 and the side surfaces 2c and 2d of the mounting substrate 2 are completely in contact with each other. Here, by fixing the mounting substrate 2 to the lighting device housing 3 by screwing or the like, both the back surface of the mounting substrate and the side surface of the substrate are in close contact with the lighting device housing 3. As a result, the heat generated in the LED element 1 can be efficiently released to the housing.

ここで、ネジ等を使用して実装基板２と照明装置筐体３を固定する場合、図２（ａ）に示すように実装基板２の長手方向（挿入方向）に楕円形状もしくは長穴形状の長穴１１を設ける。これにより、実装基板２の傾斜した側面２ｃと照明装置筐体３の傾斜した内側側面３ｄとが完全に接触できる位置まで実装基板２の位置を微調整することができ、完全に密着した位置にて実装基板２と照明装置筐体３を固定することができる。   Here, when the mounting board 2 and the lighting device housing 3 are fixed using screws or the like, as shown in FIG. 2A, the mounting board 2 has an elliptical shape or a long hole shape in the longitudinal direction (insertion direction). A long hole 11 is provided. As a result, the position of the mounting substrate 2 can be finely adjusted to a position where the inclined side surface 2c of the mounting substrate 2 and the inclined inner side surface 3d of the lighting device housing 3 can be completely in contact with each other. Thus, the mounting substrate 2 and the lighting device housing 3 can be fixed.

以上のように、本実施の形態のＬＥＤ照明装置は、複数のＬＥＤ素子１が実装され、少なくとも一辺に設けた、連続的に傾斜している側面２ｃを有する実装基板２と、実装基板２を収める照明装置筐体３とを備え、実装基板２の側面２ｃに対応する照明装置筐体３の内側側面３ｄが、実装基板２の傾斜した側面２ｃと一致するように同一角度で連続的に傾斜した面を有するので、実装基板２と照明装置筐体３の接触面積が大きくなり、ＬＥＤ素子１で発生した熱を照明装置筐体３に効率よく放熱することができる。   As described above, the LED lighting device according to the present embodiment includes a mounting substrate 2 on which at least one LED element 1 is mounted and has a continuously inclined side surface 2c provided on at least one side. A lighting device housing 3 for housing, and the inner side surface 3d of the lighting device housing 3 corresponding to the side surface 2c of the mounting substrate 2 is continuously inclined at the same angle so as to coincide with the inclined side surface 2c of the mounting substrate 2 Therefore, the contact area between the mounting substrate 2 and the lighting device casing 3 is increased, and the heat generated by the LED element 1 can be efficiently radiated to the lighting device casing 3.

従って、ＬＥＤ素子周辺に充填した樹脂の劣化を防ぐことができ、ＬＥＤ素子の寿命低下を抑制することができる。また、放熱のために大型のフィンを用いることなく、より高出力のＬＥＤ素子を使用することができ、ＬＥＤ照明装置の高出力化・小型化を達成でき、且つ高い信頼性を得ることができる。   Therefore, it is possible to prevent the resin filled around the LED element from being deteriorated, and to suppress the lifetime reduction of the LED element. In addition, higher power LED elements can be used without using large fins for heat dissipation, higher output and smaller size of the LED lighting device can be achieved, and high reliability can be obtained. .

なお、本実施の形態１では、実装基板２の側面２ｃおよび照明装置筐体３の内側側面３ｄは、端から端まで連続した傾斜面つまり全長傾斜（伝熱上は全面密着）の形態をとっているが、これらの側面２ｃ、３ｄの一部に、すなわち先端側もしくは後端側あるいはその両方に、他方の側面２ｄ、３ｅと平行なストレートな面を含んでいてもよい。つまり、これらの側面２ｃ、３ｄは、一部のストレート面と傾斜面とを含む形状でもよいものである。ストレート面は可能な限り短い方が好ましい。   In the first embodiment, the side surface 2c of the mounting substrate 2 and the inner side surface 3d of the illuminating device housing 3 are in the form of an inclined surface that is continuous from end to end, that is, an entire length inclination (overall contact in terms of heat transfer). However, a straight surface parallel to the other side surfaces 2d and 3e may be included in a part of these side surfaces 2c and 3d, that is, on the front end side or the rear end side or both. That is, the side surfaces 2c and 3d may have a shape including a part of straight surfaces and inclined surfaces. The straight surface is preferably as short as possible.

実施の形態２．
図４は、本発明の実施の形態２に係るＬＥＤ照明装置の斜視図である。また、図５はＬＥＤ照明装置の放熱部材の正面図、図６および図７はＬＥＤ照明装置の組立方法を示す分解斜視図である。
本実施の形態２に係るＬＥＤ照明装置は、実施の形態１で示した実装基板２と照明装置筐体３との間に放熱部材４を設け、放熱部材４に実装基板２をそれらの側面および底面が密着するように収容するとともに、放熱部材４を照明装置筐体３にそれらの側面および底面が密着するように収容する構成としたものである。放熱部材４は、図４〜図７に示すように、側壁４ａ、４ｂと底壁４ｃとを有する溝形の部材により構成されており、一方の側壁４ｂの内側側面４ｄおよび外側側面４ｅは、実装基板２の側面２ｃの傾斜角度と同一角度で連続的に傾斜した傾斜面となっている。図中、１３は放熱部材４の底面および側面に設けた長穴で、底面に設けた長穴１３は実装基板２に設けた長穴１１に連通している。 Embodiment 2. FIG.
FIG. 4 is a perspective view of the LED illumination device according to Embodiment 2 of the present invention. FIG. 5 is a front view of a heat radiating member of the LED lighting device, and FIGS. 6 and 7 are exploded perspective views showing a method of assembling the LED lighting device.
In the LED lighting device according to the second embodiment, the heat radiation member 4 is provided between the mounting substrate 2 and the lighting device housing 3 shown in the first embodiment, and the mounting substrate 2 is attached to the heat radiation member 4 on the side surfaces thereof. While accommodating so that a bottom surface may closely_contact | adhere, it is set as the structure which accommodates the thermal radiation member 4 so that those side surfaces and bottom surfaces may contact | adhere to the illuminating device housing | casing 3 closely. As shown in FIGS. 4 to 7, the heat dissipating member 4 is constituted by a groove-shaped member having side walls 4a and 4b and a bottom wall 4c. The inner side surface 4d and the outer side surface 4e of one side wall 4b are: It is an inclined surface that is continuously inclined at the same angle as the inclination angle of the side surface 2 c of the mounting substrate 2. In the figure, reference numeral 13 denotes an elongated hole provided in the bottom surface and the side surface of the heat radiating member 4, and the elongated hole 13 provided in the bottom surface communicates with the elongated hole 11 provided in the mounting substrate 2.

実施の形態２に係るＬＥＤ照明装置を組み立てる場合には、まず図６に示すように、複数のＬＥＤ素子１が実装された実装基板２を放熱部材４に取り付ける。この場合には、実装基板２の幅の狭い方、すなわち先端面２ａ側（図では基板の左側）を放熱部材４の幅の広い方（図では放熱部材４の右側）から矢印のように横方向に挿入し、基板側面２ｃと放熱部材４の内側側面４ｄが接触し、止まるところまで挿入する。この位置においては実装基板２の側面２ｃと放熱部材４の内側側面４ｄとが確実に密着する。このとき、放熱部材４と実装基板２の接触面に熱伝導性グリスを塗布すれば、より接触熱抵抗を低減することができる。放熱部材４は熱伝導率の高い金属材料、例えばアルミニウムから形成されている。   When the LED lighting device according to Embodiment 2 is assembled, first, as shown in FIG. 6, the mounting substrate 2 on which the plurality of LED elements 1 are mounted is attached to the heat dissipation member 4. In this case, the narrower side of the mounting substrate 2, that is, the front end surface 2a side (left side of the substrate in the figure) is laterally extended as indicated by the arrow from the wider side of the heat radiating member 4 (right side of the heat radiating member 4 in the figure). The substrate side surface 2c and the inner side surface 4d of the heat dissipating member 4 are in contact with each other and inserted until it stops. At this position, the side surface 2c of the mounting substrate 2 and the inner side surface 4d of the heat dissipating member 4 are securely adhered. At this time, if thermal conductive grease is applied to the contact surface between the heat radiating member 4 and the mounting substrate 2, the contact thermal resistance can be further reduced. The heat radiating member 4 is made of a metal material having high thermal conductivity, for example, aluminum.

ついで、前述のように実装基板２が取り付けられた放熱部材４を、図７に示すように、照明装置筐体３に取り付ける。放熱部材４の外側側面４ｅは、実装基板２の側面２ｃおよび照明装置筐体３の内側側面３ｄの傾斜角度と同一角度で傾斜した傾斜面となっているので、放熱部材４の幅の狭い方（図では左側）を照明装置筐体３の幅の広い方（図では右側）から横方向に挿入し、放熱部材４をスライドしていき、放熱部材４の外側側面４ｅと照明装置筐体３の内側側面３ｄが接触し、止まるところまで挿入する。止まるところで放熱部材４の外側側面４ｅと照明装置筐体３の内側側面３ｄとが完全に接触することになる。またこのとき、放熱部材４と照明装置筐体３の接触面に熱伝導性グリスを塗布すれば、より接触熱抵抗を低減することができる。この位置にて図４に示すように、放熱部材４を照明装置筐体３の底部と側面にネジ１０等で固定することにより放熱部材４が照明装置筐体３に確実に密着する。   Next, the heat dissipating member 4 to which the mounting substrate 2 is attached as described above is attached to the lighting device casing 3 as shown in FIG. The outer side surface 4e of the heat radiating member 4 is an inclined surface that is inclined at the same angle as that of the side surface 2c of the mounting substrate 2 and the inner side surface 3d of the lighting device housing 3, so that the heat radiating member 4 having a narrower width. (Left side in the figure) is inserted laterally from the wider side (right side in the figure) of the lighting device housing 3, the heat radiating member 4 is slid, and the outer side surface 4e of the heat radiating member 4 and the lighting device housing 3 are inserted. Insert until the inner side surface 3d contacts and stops. When it stops, the outer side surface 4e of the heat radiating member 4 and the inner side surface 3d of the lighting device housing 3 come into complete contact. At this time, if thermal conductive grease is applied to the contact surface between the heat dissipating member 4 and the lighting device housing 3, the contact thermal resistance can be further reduced. At this position, as shown in FIG. 4, the heat radiating member 4 is securely attached to the lighting device housing 3 by fixing the heat radiating member 4 to the bottom and side surfaces of the lighting device housing 3 with screws 10 or the like.

本実施の形態では、少なくとも一辺が連続的に傾斜する側面２ｃを有する実装基板２に、実装基板２の傾斜させた側面２ｃと一致するように同一角度で傾斜させた内側側面４ｄおよび外側側面４ｅを有する放熱部材４を取り付け、さらに、これらを収める照明装置筐体３の内側側面３ｄは、放熱部材４の外側側面４ｅと一致するように同一角度で連続的に傾斜させた傾斜面となっているので、基板側面は放熱部材側面に接触し、放熱部材４はより広い接触面積で照明装置筐体側面と密着することになる。放熱部材側面は照明装置筐体側面とネジ等で固定するので、放熱部材側面と照明装置筐体側面が確実に密着するため、ＬＥＤ素子で発生した熱は照明装置筐体底面だけでなく、照明装置筐体側面方向にも効率よく放熱することができる。   In the present embodiment, an inner side surface 4d and an outer side surface 4e that are inclined at the same angle so as to coincide with the inclined side surface 2c of the mounting substrate 2 on the mounting substrate 2 having the side surface 2c that is continuously inclined at least one side. Further, the inner side surface 3d of the luminaire housing 3 that houses them is an inclined surface that is continuously inclined at the same angle so as to coincide with the outer side surface 4e of the heat radiating member 4. Therefore, the side surface of the substrate comes into contact with the side surface of the heat radiating member, and the heat radiating member 4 comes into close contact with the side surface of the lighting device housing with a wider contact area. Since the heat radiating member side surface is fixed to the lighting device housing side surface with a screw or the like, the heat radiation member side surface and the lighting device housing side surface are securely in contact with each other. It is possible to efficiently dissipate heat in the side direction of the device casing.

以上のように、本実施の形態のＬＥＤ照明装置は、照明装置筐体３と放熱部材４の接触面積が大きくなり、ＬＥＤ素子１で発生した熱を、放熱部材４を介して照明装置筐体３に効率よく放熱することができる。   As described above, in the LED lighting device of the present embodiment, the contact area between the lighting device housing 3 and the heat radiating member 4 is increased, and the heat generated in the LED element 1 is transmitted via the heat radiating member 4 to the lighting device housing. 3 can efficiently dissipate heat.

従って、ＬＥＤ素子周辺に充填した樹脂の劣化を防ぐことができ、ＬＥＤ素子の寿命低下を抑制することができる。また、放熱のために大型のフィンを用いることなく、より高出力のＬＥＤ素子を使用することができ、ＬＥＤ照明装置の高出力化・小型化を達成でき、且つ高い信頼性を得ることができる。   Therefore, it is possible to prevent the resin filled around the LED element from being deteriorated, and to suppress the lifetime reduction of the LED element. In addition, higher power LED elements can be used without using large fins for heat dissipation, higher output and smaller size of the LED lighting device can be achieved, and high reliability can be obtained. .

実施の形態３．
図８は、本発明の実施の形態３に係るＬＥＤ照明装置の斜視図である。また、図９はＬＥＤ照明装置の実装基板と放熱部材との取り付け状態を示す正面図、図１０はＬＥＤ照明装置の組立方法を示す分解斜視図である。 Embodiment 3 FIG.
FIG. 8 is a perspective view of the LED lighting apparatus according to Embodiment 3 of the present invention. FIG. 9 is a front view showing a mounting state of the mounting board and the heat dissipating member of the LED lighting device, and FIG. 10 is an exploded perspective view showing an assembly method of the LED lighting device.

本実施の形態３に係るＬＥＤ照明装置において、図４に示した実施の形態２と異なる点は、放熱部材４の側面に実装基板２の側面２ｃの傾斜角度と同一角度で傾斜した複数のフィン５が設けられ、照明装置筐体３の内側側面に、これらのフィン５に対応して断面が凹状に形成され、凸状のフィン５が嵌合する傾斜した溝部６を設けたことである。その他は、実施の形態２と同一の構成である。   In the LED lighting device according to the third embodiment, the difference from the second embodiment shown in FIG. 4 is that a plurality of fins inclined on the side surface of the heat dissipation member 4 at the same angle as the inclination angle of the side surface 2c of the mounting substrate 2. 5 is provided, and an inclined groove portion 6 in which a cross section is formed in a concave shape corresponding to the fins 5 and the convex fins 5 are fitted is provided on the inner side surface of the lighting device housing 3. The other configuration is the same as that of the second embodiment.

図８に示すＬＥＤ照明装置は、放熱部材４の側面に複数のフィン５が設けられ、図９の放熱部材４の正面図に示すように、基板形状に合わせて（実装基板２の側面２ｃの傾斜角度と同一角度で）フィン５が連続的に傾斜する構成となっている。また、フィン５と嵌合する照明装置筐体３の内側側面に設けた溝部６は、放熱部材４のフィン５に対応して同一角度にて連続傾斜している。   The LED lighting device shown in FIG. 8 is provided with a plurality of fins 5 on the side surface of the heat radiating member 4, and as shown in the front view of the heat radiating member 4 in FIG. The fins 5 are continuously inclined (at the same angle as the inclination angle). Further, the groove 6 provided on the inner side surface of the lighting device housing 3 that fits with the fin 5 is continuously inclined at the same angle corresponding to the fin 5 of the heat radiating member 4.

実装基板２の放熱部材４への取り付けについては、実施の形態２と同様、実装基板２を放熱部材４の幅の広い方から横方向に挿入し、実装基板２の側面と放熱部材４の内側側面が接触し、止まるところまで挿入する。これにより実装基板側面と放熱部材側面が確実に密着する。このとき、放熱部材４と実装基板２の接触面に熱伝導性グリスを塗布すれば、より接触熱抵抗を低減することができる。   As for the mounting of the mounting board 2 to the heat radiating member 4, as in the second embodiment, the mounting board 2 is inserted laterally from the wider side of the heat radiating member 4, and the side surface of the mounting board 2 and the inner side of the heat radiating member 4 are inserted. Insert until the sides touch and stop. As a result, the side surface of the mounting substrate and the side surface of the heat radiating member are securely adhered. At this time, if thermal conductive grease is applied to the contact surface between the heat radiating member 4 and the mounting substrate 2, the contact thermal resistance can be further reduced.

次に、放熱部材４と照明装置筐体３の取り付けについて図１０を用いて説明する。放熱部材４を照明装置筐体３に取り付けるときは放熱部材４のフィン５を照明装置筐体３の溝部６に合わせて、放熱部材４の幅の狭い方（図では左側）を照明装置筐体３の幅の広い方（図では右側）から横方向に挿入して嵌合させる。そのまま横方向にスライドさせて放熱部材４の側面と照明装置筐体３の内側側面が接触し、止まるところまで挿入する。これにより照明装置筐体側面と放熱部材４のフィン５が確実に密着する。このとき、放熱部材４と照明装置筐体３の接触面に熱伝導性グリスを塗布すれば、より接触熱抵抗を低減することができる。そしてこの位置にて実装基板２、放熱部材４、照明装置筐体３をネジ等で固定する。   Next, attachment of the heat radiating member 4 and the lighting device housing 3 will be described with reference to FIG. When attaching the heat dissipating member 4 to the lighting device housing 3, the fin 5 of the heat dissipating member 4 is aligned with the groove 6 of the lighting device housing 3, and the narrower one of the heat dissipating members 4 (the left side in the figure) is attached to the lighting device housing. 3 is inserted laterally from the wider side (right side in the figure) and fitted. It is slid in the horizontal direction as it is, and the side surface of the heat radiating member 4 and the inner side surface of the lighting device housing 3 are in contact with each other and inserted until it stops. As a result, the side surface of the lighting device casing and the fins 5 of the heat dissipation member 4 are securely adhered. At this time, if thermal conductive grease is applied to the contact surface between the heat radiating member 4 and the lighting device housing 3, the contact thermal resistance can be further reduced. At this position, the mounting substrate 2, the heat radiating member 4, and the lighting device housing 3 are fixed with screws or the like.

以上のように、本実施の形態のＬＥＤ照明装置は、少なくとも一辺が連続的に傾斜する形状を設けた実装基板２と、実装基板２と同一角度で傾斜させた側面を有する放熱部材４と、放熱部材４の側面に設けられた複数のフィン５と、フィン５と同一角度にて連続傾斜しフィン５が嵌合する溝部６を設けた照明装置筐体３とを有するので、フィン５が照明装置筐体３の内側側面に設けた溝部６に嵌合され、照明装置筐体側面とフィンが確実に密着するので、放熱部材４と照明装置筐体３の接触面積が大きくなり、ＬＥＤ素子１で発生した熱を照明装置筐体底面のみならず、照明装置筐体側面からも効率よく放熱することができる。   As described above, the LED lighting device according to the present embodiment includes the mounting substrate 2 provided with a shape in which at least one side is continuously inclined, the heat dissipation member 4 having a side surface inclined at the same angle as the mounting substrate 2, Since it has the several fin 5 provided in the side surface of the thermal radiation member 4, and the illuminating device housing | casing 3 which provided the groove part 6 which continuously inclines at the same angle as the fin 5 and the fin 5 fits, the fin 5 is illuminated. Since it fits into the groove part 6 provided in the inner side surface of the apparatus housing | casing 3, and a lighting device housing | casing side surface and a fin contact | adhere reliably, the contact area of the thermal radiation member 4 and the illuminating device housing | casing 3 becomes large, and the LED element 1 It is possible to efficiently dissipate the heat generated in step 1 not only from the bottom surface of the lighting device housing but also from the side surface of the lighting device housing.

従って、ＬＥＤ素子周辺に充填した樹脂の劣化を防ぐことができ、ＬＥＤ素子の寿命低下を抑制することができる。また、大型のフィンを用いることなく、より高出力のＬＥＤ素子を使用することができ、ＬＥＤ照明装置の高出力化・小型化を達成でき、且つ高い信頼性を得ることができる。   Therefore, it is possible to prevent the resin filled around the LED element from being deteriorated, and to suppress the lifetime reduction of the LED element. Moreover, it is possible to use a higher-power LED element without using a large fin, to achieve higher output and smaller size of the LED lighting device, and to obtain high reliability.

本発明の実施の形態１に係るＬＥＤ照明装置の斜視図である。It is a perspective view of the LED lighting apparatus which concerns on Embodiment 1 of this invention. ＬＥＤ照明装置の分解正面図である。It is a disassembled front view of a LED lighting apparatus. ＬＥＤ照明装置の組立方法を示す分解斜視図である。It is a disassembled perspective view which shows the assembly method of a LED lighting apparatus. 本発明の実施の形態２に係るＬＥＤ照明装置の斜視図である。It is a perspective view of the LED lighting apparatus which concerns on Embodiment 2 of this invention. ＬＥＤ照明装置の放熱部材の正面図である。It is a front view of the heat radiating member of LED lighting apparatus. ＬＥＤ照明装置の組立方法を示す分解斜視図である。It is a disassembled perspective view which shows the assembly method of a LED lighting apparatus. 図６に続くＬＥＤ照明装置の組立方法を示す分解斜視図である。It is a disassembled perspective view which shows the assembly method of the LED lighting apparatus following FIG. 本発明の実施の形態３に係るＬＥＤ照明装置の斜視図である。It is a perspective view of the LED lighting apparatus which concerns on Embodiment 3 of this invention. ＬＥＤ照明装置の実装基板と放熱部材との取り付け状態を示す正面図である。It is a front view which shows the attachment state of the mounting board | substrate of a LED lighting apparatus, and a heat radiating member. 図９に続くＬＥＤ照明装置の組立方法を示す分解斜視図である。It is a disassembled perspective view which shows the assembly method of the LED lighting apparatus following FIG.

符号の説明Explanation of symbols

１ ＬＥＤ素子、２ 実装基板、２ｃ 実装基板の傾斜した側面、３ 照明装置筐体、３ｄ 照明装置筐体の傾斜した内側側面、４ 放熱部材、４ｄ 放熱部材の傾斜した内側側面、４ｅ 放熱部材の傾斜した外側側面、５ フィン、６ 溝部、１０ ネジ、１１ 長穴、１２ ネジ穴。   1 LED element, 2 mounting substrate, 2c inclined side surface of mounting substrate, 3 lighting device casing, 3d inclined inner side surface of lighting device casing, 4 heat dissipation member, 4d inclined inner side surface of heat dissipation member, 4e heat dissipation member Inclined outer side, 5 fins, 6 grooves, 10 screws, 11 oblong holes, 12 screw holes.

Claims (5)

複数のＬＥＤ素子が実装された基板と、前記基板を収容する照明装置筐体とを備え、
前記基板は、少なくとも一方の側面が連続的に傾斜した形状を有し、前記照明装置筐体は、前記基板の一方の側面に対応する内側側面が該一方の側面の傾斜角度と同一角度で傾斜した形状を有することを特徴とするＬＥＤ照明装置。 A board on which a plurality of LED elements are mounted; and a lighting device housing that houses the board,
The substrate has a shape in which at least one side surface is continuously inclined, and the lighting device housing has an inner side surface corresponding to one side surface of the substrate inclined at the same angle as the inclination angle of the one side surface. The LED lighting device characterized by having a shape. 前記基板と前記照明装置筐体との間に、前記基板が取り付けられ前記照明装置筐体に放熱する放熱部材を設け、前記放熱部材は、前記基板の一方の側面に対応する内側側面が該一方の側面の傾斜角度と同一角度で傾斜し、外側側面が前記照明装置筐体の内側側面の傾斜角度と同一角度で傾斜する形状を有することを特徴とする請求項１記載のＬＥＤ照明装置。   A heat dissipating member is provided between the substrate and the lighting device casing and the substrate is attached to dissipate heat to the lighting device casing, and the heat dissipating member has an inner side surface corresponding to one side surface of the substrate. The LED lighting device according to claim 1, wherein the LED lighting device has a shape that is inclined at the same angle as an inclination angle of the side surface of the lighting device, and an outer side surface is inclined at the same angle as an inclination angle of the inner side surface of the lighting device housing. 前記放熱部材は、外側側面に連続的に傾斜した複数のフィンを備え、前記照明装置筐体の内側側面には前記フィンの傾斜角度と同一角度で傾斜し、前記フィンが嵌合する溝部を備えることを特徴とする請求項２記載のＬＥＤ照明装置。   The heat dissipating member includes a plurality of fins that are continuously inclined on an outer side surface, and an inner side surface of the lighting device housing includes a groove portion that is inclined at the same angle as the inclination angle of the fin and into which the fin is fitted. The LED lighting device according to claim 2. 前記基板は、前記照明装置筐体の底面上にネジで固定され、前記ネジを前記基板に通す穴の形状が前記基板の挿入方向に長い長穴に形成されていることを特徴とする請求項１乃至３のいずれかに記載のＬＥＤ照明装置。   The board is fixed to the bottom surface of the luminaire housing with a screw, and a shape of a hole through which the screw passes through the board is formed as an elongated hole extending in the insertion direction of the board. The LED lighting device according to any one of 1 to 3. 前記基板は、前記放熱部材を介して前記照明装置筐体の底面上にネジで固定され、前記ネジを前記基板及び前記放熱部材に通す穴の形状が前記基板の挿入方向に長い長穴に形成されていることを特徴とする請求項２または３記載のＬＥＤ照明装置。   The substrate is fixed to the bottom surface of the lighting device housing with a screw through the heat radiating member, and the shape of a hole through which the screw passes through the substrate and the heat radiating member is formed as an elongated hole in the insertion direction of the substrate. The LED illumination device according to claim 2, wherein the LED illumination device is provided.
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