JP2010132849A5 - - Google Patents

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Publication number
JP2010132849A5
JP2010132849A5 JP2009044883A JP2009044883A JP2010132849A5 JP 2010132849 A5 JP2010132849 A5 JP 2010132849A5 JP 2009044883 A JP2009044883 A JP 2009044883A JP 2009044883 A JP2009044883 A JP 2009044883A JP 2010132849 A5 JP2010132849 A5 JP 2010132849A5
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Japan
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temperature
heat resistance
tan
evaluated
cured product
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Pending
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JP2009044883A
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Japanese (ja)
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JP2010132849A (en
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Priority to JP2009044883A priority Critical patent/JP2010132849A/en
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次に、実施例1〜4で得られた硬化物の耐熱性を下記の方法で評価した。
すなわち、得られた厚さ2mmの硬化物を55mm×10mmの大きさに切り出して試験片とし、粘弾性スペクトロメータ(DMS)(エスアイアイ・ナノテクノロジー(株)製「EXSTAR DMS6100」)を用いて、周波数1Hz、昇温速度2℃/分の条件で、25℃〜200℃の温度領域でtanδ(損失正接)を測定し、縦軸をtanδ、横軸を温度(℃)として動的粘弾性を示すグラフを得、そのピーク温度によって耐熱性を評価した。かかるピーク温度が高いほど、当該硬化物の耐熱性が高いことを意味する。
Next, the heat resistance of the cured products obtained in Examples 1 to 4 was evaluated by the following method.
That is, the obtained cured product having a thickness of 2 mm was cut into a size of 55 mm × 10 mm to obtain a test piece, and a viscoelastic spectrometer (DMS) (“EXSTAR DMS6100” manufactured by SII Nanotechnology Co., Ltd.) was used. , Tan δ (loss tangent) is measured in a temperature range of 25 ° C. to 200 ° C. under conditions of a frequency of 1 Hz and a temperature increase rate of 2 ° C./min, and the ordinate is tan δ and the horizontal axis is temperature (° C.). A graph showing viscoelasticity was obtained, and the heat resistance was evaluated by the peak temperature. The higher the peak temperature, the higher the heat resistance of the cured product.

JP2009044883A 2008-11-05 2009-02-26 Epoxy resin composition and method for producing cured material Pending JP2010132849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009044883A JP2010132849A (en) 2008-11-05 2009-02-26 Epoxy resin composition and method for producing cured material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008284696 2008-11-05
JP2009044883A JP2010132849A (en) 2008-11-05 2009-02-26 Epoxy resin composition and method for producing cured material

Publications (2)

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JP2010132849A JP2010132849A (en) 2010-06-17
JP2010132849A5 true JP2010132849A5 (en) 2012-03-08

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JP2009044883A Pending JP2010132849A (en) 2008-11-05 2009-02-26 Epoxy resin composition and method for producing cured material

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181384A1 (en) * 2017-03-31 2018-10-04 日立化成株式会社 Epoxy resin composition, curable resin composition and electronic component device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745533B2 (en) * 1986-02-19 1995-05-17 新技術事業団 Photosensitive resin and method for producing the same
JPH06316626A (en) * 1993-05-06 1994-11-15 Nippon Kayaku Co Ltd Transparent epoxy resin composition and its cured product
JP4569233B2 (en) * 2003-09-09 2010-10-27 チッソ株式会社 Thermosetting resin composition and cured film
JP4872358B2 (en) * 2005-10-20 2012-02-08 日立化成工業株式会社 Resin composition, optical member using the same, and method for producing the same
JP2007297451A (en) * 2006-04-28 2007-11-15 Sumitomo Chemical Co Ltd Methacrylic resin composition

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