JP2010118436A - Manufacturing method for module with built-in component - Google Patents

Manufacturing method for module with built-in component Download PDF

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JP2010118436A
JP2010118436A JP2008289688A JP2008289688A JP2010118436A JP 2010118436 A JP2010118436 A JP 2010118436A JP 2008289688 A JP2008289688 A JP 2008289688A JP 2008289688 A JP2008289688 A JP 2008289688A JP 2010118436 A JP2010118436 A JP 2010118436A
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resin layer
resin
convex portion
carrier
circuit component
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JP5200870B2 (en
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Masashi Arai
雅司 荒井
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a module with a built-in component that can form a hollow cavity by storing a circuit component therein without contacting with a resin layer while thinning the thickness of the resin layer. <P>SOLUTION: A carrier 30 is configured so that a protrusion 31 for forming a cavity and first electrodes 23, 24 are formed on the upper face while each first circuit component 25, 26 is formed on each electrode. An uncured resin layer 20 is pressure-bonded to the carrier and cured. Next, the carrier 30 is peeled off from the resin layer 20 so as to embed the circuit components 25, 26 into the resin layer 20 while a recess 21 is formed at the lower face of the resin layer 20. The resin layer 20 is bonded to a substrate 1, mounted with a second circuit component 5 via an adhesive layer 10, thereby storing the second circuit component 5 in a hollow cavity 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は部品内蔵モジュールの製造方法に関するものである。本発明でいう部品内蔵モジュールとは、樹脂層に部品が内蔵された部品内蔵層を少なくとも一層有するモジュールを意味し、複数の部品内蔵層を有したり、部品内蔵層の上下面に薄層（部品が内蔵されていない層）がビルトアップされたモジュールも含む。   The present invention relates to a method for manufacturing a component built-in module. The component built-in module in the present invention means a module having at least one component built-in layer in which a component is built in a resin layer, and has a plurality of component built-in layers or thin layers ( This includes modules with built-in layers that do not contain components.

従来、携帯電話、自動車電話などの無線機器やその他の各種通信機器に、回路部品を樹脂層の中に埋設した部品内蔵層を備えた部品内蔵モジュールが用いられている。この種の部品内蔵モジュールの製造方法として、特許文献１には、配線パターンを形成した基板に回路部品を実装した上で、未硬化の樹脂層を回路部品及び基板上に圧着し、樹脂層の内部に回路部品を埋設した後、樹脂層を硬化させ、その後で基板を剥離する方法が提案されている。   2. Description of the Related Art Conventionally, a component built-in module including a component built-in layer in which a circuit component is embedded in a resin layer is used in wireless devices such as mobile phones and automobile phones and other various communication devices. As a method of manufacturing this type of component built-in module, Patent Document 1 discloses that a circuit component is mounted on a substrate on which a wiring pattern is formed, and an uncured resin layer is pressure-bonded onto the circuit component and the substrate. A method has been proposed in which a circuit layer is embedded therein, the resin layer is cured, and then the substrate is peeled off.

絶縁性基板の内部に埋設される回路部品には、半導体集積回路のような集積回路素子のほか、フィルタ、コンデンサのような周辺受動部品もある。ところが、ＭＥＭＳ素子や弾性表面波素子のような回路部品は、樹脂層と接触すると特性が変化してしまうため、このような回路部品を樹脂層の内部に埋設することができない。そこで、樹脂層の内部に中空キャビティを形成し、この中空キャビティ内に回路部品を配置するようにした部品内蔵モジュールが特許文献２や３によって提案されている。   Circuit components embedded in the insulating substrate include not only integrated circuit elements such as semiconductor integrated circuits but also peripheral passive components such as filters and capacitors. However, characteristics of circuit components such as MEMS elements and surface acoustic wave elements change when they come into contact with the resin layer, and therefore such circuit components cannot be embedded in the resin layer. Therefore, Patent Documents 2 and 3 propose a component built-in module in which a hollow cavity is formed inside a resin layer and a circuit component is arranged in the hollow cavity.

図４は特許文献２に示された部品内蔵モジュールの製造方法を示す。開口部４１とビア４２とを有する未硬化の樹脂層４０を準備する一方、配線パターン４４を形成した転写フィルム４３を準備し、配線パターン４４に回路部品４５を実装する。次に、開口部４１が回路部品４５に対応するように、回路部品４５を実装した転写フィルム４３に対して未硬化の樹脂層４０を圧着し、配線パターン４４と樹脂層４０のビア４４とを接続させる。さらに、転写フィルム４３を未硬化の樹脂層４０から剥離する。その後、樹脂層４０の上下に未硬化の樹脂層４６，４７を圧着し、３層の樹脂層４０，４６，４７を同時に熱硬化させることで、開口部４１内に回路部品４５を収納した部品内蔵モジュールを得る。   FIG. 4 shows a method of manufacturing the component built-in module disclosed in Patent Document 2. An uncured resin layer 40 having openings 41 and vias 42 is prepared, while a transfer film 43 on which a wiring pattern 44 is formed is prepared, and a circuit component 45 is mounted on the wiring pattern 44. Next, the uncured resin layer 40 is pressure-bonded to the transfer film 43 on which the circuit component 45 is mounted so that the opening 41 corresponds to the circuit component 45, and the wiring pattern 44 and the via 44 of the resin layer 40 are connected. Connect. Further, the transfer film 43 is peeled from the uncured resin layer 40. Thereafter, the uncured resin layers 46 and 47 are pressure-bonded on the upper and lower sides of the resin layer 40, and the three resin layers 40, 46 and 47 are thermally cured at the same time, so that the circuit component 45 is accommodated in the opening 41. Get a built-in module.

この方法の場合、中央の樹脂層４０と上下の樹脂層４６，４７との間の気密性を確保するため、中央の樹脂層４０に対して上下の樹脂層４６，４７を強く圧着する必要がある。そのため、図５に示すように樹脂層に歪みが発生し、特に下側の樹脂層４７が開口部４１に向かって変形し、樹脂層４７が回路部品４５に接触する可能性がある。中央の樹脂層２０の厚みを十分に厚くすれば接触の恐れはなくなるが、これでは部品内蔵モジュールの厚みが厚くなるという欠点がある。また、図４の（ｂ）の段階で、回路部品４５は配線パターン４４だけで支持されているため、支持強度が非常に低く、図４の（ｃ）で樹脂層４６，４７と圧着した時に、配線パターン４４が断線する危険性がある。   In the case of this method, it is necessary to strongly press the upper and lower resin layers 46 and 47 against the central resin layer 40 in order to ensure airtightness between the central resin layer 40 and the upper and lower resin layers 46 and 47. is there. Therefore, as shown in FIG. 5, the resin layer is distorted. In particular, the lower resin layer 47 may be deformed toward the opening 41 and the resin layer 47 may contact the circuit component 45. If the thickness of the central resin layer 20 is sufficiently increased, there is no risk of contact, but this has the disadvantage that the thickness of the component built-in module is increased. In addition, since the circuit component 45 is supported only by the wiring pattern 44 at the stage of FIG. 4B, the support strength is very low, and when the resin parts 46 and 47 are pressure-bonded in FIG. There is a risk that the wiring pattern 44 is disconnected.

図６は特許文献３に示された部品内蔵モジュールの製造方法を示す。この方法は、まず硬化済みの基板５０の表裏面に配線パターン５１，５２を形成するとともに、表面の配線パターン５１に回路部品５３を実装する。次に、回路部品５３のバンプ部分に封止材５４を形成し、基板５０の表裏面に未硬化の樹脂層５５，５６を圧着する。基板５０の表面に圧着される樹脂層５５には予め凹部５５ａが形成されており、この凹部５５ａに回路部品５３が収納される。   FIG. 6 shows a method of manufacturing the component built-in module disclosed in Patent Document 3. In this method, wiring patterns 51 and 52 are first formed on the front and back surfaces of a cured substrate 50, and circuit components 53 are mounted on the wiring pattern 51 on the front surface. Next, a sealing material 54 is formed on the bump portion of the circuit component 53, and uncured resin layers 55 and 56 are pressure-bonded to the front and back surfaces of the substrate 50. A concave portion 55a is formed in advance in the resin layer 55 to be pressure-bonded to the surface of the substrate 50, and the circuit component 53 is accommodated in the concave portion 55a.

この場合は、硬化済みの基板５０の配線パターン５１に回路部品５３が実装されているので、その支持強度が低下することはない。しかし、未硬化の樹脂層５５を基板５０に対して圧着した際、図７に示すように凹部５５ａの底部が撓み、回路部品５３に接触する可能性がある。凹部５５ａの深さを十分に深くしておけば接触の可能性は低くなるが、それだけ樹脂層５５の厚みが厚くなるという欠点がある。
特開平１１−２２０２６２号公報 特開平１１−４５９５５号公報 特開２００４−３１６５１号公報 In this case, since the circuit component 53 is mounted on the wiring pattern 51 of the hardened substrate 50, the supporting strength does not decrease. However, when the uncured resin layer 55 is pressure-bonded to the substrate 50, the bottom of the recess 55a may bend and contact the circuit component 53 as shown in FIG. If the depth of the recess 55a is sufficiently deep, the possibility of contact is reduced, but there is a disadvantage that the thickness of the resin layer 55 is increased accordingly.
Japanese Patent Laid-Open No. 11-220262 Japanese Patent Laid-Open No. 11-45955 JP 2004-31651 A

本発明の目的は、樹脂層の厚みを薄くしながら、回路部品を樹脂層と接触させずに収納できる中空キャビティを形成できる部品内蔵モジュールの製造方法を提供することにある。   An object of the present invention is to provide a method of manufacturing a component built-in module capable of forming a hollow cavity that can accommodate a circuit component without contacting the resin layer while reducing the thickness of the resin layer.

本発明に係る部品内蔵モジュールの製造方法は、上面に、中空形成用凸部が形成されると共に、前記中空形成用凸部以外の領域に第１の電極が形成され、当該第１の電極に第１の回路部品が実装されたキャリアを用意する第１の工程と、前記中空形成用凸部及び前記第１の回路部品を被覆するように、前記キャリア上に樹脂層を形成し、当該樹脂層を硬化させる第２の工程と、硬化した前記樹脂層から前記中空形成用凸部と一体に前記キャリアを剥離することにより、前記中空形成用凸部によって前記樹脂層の下面側に凹部を形成すると共に、前記樹脂層に前記第１の電極及び第１の回路部品を転写する第３の工程と、上面に第２の電極が形成され、当該第２の電極上に第２の回路部品が実装された基板を用意する第４の工程と、前記樹脂層を未硬化状態の接着剤層を介して前記基板の上面に接合し、前記凹部の中に前記第２の回路部品を収納する第５の工程と、を備えることを特徴とする。   In the manufacturing method of the component built-in module according to the present invention, the hollow forming convex portion is formed on the upper surface, and the first electrode is formed in a region other than the hollow forming convex portion. A first step of preparing a carrier on which a first circuit component is mounted; and a resin layer is formed on the carrier so as to cover the hollow forming convex portion and the first circuit component, and the resin Forming a recess on the lower surface side of the resin layer by the hollow forming convex portion by peeling the carrier integrally with the hollow forming convex portion from the cured resin layer; And a third step of transferring the first electrode and the first circuit component to the resin layer, a second electrode is formed on the upper surface, and the second circuit component is formed on the second electrode. A fourth step of preparing a mounted substrate; and the resin layer Through an adhesive layer in an uncured state and joined to the upper surface of the substrate, characterized in that it comprises a fifth step of receiving said second circuit component in said recess.

まず、キャリア上に中空形成用凸部を形成すると共に、中空形成用凸部以外の領域に第１の電極を形成し、この電極に第１の回路部品を実装する。キャリアはＳＵＳ等の金属板でもよいし、樹脂フィルムでもよい。電極とは、回路部品を実装するための実装用ランドの他、ビア用ランド、ランド同士を相互に接続するための配線などを含んでもよいが、キャリアから樹脂層へ転写しやすくするため、銅箔などで形成するのがよい。第１の回路部品は、例えばチップコンデンサやチップ抵抗などの樹脂と接触しても特性が変化しないか、又は殆ど変化しない部品である。次に、中空形成用凸部及び第１の回路部品を被覆するように、キャリア上に樹脂層を形成し、この樹脂層を硬化させる。樹脂層の形成方法としては、例えば未硬化の熱硬化性樹脂シートを準備し、キャリア上に圧着・熱硬化させる方法を用いることができる。未硬化状態とは、例えばＢステージ状態が望ましい。これにより、樹脂層の樹脂が中空形成用凸部や第１の回路部品の周囲に隙間なく充填される。次に、硬化した樹脂層からキャリアを剥離する。その際、キャリアと中空形成用凸部とが一体に剥離されるように、中空形成用凸部と樹脂層との密着力を、キャリアと中空形成用凸部との密着力より弱く設定しておく必要がある。キャリアを剥離することにより、中空形成用凸部によって樹脂層の下面側に凹部が形成されると共に、樹脂層に第１の電極及び第１の回路部品が転写される。   First, a hollow forming convex portion is formed on the carrier, a first electrode is formed in a region other than the hollow forming convex portion, and a first circuit component is mounted on the electrode. The carrier may be a metal plate such as SUS or a resin film. In addition to mounting lands for mounting circuit components, the electrodes may include via lands, wiring for connecting lands to each other, etc. In order to facilitate transfer from the carrier to the resin layer, copper It is good to form with foil. The first circuit component is a component whose characteristics do not change or hardly change even when it comes into contact with a resin such as a chip capacitor or chip resistor. Next, a resin layer is formed on the carrier so as to cover the hollow forming convex portion and the first circuit component, and the resin layer is cured. As a method for forming the resin layer, for example, a method in which an uncured thermosetting resin sheet is prepared and press-bonded and thermoset on a carrier can be used. The uncured state is preferably, for example, a B stage state. As a result, the resin of the resin layer is filled without any gaps around the hollow forming convex portions and the first circuit component. Next, the carrier is peeled from the cured resin layer. At that time, the adhesion force between the hollow formation convex portion and the resin layer is set to be weaker than the adhesion force between the carrier and the hollow formation convex portion so that the carrier and the hollow formation convex portion are peeled together. It is necessary to keep. By peeling the carrier, a concave portion is formed on the lower surface side of the resin layer by the hollow forming convex portion, and the first electrode and the first circuit component are transferred to the resin layer.

次に、上面に第２の電極が形成され、当該電極上に第２の回路部品が実装された基板を用意する。基板としては、例えば樹脂製又はセラミック製の配線基板を使用することができる。第２の回路部品は、ＭＥＭＳ素子や弾性表面波素子のような樹脂層と接触すると特性が変化してしまう部品である。基板の上面に、下面側に凹部を形成した樹脂層を未硬化状態の接着剤層を介して接合することにより、中空キャビティの中に第２の回路部品が収納される。このようにして、基板と樹脂層との多層構造の部品内蔵モジュールが形成される。   Next, a substrate on which the second electrode is formed on the upper surface and the second circuit component is mounted on the electrode is prepared. As the substrate, for example, a resin or ceramic wiring substrate can be used. The second circuit component is a component whose characteristics change when it comes into contact with a resin layer such as a MEMS element or a surface acoustic wave element. By bonding a resin layer having a recess formed on the lower surface side to the upper surface of the substrate via an uncured adhesive layer, the second circuit component is accommodated in the hollow cavity. In this way, a component built-in module having a multilayer structure of the substrate and the resin layer is formed.

基板と樹脂層との接着に際して両者を圧着しても、樹脂層は既に硬化済みであるから、凹部が変形することがなく、第２の回路部品との接触を回避できる。凹部が変形しないので、樹脂層の厚みは中空キャビティを形成するための最小限の厚みでよく、部品内蔵モジュールを薄型に構成できる。   Even if the substrate and the resin layer are bonded together, the resin layer is already cured, so that the concave portion is not deformed, and contact with the second circuit component can be avoided. Since the concave portion is not deformed, the resin layer may have a minimum thickness for forming the hollow cavity, and the component built-in module can be made thin.

第１の工程において、中空形成用凸部は未硬化状態の樹脂ブロックであって、第２の工程において、樹脂層と共に樹脂ブロックを硬化させるようにしてもよい。すなわち、中空形成用凸部を未硬化状態の樹脂ブロックで形成した場合には、樹脂ブロック自体がタック性を持つので、接着剤などを必要とせずにキャリアに対して簡単に固定できる。そして、第２の工程において、樹脂層と樹脂ブロックとを同時に硬化させれば、硬化処理回数を少なくできると同時に、硬化によって樹脂ブロックをキャリアに強く固着させることができる。特に、樹脂ブロックと樹脂層とを同じ樹脂材料とした場合には、圧力に対する変形や熱硬化時の収縮率が同じになり、充填から硬化までの過程における樹脂ブロックと樹脂層との間の応力集中、変形、クラックなどを防止できる。   In the first step, the hollow forming convex portion is an uncured resin block, and in the second step, the resin block may be cured together with the resin layer. That is, when the hollow forming convex portion is formed of an uncured resin block, the resin block itself has tackiness and can be easily fixed to the carrier without requiring an adhesive or the like. In the second step, if the resin layer and the resin block are cured at the same time, the number of curing processes can be reduced, and at the same time, the resin block can be firmly fixed to the carrier by curing. In particular, when the resin block and the resin layer are made of the same resin material, the deformation due to pressure and the shrinkage rate at the time of thermosetting become the same, and the stress between the resin block and the resin layer in the process from filling to curing Concentration, deformation, cracks, etc. can be prevented.

第１の工程において、中空形成用凸部は硬化物であって、当該硬化物を接着剤によりキャリアに固定してもよい。硬化物としては、樹脂ブロック、金属ブロック、セラミックブロックなど何でもよい。   In the first step, the hollow forming convex portion is a cured product, and the cured product may be fixed to the carrier with an adhesive. The cured product may be anything such as a resin block, a metal block, or a ceramic block.

第１の工程において、中空形成用凸部はキャリアと一体に形成されているものとしてもよい。例えばキャリアが金属板で構成されている場合、その金属板の一部を凸状にプレス加工することで、中空形成用凸部を形成してもよい。また、キャリアが樹脂板で構成されている場合には、凸部を一体成形することもできる。   In the first step, the hollow forming convex portion may be formed integrally with the carrier. For example, when the carrier is formed of a metal plate, the hollow forming convex portion may be formed by pressing a part of the metal plate into a convex shape. Further, when the carrier is made of a resin plate, the convex portion can be integrally formed.

第２の工程の前に、中空形成用凸部の表面に離型処理が施されているのが望ましい。中空形成用凸部の表面に離型処理を施すことにより、凸部と硬化後の樹脂層との密着力を、凸部とキャリアとの密着力に比べて小さくでき、キャリアを剥離する際に凸部と樹脂層とを簡単に剥離できる。そのため、凹部の中に凸部の一部が残留するという問題がなく、安定した形状の凹部を形成できる。なお、離型処理は単に離型剤を塗布するだけでもよいし、両面で樹脂に対する密着強度が異なるもの、例えば片面離型処理を施されたＰＥＴフィルム等を貼り付けてもよい。また、中空形成用凸部として例えばフッ素樹脂を用いた場合、フッ素樹脂は金属に対する接着力に比べて樹脂に対する接着力が低いので、格別な離型処理を施すことなく、樹脂層との剥離が簡単になる。   Prior to the second step, it is desirable that a release treatment is performed on the surface of the hollow forming convex portion. By performing mold release treatment on the surface of the hollow forming convex part, the adhesive force between the convex part and the cured resin layer can be made smaller than the adhesive force between the convex part and the carrier. A convex part and a resin layer can be peeled easily. Therefore, there is no problem that a part of the convex portion remains in the concave portion, and a concave portion having a stable shape can be formed. The release treatment may be performed simply by applying a release agent, or a film having different adhesion strength to the resin on both sides, for example, a PET film subjected to a single-side release treatment may be attached. In addition, when a fluororesin is used as the hollow forming convex portion, for example, the fluororesin has a lower adhesive strength to the resin than the adhesive strength to the metal, so that it can be separated from the resin layer without performing a special release treatment. It will be easy.

中空形成用凸部は、その頂部から底部に向かって拡径するテーパ状としてもよい。中空形成用凸部の形状は、凹部の中に収容される第２の回路部品の形状に応じて任意に選定できるが、テーパ状とした場合には、キャリアを剥離する際に中空形成用凸部と樹脂層との剥離が容易になる。なお、ここでテーパ状とは円錐台形状のほか、角錐台形状であってもよい。   The hollow forming convex portion may have a tapered shape whose diameter increases from the top to the bottom. The shape of the hollow forming convex portion can be arbitrarily selected according to the shape of the second circuit component housed in the concave portion. However, in the case of a tapered shape, the hollow forming convex portion is removed when the carrier is peeled off. Separation between the portion and the resin layer becomes easy. Here, the tapered shape may be a truncated cone shape or a truncated pyramid shape.

以上のように、本発明に係る部品内蔵モジュールの製造方法によれば、中空部を必要とする回路部品と中空部を必要としない回路部品とを同じ樹脂層の中に配置できるので、高機能な部品内蔵モジュールを作成できる。また、キャリア上に中空形成用凸部を形成しておき、樹脂層の圧着後にキャリアを剥離するだけで中空部を形成できるので、中空部を形成するための格別な工程を必要とせず、工程を簡素化できる。樹脂層を基板と接合する段階で、樹脂層は既に硬化状態であるから、中空部が変形することがなく、第２の回路部品との接触を防止できると共に、樹脂層を薄くできる。   As described above, according to the method for manufacturing a component built-in module according to the present invention, a circuit component that requires a hollow portion and a circuit component that does not require a hollow portion can be arranged in the same resin layer, so that it has high functionality. Module with built-in parts. In addition, since the hollow portion can be formed by simply forming the hollow forming convex portion on the carrier and peeling the carrier after the resin layer is pressure-bonded, a special process for forming the hollow portion is not required. Can be simplified. Since the resin layer is already cured at the stage of bonding the resin layer to the substrate, the hollow portion is not deformed, and contact with the second circuit component can be prevented and the resin layer can be thinned.

以下に、本発明の好ましい実施の形態を、実施例を参照して説明する。   Hereinafter, preferred embodiments of the present invention will be described with reference to examples.

図１は本発明にかかる部品内蔵モジュールの第１実施例を示す。部品内蔵モジュールＡは、樹脂基板やセラミック基板などの絶縁性基板よりなるモジュール基板（基板）１を備えている。ここでは、モジュール基板１として単層構造の樹脂基板よりなるプリント配線板を用いたが、多層配線基板を用いてもよい。モジュール基板１の上面には電極（第２の電極）２〜４がパターン形成されている。このうち、モジュール基板１の左側の領域に形成された実装用電極２には第２の回路部品５が実装されている。第２の回路部品５は、圧電素子や弾性表面波素子のような樹脂層と接触すると特性が変化してしまう部品である。実装方法は、はんだ付け、導電性接着剤を用いた実装、バンプを用いたフリップチップ実装、プリコート実装など、如何なる方法でもよい。なお、モジュール基板１の下面に配線電極を形成し、上面の電極２〜４とビア導体を介して接続してもよい。   FIG. 1 shows a first embodiment of a component built-in module according to the present invention. The component built-in module A includes a module substrate (substrate) 1 made of an insulating substrate such as a resin substrate or a ceramic substrate. Here, a printed wiring board made of a resin substrate having a single-layer structure is used as the module substrate 1, but a multilayer wiring substrate may be used. Electrodes (second electrodes) 2 to 4 are patterned on the upper surface of the module substrate 1. Among these, the second circuit component 5 is mounted on the mounting electrode 2 formed in the left region of the module substrate 1. The second circuit component 5 is a component whose characteristics change when it comes into contact with a resin layer such as a piezoelectric element or a surface acoustic wave element. The mounting method may be any method such as soldering, mounting using a conductive adhesive, flip chip mounting using bumps, or precoat mounting. Note that a wiring electrode may be formed on the lower surface of the module substrate 1 and connected to the electrodes 2 to 4 on the upper surface via via conductors.

モジュール基板１の上面には、接着剤層１０を介して樹脂層２０が接着固定されている。接着剤層１０には、実装用電極２を取り囲む開口部１１が形成されており、電極３，４と対応する箇所には、厚み方向に貫通するビア導体１２，１３が形成されている。なお、この実施例では接着剤層１０にビア導体１２，１３を形成したが、省略してもよい。   A resin layer 20 is bonded and fixed to the upper surface of the module substrate 1 via an adhesive layer 10. An opening 11 surrounding the mounting electrode 2 is formed in the adhesive layer 10, and via conductors 12 and 13 penetrating in the thickness direction are formed at locations corresponding to the electrodes 3 and 4. In this embodiment, the via conductors 12 and 13 are formed in the adhesive layer 10, but may be omitted.

樹脂層２０は、例えば熱硬化性樹脂、熱硬化性樹脂と無機フィラーとの混合物、ガラス繊維に熱硬化性樹脂を含浸させた樹脂組成物等で構成されている。接着剤層１０と同質の材料とするのが望ましい。樹脂層２０の下面には、接着剤層１０の開口部１１と対応する位置に凹部２１が形成されており、接着剤１０の開口部１１と樹脂層２０の凹部２１とモジュール基板１とによって第２の回路部品５を封止する中空キャビティ２２が形成されている。凹部２１の側壁は、下方にむかって拡径するようにテーパ状に傾斜している。樹脂層２０の下面であって、接着剤層１０のビア導体１２，１３と対応する箇所には、電極（第１の電極）２３，２４が形成されている。電極２３，２４はビア導体１２，１３を介して電極３，４と接続されている。電極２３，２４上には第１の回路部品２５，２６がそれぞれ実装されている。第１の回路部品２５，２６は、樹脂層２０の中に埋設しても電気的特性が変化しないか、又は殆ど変化しない部品である。実装方法は回路部品２５，２６の特性に応じて任意に選択できる。   The resin layer 20 is made of, for example, a thermosetting resin, a mixture of a thermosetting resin and an inorganic filler, a resin composition in which a glass fiber is impregnated with a thermosetting resin, or the like. It is desirable to use the same material as the adhesive layer 10. A recess 21 is formed on the lower surface of the resin layer 20 at a position corresponding to the opening 11 of the adhesive layer 10, and the opening 11 of the adhesive 10, the recess 21 of the resin layer 20, and the module substrate 1 A hollow cavity 22 for sealing the second circuit component 5 is formed. The side wall of the recess 21 is inclined in a tapered shape so as to expand toward the bottom. Electrodes (first electrodes) 23 and 24 are formed on the lower surface of the resin layer 20 at locations corresponding to the via conductors 12 and 13 of the adhesive layer 10. The electrodes 23 and 24 are connected to the electrodes 3 and 4 through the via conductors 12 and 13. First circuit components 25 and 26 are mounted on the electrodes 23 and 24, respectively. The first circuit components 25 and 26 are components whose electrical characteristics do not change or hardly change even when embedded in the resin layer 20. The mounting method can be arbitrarily selected according to the characteristics of the circuit components 25 and 26.

次に、前記構成よりなる部品内蔵モジュールＡの製造方法の一例を、図２を参照して説明する。ここでは、子基板状態における部品内蔵モジュールＡの製造方法について説明するが、実際には子基板を複数個集合した集合基板状態で製造し、その後で子基板に分割する。   Next, an example of a manufacturing method of the component built-in module A having the above configuration will be described with reference to FIG. Here, the manufacturing method of the component built-in module A in the sub-board state will be described, but in actuality, it is manufactured in a collective board state in which a plurality of sub-boards are assembled and then divided into the sub-boards.

図２の（ａ）は第１工程を示し、上面に中空形成用凸部である樹脂ブロック３１を固定したキャリア３０を用意する。キャリア３０としては、例えばＳＵＳ等の薄肉な金属板を用いることができる。キャリア３０の樹脂ブロック３１以外の領域には、電極２３，２４が銅箔などによりパターン形成され、これら電極２３，２４上に第１の回路部品２５，２６が実装されている。樹脂ブロック３１は、例えば樹脂層２０と同じ樹脂材料を使用し、頂部から底部に向かって拡径するテーパ状に形成したものであり、この段階では未硬化であるのが望ましい。未硬化の樹脂ブロック３１を使用する場合、後述する未硬化の樹脂層２０を圧着した時に変形しないように、圧着時において樹脂層２０より硬い状態が望ましい。樹脂ブロック３１の表面には離型剤３２が塗布されている。   FIG. 2 (a) shows a first step, in which a carrier 30 having a resin block 31 as a hollow forming convex portion fixed on the upper surface is prepared. As the carrier 30, for example, a thin metal plate such as SUS can be used. In regions other than the resin block 31 of the carrier 30, the electrodes 23 and 24 are patterned with copper foil or the like, and the first circuit components 25 and 26 are mounted on the electrodes 23 and 24. The resin block 31 is formed by using the same resin material as that of the resin layer 20, for example, and is formed in a taper shape whose diameter increases from the top portion toward the bottom portion, and is preferably uncured at this stage. When the uncured resin block 31 is used, it is desirable that the resin block 20 is harder than the resin layer 20 so as not to be deformed when the uncured resin layer 20 described later is crimped. A release agent 32 is applied to the surface of the resin block 31.

図２の（ｂ）は第２工程を示し、樹脂ブロック３１及び第１の回路部品２５，２６を被覆するように、キャリア３０上に未硬化の樹脂層２０を圧着し、熱硬化させる。ここで未硬化とはＢステージ状態が望ましい。樹脂層２０を圧着することにより、樹脂材料が樹脂ブロック３１と第１の回路部品２５，２６の周囲に隙間なく充填され、電極２３，２４の表面にも密着する。そのため、第１の回路部品２５，２６は樹脂層２０の中に埋設される。樹脂層２０を熱硬化させる際、その熱で未硬化の樹脂ブロック３１も同時に熱硬化される。   FIG. 2B shows a second step, in which the uncured resin layer 20 is pressure-bonded on the carrier 30 so as to cover the resin block 31 and the first circuit components 25 and 26, and is thermally cured. Here, the uncured state is preferably a B-stage state. By press-bonding the resin layer 20, the resin material is filled around the resin block 31 and the first circuit components 25 and 26 without any gap, and is also in close contact with the surfaces of the electrodes 23 and 24. Therefore, the first circuit components 25 and 26 are embedded in the resin layer 20. When the resin layer 20 is thermally cured, the uncured resin block 31 is also thermally cured by the heat.

図２の（ｃ）は第３工程であり、硬化した樹脂層２０からキャリア３０を剥離する。このとき、キャリア３０の上面に形成された電極２３，２４が樹脂層２０に転写される。一方、樹脂ブロック３１の表面には離型剤３２が塗布されているので、樹脂ブロック３１と樹脂層２０との密着力は、樹脂ブロック３１とキャリア３０との密着力より弱く、さらに樹脂ブロック３１がテーパ状であるため、樹脂ブロック３１がキャリア３０と一体に樹脂層２０から剥離される。その結果、樹脂層２０の下面側に凹部２１が形成される。   FIG. 2C shows the third step, in which the carrier 30 is peeled from the cured resin layer 20. At this time, the electrodes 23 and 24 formed on the upper surface of the carrier 30 are transferred to the resin layer 20. On the other hand, since the release agent 32 is applied to the surface of the resin block 31, the adhesion force between the resin block 31 and the resin layer 20 is weaker than the adhesion force between the resin block 31 and the carrier 30. Is tapered, the resin block 31 is peeled from the resin layer 20 integrally with the carrier 30. As a result, a recess 21 is formed on the lower surface side of the resin layer 20.

図２の（ｄ）は第４工程であり、上面に電極２〜４がパターン形成され、その一部の電極２上に第２の回路部品５が実装されたモジュール基板１を準備する。このモジュール基板１の上に、未硬化の接着剤層１０を間にして硬化済みの樹脂層２０を積層接着する。接着剤層１０には、第２の回路部品５を取り囲む開口部１１が形成されているので、接着に際して開口部１１と第２の回路部品５とを位置合わせすることで、接着剤１０が第２の回路部品５に付着するのを防止できる。接着剤層１０には、モジュール基板１の電極３，４と対応する位置にビア導体１２，１３が形成されている。ビア導体１２，１３は、例えば接着剤層１０にビアホールを形成し、その中に導電ペーストを充填したものである。モジュール基板１の上に接着剤層１０を間にして樹脂層２０を接着する際、圧力を加えるが、樹脂層２０は硬化済みであるため、凹部２１が変形する心配がない。そのため、接着剤層１０の厚みと圧縮代を予め適切に設定しておけば、凹部２１の底面が第２の回路部品５に接触することがなく、樹脂層２０の厚みを必要最低限に薄くできる。   (D) of FIG. 2 is a 4th process, and prepares the module board 1 by which the electrodes 2-4 are pattern-formed on the upper surface, and the 2nd circuit component 5 was mounted on the one part electrode 2. FIG. A cured resin layer 20 is laminated and bonded onto the module substrate 1 with an uncured adhesive layer 10 therebetween. Since the opening 11 surrounding the second circuit component 5 is formed in the adhesive layer 10, the adhesive 10 is bonded to the first circuit component 5 by aligning the opening 11 and the second circuit component 5 during bonding. 2 can be prevented from adhering to the second circuit component 5. Via conductors 12 and 13 are formed in the adhesive layer 10 at positions corresponding to the electrodes 3 and 4 of the module substrate 1. For example, the via conductors 12 and 13 are formed by forming a via hole in the adhesive layer 10 and filling the conductive paste therein. When the resin layer 20 is bonded to the module substrate 1 with the adhesive layer 10 interposed therebetween, pressure is applied. However, since the resin layer 20 has been cured, there is no fear that the recess 21 is deformed. Therefore, if the thickness and the compression allowance of the adhesive layer 10 are appropriately set in advance, the bottom surface of the recess 21 does not come into contact with the second circuit component 5, and the thickness of the resin layer 20 is made as thin as necessary. it can.

図２の（ｅ）は第５工程であり、モジュール基板１、接着剤層１０及び樹脂層２０の積層接着後、加熱することにより、接着剤層１０の硬化とビア導体１２，１３の硬化とを同時に実施する。その結果、ビア導体１２，１３を介してモジュール基板１の電極３，４と樹脂層２０の電極２３，２４とが電気的に接続される。第２の回路部品５の周囲には、モジュール基板１と樹脂層２０の凹部２１と接着剤層１０の開口部１１とによって中空キャビティ２２が形成される。   (E) of FIG. 2 is the fifth step. After the module substrate 1, the adhesive layer 10 and the resin layer 20 are laminated and bonded, the adhesive layer 10 is cured and the via conductors 12 and 13 are cured by heating. At the same time. As a result, the electrodes 3 and 4 of the module substrate 1 and the electrodes 23 and 24 of the resin layer 20 are electrically connected via the via conductors 12 and 13. A hollow cavity 22 is formed around the second circuit component 5 by the module substrate 1, the recess 21 of the resin layer 20, and the opening 11 of the adhesive layer 10.

図３の（ａ）〜（ｃ）は、本発明における中空形成用凸部の他の実施例を示す。（ａ）は、キャリア３０の上にフッ素樹脂よりなる樹脂ブロック３３を固定した例である。キャリア３０上に樹脂層２０を圧着・硬化させた後、樹脂層２０をキャリア３０から剥離する際、フッ素樹脂は樹脂層２０との密着性が悪いので、離型剤を塗布しなくても樹脂ブロック３３は樹脂層２０から簡単に剥離する。   3A to 3C show another embodiment of the hollow forming convex portion in the present invention. (A) is an example in which a resin block 33 made of a fluororesin is fixed on the carrier 30. After the resin layer 20 is pressure-bonded / cured on the carrier 30, the fluororesin has poor adhesion to the resin layer 20 when the resin layer 20 is peeled off from the carrier 30. The block 33 is easily peeled off from the resin layer 20.

図３の（ｂ）は、キャリア３０の上に接着剤３４を介して金属ブロック３５を固定したものである。この場合には、接着剤３４の接着力が、樹脂層２０と金属ブロック３５との接着力より大きくなるように、接着剤３４を選定する必要がある。   FIG. 3B shows a structure in which a metal block 35 is fixed on a carrier 30 via an adhesive 34. In this case, it is necessary to select the adhesive 34 so that the adhesive force of the adhesive 34 is larger than the adhesive force between the resin layer 20 and the metal block 35.

図３の（ｃ）は、キャリア３０を金属板で作成し、この金属板３０にプレス加工によって凸部３６を一体に形成したものである。この場合には、キャリア３０に格別のブロックを接着しなくても、中空形成用凸部を形成できる。   In FIG. 3C, the carrier 30 is made of a metal plate, and the convex portion 36 is integrally formed on the metal plate 30 by pressing. In this case, the hollow forming convex portion can be formed without adhering a special block to the carrier 30.

本発明は前記実施例に限定されるものではない。本発明の部品内蔵モジュールは、モジュール基板１と接着剤層１０と樹脂層２０との３層構造に限るものではなく、樹脂層２０の上に別の樹脂層や配線基板が積層されてもよいし、モジュール基板１の下側に別の樹脂層や配線基板が積層されてもよい。   The present invention is not limited to the above embodiment. The component built-in module of the present invention is not limited to the three-layer structure of the module substrate 1, the adhesive layer 10, and the resin layer 20, and another resin layer or a wiring substrate may be laminated on the resin layer 20. Then, another resin layer or a wiring board may be laminated on the lower side of the module substrate 1.

本発明に係る部品内蔵モジュールの第１実施例の断面図である。It is sectional drawing of 1st Example of the component built-in module which concerns on this invention. 図１に示す部品内蔵モジュールの製造工程図である。It is a manufacturing-process figure of the component built-in module shown in FIG. 本発明に係る中空形成用凸部の他の実施例を示す断面図である。It is sectional drawing which shows the other Example of the convex part for hollow formation which concerns on this invention. 従来の部品内蔵モジュールの一例の製造工程図である。It is a manufacturing process figure of an example of the conventional component built-in module. 図４に示す製造工程における樹脂層の変形を示す図である。It is a figure which shows the deformation | transformation of the resin layer in the manufacturing process shown in FIG. 従来の部品内蔵モジュールの他の例の製造工程図である。It is a manufacturing process figure of the other example of the conventional component built-in module. 図６に示す製造工程における樹脂層の変形を示す図である。It is a figure which shows the deformation | transformation of the resin layer in the manufacturing process shown in FIG.

符号の説明Explanation of symbols

Ａ 部品内蔵モジュール
１ モジュール基板（基板）
２ 第２の電極
５ 第２の回路部品
１０ 接着剤層
１１ 開口部
２０ 樹脂層
２１ 凹部
２２ 中空キャビティ
２３，２４ 第１の電極
２５，２６ 第１の回路部品
３１ 樹脂ブロック
３２ 離型剤
３３ 樹脂ブロック（フッ素樹脂製）
３４ 接着剤
３５ 金属ブロック
３６ 凸部 A Component built-in module 1 Module board (board)
2 Second electrode 5 Second circuit component 10 Adhesive layer 11 Opening 20 Resin layer 21 Recess 22 Hollow cavity 23, 24 First electrode 25, 26 First circuit component 31 Resin block 32 Release agent 33 Resin Block (made of fluororesin)
34 Adhesive 35 Metal block 36 Projection

Claims (6)

上面に、中空形成用凸部が形成されると共に、前記中空形成用凸部以外の領域に第１の電極が形成され、当該第１の電極に第１の回路部品が実装されたキャリアを用意する第１の工程と、
前記中空形成用凸部及び前記第１の回路部品を被覆するように、前記キャリア上に樹脂層を形成し、当該樹脂層を硬化させる第２の工程と、
硬化した前記樹脂層から前記中空形成用凸部と一体に前記キャリアを剥離することにより、前記中空形成用凸部によって前記樹脂層の下面側に凹部を形成すると共に、前記樹脂層に前記第１の電極及び第１の回路部品を転写する第３の工程と、
上面に第２の電極が形成され、当該第２の電極上に第２の回路部品が実装された基板を用意する第４の工程と、
前記樹脂層を未硬化状態の接着剤層を介して前記基板の上面に接合し、前記凹部の中に前記第２の回路部品を収納する第５の工程と、を備える部品内蔵モジュールの製造方法。 Provided is a carrier in which a hollow forming convex portion is formed on the upper surface, a first electrode is formed in a region other than the hollow forming convex portion, and a first circuit component is mounted on the first electrode. A first step of:
A second step of forming a resin layer on the carrier so as to cover the hollow forming convex portion and the first circuit component, and curing the resin layer;
The carrier is peeled from the cured resin layer integrally with the hollow forming convex portion, whereby a concave portion is formed on the lower surface side of the resin layer by the hollow forming convex portion, and the first resin is formed on the resin layer. A third step of transferring the electrode and the first circuit component;
A fourth step of preparing a substrate on which the second electrode is formed and the second circuit component is mounted on the second electrode;
A fifth step of bonding the resin layer to the upper surface of the substrate via an uncured adhesive layer and storing the second circuit component in the recess. . 前記第１の工程において、前記中空形成用凸部は未硬化状態の樹脂ブロックであって、
前記第２の工程において、前記樹脂層と共に当該樹脂ブロックを硬化させることを特徴とする請求項１に記載の部品内蔵モジュールの製造方法。 In the first step, the hollow forming convex portion is an uncured resin block,
The method of manufacturing a component built-in module according to claim 1, wherein the resin block is cured together with the resin layer in the second step. 前記第１の工程において、前記中空形成用凸部は硬化物であって、当該硬化物は接着剤により前記キャリアに固定されていることを特徴とする請求項１に記載の部品内蔵モジュールの製造方法。   2. The component built-in module according to claim 1, wherein, in the first step, the hollow forming convex portion is a cured product, and the cured product is fixed to the carrier with an adhesive. Method. 前記第１の工程において、前記中空形成用凸部は前記キャリアと一体に形成されていることを特徴とする請求項１に記載の部品内蔵モジュールの製造方法。   2. The method of manufacturing a component built-in module according to claim 1, wherein, in the first step, the hollow forming convex portion is formed integrally with the carrier. 3. 前記第２の工程の前に、前記中空形成用凸部の表面に離型処理が施されていることを特徴とする請求項１ないし４のいずれか１項に記載の部品内蔵モジュールの製造方法。   5. The method of manufacturing a component built-in module according to claim 1, wherein a release treatment is performed on a surface of the hollow forming convex portion before the second step. 6. . 前記中空形成用凸部は、その頂部から底部に向かって拡径するテーパ状であることを特徴とする請求項１ないし５のいずれか１項に記載の部品内蔵モジュールの製造方法。   6. The method for manufacturing a component built-in module according to claim 1, wherein the hollow forming convex portion has a tapered shape whose diameter increases from a top portion toward a bottom portion.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011254047A (en) * 2010-06-04 2011-12-15 Denso Corp Electronic device manufacturing method
JP2014060433A (en) * 2013-11-20 2014-04-03 Denso Corp Manufacturing method of electronic device
US20150113802A1 (en) * 2013-05-16 2015-04-30 Murata Manufacturing Co., Ltd. Method of manufacturing resin multilayer substrate
JP2017505540A (en) * 2014-01-23 2017-02-16 クアルコム，インコーポレイテッド Substrate and method for forming substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368757A (en) * 1989-08-09 1991-03-25 Fuji Electric Co Ltd Production of optical sensor
JP2002261449A (en) * 2000-12-27 2002-09-13 Matsushita Electric Ind Co Ltd Module with built-in component and its manufacturing method
JP2003243797A (en) * 2002-02-19 2003-08-29 Matsushita Electric Ind Co Ltd Module component
JP2005150185A (en) * 2003-11-12 2005-06-09 Dainippon Printing Co Ltd Electronic device
JP2005268297A (en) * 2004-03-16 2005-09-29 Hitachi Media Electoronics Co Ltd High frequency device and its fabrication method
JP2006339365A (en) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd Wiring board, its manufacturing method, manufacturing method of multilayer laminated wiring board and forming method of via hole

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368757A (en) * 1989-08-09 1991-03-25 Fuji Electric Co Ltd Production of optical sensor
JP2002261449A (en) * 2000-12-27 2002-09-13 Matsushita Electric Ind Co Ltd Module with built-in component and its manufacturing method
JP2003243797A (en) * 2002-02-19 2003-08-29 Matsushita Electric Ind Co Ltd Module component
JP2005150185A (en) * 2003-11-12 2005-06-09 Dainippon Printing Co Ltd Electronic device
JP2005268297A (en) * 2004-03-16 2005-09-29 Hitachi Media Electoronics Co Ltd High frequency device and its fabrication method
JP2006339365A (en) * 2005-06-01 2006-12-14 Mitsui Mining & Smelting Co Ltd Wiring board, its manufacturing method, manufacturing method of multilayer laminated wiring board and forming method of via hole

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011254047A (en) * 2010-06-04 2011-12-15 Denso Corp Electronic device manufacturing method
US20150113802A1 (en) * 2013-05-16 2015-04-30 Murata Manufacturing Co., Ltd. Method of manufacturing resin multilayer substrate
US9894780B2 (en) * 2013-05-16 2018-02-13 Murata Manufacturing Co., Ltd. Method of manufacturing resin multilayer substrate
JP2014060433A (en) * 2013-11-20 2014-04-03 Denso Corp Manufacturing method of electronic device
JP2017505540A (en) * 2014-01-23 2017-02-16 クアルコム，インコーポレイテッド Substrate and method for forming substrate

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