JP2010113830A - Method for manufacturing flat display - Google Patents

Method for manufacturing flat display Download PDF

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JP2010113830A
JP2010113830A JP2008283174A JP2008283174A JP2010113830A JP 2010113830 A JP2010113830 A JP 2010113830A JP 2008283174 A JP2008283174 A JP 2008283174A JP 2008283174 A JP2008283174 A JP 2008283174A JP 2010113830 A JP2010113830 A JP 2010113830A
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substrate
sealing
sealing material
element substrate
frit
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Hironori Takabayashi
弘徳 高林
Tomohiro Matsui
智洋 松井
Shin Sakamoto
慎 坂本
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flat display with improved adhesion of a sealing material with a substrate without the use of mechanical pressurization. <P>SOLUTION: The method for manufacturing a flat display includes a process (Step S11) of sticking together an element substrate having a light-emitting element and a sealing substrate under a decompressed atmosphere, with the former inside, and with an interposition of a frame-shaped sealer surrounding the light-emitting element and a frame-shaped sealing material surrounding the sealer, a process (Step S13) of curing the sealing material positioned between the element substrate and the sealing substrate stuck together, and a process (Step S15) of sealing the light-emitting element by welding the sealer positioned between the element substrate having the sealing material cured and the sealing substrate under an atmospheric pressure. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、平面表示装置の製造方法に関する。   The present invention relates to a method for manufacturing a flat display device.

平面表示装置は、コンピュータディスプレイや携帯端末など、様々な装置で使用されている。この平面表示装置としては、例えば、有機ＥＬ（Electro Luminescence：エレクトロルミネッセンス）表示装置が開発されている。この有機ＥＬ表示装置は、液晶表示装置やプラズマ表示装置などよりも薄型化が可能であって、プラズマ表示装置と同様に自発光が可能な表示装置である。   The flat display device is used in various devices such as a computer display and a portable terminal. As this flat display device, for example, an organic EL (Electro Luminescence) display device has been developed. This organic EL display device can be made thinner than a liquid crystal display device, a plasma display device, or the like, and is a display device that can emit light in the same manner as the plasma display device.

平面表示装置においては、水分と酸素による発光素子の劣化を防止するため、封止基板と素子基板とが封止材であるフリット材により接合され、素子基板上の発光素子が封止される。このとき、基板とフリット材との密着性を向上させるため、加圧ジグなどの加圧機構により基板が機械的に加圧されながら、レーザ光がフリット材に照射されてフリット材と基板とが溶着される（例えば、特許文献１参照）。
特開２００３−１２３９６６号公報 In the flat display device, in order to prevent deterioration of the light emitting element due to moisture and oxygen, the sealing substrate and the element substrate are joined by a frit material as a sealing material, and the light emitting element on the element substrate is sealed. At this time, in order to improve the adhesion between the substrate and the frit material, laser light is applied to the frit material while the substrate is mechanically pressurized by a pressure mechanism such as a pressure jig, and the frit material and the substrate are separated from each other. It is welded (see, for example, Patent Document 1).
JP 2003-123966 A

しかしながら、前述のような機械的な加圧では、基板全体を均一に加圧することが困難であり、さらに、一枚のマザー基板から複数枚の基板を取る多面取り用の基板においては、フリット材の塗布パターン毎に加圧を行うために複数個の加圧機構が必要となり、装置重量の増加や機構の複雑化が生じてしまう。したがって、機械的な加圧を用いずに封止材と基板との密着性を向上させることが求められている。   However, it is difficult to press the entire substrate uniformly with the mechanical pressurization as described above. Further, in the case of a multi-sided substrate that takes a plurality of substrates from one mother substrate, a frit material is used. In order to perform pressurization for each coating pattern, a plurality of pressurizing mechanisms are required, resulting in an increase in apparatus weight and a complicated mechanism. Therefore, it is required to improve the adhesion between the sealing material and the substrate without using mechanical pressure.

本発明は上記に鑑みてなされたものであり、その目的は、機械的な加圧を用いずに封止材と基板との密着性を向上させることができる平面表示装置の製造方法を提供することである。   The present invention has been made in view of the above, and an object of the present invention is to provide a method for manufacturing a flat display device capable of improving the adhesion between a sealing material and a substrate without using mechanical pressure. That is.

本発明の実施の形態に係る第１の特徴は、平面表示装置の製造方法において、発光素子を有する素子基板と封止基板とを、発光素子を内側にし、発光素子を囲う枠形状の封止材及び封止材を囲う枠形状のシール材を間にして減圧雰囲気下で貼り合わせる工程と、貼り合わせた素子基板と封止基板との間に位置するシール材を大気圧雰囲気下で硬化させる工程と、シール材が硬化した素子基板と封止基板との間に位置する封止材を大気圧雰囲気下で溶着し、前記発光素子を封止する工程とを有することである。   A first feature according to an embodiment of the present invention is that, in a method for manufacturing a flat display device, a frame-shaped sealing that surrounds a light emitting element, with the element substrate having the light emitting element and the sealing substrate inside. A step of bonding in a reduced pressure atmosphere with a frame-shaped sealing material surrounding the sealing material and the sealing material, and curing the sealing material positioned between the bonded element substrate and the sealing substrate in an atmospheric pressure atmosphere And a step of welding a sealing material positioned between the element substrate on which the sealing material is cured and the sealing substrate in an atmospheric pressure atmosphere to seal the light emitting element.

本発明によれば、機械的な加圧を用いずに封止材と基板との密着性を向上させることができる。   According to the present invention, the adhesion between the sealing material and the substrate can be improved without using mechanical pressure.

本発明の実施の一形態について図面を参照して説明する。   An embodiment of the present invention will be described with reference to the drawings.

図１に示すように、本発明の実施の形態に係る平面表示装置の製造工程は、ガラス基板などの封止基板１上にフリット材１ａを枠形状に塗布して焼成するフリット塗布焼成工程と（図２参照）、複数の発光素子２ａを有する素子基板２上にシール材２ｂを枠形状に塗布するシール塗布工程と（図３参照）、フリット材１ａが焼成された封止基板１と、シール材１ｂが塗布された素子基板２とを貼り合わせる貼り合わせ工程と（図４及び図５参照）、貼り合わせ状態の封止基板１と素子基板２との間に位置する枠形状のフリット材１ａを素子基板２に溶着して各発光素子２ａを封止する封止工程と（図６参照）を有している。   As shown in FIG. 1, the manufacturing process of the flat display device according to the embodiment of the present invention includes a frit coating and baking process in which a frit material 1 a is applied in a frame shape on a sealing substrate 1 such as a glass substrate and then fired. (See FIG. 2), a seal application step of applying a sealing material 2b in a frame shape onto an element substrate 2 having a plurality of light emitting elements 2a (see FIG. 3), a sealing substrate 1 in which the frit material 1a is baked, A bonding step of bonding the element substrate 2 to which the sealing material 1b is applied (see FIGS. 4 and 5), and a frame-shaped frit material positioned between the sealing substrate 1 and the element substrate 2 in the bonded state A sealing step of sealing each light emitting element 2a by welding 1a to the element substrate 2 (see FIG. 6).

フリット塗布焼成工程では、図１及び図２に示すように、封止基板１がフリット塗布装置のステージ１１上に載置され（ステップＳ１）、その封止基板１上に封止材であるフリット材１ａがフリット塗布装置の塗布ヘッド１２により所定領域を囲むように枠形状に塗布され（ステップＳ２）、フリット材１ａ塗布済の封止基板１が焼成炉内に入れられて封止基板１上のフリット材１ａが焼成され（ステップＳ３）、最後に、フリット材１ａ焼成済みの封止基板１が反転される（ステップＳ４）。   In the frit coating and firing step, as shown in FIGS. 1 and 2, the sealing substrate 1 is placed on the stage 11 of the frit coating apparatus (step S1), and the frit serving as a sealing material is placed on the sealing substrate 1. The material 1a is coated in a frame shape so as to surround a predetermined region by the coating head 12 of the frit coating apparatus (step S2), and the sealing substrate 1 coated with the frit material 1a is placed in a firing furnace and placed on the sealing substrate 1. The frit material 1a is fired (step S3). Finally, the sealing substrate 1 that has been fired is inverted (step S4).

フリット塗布においては、フリット材１ａを吐出する塗布ヘッド１２がステージ１１上の封止基板１に対して相対移動し、基板貼り合わせ後にフリット材１ａが各発光素子２ａの全体の周囲を囲うように、すなわち各発光素子２ａの全体を囲う大きさの枠形状に封止基板１上に塗布される。   In frit coating, the coating head 12 that discharges the frit material 1a moves relative to the sealing substrate 1 on the stage 11, and the frit material 1a surrounds the entire periphery of each light emitting element 2a after the substrates are bonded together. That is, it is applied on the sealing substrate 1 in a frame shape having a size surrounding the entirety of each light emitting element 2a.

シール塗布工程では、図１及び図３に示すように、素子基板２がトランスファベッセルなどの搬送用容器に投入され（ステップＳ５）、その搬送用容器により素子基板２は真空中に維持されて搬送される（ステップＳ６）。その後、素子基板２は搬送用容器から取り出されてシール塗布装置のステージ２１上に載置され（ステップＳ７）、その素子基板２上にシール材２ｂがシール塗布装置の塗布ヘッド２２により所定領域を囲むように枠形状に塗布される（ステップＳ８）。   In the seal coating process, as shown in FIGS. 1 and 3, the element substrate 2 is put into a transfer container such as a transfer vessel (step S5), and the element substrate 2 is maintained in a vacuum by the transfer container and transferred. (Step S6). Thereafter, the element substrate 2 is taken out from the transport container and placed on the stage 21 of the seal coating device (step S7), and the sealing material 2b is placed on the element substrate 2 by the coating head 22 of the seal coating device. It is applied in a frame shape so as to surround (step S8).

このシール塗布においては、シール塗布装置内は窒素などの不活性ガス雰囲気に維持されており、シール材２ｂを吐出する塗布ヘッド２２はステージ２１上の素子基板２に対して相対移動し、基板貼り合わせ後にシール材２ｂが枠形状のフリット材１ａを囲うように、すなわち枠形状のフリット材１ａを囲う大きさの枠形状に素子基板２上に外周に沿って塗布される。シール材２ｂとしては、例えば、紫外線硬化性樹脂（ＵＶ硬化性樹脂）などの光硬化性樹脂が用いられる。   In this seal coating, the inside of the seal coating apparatus is maintained in an inert gas atmosphere such as nitrogen, and the coating head 22 that discharges the sealing material 2b moves relative to the element substrate 2 on the stage 21 to attach the substrate. After the alignment, the sealing material 2b is applied on the element substrate 2 along the outer periphery so as to surround the frame-shaped frit material 1a, that is, a frame shape having a size surrounding the frame-shaped frit material 1a. As the sealing material 2b, for example, a photocurable resin such as an ultraviolet curable resin (UV curable resin) is used.

なお、素子基板２には、有機発光素子膜やその素子膜に通電するための電極層などからなる発光素子（例えば、有機発光ダイオード（ＯＬＥＤ）素子）２ａを画素ごとに積層した有機ＥＬ回路が形成されている。発光素子２ａは水分や酸素により劣化するため、素子基板２は露点管理された不活性ガス雰囲気下や真空中で管理される必要がある。したがって、前述の基板搬送は真空中で行われており、前述のシール塗布は窒素などの不活性ガス雰囲気中で行われている。   The element substrate 2 includes an organic EL circuit in which a light-emitting element (for example, an organic light-emitting diode (OLED) element) 2a including an organic light-emitting element film and an electrode layer for energizing the element film is stacked for each pixel. Is formed. Since the light emitting element 2a is deteriorated by moisture or oxygen, the element substrate 2 needs to be managed in an inert gas atmosphere or a vacuum in which the dew point is controlled. Therefore, the above-described substrate conveyance is performed in a vacuum, and the above-described seal coating is performed in an inert gas atmosphere such as nitrogen.

貼り合わせ工程では、図１及び図４に示すように、シール材２ｂ塗布済みの素子基板２が貼り合わせ装置の減圧チャンバ３１内のステージ３２上に載置され、反転された封止基板１がそのステージ３２上の素子基板２に対向するように減圧チャンバ３１内に投入され（ステップＳ９）、減圧チャンバ３１内が真空引きにより減圧され（ステップＳ１０）、位置決め及び貼り合わせが行われる（ステップＳ１１）。   In the bonding step, as shown in FIGS. 1 and 4, the element substrate 2 coated with the sealing material 2 b is placed on the stage 32 in the decompression chamber 31 of the bonding apparatus, and the sealed sealing substrate 1 is inverted. The pressure reduction chamber 31 is placed so as to face the element substrate 2 on the stage 32 (step S9), the pressure reduction chamber 31 is depressurized by evacuation (step S10), and positioning and bonding are performed (step S11). ).

この貼り合わせにおいては、減圧チャンバ３１内は窒素（Ｎ２）雰囲気に維持されており、封止基板１はフリット材１ａが素子基板２に向けられて保持移動機構（図示せず）により保持されている。この保持移動機構は、保持した封止基板１をステージ３２に対して往復移動可能に形成されている。封止基板１及び素子基板２が減圧チャンバ３１内に投入された状態で、減圧チャンバ３１内の雰囲気が減圧ポンプ（図示せず）により吸引されて所定の真空圧まで減圧される。その後、封止基板１と素子基板２との位置合わせが行われ、封止基板１が保持移動機構によりステージ３２上の素子基板２に向かって移動し、窒素の減圧雰囲気中で封止基板１と素子基板２との貼り合わせが行われる。 In this bonding, the inside of the decompression chamber 31 is maintained in a nitrogen (N 2 ) atmosphere, and the sealing substrate 1 is held by a holding and moving mechanism (not shown) with the frit material 1 a facing the element substrate 2. ing. This holding and moving mechanism is formed so that the held sealing substrate 1 can be reciprocated with respect to the stage 32. In a state where the sealing substrate 1 and the element substrate 2 are put in the decompression chamber 31, the atmosphere in the decompression chamber 31 is sucked by a decompression pump (not shown) and decompressed to a predetermined vacuum pressure. Thereafter, alignment between the sealing substrate 1 and the element substrate 2 is performed, and the sealing substrate 1 is moved toward the element substrate 2 on the stage 32 by the holding and moving mechanism, and the sealing substrate 1 in a reduced-pressure atmosphere of nitrogen. And the element substrate 2 are bonded together.

貼り合わせ後、図１及び図５に示すように、減圧チャンバ３１内に窒素（Ｎ２）ガスが供給されて大気開放が行われ（ステップＳ１２）、貼り合わせ状態の封止基板１と素子基板２との間に位置する枠形状のシール材２ｂがＵＶ照射部３３のＵＶ照射により硬化し（ステップＳ１３）、シール材２ｂ硬化済の封止基板１及び素子基板２が減圧チャンバ３１外に取り出される（ステップＳ１４）。なお、シール材２ｂとして紫外線硬化樹脂と異なる光硬化性樹脂を用いた場合には、それを硬化可能な光を照射する光照射部がＵＶ照射部３３にかえて用いられる。 After bonding, as shown in FIGS. 1 and 5, nitrogen (N 2 ) gas is supplied into the decompression chamber 31 to release the atmosphere (step S12), and the bonded sealing substrate 1 and element substrate are bonded. 2 is cured by the UV irradiation of the UV irradiation unit 33 (step S13), and the sealing substrate 1 and the element substrate 2 cured with the sealing material 2b are taken out of the decompression chamber 31. (Step S14). In addition, when using photocurable resin different from ultraviolet curable resin as the sealing material 2b, the light irradiation part which irradiates the light which can harden it is used instead of the UV irradiation part 33.

このシール硬化工程により、枠形状のシール材２ｂが硬化し、そのシール材２ｂにより封止基板１と素子基板２とが接合され、さらに、封止基板１、素子基板２及びシール材２ｂにより形成される内部空間がシール材２ｂにより減圧状態で封止される。したがって、その後工程においては、シール材２ｂ硬化状態の封止基板１及び素子基板２を大気中にさらすことが可能となるので、後工程で真空や不活性ガスを用いるための複雑な装置を用いることなく、後工程の封止工程（フリット溶着工程）を大気中で行うことができ、その結果、製造を容易化することができる。   By this sealing curing process, the frame-shaped sealing material 2b is cured, the sealing substrate 1 and the element substrate 2 are joined by the sealing material 2b, and further formed by the sealing substrate 1, the element substrate 2 and the sealing material 2b. The internal space is sealed in a reduced pressure state by the sealing material 2b. Therefore, in the subsequent process, the sealing substrate 1 and the element substrate 2 cured with the sealing material 2b can be exposed to the atmosphere. Therefore, a complicated apparatus for using a vacuum or an inert gas is used in the subsequent process. Without this, the subsequent sealing step (frit welding step) can be performed in the atmosphere, and as a result, the manufacturing can be facilitated.

封止工程では、図１及び図６に示すように、シール材２ｂ硬化済の封止基板１及び素子基板２が大気雰囲気中で封止装置のステージ４１上に載置され、その状態でシール材２ｂ硬化状態の封止基板１と素子基板２との間に位置するフリット材１ａがレーザ照射部４２のレーザ照射により溶融されて素子基板２に接着され（ステップＳ１５）、貼り合わせ基板が完成する（ステップＳ１６）。このとき、封止基板１と素子基板２とはフリット材１ａ及びシール材２ｂにより接合されている。   In the sealing step, as shown in FIGS. 1 and 6, the sealing substrate 1 and the element substrate 2 cured with the sealing material 2b are placed on the stage 41 of the sealing device in the atmosphere, and the sealing is performed in this state. The frit material 1a located between the sealing substrate 1 in a cured state of the material 2b and the element substrate 2 is melted by the laser irradiation of the laser irradiation unit 42 and bonded to the element substrate 2 (step S15), and the bonded substrate is completed. (Step S16). At this time, the sealing substrate 1 and the element substrate 2 are joined by the frit material 1a and the sealing material 2b.

ここで、レーザ照射時には、シール材２ｂ硬化済の封止基板１及び素子基板２が大気圧により、封止基板１と素子基板２とが密着する方向に均一に加圧されており、その状態でレーザ照射が行われる（図６参照）。すなわち、封止基板１、素子基板２及びシール材２ｂにより形成される内部空間は減圧状態であるため、封止基板１及び素子基板２のパネル外面に作用する大気圧により、フリット材１ａが素子基板２に対して均一に密着する。この密着状態でフリット材１ａが素子基板２に溶着されて各発光素子２ａの封止が行われるので、素子基板２に対するフリット材１ａの溶着を確実に行うことができる。さらに、大気圧による加圧を行うので、素子基板２が多面取りのマザー基板である場合にも、一括封止を容易に行うことができる。   Here, at the time of laser irradiation, the sealing substrate 1 and the element substrate 2 cured with the sealing material 2b are uniformly pressurized in the direction in which the sealing substrate 1 and the element substrate 2 are in close contact with each other by the atmospheric pressure. Then, laser irradiation is performed (see FIG. 6). That is, since the internal space formed by the sealing substrate 1, the element substrate 2, and the sealing material 2b is in a reduced pressure state, the frit material 1a is caused to be generated by the atmospheric pressure acting on the panel outer surfaces of the sealing substrate 1 and the element substrate 2. It adheres uniformly to the substrate 2. Since the frit material 1a is welded to the element substrate 2 and the light emitting elements 2a are sealed in this tight contact state, the frit material 1a can be reliably welded to the element substrate 2. Furthermore, since pressurization by atmospheric pressure is performed, even when the element substrate 2 is a multi-sided mother substrate, collective sealing can be easily performed.

以上説明したように、本発明の実施の形態によれば、封止基板１と素子基板２とを、各発光素子２ａを内側にし、それらの発光素子２ａを囲う枠形状のフリット材１ａ及びそのフリット材１ａを囲う枠形状のシール材２ｂを間にして減圧雰囲気下で貼り合わせ、貼り合わせた封止基板１と素子基板２との間に位置するシール材２ｂを大気圧雰囲気下で硬化させ、シール材２ｂが硬化した封止基板１と素子基板２との間に位置する封止材１ａを大気圧雰囲気下で溶着して各発光素子２ａを封止することによって、封止材１ａの溶着を行う際には、シール材２ｂ硬化済の封止基板１及び素子基板２は大気圧により密着する方向に均一に加圧される。すなわち、封止基板１、素子基板２及びシール材２ｂにより形成される内部空間は減圧状態であるため、封止基板１及び素子基板２のパネル外面に作用する大気圧によりフリット材１ａが素子基板２に均一に密着する。この密着状態でフリット材１ａが溶融されて封止が行われるので、フリット材１ａは素子基板２に確実に固着することになる。   As described above, according to the embodiment of the present invention, the sealing substrate 1 and the element substrate 2 are arranged so that each light emitting element 2a is inside, and the frame-shaped frit material 1a surrounding the light emitting elements 2a and its The frame-shaped sealing material 2b surrounding the frit material 1a is bonded in a reduced pressure atmosphere, and the sealing material 2b positioned between the bonded sealing substrate 1 and element substrate 2 is cured in an atmospheric pressure atmosphere. By sealing the light emitting element 2a by welding the sealing material 1a located between the sealing substrate 1 and the element substrate 2 where the sealing material 2b is cured in an atmospheric pressure atmosphere, When welding is performed, the sealing substrate 1 and the element substrate 2 cured with the sealing material 2b are uniformly pressed in a direction in which they are in close contact with each other under atmospheric pressure. That is, since the internal space formed by the sealing substrate 1, the element substrate 2, and the sealing material 2b is in a reduced pressure state, the frit material 1a is moved to the element substrate by the atmospheric pressure acting on the panel outer surfaces of the sealing substrate 1 and the element substrate 2. 2 evenly. Since the frit material 1a is melted and sealed in this close contact state, the frit material 1a is securely fixed to the element substrate 2.

このようにして、素子基板２に対してフリット材１ａを確実に密着させることが可能になるので、機械的な加圧を用いずにフリット材１ａと素子基板２との密着性を向上させることができる。したがって、加圧機構を必要とせず、貼り合わせ基板全体を均一に加圧することができ、さらに、多面取り用のマザー基板に対しても、フリット材１ａの塗布パターン毎に加圧を行うための複数個の加圧機構を必要とせず、装置重量の増加や機構の複雑化を抑えることができる。   In this way, the frit material 1a can be reliably adhered to the element substrate 2, so that the adhesion between the frit material 1a and the element substrate 2 can be improved without using mechanical pressure. Can do. Therefore, it is possible to uniformly press the entire bonded substrate without requiring a pressurizing mechanism, and also to pressurize the frit material 1a for each application pattern of the multi-sided mother substrate. A plurality of pressurizing mechanisms are not required, and an increase in apparatus weight and a complicated mechanism can be suppressed.

また、封止工程前に、封止基板１、素子基板２及びシール材２ｂにより形成される内部空間はシール材２ｂにより減圧状態で封止されることから、その後工程では、シール材２ｂ硬化状態の封止基板１及び素子基板２を大気中にさらすことが可能となる。これにより、後工程の封止工程を大気中で行うことが可能となり、さらに、真空や不活性ガスを用いるための複雑な装置を用いる必要がなくなるので、製造を容易化することができ、加えて、製造コストを抑えることができる。   In addition, since the internal space formed by the sealing substrate 1, the element substrate 2, and the sealing material 2b is sealed in a reduced pressure state by the sealing material 2b before the sealing step, the sealing material 2b is cured in the subsequent process. The sealing substrate 1 and the element substrate 2 can be exposed to the atmosphere. As a result, it becomes possible to perform the subsequent sealing step in the atmosphere, and further, since it is not necessary to use a complicated apparatus for using a vacuum or an inert gas, the manufacturing can be facilitated. Manufacturing costs can be reduced.

また、フリット材１ａに加え枠形状のシール材２ｂにより封止基板１と素子基板２とが接合されていることから、封止基板１と素子基板２の接合力が向上するので、衝撃による破損を抑え、製品の信頼性をより向上させることができる。   Further, since the sealing substrate 1 and the element substrate 2 are bonded to each other by the frame-shaped sealing material 2b in addition to the frit material 1a, the bonding force between the sealing substrate 1 and the element substrate 2 is improved. And the reliability of the product can be further improved.

なお、本発明は、前述の実施の形態に限るものではなく、その要旨を逸脱しない範囲において種々変更可能である。例えば、前述の実施の形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施の形態に亘る構成要素を適宜組み合わせてもよい。   The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention. For example, some components may be deleted from all the components shown in the above-described embodiment. Furthermore, you may combine the component covering different embodiment suitably.

前述の実施の形態においては、フリット材１ａを封止基板１上に塗布し、シール材２ｂを素子基板２上に塗布しているが、これに限るものではなく、例えば、シール材２ｂを封止基板１上に塗布し、フリット材１ａを素子基板２上に塗布してもよく、あるいは、フリット材１ａ及びシール材２ｂの両方を封止基板１上又は素子基板２上に塗布するようにしてもよい。   In the above-described embodiment, the frit material 1a is applied on the sealing substrate 1 and the sealing material 2b is applied on the element substrate 2. However, the present invention is not limited to this. For example, the sealing material 2b is sealed. The frit material 1a may be applied onto the element substrate 2 by coating on the stop substrate 1, or both the frit material 1a and the sealing material 2b may be applied onto the sealing substrate 1 or the element substrate 2. May be.

ただし、シール材２ｂが塗布される基板は、貼り合わせ時にステージ３２上に載置される基板である方が好ましいが、シール材２ｂが基板反転により垂れない粘性を有している場合には、どちらでもよい。また、貼り合わせ時には、封止基板１及び素子基板２のどちらを反転させて貼り合わせを行ってもよい。   However, the substrate to which the sealing material 2b is applied is preferably a substrate placed on the stage 32 at the time of bonding, but when the sealing material 2b has a viscosity that does not sag due to substrate reversal, either will do. Further, at the time of bonding, either the sealing substrate 1 or the element substrate 2 may be reversed to perform the bonding.

また、前述の実施の形態においては、フリット材１ａ及びシール材２ｂを基板上に塗布する塗布方式を採用しているが、これに限るものではなく、例えば、フリット材１ａ及びシール材２ｂを基板上に印刷する印刷方式を採用してもよい。   In the above-described embodiment, the application method of applying the frit material 1a and the sealing material 2b onto the substrate is employed. However, the present invention is not limited to this. For example, the frit material 1a and the sealing material 2b are applied to the substrate. You may employ | adopt the printing system printed on top.

本発明の実施の形態に係る平面表示装置の製造工程を説明するための説明図である。It is explanatory drawing for demonstrating the manufacturing process of the flat display apparatus which concerns on embodiment of this invention. 図１に示す製造工程におけるフリット塗布焼成工程を説明するための説明図である。It is explanatory drawing for demonstrating the frit application | coating baking process in the manufacturing process shown in FIG. 図１に示す製造工程におけるシール塗布工程を説明するための説明図である。It is explanatory drawing for demonstrating the seal | sticker application | coating process in the manufacturing process shown in FIG. 図１に示す製造工程における貼り合わせ工程の一部を説明するための説明図である。It is explanatory drawing for demonstrating a part of bonding process in the manufacturing process shown in FIG. 図１に示す製造工程における貼り合わせ工程の一部を説明するための説明図である。It is explanatory drawing for demonstrating a part of bonding process in the manufacturing process shown in FIG. 図１に示す製造工程における封止工程を説明するための説明図である。It is explanatory drawing for demonstrating the sealing process in the manufacturing process shown in FIG.

符号の説明Explanation of symbols

１…封止基板、１ａ…封止材（フリット材）、２…素子基板、２ａ…発光素子、２ｂ…シール材   DESCRIPTION OF SYMBOLS 1 ... Sealing substrate, 1a ... Sealing material (frit material), 2 ... Element substrate, 2a ... Light emitting element, 2b ... Sealing material

Claims (1)

発光素子を有する素子基板と封止基板とを、前記発光素子を内側にし、前記発光素子を囲う枠形状の封止材及び前記封止材を囲う枠形状のシール材を間にして減圧雰囲気下で貼り合わせる工程と、
貼り合わせた前記素子基板と前記封止基板との間に位置する前記シール材を大気圧雰囲気下で硬化させる工程と、
前記シール材が硬化した前記素子基板と前記封止基板との間に位置する前記封止材を大気圧雰囲気下で溶着し、前記発光素子を封止する工程と、
を有することを特徴とする平面表示装置の製造方法。 An element substrate having a light-emitting element and a sealing substrate are placed in a reduced pressure atmosphere with the light-emitting element inside and a frame-shaped sealing material surrounding the light-emitting element and a frame-shaped sealing material surrounding the sealing material in between. The process of pasting together,
Curing the sealing material located between the bonded element substrate and the sealing substrate in an atmospheric pressure atmosphere;
Sealing the light emitting element by welding the sealing material located between the element substrate and the sealing substrate cured with the sealing material in an atmospheric pressure atmosphere;
A method of manufacturing a flat display device.
JP2008283174A 2008-11-04 2008-11-04 Method for manufacturing flat display Pending JP2010113830A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012096930A (en) * 2010-10-29 2012-05-24 Hamamatsu Photonics Kk Glass welding method
JP2015032393A (en) * 2013-07-31 2015-02-16 株式会社フジクラ Manufacturing device for base material assembly
JP2017208549A (en) * 2017-05-24 2017-11-24 株式会社フジクラ Manufacturing apparatus of substrate assembly
JP2018006349A (en) * 2011-06-16 2018-01-11 株式会社半導体エネルギー研究所 Sealing body and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007140061A (en) * 2005-11-17 2007-06-07 Samsung Sdi Co Ltd Manufacturing method for flat panel display, flat panel display, and panel of flat panel display

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007140061A (en) * 2005-11-17 2007-06-07 Samsung Sdi Co Ltd Manufacturing method for flat panel display, flat panel display, and panel of flat panel display

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012096930A (en) * 2010-10-29 2012-05-24 Hamamatsu Photonics Kk Glass welding method
JP2018006349A (en) * 2011-06-16 2018-01-11 株式会社半導体エネルギー研究所 Sealing body and method for manufacturing the same
JP2015032393A (en) * 2013-07-31 2015-02-16 株式会社フジクラ Manufacturing device for base material assembly
JP2017208549A (en) * 2017-05-24 2017-11-24 株式会社フジクラ Manufacturing apparatus of substrate assembly

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