JP2010108996A - Expanding device and expanding method - Google Patents

Expanding device and expanding method Download PDF

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JP2010108996A
JP2010108996A JP2008276905A JP2008276905A JP2010108996A JP 2010108996 A JP2010108996 A JP 2010108996A JP 2008276905 A JP2008276905 A JP 2008276905A JP 2008276905 A JP2008276905 A JP 2008276905A JP 2010108996 A JP2010108996 A JP 2010108996A
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adhesive sheet
adherend
concave groove
expanding
stage
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JP5435925B2 (en
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Takahisa Yoshioka
孝久 吉岡
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Lintec Corp
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Lintec Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an expanding device that cuts an adherend W stuck on an adhesive sheet S into a plurality of small pieces WT and expands the adhesive sheet S to form gaps between those small pieces WT, the expanding device eliminating the need for a troublesome setting operation for machine components, being compact, and having a simple structure. <P>SOLUTION: The expanding device has a stage 1 where an adherent W is mounted with the adhesive sheet S interposed. On a surface of the stage 1, a recessed groove 11 is formed at a position where an area of the adhesive sheet S projecting from an outer edge of the adherend W is mounted, and the adhesive sheet S is sucked into the recessed groove 11 by a suction means 2 to expand the adhesive sheet S positioned inside the recessed groove 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、接着シートに貼付された半導体ウエハ等の被着体を複数の小片に切断し、この接着シートを引き伸ばしてこれら小片間に間隙を形成するエキスパンド装置及びエキスパンド方法に関する。   The present invention relates to an expanding apparatus and an expanding method for cutting an adherend such as a semiconductor wafer attached to an adhesive sheet into a plurality of small pieces and stretching the adhesive sheet to form a gap between the small pieces.

半導体の製造工程の１つとして、ダイシング工程後に行われるボンディング工程がある。ダイシング工程では、接着シートを介してリングフレームと一体化された半導体ウエハ(以下、単に「ウエハ」という)を複数の半導体チップ(以下、単に「チップ」という)に切断する。また、ボンディング工程では、エキスパンド装置を用いて接着シートを引き伸ばすことにより、チップ間に間隙を形成し、この状態で１個ずつチップをピックアップして、回路基板の所定位置にチップをボンディングする作業が行われる。   As one of semiconductor manufacturing processes, there is a bonding process performed after a dicing process. In the dicing process, a semiconductor wafer (hereinafter simply referred to as “wafer”) integrated with the ring frame via an adhesive sheet is cut into a plurality of semiconductor chips (hereinafter simply referred to as “chips”). Also, in the bonding process, an adhesive sheet is stretched using an expanding device to form a gap between the chips. In this state, the chip is picked up one by one and the chip is bonded to a predetermined position on the circuit board. Done.

従来、このようなエキスパンド装置として、特許文献１に記載のものが知られている。このエキスパンド装置は、筒状のエキスパンドリングと、プレスリングと、プレスリングに螺挿される複数本のボルトと、これらボルトの締付け装置とを備えている。そして、エキスパンドリングの上に接着シートを載置してからリングフレーム上にプレスリングを載せ、ボルトを締付けることによってエキスパンドが行われ、チップ間に間隙が形成される。
特開平９−１９０９８８号公報 Conventionally, as such an expanding apparatus, the one described in Patent Document 1 is known. The expanding device includes a cylindrical expanding ring, a press ring, a plurality of bolts screwed into the press ring, and a tightening device for these bolts. Then, the adhesive sheet is placed on the expand ring, the press ring is placed on the ring frame, and the bolts are tightened to perform expansion, thereby forming a gap between the chips.
JP-A-9-190988

上記従来例のエキスパンド装置は、プレスリングやボルト締付け装置等が必要になり、装置が大型化する不具合がある。また、エキスパンドリングに接着シートを載置した後に、プレスリング及びボルトから成る機械部品をセットする必要があって、このセット作業に手間がかかる不具合もある。   The conventional expanding device requires a press ring, a bolt tightening device, and the like, and there is a problem that the device becomes large. In addition, after placing the adhesive sheet on the expanding ring, it is necessary to set a mechanical part composed of a press ring and a bolt, and there is a problem that this setting work is troublesome.

本発明は、以上の点に鑑み、手間のかかる機械部品のセット作業を不要とした、小型で簡単構造のエキスパンド装置及びエキスパンド方法を提供することをその課題としている。   In view of the above points, an object of the present invention is to provide a small and simple expanding device and an expanding method that do not require labor-intensive setting of machine parts.

上記課題を解決するために、請求項１記載のエキスパンド装置は、被着体の外縁からはみ出る大きさの接着シートに貼付された被着体を複数の小片に切断し、前記接着シートを引き伸ばしてこれら小片間に間隙を形成するエキスパンド装置であって、前記接着シートを前記被着体との間に挟んで当該被着体を載置するステージと、前記被着体の外縁からはみ出た接着シート領域が載置されるステージの表面に形成された凹溝と、前記凹溝に吸引力を付与する吸引手段とからなり、前記凹溝は、吸引手段によって付与された吸引力によって凹溝内に接着シートを吸引して凹溝よりも内方に位置する接着シートを引き伸ばすことを特徴とする。   In order to solve the above-described problem, the expanding device according to claim 1 is configured to cut an adherend attached to an adhesive sheet having a size protruding from an outer edge of the adherend into a plurality of small pieces, and stretch the adhesive sheet. An expanding apparatus for forming a gap between the small pieces, a stage on which the adherend is placed with the adhesive sheet sandwiched between the adherend, and an adhesive sheet protruding from an outer edge of the adherend A groove formed on the surface of the stage on which the region is placed, and suction means for applying a suction force to the groove. The groove is formed in the groove by the suction force applied by the suction means. The adhesive sheet is sucked to stretch the adhesive sheet positioned inward of the groove.

また、上記エキスパンド装置においては、前記凹溝の内縁に、前記接着シートが滑り易い低摩擦部材が設けられていてもよい。   Moreover, in the said expand apparatus, the low friction member with which the said adhesive sheet can slip easily may be provided in the inner edge of the said ditch | groove.

更に、上記エキスパンド装置においては、前記凹溝の外縁に、前記接着シートが滑り難い高摩擦部材が設けられていてもよい。   Further, in the expanding apparatus, a high friction member that is difficult to slip the adhesive sheet may be provided on an outer edge of the concave groove.

また、上記エキスパンド装置においては、前記小片間の距離を計測する測長手段と、この測長手段の計測データに基づいて前記吸引手段の吸引力を調整する制御手段とを備えていてもよい。   The expanding device may further include length measuring means for measuring the distance between the small pieces and control means for adjusting the suction force of the suction means based on measurement data of the length measuring means.

更に、上記エキスパンド装置においては、前記凹溝よりも内方に位置する接着シートを吸引する第２の吸引手段を備えていてもよい。   Furthermore, the expanding device may include a second suction unit that sucks an adhesive sheet positioned inward of the concave groove.

また、上記エキスパンド装置において、前記凹溝は、前記被着体を間に挟んで直交２軸方向の両側に設けられていてもよい。   Moreover, the said expansion apparatus WHEREIN: The said ditch | groove may be provided in the both sides of the orthogonal biaxial direction on both sides of the said to-be-adhered body.

また、上記課題を解決するために、請求項７記載のエキスパンド方法は、被着体の外縁からはみ出る大きさの接着シートに貼付された被着体を複数の小片に切断し、前記接着シートを引き伸ばしてこれら小片間に間隙を形成するエキスパンド方法であって、前記接着シートが間に挟まれるように前記被着体をステージに載置する工程と、前記被着体の外縁からはみ出た接着シート領域が載置されるステージの表面に形成した凹溝を吸引し、当該凹溝内に接着シートを吸引して凹溝よりも内方に位置する接着シートを引き伸ばす工程とを備えることを特徴とする。   In order to solve the above-mentioned problem, the expanding method according to claim 7, the adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend is cut into a plurality of small pieces, and the adhesive sheet is An expanding method for forming a gap between the small pieces by stretching, the step of placing the adherend on a stage so that the adhesive sheet is sandwiched therebetween, and an adhesive sheet protruding from the outer edge of the adherend A step of sucking a concave groove formed on the surface of the stage on which the region is placed, sucking the adhesive sheet into the concave groove, and stretching the adhesive sheet positioned inward of the concave groove, To do.

本発明のエキスパンド装置及びエキスパンド方法においては、凹溝内に接着シートを吸引して引き込むことにより、凹溝よりも内方に位置する接着シート、即ち、接着シートの被着体が貼付された領域が引き伸ばされ、被着体の切断で得られた複数の小片間に間隙が形成される。そして、本発明では、基本的にステージと吸引手段とを備えていれば足り、プレスリングやボルト締付け装置といった機械設備が不要になり、装置構造が簡単で小型になる。更に、ステージに接着シートを載置した後に、機械部品をセットする必要がなく、作業性も向上する。   In the expanding device and the expanding method of the present invention, the adhesive sheet positioned inside the concave groove, that is, the adherend of the adhesive sheet is pasted by sucking and drawing the adhesive sheet into the concave groove. Is stretched, and a gap is formed between a plurality of small pieces obtained by cutting the adherend. In the present invention, it is basically sufficient to provide a stage and suction means, and mechanical equipment such as a press ring and a bolt fastening device is not required, and the device structure is simple and small. Furthermore, it is not necessary to set mechanical parts after placing the adhesive sheet on the stage, and workability is improved.

また、凹溝の内縁に、低摩擦部材が設けられていれば、凹溝よりも内方に位置する接着シートを効率良く引き伸ばすことができる。   Moreover, if the low friction member is provided in the inner edge of the ditch | groove, the adhesive sheet located inside rather than a ditch | groove can be extended efficiently.

更に、凹溝の外縁に、高摩擦部材が設けられていれば、凹溝よりも外方に位置する接着シートが凹溝内に引き込まれることを抑制し、凹溝よりも内方に位置する接着シートを一層効率良く引き伸ばすことができる。   Furthermore, if a high friction member is provided on the outer edge of the groove, the adhesive sheet positioned outward from the groove is prevented from being pulled into the groove, and is positioned inward from the groove. The adhesive sheet can be stretched more efficiently.

また、上記測長手段と上記制御手段とを備えていれば、小片間の距離が所要値になるように、接着シートを引き伸ばすことができる。   Further, if the length measuring means and the control means are provided, the adhesive sheet can be stretched so that the distance between the small pieces becomes a required value.

更に、上記第２の吸引手段を備えていれば、小片をピックアップする際に、接着シートが小片と一緒に引っ張られてステージの表面から浮き上がることを防止でき、ピックアップ作業を作業性良く行うことができる。   Furthermore, if the second suction means is provided, when picking up the small piece, the adhesive sheet can be prevented from being lifted from the surface of the stage by being pulled together with the small piece, and the pick-up operation can be performed with good workability. it can.

また、凹溝が被着体を間に挟んで直交２軸方向両側に設けられていれば、それぞれ１軸方向ごとに独立して接着シートを引き伸ばすことができる。   In addition, if the concave grooves are provided on both sides of the orthogonal biaxial direction with the adherend interposed therebetween, the adhesive sheet can be stretched independently for each axial direction.

図１は、本発明の実施形態のエキスパンド装置を示し、図２は、その平面図を示している。このエキスパンド装置は、接着シートＳを介してリングフレームＲＦと一体化された被着体たるウエハＷがダイシングされて複数の小片たるチップＷＴに切断された後、接着シートＳを引き伸ばしてチップＷＴ間に間隙を形成する。   FIG. 1 shows an expanding apparatus according to an embodiment of the present invention, and FIG. 2 shows a plan view thereof. In this expanding apparatus, a wafer W as an adherend integrated with the ring frame RF is diced through an adhesive sheet S and cut into a plurality of small chips WT, and then the adhesive sheet S is stretched between the chips WT. A gap is formed in

エキスパンド装置は、接着シートＳをウエハＷとの間に挟んでウエハＷとリングフレームＲＦとを載置するステージ１と、ステージ１の表面に形成した凹溝１１と、凹溝１１に吸引力を付与して当該凹溝１１内に接着シートＳを引き込む吸引手段２と、凹溝１１よりも内方に位置する接着シートＳを吸引する第２の吸引手段３と、チップＷＴ間の距離を計測する測長手段４と、測長手段４の計測データに基づいて吸引手段２の吸引力を調整する制御手段５とを備えている。   The expanding apparatus has a stage 1 on which the wafer W and the ring frame RF are placed with the adhesive sheet S sandwiched between the wafer W, a groove 11 formed on the surface of the stage 1, and a suction force applied to the groove 11. Measuring the distance between the tip WT, the suction means 2 for applying and drawing the adhesive sheet S into the concave groove 11, the second suction means 3 for sucking the adhesive sheet S located inward of the concave groove 11 And a control means 5 for adjusting the suction force of the suction means 2 based on the measurement data of the length measurement means 4.

ステージ１の表面には、図２に示すように、ウエハＷからはみ出た接着シート領域が載置される位置に、平面視円環状の凹溝１１が形成されている。凹溝１１の内縁には、接着シートＳが滑り易いように、断面視で湾曲し、フッ素加工を施した低摩擦部材１２が設けられている。また、各凹溝１１の外縁には、接着シートＳが滑り難いように、表面に接着シートＳが引っ掛るような微細な凹凸を付けた高摩擦部材１３が設けられている。尚、これら部材１２、１３は、ステージ１に直接加工を施して形成してもよい。   On the surface of the stage 1, as shown in FIG. 2, an annular concave groove 11 is formed at a position where the adhesive sheet region protruding from the wafer W is placed. At the inner edge of the concave groove 11, a low friction member 12 that is curved in a sectional view and subjected to fluorine processing is provided so that the adhesive sheet S can be easily slipped. Moreover, the high friction member 13 which attached | subjected the fine unevenness | corrugation which the adhesive sheet S catches on the surface is provided in the outer edge of each concave groove 11 so that the adhesive sheet S cannot slip easily. These members 12 and 13 may be formed by processing the stage 1 directly.

吸引手段２は、凹溝１１及び凹溝１１よりも外方の接着シートＳが載置されるステージ１の表裏に貫通する多数の吸引孔２１と、ステージ１の裏面に固定した裏板１４で画成され吸引孔２１に連通する吸引室２２と、吸引室２２と吸引ポンプ２４とを接続する吸引管２３と、吸引管２３に介設した開閉バルブ２５とで構成されている。   The suction means 2 includes a plurality of suction holes 21 penetrating the front and back of the stage 1 on which the adhesive sheet S outside the concave grooves 11 and the concave grooves 11 are placed, and a back plate 14 fixed to the back surface of the stage 1. A suction chamber 22 that is defined and communicates with the suction hole 21, a suction pipe 23 that connects the suction chamber 22 and the suction pump 24, and an open / close valve 25 interposed in the suction pipe 23.

第２の吸引手段３は、凹溝１１よりも内方のステージ１に形成したステージ１の表裏に貫通する多数の吸引孔３１と、ステージ１の裏面に固定した裏板１４で画成され吸引孔３１に連通する吸引室３２と、吸引室３２と吸引ポンプ２４とを接続する吸引管３３と、吸引管３３に介設した開閉バルブ３４とで構成されている。尚、図２では、図面簡略化のため吸引孔２１、３１を省略している。   The second suction means 3 is defined by a number of suction holes 31 penetrating through the front and back of the stage 1 formed in the stage 1 inside the concave groove 11 and the back plate 14 fixed to the back surface of the stage 1 for suction. A suction chamber 32 that communicates with the hole 31, a suction pipe 33 that connects the suction chamber 32 and the suction pump 24, and an open / close valve 34 that is interposed in the suction pipe 33. In FIG. 2, the suction holes 21 and 31 are omitted for simplification of the drawing.

測長手段４は、ステージ１上のウエハＷを撮像するカメラ４１と、カメラ４１に接続された画像処理回路４２とで構成されている。そして、カメラ４１で撮像したウエハＷの画像を画像処理回路４２で処理し、チップＷＴ間の距離を計測する。   The length measuring means 4 includes a camera 41 that captures an image of the wafer W on the stage 1 and an image processing circuit 42 connected to the camera 41. Then, the image of the wafer W taken by the camera 41 is processed by the image processing circuit 42, and the distance between the chips WT is measured.

制御手段５は、画像処理回路４２からの計測データが入力されるパーソナルコンピュータやシーケンサ等から成るコントローラ５１で構成されている。コントローラ５１は、測長手段４で計測されたチップＷＴ間の距離に基づいて開閉バルブ２５の開度を制御し、吸引孔２１に作用する負圧、即ち、吸引手段２の吸引力をチップＷＴ間の距離が所要値になるように制御する。また、コントローラ５１は、吸引ポンプ２４及び開閉バルブ３４も制御する。   The control means 5 is composed of a controller 51 composed of a personal computer, a sequencer or the like to which measurement data from the image processing circuit 42 is input. The controller 51 controls the opening degree of the opening / closing valve 25 based on the distance between the chips WT measured by the length measuring means 4, and the negative pressure acting on the suction hole 21, that is, the suction force of the suction means 2 is controlled by the chip WT. Control the distance between them to the required value. The controller 51 also controls the suction pump 24 and the opening / closing valve 34.

次に、本実施形態のエキスパンド装置を用い、接着シートＳを引き伸ばしてチップＷＴ間に間隙を形成する動作について説明する。   Next, an operation of stretching the adhesive sheet S to form a gap between the chips WT using the expanding apparatus of the present embodiment will be described.

先ず、接着シートＳを介してリングフレームＲＦと一体化される共に、ダイシングによって複数のチップＷＴに個片化されたウエハＷを、図外の搬送手段により、図１に示す如く、接着シートＳが下方に位置するように、即ち、接着シートＳをウエハＷとの間に挟んでステージ１に載置する。   First, the wafer W integrated with the ring frame RF through the adhesive sheet S and separated into a plurality of chips WT by dicing is transferred to the adhesive sheet S as shown in FIG. Is placed on the stage 1 so that the adhesive sheet S is sandwiched between the wafer W and the adhesive sheet S.

次に、開閉バルブ３４は閉弁させた状態で、開閉バルブ２５を開弁する。すると、吸引室２２が吸引ポンプ２４に連通して吸引孔２１に負圧が作用し、図３に示す如く、凹溝１１よりも外方に位置する接着シートＳの外縁部分がステージ１の表面に吸引されると共に、凹溝１１上に位置する接着シートＳが凹溝１１内に吸引されて引き込まれる。そして、凹溝１１内への接着シートＳの引き込みに伴い、凹溝１１よりも内方に位置する接着シートＳ、即ち、接着シートＳのウエハＷが貼付された部分が引き伸ばされ、チップＷＴ間に間隙が形成される。そして、測長手段４によりチップＷＴ間の距離が計測され、この計測データに基づいてコントローラ５１により開閉バルブ２５が制御され、計測されたチップＷＴ間の距離が所要値になるように吸引力が調整される。   Next, the open / close valve 25 is opened with the open / close valve 34 closed. Then, the suction chamber 22 communicates with the suction pump 24 and negative pressure acts on the suction hole 21, and the outer edge portion of the adhesive sheet S located outside the concave groove 11 is located on the surface of the stage 1 as shown in FIG. The adhesive sheet S located on the concave groove 11 is sucked into the concave groove 11 and drawn. As the adhesive sheet S is pulled into the concave groove 11, the adhesive sheet S located inward of the concave groove 11, that is, the portion of the adhesive sheet S to which the wafer W is attached is stretched, and between the chips WT. A gap is formed. Then, the distance between the chips WT is measured by the length measuring means 4, and the opening / closing valve 25 is controlled by the controller 51 based on this measurement data, and the suction force is adjusted so that the measured distance between the chips WT becomes a required value. Adjusted.

尚、本実施形態では、凹溝１１の内縁に、低摩擦部材１２が設けられているため、凹溝１１よりも内方に位置する接着シートＳを効率良く凹溝１１内へ引き込んで当該領域を引き伸ばすことができる。更に、凹溝１１の外縁に高摩擦部材１３が設けられているため、凹溝１１よりも外方に位置する接着シートＳの外縁部分が凹溝１１内に引き込まれることを抑制して、凹溝１１よりも内方に位置する接着シートＳのみを一層効率良く引き伸ばすことができる。   In the present embodiment, since the low friction member 12 is provided at the inner edge of the groove 11, the adhesive sheet S positioned inward of the groove 11 can be efficiently drawn into the groove 11. Can be stretched. Furthermore, since the high friction member 13 is provided on the outer edge of the groove 11, the outer edge portion of the adhesive sheet S positioned outward from the groove 11 is suppressed from being pulled into the groove 11. Only the adhesive sheet S positioned inward of the groove 11 can be stretched more efficiently.

チップＷＴ間の距離が所要値になって、これが測長手段４で検出されると、コントローラ５１により開閉バルブ３４が開弁される。これにより、吸引孔３１に負圧が作用して凹溝１１よりも内方に位置する接着シートＳが吸引される。そして、この状態で図外のピックアップ装置により１個ずつチップＷＴをピックアップして、図外の回路基板の所定位置にチップＷＴをボンディングする。   When the distance between the chips WT reaches a required value and this is detected by the length measuring means 4, the controller 51 opens the on-off valve 34. As a result, a negative pressure acts on the suction hole 31, and the adhesive sheet S positioned inward from the concave groove 11 is sucked. In this state, the chips WT are picked up one by one by a pickup device (not shown), and the chips WT are bonded to predetermined positions on the circuit board (not shown).

本実施形態によれば、上記従来例のようなプレスリングやボルト締付け装置といった大型の機械設備が不要となり、装置構造が簡単で小型になる。更に、ステージ１に接着シートＳを載置した後に、上記従来例のようにプレスリングやボルトといった機械部品をセットする必要がなく、作業性も向上する。   According to the present embodiment, a large-scale mechanical facility such as a press ring and a bolt tightening device as in the conventional example is not required, and the device structure is simple and small. Further, after the adhesive sheet S is placed on the stage 1, it is not necessary to set mechanical parts such as a press ring and a bolt as in the conventional example, and workability is improved.

以上、本発明の実施形態について図面を参照して説明したが、本発明はこれに限定されない。例えば、図４に示すように、ダイシングにおけるウエハＷの切断方向（直交２軸方向）をＸ軸方向及びＹ軸方向として、ウエハＷのＸ軸方向両外側のステージ１の表面に、Ｙ軸方向に平行な２本の凹溝１１Ｘと、ウエハＷのＹ軸方向両外側のステージ１の表面に、Ｘ軸方向に平行な２本の凹溝１１Ｙとを形成し、凹溝１１Ｘと凹溝１１Ｙとを独立して減圧できるように吸引室２２を独立して設け、それぞれの吸引室２２に吸引管２３と開閉バルブ２５とを設けてもよい。このような構成とすることで、チップＷＴ間の距離をＸ軸方向とＹ軸方向とで独立して制御することができ、例えば、Ｘ軸方向の間隔のみ広げたい場合、凹溝１１Ｘの吸引力を大きくすればよいし、Ｘ軸方向の間隔を広げた後に、Ｙ軸方向の間隔を広げることもできる。   As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, as shown in FIG. 4, the cutting direction (two orthogonal directions) of the wafer W in dicing is defined as the X-axis direction and the Y-axis direction. Are formed on the surface of the stage 1 on both outer sides of the wafer W in the Y-axis direction, and the two grooves 11Y parallel to the X-axis direction are formed. The suction chambers 22 may be provided independently, and the suction pipes 23 and the open / close valves 25 may be provided in the respective suction chambers 22. With such a configuration, the distance between the chips WT can be controlled independently in the X-axis direction and the Y-axis direction. For example, when it is desired to increase only the interval in the X-axis direction, the suction of the concave groove 11X is possible. What is necessary is just to enlarge force, and after expanding the space | interval of the X-axis direction, the space | interval of the Y-axis direction can also be expanded.

また、接着シートＳとして紫外線硬化型のものを用い、ステージ１に載置する前に接着シートＳに紫外線を照射するように構成してもよい。更に、凹溝１１よりも内方のステージ１の表面部分に窪みを形成してもよい。これによれば、凹溝１１よりも内方に位置する接着シートＳが、ステージ１からの摩擦抵抗を受けずに容易に引き伸ばされるようになる。   Alternatively, the adhesive sheet S may be of an ultraviolet curable type and may be configured to irradiate the adhesive sheet S with ultraviolet rays before being placed on the stage 1. Furthermore, you may form a hollow in the surface part of the stage 1 inward rather than the ditch | groove 11. FIG. According to this, the adhesive sheet S positioned inward from the concave groove 11 is easily stretched without receiving frictional resistance from the stage 1.

また、接着シートＳの外縁部分の吸引やリングフレームＲＦは必要不可欠ではない。例えば、接着シートＳの外縁部分をステージ１の表面に押圧してクランプするクランプ部材を設けてもよい。   Further, suction of the outer edge portion of the adhesive sheet S and the ring frame RF are not indispensable. For example, a clamp member that presses and clamps the outer edge portion of the adhesive sheet S against the surface of the stage 1 may be provided.

更に、低摩擦部材１２は、樹脂や鏡面加工された金属部材等、接着シートＳとの相性に応じて適宜変更が可能である。また、高摩擦部材１３は、樹脂や金属部材に接着シートＳが引っ掛り易い微細な凹凸加工を施したり、ゴムや粘着剤等を用いて接着シートＳとの相性に応じて適宜変更が可能である。   Furthermore, the low friction member 12 can be appropriately changed according to the compatibility with the adhesive sheet S, such as a resin or a mirror-finished metal member. In addition, the high friction member 13 can be appropriately modified depending on the compatibility with the adhesive sheet S using a rubber or a pressure sensitive adhesive or the like by giving a resin or a metal member a fine unevenness that allows the adhesive sheet S to be easily caught. is there.

また、上記実施形態は、ウエハＷのダイシング工程後に使用するエキスパンド装置に本発明を適用したものであるが、例えば、ガラス板、鋼板、陶器、木板または樹脂板等のウエハ以外の被着体を接着シートに貼付した状態で複数の小片に切断した後、接着シートを引き伸ばして小片間に間隙を形成するエキスパンド装置にも本発明は広く適用できる。更に、半導体ウエハは、シリコンウエハや化合物ウエハであってもよい。   Moreover, although the said embodiment applies this invention to the expanding apparatus used after the dicing process of the wafer W, for example, adherends other than wafers, such as a glass plate, a steel plate, earthenware, a wooden board, or a resin board, are attached. The present invention can also be widely applied to an expanding apparatus that cuts a plurality of small pieces in a state of being attached to the adhesive sheet and then stretches the adhesive sheet to form a gap between the small pieces. Further, the semiconductor wafer may be a silicon wafer or a compound wafer.

本発明の実施形態のエキスパンド装置を示す切断側面図。The cutting | disconnection side view which shows the expand apparatus of embodiment of this invention. 実施形態のエキスパンド装置のステージを示す平面図。The top view which shows the stage of the expanding apparatus of embodiment. 実施形態のエキスパンド装置の作動状態の切断側面図。The cut side view of the operation state of the expanding apparatus of an embodiment. 他の実施形態のエキスパンド装置のステージを示す平面図。The top view which shows the stage of the expand apparatus of other embodiment.

符号の説明Explanation of symbols

Ｓ…接着シート、Ｗ…ウエハ(被着体)、ＷＴ…チップ(小片)、１…ステージ、１１…凹溝、１２…低摩擦部材、１３…高摩擦部材、２…吸引手段、３…第２の吸引手段、４…測長手段、５…制御手段。

DESCRIPTION OF SYMBOLS S ... Adhesive sheet, W ... Wafer (to-be-adhered body), WT ... Chip (small piece), 1 ... Stage, 11 ... Groove, 12 ... Low friction member, 13 ... High friction member, 2 ... Suction means 2 suction means, 4 ... length measuring means, 5 ... control means.

Claims (7)

被着体の外縁からはみ出る大きさの接着シートに貼付された被着体を複数の小片に切断し、前記接着シートを引き伸ばしてこれら小片間に間隙を形成するエキスパンド装置であって、
前記接着シートを前記被着体との間に挟んで当該被着体を載置するステージと、
前記被着体の外縁からはみ出た接着シート領域が載置されるステージの表面に形成された凹溝と、
前記凹溝に吸引力を付与する吸引手段とからなり、
前記凹溝は、吸引手段によって付与された吸引力によって凹溝内に接着シートを吸引して凹溝よりも内方に位置する接着シートを引き伸ばすことを特徴とするエキスパンド装置。 An expanding device that cuts an adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend into a plurality of small pieces, and stretches the adhesive sheet to form a gap between the small pieces,
A stage on which the adherend is placed with the adhesive sheet sandwiched between the adherend,
A concave groove formed on the surface of the stage on which the adhesive sheet region protruding from the outer edge of the adherend is placed;
A suction means for applying a suction force to the concave groove,
The expanding apparatus is characterized in that the concave groove sucks the adhesive sheet into the concave groove by the suction force applied by the suction means and stretches the adhesive sheet positioned inward of the concave groove. 前記凹溝の内縁に、前記接着シートが滑り易い低摩擦部材が設けられていることを特徴とする請求項１記載のエキスパンド装置。   The expanding device according to claim 1, wherein a low friction member on which the adhesive sheet easily slips is provided at an inner edge of the concave groove. 前記凹溝の外縁に、前記接着シートが滑り難い高摩擦部材が設けられていることを特徴とする請求項１又は２記載のエキスパンド装置。   The expanding device according to claim 1, wherein a high friction member that prevents the adhesive sheet from slipping is provided on an outer edge of the concave groove. 前記小片間の距離を計測する測長手段と、この測長手段の計測データに基づいて前記吸引手段の吸引力を調整する制御手段とを備えることを特徴とする請求項１〜３の何れか１項記載のエキスパンド装置。   The length measuring means for measuring the distance between the small pieces and the control means for adjusting the suction force of the suction means based on the measurement data of the length measuring means are provided. The expanding apparatus according to 1. 前記凹溝よりも内方に位置する接着シートを吸引する第２の吸引手段を備えることを特徴とする請求項１〜４の何れか１項記載のエキスパンド装置。   The expanding apparatus according to claim 1, further comprising a second suction unit that sucks an adhesive sheet positioned inward of the concave groove. 前記凹溝は、前記被着体を間に挟んで直交２軸方向の両側に設けられていることを特徴とする請求項１〜５の何れか１項記載のエキスパンド装置。 The expanding device according to any one of claims 1 to 5, wherein the concave grooves are provided on both sides in the orthogonal biaxial direction with the adherend interposed therebetween. 被着体の外縁からはみ出る大きさの接着シートに貼付された被着体を複数の小片に切断し、前記接着シートを引き伸ばしてこれら小片間に間隙を形成するエキスパンド方法であって、
前記接着シートが間に挟まれるように前記被着体をステージに載置する工程と、
前記被着体の外縁からはみ出た接着シート領域が載置されるステージの表面に形成した凹溝を吸引し、当該凹溝内に接着シートを吸引して凹溝よりも内方に位置する接着シートを引き伸ばす工程とを備えることを特徴とするエキスパンド方法。

An expanding method of cutting an adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend into a plurality of small pieces and stretching the adhesive sheet to form a gap between the small pieces,
Placing the adherend on a stage so that the adhesive sheet is sandwiched therebetween;
Adhesion located inside the concave groove by sucking the concave groove formed on the surface of the stage on which the adhesive sheet region protruding from the outer edge of the adherend is placed, and sucking the adhesive sheet into the concave groove An expanding method comprising: a step of stretching the sheet.

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