JP2010080079A - Lighting fixture for vehicle - Google Patents

Lighting fixture for vehicle Download PDF

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JP2010080079A
JP2010080079A JP2008243736A JP2008243736A JP2010080079A JP 2010080079 A JP2010080079 A JP 2010080079A JP 2008243736 A JP2008243736 A JP 2008243736A JP 2008243736 A JP2008243736 A JP 2008243736A JP 2010080079 A JP2010080079 A JP 2010080079A
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light source
semiconductor
type light
heat sink
reflector
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JP5035564B2 (en
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Hiroto Tokunaga
裕人 徳永
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Ichikoh Industries Ltd
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Ichikoh Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting fixture for vehicle capable of accurately attaching a semiconductor light source on a light-source attachment face of a heat sink member. <P>SOLUTION: The semiconductor light source 10 has its substrate 10A positioned on the light source attachment face 21 of a heat sink member 20 by being pinched in a back-and-forth direction with a rear-side stopper 30R set in protrusion on the light source attachment face 21 and a U-shaped leaf spring 31. The leaf spring 31 is pressed into an insertion-coupling hole 28 of the light source attachment face 21 with its own elasticity, and a top-end terminal of a front-side spring piece 31a is locked to an underside of a power-feeding member 40 to press down and fix the semiconductor light source 10 from above to be fixed in an anti-pull-off state. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、自動車のヘッドランプを始めとして、リヤコンビネーションランプやフォグランプ等に用いられる車両用灯具に関する。   The present invention relates to a vehicular lamp used for a rear combination lamp, a fog lamp, and the like including an automobile headlamp.

従来、車両用灯具として例えば特許文献１に示されているように、光源として発光ダイオード（ＬＥＤ）等の半導体型光源を用い、これをリフレクタと共にヒートシンク部材（固定部材）に組付けて、半導体型光源の発熱を該ヒートシンク部材により拡散して放熱するようにしたものが知られている。
特開２００６−３０２７１４号公報 Conventionally, as shown in, for example, Patent Document 1 as a vehicle lamp, a semiconductor light source such as a light emitting diode (LED) is used as a light source, and this is assembled to a heat sink member (fixing member) together with a reflector. A heat source is known in which heat generated by a light source is diffused by the heat sink member.
JP 2006-302714 A

前記従来の車両用灯具にあっては、半導体型光源は給電アタッチメント部材に位置決めして固定配置され、この給電アタッチメント部材をヒートシンク部材に嵌挿固定することにより、該半導体型光源がヒートシンク部材の所定部位に配置されるようにしている。   In the conventional vehicular lamp, the semiconductor-type light source is positioned and fixedly disposed on the power supply attachment member, and the semiconductor-type light source is fixed to the heat sink member by inserting and fixing the power supply attachment member to the heat sink member. It is arranged at the site.

このため、半導体型光源と給電アタッチメント部材との組付誤差、および給電アタッチメント部材とヒートシンク部材との組付誤差が集積されて、半導体型光源とリフレクタ，シェード，投影レンズ等との光学的位置関係に狂いが生じて、配光性能に悪影響と及ぼしてしまうことは否めない。   Therefore, the assembly error between the semiconductor light source and the power supply attachment member and the assembly error between the power supply attachment member and the heat sink member are integrated, and the optical positional relationship between the semiconductor light source and the reflector, shade, projection lens, etc. It is undeniable that an error will occur and the light distribution performance will be adversely affected.

一方、前記半導体型光源の背面とヒートシンク部材の光源取付面とに、相互に係合するロケートピンとロケート孔とを設けて、これらロケートピンとロケート孔との係合により半導体型光源を位置決めして、直接、前記光源取付面に固定することも行われてはいるが、前記ロケートピンとロケート孔の加工精度管理が困難で、この場合も半導体型光源と他の光学系部材との位置関係に微妙な狂いを生じてしまう。   On the other hand, the rear surface of the semiconductor type light source and the light source mounting surface of the heat sink member are provided with a locating pin and a locating hole that are engaged with each other, and the semiconductor type light source is positioned by the engagement between the locating pin and the locating hole, Although it is also directly fixed to the light source mounting surface, it is difficult to manage the processing accuracy of the locating pin and the locating hole, and in this case also, the positional relationship between the semiconductor light source and other optical system members is delicate. It will cause madness.

そこで、本発明は半導体型光源をヒートシンク部材の取付面上に精度良く組付けることができて、配光性能を向上することができる車両用灯具を提供するものである。   Therefore, the present invention provides a vehicular lamp that can accurately assemble a semiconductor-type light source on a mounting surface of a heat sink member and improve light distribution performance.

本発明の車両用灯具にあっては、半導体型光源と、該半導体型光源の出射光の一部を所定の方向に向けて反射するリフレクタと、これら半導体型光源およびリフレクタ等の光学系部材を集約的に配置したヒートシンク部材と、を備え、前記半導体型光源は、前記ヒートシンク部材の光源取付面上に突設されたストッパーと、該ストッパーと対峙して配設されたばね部材との対向的な挟圧により位置決めされ、前記ばね部材はＵ字状の板ばねで構成され、該板ばねが前記光源取付面に形成された嵌合孔に自体の弾性により圧入配置され、その一側ばね片が前記半導体型光源の一側端面に弾接し、他側ばね片の端末が前記半導体型光源をその上方から押え付けて固定する給電部材の背面に係止して抜け止め固定されていることを主要な特徴としている。   In the vehicular lamp of the present invention, a semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, and an optical system member such as the semiconductor-type light source and the reflector are provided. A heat sink member arranged in an intensive manner, and the semiconductor-type light source includes a stopper projecting on a light source mounting surface of the heat sink member, and a spring member disposed opposite to the stopper. Positioned by clamping pressure, the spring member is formed of a U-shaped leaf spring, and the leaf spring is press-fitted into the fitting hole formed in the light source mounting surface by its own elasticity, and the one side spring piece is Mainly, the end of one side of the semiconductor-type light source is elastically contacted, and the end of the other-side spring piece is fixed to the back of the power supply member that presses and fixes the semiconductor-type light source from above. As a special feature That.

前記半導体型光源は、その背面をヒートシンク部材の光源取付面に重合して、該半導体型光源の一側端面を該取付面上に突設されたストッパーに面接触して当接係止することにより、該半導体型光源の配設基準位置が定められる。そして、該半導体型光源の他側端面を前記ばね部材により前記ストッパー側に向けて押圧することによって、該半導体型光源の配設位置が確定される。   The semiconductor-type light source has its rear surface superimposed on a light source mounting surface of a heat sink member, and one side end surface of the semiconductor-type light source is brought into surface contact with and locked to a stopper projecting on the mounting surface. Thus, the arrangement reference position of the semiconductor light source is determined. And the arrangement | positioning position of this semiconductor type light source is decided by pressing the other side end surface of this semiconductor type light source toward the said stopper side with the said spring member.

前記ばね部材として用いられるＵ字状の板ばねは、前記光源取付面に形成された嵌合孔に自体の弾性により圧入配置され、その一側ばね片が前記半導体型光源のストッパーと面接触した側とは反対側の端面に弾接して、他側ばね片の端末が半導体型光源をその上方から押え付けて固定されているため、車両振動等による該板ばねの脱落およびガタツキが防止される。   The U-shaped leaf spring used as the spring member is press-fitted and arranged by its own elasticity in a fitting hole formed in the light source mounting surface, and one side spring piece is in surface contact with the stopper of the semiconductor-type light source. Since the end of the other spring piece is fixed by pressing the semiconductor-type light source from above, the leaf spring is prevented from falling off and rattling due to vehicle vibration or the like. .

本発明によれば、ヒートシンク部材の光源取付面上に突設したストッパーに半導体型光源の一側端面を突当てて面接触させることにより、該取付面上における半導体型光源の配設基準位置が定められ、このストッパーとばね部材との対向的な挟圧によって該半導体型光源の配設位置が確定されるので、前記従来の給電アタッチメント部材の如き中間媒体がなく、半導体型光源の組付精度を高めることができる。   According to the present invention, the arrangement reference position of the semiconductor-type light source on the mounting surface can be determined by bringing one end face of the semiconductor-type light source into contact with the stopper protruding from the light-source mounting surface of the heat sink member. Since the arrangement position of the semiconductor light source is determined by the opposing clamping force between the stopper and the spring member, there is no intermediate medium as in the conventional power supply attachment member, and the assembly accuracy of the semiconductor light source Can be increased.

しかも、前記ストッパーと半導体型光源の相互の接触面の精度を出せばよいので、加工精度管理が容易で半導体型光源の位置決めを正確に行えて、他のリフレクタ等との光学的位置関係に狂いを生じることがなく、これにより配光性能を向上することができる。   In addition, the accuracy of the contact surface between the stopper and the semiconductor-type light source only needs to be obtained, so that the processing accuracy can be easily managed and the positioning of the semiconductor-type light source can be performed accurately, and the optical positional relationship with other reflectors, etc. is not correct. Thus, the light distribution performance can be improved.

また、前記ばね部材はＵ字状の板ばねで構成されていて、自体の弾性により光源取付面に形成された嵌合孔に圧入配置され、半導体型光源の端面に弾接した一側ばね片とは反対側の他側ばね片の端末が、該半導体型光源をその上方から押え付けて固定する給電部材の背面に係止して抜け止め固定されているので、車両振動等による脱落やガタツキを生じることがなく、板ばねが半導体型光源およびリフレクタの配光経路内に突出して配光が部分的に遮断されたり、乱反射を発生する事態が回避されて品質感および信頼性を高めることができる。   The spring member is formed of a U-shaped leaf spring, and is press-fitted into a fitting hole formed in the light source mounting surface by its own elasticity, and is a one-side spring piece that is elastically contacted with the end surface of the semiconductor light source. Since the end of the other spring piece on the opposite side is fixed to the back of the power supply member that holds the semiconductor-type light source by pressing it from above, it is fixed so that it does not fall off or rattle due to vehicle vibration or the like. The leaf spring protrudes into the light distribution path of the semiconductor-type light source and reflector, and the light distribution is partially blocked or the occurrence of irregular reflection is avoided, improving the quality and reliability. it can.


以下、本発明の一実施形態を車両用ヘッドランプを例に採って図面と共に詳述する。
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings by taking a vehicle headlamp as an example.

図１は本発明に係るヘッドランプにおける灯具ユニットを示す分解斜視図、図２は灯具ユニットの断面図、図３は半導体型光源の位置決め状態を示す斜視図、図４はばね部材の組付け状態を示す斜視図、図５は給電部材の組付け状態を示す斜視図、図６は固定フレームの組付状態を示す斜視図である。   1 is an exploded perspective view showing a lamp unit in a headlamp according to the present invention, FIG. 2 is a sectional view of the lamp unit, FIG. 3 is a perspective view showing a positioning state of a semiconductor light source, and FIG. 4 is an assembled state of a spring member FIG. 5 is a perspective view showing the assembled state of the power feeding member, and FIG. 6 is a perspective view showing the assembled state of the fixed frame.

図１〜図６に示すヘッドランプの灯具ユニット１はプロジェクタタイプとして構成され、半導体型光源１０と、半導体型光源１０から射出された光の一部を反射する凹型の反射面１１ａを有するリフレクタ１１と、半導体型光源１０の直射光および前記リフレクタ１１の反射光を集光して灯具前方に向けて照射する投影レンズ１２と、これら半導体型光源１０と、リフレクタ１１と、投影レンズ１２とが光学的に集約して配設されるヒートシンク部材２０と、を備えている。   The lamp unit 1 of the headlamp shown in FIGS. 1 to 6 is configured as a projector type, and includes a semiconductor-type light source 10 and a reflector 11 having a concave reflection surface 11a that reflects a part of light emitted from the semiconductor-type light source 10. A projection lens 12 that collects the direct light from the semiconductor light source 10 and the reflected light from the reflector 11 and irradiates the light forward, and the semiconductor light source 10, the reflector 11, and the projection lens 12 are optically connected. A heat sink member 20 arranged in a concentrated manner.

この灯具ユニット１が図外のランプハウジングと素通しのアウターレンズとで形成される灯室内に配設されて、ヘッドランプが構成される。   This lamp unit 1 is disposed in a lamp chamber formed by a lamp housing (not shown) and a transparent outer lens to constitute a headlamp.

前記リフレクタ１１の反射面１１ａは、楕円または楕円を基本とする反射面、例えば、回転楕円面または楕円を基本とした自由曲面からなる。図２の鉛直断面において、リフレクタ１１の反射面１１ａは、例えば楕円をその長軸に沿って半分にした半楕円の形状を有し、反射面１１ａの前端部側は半円柱状のフード部１１Ａとされている。   The reflecting surface 11a of the reflector 11 is an ellipse or a reflecting surface based on an ellipse, for example, a free-form surface based on a spheroid or ellipse. In the vertical cross section of FIG. 2, the reflecting surface 11a of the reflector 11 has, for example, a semi-elliptical shape in which an ellipse is halved along its long axis, and the front end side of the reflecting surface 11a is a semi-columnar hood portion 11A. It is said that.

このリフレクタ１１は、例えば光不透過性の合成樹脂材で形成され、リフレクタ１１の内面にアルミ蒸着や銀塗装を施して前記反射面１１ａが形成される。   The reflector 11 is formed of, for example, a light-impermeable synthetic resin material, and the reflective surface 11a is formed by performing aluminum vapor deposition or silver coating on the inner surface of the reflector 11.

前記リフレクタ１１の反射面１１ａは第１焦点Ｆ１と第２焦点Ｆ２とを備え、この第１焦点Ｆ１またはその近傍に前記半導体型光源１０の発光部１０ａが配設される。これにより、半導体型光源１０から射出される光のうち、リフレクタ１１の反射面１１ａにより反射された光は、該リフレクタ１１の第２焦点Ｆ２またはその近傍に集光される。   The reflecting surface 11a of the reflector 11 includes a first focal point F1 and a second focal point F2, and the light emitting unit 10a of the semiconductor-type light source 10 is disposed at or near the first focal point F1. Thereby, of the light emitted from the semiconductor-type light source 10, the light reflected by the reflecting surface 11 a of the reflector 11 is collected at the second focal point F <b> 2 of the reflector 11 or in the vicinity thereof.

前記半導体型光源１０は、例えば発光ダイオード（ＬＥＤ）や有機ＥＬおよび無機ＥＬを含むエレクトロルミネッセンス（ＥＬ）など、半導体に電圧を印加することによって得られるルミネッセンス（発光現像）を利用した光源である。   The semiconductor light source 10 is a light source using luminescence (light emission development) obtained by applying a voltage to a semiconductor, such as a light emitting diode (LED) or an electroluminescence (EL) including an organic EL and an inorganic EL.

この半導体型光源１０は、平面方形の基板１０Ａを有し、該基板１０Ａの左右両側上面に端子１０ｂが設けられ、また、前記発光部１０ａを覆って透明なドーム状カバー１０ｃ
が付設されている。 This semiconductor-type light source 10 has a planar rectangular substrate 10A, terminals 10b are provided on the upper surfaces of the left and right sides of the substrate 10A, and a transparent dome-shaped cover 10c covering the light emitting portion 10a.
Is attached.

前記投影レンズ１２は、少なくとも何れか一方の側面が球面または略球面の形状を有する凸レンズである。本実施形態では、投影レンズ１２の両側面が凸型の略球面形状を有し、灯具前方側の側面（前面）は灯具後方側の側面（後面）に比べて曲率半径が小さい。投影レンズ１２の形状はこれに限らず、レンズ光軸方向の厚みが中心から外周にかけて薄くなる凸レンズであればよく、例えば、灯具後方側の側面（後面）が略平坦な面とされた平凸レンズであってもよい。   The projection lens 12 is a convex lens having a spherical or substantially spherical shape on at least one side surface. In this embodiment, both side surfaces of the projection lens 12 have a convex substantially spherical shape, and the side surface (front surface) on the front side of the lamp has a smaller radius of curvature than the side surface (rear surface) on the rear side of the lamp. The shape of the projection lens 12 is not limited to this, and may be any convex lens whose thickness in the lens optical axis direction becomes thinner from the center to the outer periphery. For example, a plano-convex lens whose side surface (rear surface) on the rear side of the lamp is a substantially flat surface. It may be.

この投影レンズ１２は、水平または略水平なレンズ光軸Ｚ１を有し、前記リフレクタ１１の第１焦点Ｆ１および第２焦点Ｆ２はこのレンズ光軸Ｚ１上に設定される。これにより、リフレクタ１１の第２焦点Ｆ２またはその近傍に集束した光は、投影レンズ１２を透過する際にレンズ光軸Ｚ１に対して平行もしくは略平行な光束に集光されて灯具前方へ投射される。   The projection lens 12 has a horizontal or substantially horizontal lens optical axis Z1, and the first focal point F1 and the second focal point F2 of the reflector 11 are set on the lens optical axis Z1. As a result, the light focused at or near the second focal point F2 of the reflector 11 is condensed into a light beam parallel or substantially parallel to the lens optical axis Z1 when passing through the projection lens 12, and is projected forward of the lamp. The

なお、前記半導体型光源１０はハロゲンランプやＨＩＤランプ（高輝度放電ランプ）に比べて発熱量が小さいため、投影レンズ１２としてガラスレンズよりも軽量な合成樹脂製のレンズ、例えばアクリル製レンズが使用される。   Since the semiconductor-type light source 10 generates less heat than a halogen lamp or HID lamp (high-intensity discharge lamp), a lens made of a synthetic resin that is lighter than a glass lens, such as an acrylic lens, is used as the projection lens 12. Is done.

前記ヒートシンク部材２０は、熱伝導率が高い金属材料、例えばアルミダイカスト製からなる。このヒートシンク部材２０は下側が開放した略方形ボックス状に形成され、下側に複数枚の縦型フィン２０ａが車幅方向に適宜等間隔に列設されている。   The heat sink member 20 is made of a metal material having a high thermal conductivity, for example, aluminum die casting. The heat sink member 20 is formed in a substantially rectangular box shape with the lower side open, and a plurality of vertical fins 20a are arranged at equal intervals in the vehicle width direction on the lower side.

このヒートシンク部材２０は、前記半導体型光源１０、リフレクタ１１および投影レンズ１２を前述のように光学的に集約して配置する基台を兼ねて、前記半導体型光源１０で発生した熱を放熱するもので、その上面は平坦に形成されて、前記半導体型光源１０の取付面２１とリフレクタ１１の取付面２２とが形成されている。   The heat sink member 20 also serves as a base on which the semiconductor-type light source 10, the reflector 11, and the projection lens 12 are optically concentrated as described above, and dissipates heat generated by the semiconductor-type light source 10. Thus, the upper surface is formed flat, and the mounting surface 21 of the semiconductor light source 10 and the mounting surface 22 of the reflector 11 are formed.

前記半導体型光源１０は後述するように、この光源取付面２１に発光部１０ａを上向きにしてその発光中心が前記リフレクタ１１の第１焦点Ｆ１の位置またはその近傍の位置となる定位置に略水平に固定配置され、従って、この光源取付面２１は、リフレクタ取付面２２に対して、前記半導体型光源１０の発光中心をレンズ光軸Ｚ１上に採り得る深さに一段低く有段成形されている。   As will be described later, the semiconductor-type light source 10 has a light emitting portion 10a facing upward on the light source mounting surface 21, and the light emission center is substantially horizontal at a fixed position where the position of the first focal point F1 of the reflector 11 or a position in the vicinity thereof. Accordingly, the light source mounting surface 21 is formed stepwise with respect to the reflector mounting surface 22 to a depth that allows the emission center of the semiconductor light source 10 to be taken on the lens optical axis Z1. .

一方、前記リフレクタ１１は、前記リフレクタ取付面２２に半導体型光源１０の上方および後方を覆ってビス等により上方より締結固定され、このリフレクタ取付面２２を含むヒートシンク部材２０の一般上面は、前記レンズ光軸Ｚ１上に略整合する平坦面として形成されている。   On the other hand, the reflector 11 is fastened and fixed to the reflector mounting surface 22 from above by using screws or the like covering the upper and rear sides of the semiconductor light source 10, and the general upper surface of the heat sink member 20 including the reflector mounting surface 22 is the lens. It is formed as a flat surface substantially aligned on the optical axis Z1.

本実施形態では、前記ヒートシンク部材２０の一般上面の前端縁はシェード２３を構成しており、このシェード２３は、前記半導体型光源１０から射出されてリフレクタ１１の反射面１１ａで反射された反射光の一部を遮断して、残りの反射光でカットオフラインを有する所定の配光パターン、例えば、すれ違い用配光パターン（ロービーム）を形成するものである。   In this embodiment, the front end edge of the general upper surface of the heat sink member 20 constitutes a shade 23, and the shade 23 is reflected light that is emitted from the semiconductor-type light source 10 and reflected by the reflecting surface 11 a of the reflector 11. A predetermined light distribution pattern having a cut-off line with the remaining reflected light, for example, a passing light distribution pattern (low beam) is formed.

また、前記ヒートシンク部材２０の一般上面の前記シェード２３の後方平坦面は、前記リフレクタ１１の反射面１１ａを第１反射面とした場合に、該第１反射面１１ａで前記シェード２３よりも灯具後方位置に反射された反射光を、投影レンズ１２の上方部分に向けて斜め上向き方向に反射させる第２反射面２４として形成されている。   Further, the rear flat surface of the shade 23 on the general upper surface of the heat sink member 20 is located behind the lamp 23 in the first reflective surface 11a when the reflective surface 11a of the reflector 11 is the first reflective surface. It is formed as a second reflecting surface 24 that reflects the reflected light reflected at the position in an obliquely upward direction toward the upper portion of the projection lens 12.

一方、前記リフレクタ１１のフード部１１Ａの前端部上側部位には、前記半導体型光源１０から射出される光の一部を、前記シェード２３の直前位置に向けて反射させる第３反射面２５が形成されている。この第３反射面２５は、前記フード部１１Ａの前端部上側部位に、内側に向けて断面逆三角形状に突出する膨出部１１Ａ１を形成することにより、その内側の後方の前傾した斜面で形成される。 On the other hand, a third reflecting surface 25 that reflects a part of the light emitted from the semiconductor-type light source 10 toward the position immediately before the shade 23 is formed on the upper portion of the front end portion of the hood portion 11A of the reflector 11. Has been. The third reflecting surface 25, the front end upper portion of the hood portion 11A, by forming the bulge portions 11A 1 projecting section inverted triangular shape toward the inside, slopes inclined forward of the rear of the inner Formed with.

また、前記シェード２３の直前部位には、前記第３反射面２５で反射された反射光を、投影レンズ１２の上側部に向けて反射させる第４反射面２６が形成されている。この第４反射面２６は斜め下方に傾斜した傾斜面として形成され、これら第３，第４反射面２５，２６は、前記ロービーム配光パターンよりも上方位置に配光パターンを形成するオーバーヘッドサイン用の反射面を構成するものである。   In addition, a fourth reflecting surface 26 that reflects the reflected light reflected by the third reflecting surface 25 toward the upper portion of the projection lens 12 is formed immediately before the shade 23. The fourth reflection surface 26 is formed as an inclined surface inclined obliquely downward, and the third and fourth reflection surfaces 25 and 26 are for overhead sign forming a light distribution pattern at a position above the low beam light distribution pattern. This constitutes the reflective surface.

前記ヒートシンク部材２０側の第２反射面２４および第４反射面２６は、リフレクタ１１の第１反射面１１ａおよび第３反射面２５と同様に、アルミ蒸着や銀塗装を施して形成される他、該ヒートシンク部材２０を構成するアルミダイカストの研削面を研磨加工により鏡面仕上げすることによっても容易に得られる。   Similar to the first reflecting surface 11a and the third reflecting surface 25 of the reflector 11, the second reflecting surface 24 and the fourth reflecting surface 26 on the heat sink member 20 side are formed by performing aluminum deposition or silver coating, It can also be easily obtained by mirror-finishing the ground surface of the aluminum die casting constituting the heat sink member 20 by polishing.

また、前記投影レンズ１２は、その周縁部がレンズホルダーによって抱持固定されるが、本実施形態にあっては、前記ヒートシンク部材２０の前端部にレンズホルダー部２７を一体に形成して、該レンズホルダー部２７によって投影レンズ１２を抱持固定するようにしている。   Further, the projection lens 12 is held and fixed at its peripheral edge by a lens holder. In the present embodiment, a lens holder portion 27 is integrally formed at the front end portion of the heat sink member 20, The projection lens 12 is held and fixed by the lens holder portion 27.

このレンズホルダー部２７は、ヒートシンク部材２０の前端面から左右側壁と底壁とを持つ延長部として一体成形され、その内周面は凹型の半円状に形成されている。レンズホルダー部２７の前端内周の下側中央部には溝部２７ａが段付き形成されている。そして、前記投影レンズ１２は、その周縁下部に沿設した下側係止突起１２ａをこの溝部２７ａに嵌合して定置され、周縁上部に沿設した上側係止突起１２ｂに図外の半円リング状のリテーナを係合して、該リテーナをレンズホルダー部２７の左右側壁の前端面にビス等により締結して固定される。   The lens holder portion 27 is integrally formed as an extension portion having left and right side walls and a bottom wall from the front end surface of the heat sink member 20, and an inner peripheral surface thereof is formed in a concave semicircular shape. A groove 27 a is formed in a stepped manner in the lower central portion of the inner periphery of the front end of the lens holder portion 27. The projection lens 12 is fixed by fitting a lower locking projection 12a extending along the lower peripheral edge of the projection lens 12 into the groove 27a, and a semicircle (not shown) on the upper locking projection 12b extending along the upper peripheral edge. The ring-shaped retainer is engaged, and the retainer is fastened to the front end surfaces of the left and right side walls of the lens holder portion 27 with screws or the like and fixed.

また、前記レンズホルダー部２７の底壁中央部には、開口面積が比較的に大きな通気窓２７ｂが形成され、レンズホルダー部２７の底部に熱が籠もることがないようにされている。   In addition, a ventilation window 27b having a relatively large opening area is formed at the center of the bottom wall of the lens holder 27 so that heat does not accumulate at the bottom of the lens holder 27.

ここで、前記半導体型光源１０は、前述のようにヒートシンク部材２０の光源取付面２１上に固定配置されるが、該半導体型光源１０はストッパー３０と、ばね部材としてのＵ字状の板ばね３１とからなる位置決め手段によって正確に位置決めして固定配置される。   Here, the semiconductor type light source 10 is fixedly disposed on the light source mounting surface 21 of the heat sink member 20 as described above. The semiconductor type light source 10 includes a stopper 30 and a U-shaped leaf spring as a spring member. It is fixed and arranged accurately by the positioning means comprising 31.

前記ストッパー３０は、前記光源取付面２１上に突設されて半導体型光源１０の基板１０Ａの後端面が係止する後部ストッパー３０Ｒと、該基板１０Ａの左右の側端面後部が係止する左右一対の側部ストッパー３０Ｓとから成る。   The stopper 30 protrudes from the light source mounting surface 21 and a pair of left and right rear stoppers 30R that the rear end surface of the substrate 10A of the semiconductor-type light source 10 is locked and the rear portions of the left and right side end surfaces of the substrate 10A are locked. Side stopper 30S.

後部ストッパー３０Ｒは、左右方向に延在する縦壁状に立設され、側部ストッパー３０Ｓは四角柱状に立設されて、前記基板１０Ａの後端面と側端面に面接触するようにされている。また、これらストッパー３０Ｒ，３０Ｓは、何れも前記基板１０Ａの上面よりも若干低い高さ位置となるように立設されている。   The rear stopper 30R is erected in a vertical wall shape extending in the left-right direction, and the side stopper 30S is erected in a quadrangular column shape so as to be in surface contact with the rear end surface and the side end surface of the substrate 10A. . The stoppers 30R and 30S are erected so as to be at a slightly lower height than the upper surface of the substrate 10A.

本実施形態にあっては、前記半導体型光源１０は、ヒートシンク部材２０と同質金属材からなる台座３２上に載置されて該台座３２と共にストッパー３０と板ばね３１とにより位置決めされる。   In the present embodiment, the semiconductor light source 10 is placed on a pedestal 32 made of the same metal material as the heat sink member 20, and is positioned together with the pedestal 32 by a stopper 30 and a leaf spring 31.

前記台座３２は、前記基板１０Ａの投影平面形状に整合する方形に形成され、その底面中央部には少なくとも前端面が台座３２の前端面と面一な四角柱状の脚部３２ａを一体に備えている。   The pedestal 32 is formed in a square shape that matches the projected plane shape of the substrate 10A, and at the center of the bottom surface thereof is integrally provided with a square columnar leg portion 32a whose front end surface is flush with the front end surface of the pedestal 32. Yes.

一方、前記光源取付面２１には前記板ばね３１のＵ字状底部が底付きする所定深さの平面方形の嵌合孔２８が形成されている。この嵌合孔２８は前記板ばね３１と共に台座３２の脚部３２ａを嵌合配置するもので、脚部３２ａの前後寸法よりも大きく設定され、脚部３２ａの前側に残余部２８ａが形成されるようにしている。   On the other hand, the light source mounting surface 21 is formed with a flat rectangular fitting hole 28 having a predetermined depth at which the U-shaped bottom portion of the leaf spring 31 bottoms. The fitting hole 28 fits and arranges the leg portion 32a of the pedestal 32 together with the leaf spring 31, and is set to be larger than the front and rear dimensions of the leg portion 32a, and a remaining portion 28a is formed on the front side of the leg portion 32a. I am doing so.

前記後部ストッパー３０Ｒおよび側部ストッパー３０Ｓは、前記嵌合孔２８の後縁および左右側縁に沿って立設されている。   The rear stopper 30R and the side stopper 30S are erected along the rear edge and the left and right side edges of the fitting hole 28.

そして、前記台座３２はその脚部３２ａを前記嵌合孔２８に上方より嵌入し、台座３２の後端面および側端面を前記後部ストッパー３０Ｒおよび側部ストッパー３０Ｓに面接触させて係止し、該嵌合孔２８にサブアッセンブリされる。   The pedestal 32 has its leg 32a fitted into the fitting hole 28 from above, and the rear end surface and the side end surface of the pedestal 32 are brought into surface contact with the rear stopper 30R and the side stopper 30S and locked. Sub-assembled in the fitting hole 28.

半導体型光源１０は、このように嵌合孔２８にサブアッセンブリされた台座３２上に基板１０Ａを載置し、該基板１０Ａの後端面と左右側端面とを前記後部ストッパー３０Ｒと側部ストッパー３０Ｓとに面接触させて係止した状態で、前記嵌合孔２８の前側の残余部２８ａに板ばね３１を差し込むことにより、基板１０Ａが台座３２と共に後部ストッパー３０Ｒと板ばね３１とにより前後方向に挟圧されて前後方向の位置決めが行われ、かつ、左右の側部ストッパー３０Ｓにより左右方向の位置決めが行われる。   The semiconductor-type light source 10 places the substrate 10A on the pedestal 32 thus sub-assembled in the fitting hole 28, and the rear end surface and the left and right end surfaces of the substrate 10A are connected to the rear stopper 30R and the side stopper 30S. With the plate spring 31 inserted into the remaining portion 28a on the front side of the fitting hole 28 in a state of being brought into surface contact with the base plate, the base plate 10A is moved in the front-rear direction by the rear stopper 30R and the plate spring 31 together with the base 32. Positioning in the front-rear direction is performed by being pinched, and positioning in the left-right direction is performed by the left and right side stoppers 30S.

このとき、前記Ｕ字状の板ばね３１の前側のばね片３１ａの上端縁が前記取付面２１とほぼ面一に整合する長さに、および後側のばね片３１ｂの上端縁が前記基板１０Ａの上面と面一もしくは若干上方に突出する長さに設定されている。また、この板ばね３１の後側のばね片３１ｂの上端末は若干前側に向けて傾斜したガイド片３１ｃとして曲折成形され、先に該板ばね３１を前記嵌合孔２８の残余部２８ａに差し込んで自体の弾性作用により係着させておき、後から半導体型光源１０の基板１０Ａを前記ストッパー３０とガイド片３１ｃとの間に上方から差し込んで係着が可能となるようにされている。   At this time, the upper end edge of the front spring piece 31a of the U-shaped leaf spring 31 is aligned with the mounting surface 21, and the upper end edge of the rear spring piece 31b is the substrate 10A. The length is set so as to be flush with or slightly above the upper surface. The upper end of the spring piece 31b on the rear side of the leaf spring 31 is bent and formed as a guide piece 31c slightly inclined toward the front side, and the leaf spring 31 is inserted into the remaining portion 28a of the fitting hole 28 first. The substrate 10A of the semiconductor light source 10 is inserted between the stopper 30 and the guide piece 31c from above and can be engaged later.

このように、ヒートシンク部材２０の光源取付面２１上に、ストッパー３０と板ばね３１とによって正確に位置決めして配設された半導体型光源１０は、該半導体型光源１０と電気的に接続される給電部材４０と、固定フレーム５０とによってヒートシンク部材２０にしっかりと固定される。   As described above, the semiconductor-type light source 10 that is accurately positioned on the light-source mounting surface 21 of the heat sink member 20 by the stopper 30 and the leaf spring 31 is electrically connected to the semiconductor-type light source 10. The power supply member 40 and the fixed frame 50 are firmly fixed to the heat sink member 20.

給電部材４０は適宜の合成樹脂材からなり、前記半導体型光源１０の周縁部、具体的には前記基板１０Ａの周縁部を上方から押え付けるホルダー部４１と、該ホルダー部４１の一側端に一体的に外方に向けて突設されて、図外の電源側コネクタが接続されるコネクタ部４２と、を備えている。   The power supply member 40 is made of an appropriate synthetic resin material, and includes a holder 41 that presses the peripheral edge of the semiconductor light source 10, specifically, the peripheral edge of the substrate 10 </ b> A from above, and one side end of the holder 41. And a connector portion 42 that projects integrally outward and to which a power supply side connector (not shown) is connected.

前記ホルダー部４１は平面方形に形成され、その周縁部に一段低く一体に有段成形されて前記ヒートシンク部材２０の光源取付面２１に重合されるフランジ部４１ａを備えている。このホルダー部４１の中央部には、前記半導体型光源１０のドーム状カバー１０ｃおよび板ばね３１の後側のばね片３１ｂが露出可能な平面方形の開窓部４１ｂが形成されている。また、この開窓部４１ｂの左右側縁部には、前記半導体型光源１０の基板１０Ａの上面の左右側縁部に設けた光源側端子１０ｂに電気的に導通可能な各一対の板ばね端子４１ｃを備えている。   The holder portion 41 is formed in a flat rectangular shape, and includes a flange portion 41 a that is formed in a stepped shape integrally with the peripheral portion thereof and is superposed on the light source mounting surface 21 of the heat sink member 20. At the center of the holder portion 41, a flat rectangular opening portion 41b is formed in which the dome-shaped cover 10c of the semiconductor light source 10 and the spring piece 31b on the rear side of the leaf spring 31 can be exposed. Further, a pair of leaf spring terminals that can be electrically connected to the light source side terminals 10b provided on the left and right side edge portions of the upper surface of the substrate 10A of the semiconductor-type light source 10 are provided on the left and right side edge portions of the opening portion 41b. 41c.

前記フランジ部４１の左右側部の裏面には、前記光源取付面２１に設けられたロケート孔２１ａに嵌合するロケートピン４１ｄが一体に突設されている。   A locating pin 41 d that fits into a locating hole 21 a provided in the light source mounting surface 21 is integrally projected on the back surfaces of the left and right side portions of the flange portion 41.

前記コネクタ部４２は、前記フランジ部４１の後端中央部に灯具後方に向けて直状に突設されている。このコネクタ部４２はその上面がフランジ部４１の上面と面一な四角柱状に形成され、従って、該コネクタ部４２はフランジ部４１の下面よりも下方に突出している。   The connector portion 42 is projected in a straight shape toward the rear of the lamp at the center of the rear end of the flange portion 41. The connector portion 42 is formed in a quadrangular prism shape whose upper surface is flush with the upper surface of the flange portion 41, and thus the connector portion 42 protrudes downward from the lower surface of the flange portion 41.

一方、前記光源取付面２１には、前記コネクタ部４２に対応する位置に、該コネクタ部４２の略下半部が嵌合する角形溝部２９が形成されている。   On the other hand, the light source mounting surface 21 is formed with a rectangular groove 29 in which a substantially lower half of the connector part 42 is fitted at a position corresponding to the connector part 42.

この給電部材４０は、前記ホルダー部４１を半導体型光源１０の基板１０Ａの周縁部上に被冠し、フランジ部４１ａのロケートピン４１ｄを前記光源取付面２１のロケート孔２１ａに圧入嵌合すると共に、コネクタ部４２を該光源取付面２１の角形溝部２９に圧入嵌合することにより該光源取付面２１に仮固定される。このとき、前記半導体型光源１０は、その基板１０Ａの端子１０ｂに、ホルダー部４１のばね端子４１ｃが弾接することによって電気的な接続が行われると共に、該ばね端子４１ｃの押え付けにより光源取付面２１に固定される。また、前記板ばね３１は、その前側のばね片３１ａの上端縁がフランジ部４１ａの前部下面に当接して固定される。一方、前記コネクタ部４２は角形溝部２９からヒートシンク部材２０の灯具後方に突出して配置される。   In the power supply member 40, the holder portion 41 is crowned on the peripheral portion of the substrate 10A of the semiconductor light source 10, and the locating pin 41d of the flange portion 41a is press-fitted into the locating hole 21a of the light source mounting surface 21, The connector portion 42 is temporarily fixed to the light source mounting surface 21 by press-fitting into the rectangular groove portion 29 of the light source mounting surface 21. At this time, the semiconductor-type light source 10 is electrically connected to the terminal 10b of the substrate 10A by elastic contact of the spring terminal 41c of the holder portion 41, and the light source mounting surface is pressed by the spring terminal 41c. 21 is fixed. The leaf spring 31 is fixed by contacting the upper end edge of the spring piece 31a on the front side thereof with the lower surface of the front portion of the flange portion 41a. On the other hand, the connector part 42 is disposed so as to protrude from the square groove part 29 to the rear side of the lamp of the heat sink member 20.

前記固定フレーム５０は、所要の剛性を有する金属板材をもって前記給電部材４０のホルダー部４１の外周縁に外嵌してフランジ部４１ａ上に重合する平面方形の枠形状に形成されている。   The fixed frame 50 is formed in a planar rectangular frame shape that is fitted on the outer peripheral edge of the holder portion 41 of the power supply member 40 with a metal plate having a required rigidity and overlaps on the flange portion 41a.

この固定フレーム５０の前，後両側縁の左右側部には、脚片５１が下向きに略直角に曲折成形されている。各脚片５１の下側部には、それぞれ外側に斜め上向きに突出する係止フック５１ａが切り起し成形されている。   Leg pieces 51 are bent downward at substantially right angles on the left and right sides of the front and rear side edges of the fixed frame 50. A locking hook 51a that protrudes obliquely upward is cut and raised at the lower side of each leg piece 51.

一方、ヒートシンク部材２０の光源取付面２１には、前記固定フレーム５０の脚片５１に対応して上下方向に貫通するスリット２１ｂが形成されている。   On the other hand, the light source mounting surface 21 of the heat sink member 20 is formed with a slit 21 b penetrating in the vertical direction corresponding to the leg piece 51 of the fixed frame 50.

従って、前記固定フレーム５０は、上方よりその脚片５１を光源取付面２１のスリット２１ｂに差し込んで、係止フック５１ａがスリット２１ｂの途中に形成された顎部２１ｃをくぐり抜けて該顎部２１ｃに係合することによって、給電部材４０のフランジ部４１ａ上に装着される。この係止フック５１ａとスリット２１ｂの顎部２１ｃとの係合を確実に行わせるため、固定フレーム５０の左右両側部の中央部分に下側に凸となる湾曲したばね部５２が形成され、このばね部５２が給電部材４０のフランジ部４１ａ面に弾接して撓み変形することによって、前記係止フック５１ａがスリット２１ｂの顎部２１ｃと係合する方向の付勢力が得られるようにしている。これにより、前記給電部材４０と半導体型光源１０の光源取付面２１上への本固定が行われる。   Accordingly, the fixed frame 50 has its leg piece 51 inserted into the slit 21b of the light source mounting surface 21 from above, and the locking hook 51a passes through the jaw portion 21c formed in the middle of the slit 21b and enters the jaw portion 21c. By being engaged, the power supply member 40 is mounted on the flange portion 41a. In order to ensure engagement between the locking hook 51a and the jaw portion 21c of the slit 21b, a curved spring portion 52 that protrudes downward is formed at the center of the left and right sides of the fixed frame 50. The spring portion 52 is elastically brought into contact with the surface of the flange portion 41a of the power supply member 40 to bend and deform so that a biasing force in a direction in which the locking hook 51a engages with the jaw portion 21c of the slit 21b is obtained. As a result, the power supply member 40 and the semiconductor-type light source 10 are permanently fixed onto the light source mounting surface 21.

前記半導体型光源１０のヒートシンク部材２０への組付けは次のようにして行われる。   The semiconductor light source 10 is assembled to the heat sink member 20 as follows.

先ず、半導体型光源１０をその発光部１０ａを上向きにして、光源取付面２１の嵌合孔２８にサブアッセンブリされた台座３２の上面に載置し、基板１０Ａを該台座３２上で摺動して、該基板１０Ａの後端面と左右の側部端面とを、後部ストッパー３０Ｒと側部ストッパー３０Ｓとにそれぞれ面接触により当接してセットする（図３参照）。   First, the semiconductor-type light source 10 is placed on the upper surface of the pedestal 32 sub-assembled in the fitting hole 28 of the light source mounting surface 21 with the light emitting portion 10a facing upward, and the substrate 10A is slid on the pedestal 32. Then, the rear end face and the left and right side end faces of the substrate 10A are set in contact with the rear stopper 30R and the side stopper 30S by surface contact, respectively (see FIG. 3).

次に、嵌合孔２８の前側の残余部２８ａに上方からＵ字状の板ばね３１を、その弾性を利用して該板ばね３１が嵌合孔２８に底付きするまで圧入する。これにより、前記基板１０Ａの前端面に板ばね３１の後側のばね片３１ｂが弾接して、該基板１０Ａは前記後部ストッパー３０Ｒと板ばね３１とにより前後方向に挟圧されて、光源取付面２１上での前後方向の取付位置が規定されると共に、左右の側部ストッパー３０Ｓによって左右方向の取付位置が規定される（図４参照）。   Next, a U-shaped leaf spring 31 is press-fitted into the remaining portion 28a on the front side of the fitting hole 28 from above until the leaf spring 31 bottoms into the fitting hole 28 using its elasticity. As a result, the spring piece 31b on the rear side of the leaf spring 31 is brought into elastic contact with the front end surface of the substrate 10A, and the substrate 10A is sandwiched between the rear stopper 30R and the leaf spring 31 in the front-rear direction, and the light source mounting surface The mounting position in the front-rear direction on 21 is defined, and the mounting position in the left-right direction is defined by the left and right side stoppers 30S (see FIG. 4).

前記半導体型光源１０と板ばね３１の組付工順は逆であってもよい。即ち、先に板ばね３１を嵌合孔２８の前側部に圧入して後側のばね片３１ｂを台座３２の前端面に弾接させて該嵌合孔２８にサブアッセンブリしておき、半導体型光源１０の基板１０Ａを、後部ストッパー３０Ｒと左右ストッパー３０Ｓと板ばね３１の後側のばね片３１ｂのガイド片３１ｃとで囲まれた部分に、基板１０Ａの前端で該ガイド片３１ｃを前方へ押し退けるようにして挿入しても、前述と同様に基板１０Ａの前後方向および左右方向の組付け位置が正確に定められる。   The assembly order of the semiconductor-type light source 10 and the leaf spring 31 may be reversed. That is, the leaf spring 31 is first press-fitted into the front side portion of the fitting hole 28, and the rear spring piece 31b is elastically contacted with the front end surface of the base 32 to be sub-assembled into the fitting hole 28. The substrate 10A of the light source 10 is pushed forward by the front end of the substrate 10A toward the portion surrounded by the rear stopper 30R, the left and right stopper 30S, and the guide piece 31c of the spring piece 31b on the rear side of the leaf spring 31. Even if it is inserted in this manner, the assembling positions of the substrate 10A in the front-rear direction and the left-right direction are accurately determined in the same manner as described above.

このようにして半導体型光源１０の位置決めを行った後、給電部材４０をそのホルダー部４１を前記半導体型光源１０の基板１０Ａの周縁部上に上方から宛ってドーム状カバー１０ｃを開窓部４１ｂにくぐらせ、該ホルダー部４１を前記基板１０Ａの周縁部に被冠した状態で、コネクタ部４２を光源取付面２１の角形溝部２９に圧入嵌合すると共に、ホルダー部４１の下面のロケートピン４１ｄを該光源取付面２１のロケート孔２１ａに圧入嵌合する。これにより、ホルダー部４１のばね端子４１ｃが前記基板１０Ａの端子１０ｂ上に弾接して給電部材４０と半導体型光源１０とが電気的に導通すると共に、該基板１０Ａが光源取付面２１上に押え付けられて、半導体型光源１０と給電部材４０との仮固定が行われる（図５参照）。   After positioning the semiconductor light source 10 in this manner, the dome-shaped cover 10c is opened by placing the power supply member 40 with its holder 41 on the peripheral edge of the substrate 10A of the semiconductor light source 10 from above. The connector portion 42 is press-fitted into the rectangular groove portion 29 of the light source mounting surface 21 while the holder portion 41 is covered with the peripheral edge portion of the substrate 10A, and the locating pin 41d on the lower surface of the holder portion 41 is inserted. Is press-fitted into the locating hole 21 a of the light source mounting surface 21. Thereby, the spring terminal 41c of the holder part 41 is elastically contacted with the terminal 10b of the substrate 10A so that the power supply member 40 and the semiconductor light source 10 are electrically connected, and the substrate 10A is pressed against the light source mounting surface 21. In addition, the semiconductor light source 10 and the power supply member 40 are temporarily fixed (see FIG. 5).

そこで、固定フレーム５０を前述のようにその脚片５１を光源取付面２１のスリット２１ｂに上方より差し込んで、給電部材４０のフランジ部４１ａ上に装着して半導体型光源１０と給電部材４０とを本固定することによって、該半導体型光源１０を光源取付面２１上に正確に位置決めした状態で、ヒートシンク部材２０に対する組付けが終了する（図６参照）。   Therefore, as described above, the leg piece 51 of the fixed frame 50 is inserted into the slit 21b of the light source mounting surface 21 from above and is mounted on the flange portion 41a of the power supply member 40 so that the semiconductor light source 10 and the power supply member 40 are connected. By permanently fixing, the assembly of the semiconductor light source 10 to the heat sink member 20 is completed in a state where the semiconductor light source 10 is accurately positioned on the light source mounting surface 21 (see FIG. 6).

前記リフレクタ１１は、以上のようにして半導体型光源１０をヒートシンク部材２０に組付けた後、前記リフレクタ取付面２２上にビス等により締結固定し、もしくはロケートピンとロケート孔とによる位置決め手段の圧入嵌合等によって組付けられる。   After the semiconductor light source 10 is assembled to the heat sink member 20 as described above, the reflector 11 is fastened and fixed to the reflector mounting surface 22 with screws or the like, or press-fitting positioning means using a locate pin and a locate hole. It is assembled by means of equality.

以上の構成からなる本実施形態のヘッドランプによれば、ヒートシンク部材２０の光源取付面２１上に突設したストッパー３０に半導体型光源１０の一側端面を突当てて面接触させることにより、該光源取付面２１上における半導体型光源１０の配設基準位置が定められ、このストッパー３０と板ばね３１との対向的な挟圧によって該半導体型光源１０の配設位置が確定されるので、前記従来の給電アタッチメント部材の如き中間媒体がなく、半導体型光源１０の組付精度を高めることができる。   According to the headlamp of the present embodiment having the above configuration, the one end face of the semiconductor light source 10 is brought into surface contact with the stopper 30 protruding on the light source mounting surface 21 of the heat sink member 20, thereby The arrangement reference position of the semiconductor light source 10 on the light source mounting surface 21 is determined, and the arrangement position of the semiconductor light source 10 is determined by the opposing clamping pressure between the stopper 30 and the leaf spring 31. There is no intermediate medium like a conventional power supply attachment member, and the assembly accuracy of the semiconductor light source 10 can be increased.

しかも、前記ストッパー３０と半導体型光源１０の一側端面との相互接触面の精度を出せばよいので、加工精度管理が容易で半導体型光源１０の位置決めを正確に行えて、他のリフレクタ１１等との光学的位置関係に狂いを生じることがなく、これにより配光性能を向上することができる。   In addition, since the accuracy of the mutual contact surface between the stopper 30 and one side end surface of the semiconductor light source 10 can be obtained, the processing accuracy can be easily managed, and the positioning of the semiconductor light source 10 can be performed accurately. In this way, the optical positional relationship is not deviated and the light distribution performance can be improved.

ここで、特に本実施形態にあっては、前記ストッパー３０を、半導体型光源１０の基板１０Ａの後側端面が面接触して当接する後部ストッパー３０Ｒと、該基板１０Ａの左右の側端面が面接触して当接する一対の側部ストッパー３０Ｓとで構成してあって、これらストッパー３０Ｒ，３０Ｓに囲まれた部分に前記基板１０Ａを挿入，載置し、ばね部材としてＵ字状の板ばね３１を、光源取付面２１の嵌合孔２８（余剰部２８ａ）に嵌挿圧入して、基板１０Ａを後部ストッパー３０Ｒと板ばね３１とにより前後方向に挟圧定置するようにしている。従って、ヒートシンク部材２０に形成されたシェード２３と、半導体型光源１０との前後方向の位置精度を高められることは勿論、左右の側部ストッパー３０Ｓによって左右方向の位置精度も高められ、シェード２３と半導体型光源１０およびリフレクタ１１との光学的な位置関係を設計通りに行えて、配光性能を一段と向上することができる。   Here, particularly in the present embodiment, the stopper 30 includes a rear stopper 30R in which the rear end surface of the substrate 10A of the semiconductor light source 10 comes into contact with the surface and the left and right side end surfaces of the substrate 10A are surfaces. A pair of side stoppers 30S that come into contact with and come into contact with each other. The substrate 10A is inserted and placed in a portion surrounded by the stoppers 30R and 30S, and a U-shaped leaf spring 31 is used as a spring member. Is inserted into the fitting hole 28 (the surplus portion 28a) of the light source mounting surface 21, and the substrate 10A is clamped and fixed in the front-rear direction by the rear stopper 30R and the leaf spring 31. Therefore, the position accuracy in the front-rear direction between the shade 23 formed on the heat sink member 20 and the semiconductor-type light source 10 can be increased, and the position accuracy in the left-right direction can be increased by the left and right side stoppers 30S. The optical positional relationship between the semiconductor light source 10 and the reflector 11 can be performed as designed, and the light distribution performance can be further improved.

また、前記Ｕ字状の板ばね３１は自体の弾性により光源取付面２１に形成された嵌合孔２８に圧入配置され、半導体型光源１０の基板１０Ａの前側端面に弾接した後側のばね片３１ｂとは反対側の前側のばね片３１ａの上端末が、該半導体型光源１０をその上方から押え付けて固定する給電部材４０の下面（背面）に係止して抜け止め固定されているので、車両振動等による脱落やガタツキを生じることがなく、板ばね３１が半導体型光源１０およびリフレクタ１１の配光経路内に突出して配光が部分的に遮断されたり、乱反射を発生する事態が回避されて品質感および信頼性を高めることができる。   Further, the U-shaped plate spring 31 is press-fitted into a fitting hole 28 formed in the light source mounting surface 21 by its own elasticity, and is a spring on the rear side that is elastically contacted with the front end surface of the substrate 10A of the semiconductor light source 10. The upper end of the front spring piece 31a opposite to the piece 31b is fixed to the lower surface (rear surface) of the power supply member 40 that holds the semiconductor-type light source 10 from above and is fixed. Therefore, the leaf spring 31 protrudes into the light distribution path of the semiconductor light source 10 and the reflector 11 and the light distribution is partially cut off or irregular reflection occurs without dropping or rattling due to vehicle vibration or the like. It can be avoided to improve quality and reliability.

一方、この板ばね３１の前記基板１０Ａの前側端面に弾接した後側のばね片３１ｂの上端末は、半導体型光源１０の直接光路およびリフレクタ１１の反射光路から外れた高さ位置に設定されているため、常態にあってこの後側のばね片３１ｂの上端末が前記配光経路内に存在することがなく、配光性能に些かも影響を及ぼすことはない。   On the other hand, the upper end of the spring piece 31b on the rear side that is elastically contacted with the front end face of the substrate 10A of the leaf spring 31 is set at a height position that is out of the direct optical path of the semiconductor light source 10 and the reflected optical path of the reflector 11. Therefore, the upper end of the rear spring piece 31b does not exist in the light distribution path in a normal state, and the light distribution performance is not slightly affected.

そして、この半導体型光源１０の前記光源取付面２１上への固定は前述のように半導体型光源１０と電気的に接続される給電部材４０によって行われ、該給電部材４０は、半導体型光源１０の上方から押え付ける平板状のホルダー部４１の後側端に一体に突設したコネクタ部４２を四角柱状として、これを前記光源取付面２１に形成した角形溝部２９に圧入嵌合してあるので、該コネクタ部４２を角形溝部２９で補剛できて、電源側コネクタ４３の着脱時におけるコネクタ部４２の変形または破損を防止できて、品質感を高めることができる。しかも、該コネクタ部４２の後端部は、ヒートシンク部材２０の後方に突出して配置してあるため、前記電源側コネクタ４３の着脱作業を灯具後方から容易に行えて作業性を高められると共に、該電源側コネクタ４３の振動等による脱落を回避することもできて、より一層品質感および信頼性を高めることができる。   The semiconductor-type light source 10 is fixed onto the light source mounting surface 21 by the power supply member 40 electrically connected to the semiconductor-type light source 10 as described above. Since the connector portion 42 integrally projecting from the rear end of the flat plate-like holder portion 41 pressed from above is formed into a quadrangular prism shape, this is press-fitted into a rectangular groove portion 29 formed in the light source mounting surface 21. The connector portion 42 can be stiffened by the rectangular groove portion 29, so that the connector portion 42 can be prevented from being deformed or damaged when the power supply side connector 43 is attached or detached, and the quality can be enhanced. In addition, since the rear end portion of the connector portion 42 protrudes from the rear of the heat sink member 20, the power connector 43 can be easily attached / detached from the rear of the lamp to improve workability, and The power supply side connector 43 can be prevented from dropping off due to vibration or the like, and the quality and reliability can be further enhanced.

更に、前記実施形態のように、ヒートシンク部材２０の光源取付面２１上への半導体型光源１０，板ばね３１，給電部材４０，および固定フレーム５０の組付けを、順次上方からの挿入または圧入操作で行えて締結部材を不要とすることができるため、組付作業を簡素化して作業性を向上できることは勿論、ロボットによる組付けの自動化を容易にすることができる利点がある。   Further, as in the above-described embodiment, the assembly of the semiconductor light source 10, the leaf spring 31, the power feeding member 40, and the fixed frame 50 on the light source mounting surface 21 of the heat sink member 20 is sequentially inserted or press-fitted from above. Since the fastening member is unnecessary, the assembly work can be simplified to improve workability, and there is an advantage that the assembly by the robot can be easily automated.

なお、前記実施形態では、半導体型光源１０の出射光を１つのリフレクタ１１で灯具前方に向けて反射させる構造を例示したが、複数個のリフレクタにより灯具前方に向けて多段に反射させる構造であってもよく、また、プロジェクタタイプ以外の灯具構成にも適用することが可能である。   In the above embodiment, the structure in which the light emitted from the semiconductor-type light source 10 is reflected by the single reflector 11 toward the front of the lamp is illustrated. However, the structure is a structure in which a plurality of reflectors reflect the light from the front of the lamp in multiple stages. It is also possible to apply to lamp configurations other than the projector type.

また、本発明は前記ヘッドランプの他、リヤコンビネーションランプあるいはフォグランプに適用することができる。   Further, the present invention can be applied to a rear combination lamp or a fog lamp in addition to the headlamp.

本発明の一実施形態における灯具ユニットを示す分解斜視図。The disassembled perspective view which shows the lamp unit in one Embodiment of this invention. 灯具ユニットの断面図。Sectional drawing of a lamp unit. 半導体型光源の位置決め状態を示す斜視図。The perspective view which shows the positioning state of a semiconductor type light source. ばね部材の組付け状態を示す斜視図。The perspective view which shows the assembly | attachment state of a spring member. 給電部材の組付け状態を示す斜視図。The perspective view which shows the assembly | attachment state of an electric power feeding member. 固定フレームの組付け状態を示す斜視図。The perspective view which shows the assembly | attachment state of a fixed frame.

符号の説明Explanation of symbols

１ 灯具ユニット
１０ 半導体型光源
１１ リフレクタ
１２ 投影レンズ
２０ ヒートシンク部材
２１ 光源取付面
２２ リフレクタ取付面
２３ シェード
２８ 嵌合孔
３０ ストッパー
３０Ｒ 後部ストッパー
３０Ｓ 側部ストッパー
３１ 板ばね
３１ａ 前側のばね片
３０ｂ 後側のばね片
４０ 給電部材
５０ 固定フレーム
DESCRIPTION OF SYMBOLS 1 Lamp unit 10 Semiconductor type light source 11 Reflector 12 Projection lens 20 Heat sink member 21 Light source mounting surface 22 Reflector mounting surface 23 Shade 28 Fitting hole 30 Stopper 30R Rear stopper 30S Side stopper 31 Leaf spring 31a Front spring piece 30b Spring piece 40 Power supply member 50 Fixed frame

Claims (2)

半導体型光源と、該半導体型光源の出射光の一部を所定の方向に向けて反射するリフレクタと、これら半導体型光源およびリフレクタ等の光学系部材を集約的に配置したヒートシンク部材と、を備え、
前記半導体型光源は、前記ヒートシンク部材の光源取付面上に突設されたストッパーと、該ストッパーと対峙して配設されたばね部材との対向的な挟圧により位置決めされ、
前記ばね部材はＵ字状の板ばねで構成され、該板ばねが前記光源取付面に形成された嵌合孔に自体の弾性により圧入配置され、その一側ばね片が前記半導体型光源の一側端面に弾接し、他側ばね片の端末が前記半導体型光源をその上方から押え付けて固定する給電部材の背面に係止して抜け止め固定されていることを特徴とする車両用灯具。 A semiconductor-type light source, a reflector that reflects a part of light emitted from the semiconductor-type light source in a predetermined direction, and a heat sink member in which optical system members such as the semiconductor-type light source and the reflector are collectively arranged. ,
The semiconductor-type light source is positioned by opposing clamping pressure between a stopper projecting on a light source mounting surface of the heat sink member and a spring member disposed opposite to the stopper,
The spring member is composed of a U-shaped leaf spring, and the leaf spring is press-fitted and arranged by its own elasticity in a fitting hole formed in the light source mounting surface. A vehicular lamp characterized in that it is elastically contacted with a side end face, and the terminal of the other side spring piece is fixed to the rear surface of a power supply member that presses and fixes the semiconductor-type light source from above. 前記半導体型光源の一側端面に弾接した板ばねの一側ばね片は、その端末が半導体型光源の直接光路およびリフレクタの反射光路から外れた高さ位置に設定されていることを特徴とする請求項１に記載の車両用灯具。   The one-side spring piece of the leaf spring that is in elastic contact with one end face of the semiconductor-type light source is characterized in that the end thereof is set at a height position that is out of the direct optical path of the semiconductor-type light source and the reflected light path of the reflector. The vehicular lamp according to claim 1.
JP2008243736A 2008-09-24 2008-09-24 Vehicle lighting Expired - Fee Related JP5035564B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102335818A (en) * 2010-07-21 2012-02-01 富士迈半导体精密工业（上海）有限公司 Pressing fixture
KR20160000647U (en) * 2014-08-18 2016-02-26 에스엘 주식회사 Lamp assembly for vehicle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129207U (en) * 1985-02-01 1986-08-13
JP2005209536A (en) * 2004-01-23 2005-08-04 Koito Mfg Co Ltd Lighting fixture
JP2005243407A (en) * 2004-02-26 2005-09-08 Harison Toshiba Lighting Corp Lamp device and display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129207U (en) * 1985-02-01 1986-08-13
JP2005209536A (en) * 2004-01-23 2005-08-04 Koito Mfg Co Ltd Lighting fixture
JP2005243407A (en) * 2004-02-26 2005-09-08 Harison Toshiba Lighting Corp Lamp device and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102335818A (en) * 2010-07-21 2012-02-01 富士迈半导体精密工业（上海）有限公司 Pressing fixture
KR20160000647U (en) * 2014-08-18 2016-02-26 에스엘 주식회사 Lamp assembly for vehicle
KR200480827Y1 (en) 2014-08-18 2016-07-12 에스엘 주식회사 Lamp assembly for vehicle

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