JP2010064237A - Method of and device for polishing surface of substrate-placing plate for substrate-placing device - Google Patents
Method of and device for polishing surface of substrate-placing plate for substrate-placing device Download PDFInfo
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- JP2010064237A JP2010064237A JP2008235822A JP2008235822A JP2010064237A JP 2010064237 A JP2010064237 A JP 2010064237A JP 2008235822 A JP2008235822 A JP 2008235822A JP 2008235822 A JP2008235822 A JP 2008235822A JP 2010064237 A JP2010064237 A JP 2010064237A
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- 238000005498 polishing Methods 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 205
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 239000006061 abrasive grain Substances 0.000 claims abstract description 13
- 239000000314 lubricant Substances 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 7
- 239000002002 slurry Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 26
- 239000006249 magnetic particle Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000696 magnetic material Substances 0.000 claims description 11
- 239000003082 abrasive agent Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 4
- 241000135309 Processus Species 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 16
- 239000002245 particle Substances 0.000 description 9
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
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- 229910003460 diamond Inorganic materials 0.000 description 2
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- 238000003672 processing method Methods 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本発明は、突起のある基板戴置板の表面を研磨する方法、特に半導体ウエハーや液晶用ウエハーを戴置し、移動させる基板戴置装置用の基板戴置板の表面を鏡面研磨する方法及び装置に関する。 The present invention relates to a method for polishing a surface of a substrate mounting plate having protrusions, in particular, a method for mirror polishing the surface of a substrate mounting plate for a substrate mounting device on which a semiconductor wafer or a liquid crystal wafer is mounted and moved. Relates to the device.
半導体ウエハーや液晶用ウエハーの製造には、成膜、露光、エッチング等の工程が存在し、この工程間の移動には、上記ウエハーを基板戴置装置に戴置して各工程の製造装置間を移動させる必要がある。 In the manufacture of semiconductor wafers and liquid crystal wafers, there are processes such as film formation, exposure, and etching, and movement between these processes is performed by placing the wafer on a substrate mounting apparatus and between manufacturing apparatuses in each process. Need to be moved.
上記半導体ウエハー等の製造には、塵埃（以下、パーティクルという。）の発生は禁物であり、このパーティクルは上記ウエハーと基板戴置装置の基板戴置板との接触により生じることが多いので、上記基板戴置装置の基板戴置板は表面の接触面積を小さくする方がよく、このため上記基板戴置板の表面には無数の突起が形成されている。 In the production of the semiconductor wafer and the like, generation of dust (hereinafter referred to as particles) is prohibited, and the particles are often generated by contact between the wafer and the substrate mounting plate of the substrate mounting apparatus. It is better to reduce the contact area of the surface of the substrate placement plate of the substrate placement device. For this reason, innumerable protrusions are formed on the surface of the substrate placement plate.
このような基板戴置装置は、上記ウエハーを該基板戴置装置の基板戴置板上に吸着する構造となっており、この吸着方式には静電チャック方式と真空チャック方式がある。従って、基板戴置装置は、基板戴置板と上記吸着装置から構成される。（以下、前記基板戴置板を単に「チャック」と略称する。）
上記チャックの表面の突起は、断面が台形、または頂面を平面にした山形である。該チャックの突起はブラストで形成されることが多いが、ブラスト成形の場合、該突起の側面や底面の表面粗さが悪く、該粗面からのパーティクルの発生が多くなるので、該粗面をなだらかに鏡面研磨することが求められている。該突起の頂面は平坦であり、比較的研磨し易いが、上記突起の側面は、突起の内方に存在するので研磨が困難である。
Such a substrate placing apparatus has a structure in which the wafer is sucked onto a substrate placing plate of the substrate placing apparatus, and there are an electrostatic chuck method and a vacuum chuck method. Therefore, the substrate placing device is composed of the substrate placing plate and the suction device. (Hereinafter, the substrate mounting plate is simply referred to as “chuck”.)
The protrusion on the surface of the chuck has a trapezoidal cross section or a mountain shape with a flat top surface. The projections of the chuck are often formed by blasting. However, in the case of blast molding, the surface roughness of the side and bottom surfaces of the projections is poor, and the generation of particles from the rough surface increases. There is a demand for smooth mirror polishing. The top surface of the protrusion is flat and relatively easy to polish, but the side surface of the protrusion is inward of the protrusion and is difficult to polish.
しかし、該チャックの突起の内方の側面や突起間の基板戴置板表面（突起の底面）の鏡面研磨が十分に行われないで粗面として残る場合、前記のように該粗面から振動や衝突等によりパーティクルが発生することが確認されており、該チャックの突起の内方の側面や突起間の基板戴置板表面（突起の底面）の鏡面研磨を行うことが、前記ウエハー等の製造過程における品質を左右するので、基板戴置板表面の鏡面研磨の必要性は高い。 However, if the inner surface of the chuck protrusion or the substrate mounting plate surface between the protrusions (bottom surface of the protrusion) is not sufficiently polished and remains as a rough surface, the surface is vibrated as described above. It has been confirmed that particles are generated due to or collision, and mirror polishing of the inner side surface of the projection of the chuck or the surface of the substrate mounting plate between the projections (bottom surface of the projection) Since the quality in the manufacturing process is affected, the necessity for mirror polishing of the substrate mounting plate surface is high.
該基板戴置板表面の鏡面研磨の従来例として、上記突起の側面（斜面）を微少砥粒とバフ研磨により鏡面研磨することが特開２００３−８６６６４号公報に開示されている。
バフ研磨とは、金属表面をきれいにする加工法で、綿布・麻など、柔軟性のある素材でできた軟らかいバフに砥粒を付着させ、このバフを高速回転させながら被加工物に押し当てて表面を磨く加工方法のことである。
As a conventional example of mirror polishing of the surface of the substrate mounting plate, Japanese Patent Application Laid-Open No. 2003-86664 discloses that the side surfaces (slopes) of the protrusions are mirror polished by fine abrasive grains and buffing.
Buffing is a process that cleans the metal surface. Abrasives are attached to a soft buff made of a flexible material such as cotton cloth or linen, and this buff is pressed against the work piece while rotating at high speed. It is a processing method that polishes the surface.
一般的に布を円形に切り抜いて一定の厚みに縫いあわせたものや、バイアス状に縫いあわせた布の外周面に研磨材を塗ったもので製品を磨く工程である。その加工方法は研削（グラインダー類）とは異なり、加工物の表層のみを磨く（加工）することに特徴がある。素材は、鉄、銅や 亜鉛等の合金、プラスティック、板、パイプ、鋳物、ダイカストと広範囲にわたる。 In general, this is a process in which a product is polished with a cloth cut into a circular shape and sewn to a certain thickness, or with an abrasive applied to the outer peripheral surface of a cloth sewn in a bias shape. Unlike grinding (grinders), the processing method is characterized by polishing (processing) only the surface layer of the workpiece. Materials range from iron, alloys such as copper and zinc, plastics, plates, pipes, castings and die casting.
しかし、バフ研磨では、前記チャックの突起の底辺の方まで研磨材が届かないので、チャックの突起の内方の側面や突起間の基板戴置板表面（突起の底面）の鏡面研磨が十分に行われない欠点がある。すなわち、バフ研磨技術等の場合、ピン（突起）部の全域、全周方向に対して、均一な鏡面研磨は出来なかった。例えば、ピン（突起）の高さが５０ミクロン以上になってきた場合、バフ材がピン凸部にからみあってしまい、ピン（突起）部側面部や底面部を均一に研磨することができない。 However, in the buffing, the abrasive does not reach the bottom of the chuck protrusion, so the mirror polishing of the inner side surface of the chuck protrusion and the substrate mounting plate surface (bottom surface of the protrusion) between the protrusions is sufficient. There is a drawback that is not done. That is, in the case of the buffing technique or the like, uniform mirror polishing could not be performed over the entire region of the pin (protrusion) and the entire circumferential direction. For example, when the height of the pin (projection) is 50 microns or more, the buff material is entangled with the pin convex portion, and the side surface portion and the bottom surface portion of the pin (projection) portion cannot be uniformly polished.
この他、サンドプラストや超音波振動研磨等による上記基板戴置板表面の研磨も試行されているが、いずれも上記基板戴置板表面の突起の内部まで鏡面研磨することは困難であった。また、基板載置装置にコーティング等の技術を施して、パーティクルの抑制をした場合、ウエハーとの摩擦により、コーティングが剥離し、その結果、新たなパーティクルの発生となってくるので、コーティングも好ましくないことが知られている。
本発明は、複雑形状を有するファインセラミックの平滑研磨方法及び装置に関し、特に、表面に突起を有するウエハー等の基板戴置装置用の基板戴置板（チャック）の表面を鏡面研磨する方法に関する。そして、上記突起の側面や突起に覆われたチャック表面が効率よく、かつ研磨精度の優れた研磨方法及び装置を提供することを目的とする。 The present invention relates to a smooth polishing method and apparatus for fine ceramics having a complex shape, and more particularly to a method for mirror polishing the surface of a substrate mounting plate (chuck) for a substrate mounting apparatus such as a wafer having protrusions on the surface. It is another object of the present invention to provide a polishing method and apparatus in which the side surfaces of the protrusions and the chuck surface covered with the protrusions are efficient and have excellent polishing accuracy.
上記目的を達成するために、この発明の基板戴置装置用の基板戴置板の表面研磨方法は、突起のある上記基板戴置板の表面を研磨する方法であって、該基板戴置板の表面に磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨材を戴置し、上記基板戴置板の裏面側に磁力発生装置を置いて、該磁力発生装置を移動させて、上記基板戴置板表面の研磨材を移動させ、前記基板戴置板の表面を鏡面研磨することを特徴とする。 In order to achieve the above object, a method for polishing a surface of a substrate mounting plate for a substrate mounting device according to the present invention is a method for polishing a surface of the substrate mounting plate having a protrusion, the substrate mounting plate A slurry-like abrasive in which magnetic particles and abrasive grains are mixed with a lubricant is placed on the surface of the substrate, and a magnetic force generator is placed on the back side of the substrate mounting plate, and the magnetic force generator is moved to move the substrate. The polishing material on the surface of the mounting plate is moved, and the surface of the substrate mounting plate is mirror-polished.
また、前記基板戴置装置が半導体用ウエハーや液晶用ウエハーを戴置し、移動させるものであって、前記基板戴置板が、突起のあるファインセラミックス製であることを特徴とする。 The substrate placing apparatus places and moves a semiconductor wafer or a liquid crystal wafer, and the substrate placing plate is made of fine ceramics having protrusions.
また、前記磁力発生装置を移動させて生じる前記基板戴置板表面の研磨材の移動が振動であって、該振動による基板戴置板表面の研磨は、前記基板戴置板の各部分において行われ、前記基板戴置板の該各部分を前記磁力発生装置に対して、相対的に上記基板戴置板上の各箇所に移動させ、前記研磨が前記基板戴置板の全面にわたって行われることを特徴とする。 Further, the movement of the abrasive on the surface of the substrate placement plate caused by moving the magnetic force generator is vibration, and the polishing of the surface of the substrate placement plate by the vibration is performed at each part of the substrate placement plate. Each part of the substrate mounting plate is moved relative to the magnetic force generator to each location on the substrate mounting plate, and the polishing is performed over the entire surface of the substrate mounting plate. It is characterized by.
さらに、前記磁力発生装置の磁力源が永久磁石または電磁石であり、前記磁力発生装置を移動させる手段が、上記磁力源を載せた台にモーターで横振動を与える構造であることを特徴とする。 Further, the magnetic force source of the magnetic force generation device is a permanent magnet or an electromagnet, and the means for moving the magnetic force generation device has a structure in which a transverse vibration is applied by a motor to a table on which the magnetic force source is mounted.
あるいは、前記基板戴置板の上方にも前記基板戴置板下方の磁力源と極性の異なる磁力源を設け、前記スラリー状研磨材を上記両磁力源間に吸着させることにより、前記スラリー状研磨材が前記基板戴置板上面への磁気ブラシを形成することを特徴とする。 Alternatively, a magnetic source having a polarity different from that of the magnetic force source below the substrate mounting plate is also provided above the substrate mounting plate, and the slurry-like polishing material is adsorbed between the magnetic force sources so that the slurry polishing is performed. The material forms a magnetic brush on the upper surface of the substrate mounting plate.
また、前記基板戴置板の上方の磁力源および基板戴置板の下方の磁力源が１つの電磁コイルで励磁され、該電磁コイルから上記基板戴置板上方及び基戴置板下方にヨークが延長され、上記基板戴置板の上方の磁力源および基板戴置板の下方の磁力源を介して前記電磁コイルで励磁された磁気回路が形成されることを特徴とする。 Further, a magnetic source above the substrate mounting plate and a magnetic source below the substrate mounting plate are excited by one electromagnetic coil, and yokes are provided above the substrate mounting plate and below the base mounting plate from the electromagnetic coil. The magnetic circuit is extended, and a magnetic circuit excited by the electromagnetic coil is formed through a magnetic source above the substrate mounting plate and a magnetic source below the substrate mounting plate.
さらに、前記基板戴置板の上方の磁力源が前記基板戴置板の中心部上方に設けられ、かつ、基板戴置板の下方の磁力源が軸中心を前記戴置板の中心部下方に設けられた回転円盤の周辺部上方に設けられており、該回転円盤を回転させることにより、前記磁気ブラシが前記基板戴置板の上面に斜めに形成され、前記円盤の回転により該磁気ブラシが基板戴置板上面を周回して研磨することを特徴とする。 Further, a magnetic force source above the substrate mounting plate is provided above the central portion of the substrate mounting plate, and a magnetic force source below the substrate mounting plate has an axis center below the central portion of the mounting plate. The magnetic brush is formed obliquely on the upper surface of the substrate mounting plate by rotating the rotary disk, and the magnetic brush is rotated by the rotation of the disk. It is characterized by polishing around the upper surface of the substrate mounting plate.
また、前記磁性粒が、鉄、ニッケル、ステンレス等の磁性体からなる粉状、または円柱状のピンからなり、硬度差からそれ自体は前記ファインセラミックス製の基板戴置板表面を削ることのない材質であることを特徴とする。 In addition, the magnetic particles are composed of powdered or cylindrical pins made of a magnetic material such as iron, nickel, and stainless steel, and themselves do not cut the surface of the fine ceramic substrate mounting plate due to the difference in hardness. It is a material.
あるいは、本発明の基板戴置装置用の基板戴置板の表面研磨装置は、基板戴置装置用の突起のある基板戴置板の表面を研磨する装置であって、該基板戴置板の表面に戴置した磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨剤、上記基板戴置板の裏面側に設けた磁力発生装置とからなり、該磁力発生装置を移動させて上記基板戴置板表面の研磨材を移動させ、前記基板戴置板の表面を鏡面研磨することを特徴とする。 Alternatively, a surface polishing apparatus for a substrate mounting plate for a substrate mounting apparatus according to the present invention is an apparatus for polishing the surface of a substrate mounting plate having a protrusion for the substrate mounting apparatus. A magnetic particle placed on the surface, a slurry-like abrasive mixed with abrasives in a lubricant, and a magnetic force generator provided on the back side of the substrate mounting plate. The polishing material on the surface of the mounting plate is moved, and the surface of the substrate mounting plate is mirror-polished.
また、前記基板戴置装置が半導体用ウエハーや液晶用ウエハーを戴置し、移動させるものであって、前記基板戴置板が、突起のあるファインセラミックス製であることを特徴とする。 The substrate placing apparatus places and moves a semiconductor wafer or a liquid crystal wafer, and the substrate placing plate is made of fine ceramics having protrusions.
また、前記磁力発生装置を移動させて生じる前記基板戴置板表面の研磨材の移動が振動であって、該振動による基板戴置板表面の研磨は前記基板戴置板の各部分において行われ、前記基板戴置板の該各部分を前記磁力発生装置に対して相対的に上記基板戴置板上の各部分に移動させ、前記研磨が前記基板戴置板の全面にわたって行われることを特徴とする。 Further, the movement of the polishing material on the surface of the substrate mounting plate generated by moving the magnetic force generator is vibration, and the polishing of the surface of the substrate mounting plate by the vibration is performed in each part of the substrate mounting plate. The portions of the substrate mounting plate are moved to the portions of the substrate mounting plate relative to the magnetic force generator, and the polishing is performed over the entire surface of the substrate mounting plate. And
また、前記磁力発生装置の磁力源が永久磁石または電磁石であり、前記磁力発生装置を移動させる手段が、上記磁力源を載せた台にモーターで横振動を与える構造であることを特徴とする。 Further, the magnetic force source of the magnetic force generator is a permanent magnet or an electromagnet, and the means for moving the magnetic force generator has a structure in which a transverse vibration is applied by a motor to a table on which the magnetic force source is placed.
あるいは、前記基板戴置板の上方にも前記基板戴置板下方の磁力源と極性の異なる磁力源を設け、前記スラリー状研磨材を上記両磁力源間に吸着させることにより、前記スラリー状研磨材が前記基板戴置板上面への磁気ブラシを形成することを特徴とする。 Alternatively, a magnetic source having a polarity different from that of the magnetic force source below the substrate mounting plate is also provided above the substrate mounting plate, and the slurry-like polishing material is adsorbed between the magnetic force sources so that the slurry polishing is performed. The material forms a magnetic brush on the upper surface of the substrate mounting plate.
またさらに、前記基板戴置板の上方の磁力源および基板戴置板の下方の磁力源が１つの電磁コイルで励磁され、該電磁コイルから上記基板戴置板上方及び基戴置板下方にヨークが延長され、上記基板戴置板の上方の磁力源および基板戴置板の下方の磁力源を介して前記電磁コイルで励磁された磁気回路が形成されることを特徴とする。 Further, the magnetic source above the substrate mounting plate and the magnetic source below the substrate mounting plate are excited by one electromagnetic coil, and the yoke is disposed above the substrate mounting plate and below the base mounting plate from the electromagnetic coil. And a magnetic circuit excited by the electromagnetic coil is formed through a magnetic force source above the substrate mounting plate and a magnetic force source below the substrate mounting plate.
あるいは、前記基板戴置板の上方の磁力源が前記基板戴置板の中心部上方に設けられ、かつ、基板戴置板の下方の磁力源が軸中心を前記戴置板の中心部下方に設けられた回転円盤の周辺部上方に設けられており、該回転円盤を回転させることにより、前記磁気ブラシが前記基板戴置板の上面に斜めに形成され、前記円盤の回転により該磁気ブラシが基板戴置板上面を周回して研磨することを特徴とする。 Alternatively, the magnetic force source above the substrate mounting plate is provided above the center portion of the substrate mounting plate, and the magnetic force source below the substrate mounting plate is below the center portion of the mounting plate. The magnetic brush is formed obliquely on the upper surface of the substrate mounting plate by rotating the rotary disk, and the magnetic brush is rotated by the rotation of the disk. It is characterized by polishing around the upper surface of the substrate mounting plate.
また、前記磁性粒が、鉄、ニッケル、ステンレス等の磁性体からなる粉状、または円柱状のピンからなり、硬度差からそれ自体は前記ファインセラミックス製の基板戴置板表面を削ることのない材質であることを特徴とする。 In addition, the magnetic particles are composed of powdered or cylindrical pins made of a magnetic material such as iron, nickel, and stainless steel, and themselves do not cut the surface of the fine ceramic substrate mounting plate due to the difference in hardness. It is a material.
以上の説明から明らかなように、本発明によれば、微少凹凸形状に沿った研磨が可能であり、ウエハー等をその上に吸着して移動させるためのファインセラミック製の基板戴置板の、数万個にもおよぶ突起を有する複雑な形状の表面に対して、その突起の凸形状の側面や該突起に埋もれた突起間の戴置板表面をも効果的に均一に鏡面研磨できる効果がある。またさらに、前記各突起の全方向の斜面が均一に研磨できる効果がある。 As is clear from the above description, according to the present invention, polishing along a fine uneven shape is possible, and a substrate mounting plate made of fine ceramic for adsorbing and moving a wafer or the like thereon, For complex surfaces with tens of thousands of protrusions, the convex side surfaces of the protrusions and the surface of the mounting plate between the protrusions buried in the protrusions can be mirror-polished effectively and uniformly. is there. Furthermore, there is an effect that the slopes in all directions of the projections can be uniformly polished.
また、その装置は、従来のバフ研磨やサンドプラストや超音波振動研磨に比べ、その装置が簡単であり、また、研磨効率がいいので短時間で研磨でき、従って、結果的に研磨のコストも低減できる。 In addition, the apparatus is simpler than conventional buffing, sand plast, and ultrasonic vibration polishing, and the polishing efficiency is good, so polishing can be done in a short time. Can be reduced.
以下、本発明の実施の形態を図面に基づいて説明する。
図１に、本発明の研磨の対象である基板戴置装置の基板戴置板（チャック）の概念図を示す。基板戴置板（チャック）１は円板状であって、その表面には無数の突起５が存在する。図１（ａ）は上面図、図１（ｂ）は、側面図である。図１（ｃ）は、図１（ｂ）の突起５の拡大図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual diagram of a substrate mounting plate (chuck) of a substrate mounting apparatus that is an object of polishing according to the present invention. The substrate mounting plate (chuck) 1 has a disk shape, and an infinite number of protrusions 5 exist on the surface thereof. 1A is a top view and FIG. 1B is a side view. FIG.1 (c) is an enlarged view of the protrusion 5 of FIG.1 (b).
図１において、基板戴置板１は、前記ウエハー等を該戴置板上に吸着する構造となっており、その表面には無数の突起５がある。上記吸着方式には静電チャック方式と真空チャック方式がある。前記のように、上記基板戴置装置は、上記基板戴置板及び上記基板吸着装置から構成される。 In FIG. 1, a substrate mounting plate 1 has a structure for adsorbing the wafer or the like on the mounting plate, and there are innumerable protrusions 5 on the surface thereof. There are an electrostatic chuck system and a vacuum chuck system as the above-mentioned adsorption system. As described above, the substrate placement device is configured by the substrate placement plate and the substrate suction device.
また、前記のように、上記チャックの表面の突起は、断面が台形、または頂面を平面にした山形である。該突起の頂面は平坦であり、比較的研磨し易いが、上記突起の側面は、突起５の内方に存在するので研磨が困難である。 Further, as described above, the protrusion on the surface of the chuck has a trapezoidal cross section or a mountain shape with a flat top surface. The top surface of the projection is flat and relatively easy to polish, but the side surface of the projection is inward of the projection 5 and is difficult to polish.
（実施例１）
図２に、本発明に係わる基板戴置板（チャック）１の表面を鏡面研磨する方法の第１の実施例を示す。
Example 1
FIG. 2 shows a first embodiment of a method for mirror polishing the surface of a substrate mounting plate (chuck) 1 according to the present invention.
基板戴置板の表面に磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨材６を戴置し、上記基板の裏面側に磁力発生装置を備えた振動ユニット７を置いて、該磁力発生装置をモーター８により振動（１０）させて、これにより上記基板戴置板表面の研磨材６を振動させ、上記磁性粒及び砥粒を潤滑材に混ぜたスラリー状研磨材が基板戴置板上で振動させられて該研磨材に含まれる砥粒が戴置板表面を研磨することにより、前記戴置板１の表面を鏡面研磨する。なお、上記磁力発生装置は永久磁石でもよい。 A slurry-like abrasive 6 in which magnetic particles and abrasive grains are mixed with a lubricant is placed on the surface of the substrate mounting plate, and a vibration unit 7 having a magnetic force generator is placed on the back side of the substrate to generate the magnetic force. The apparatus is vibrated (10) by the motor 8, thereby causing the abrasive 6 on the surface of the substrate mounting plate to vibrate, and the slurry-like abrasive mixed with the magnetic particles and abrasive grains on the substrate mounting plate is placed on the substrate mounting plate. The surface of the mounting plate 1 is mirror-polished by polishing the surface of the mounting plate with the abrasive grains contained in the abrasive. The magnetic force generator may be a permanent magnet.
この時、重要なのは、上記研磨材に含まれる磁性粒は研磨に寄与しない点である。これは、硬度差から、どんなに角ばった磁性粒を使用しても、セラミック製のチャックのほうが圧倒的に硬いため、キズつけることは無い、すなわち、上記磁性粒は、硬度差からそれ自体は前記ファインセラミックス製の基板戴置板表面を削ることのない材質である。図２と似た構造のものに、磁気バレルがある。磁気バレルは、ワークのバリ取りを目的とし、ワークの下で磁気発生装置を移動、もしくは振動させて、ワーク表面に戴置されている磁性ピン等を振動させ、ワークのバリ取りを行うものである。この磁気バレルにおいては、上記磁性体がワーク表面に突き当たり、ワークの表面に残存するバリを削り落とす作用をする。すなわち、一般に、ワークのバリは、数mm程度の大きなものであり、これを上記磁気研磨材が削り落とすものである。 At this time, it is important that the magnetic particles contained in the abrasive do not contribute to polishing. This is because of the hardness difference, no matter how square the magnetic particles are used, the ceramic chuck is overwhelmingly hard, so it will not be scratched. It is a material that does not cut the surface of the substrate mounting plate made of fine ceramics. A magnetic barrel has a structure similar to that shown in FIG. The magnetic barrel is intended to deburr the work by moving or vibrating the magnet generator under the work to vibrate the magnetic pins placed on the work surface. is there. In this magnetic barrel, the magnetic body hits the workpiece surface and acts to scrape off burrs remaining on the workpiece surface. That is, in general, the burr of the work is a large one of about several mm, and the magnetic abrasive material scrapes off this.
しかし、ファインセラミックス製の前記基板戴置板の表面研磨は、パーティクル発生の原因となるセラミック表面のざらざらした表面を鏡面研磨することが目的である。そして、これを鏡面研磨するとは、欠落してパーティクル発生の要因となる個々の突起の高さをスムージングすることを意味する。 However, the surface polishing of the substrate mounting plate made of fine ceramics is intended to mirror-polish the rough surface of the ceramic surface that causes particle generation. And mirror polishing this means smoothing the height of individual protrusions that are missing and cause particle generation.
従って、上記磁性粒は、磁力源の移動により、磁性材をかき回すのがその主な役目であり、戴置板のセラミック表面を鏡面研磨するのは、研磨材に含まれる砥粒である。
上記磁性粒は、鉄、ニッケル、ステンレス等の磁性体からなる粉状、または円柱状のものが使用される。上記砥粒としては、ダイヤモンド、酸化アルミナ、炭化ケイ素、窒化ケイ素、立方体窒化ホウ素等が用いられる。
Therefore, the main role of the magnetic grains is to stir the magnetic material by moving the magnetic force source, and it is the abrasive grains contained in the abrasive that mirror-polishes the ceramic surface of the mounting plate.
As the magnetic particles, powdery or cylindrical particles made of a magnetic material such as iron, nickel, and stainless steel are used. As the abrasive, diamond, alumina, silicon carbide, silicon nitride, cubic boron nitride or the like is used.
なお、上記ファインセラミックスは、主として組成の面から、以下に分類されるが、全てのファインセラミックスに適用される。
元素系 例：ダイヤモンド（Ｃ）
酸化物系 例：アルミナ（Ａｌ２Ｏ３），ジルコニア
水酸化物系 例：ハイドロキシアパタイト
炭化物系 例：炭化ケイ素（ＳｉＣ）
炭酸塩系
窒化物系 例：窒化ケイ素（Ｓｉ３Ｎ４），窒化アルミニウム（ＡＬＮ）
ハロゲン化物系 例：蛍石
リン酸塩系
In addition, although the said fine ceramics are classified into the following mainly from the surface of a composition, it is applied to all the fine ceramics.
Elemental system Example: Diamond (C)
Oxide system Example: Alumina (Al2O3), Zirconia Hydroxide system Example: Hydroxyapatite Carbide system Example: Silicon carbide (SiC)
Carbonate-based nitride-based examples: silicon nitride (Si3N4), aluminum nitride (ALN)
Halide type Example: Fluorite Phosphate type
上記研磨は、円盤状の戴置板の各部分において行われる。また、図２（ａ）に示されるように、基板戴置板１は正転、逆転を行って、上記研磨箇所を円周方向に移動させる。また、前記磁力発生装置は、１軸ロボット９（図２）により戴置板の半径方向に移動させ、前記円周方向に位置を中から外方、またはその逆方向に移動させ、前記戴置板の回転と併せて、戴置板全面の研磨が行われるように動作する。前記磁力発生装置の磁力源は、永久磁石または電磁石であり、前記磁力発生装置を振動させる手段が、上記磁力源を載せた台にモーター８で横振動を与える構造である。 The polishing is performed on each part of the disk-shaped placement plate. Further, as shown in FIG. 2A, the substrate mounting plate 1 performs normal rotation and reverse rotation to move the polishing portion in the circumferential direction. Further, the magnetic force generator is moved in the radial direction of the mounting plate by the single-axis robot 9 (FIG. 2), and moved in the circumferential direction from the inside to the outside or vice versa. Along with the rotation of the plate, the entire surface of the mounting plate is polished. The magnetic force source of the magnetic force generator is a permanent magnet or an electromagnet, and the means for vibrating the magnetic force generator has a structure in which a motor 8 applies lateral vibration to a table on which the magnetic force source is placed.
（実施例２）
図３は、本発明の第２実施例を示す。
第２実施例においては、前記基板戴置板の上方にも前記基板戴置板下方の磁力源と極性の異なる磁力源を設け、前記スラリー状研磨材を上記両磁力源間に吸着させることにより、前記スラリー状研磨材が前記基板戴置板上面への磁気ブラシを形成する。
(Example 2)
FIG. 3 shows a second embodiment of the present invention.
In the second embodiment, a magnetic force source having a polarity different from that of the magnetic force source below the substrate mounting plate is also provided above the substrate mounting plate, and the slurry-like abrasive is adsorbed between the magnetic force sources. The slurry-like abrasive forms a magnetic brush on the upper surface of the substrate mounting plate.
上記のように、基板戴置板の上方にも前記基板戴置板下方の磁力源と極性の異なる磁力源を設けると、前記磁性材は、上記両磁力源間に吸着させられるが、前記スラリー状研磨材２３は前記基板戴置板１の上面に戴置されているので、該磁性材２３は戴置板表面にのみ存在し、該戴置板表面に上方磁極（Ｓ極）から垂れ下がった形状の磁気ブラシを形成する。 As described above, when a magnetic force source having a polarity different from that of the magnetic force source below the substrate mounting plate is also provided above the substrate mounting plate, the magnetic material is adsorbed between the magnetic force sources. Since the shaped abrasive 23 is placed on the upper surface of the substrate mounting plate 1, the magnetic material 23 exists only on the mounting plate surface and hangs down from the upper magnetic pole (S pole) on the mounting plate surface. Form a shaped magnetic brush.
該磁気ブラシは、基板戴置板下方の磁力源に引っ張られて、該下方の磁力源（Ｎ極）の移動等によって該下方の磁力源の方向にブラシの先端、すなわち戴置板表面に前記磁気ブラシが当接している箇所が左右に移動（振動）することになる。 The magnetic brush is pulled by a magnetic force source below the substrate mounting plate and moved toward the lower magnetic force source by the movement of the lower magnetic source (N pole) or the like, that is, on the surface of the mounting plate. The location where the magnetic brush is in contact moves (vibrates) to the left and right.
前記基板戴置板１の上方の磁力源（Ｓ極）および基板戴置板１の下方の磁力源（Ｎ極）が１つの電磁コイル２６で励磁され、該電磁コイル２６から上記基板戴置板１上方及び基戴置板下方にヨーク２４，２５が延長され、上記基板戴置板１の上方の磁力源（Ｓ極）および基板戴置板の下方の磁力源（Ｎ極）を介して前記電磁コイルで励磁された磁気回路が形成されている。なお、上記Ｓ極、Ｎ極は逆でもよい。 The magnetic source (S pole) above the substrate mounting plate 1 and the magnetic source (N pole) below the substrate mounting plate 1 are excited by one electromagnetic coil 26, and the substrate mounting plate from the electromagnetic coil 26. (1) The yokes 24 and 25 are extended above and below the base plate, and through the magnetic source (S pole) above the base plate 1 and the magnetic source (N pole) below the base plate. A magnetic circuit excited by an electromagnetic coil is formed. The S pole and N pole may be reversed.
この実施例２においては、上記下方の磁力源（Ｎ極）にモーター２１によって横振動が与えられる。この振動は、ヨーク２４を介して除法の磁力源（Ｓ極）にも与えられるが、主たる振動は下方の磁力源（Ｎ極）に与えられ、該下方の磁力源（Ｎ極）が横振動することにより前記戴置板上方の研磨材２３、すなわち前記磁気ブラシの先端が横方向に振られる。このことにより、前記磁気ブラシは、戴置板表面上を微少範囲で移動（振動）し、該戴置板表面を研磨する。 In the second embodiment, a lateral vibration is applied to the lower magnetic force source (N pole) by the motor 21. This vibration is also given to the magnetic field source (S pole) of the division through the yoke 24, but the main vibration is given to the lower magnetic source (N pole), and the lower magnetic source (N pole) is laterally vibrated. As a result, the abrasive 23 above the mounting plate, that is, the tip of the magnetic brush is shaken in the lateral direction. As a result, the magnetic brush moves (vibrates) on the surface of the mounting plate within a minute range, and polishes the surface of the mounting plate.
ただし、研磨材は、前記実施例１と同様の磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨材であって戴置板表面を削ることはなく、ただ、上記磁性粒は前記振動により研磨材を右に左にと、かき回す効果がある。 However, the abrasive is a slurry-like abrasive in which the same magnetic grains as in Example 1 and abrasive grains are mixed with a lubricant and does not scrape the surface of the mounting plate. However, the magnetic grains are caused by the vibration. It has the effect of stirring the abrasives left and right.
このことにより、研磨材２３に含まれる砥粒が戴置板表面にぶつかることになり、このことにより戴置板表面の粗面が研磨され、鏡面へと変化する。前記潤滑剤は、上記磁性粒と砥粒が直接ぶつかることを緩和し、また戴置板表面の砥粒による研磨も緩和する。 As a result, the abrasive grains contained in the polishing material 23 come into contact with the mounting plate surface, whereby the rough surface of the mounting plate surface is polished and changed to a mirror surface. The lubricant alleviates the direct contact between the magnetic grains and the abrasive grains and also reduces the polishing of the mounting plate surface by the abrasive grains.
このようにして、ファインセラミック製の戴置板表面が鏡面研磨される。なお、前記磁気ブラシは、前記磁性粒及び砥粒が潤滑材に浮いている状態であるので、下方磁極の横振動によって柔軟にその形状が変化し、戴置板表面の前記突起５の側面や突起内方の戴置板表面にも自在に進入するので、突起５の側面や突起内方の戴置板表面をも鏡面研磨することができるのである。なお、図３は電磁石を用いているが、永久磁石を用いてもよい。この場合、ヨークは、特になくてもよい。 In this way, the surface of the placing plate made of fine ceramic is mirror-polished. The magnetic brush is in a state where the magnetic grains and abrasive grains are floating on the lubricant, so that the shape thereof is flexibly changed by the lateral vibration of the lower magnetic pole, and the side surface of the projection 5 on the surface of the mounting plate Since it can freely enter the surface of the mounting plate inside the protrusion, the side surface of the protrusion 5 and the surface of the mounting plate inside the protrusion can be mirror-polished. Although FIG. 3 uses an electromagnet, a permanent magnet may be used. In this case, the yoke is not particularly required.
（実施例３）
図４，図５には、本発明の第３実施例を示す。
図３の第２実施例と異なる点は、第３実施例においては、下方磁極が円盤上に載せられていて、該円盤が戴置板の下方で回転する点である。なお、下方磁極（Ｎ極）の載せられている位置は、中心ではなく周辺に近く、偏心している。
(Example 3)
4 and 5 show a third embodiment of the present invention.
The difference from the second embodiment of FIG. 3 is that in the third embodiment, the lower magnetic pole is placed on the disk, and the disk rotates below the mounting plate. The position where the lower magnetic pole (N pole) is placed is not the center but near the periphery and is eccentric.
すなわち、前記基板戴置板の上方の磁力源（Ｓ極）が前記基板戴置板の中心部上方に設けられ、かつ、基板戴置板の下方の磁力源（Ｎ極）４３が軸中心を前記戴置板１の中心部下方に設けられた回転円盤４５の周辺部上方に設けられており、該回転円盤４５を回転駆動装置４６により回転させることにより、前記磁気ブラシ４２が前記基板戴置板の上面に斜めに形成され、上記円盤の回転４５により該磁気ブラシ４２が基板戴置板上面を周回して研磨する。このように、下方の磁極（Ｎ極）が偏心して回転し、前記磁気ブラシが前記突起の全周方向から万偏なく研磨することになるので、その突起の側面や該突起に埋もれた戴置板表面をも均一に鏡面研磨できる。上記磁気発生装置の回転方向４５は、時々回転方向を逆にする方が望ましい。また、上記偏心回転動作は、戴置板を載せたテーブル４８を回転させる構造でもよい。この場合、下方磁力発生装置は、回転しなくてもよいのであるが、これらを併用して、下方磁力発生装置および戴置板を載せた台を同時に逆方向に回転してもよい。このようにすれば、研磨速度が倍化し、研磨効果や研磨効率も倍化する。 That is, the magnetic force source (S pole) above the substrate mounting plate is provided above the center of the substrate mounting plate, and the magnetic source (N pole) 43 below the substrate mounting plate is centered on the axis. The magnetic brush 42 is mounted on the substrate by rotating the rotating disk 45 by a rotation driving device 46 provided above the peripheral part of the rotating disk 45 provided below the center of the mounting plate 1. The magnetic brush 42 is formed on the upper surface of the plate at an angle and is rotated around the upper surface of the substrate mounting plate by the rotation 45 of the disk. In this way, the lower magnetic pole (N pole) rotates eccentrically, and the magnetic brush is polished evenly from the entire circumferential direction of the projection, so that the side surface of the projection and the placement buried in the projection The plate surface can be evenly mirror-polished. It is desirable that the rotation direction 45 of the magnetism generator is sometimes reversed. The eccentric rotation operation may be a structure for rotating the table 48 on which the mounting plate is placed. In this case, the lower magnetic force generator does not need to rotate, but using these together, the lower magnetic force generator and the table on which the mounting plate is placed may be simultaneously rotated in the opposite direction. In this way, the polishing rate is doubled, and the polishing effect and polishing efficiency are also doubled.
なお、研磨材は、実施例１，２と同様であって、前記磁性粒が、鉄、ニッケル、ステンレス等の磁性体からなる粉状、または円柱状のピンからなり、該磁性粒は、硬度差からそれ自体は前記ファインセラミックス製の基板戴置板表面を削ることのない材質である。また、上記磁極は、Ｓ，Ｎが逆の構成でもよい。 The abrasive is the same as in Examples 1 and 2, and the magnetic particles are made of a powdery or cylindrical pin made of a magnetic material such as iron, nickel, and stainless steel, and the magnetic particles have a hardness. From the difference, the material itself is a material that does not scrape the surface of the fine ceramic substrate mounting plate. Further, the magnetic pole may have a configuration in which S and N are reversed.
また、第３実施例の他の例として、前記基板戴置板の下方の磁力源（Ｎ極）が前記基板戴置板の中心部下方に設けられ、かつ、基板戴置板の上方の磁力源（Ｓ極）が軸中心を前記戴置板１の中心部上方に設けられた回転円盤の周辺部下方に設けられており、該回転円盤を回転駆動装置により回転させることにより、前記磁気ブラシが前記基板戴置板の上面に斜めに形成され、前記円盤の回転により該磁気ブラシが基板戴置板上面を周回して研磨する構造としてもよい。この構造は、前記のように、上下磁極が固定され、偏心回転動作が基板戴置板を載せた回転円盤の回転によって行われる構造にも応用できる。すなわち、この場合、上方磁極は、偏心して固定され、下方磁極は軸中心に固定されていて、基板戴置板が回転する構造となる。もちろん、前記同様、上記偏心磁極自体の回転をこれに併用してもよい。 As another example of the third embodiment, a magnetic force source (N pole) below the substrate mounting plate is provided below the center of the substrate mounting plate, and the magnetic force above the substrate mounting plate. A source (S pole) is provided below the periphery of a rotating disk provided at the center of the mounting plate 1 above the axis, and the magnetic brush is rotated by rotating the rotating disk with a rotation driving device. May be formed obliquely on the upper surface of the substrate mounting plate, and the magnetic brush may circulate around the upper surface of the substrate mounting plate and be polished by the rotation of the disk. As described above, this structure can also be applied to a structure in which the upper and lower magnetic poles are fixed and the eccentric rotation operation is performed by the rotation of the rotating disk on which the substrate mounting plate is placed. That is, in this case, the upper magnetic pole is eccentrically fixed and the lower magnetic pole is fixed at the center of the axis, and the substrate mounting plate rotates. Of course, as described above, the rotation of the eccentric magnetic pole itself may be used together.
上記回転円盤４５は、回転駆動装置４６と共に、移動装置４７の上に設けられており、該移動装置４７を前記戴置板１の横方向、縦方向に移動させることにより、前記同様、上記磁気ブラシの先端による研磨箇所を移動させ、前記戴置板全面を研磨できるようになっている。 The rotating disk 45 is provided on the moving device 47 together with the rotation driving device 46. By moving the moving device 47 in the horizontal direction and the vertical direction of the mounting plate 1, the magnetic disk as described above. The polishing part by the tip of the brush is moved so that the entire surface of the mounting plate can be polished.
なお、図４は縦方向から見た図であり、図５は横方向から見た図である。図５に示されるように、基板戴置板の上方の磁力源（Ｓ極）４１と基板戴置板の下方の磁力源（Ｎ極）４３が支持柱５０で移動装置４７上に支持されている。また、前記同様、図４，図５は電磁石の例を示しているが、永久磁石を用いてもよい。 4 is a view seen from the vertical direction, and FIG. 5 is a view seen from the horizontal direction. As shown in FIG. 5, a magnetic source (S pole) 41 above the substrate mounting plate and a magnetic source (N pole) 43 below the substrate mounting plate are supported on the moving device 47 by the support pillar 50. Yes. 4 and 5 show examples of electromagnets as described above, but permanent magnets may be used.
図６に、このようにして鏡面研磨した基板戴置板表面粗さの測定結果を示す。
測定結果より、基板戴置板の表面が非常になだらかな鏡面になっているのが分かる。なお、前記戴置板状の突起は、エッチングやマシニングにより形成されることもあるが、その場合も本発明の鏡面研磨は有効である。
FIG. 6 shows the measurement result of the surface roughness of the substrate mounting plate mirror-polished in this way.
From the measurement results, it can be seen that the surface of the substrate mounting plate has a very smooth mirror surface. The mounting plate-like protrusions may be formed by etching or machining, but in this case, the mirror polishing of the present invention is effective.
また、図７に、各突起（ピン部）の斜面の形状の測定結果を示す。該測定結果から、突起の全方向が均一に研磨されていることが分かる。例えば、バフ研磨のような場合、研磨に方向による偏りがあるので、上記突起の全方向の斜面の形状が一致しない欠点があるが、本発明の研磨方法によるとこのような欠点が生じないので、突起の鏡面研磨方法として非常に優れたものである。 FIG. 7 shows the measurement result of the shape of the slope of each protrusion (pin part). From the measurement results, it can be seen that all directions of the protrusions are uniformly polished. For example, in the case of buffing, since there is a deviation in the direction of polishing, there is a defect that the shape of the slope of the projection in all directions does not match, but according to the polishing method of the present invention, such a defect does not occur. This is a very excellent method for mirror polishing of protrusions.
なお、図７は図７（ｂ）の各方向への触針を垂らした図７（ｃ）の中間部位での測定結果であるが、中央部や外周部でもほぼ同様の測定結果が得られている。 Note that FIG. 7 shows the measurement results at the intermediate portion of FIG. 7C where the stylus is hung in each direction of FIG. 7B, but almost the same measurement results are obtained at the central portion and the outer peripheral portion. ing.
１ 基板戴置板（チャック）
５ 突起
６ 研磨材
７ 振動ユニット
８ モーター
２１，２２ モーター
２３ 研磨材
２４，２５ ヨーク
２８ 回転テーブル
３０ 振動ユニット
４１ 磁極
４２ 研磨材
４３ 磁極
４６ 回転駆動装置
４７ 移動装置
1 Substrate mounting plate (chuck)
5 Protrusion 6 Abrasive Material 7 Vibration Unit 8 Motor 21, 22 Motor 23 Abrasive Material 24, 25 Yoke 28 Rotating Table 30 Vibrating Unit 41 Magnetic Material 42 Abrasive Material 43 Magnetic Material 46 Rotation Drive Device 47 Moving Device
Claims (16)
該基板戴置板の表面に磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨材を戴置し、上記基板戴置板の裏面側に磁力発生装置を置いて、該磁力発生装置を移動させて、上記基板戴置板表面の研磨材を移動させ、前記基板戴置板の表面を鏡面研磨することを特徴とする前記基板戴置板の表面研磨方法。 A method of polishing a surface of a substrate mounting plate having a protrusion for a substrate mounting device,
A slurry-like abrasive in which magnetic particles and abrasive grains are mixed with a lubricant is placed on the surface of the substrate mounting plate, and a magnetic force generator is placed on the back side of the substrate mounting plate to move the magnetic force generator. Then, the polishing material on the surface of the substrate mounting plate is moved, and the surface of the substrate mounting plate is mirror-polished, and the surface polishing method of the substrate mounting plate is characterized in that:
該基板戴置板の表面に戴置した磁性粒、砥粒を潤滑材に混ぜたスラリー状研磨材、上記基板戴置板の裏面側に設けた磁力発生装置とからなり、該磁力発生装置を移動させて上記基板戴置板表面の研磨材を移動させ、前記基板戴置板の表面を鏡面研磨することを特徴とする前記基板戴置装置用の基板戴置板の表面研磨装置。 A device for polishing the surface of a substrate mounting plate having a protrusion for a substrate mounting device,
A magnetic particle placed on the surface of the substrate mounting plate, a slurry-like abrasive mixed with abrasives in a lubricant, and a magnetic force generator provided on the back side of the substrate mounting plate. A surface polishing apparatus for a substrate mounting plate for a substrate mounting apparatus, wherein the polishing material on the surface of the substrate mounting plate is moved to move the mirror surface of the substrate mounting plate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101482842B1 (en) * | 2013-04-01 | 2015-01-15 | 한국 천문 연구원 | Polishing apparatus |
| CN107004558A (en) * | 2014-11-07 | 2017-08-01 | 株式公司品維斯 | Process components and the plasma etch resistance enhanced processing method of process components that plasma etch resistance is improved |
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| JPH09283605A (en) * | 1996-04-09 | 1997-10-31 | Canon Inc | Substrate sucking and holding device and manufacturing method therefor |
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| JP2007021661A (en) * | 2005-07-15 | 2007-02-01 | Fdk Corp | Method of mirror-polishing complicated shape body, and mirror-polishing device |
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| JPS6034264A (en) * | 1983-08-06 | 1985-02-21 | Toubu M X Kk | Magnetic finishing method and device thereof |
| JPH09283605A (en) * | 1996-04-09 | 1997-10-31 | Canon Inc | Substrate sucking and holding device and manufacturing method therefor |
| JP2002283216A (en) * | 2001-03-27 | 2002-10-03 | Japan Science & Technology Corp | Magnetic polishing method utilizing ellipse vibration, device therefor and magnetic abrasive grain |
| JP2007021661A (en) * | 2005-07-15 | 2007-02-01 | Fdk Corp | Method of mirror-polishing complicated shape body, and mirror-polishing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101482842B1 (en) * | 2013-04-01 | 2015-01-15 | 한국 천문 연구원 | Polishing apparatus |
| CN107004558A (en) * | 2014-11-07 | 2017-08-01 | 株式公司品維斯 | Process components and the plasma etch resistance enhanced processing method of process components that plasma etch resistance is improved |
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