JP2010016213A - プラズマエッチング方法、制御プログラム及びコンピュータ記憶媒体 - Google Patents
プラズマエッチング方法、制御プログラム及びコンピュータ記憶媒体 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 102
- 238000001020 plasma etching Methods 0.000 title claims abstract description 73
- 238000005530 etching Methods 0.000 claims abstract description 98
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 30
- 229910003481 amorphous carbon Inorganic materials 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 8
- 238000007796 conventional method Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 78
- 230000008569 process Effects 0.000 description 64
- 239000004065 semiconductor Substances 0.000 description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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Abstract
【解決手段】 有機膜102をエッチングして被エッチング膜101のマスクパターンを形成する際に、少なくとも、有機膜102の一部をエッチングする第1有機膜エッチング工程と、第1有機膜エッチング工程の後、Si含有膜103と有機膜102を希ガスのプラズマに晒すトリートメント工程と、トリートメント工程の後、有機膜102の残部をエッチングする第2有機膜エッチング工程を具備している。
【選択図】 図2
Description
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(第1有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=10秒
(トリートメント工程)
トリートメントガス:Ar=750sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=15秒
(第2有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分20秒
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分30秒
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(第1有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=10秒
(トリートメント工程)
トリートメントガス:Ar=750sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/(0,200,1000)W
時間=15秒
(第2有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分20秒
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(第1有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=2000/1000W
時間=10秒
(トリートメント工程)
トリートメントガス:Ar=750sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=(2000,1000,800)/1000W
時間=15秒
(第2有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分30秒
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(第1有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=10秒
(トリートメント工程)
トリートメントガス:Ar=750sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=15秒
(第2有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分20秒
エッチングガス:CF4=150sccm
圧力6.67Pa(50mTorr)
電力(上部/下部)=300/300W
時間=1分17秒
(トリートメント工程)
トリートメントガス:Ar=750sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/(1000,500)W
時間=15秒
(有機膜エッチング工程)
エッチングガス:CO/O2=150/300sccm
圧力=2.67Pa(20mTorr)
電力(上部/下部)=2000/1000W
時間=1分30秒
Claims (8)
- 下側から順に少なくとも、被エッチング膜と、前記被エッチング膜のマスクとなる有機膜と、Si含有膜とが積層された被処理基板をプラズマを用いてエッチングするプラズマエッチング方法であって、
前記有機膜をエッチングして前記被エッチング膜のマスクパターンを形成する際に、
少なくとも、
前記有機膜の一部をエッチングする第1有機膜エッチング工程と、
前記第1有機膜エッチング工程の後、前記Si含有膜と前記有機膜を希ガスのプラズマに晒すトリートメント工程と、
前記トリートメント工程の後、前記有機膜の残部をエッチングする第2有機膜エッチング工程と
を具備したことを特徴とするプラズマエッチング方法。 - 請求項1記載のプラズマエッチング方法であって、
前記希ガスのプラズマがArガス単ガスのプラズマであることを特徴とするプラズマエッチング方法。 - 請求項2記載のプラズマエッチング方法であって、
前記トリートメント工程では、前記被処理基板にバイアス用高周波電力を作用させることを特徴とするプラズマエッチング方法。 - 請求項1〜3いずれか1項記載のプラズマエッチング方法であって、
前記有機膜をエッチングして前記被エッチング膜のマスクパターンを形成する工程が、
前記第1有機膜エッチング工程と、前記トリートメント工程と、前記第2有機膜エッチング工程の3つの工程からなることを特徴とするプラズマエッチング方法。 - 請求項1〜4いずれか1項記載のプラズマエッチング方法であって、
前記有機膜がアモルファスカーボン膜であることを特徴とするプラズマエッチング方法。 - 請求項1〜5いずれか1項記載のプラズマエッチング方法であって、
前記Si含有膜が、SiON膜、SiC膜、SiN膜のいずれかであることを特徴とするプラズマエッチング方法。 - コンピュータ上で動作し、実行時に、請求項1から請求項6いずれか1項記載のプラズマエッチング方法が行われるようにプラズマエッチング装置を制御することを特徴とする制御プログラム。
- コンピュータ上で動作する制御プログラムが記憶されたコンピュータ記憶媒体であって、
前記制御プログラムは、実行時に請求項1から請求項6いずれか1項記載のプラズマエッチング方法が行われるようにプラズマエッチング装置を制御することを特徴とするコンピュータ記憶媒体。
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JP2008175391A JP5064319B2 (ja) | 2008-07-04 | 2008-07-04 | プラズマエッチング方法、制御プログラム及びコンピュータ記憶媒体 |
US12/497,106 US8298960B2 (en) | 2008-07-04 | 2009-07-02 | Plasma etching method, control program and computer storage medium |
TW098122649A TWI525692B (zh) | 2008-07-04 | 2009-07-03 | Plasma etching method, control program and computer memory media |
KR1020090060728A KR101540816B1 (ko) | 2008-07-04 | 2009-07-03 | 플라즈마 에칭 방법, 컴퓨터 기억 매체 및 플라즈마 에칭 장치 |
CN2009101587110A CN101621000B (zh) | 2008-07-04 | 2009-07-03 | 等离子体蚀刻方法 |
US13/644,619 US8642482B2 (en) | 2008-07-04 | 2012-10-04 | Plasma etching method, control program and computer storage medium |
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KR101190804B1 (ko) * | 2010-11-19 | 2012-10-12 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마처리방법 |
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JP5064319B2 (ja) * | 2008-07-04 | 2012-10-31 | 東京エレクトロン株式会社 | プラズマエッチング方法、制御プログラム及びコンピュータ記憶媒体 |
JP5289863B2 (ja) * | 2008-08-28 | 2013-09-11 | 東京エレクトロン株式会社 | アモルファスカーボンナイトライド膜の形成方法、多層レジスト膜、半導体装置の製造方法および制御プログラムが記憶された記憶媒体 |
US8227339B2 (en) * | 2009-11-02 | 2012-07-24 | International Business Machines Corporation | Creation of vias and trenches with different depths |
US8304262B2 (en) * | 2011-02-17 | 2012-11-06 | Lam Research Corporation | Wiggling control for pseudo-hardmask |
US9865459B2 (en) * | 2015-04-22 | 2018-01-09 | Applied Materials, Inc. | Plasma treatment to improve adhesion between hardmask film and silicon oxide film |
CA3016456A1 (en) | 2016-03-07 | 2017-09-14 | HyTech Power, Inc. | A method of generating and distributing a second fuel for an internal combustion engine |
US10964590B2 (en) * | 2017-11-15 | 2021-03-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Contact metallization process |
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TW201021116A (en) | 2010-06-01 |
US20100003825A1 (en) | 2010-01-07 |
US8298960B2 (en) | 2012-10-30 |
KR101540816B1 (ko) | 2015-07-30 |
CN101621000A (zh) | 2010-01-06 |
CN101621000B (zh) | 2011-12-28 |
US8642482B2 (en) | 2014-02-04 |
TWI525692B (zh) | 2016-03-11 |
JP5064319B2 (ja) | 2012-10-31 |
KR20100004891A (ko) | 2010-01-13 |
US20130029493A1 (en) | 2013-01-31 |
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