JP2010010618A - Container for electronic component - Google Patents

Container for electronic component Download PDF

Info

Publication number
JP2010010618A
JP2010010618A JP2008171282A JP2008171282A JP2010010618A JP 2010010618 A JP2010010618 A JP 2010010618A JP 2008171282 A JP2008171282 A JP 2008171282A JP 2008171282 A JP2008171282 A JP 2008171282A JP 2010010618 A JP2010010618 A JP 2010010618A
Authority
JP
Japan
Prior art keywords
substrate member
container body
frame members
electronic component
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008171282A
Other languages
Japanese (ja)
Inventor
Hirokazu Kobayashi
宏和 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP2008171282A priority Critical patent/JP2010010618A/en
Publication of JP2010010618A publication Critical patent/JP2010010618A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To maintain strength while ensuring the volume of a recess even in miniaturizing a container than in the prior art. <P>SOLUTION: The container has: a substrate member made from one of glass, quartz, silicon (Si), and ceramics; and a plurality of frame members made from one of kovar, SUS, and an iron-nickel alloy. The thickness and width of each frame member are set smaller than the thickness of the substrate member for formation, and a diffused junction is performed to form a recess while the substrate member and the plurality of frame members are overlapped. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、気密封止や保護が必要な電子部品に用いられる電子部品用の容器体に関する。   The present invention relates to a container body for an electronic component used for an electronic component that requires hermetic sealing or protection.

近年より電子機器は小型化が進み、それに伴い、内部に搭載される電子部品の小型化が進んでいる。
このような電子機器に搭載される電子部品には、カバーとなる蓋体と容器体とを設けて保護する必要がある部品がある。これら蓋体と容器体とにより、保護が必要な部品を異物や外部環境からの影響を防ぐことができる。
この保護が必要な電子部品の一つの例として圧電振動素子がある。
この圧電振動素子は、例えば、基板体に搭載された後に凹部を有する蓋体で気密封止して保護される（例えば、特許文献１参照）。又は、圧電振動素子は、凹部を有する基板体内に搭載され、平板状の蓋体で気密封止されて保護される（例えば、特許文献２参照）。 In recent years, electronic devices have been reduced in size, and accordingly, electronic components mounted therein have been reduced in size.
Among electronic components mounted on such electronic devices, there are components that need to be protected by providing a cover body and a container body as a cover. By these lids and containers, it is possible to prevent the parts that need to be protected from being affected by foreign matter or the external environment.
One example of an electronic component that requires this protection is a piezoelectric vibration element.
The piezoelectric vibration element is protected by being hermetically sealed with a lid having a recess after being mounted on the substrate body (see, for example, Patent Document 1). Alternatively, the piezoelectric vibration element is mounted in a substrate body having a recess, and is hermetically sealed with a flat lid member to be protected (see, for example, Patent Document 2).

ここで、蓋体は、主に金属で形成され、主材となる金属板に封止材を設けて打抜き加工により平板状に形成されている。
また、容器体は、主にセラミックスで形成されている。この容器体に凹部を形成する場合は、所定の配線パターンが形成されたシート状のセラミックスを積層させて、焼成することにより形成される。したがって、積層させるシート状のセラミックスは、凹部の縁である枠となるために、複数の貫通穴部が形成された状態で積層されることとなる。 Here, the lid is mainly made of metal, and is formed in a flat plate shape by punching with a sealing material provided on a metal plate as a main material.
The container body is mainly formed of ceramics. In the case where the recess is formed in the container body, it is formed by laminating and baking sheet-like ceramics on which a predetermined wiring pattern is formed. Therefore, the sheet-like ceramics to be laminated are laminated in a state where a plurality of through-hole portions are formed in order to form a frame that is an edge of the recess.

特開２００７−０１３６０８号公報JP 2007-013608 A 特開２００７−２０８４７０号公報JP 2007-208470 A

しかしながら、電子部品を小型化する場合、保護が必要な部品を保護する容器体も小型化されることとなるが、従来のような構成の容器体の場合、特に凹部を有する容器体の場合は、容器体の強度を高くする観点から、凹部を形成する枠となる部分の幅の値をシート状のセラミックスの厚みの値よりも大きくして設ける必要があった。そのためこの枠の部分を大きくすると、この枠となる部分で形成される凹部の容積が小さくなることにより、所定の大きさの圧電振動子等の保護を必要とする電子部品を凹部内に搭載する場合、凹部の容積を確保しなくてはならず、容器体の小型化が困難になるという問題があった。   However, when electronic components are downsized, the container body that protects parts that need protection is also downsized. However, in the case of a container body having a conventional structure, particularly in the case of a container body having a recess. From the viewpoint of increasing the strength of the container body, it has been necessary to provide the width value of the portion serving as the frame for forming the recesses larger than the thickness value of the sheet-like ceramic. For this reason, when this frame portion is enlarged, the volume of the recess formed in this frame portion is reduced, so that an electronic component that requires protection such as a piezoelectric vibrator of a predetermined size is mounted in the recess. In this case, there is a problem that it is difficult to reduce the size of the container body because the volume of the concave portion must be ensured.

そこで、本発明では、前記した問題を解決し、容器体を従来よりも小型にしても凹部の容積を確保しつつ強度を維持できる電子部品用の容器体を提供することを課題とする。   Therefore, an object of the present invention is to solve the above-described problems and provide a container body for an electronic component that can maintain strength while ensuring the volume of the recess even if the container body is made smaller than before.

前記課題を解決するため、本発明は、電子部品用の容器体であって、ガラス、水晶、シリコン（Ｓｉ）、セラミックスのいずれかから選択されてなる基板部材と、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる複数の枠部材と、を備え、
それぞれの前記枠部材の厚みと幅の値が前記基板部材の厚みの値より小さく形成され、
前記基板部材と前記複数の枠部材とが重ねられた状態で拡散接合されて凹部を形成していることを特徴とする。 In order to solve the above-mentioned problems, the present invention is a container for an electronic component, which is a substrate member selected from glass, quartz, silicon (Si), and ceramics, and Kovar, SUS, iron-nickel alloy A plurality of frame members selected from any one of
The thickness and width values of each frame member are formed smaller than the thickness value of the substrate member,
The substrate member and the plurality of frame members are diffusion bonded in a state of being overlapped to form a recess.

また、本発明は、それぞれの前記枠部材の厚みと幅の値が前記基板部材の厚みの値より小さく形成されていても良い。   In the present invention, the thickness and width values of the frame members may be smaller than the thickness value of the substrate member.

このような電子部品用の容器体によれば、基板部材と複数の枠部材とが拡散接合により接合されているため、強度を確保することができる。
このような電子部品用の容器体によれば、容器体を構成する複数の枠部材の幅の値と厚みの値とが、基板部材の厚みよりも小さくなっていることにより、凹部の容積を従来よりも広く設けることができる。また、枠部材が、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなることにより、枠部材の幅を小さくしても、容器体の強度を維持することができる。
また、複数の枠部材は、フォトリソグラフィ技術とエッチング技術により容易に製作でき、また、基板部材と複数の枠部材とは、拡散接合により容易に接合できる。そのため、生産性が向上し、製品のコストダウンに貢献することができる。
したがって、このような電子部品用の容器体によれば、容器体を従来よりも小型にしても凹部の容積を確保しつつ強度を維持できる。 According to such a container for an electronic component, since the substrate member and the plurality of frame members are joined by diffusion bonding, the strength can be ensured.
According to such a container body for electronic components, the width value and the thickness value of the plurality of frame members constituting the container body are smaller than the thickness of the substrate member, thereby reducing the volume of the recess. It can be provided wider than before. In addition, since the frame member is selected from any of Kovar, SUS, and iron-nickel alloy, the strength of the container body can be maintained even if the width of the frame member is reduced.
The plurality of frame members can be easily manufactured by photolithography technology and etching technology, and the substrate member and the plurality of frame members can be easily joined by diffusion bonding. Therefore, productivity can be improved and the cost of the product can be reduced.
Therefore, according to such a container body for electronic components, the strength can be maintained while securing the volume of the recess even if the container body is made smaller than the conventional container body.

次に、本発明を実施するための最良の形態（以下、「実施形態」という。）について、適宜図面を参照しながら詳細に説明する。なお、各構成要素について、状態をわかりやすくするために、誇張して図示している。
また、電子部品を圧電振動子として説明する。 Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate. Note that each component is exaggerated for easy understanding of the state.
The electronic component is described as a piezoelectric vibrator.

図１は本発明の実施形態に係る電子部品用の容器体の一例を概念的に示す斜視図である。図２は図１の分解斜視図である。図３は本発明の実施形態に係る電子部品用の容器体の他の例を概念的に示す分解斜視図である。
圧電振動子は、例えば、励振電極を両主面に設けた圧電振動素子と、凹部を有し、その凹部内に設けられる圧電振動素子を搭載するための搭載パッドと外部に設けられる外部端子とが備えられた容器体と、この容器体に接合されて圧電振動素子を覆いつつ気密封止する蓋体とから構成されている。
この圧電振動子に用いられる本発明の実施形態に係る電子部品用の容器体１０１は、図１及び図２に示すように、基板部材１０と、３つの枠部材（複数の枠部材）２０とから構成されている。 FIG. 1 is a perspective view conceptually showing an example of a container body for an electronic component according to an embodiment of the present invention. 2 is an exploded perspective view of FIG. FIG. 3 is an exploded perspective view conceptually showing another example of an electronic component container according to an embodiment of the present invention.
The piezoelectric vibrator includes, for example, a piezoelectric vibration element provided with excitation electrodes on both main surfaces, a mounting pad for mounting the piezoelectric vibration element provided in the recess, and an external terminal provided outside. And a lid body that is bonded to the container body and hermetically seals while covering the piezoelectric vibration element.
As shown in FIGS. 1 and 2, a container body 101 for an electronic component according to an embodiment of the present invention used for this piezoelectric vibrator has a substrate member 10, three frame members (a plurality of frame members) 20, and It is composed of

基板部材１０は、ガラス、水晶、シリコン（Ｓｉ）、セラミックスのいずれかから選択されて用いられる。なお、本実施形態においては、材質をセラミックスとして説明する。
この基板部材１０は、図２に示すように、平面視矩形形状となるように平板状に形成されている。基板部材１０の一方の主面には、後述する枠部材２０と接合するための金属膜Ｍが縁に沿って設けられている。この金属膜Ｍの幅は、枠部材２０と重ねたときに接触する位置から縁までの間隔で形成されている。
この金属膜Ｍで囲まれた内部に圧電振動素子を搭載するための搭載パッドＰが２つ一対で形成されている。
この搭載パッドＰは、基板部材１０の他方の主面に設けられた外部端子（図示せず）と電気的に接続している。
なお、この基板部材１０は、複数個が並べられた状態でウェハ状になっており、個片に切断された後、若しくはウェハの状態で後述する枠部材が従来周知の陽極接合により接合される。 The substrate member 10 is selected from any one of glass, quartz, silicon (Si), and ceramics. In the present embodiment, the material is described as ceramics.
As shown in FIG. 2, the substrate member 10 is formed in a flat plate shape so as to have a rectangular shape in plan view. On one main surface of the substrate member 10, a metal film M for joining to a frame member 20 described later is provided along the edge. The width of the metal film M is formed at an interval from a position where the metal film M comes into contact with the frame member 20 to the edge.
Two mounting pads P for mounting the piezoelectric vibration element are formed in a pair surrounded by the metal film M.
The mounting pad P is electrically connected to an external terminal (not shown) provided on the other main surface of the substrate member 10.
The substrate member 10 is in the form of a wafer in a state where a plurality of the substrate members 10 are arranged, and after being cut into pieces, a frame member to be described later is joined by well-known anodic bonding in the state of the wafer. .

３つの枠部材２０は、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されて用いられる。なお、本実施形態においては、材質をコバールとして説明する。
この枠部材２０は、図２に示すように、基板部材１０の縁から内側に所定の距離を離れた位置に沿うように環状に形成された部材である。
この枠部材２０の幅の値は、基板部材１０の厚みの値よりも小さくされており、例えば、基板部材１０の厚みｔ１が０．２ｍｍの場合、枠部材２０の幅の値ｗ１は、０．０５ｍｍとなる。なお、枠部材２０の厚みｔ２を枠部材２０の幅の値ｗ１と同じ厚みとしてもよい。
枠部材２０は、基板部材１０と同様に、フォトリソグラフィ技術とエッチング技術とを用いて製造される。 The three frame members 20 are selected from one of Kovar, SUS, and iron-nickel alloy. In the present embodiment, description will be made assuming that the material is Kovar.
As shown in FIG. 2, the frame member 20 is a member formed in an annular shape so as to follow a position away from the edge of the substrate member 10 by a predetermined distance.
The width value of the frame member 20 is smaller than the thickness value of the substrate member 10. For example, when the thickness t1 of the substrate member 10 is 0.2 mm, the width value w1 of the frame member 20 is 0. .05mm. The thickness t2 of the frame member 20 may be the same thickness as the width value w1 of the frame member 20.
The frame member 20 is manufactured using a photolithography technique and an etching technique in the same manner as the substrate member 10.

この本発明の第一の実施形態に係る電子部品用の容器体１０１は、基板部材１０の一方の主面に３つの枠部材２０を重ねて、所定の圧力下で加圧して拡散接合の状態にして接合がなされる。
ここで、拡散接合とは、母材を密着させた状態で母材の融点以下の温度条件で、塑性変形をできるだけ生じない程度に加圧して、接合面間に生じる原子の拡散を接合する方法をいう（「ＪＩＳ工業用語大辞典第５版」、財団法人日本規格協会発行、Ｐ３３１）。
これにより、基板部材１０の一方の主面に３つの枠部材２０が接合されて凹部Ｋが形成される。 In the electronic component container body 101 according to the first embodiment of the present invention, three frame members 20 are stacked on one main surface of the substrate member 10 and pressed under a predetermined pressure to be in a diffusion bonded state. And joining is performed.
Here, diffusion bonding is a method in which the diffusion of atoms occurring between the bonding surfaces is bonded by applying pressure to the extent that plastic deformation does not occur as much as possible under a temperature condition equal to or lower than the melting point of the matrix with the matrix in close contact. ("JIS Industrial Glossary Dictionary 5th Edition", published by the Japanese Standards Association, P331).
As a result, the three frame members 20 are joined to one main surface of the substrate member 10 to form the recesses K.

このような電子部品用の蓋体１０１によれば、複数の枠部材２０が、フォトリソグラフィ技術とエッチング技術により、厚みが従来よりも薄い部材から従来より幅を狭くして製造することできる。また、枠部材２０は、フォトリソグラフィ技術とエッチング技術により幅が従来よりも狭く形成できるため、圧電振動素子（図示せず）を気密封止する空間を確保しつつ、蓋体１０１の全体を従来よりも小さくすることができる。
また、複数の枠部材２０は、拡散接合により容易に接合できる。そのため、従来よりも薄く、また、幅が狭く形成されていても容易に接合することができるので、生産性が向上し、製品のコストダウンに貢献することができる。 According to such a lid 101 for an electronic component, the plurality of frame members 20 can be manufactured from a member having a smaller thickness than that of a conventional member by using a photolithography technique and an etching technique. Further, since the frame member 20 can be formed narrower than in the prior art by the photolithography technique and the etching technique, the entire lid 101 is secured while securing a space for hermetically sealing the piezoelectric vibration element (not shown). Can be made smaller.
The plurality of frame members 20 can be easily joined by diffusion joining. Therefore, even if it is thinner and narrower than before, it can be easily joined, so that productivity can be improved and the cost of the product can be reduced.

なお、変形例として、図３に示すように、本発明の実施形態に係る容器体１０２は、基板部材１１と枠部材２１との平面形状の外周形状を同一に構成しても良い。   As a modification, as shown in FIG. 3, the container body 102 according to the embodiment of the present invention may have the same planar outer peripheral shape of the substrate member 11 and the frame member 21.

以上、本発明の実施形態について説明したが、本発明は前記実施形態には限定されない。例えば、枠部材を３つとして説明したがこれに限定されず、２つや４つなどの自然数となる数を重ねて用いても良い。
また、圧電振動素子は、例えば、ＳＴカットやＡＴカットされた水晶振動素子、音叉型の水晶振動素子又はセンサ、ベベル加工やコンペックス加工やプラノコンベックス加工された水晶振動素子、ＳＡＷデバイスに用いられる水晶板などであっても良い。 As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, although three frame members have been described, the present invention is not limited to this, and a natural number such as two or four may be used in an overlapping manner.
The piezoelectric vibration element is used for, for example, ST-cut or AT-cut crystal vibration elements, tuning-fork type crystal vibration elements or sensors, bevel processing, complex processing, plano convex processing crystal vibration elements, and SAW devices. It may be a crystal plate.

本発明の実施形態に係る電子部品用の容器体の一例を概念的に示す斜視図である。It is a perspective view which shows notionally an example of the container body for electronic components which concerns on embodiment of this invention. 図１の分解斜視図である。FIG. 2 is an exploded perspective view of FIG. 1. 本発明の実施形態に係る電子部品用の容器体の他の例を概念的に示す分解斜視図である。It is a disassembled perspective view which shows notionally the other example of the container body for electronic components which concerns on embodiment of this invention.

符号の説明Explanation of symbols

１０１、１０２ 容器体
１０、１１ 基板部材
２０、２１ 枠部材
Ｋ 凹部
Ｍ 金属膜
Ｐ 搭載パッド 101, 102 Container body 10, 11 Substrate member 20, 21 Frame member K Recess M Metal film P Mounting pad

Claims (2)

ガラス、水晶、シリコン（Ｓｉ）、セラミックスのいずれかから選択されてなる基板部材と、コバール、ＳＵＳ、鉄ニッケル合金のいずれかから選択されてなる複数の枠部材と、を備え、
前記基板部材と前記複数の枠部材とが重ねられた状態で拡散接合されて凹部を形成していることを特徴とする電子部品用の容器体。 A substrate member selected from any of glass, quartz, silicon (Si), and ceramics, and a plurality of frame members selected from any of Kovar, SUS, and iron-nickel alloy,
A container body for an electronic component, wherein the substrate member and the plurality of frame members are diffusion bonded in a state of being overlapped to form a recess. それぞれの前記枠部材の厚みと幅の値が前記基板部材の厚みの値より小さく形成されていることを特徴とする請求項１に記載の電子部品用の蓋体。   2. The lid for an electronic component according to claim 1, wherein the thickness and width values of each of the frame members are smaller than the thickness value of the substrate member.
JP2008171282A 2008-06-30 2008-06-30 Container for electronic component Pending JP2010010618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008171282A JP2010010618A (en) 2008-06-30 2008-06-30 Container for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008171282A JP2010010618A (en) 2008-06-30 2008-06-30 Container for electronic component

Publications (1)

Publication Number Publication Date
JP2010010618A true JP2010010618A (en) 2010-01-14

Family

ID=41590708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008171282A Pending JP2010010618A (en) 2008-06-30 2008-06-30 Container for electronic component

Country Status (1)

Country Link
JP (1) JP2010010618A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7224827B2 (en) 2018-09-21 2023-02-20 株式会社Subaru car body structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335433A (en) * 1992-05-27 1993-12-17 Kyocera Corp Package for accommodating semiconductor element
JP2007305856A (en) * 2006-05-12 2007-11-22 Olympus Corp Sealing structure and manufacturing method therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335433A (en) * 1992-05-27 1993-12-17 Kyocera Corp Package for accommodating semiconductor element
JP2007305856A (en) * 2006-05-12 2007-11-22 Olympus Corp Sealing structure and manufacturing method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7224827B2 (en) 2018-09-21 2023-02-20 株式会社Subaru car body structure

Similar Documents

Publication Publication Date Title
JP4707725B2 (en) Package type piezoelectric vibrator and manufacturing method of package type piezoelectric vibrator
CN107925393B (en) Piezoelectric vibration device
JP2011193109A (en) Electronic device
WO2020122179A1 (en) Piezoelectric vibrating device
JP2006148758A (en) Quartz oscillator package
JP2008072456A (en) Chip type piezoelectric vibrator, chip type saw device, and manufacturing method
JP2010010618A (en) Container for electronic component
JP5123079B2 (en) Lid for electronic parts
JP2007324852A (en) Crystal resonator and its manufacturing method
JP5123080B2 (en) Lid, piezoelectric vibrator and piezoelectric oscillator for electronic parts
JP5123081B2 (en) Lid, piezoelectric vibrator and piezoelectric oscillator for electronic parts
JP2007235289A (en) Piezoelectric oscillator
JP2010272783A (en) Surface-mounting device
JP7196726B2 (en) crystal wafer
JP2008278110A (en) Piezoelectric oscillator
JP4555068B2 (en) Method for manufacturing crystal resonator package
JP2009088699A (en) Manufacturing method of piezoelectric device and piezoelectric device
JP2009088057A (en) Method of manufacturing electronic component
JP2008109430A (en) Piezoelectric device
JP4795697B2 (en) Vibrator package
CN110999079A (en) Piezoelectric vibrator
TWI824717B (en) Piezoelectric vibration device
US11063574B2 (en) Piezoelectric resonator unit
WO2021059576A1 (en) Piezoelectric oscillator
JP2013120762A (en) Lid, package, electronic component, and manufacturing method of package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110616

A977 Report on retrieval

Effective date: 20121026

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121106

A521 Written amendment

Effective date: 20121227

Free format text: JAPANESE INTERMEDIATE CODE: A523

A02 Decision of refusal

Effective date: 20130423

Free format text: JAPANESE INTERMEDIATE CODE: A02