JP2009302442A - Method of manufacturing component mounting substrate - Google Patents

Method of manufacturing component mounting substrate Download PDF

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Publication number
JP2009302442A
JP2009302442A JP2008157668A JP2008157668A JP2009302442A JP 2009302442 A JP2009302442 A JP 2009302442A JP 2008157668 A JP2008157668 A JP 2008157668A JP 2008157668 A JP2008157668 A JP 2008157668A JP 2009302442 A JP2009302442 A JP 2009302442A
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Prior art keywords
substrate
electronic component
thermoplastic resin
terminals
coating film
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JP2008157668A
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Japanese (ja)
Inventor
Yohei Shoji
陽平 庄司
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Priority to JP2008157668A priority Critical patent/JP2009302442A/en
Publication of JP2009302442A publication Critical patent/JP2009302442A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a component mounting substrate in which an electronic component such as an IC chip is mounted on a substrate inexpensively and a circuit is prevented from short-circuiting as terminals of a conduction portion are electrically connected to each other with polymer conductive ink when the electronic component is mounted. <P>SOLUTION: The method of manufacturing the component mounting substrate includes: a process A of coating one surface 1a of the substrate 1 with the polymer conductive ink to form an undried coating 2; a process B of sticking a thermoplastic resin 3 between electrode portions 2a of the coating 2; a process C of arranging the electronic component 11 on the one surface 1a of the substrate 1 so that terminals 12 of the electronic component 11 face the electrode portions 2a and the thermoplastic resin 3 is disposed between the terminals 12; and a process D of heating and drying the undried coating 2 to form the conduction portion and charging a thermoplastic resin 3 between the pair of electrodes of the conduction portion and between the terminals 12 of the electronic component by fusing the thermoplastic resin 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、部品実装基板の製造方法に関するものである。   The present invention relates to a method for manufacturing a component mounting board.

従来、基板にＩＣチップを実装する方法としては、アンテナを構成する導体パターンと、この導体パターン上の電極領域を覆う熱可塑性樹脂被膜を備えた基板を用いて、その熱可塑性樹脂被膜上にＩＣチップのバンプを押し付け、導電パターンにＩＣチップを圧着する方法が開示されている（例えば、特許文献１、２参照）。   Conventionally, as a method of mounting an IC chip on a substrate, an IC is formed on the thermoplastic resin coating using a substrate including a conductor pattern constituting an antenna and a thermoplastic resin coating covering an electrode region on the conductor pattern. A method is disclosed in which bumps of a chip are pressed and an IC chip is pressure-bonded to a conductive pattern (see, for example, Patent Documents 1 and 2).

また、より低コストで基板にＩＣチップを実装する方法としては、図７〜９に示すような方法が検討されている。
まず、図７に示すように、基板１０１の一方の面１０１ａに、ポリマー型導電インクを塗布して、導電部をなす未乾燥の塗膜１０２を形成する。
次いで、未乾燥の塗膜１０２における導電部の一対の電極をなす部分（電極部）１０２ａ、１０２ａに、ＩＣチップ１１１の一対の端子１１２、１１２が対向するように、基板１０１の一方の面１０１ａにＩＣチップ１１１を配置する。
次いで、図８に示すように、未乾燥の塗膜１０２の電極部１０２ａ、１０２ａにＩＣチップ１１１の端子１１２、１１２を接触させるとともに、赤外線により２００℃程度に加熱して、塗膜１０２を乾燥させて導電部１０３を形成するとともに、この導電部１０３にＩＣチップ１１１を固定する。
特開２００１−２１７６１７号公報 特開２００５−２７５８０２号公報 Further, as a method of mounting an IC chip on a substrate at a lower cost, methods as shown in FIGS.
First, as shown in FIG. 7, a polymer type conductive ink is applied to one surface 101a of the substrate 101 to form an undried coating film 102 that forms a conductive portion.
Next, one surface 101a of the substrate 101 is arranged such that the pair of terminals 112, 112 of the IC chip 111 are opposed to the portions (electrode portions) 102a, 102a forming the pair of electrodes of the conductive portion in the undried coating film 102. The IC chip 111 is disposed on the substrate.
Next, as shown in FIG. 8, the terminals 112 and 112 of the IC chip 111 are brought into contact with the electrode portions 102 a and 102 a of the undried coating film 102, and the coating film 102 is dried by heating to about 200 ° C. with infrared rays. Thus, the conductive portion 103 is formed, and the IC chip 111 is fixed to the conductive portion 103.
JP 2001-217617 A JP-A-2005-275802

しかしながら、上述の方法では、未乾燥の塗膜１０２を加熱、乾燥させる際、図９に示すように、未乾燥のポリマー型導電インクが端子１１２の表面を伝ってＩＣチップ１１１の裏面（基板１０１と対向する面）１１１ａに延在し、この裏面１１１ａにて、未乾燥の塗膜１０２の電極部１０２ａ、１０２ａと連続する、未乾燥の塗膜１０５を形成することがある。そして、未乾燥の塗膜１０２を乾燥させて導電部１０３を形成すると、未乾燥の塗膜１０５も乾燥して導電部１０６を形成し、この導電部１０６を介して、導電部１０３の一対の電極が電気的に接続される。そのため、この状態で、導電部１０３に電気が流れると、回路がショートして、ＩＣチップ１１１が破壊されるという問題がある。   However, in the above-described method, when the undried coating film 102 is heated and dried, as shown in FIG. 9, the undried polymer-type conductive ink travels along the surface of the terminal 112 and the back surface (substrate 101). In some cases, an undried coating film 105 that is continuous with the electrode portions 102a and 102a of the undried coating film 102 is formed on the back surface 111a. Then, when the undried coating film 102 is dried to form the conductive portion 103, the undried coating film 105 is also dried to form the conductive portion 106, and the pair of conductive portions 103 is connected via the conductive portion 106. The electrodes are electrically connected. Therefore, in this state, when electricity flows through the conductive portion 103, there is a problem that the circuit is short-circuited and the IC chip 111 is destroyed.

本発明は、上記事情に鑑みてなされたものであって、低コストで基板にＩＣチップなどの電子部品を実装することが可能であり、電子部品の実装時にポリマー型導電インクによって導電部の端子間が電気的に接続され、回路がショートすることを防止する部品実装基板の製造方法を提供することを目的とする。   The present invention has been made in view of the above circumstances, and it is possible to mount an electronic component such as an IC chip on a substrate at a low cost, and the terminal of the conductive portion is made of polymer-type conductive ink when the electronic component is mounted. It is an object of the present invention to provide a method for manufacturing a component mounting board that is electrically connected to each other and prevents a circuit from being short-circuited.

本発明の部品実装基板の製造方法は、基板と、該基板の少なくとも一方の面に設けられた導電部と、該導電部に接続され、前記基板の少なくとも一方の面に実装された電子部品とを備えた部品実装基板の製造方法であって、基板の少なくとも一方の面に、ポリマー型導電インクを塗布して、導電部をなす未乾燥の塗膜を形成する工程Ａと、前記未乾燥の塗膜における前記導電部の一対の電極をなす部分の間に熱可塑性樹脂を付着させる工程Ｂと、前記一対の電極をなす部分に電子部品の一対の端子が対向するとともに、該電子部品の一対の端子間に前記熱可塑性樹脂が配されるように、前記基板の少なくとも一方の面に前記電子部品を配置する工程Ｃと、前記未乾燥の塗膜を加熱、乾燥させて前記導電部を形成するとともに、前記熱可塑性樹脂を溶融して前記導電部の一対の電極間および前記電子部品の一対の端子間に、前記熱可塑性樹脂を充填する工程Ｄとを有することを特徴とする。   The component mounting board manufacturing method of the present invention includes a board, a conductive part provided on at least one side of the board, an electronic component connected to the conductive part and mounted on at least one side of the board. A process A for manufacturing a component mounting board, comprising: applying a polymer-type conductive ink to at least one surface of the board to form an undried coating film forming a conductive portion; and A step B of attaching a thermoplastic resin between portions of the conductive portion of the coating film forming a pair of electrodes, a pair of terminals of the electronic component facing the portions forming the pair of electrodes, and a pair of the electronic components Step C for placing the electronic component on at least one surface of the substrate so that the thermoplastic resin is disposed between the terminals, and heating and drying the undried coating film to form the conductive portion And the thermoplastic tree Between a pair of terminals of the pair of electrodes and between the electronic component of the conductive portion by melting, characterized in that a step D of filling the thermoplastic resin.

本発明の部品実装基板の製造方法によれば、基板と、該基板の少なくとも一方の面に設けられた導電部と、該導電部に接続され、前記基板の少なくとも一方の面に実装された電子部品とを備えた部品実装基板の製造方法であって、基板の少なくとも一方の面に、ポリマー型導電インクを塗布して、導電部をなす未乾燥の塗膜を形成する工程Ａと、前記未乾燥の塗膜における前記導電部の一対の電極をなす部分の間に熱可塑性樹脂を付着させる工程Ｂと、前記一対の電極をなす部分に電子部品の一対の端子が対向するとともに、該電子部品の一対の端子間に前記熱可塑性樹脂が配されるように、前記基板の少なくとも一方の面に前記電子部品を配置する工程Ｃと、前記未乾燥の塗膜を加熱、乾燥させて前記導電部を形成するとともに、前記熱可塑性樹脂を溶融して前記導電部の一対の電極間および前記電子部品の一対の端子間に、前記熱可塑性樹脂を充填する工程Ｄとを有するので、未乾燥の塗膜を乾燥させる熱によって、塗膜の電極をなす部分を形成するポリマー型導電インクが電子部品の端子の表面を伝ってその裏面に延在し、この裏面にて、未乾燥の電極をなす部分と連続する塗膜が形成されることを防止できる。したがって、得られた部品実装基板に電気を流しても、回路がショートして、電子部品が破壊されることがない。また、ポリマー型導電インクに起因する回路のショートの問題を解決できるので、未乾燥の塗膜を乾燥させて導電部を形成すると同時に、端子を介して電子部品を導電部の電極に固定することができるので、工程を簡略化し、製造コストを削減することができる。   According to the component mounting board manufacturing method of the present invention, the board, the conductive part provided on at least one surface of the board, and the electrons connected to the conductive part and mounted on at least one side of the board. A component mounting board manufacturing method comprising: a step of applying a polymer-type conductive ink to at least one surface of a board to form an undried coating film that forms a conductive portion; and A step B of attaching a thermoplastic resin between the portions forming the pair of electrodes of the conductive portion in the dried coating film, and a pair of terminals of the electronic component facing the portions forming the pair of electrodes, and the electronic component A step C of disposing the electronic component on at least one surface of the substrate so that the thermoplastic resin is disposed between the pair of terminals; and heating and drying the undried coating film to form the conductive portion. And the heatable And the step D of filling the thermoplastic resin between the pair of electrodes of the conductive part by melting the resin and between the pair of terminals of the electronic component, by the heat of drying the undried coating film, The polymer-type conductive ink that forms the part that forms the electrode of the coating film extends to the back surface of the terminal of the electronic component, and a coating film that is continuous with the part that forms the undried electrode is formed on this back surface. Can be prevented. Therefore, even if electricity is passed through the obtained component mounting board, the circuit is short-circuited and the electronic component is not destroyed. Also, it can solve the problem of short circuit caused by polymer type conductive ink, so dry conductive film can be dried to form conductive part, and at the same time, electronic parts can be fixed to conductive part electrode via terminal Therefore, the process can be simplified and the manufacturing cost can be reduced.

本発明の部品実装基板の製造方法の最良の形態について説明する。
なお、この形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。 The best mode of the method for manufacturing a component mounting board of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

本発明の部品実装基板の製造方法は、基板と、該基板の少なくとも一方の面に設けられた導電部と、該導電部に接続され、前記基板の少なくとも一方の面に実装された電子部品とを備えた部品実装基板の製造方法であって、基板の少なくとも一方の面に、ポリマー型導電インクを塗布して、導電部をなす未乾燥の塗膜を形成する工程Ａと、前記未乾燥の塗膜における前記導電部の一対の電極をなす部分の間に熱可塑性樹脂を付着させる工程Ｂと、前記一対の電極をなす部分に電子部品の一対の端子が対向するとともに、該電子部品の一対の端子間に前記熱可塑性樹脂が配されるように、前記基板の少なくとも一方の面に前記電子部品を配置する工程Ｃと、前記未乾燥の塗膜を加熱、乾燥させて前記導電部を形成するとともに、前記熱可塑性樹脂を溶融して前記導電部の一対の電極間および前記電子部品の一対の端子間に、前記熱可塑性樹脂を充填する工程Ｄとを有する方法である。   The component mounting board manufacturing method of the present invention includes a board, a conductive part provided on at least one side of the board, an electronic component connected to the conductive part and mounted on at least one side of the board. A process A for manufacturing a component mounting board, comprising: applying a polymer-type conductive ink to at least one surface of the board to form an undried coating film forming a conductive portion; and A step B of attaching a thermoplastic resin between portions of the conductive portion of the coating film forming a pair of electrodes, a pair of terminals of the electronic component facing the portions forming the pair of electrodes, and a pair of the electronic components Step C for placing the electronic component on at least one surface of the substrate so that the thermoplastic resin is disposed between the terminals, and heating and drying the undried coating film to form the conductive portion And the thermoplastic tree Between a pair of terminals of the pair of electrodes and between the electronic component of the conductive portion by melting, a method and a step D of filling the thermoplastic resin.

以下、図１〜図５を参照して、本発明の部品実装基板の製造方法の一実施形態を説明する。
まず、図１に示すように、印刷法により、基板１の一方の面１ａにポリマー型導電インクを塗布して、所定の形状の導電部をなす未乾燥の塗膜２を形成する（工程Ａ）。
この工程Ａにおいて、未乾燥の塗膜２の形状は、所定の回路やアンテナなどからなる導電部の形状をなしている。
また、印刷法としては、インクジェット法、スクリーン印刷法などが用いられる。 Hereinafter, with reference to FIGS. 1-5, one Embodiment of the manufacturing method of the component mounting board | substrate of this invention is described.
First, as shown in FIG. 1, a polymer-type conductive ink is applied to one surface 1a of the substrate 1 by a printing method to form an undried coating film 2 forming a conductive portion of a predetermined shape (step A). ).
In this step A, the shape of the undried coating film 2 is the shape of a conductive portion made of a predetermined circuit, antenna, or the like.
As a printing method, an ink jet method, a screen printing method, or the like is used.

基板１としては、少なくとも表層部には、ガラス繊維、アルミナ繊維などの無機繊維からなる織布、不織布、マット、紙などまたはこれらを組み合わせたもの、ポリエステル繊維、ポリアミド繊維などの有機繊維からなる織布、不織布、マット、紙などまたはこれらを組み合わせたものや、あるいはこれらに樹脂ワニスを含浸させて成形した被覆部材や、ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリオレフィン系樹脂基材、ポリイミド系樹脂基材、エチレン−ビニルアルコール共重合体基材、ポリビニルアルコール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリカーボネート系樹脂基材、アクリロニトリルブタジエンスチレン共重合系樹脂基材、ポリエーテルスルホン系樹脂基材、（ガラス）エポキシ樹脂基材などのプラスチック基材や、あるいはこれらにマット処理、コロナ放電処理、プラズマ処理、紫外線照射処理、電子線照射処理、フレームプラズマ処理、オゾン処理、または各種易接着処理などの表面処理を施したものなどの公知のものから選択して用いられる。   As the substrate 1, at least in the surface layer portion, a woven fabric made of inorganic fibers such as glass fibers or alumina fibers, a nonwoven fabric, a mat, paper, or a combination thereof, or a woven fabric made of organic fibers such as polyester fibers or polyamide fibers. Cloth, non-woven fabric, mat, paper, etc., or a combination thereof, or a covering member formed by impregnating them with a resin varnish, polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide Resin base material, ethylene-vinyl alcohol copolymer base material, polyvinyl alcohol resin base material, polyvinyl chloride resin base material, polyvinylidene chloride resin base material, polystyrene resin base material, polycarbonate resin base material, Acrylonitrile butadiene styrene copolymer resin base material, polyethersulfone type Plastic base materials such as fat base materials, (glass) epoxy resin base materials, or these, mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing, or various eases It selects from well-known things, such as what gave surface treatments, such as adhesion processing, and is used.

ポリマー型導電インクとしては、例えば、銀粉末、金粉末、白金粉末、アルミニウム粉末、パラジウム粉末、ロジウム粉末、カーボン粉末（カーボンブラック、カーボンナノチューブなど）などの導電微粒子が樹脂組成物に配合されたものが挙げられる。
樹脂組成物として熱硬化型樹脂を用いれば、ポリマー型導電インクは、２００℃以下、例えば１００〜１５０℃程度で導電部をなす塗膜を形成することができる熱硬化型となる。導電部をなす塗膜の電気の流れる経路は、塗膜をなす導電微粒子が互いに接触することによる形成され、この塗膜の抵抗値は１０-5Ω・ｃｍオーダーである。
また、本発明におけるポリマー型導電インクとしては、熱硬化型の他にも、光硬化型、浸透乾燥型、溶剤揮発型といった公知のものが用いられる。 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.
If a thermosetting resin is used as the resin composition, the polymer type conductive ink becomes a thermosetting type capable of forming a coating film forming a conductive part at 200 ° C. or less, for example, about 100 to 150 ° C. A path through which electricity of the coating film forming the conductive portion flows is formed by contact of the conductive fine particles forming the coating film with each other, and the resistance value of the coating film is on the order of 10 −5 Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

光硬化型のポリマー型導電インクは、光硬化性樹脂を樹脂組成物に含むものであり、硬化時間が短いので、製造効率を向上させることができる。光硬化型のポリマー型導電インクとしては、例えば、熱可塑性樹脂のみ、あるいは、熱可塑性樹脂と架橋性樹脂（特にポリエステルとイソシアネートによる架橋系樹脂など）とのブレンド樹脂組成物に、導電微粒子が６０質量％以上配合され、ポリエステル樹脂が１０質量％以上配合されたもの、すなわち、溶剤揮発型かあるいは架橋／熱可塑併用型（ただし熱可塑型が５０質量％以上である）のものや、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性樹脂（特にポリエステルとイソシアネートによる架橋系樹脂など）とのブレンド樹脂組成物に、ポリエステル樹脂が１０質量％以上配合されたもの、すなわち、架橋型かあるいは架橋／熱可塑併用型のものなどが好適に用いられる。   The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), thermoplastic A resin resin or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinked / crosslinked resin. A thermoplastic combination type is preferably used.

次いで、図２に示すように、基板１の一方の面１ａにおいて、未乾燥の塗膜２における導電部の一対の電極をなす部分（電極部）２ａ、２ａの間に、略円錐状に熱可塑性樹脂３を付着させる（工程Ｂ）。
この工程Ｂにおいて、基板１の一方の面１ａに熱可塑性樹脂を付着させる方法としては、バーコート法、スピンコート法、スプレーコート法、インクジェット法、ディップコート法、グラビアコート法、ロールコート法、スクリーン印刷法、ナイフコータ法、リバースロールコータ法、キスコータ法などの塗布方法が用いられる。
また、熱可塑性樹脂３の形状は特に限定されず、円柱状、角柱状、球状、半球状などであってもよい。 Next, as shown in FIG. 2, on one surface 1 a of the substrate 1, heat is formed in a substantially conical shape between the portions (electrode portions) 2 a and 2 a forming the pair of electrodes of the conductive portion in the undried coating film 2. A plastic resin 3 is adhered (step B).
In this step B, as a method of attaching the thermoplastic resin to one surface 1a of the substrate 1, a bar coating method, a spin coating method, a spray coating method, an ink jet method, a dip coating method, a gravure coating method, a roll coating method, Coating methods such as a screen printing method, a knife coater method, a reverse roll coater method, and a kiss coater method are used.
The shape of the thermoplastic resin 3 is not particularly limited, and may be a cylindrical shape, a prismatic shape, a spherical shape, a hemispherical shape, or the like.

基板１の一方の面１ａに対する熱可塑性樹脂３の付着量は、後段の工程において、基板１の一方の面１ａに設けられる導電部の一対の電極にＩＣチップを固定した際、その一対の電極間およびＩＣチップの一対の端子間に、熱可塑性樹脂３が隙間なく充填される量とする。   The adhesion amount of the thermoplastic resin 3 to the one surface 1a of the substrate 1 is determined when the IC chip is fixed to the pair of electrodes of the conductive portion provided on the one surface 1a of the substrate 1 in a later step. The amount of the thermoplastic resin 3 filled between the terminals and the pair of terminals of the IC chip is not filled.

また、熱可塑性樹脂３の付着量は、未乾燥の塗膜２の厚みをα、図３に示す電子部品１１の一対の端子１２、１２の長さ（電子部品１１の裏面（基板１と対向する面）１１ａからの突出長）をβ、熱可塑性樹脂３の厚み（基板１の一方の面１ａからの高さ）をγとした場合、γ＞α＋βの関係を満たすことが好ましい。
熱可塑性樹脂３の厚みγが上記の関係を満たすようにすれば、未乾燥の塗膜２における一対の電極部２ａ、２ａに、電子部品１１の一対の端子１２、１２が対向するように、基板１の一方の面１ａに電子部品１１を配置しても、基板１と電子部品１１との間に介在する熱可塑性樹脂３によって、未乾燥の電極部２ａ、２ａと端子１２、１２が接触することがない（図３参照）。したがって、未乾燥の電極部２ａ、２ａを形成するポリマー型導電インクが端子１２の表面を伝って電子部品１１の裏面１１ａに延在し、この裏面１１ａにて、未乾燥の電極部２ａ、２ａと連続する、未乾燥の塗膜が形成されることがない。 Further, the adhesion amount of the thermoplastic resin 3 is such that the thickness of the undried coating 2 is α, the length of the pair of terminals 12 and 12 of the electronic component 11 shown in FIG. It is preferable that the relationship of γ> α + β is satisfied, where β is the protrusion length from the surface 11a) and γ is the thickness of the thermoplastic resin 3 (height from the one surface 1a of the substrate 1).
If the thickness γ of the thermoplastic resin 3 satisfies the above relationship, the pair of terminals 12 and 12 of the electronic component 11 are opposed to the pair of electrode portions 2a and 2a in the undried coating film 2. Even if the electronic component 11 is arranged on one surface 1a of the substrate 1, the undried electrode portions 2a, 2a and the terminals 12, 12 are in contact with each other by the thermoplastic resin 3 interposed between the substrate 1 and the electronic component 11. There is nothing to do (see FIG. 3). Therefore, the polymer-type conductive ink that forms the undried electrode portions 2a, 2a travels along the surface of the terminal 12 and extends to the back surface 11a of the electronic component 11, and the undried electrode portions 2a, 2a pass through the back surface 11a. A continuous undried film is not formed.

熱可塑性樹脂３としては、融点が上記のポリマー型導電インクであって、溶融時の粘度が比較的低いものが用いられ、例えば、ポリメチルメタクリレート（ＰＭＭＡ）、ポリブチルメタクリレート（ＰＢＭＡ）などが挙げられる。   As the thermoplastic resin 3, a polymer-type conductive ink having a melting point as described above and having a relatively low viscosity when melted is used, and examples thereof include polymethyl methacrylate (PMMA) and polybutyl methacrylate (PBMA). It is done.

次いで、図３に示すように、未乾燥の電極部２ａ、２ａに電子部品１１の端子１２、１２が対向するとともに、電子部品１１の端子１２、１２の間に熱可塑性樹脂３が配されるように、基板１の一方の面１ａに電子部品１１を配置する（工程Ｃ）。   Next, as shown in FIG. 3, the terminals 12 and 12 of the electronic component 11 face the undried electrode portions 2 a and 2 a, and the thermoplastic resin 3 is disposed between the terminals 12 and 12 of the electronic component 11. As described above, the electronic component 11 is arranged on one surface 1a of the substrate 1 (step C).

電子部品１１としては、ＩＣチップ、ＣＣＤ素子などの光素子などが挙げられる。   Examples of the electronic component 11 include optical elements such as an IC chip and a CCD element.

次いで、図４、５に示すように、未乾燥の塗膜２を加熱、乾燥させて導電部４を形成するとともに、未乾燥の塗膜２を加熱する熱によって、熱可塑性樹脂３を溶融して、流動させることにより、導電部４の電極４ａ、４ａの間および電子部品１１の端子１２、１２の間に、熱可塑性樹脂３を隙間なく充填する（工程Ｄ）。   Next, as shown in FIGS. 4 and 5, the undried coating film 2 is heated and dried to form a conductive portion 4, and the thermoplastic resin 3 is melted by heat to heat the undried coating film 2. By flowing, the thermoplastic resin 3 is filled without gaps between the electrodes 4a, 4a of the conductive portion 4 and between the terminals 12, 12 of the electronic component 11 (step D).

この工程Ｄにおいて、未乾燥の塗膜２を加熱、乾燥させるともに、熱可塑性樹脂３を溶融するには、温度２００℃にて、数分間保持する。   In this process D, the undried coating film 2 is heated and dried, and the thermoplastic resin 3 is melted at a temperature of 200 ° C. for several minutes.

この工程Ｄでは、未乾燥の塗膜２を加熱する熱によって熱可塑性樹脂３を溶融して、電極４ａ、４ａの間および端子１２、１２の間に熱可塑性樹脂３を充填するが、これらの間に熱可塑性樹脂３を隙間なく充填するためには、電子部品１１を基板１の一方の面１ａに対して（図４の矢印方向）押圧することが好ましい。このようにすれば、溶融状態の熱可塑性樹脂３が基板１の一方の面１ａと電子部品１１の裏面１１ａとの間に挟まれて、これらの間を流動しやすくなるので、電極４ａ、４ａの間および端子１２、１２の間に、熱可塑性樹脂３を隙間なく充填することができる。   In this step D, the thermoplastic resin 3 is melted by heat to heat the undried coating film 2, and the thermoplastic resin 3 is filled between the electrodes 4a and 4a and between the terminals 12 and 12. In order to fill the thermoplastic resin 3 with no gap therebetween, it is preferable to press the electronic component 11 against one surface 1a of the substrate 1 (in the direction of the arrow in FIG. 4). In this way, the molten thermoplastic resin 3 is sandwiched between the one surface 1a of the substrate 1 and the back surface 11a of the electronic component 11 and can easily flow between the electrodes 4a, 4a. And between the terminals 12 and 12 can be filled with the thermoplastic resin 3 without a gap.

以上の工程Ａ〜Ｄにより、基板１と、基板１の一方の面１ａに設けられた導電部４と、導電部４の電極４ａ、４ａに、端子１２、１２を介して接続され、基板１の一方の面１ａに実装された電子部品１１とを備えた部品実装基板２０が得られる。   Through the above steps A to D, the substrate 1, the conductive portion 4 provided on one surface 1 a of the substrate 1, and the electrodes 4 a and 4 a of the conductive portion 4 are connected via the terminals 12 and 12. A component mounting board 20 including the electronic component 11 mounted on the one surface 1a of the substrate is obtained.

この実施形態の部品実装基板の製造方法によれば、未乾燥の塗膜２における電極部２ａ、２ａをなす部分の間に熱可塑性樹脂３を付着させた後、この電極部２ａ、２ａに電子部品１１の端子１２、１２が対向するとともに、電子部品１１の端子１２、１２の間に熱可塑性樹脂３が配されるように、基板１の一方の面１ａに電子部品１１を配置し、未乾燥の塗膜２を加熱、乾燥させて導電部４を形成するとともに、熱可塑性樹脂３を溶融して導電部４の電極４、４の間および電子部品１１の端子１２、１２の間に、熱可塑性樹脂３を充填するので、未乾燥の塗膜２を乾燥させる熱によって、電極部２ａ、２ａを形成するポリマー型導電インクが端子１２の表面を伝って電子部品１１の裏面１１ａに延在し、この裏面１１ａにて、未乾燥の電極部２ａ、２ａと連続する塗膜が形成されることを防止できる。したがって、得られた部品実装基板２０に電気を流しても、回路がショートして、電子部品１１が破壊されることがない。また、ポリマー型導電インクに起因する回路のショートの問題を解決できるので、未乾燥の塗膜２を乾燥させて導電部４を形成すると同時に、端子１２を介して電子部品１１を導電部４の電極に固定することができるので、工程を簡略化し、製造コストを削減することができる。   According to the manufacturing method of the component mounting board of this embodiment, after the thermoplastic resin 3 is adhered between the portions of the undried coating film 2 forming the electrode portions 2a and 2a, the electrodes 2a and 2a are electronically connected. The electronic component 11 is disposed on one surface 1a of the substrate 1 so that the terminals 12 and 12 of the component 11 face each other and the thermoplastic resin 3 is disposed between the terminals 12 and 12 of the electronic component 11. The dried coating film 2 is heated and dried to form the conductive portion 4, and the thermoplastic resin 3 is melted between the electrodes 4, 4 of the conductive portion 4 and between the terminals 12, 12 of the electronic component 11, Since the thermoplastic resin 3 is filled, the polymer-type conductive ink forming the electrode portions 2a and 2a extends to the back surface 11a of the electronic component 11 through the surface of the terminal 12 by heat for drying the undried coating film 2. In this back surface 11a, the undried electrode part a, that the coating is continuous with 2a is formed it can be prevented. Therefore, even if electricity is supplied to the obtained component mounting board 20, the circuit is short-circuited and the electronic component 11 is not destroyed. Moreover, since the problem of the short circuit caused by the polymer-type conductive ink can be solved, the undried coating film 2 is dried to form the conductive portion 4, and at the same time, the electronic component 11 is connected to the conductive portion 4 via the terminal 12. Since it can fix to an electrode, a process can be simplified and manufacturing cost can be reduced.

なお、この実施形態では、基板１の一方の面１ａに導電部４を設け、この導電部４に接続された電子部品１１を備えた部品実装基板２０の製造方法を例示したが、本発明の部品実装基板の製造方法はこれに限定されない。本発明の部品実装基板の製造方法にあっては、基板の一方の面とは反対側の面に導電部を設け、その導電部に電子部品を設けることもできる。   In this embodiment, the conductive part 4 is provided on one surface 1a of the substrate 1, and the method for manufacturing the component mounting board 20 including the electronic component 11 connected to the conductive part 4 is exemplified. The manufacturing method of a component mounting board is not limited to this. In the method for manufacturing a component mounting board according to the present invention, a conductive portion can be provided on the surface opposite to one surface of the substrate, and an electronic component can be provided on the conductive portion.

また、この実施形態では、工程Ｂにおいて、基板１の一方の面１ａにおける、未乾燥の塗膜２の電極部２ａ、２ａの間に、略円錐状に熱可塑性樹脂３を付着させる部品実装基板の製造方法を例示したが、本発明の部品実装基板の製造方法はこれに限定されない。本発明の部品実装基板の製造方法にあっては、図６に示すように、基板１の一方の面１ａにおいて、基板１に実装される電子部品１１の裏面１１ａの中央部から、その各辺に向かって十字状に延在する位置で、かつ、電子部品１１の裏面１１ａの４隅に設けられた４つの端子１２の間に相当する位置に、突条の熱可塑性樹脂３３を付着させてもよい。このようにすれば、基板１に電子部品１１を実装した際に、電子部品１１が傾いて、電極部との接続不良が生じたりするのを防止できる。   In this embodiment, the component mounting board in which the thermoplastic resin 3 is attached in a substantially conical shape between the electrode portions 2a and 2a of the undried coating film 2 on one surface 1a of the board 1 in the step B. However, the method for manufacturing the component mounting board of the present invention is not limited to this. In the method for manufacturing a component mounting board of the present invention, as shown in FIG. 6, each side of the one surface 1 a of the substrate 1 from the center of the back surface 11 a of the electronic component 11 mounted on the substrate 1. The thermoplastic resin 33 of the ridge is attached to a position corresponding to the position between the four terminals 12 provided at the four corners of the back surface 11a of the electronic component 11 at a position extending in a cross shape toward Also good. In this way, when the electronic component 11 is mounted on the substrate 1, it is possible to prevent the electronic component 11 from being tilted and causing poor connection with the electrode portion.

本発明の部品実装基板の製造方法の一実施形態を示す概略断面図である。It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the component mounting board | substrate of this invention. 本発明の部品実装基板の製造方法の一実施形態を示す概略図であり、（ａ）は基板の裏面側から見た図、（ｂ）は（ａ）のＡ−Ａ線に沿う断面図である。It is the schematic which shows one Embodiment of the manufacturing method of the component mounting board | substrate of this invention, (a) is the figure seen from the back surface side of a board | substrate, (b) is sectional drawing which follows the AA line of (a). is there. 本発明の部品実装基板の製造方法の一実施形態を示す概略断面図である。It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the component mounting board | substrate of this invention. 本発明の部品実装基板の製造方法の一実施形態を示す概略断面図である。It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the component mounting board | substrate of this invention. 本発明の部品実装基板の製造方法の一実施形態を示す概略図であり、（ａ）は基板の裏面側から見た図、（ｂ）は（ａ）のＢ−Ｂ線に沿う断面図である。It is the schematic which shows one Embodiment of the manufacturing method of the component mounting board | substrate of this invention, (a) is the figure seen from the back surface side of a board | substrate, (b) is sectional drawing which follows the BB line of (a). is there. 本発明の部品実装基板の製造方法の他の実施形態を示す概略断面図である。It is a schematic sectional drawing which shows other embodiment of the manufacturing method of the component mounting board | substrate of this invention. 基板に対するＩＣチップの実装方法の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the mounting method of IC chip with respect to a board | substrate. 基板に対するＩＣチップの実装方法の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the mounting method of IC chip with respect to a board | substrate. 基板に対するＩＣチップの実装方法の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the mounting method of IC chip with respect to a board | substrate.

符号の説明Explanation of symbols

１・・・基板、２・・・塗膜、３・・・熱可塑性樹脂、４・・・電極、１１・・・電子部品、１２・・・端子、２０・・・部品実装基板、３３・・・熱可塑性樹脂。 DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Coating film, 3 ... Thermoplastic resin, 4 ... Electrode, 11 ... Electronic component, 12 ... Terminal, 20 ... Component mounting board, 33. ··Thermoplastic resin.

Claims (1)

基板と、該基板の少なくとも一方の面に設けられた導電部と、該導電部に接続され、前記基板の少なくとも一方の面に実装された電子部品とを備えた部品実装基板の製造方法であって、
基板の少なくとも一方の面に、ポリマー型導電インクを塗布して、導電部をなす未乾燥の塗膜を形成する工程Ａと、
前記未乾燥の塗膜における前記導電部の一対の電極をなす部分の間に熱可塑性樹脂を付着させる工程Ｂと、
前記一対の電極をなす部分に電子部品の一対の端子が対向するとともに、該電子部品の一対の端子間に前記熱可塑性樹脂が配されるように、前記基板の少なくとも一方の面に前記電子部品を配置する工程Ｃと、
前記未乾燥の塗膜を加熱、乾燥させて前記導電部を形成するとともに、前記熱可塑性樹脂を溶融して前記導電部の一対の電極間および前記電子部品の一対の端子間に、前記熱可塑性樹脂を充填する工程Ｄとを有することを特徴とする部品実装基板の製造方法。 A method for manufacturing a component mounting board, comprising: a substrate; a conductive portion provided on at least one surface of the substrate; and an electronic component connected to the conductive portion and mounted on at least one surface of the substrate. And
Applying a polymer-type conductive ink to at least one surface of the substrate to form an undried coating film forming a conductive portion; and
A step B of attaching a thermoplastic resin between portions of the conductive portion in the undried coating film forming a pair of electrodes;
The electronic component is disposed on at least one surface of the substrate such that a pair of terminals of the electronic component is opposed to a portion forming the pair of electrodes, and the thermoplastic resin is disposed between the pair of terminals of the electronic component. Step C, and
The undried coating film is heated and dried to form the conductive portion, and the thermoplastic resin is melted between the pair of electrodes of the conductive portion and between the pair of terminals of the electronic component. A process for producing a component mounting board, comprising: a step D of filling a resin.
JP2008157668A 2008-06-17 2008-06-17 Method of manufacturing component mounting substrate Pending JP2009302442A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063133A (en) * 2015-09-25 2017-03-30 トッパン・フォームズ株式会社 Electronic component mounting body

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254632A (en) * 1994-03-15 1995-10-03 Clarion Co Ltd Semiconductor device and manufacture thereof
JPH0918121A (en) * 1995-06-27 1997-01-17 S I I R D Center:Kk Electronic component mounted body and production thereof
JP2000200332A (en) * 1999-01-07 2000-07-18 Matsushita Electric Ind Co Ltd Production of non-contact ic card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254632A (en) * 1994-03-15 1995-10-03 Clarion Co Ltd Semiconductor device and manufacture thereof
JPH0918121A (en) * 1995-06-27 1997-01-17 S I I R D Center:Kk Electronic component mounted body and production thereof
JP2000200332A (en) * 1999-01-07 2000-07-18 Matsushita Electric Ind Co Ltd Production of non-contact ic card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063133A (en) * 2015-09-25 2017-03-30 トッパン・フォームズ株式会社 Electronic component mounting body

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