JP2009289818A5 - - Google Patents
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- JP2009289818A5 JP2009289818A5 JP2008138353A JP2008138353A JP2009289818A5 JP 2009289818 A5 JP2009289818 A5 JP 2009289818A5 JP 2008138353 A JP2008138353 A JP 2008138353A JP 2008138353 A JP2008138353 A JP 2008138353A JP 2009289818 A5 JP2009289818 A5 JP 2009289818A5
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- electrode pad
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Claims (21)
カラー成分であるR成分、G成分及びB成分の中から、電極パッドの材質と下地層の材質との反射率の差に応じて選択されたカラー成分の画像データを取得する手段と、
この手段で取得された画像データから、電極パッドとは区別して下地層の画像を取得するための、設定されたグレイレベルとこのグレイレベルを有する画素数との関係データを求める手段と、
この手段で求められた関係データに基づいて、針跡における下地層の露出の有無を判定する手段と、を備えたことを特徴とする針跡検査装置。 After performing electrical measurement by bringing the probe needle into contact with the electrode pad on the substrate to be inspected, the needle trace formed on the electrode pad is imaged, and the presence or absence of exposure of the underlying layer of the electrode pad is inspected. A device,
Means for acquiring image data of a color component selected according to a difference in reflectance between the material of the electrode pad and the material of the underlayer from among the R component, G component, and B component that are color components;
Means for obtaining relational data between a set gray level and the number of pixels having the gray level, in order to obtain an image of the underlying layer separately from the electrode pad, from the image data obtained by this means;
And a means for determining whether or not the underlying layer is exposed in the needle trace based on the relationship data obtained by the means.
前記関係データはこのニ値化画像データであることを特徴とする請求項1または2のいずれか一つに記載の針跡検査装置。 Means for setting the gray level based on the image data of the selected color component, performing binarization processing on the image data, and acquiring binarized image data for detecting an underlayer exposure area In addition,
The needle trace inspection apparatus according to claim 1, wherein the relation data is binary image data.
請求項1ないし10の何れか一項に記載の針跡検査装置を備えたことを特徴とするプローブ装置。 The probe apparatus which mounts a board | substrate on a probe card and a mounting base, and makes the probe needle of a probe card contact the electrode pad of the chip | tip on a board | substrate, and performs the electrical measurement of a chip | tip. A probe device comprising the needle trace inspection device according to 1.
カラー成分であるR成分、G成分及びB成分の中から、電極パッドの材質と下地層の材質との反射率の差に応じて選択されたカラー成分の画像データを取得する工程と、
この工程で取得された画像データに対して、電極パッドの材質とは区別して下地層の材質の画像を取得するために設定されたグレイレベルとこのグレイレベルを有する画素数との関係データを求める工程と、
この工程で求められた関係データに基づいて、針跡における下地層の露出の有無を判定する工程と、を備えたことを特徴とする針跡検査方法。 After performing electrical measurement by bringing the probe needle into contact with the electrode pad on the substrate to be inspected, the needle trace formed on the electrode pad is imaged, and the presence or absence of exposure of the underlying layer of the electrode pad is inspected. A method,
Acquiring image data of a color component selected according to the difference in reflectance between the material of the electrode pad and the material of the underlayer from among the R component, G component, and B component that are color components;
With respect to the image data acquired in this step, the relationship data between the gray level set to acquire the image of the material of the base layer, which is distinguished from the material of the electrode pad, and the number of pixels having this gray level is obtained. Process,
And a step of determining whether or not the underlying layer is exposed in the needle trace based on the relational data obtained in this step.
前記関係データはこのニ値化画像データであることを特徴とする請求項12に記載の針跡検査方法。 A step of setting the gray level based on the image data of the selected color component, performing binarization processing on the image data, and obtaining binarized image data for detecting an underlayer exposure area In addition,
The needle trace inspection method according to claim 12, wherein the relation data is binary image data.
前記コンピュータプログラムは、請求項12ないし20のいずれか一つに記載の針跡検査方法を実行するようにステップ群が構成されていることを特徴とする記憶媒体。 After performing electrical measurement by bringing the probe needle into contact with the electrode pad on the substrate to be inspected, the needle trace formed on the electrode pad is imaged, and the presence or absence of exposure of the underlying layer of the electrode pad is inspected. A storage medium storing a computer program used in the apparatus,
A storage medium characterized in that the computer program includes a group of steps so as to execute the needle trace inspection method according to any one of claims 12 to 20.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008138353A JP5286938B2 (en) | 2008-05-27 | 2008-05-27 | Needle mark inspection device, probe device, needle mark inspection method, and storage medium |
KR1020090041424A KR101230673B1 (en) | 2008-05-27 | 2009-05-12 | Probe mark inspection apparatus, probe apparatus, probe mark inspection method and storage medium |
TW098117478A TWI505384B (en) | 2008-05-27 | 2009-05-26 | A stitch check device, a probe device and a stitch check method, and a memory medium |
CN2009101452289A CN101593714B (en) | 2008-05-27 | 2009-05-27 | A needle tracking inspection device, a detecting device and a needle tracking inspection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008138353A JP5286938B2 (en) | 2008-05-27 | 2008-05-27 | Needle mark inspection device, probe device, needle mark inspection method, and storage medium |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009289818A JP2009289818A (en) | 2009-12-10 |
JP2009289818A5 true JP2009289818A5 (en) | 2011-06-30 |
JP5286938B2 JP5286938B2 (en) | 2013-09-11 |
Family
ID=41408296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008138353A Active JP5286938B2 (en) | 2008-05-27 | 2008-05-27 | Needle mark inspection device, probe device, needle mark inspection method, and storage medium |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5286938B2 (en) |
KR (1) | KR101230673B1 (en) |
CN (1) | CN101593714B (en) |
TW (1) | TWI505384B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011118596A1 (en) * | 2010-03-25 | 2011-09-29 | 三菱レイヨン株式会社 | Method for fabricating anodized alumina, inspection device, and inspection method |
KR102317023B1 (en) * | 2014-08-14 | 2021-10-26 | 삼성전자주식회사 | semiconductor device, method and apparatus for manufacturing the same |
US9747520B2 (en) * | 2015-03-16 | 2017-08-29 | Kla-Tencor Corporation | Systems and methods for enhancing inspection sensitivity of an inspection tool |
JP6406221B2 (en) | 2015-11-17 | 2018-10-17 | 三菱電機株式会社 | Semiconductor device evaluation apparatus and evaluation method |
JP7108527B2 (en) * | 2018-12-10 | 2022-07-28 | 東京エレクトロン株式会社 | Analysis device and image generation method |
JP2022133631A (en) | 2021-03-02 | 2022-09-14 | 株式会社東京精密 | Particle measurement device, three-dimensional shape measurement device, prober device, particle measurement system, and particle measurement method |
TWI803353B (en) * | 2022-04-19 | 2023-05-21 | 南亞科技股份有限公司 | Wafer inspection method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002252262A (en) * | 2001-02-23 | 2002-09-06 | Dainippon Screen Mfg Co Ltd | Method for detecting copper deposited substrate and substrate processing apparatus using the same |
JP4828741B2 (en) * | 2001-08-23 | 2011-11-30 | 大日本スクリーン製造株式会社 | Probe mark measuring method and probe mark measuring apparatus |
JP4357813B2 (en) * | 2002-08-23 | 2009-11-04 | 東京エレクトロン株式会社 | Probe apparatus and probe method |
US7308157B2 (en) * | 2003-02-03 | 2007-12-11 | Photon Dynamics, Inc. | Method and apparatus for optical inspection of a display |
JP4730895B2 (en) * | 2004-12-10 | 2011-07-20 | 大日本スクリーン製造株式会社 | Needle mark detection device and needle mark detection method |
KR101047795B1 (en) * | 2005-01-05 | 2011-07-07 | 엘지이노텍 주식회사 | Semiconductor light emitting device |
WO2006073098A1 (en) * | 2005-01-05 | 2006-07-13 | Thk Co., Ltd. | Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function |
JP5132307B2 (en) * | 2005-05-17 | 2013-01-30 | Agcセイミケミカル株式会社 | Method for producing lithium-containing composite oxide for positive electrode of lithium secondary battery |
JP4334527B2 (en) * | 2005-10-21 | 2009-09-30 | 大日本スクリーン製造株式会社 | Needle mark detection device and needle mark detection method |
-
2008
- 2008-05-27 JP JP2008138353A patent/JP5286938B2/en active Active
-
2009
- 2009-05-12 KR KR1020090041424A patent/KR101230673B1/en active IP Right Grant
- 2009-05-26 TW TW098117478A patent/TWI505384B/en active
- 2009-05-27 CN CN2009101452289A patent/CN101593714B/en active Active
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