JP2009266427A - 基板接続構造 - Google Patents
基板接続構造 Download PDFInfo
- Publication number
- JP2009266427A JP2009266427A JP2008111605A JP2008111605A JP2009266427A JP 2009266427 A JP2009266427 A JP 2009266427A JP 2008111605 A JP2008111605 A JP 2008111605A JP 2008111605 A JP2008111605 A JP 2008111605A JP 2009266427 A JP2009266427 A JP 2009266427A
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- JP
- Japan
- Prior art keywords
- substrate
- connection pin
- pattern
- connector
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
【解決手段】コネクタ11の第1の差込口13に第1の基板12を差し込み、第2の差込口15に第2の基板14を差し込む。この状態で、第1の基板12の第1のパターン21,22がコネクタ11の第1の差込口13の内壁に形成された第1の接続ピン17,18に接続され、第2の基板14の第2のパターン23,24がコネクタ11の第2の差込口15の内壁に形成された第2の接続ピン19,20に接続される。第1の接続ピン17,18から第2の接続ピン19,20に至る伝送経路は、特性インピーダンスの整合が取られたコプレーナ線路である。
【選択図】図3
Description
図1,図2は、本発明の実施の形態1に係るコネクタを示す斜視図である。図3は、本発明の実施の形態1に係るコネクタを用いて2つの基板を接続した状態を示す断面図である。
図6は、本発明の実施の形態2に係る基板の端部を示す平面図である。高周波パターン26は、基板パターン部29において差動マイクロストリップ線路であり、コネクタ接触部30において差動のコプレーナ線路である。また、第1の表側接続ピン17から第2の表側接続ピン19に至る伝送経路および第1の裏側接続ピン18から第2の裏側接続ピン20に至る伝送経路は差動のコプレーナ線路である。その他の構成は実施の形態1の構成と同様である。
12 第1の基板
13 第1の差込口
14 第2の基板
15 第2の差込口
17 第1の表側接続ピン(第1の接続ピン)
18 第1の裏側接続ピン(第1の接続ピン)
19 第2の表側接続ピン(第2の接続ピン)
20 第2の裏側接続ピン(第2の接続ピン)
21 第1の表側パターン(第1のパターン)
22 第1の裏側パターン(第1のパターン)
23 第2の表側パターン(第2のパターン)
24 第2の裏側パターン(第2のパターン)
25 基板端部
Claims (4)
- 第1の基板と、
第2の基板と、
前記第1の基板が差し込まれる第1の差込口と、前記第2の基板が差し込まれる第2の差込口とが向かい合うように形成されたコネクタとを備え、
前記第1の差込口の内壁に第1の接続ピンが形成され、
前記第2の差込口の内壁に第2の接続ピンが形成され、
前記第1の接続ピンと前記第2の接続ピンは前記コネクタ内部で接続され、
前記第1の基板上には、前記第1の基板が前記第1の差込口に差し込まれた状態で前記第1の接続ピンに接続される第1のパターンが形成され、
前記第2の基板上には、前記第2の基板が前記第2の差込口に差し込まれた状態で前記第2の接続ピンに接続される第2のパターンが形成され、
前記第1の接続ピンから前記第2の接続ピンに至る伝送経路は、特性インピーダンスの整合が取られたコプレーナ線路であることを特徴とする基板接続構造。 - 前記第1および第2のパターンは、それぞれ前記第1および第2の接続ピンと接触しない部分においてマイクロストリップ線路であり、前記第1および第2の接続ピンと接触する部分においてコプレーナ線路であり、
前記第1および第2のパターンは、それぞれ前記第1および第2の基板の基板端部から所定の長さだけ内側に形成されていることを特徴とする請求項1に記載の基板接続構造。 - 前記第1の接続ピンから前記第2の接続ピンに至る伝送経路は、シングルエンドのコプレーナ線路であることを特徴とする請求項1または2に記載の基板接続構造。
- 前記第1の接続ピンから前記第2の接続ピンに至る伝送経路は、差動のコプレーナ線路であることを特徴とする請求項1または2に記載の基板接続構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008111605A JP2009266427A (ja) | 2008-04-22 | 2008-04-22 | 基板接続構造 |
US12/173,086 US7625215B2 (en) | 2008-04-22 | 2008-07-15 | Circuit board connection structure |
TW097127601A TWI366955B (en) | 2008-04-22 | 2008-07-21 | Circuit board connection structure |
CNA2008101853824A CN101567495A (zh) | 2008-04-22 | 2008-12-22 | 基板连接结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008111605A JP2009266427A (ja) | 2008-04-22 | 2008-04-22 | 基板接続構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009266427A true JP2009266427A (ja) | 2009-11-12 |
Family
ID=41201464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008111605A Ceased JP2009266427A (ja) | 2008-04-22 | 2008-04-22 | 基板接続構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7625215B2 (ja) |
JP (1) | JP2009266427A (ja) |
CN (1) | CN101567495A (ja) |
TW (1) | TWI366955B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014067755A (ja) * | 2012-09-24 | 2014-04-17 | Renesas Electronics Corp | 半導体装置、半導体装置の設計方法、及び半導体装置の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201232931A (en) * | 2011-01-20 | 2012-08-01 | Hon Hai Prec Ind Co Ltd | Motherboard and memory connector thereof |
JP5790481B2 (ja) * | 2011-12-22 | 2015-10-07 | 三菱電機株式会社 | 接続装置 |
US10103494B2 (en) | 2014-05-08 | 2018-10-16 | Apple Inc. | Connector system impedance matching |
CN206412559U (zh) * | 2014-05-08 | 2017-08-15 | 苹果公司 | 连接器***以及连接器插座 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4997296A (ja) * | 1973-01-27 | 1974-09-13 | ||
WO2000070716A1 (fr) * | 1999-05-13 | 2000-11-23 | Advantest Corporation | Connecteur multiple |
JP2005517303A (ja) * | 2001-10-10 | 2005-06-09 | モレックス インコーポレーテッド | 高速差動信号エッジカードコネクタの回路基板レイアウト |
WO2009111441A1 (en) * | 2008-03-04 | 2009-09-11 | Molex Incorporated | Co-edge connector |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3591834A (en) * | 1969-12-22 | 1971-07-06 | Ibm | Circuit board connecting means |
JPH0412627Y2 (ja) | 1986-09-01 | 1992-03-26 | ||
JPH0212181U (ja) | 1988-07-05 | 1990-01-25 | ||
JPH0451475A (ja) | 1990-06-20 | 1992-02-19 | Toshiba Lighting & Technol Corp | マイクロストリップライン用コネクタ |
JPH0551475A (ja) | 1991-08-28 | 1993-03-02 | Dainippon Ink & Chem Inc | 発泡性熱可塑性樹脂組成物及び発泡絶縁電線の製法 |
US6109927A (en) * | 1998-08-27 | 2000-08-29 | The Whitaker Corporation | Connector for adjacent circuit-bearing substrates |
KR100355237B1 (ko) * | 2000-10-16 | 2002-10-11 | 삼성전자 주식회사 | 모듈확장용 소켓들 및 상기 모듈확장용 소켓들을 이용하는메모리시스템 |
JP4667652B2 (ja) * | 2001-06-12 | 2011-04-13 | ローム株式会社 | 電池パック、およびその製造方法 |
JP4664657B2 (ja) | 2004-11-30 | 2011-04-06 | 株式会社東芝 | 回路基板 |
JP2008059803A (ja) * | 2006-08-29 | 2008-03-13 | Japan Aviation Electronics Industry Ltd | コネクタ |
KR100818510B1 (ko) * | 2007-01-16 | 2008-03-31 | 삼성전기주식회사 | Blu용 pcb커넥터 및 이를 사용하는 샤시 |
US7416452B1 (en) * | 2007-03-15 | 2008-08-26 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
US7547214B2 (en) * | 2007-05-22 | 2009-06-16 | Tyco Electronics Corporation | Edge-to-edge connector system for electronic devices |
-
2008
- 2008-04-22 JP JP2008111605A patent/JP2009266427A/ja not_active Ceased
- 2008-07-15 US US12/173,086 patent/US7625215B2/en not_active Expired - Fee Related
- 2008-07-21 TW TW097127601A patent/TWI366955B/zh not_active IP Right Cessation
- 2008-12-22 CN CNA2008101853824A patent/CN101567495A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4997296A (ja) * | 1973-01-27 | 1974-09-13 | ||
WO2000070716A1 (fr) * | 1999-05-13 | 2000-11-23 | Advantest Corporation | Connecteur multiple |
JP2005517303A (ja) * | 2001-10-10 | 2005-06-09 | モレックス インコーポレーテッド | 高速差動信号エッジカードコネクタの回路基板レイアウト |
WO2009111441A1 (en) * | 2008-03-04 | 2009-09-11 | Molex Incorporated | Co-edge connector |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014067755A (ja) * | 2012-09-24 | 2014-04-17 | Renesas Electronics Corp | 半導体装置、半導体装置の設計方法、及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI366955B (en) | 2012-06-21 |
US20090263982A1 (en) | 2009-10-22 |
TW200945685A (en) | 2009-11-01 |
US7625215B2 (en) | 2009-12-01 |
CN101567495A (zh) | 2009-10-28 |
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