JP2009260102A - Apparatus for inspecting solder printing state - Google Patents

Apparatus for inspecting solder printing state Download PDF

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JP2009260102A
JP2009260102A JP2008108587A JP2008108587A JP2009260102A JP 2009260102 A JP2009260102 A JP 2009260102A JP 2008108587 A JP2008108587 A JP 2008108587A JP 2008108587 A JP2008108587 A JP 2008108587A JP 2009260102 A JP2009260102 A JP 2009260102A
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solder
printing
substrate
printed
state
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JP4840394B2 (en
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Daisuke Nagai
大介 永井
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Panasonic Corp
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Panasonic Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for determining the solder printing state by shapes in appearance. <P>SOLUTION: The apparatus is equipped with a means of obtaining three-dimensional data of surfaces of solder printed on a plurality of substrates with masks, a means of creating three-dimensional images representing solder appearances according to the obtained three-dimensional data, and a means of displaying in a superimposed manner three-dimensional images of solder printed on a plurality of substrates of the same kind on a single screen. This apparatus enables visual determination by superimposed solder appearances even when the solder shapes are hard to be evaluated by numeric threshold processing. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明はマスクを用いて基板に印刷された半田の印刷状態の検査に関するものである。   The present invention relates to an inspection of a printed state of solder printed on a substrate using a mask.

基板に電子部品を実装する場合、基板表面の電極が形成されたランド部に半田を供給し、これに電子部品を搭載した後に加熱して半田付けを行っている。同一の基板に同一パターンで半田を印刷する場合にはスクリーン印刷が広く用いられている。スクリーン印刷は電極と対応する位置が開口された所定の厚さを有するマスクを用いた印刷方法であり、基板に被せたマスク上でクリーム半田をスキージングすることで電極に一定量のクリーム半田を印刷する。スクリーン印刷によれば、同一のマスクを用いている限り複数の基板間でクリーム半田の印刷面積や印刷厚さ等の印刷状態は常に同一になるのであるが、実際には印刷条件や印刷環境の経時的な変化によって各基板間で印刷状態にばらつきが生じることがある。半田の印刷状態が悪いと理想的な半田付けが実現されないので実装強度を長期に亘って保てない場合がある。従来、電子部品の搭載に先立って半田の印刷状態を検査することを目的として、クリーム半田の印刷状態を数値化して評価することが行われている。また、この評価結果から得られた知見をスキージ速度等の印刷条件にフィードバックして印刷品質の向上を図っている（特許文献１参照）。
特開平２−２０８５４５号公報 When an electronic component is mounted on a substrate, solder is supplied to a land portion on which an electrode on the surface of the substrate is formed, and the electronic component is mounted on the land portion and then heated and soldered. Screen printing is widely used when printing solder with the same pattern on the same substrate. Screen printing is a printing method using a mask having a predetermined thickness that is opened at a position corresponding to an electrode, and a certain amount of cream solder is applied to the electrode by squeezing the cream solder on the mask placed on the substrate. Print. According to screen printing, as long as the same mask is used, the printing state such as the printing area and thickness of cream solder is always the same between multiple boards. Due to changes over time, the printed state may vary among the substrates. If the printing state of the solder is poor, ideal soldering cannot be realized, and the mounting strength may not be maintained for a long time. Conventionally, for the purpose of inspecting the printed state of solder prior to the mounting of electronic components, the printed state of cream solder has been quantified and evaluated. Further, the knowledge obtained from the evaluation result is fed back to printing conditions such as the squeegee speed to improve the printing quality (see Patent Document 1).
JP-A-2-208545

印刷状態を数値化して評価する方法は、閾値処理によって画一的に効率良く評価することができるという利点を有するが、予め評価項目として挙げられていない項目は評価対象とはならないので、半田の外観形状の上では明らかに不良であるにもかかわらずそれを見落として良品と評価してしまう可能性がある。   The method of evaluating the printing state by quantifying it has the advantage that it can be uniformly and efficiently evaluated by threshold processing. However, items that are not listed as evaluation items in advance are not subject to evaluation. There is a possibility that it may be overlooked and evaluated as a non-defective product even though it is clearly defective in appearance.

本発明は、半田の印刷状態を外観形状によって判断できるようにした装置を提供することを目的とする。   An object of this invention is to provide the apparatus which can judge the printing state of solder by the external appearance shape.

前記課題を解決するため本発明は、マスクを用いて複数の基板に印刷された半田の印刷状態を検査するための装置において、基板に印刷された半田の表面の三次元データを取得する手段と、取得した三次元データに基づいて半田の外観を示す三次元画像を生成する手段と、複数の同種の基板に印刷された半田の三次元画像を同一画面上に重ねて表示する手段を備えた。   In order to solve the above problems, the present invention provides an apparatus for inspecting the printing state of solder printed on a plurality of substrates using a mask, and means for obtaining three-dimensional data of the surface of the solder printed on the substrate; A means for generating a three-dimensional image showing the appearance of the solder based on the acquired three-dimensional data, and a means for displaying the three-dimensional images of the solder printed on a plurality of the same type of substrates on the same screen. .

複数の同種の基板に印刷された半田表面の三次元データに基づいて生成した半田の外観を示す三次元画像を同一画面上に重ねて表示することにより、数値による閾値処理では評価しにくい印刷態様についても外観に基づいて視覚的に判断することができるようになる。   Printing mode that is difficult to evaluate by numerical threshold processing by displaying 3D images showing the appearance of solder generated based on 3D data on the surface of solder printed on multiple substrates of the same type on the same screen Can be visually judged based on the appearance.

添付した図面を参照して本発明の実施の形態について説明する。図１は本発明の実施の形態の電子部品実装装置の構成を示したブロック図、図２は本発明の実施の形態の表示パネルの表示例を示した図である。   Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a block diagram illustrating a configuration of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a display example of a display panel according to an embodiment of the present invention.

電子部品実装装置１は、基板の搬送方向に対して上流から下流に向けて配置された基板検査装置２と半田印刷装置３と印刷状態検査装置４と電子部品搭載装置５と搭載状態検査装置６とリフロー装置７と実装状態検査装置８と管理コンピュータ９で構成されている。電子部品実装装置１は、これら各装置においてそれぞれ所定の処理を施すことで基板に電子部品を実装する。   The electronic component mounting apparatus 1 includes a board inspection device 2, a solder printing device 3, a printing state inspection device 4, an electronic component mounting device 5, and a mounting state inspection device 6 that are arranged from upstream to downstream with respect to the board conveyance direction. And a reflow device 7, a mounting state inspection device 8, and a management computer 9. The electronic component mounting apparatus 1 mounts an electronic component on a substrate by performing predetermined processing in each of these apparatuses.

基板検査装置２は実装対象となる基板の外観検査を行う。この外観検査には非接触型の三次元計測器を用いる。三次元計測器は基板表面に光を走査させ、基板表面で反射した光を受光した位置に応じてサンプリング測点の高さ（Ｚ座標値）を計測する。サンプリング測点は基板の全面に適宜分布するように水平位置（ＸＹ座標値）が予め設定されている。サンプリング測点の高さ（Ｚ座標値）に予め定めた許容値を超えるものがなかった場合には、基板には品質上問題となる反りは生じていないと判断され、次の半田印刷装置３に移送される。   The board inspection apparatus 2 performs an appearance inspection of a board to be mounted. A non-contact type three-dimensional measuring instrument is used for this visual inspection. The three-dimensional measuring instrument scans the surface of the substrate with light and measures the height (Z coordinate value) of the sampling point according to the position where the light reflected on the surface of the substrate is received. The horizontal positions (XY coordinate values) are set in advance so that the sampling measurement points are appropriately distributed over the entire surface of the substrate. If the sampling station height (Z coordinate value) does not exceed a predetermined allowable value, it is determined that the substrate does not have a warp that causes a quality problem, and the next solder printing apparatus 3 It is transferred to.

半田印刷装置３は基板表面に形成されている電極に半田のスクリーン印刷を行う。スクリーン印刷に用いるマスクは基板表面に密着させる必要があり、顕著な反りがある基板とは密着しないので、そのような反りを生じている基板は基板検査装置２によって電子部品実装装置１から排除される。半田印刷装置３は基板の電極に対応する位置に開口が設けられているマスクを備えており、移送されてきた基板の表面にマスクを重ね、マスク上でスキージングしたクリーム状の半田を電極上に印刷する。マスクは基板の種類（電極の位置）によって専用のものが準備されている。同種の基板に対しては同一のマスクを使用して印刷を行う。半田印刷装置３で半田が印刷された基板は印刷状態検査装置４に順次移送される。   The solder printing apparatus 3 performs solder screen printing on the electrodes formed on the substrate surface. A mask used for screen printing needs to be in close contact with the substrate surface and does not adhere to a substrate with significant warpage. Therefore, the substrate incurring such warpage is excluded from the electronic component mounting apparatus 1 by the substrate inspection apparatus 2. The The solder printing apparatus 3 is provided with a mask having an opening at a position corresponding to the electrode of the substrate. The mask is superimposed on the surface of the transferred substrate, and the cream-like solder squeezed on the mask is placed on the electrode. Print on. A special mask is prepared depending on the type of substrate (position of electrode). Printing is performed on the same type of substrate using the same mask. The board on which the solder is printed by the solder printing apparatus 3 is sequentially transferred to the printing state inspection apparatus 4.

印刷状検査装置４は半田印刷装置３から順次移送されてきた基板に印刷されている半田の外観検査を行う。基板検査装置２と同様に三次元計測器を用いて半田表面を含む基板表面の全面に適宜分布させたサンプリング測点の三次元データ（ＸＹＺ座標値）を取得する。印刷状態検査装置４には表示パネル１０が備わっている。表示パネル１０は三次元データに基づいて半田の外観を示す三次元画像を生成し、同種の基板に印刷された半田の三次元画像を同一座標上で重ね合わせた状態で可視的に表示することができるようになっている。   The printed inspection apparatus 4 inspects the appearance of the solder printed on the board sequentially transferred from the solder printing apparatus 3. Similar to the substrate inspection apparatus 2, three-dimensional data (XYZ coordinate values) of sampling measurement points that are appropriately distributed over the entire surface of the substrate surface including the solder surface are acquired using a three-dimensional measuring instrument. The print state inspection device 4 includes a display panel 10. The display panel 10 generates a three-dimensional image showing the appearance of the solder based on the three-dimensional data, and visually displays the three-dimensional image of the solder printed on the same type of substrate in a state of being superimposed on the same coordinates. Can be done.

図２に表示パネルの表示例を示す。この表示パネル１０には電極１１に印刷された半田の三次元画像が拡大して表示されている。点線１２は正常な印刷状態にある半田の外観を示しており、半田印刷装置３での印刷作業が正常に行われている限りにおいては、重ね合わされた半田の三次元画像の大多数はこの点線１２で示された位置に表示される。これに対し実線１３、１４は不良な印刷状態にある半田の外観を示している。   FIG. 2 shows a display example of the display panel. On the display panel 10, a three-dimensional image of the solder printed on the electrode 11 is enlarged and displayed. The dotted line 12 shows the appearance of the solder in a normal printing state. As long as the printing operation in the solder printing apparatus 3 is normally performed, the majority of the three-dimensional images of the superimposed solder are the dotted lines. It is displayed at the position indicated by 12. On the other hand, solid lines 13 and 14 show the appearance of the solder in a defective printed state.

このうち実線１３は正常な印刷状態のものに比べて印刷面積が過少である不良な印刷状態にある半田の外観を示している。このような印刷不良はマスクの開口に十分な量の半田が充填されなかったか、もしくは充填された半田の一部がマスクを基板表面から剥がすときにマスクに付着したままになってしまったような場合に発生する。このような印刷状態にある半田は正常な印刷状態にあるものに比べて量（体積）が不足し、電子部品などを半田付けする際の強度不足という問題を招くことになる。   Among these, the solid line 13 shows the appearance of the solder in a defective printing state in which the printing area is less than that in the normal printing state. Such a printing defect is that the mask opening is not filled with a sufficient amount of solder, or a part of the filled solder remains attached to the mask when the mask is peeled off from the substrate surface. Occurs when. The solder in such a printed state is insufficient in amount (volume) compared to that in a normal printed state, which causes a problem of insufficient strength when soldering electronic components and the like.

また実線１４は正常な印刷状態のものに比べて印刷面積が過大である不良な印刷状態にある半田の外観を示している。このような印刷不良はマスクと基板の間の隙間に半田が入り込んだ結果起きるものであり、基板やマスクに反りがある場合に顕著に発生する。なお、上部に突出した角部１５はマスクの開口からの抜けが悪い半田に発生する。このような半田は正常な印刷状態にある半田に比べて量（体積）が過大であり、電子部品などを半田
付けする際に電極１１からはみ出し、隣り合う電極に印刷されている半田と融着して電極同士を短絡させるという問題を招くことになる。 A solid line 14 shows the appearance of solder in a defective printing state in which the printing area is excessive compared to that in a normal printing state. Such a printing defect occurs as a result of the solder entering the gap between the mask and the substrate, and occurs remarkably when the substrate or the mask is warped. Note that the corner 15 protruding upward is generated in the solder that is not easily removed from the opening of the mask. Such solder has an excessive amount (volume) compared to solder in a normal printing state, and protrudes from the electrode 11 when soldering an electronic component or the like, and is fused with the solder printed on the adjacent electrode. This causes the problem of short-circuiting the electrodes.

通常、半田の印刷状態は半田表面の三次元データに基づいて半田の印刷面積、体積、厚さ、位置等の評価項目を数値化し、これらを閾値処理することでその良否が判断される。この数値化による閾値処理によれば、主観に左右されることなく画一的にかつ効率良く判断を行うことができるという利点を有するが、予め評価項目として挙げられていない印刷態様は判断要素とはならないので、外観上は明らかに不良であるにもかかわらず正常であると判断するような状況も起りうる。このような外観上の不良箇所は表示パネル１０に表示された半田の三次元画像を確認することで容易に発見することができる。そしてこの三次元画像は複数の同種の基板については重ねて表示することができるので、半田の印刷状態を時系列で確認することができ、印刷状態の変化の傾向を知ることもできる。また三次元画像を重ねて表示することで、単体では発見しにくい不良箇所も他の三次元画像の同一箇所との位置関係によって容易に発見することができる。   Normally, the quality of the solder printing is judged by quantifying evaluation items such as the solder printing area, volume, thickness, and position based on the three-dimensional data on the solder surface, and thresholding these items. According to the threshold processing based on the numerical value, there is an advantage that the determination can be performed uniformly and efficiently without being influenced by the subjectivity. However, the printing mode not previously listed as the evaluation item is a determination element. Therefore, there may be a situation in which it is judged that the appearance is normal although the appearance is clearly poor. Such a defective portion in appearance can be easily found by confirming a three-dimensional image of solder displayed on the display panel 10. Since this three-dimensional image can be displayed in a superimposed manner for a plurality of the same type of substrates, the printing state of the solder can be confirmed in time series, and the tendency of the change in the printing state can also be known. Further, by displaying the three-dimensional images in an overlapping manner, a defective portion that is difficult to find by itself can be easily found by the positional relationship with the same portion of another three-dimensional image.

このようにして半田の印刷状態が正常であると判断された基板は電子部品搭載装置５に移送される。電子搭載装置５は電子部品の電極が半田に接触するように電子部品の搭載を行う。搭載状態検査装置６は基板表面の三次元計測によって電子部品の搭載状態の検査を行う。電子部品が正常な搭載状態にある基板はリフロー装置７に移送され、ここで電子部品を基板に半田付けする。これで電子部品と基板が電気的および機械的に完全に接続された状態となり、電子部品の実装工程が完了する。   Thus, the board | substrate determined that the printing state of solder is normal is transferred to the electronic component mounting apparatus 5. FIG. The electronic mounting device 5 mounts the electronic component such that the electrode of the electronic component is in contact with the solder. The mounting state inspection device 6 inspects the mounting state of the electronic component by three-dimensional measurement of the substrate surface. The substrate on which the electronic component is normally mounted is transferred to the reflow device 7 where the electronic component is soldered to the substrate. Thus, the electronic component and the board are completely electrically and mechanically connected, and the mounting process of the electronic component is completed.

実装状態検査装置８は、実装を終えた基板の外観検査を行う。この外観検査は基板が製品として出荷できる品質であるかどうかの最終確認を行うものであり、半田のリフロー時に移動した電子部品が許容範囲内にあるかどうかを基板表面の三次元計測によって確認する。   The mounting state inspection device 8 performs an appearance inspection of the substrate after the mounting. This visual inspection is a final confirmation of whether the board is of a quality that can be shipped as a product. It is confirmed by three-dimensional measurement of the board surface whether the electronic parts moved during solder reflow are within an acceptable range. .

管理コンピュータ９は、前記各装置２〜８の動作制御を行うとともに、個々の基板に対して各装置２〜８で実行した作業に関するデータやそこで得られた三次元データ等を基板のＩＤ情報と関連付けたデータベースとして記憶する。このデータベースには印刷状検査装置４で取得した半田の三次元画像も記憶されているので、表示パネル１０はリアルタイムで印刷された半田の三次元画像を表示するだけでなく、過去に印刷された半田の三次元画像も表示させることができる。   The management computer 9 controls the operation of each of the devices 2 to 8, and uses the substrate ID information and the data regarding the work executed by the devices 2 to 8 for each substrate, the three-dimensional data obtained there, etc. Store as an associated database. Since this database also stores the three-dimensional image of the solder acquired by the printing inspection apparatus 4, the display panel 10 not only displays the three-dimensional image of the solder printed in real time, but also has been printed in the past. A three-dimensional image of solder can also be displayed.

例えば印刷不良が原因となる製品不具合があった場合、この製品に搭載された基板のＩＤ情報からこの基板を含む前後に印刷された複数の基板の三次元画像をデータベースで検索し、これらの三次元画像を重ねて表示することで、印刷不良がその基板にだけ発生した突発的なものであるのか、もしくは時系列で徐々に印刷状態が悪化したというような継続的ものであるのか等の不良発生の傾向を把握することができる。これにより印刷不良の発生原因をある程度絞り込んで推察できるので、必要に応じて半田印刷装置３における印刷条件の見直し等を講じ、今後の印刷品質の向上を図ることができる。   For example, when there is a product defect caused by printing failure, the database retrieves a three-dimensional image of a plurality of substrates printed before and after including this substrate from the ID information of the substrate mounted on this product, By displaying the original image in a superimposed manner, whether the print failure is a sudden one that occurred only on the board or whether the print state deteriorated gradually over time, etc. The tendency of occurrence can be grasped. As a result, the cause of the printing failure can be inferred to some extent, so that it is possible to improve the printing quality in the future by reviewing the printing conditions in the solder printing apparatus 3 as necessary.

本発明は電子部品を基板に半田付けする電子部品の実装分野において有用である。   The present invention is useful in the field of electronic component mounting where an electronic component is soldered to a substrate.

本発明の実施の形態の電子部品実装装置の構成を示したブロック図The block diagram which showed the structure of the electronic component mounting apparatus of embodiment of this invention 本発明の実施の形態の表示パネルの表示例を示した図The figure which showed the example of a display of the display panel of embodiment of this invention

符号の説明Explanation of symbols

１ 電子部品実装装置
３ 半田印刷装置
４ 印刷状態検査装置
１０ 表示パネル DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Solder printer 4 Print state inspection apparatus 10 Display panel

Claims (1)

マスクを用いて複数の基板に印刷された半田の印刷状態を検査するための装置において、基板に印刷された半田の表面の三次元データを取得する手段と、取得した三次元データに基づいて半田の外観を示す三次元画像を生成する手段と、複数の同種の基板に印刷された半田の三次元画像を同一画面上に重ねて表示する手段を備えたことを特徴とする装置。   In an apparatus for inspecting the printing state of solder printed on a plurality of substrates using a mask, means for acquiring three-dimensional data of the surface of the solder printed on the substrate, and solder based on the acquired three-dimensional data An apparatus comprising: means for generating a three-dimensional image showing the appearance of the above; and means for displaying three-dimensional images of solder printed on a plurality of the same type of substrates in a superimposed manner on the same screen.
JP2008108587A 2008-04-18 2008-04-18 Device for inspecting the printed state of solder Active JP4840394B2 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284790A (en) * 2000-03-30 2001-10-12 Omron Corp Device and method for visually inspecting cream solder printing
JP2005291760A (en) * 2004-03-31 2005-10-20 Anritsu Corp Printed circuit board inspection apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284790A (en) * 2000-03-30 2001-10-12 Omron Corp Device and method for visually inspecting cream solder printing
JP2005291760A (en) * 2004-03-31 2005-10-20 Anritsu Corp Printed circuit board inspection apparatus

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