JP2009248415A - Thermal printing head - Google Patents

Thermal printing head Download PDF

Info

Publication number
JP2009248415A
JP2009248415A JP2008097974A JP2008097974A JP2009248415A JP 2009248415 A JP2009248415 A JP 2009248415A JP 2008097974 A JP2008097974 A JP 2008097974A JP 2008097974 A JP2008097974 A JP 2008097974A JP 2009248415 A JP2009248415 A JP 2009248415A
Authority
JP
Japan
Prior art keywords
print head
thermal print
electrical connection
individual electrode
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008097974A
Other languages
Japanese (ja)
Other versions
JP5080335B2 (en
Inventor
Takeshi Yamamoto
剛 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Hokuto Electronics Corp
Original Assignee
Toshiba Hokuto Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Hokuto Electronics Corp filed Critical Toshiba Hokuto Electronics Corp
Priority to JP2008097974A priority Critical patent/JP5080335B2/en
Publication of JP2009248415A publication Critical patent/JP2009248415A/en
Application granted granted Critical
Publication of JP5080335B2 publication Critical patent/JP5080335B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body

Landscapes

  • Electronic Switches (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable it to make a thermal printing head have a narrow-pitch in the main scan direction and to be miniaturized in the sub scan direction, simply. <P>SOLUTION: A common electrode 16 and an individual electrode 17 which are piled up to an exothermic resistor layer 15 arranged on a support substrate 13 are provided. An opening 20 is formed in a protective sheet 19 which covers both the metal layer 30 forming the individual electrode 17 for turning on electricity to an exothermic part 18 formed in the exothermic resistor layer 15 and the exothermic part 18. A protruding electric connection part 21 which connects to the individual electrode 17 in the opening 20 and prolongs on the protective sheet 19 is provided. The protruding electric connection part 21 prolongs up to the position right above an adjoining metal layer (the individual electrode 17b) on the protective sheet 1 and be connected to a bonding pad 24 of a driving IC 23 on a driving circuit substrate 22 by a bonding wire W. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は画像記録デバイスとして用いるサーマルプリントヘッドに関する。   The present invention relates to a thermal print head used as an image recording device.

サーマルプリントヘッドは、その発熱部の発熱を利用して感熱記録紙、製版フィルム印画紙、各種カード類等の記録媒体に文字などから成る画像を形成する出力用デバイスである。そして、バーコードプリンタや計量機、デジタル製版機、ビデオプリンター、イメージャー、シールプリンター等の各記録機器に広く利用されている。一般的に、サーマルプリントヘッドは、画像形成のための発熱部を設けた抵抗体基板部および駆動用ＩＣを搭載した駆動回路基板部などを、放熱基板の一主面上に配置した構造になっている。   A thermal print head is an output device that forms an image composed of characters on a recording medium such as thermal recording paper, plate-making film photographic paper, and various cards using heat generated by a heat generating portion. It is widely used in recording devices such as barcode printers, weighing machines, digital plate-making machines, video printers, imagers, and seal printers. Generally, a thermal print head has a structure in which a resistor substrate portion provided with a heat generating portion for image formation and a drive circuit substrate portion mounted with a driving IC are arranged on one main surface of a heat dissipation substrate. ing.

ここで、従来のサーマルプリントヘッドについて図６および図７を参照して説明する。図６はサーマルプリントヘッドの一部を抜き出した一部平面図であり、図７は図６のＺ−Ｚ矢視の記録媒体が搬送されるいわゆる副走査方向における横断面図である。このサーマルプリントヘッドは、この副走査方向に直交する方向すなわち主走査方向に沿い所要の長さに延在している。   Here, a conventional thermal print head will be described with reference to FIGS. FIG. 6 is a partial plan view in which a part of the thermal print head is extracted, and FIG. 7 is a transverse cross-sectional view in the so-called sub-scanning direction in which the recording medium indicated by the arrows ZZ in FIG. 6 is conveyed. The thermal print head extends to a required length along a direction orthogonal to the sub-scanning direction, that is, the main scanning direction.

図６，７に示すように、サーマルプリントヘッド１００には、例えば放熱基板１０１上に抵抗体基板部１０２Ａおよび駆動回路基板部１０２Ｂが隣接して設けられる。そして、抵抗体基板部１０２Ａでは、放熱基板１０１の主面上に支持基板１０３が貼着され、支持基板１０３上にグレーズ層１０４が一体に設けられている。このグレーズ層１０４は、例えばスクリーン印刷法による塗布形成とその焼成とにより形成される。   As shown in FIGS. 6 and 7, in the thermal print head 100, for example, a resistor substrate portion 102A and a drive circuit substrate portion 102B are provided adjacent to each other on a heat dissipation substrate 101. In the resistor substrate portion 102 </ b> A, the support substrate 103 is stuck on the main surface of the heat dissipation substrate 101, and the glaze layer 104 is integrally provided on the support substrate 103. The glaze layer 104 is formed by, for example, coating formation by screen printing and firing.

そして、上述したようなグレーズ層１０４表面を被覆して発熱抵抗体層１０５が形成され、この発熱抵抗体層１０５上に、Ａｌなどの金属層の共通電極１０６および個別電極１０７が間隙Ｇを挟んで対向して配列されている。ここで、共通電極１０６および個別電極１０７は発熱抵抗体層１０５に重層して電気接続し、これ等の間隙Ｇで露出する発熱抵抗体層１０５が発熱部１０８になる。これ等の共通電極１０６、個別電極１０７および発熱部１０８で１つの発熱素子となり、この発熱素子はサーマルプリントヘッド１００の主走査方向に、所定数の発熱素子アレイとして一列に並行配設してある。そして、例えば膜厚５〜１０μｍ程度の保護膜１０９が全体を被覆するように形成されている。   Then, the heating resistor layer 105 is formed so as to cover the surface of the glaze layer 104 as described above, and the common electrode 106 and the individual electrode 107 of a metal layer such as Al sandwich the gap G on the heating resistor layer 105. Are arranged facing each other. Here, the common electrode 106 and the individual electrode 107 are overlapped with and electrically connected to the heating resistor layer 105, and the heating resistor layer 105 exposed in the gap G becomes a heating portion 108. The common electrode 106, the individual electrode 107, and the heat generating portion 108 form one heat generating element, and the heat generating elements are arranged in parallel as a predetermined number of heat generating element arrays in the main scanning direction of the thermal print head 100. . For example, a protective film 109 having a thickness of about 5 to 10 μm is formed so as to cover the whole.

各発熱素子の個別電極１０７の配線パターンの端部はボンディングワイヤとの電気接続部であるボンディングパッド１０７ａとなり、その上部の保護膜１０９が一部除去され開口部１１０が設けられている。ここで、各個別電極１０７のボンディングパッド１０７ａは、図６に示されるように、ボンディングワイヤ接続に支障を来さないようにボンディングパッド１０７ａのパターン幅は個別電極１０７の配線パターンよりも広げられている。その配置制約から、隣接する個別電極１０７間においてヘッドの主走査方向すなわち個別電極が並行する方向に千鳥足状配置にして副走査方向に複数段に分けて配列される。   An end portion of the wiring pattern of the individual electrode 107 of each heating element becomes a bonding pad 107a which is an electrical connection portion with a bonding wire, and the protective film 109 on the upper portion thereof is partially removed to provide an opening 110. Here, as shown in FIG. 6, the bonding pad 107 a of each individual electrode 107 is wider than the wiring pattern of the individual electrode 107 so as not to hinder the bonding wire connection. Yes. Due to the arrangement restrictions, the adjacent individual electrodes 107 are arranged in a staggered arrangement in the main scanning direction of the head, that is, the direction in which the individual electrodes are parallel, and arranged in a plurality of stages in the sub-scanning direction.

例えば、個別電極１０７の配線パターンのパターン幅が４０μｍの場合、ボンディングパッド１０７ａの主走査方向および副走査方向のパターン幅はそれぞれ例えば７０μｍ、２００μｍ程度になる。そして、ボンディングパッド１０７ａと隣接する個別電極１０７の間隔を最小寸法の１５μｍとして、互いに隣接する個別電極１０７の配線パターン間隔は３０μｍになり、個別電極１０７の配線ピッチは７０μｍとなる。なおこの場合の発熱素子ドット密度は３６０ｄｐｉである。   For example, when the pattern width of the wiring pattern of the individual electrode 107 is 40 μm, the pattern width of the bonding pad 107a in the main scanning direction and the sub-scanning direction is, for example, about 70 μm and 200 μm, respectively. Then, the interval between the individual electrodes 107 adjacent to the bonding pad 107a is set to 15 μm, which is the minimum dimension, the wiring pattern interval between the individual electrodes 107 adjacent to each other is 30 μm, and the wiring pitch of the individual electrodes 107 is 70 μm. In this case, the heating element dot density is 360 dpi.

一方、駆動回路基板部１０２Ｂは、放熱基板１０１に貼着した駆動回路基板１１１等から構成され、その基板表面に回路パターン（不図示）等が形成され、また駆動用ＩＣ１１２等が搭載されている。そして、抵抗体基板部１０２Ａの上記ボンディングパッド１０７ａと駆動用ＩＣ１１２のボンディングパッド１１３間、および、駆動用ＩＣ１１２と駆動回路基板部１０２Ｂの回路パターンとの間などがボンディングワイヤＷで電気的に接続されている。そして、これ等のボンディングワイヤＷおよび駆動用ＩＣ１１２は、図示しないが例えばエポキシ樹脂から成る封止材によって気密封止される。   On the other hand, the drive circuit board portion 102B includes a drive circuit board 111 and the like attached to the heat dissipation board 101, a circuit pattern (not shown) and the like are formed on the surface of the board, and a drive IC 112 and the like are mounted. . The bonding pads 107a of the resistor substrate portion 102A and the bonding pads 113 of the driving IC 112 and the circuit patterns of the driving IC 112 and the driving circuit substrate portion 102B are electrically connected by bonding wires W. ing. The bonding wires W and the driving IC 112 are hermetically sealed with a sealing material made of, for example, an epoxy resin (not shown).

上記サーマルプリントヘッド１００を用いた記録媒体への画像形成では、感熱記録媒体や熱転写インクリボン等（図示せず）が、発熱部１０８領域上の保護膜１０９といわゆるプラテンローラ（図示せず）との間で挟圧され、副走査方向に所定の速度で搬送される。この搬送において、例えば感熱記録媒体が発熱部１０８により加熱され、その熱により印画される。   In image formation on a recording medium using the thermal print head 100, a thermal recording medium, a thermal transfer ink ribbon, or the like (not shown) is used to form a protective film 109 on a heating portion 108 area and a so-called platen roller (not shown). And are conveyed at a predetermined speed in the sub-scanning direction. In this conveyance, for example, the heat-sensitive recording medium is heated by the heat generating unit 108 and printed by the heat.

なお、上記したのと同様な構成のサーマルプリントヘッドは特許文献１などに記載されている。
特開２００６−２７２８５１号公報 A thermal print head having the same configuration as described above is described in Patent Document 1 and the like.
JP 2006-272851 A

ところで、上述したようなサーマルプリントヘッド１００は、その高画質化のために発熱素子アレイの高密度化が求められ、上記個別電極１０７における配線パターン配列の更なる狭ピッチ化が必要になってきている。そして、サーマルプリントヘッドの小型化、低コスト化も強く要求されている。   Incidentally, the thermal print head 100 as described above is required to increase the density of the heating element array in order to improve the image quality, and it is necessary to further reduce the pitch of the wiring pattern array in the individual electrode 107. Yes. There is also a strong demand for miniaturization and cost reduction of thermal print heads.

しかしながら、従来のサーマルプリントヘッドでは、発熱素子アレイの狭ピッチ化およびヘッドの小型化が難しくなってきている。これは、ボンディングパッドの主走査方向のパターン幅がワイヤボンディングのために個別電極１０７の配線パターン幅よりも広くなり、その狭幅化に限界があり、従来の技術におけるボンディングパッド１０７ａではこのボンディングパッド１０７ａの広いパターン幅で個別電極１０７の主走査方向の配列における狭ピッチ化が制約されるからである。   However, in the conventional thermal print head, it is difficult to reduce the pitch of the heating element array and the size of the head. This is because the pattern width of the bonding pad in the main scanning direction is wider than the wiring pattern width of the individual electrode 107 due to wire bonding, and there is a limit to narrowing the width of the bonding pad. This is because a narrow pattern width in the array of the individual electrodes 107 in the main scanning direction is restricted by a wide pattern width 107a.

また、ボンディングパッド１０７ａは、その主走査方向のパターン幅に加えてその副走査方向のパターン幅の縮小化が難しい。これは、ワイヤボンディングをする前に行われる共通電極１０６と各個別電極１０７間の通電検査、あるいはそのワイヤボンディングにおいて、厚い保護膜１０９に設けられた開口部１１０の副走査方向の寸法は、所定以上に広くなっていることが必要となるからである。開口部１１０は保護膜１０９の厚さ分の深さになる。このため、上記各発熱素子の通電検査において、上記副走査方向の寸法が広く余裕がないと検査用プローブが充分にボンディングパッド１０７ａに接触することができなくなる。また、上記副走査方向の寸法に余裕がないと例えばステッチボンディングのようなワイヤボンディングができなくなる。   In addition to the pattern width in the main scanning direction, it is difficult to reduce the pattern width in the sub-scanning direction of the bonding pad 107a. This is because the size of the opening 110 provided in the thick protective film 109 in the sub-scanning direction in the energization inspection between the common electrode 106 and each individual electrode 107 performed before wire bonding or the wire bonding is predetermined. This is because it is necessary to be wider. The opening 110 has a depth corresponding to the thickness of the protective film 109. For this reason, in the energization inspection of each heating element, if the dimension in the sub-scanning direction is wide and there is no allowance, the inspection probe cannot sufficiently contact the bonding pad 107a. Further, if there is no margin in the dimension in the sub-scanning direction, for example, wire bonding such as stitch bonding cannot be performed.

以上のようなことから、従来のサーマルプリントヘッド１００は、その高画質化、小型化およびその低コスト化が難しい構造になっていた。   As described above, the conventional thermal print head 100 has a structure in which it is difficult to achieve high image quality, miniaturization, and cost reduction.

本発明は、上述の事情に鑑みてなされたもので、サーマルプリントヘッドの主走査方向における簡便な狭ピッチ化および副走査方向における簡便な小型化を可能にして、その高画質化と低コスト化を容易にするサーマルプリントヘッドを提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and enables a simple narrow pitch in the main scanning direction and a simple downsizing in the sub-scanning direction of the thermal print head, thereby achieving high image quality and low cost. It is an object of the present invention to provide a thermal print head that facilitates the above.

上記目的を達成するために、本発明にかかるサーマルプリントヘッドは、
絶縁基板と、
前記絶縁基板の上に配置された発熱抵抗体層と、
前記発熱抵抗体層に設けられた複数の発熱部にそれぞれに通電する金属層が並行に複数配列されて成る発熱素子群と、
前記発熱部と前記金属層を少なくとも被覆し前記絶縁基板上に積層する保護膜と、
前記金属層を被覆する前記保護膜に開口部が形成され、前記開口部に設けられた電気接続部とを具備するサーマルプリントヘッドにおいて、
前記開口部は前記複数の金属層が並行配列される方向に千鳥足状に設けられ、前記電気接続部のうち少なくとも前記金属層が隣接する位置に配置された電気接続部は前記開口部において前記開口部からせり上がり隣接する前記金属層の直上の前記保護膜上に延在するパターンに形成された金属体を有することを特徴とするサーマルプリントヘッドにある。そして、本発明では、前記発熱素子群の駆動を制御する駆動用ＩＣが備えられ、電気接続部は駆動用ＩＣとボンディングワイヤで接続される構成になる。 In order to achieve the above object, a thermal print head according to the present invention includes:
An insulating substrate;
A heating resistor layer disposed on the insulating substrate;
A heating element group comprising a plurality of metal layers arranged in parallel to each of a plurality of heating portions provided in the heating resistor layer;
A protective film that covers at least the heat generating portion and the metal layer and is laminated on the insulating substrate;
An opening is formed in the protective film covering the metal layer, and a thermal print head comprising an electrical connection provided in the opening,
The openings are provided in a staggered manner in a direction in which the plurality of metal layers are arranged in parallel, and at least the electrical connection portions arranged at positions where the metal layers are adjacent to each other among the electrical connection portions are the openings in the openings. A thermal print head comprising a metal body formed in a pattern extending on the protective film directly above the adjacent metal layer rising from the portion. In the present invention, a driving IC for controlling the driving of the heating element group is provided, and the electrical connection portion is connected to the driving IC by a bonding wire.

本発明の構成により、サーマルプリントヘッドの主走査方向における簡便な狭ピッチ化および副走査方向における簡便な小型化が可能になり、その高画質化と低コスト化を容易にするサーマルプリントヘッドを提供することができる。   According to the configuration of the present invention, it is possible to easily reduce the pitch of the thermal print head in the main scanning direction and to reduce the size of the thermal print head in the sub-scanning direction. can do.

本発明の好適な実施形態について図１および図２を参照して説明する。ここで、図１はサーマルプリントヘッドの一部を抜き出した一部平面図である。図２は、図１のＸ−Ｘ矢視の断面図である。以下、図面は模式的なものであり、各寸法の比率等は現実のものとは異なる。   A preferred embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is a partial plan view of a part of the thermal print head. 2 is a cross-sectional view taken along arrow XX in FIG. In the following, the drawings are schematic, and the ratio of each dimension is different from the actual one.

図１，２に示すように、サーマルプリントヘッド１０では、放熱基板１１上に抵抗体基板部１２Ａおよび駆動回路基板部１２Ｂが隣接して設けられている。この抵抗体基板部１２Ａでは、放熱基板１１の主面上にＡｌ2Ｏ3（アルミナ）等の耐熱性および熱伝導性のよい支持基板１３が貼着されている。そして、支持基板１３上にグレーズ層１４が形成され、グレーズ層１４上に発熱抵抗体層１５が配置されている。ここで、支持基板１３およびグレーズ層１４が絶縁基板を構成する。 As shown in FIGS. 1 and 2, in the thermal print head 10, a resistor substrate portion 12 </ b> A and a drive circuit substrate portion 12 </ b> B are provided adjacent to each other on a heat dissipation substrate 11. In the resistor substrate portion 12 </ b > A, a support substrate 13 having good heat resistance and thermal conductivity such as Al 2 O 3 (alumina) is attached to the main surface of the heat dissipation substrate 11. A glaze layer 14 is formed on the support substrate 13, and a heating resistor layer 15 is disposed on the glaze layer 14. Here, the support substrate 13 and the glaze layer 14 constitute an insulating substrate.

発熱抵抗体層１５上に、金属層３０である共通電極１６および個別電極１７が間隙Ｇを挟んで対向して配列されている。共通電極１６および個別電極１７は発熱抵抗体層１５に重層して電気接続し、これ等の間隙Ｇで露出する発熱抵抗体層１５が発熱部１８となる。そして、これ等の共通電極１６、個別電極１７および発熱部１８で１つの発熱素子となり、この発熱素子はサーマルプリントヘッド１０の主走査方向に、所定密度例えば６００ｄｐｉの発熱素子アレイとして一列に並行配設してある。また、保護膜１９が全体を被覆するように形成されている。   On the heating resistor layer 15, the common electrode 16 and the individual electrode 17 that are the metal layers 30 are arranged to face each other with the gap G interposed therebetween. The common electrode 16 and the individual electrode 17 are overlapped with and electrically connected to the heating resistor layer 15, and the heating resistor layer 15 exposed in the gap G becomes a heating portion 18. These common electrode 16, individual electrode 17 and heat generating portion 18 form one heat generating element, and this heat generating element is arranged in parallel in a main scanning direction of the thermal print head 10 as a heat generating element array of a predetermined density, for example, 600 dpi. It is set up. A protective film 19 is formed so as to cover the whole.

そして、各発熱素子の個別電極１７の配線パターンの端部に開口部２０が設けられ、この開口部２０にせり上がり電気接続部２１が形成されている。このせり上がり電気接続部２１は、例えばＡｌ（アルミニウム）のような個別電極１７と同一材質であってもよいし、例えばＡｕ（金）のような異質材料であってもよい。そして、このせり上がり電気接続部２１は、開口部２０において金属層である個別電極１７表面に電気接続してその開口部２０内を充填し、図１に示されるように例えば円形平面形状に、開口部２０から保護膜１９上に延びる。電気接続部２１は主走査方向すなわち個別電極が並行配列する方向に千鳥足（ジグザグ）状例えば２段のパターンで配置される。交互に並行配列された第１の個別電極１７ａが発熱部１８に近い側に開口部を、第２の個別電極１７ｂが遠い側に開口部を持つ。第１の個別電極１７ａの開口部の電気接続部２１は、隣接する第２の個別電極１７ｂの直上の保護膜１９ａ上にまで延在し張り出す円板状のパターンに形成されて、直径は７０μｍ程度になる。   And the opening part 20 is provided in the edge part of the wiring pattern of the separate electrode 17 of each heat generating element, and the electrical connection part 21 is formed in this opening part 20 and is formed. The raised electrical connection portion 21 may be made of the same material as that of the individual electrode 17 such as Al (aluminum), or may be made of a different material such as Au (gold). The rising electrical connection portion 21 is electrically connected to the surface of the individual electrode 17 that is a metal layer in the opening portion 20 and fills the inside of the opening portion 20 as shown in FIG. It extends from the opening 20 onto the protective film 19. The electrical connection portions 21 are arranged in a zigzag pattern, for example, a two-stage pattern in the main scanning direction, that is, the direction in which the individual electrodes are arranged in parallel. The first individual electrodes 17a arranged alternately in parallel have an opening on the side closer to the heat generating portion 18, and the second individual electrode 17b has an opening on the far side. The electrical connection portion 21 at the opening of the first individual electrode 17a is formed in a disk-like pattern that extends to and overhangs the protective film 19a immediately above the adjacent second individual electrode 17b, and has a diameter of It becomes about 70 μm.

例えば、個別電極１７配線パターンのパターン幅が従来技術と同様に４０μｍの場合、互いに隣接する個別電極１７の間隔を最小寸法の１５μｍにして、個別電極１７の配線ピッチは５５μｍとなる。このように、設計寸法が同じ条件であっても、配線ピッチは上述した従来技術の場合に比べて２０％以上向上するようになる。このような断面が鋲形の電気接続部２１により、個別電極幅は接続部で広幅にする必要がなく一様な同じ幅にできる。しかも、配列される電気接続部２１のパターン幅で配列密度が定まり、個別電極幅に依存することがない。   For example, when the pattern width of the individual electrode 17 wiring pattern is 40 μm as in the prior art, the interval between the individual electrodes 17 adjacent to each other is set to a minimum dimension of 15 μm, and the wiring pitch of the individual electrodes 17 is 55 μm. As described above, even when the design dimensions are the same, the wiring pitch is improved by 20% or more compared to the above-described conventional technique. With such an electrical connection portion 21 having a bowl-shaped cross section, the individual electrode width does not need to be wide at the connection portion, and can be made uniform and uniform. Moreover, the arrangement density is determined by the pattern width of the electrical connection portions 21 arranged, and does not depend on the individual electrode width.

駆動回路基板部１２Ｂは、放熱基板１１に貼着した駆動回路基板２２を有し、その基板表面に回路パターン（図示せず）等が形成され、駆動用ＩＣ２３等が搭載されている。そして、駆動用ＩＣ２３において、上記せり上がり電気接続部２１との対向部分に交互に配置されたボンディングパッド２４と、同様に接続パッドとなる上記せり上がり電気接続部２１との間がボンディングワイヤＷで電気的に接続される。更に、この駆動用ＩＣ２３と上記回路パターンとの間もボンディングワイヤＷで電気的に接続され、せり上がり電気接続部２１、ボンディングワイヤＷおよび駆動用ＩＣ２３は、図示しないが従来技術と同様に例えばエポキシ樹脂から成る封止材によって気密封止される。但し、図１では、図を判り易くするためにボンディングワイヤＷの図示は省かれている。   The drive circuit board portion 12B has a drive circuit board 22 adhered to the heat dissipation board 11, a circuit pattern (not shown) or the like is formed on the surface of the board, and a drive IC 23 or the like is mounted. In the driving IC 23, a bonding wire W is provided between the bonding pads 24 alternately arranged at the portions facing the rising electrical connection portion 21 and the rising electrical connection portion 21 which also becomes a connection pad. Electrically connected. Further, the driving IC 23 and the circuit pattern are also electrically connected by a bonding wire W, and the rising electrical connection portion 21, the bonding wire W, and the driving IC 23 are not shown in the figure, for example, as in the prior art, for example, epoxy It is hermetically sealed by a sealing material made of resin. However, in FIG. 1, the bonding wires W are not shown for easy understanding of the drawing.

上記サーマルプリントヘッド１０を用いた記録媒体への画像形成では、従来の技術で説明したのと同様であり、その記録媒体が、発熱部１８領域上の保護膜１９といわゆるプラテンローラ（図示せず）との間で挟圧され、副走査方向に所定の速度で搬送される。ここで、特定の発熱素子の個別電極１７が選択されて接地電位にされ、例えば数十Ｖに印加されている共通電極１６との間で通電が行われて、その発熱部１８が発熱する。そして、上記搬送において、例えば感熱記録媒体が発熱部１８により加熱され、その熱により印画される。   The image formation on the recording medium using the thermal print head 10 is the same as described in the prior art, and the recording medium includes a protective film 19 on the heat generating portion 18 area and a so-called platen roller (not shown). ) And is conveyed at a predetermined speed in the sub-scanning direction. Here, the individual electrode 17 of a specific heating element is selected and set to the ground potential, and energization is performed between the common electrode 16 applied with, for example, several tens of volts, and the heating portion 18 generates heat. In the conveyance, for example, the heat-sensitive recording medium is heated by the heat generating unit 18 and is printed by the heat.

上記サーマルプリントヘッド１０において、放熱基板１１は例えばＡｌ金属から成り、支持基板１３は、通常、耐熱性を有する絶縁体材料から成る支持基板であり、Ａｌ2Ｏ3セラミックスの他に、Ｓｉ（シリコン）、石英、炭化珪素等により構成される。そして、この支持基板１３は熱伝導性のよい両面接着テープ、シリコーン樹脂等の樹脂製接着剤により放熱基板１１表面に貼着される。 In the thermal print head 10, the heat dissipation substrate 11 is made of, for example, Al metal, and the support substrate 13 is usually a support substrate made of an insulating material having heat resistance, and in addition to Al 2 O 3 ceramics, Si (silicon ), Quartz, silicon carbide or the like. And this support substrate 13 is affixed on the surface of the thermal radiation board | substrate 11 with resin adhesives, such as a double-sided adhesive tape with good heat conductivity, and silicone resin.

上記グレーズ層１４は、発熱部１８の発する熱を蓄積および放散する作用を有し、表面平滑性のある絶縁体材料であればよい。例えばＳｉＯ２（酸化珪素）から成るガラス膜、あるいはポリイミド樹脂等の低熱伝導性材料から成る。ここで、グレーズ層１４は、支持基板１３表面の全体を被覆する必要はなく、少なくとも発熱部１８下に配置されるように形成されていればよい。 The glaze layer 14 may be any insulator material that has an action of accumulating and dissipating the heat generated by the heat generating portion 18 and having surface smoothness. For example, it is made of a glass film made of SiO 2 (silicon oxide) or a low thermal conductive material such as polyimide resin. Here, the glaze layer 14 does not need to cover the entire surface of the support substrate 13 and may be formed so as to be disposed at least under the heat generating portion 18.

上記発熱抵抗体層１５は、例えばＴａＳｉＯ、ＮｂＳｉＯ、ＴａＳｉＮＯ、ＴｉＳｉＣＯ系の電気抵抗体材料から成る。そして、発熱部１８の通電用電極となる共通電極１６および個別電極１７は低抵抗になるほど好ましく、例えば、Ａｌ、Ｃｕ（銅）あるいはＡｌＣｕ合金等の金属を主材料に構成される。   The heating resistor layer 15 is made of, for example, a TaSiO, NbSiO, TaSiNO, or TiSiCO based electric resistor material. The common electrode 16 and the individual electrode 17 serving as energization electrodes of the heat generating portion 18 are preferably as low as possible, and are composed mainly of metal such as Al, Cu (copper), or AlCu alloy, for example.

そして、保護膜１９は、ＳｉＯ２膜、ＳｉＮ（窒化珪素）膜、ＳｉＯＮ（酸窒化珪素）膜あるいはＳｉＣ（炭化珪素）膜等の硬質で緻密な熱伝導性のある絶縁体材料から成る。ここで、保護膜１９の最表面に少なくともＳｉと炭素（Ｃ）が含まれていると熱伝導性が高くなり好適である。この保護膜１９は、発熱素子アレイの通電用電極および発熱部１８を被覆し記録媒体の圧接あるいは摺接による磨耗、並びに大気中に含まれている水分等の接触による腐食から保護する機能を有する。 The protective film 19 is made of a hard and dense thermal conductive insulator material such as a SiO 2 film, a SiN (silicon nitride) film, a SiON (silicon oxynitride) film, or a SiC (silicon carbide) film. Here, when at least Si and carbon (C) are included in the outermost surface of the protective film 19, the thermal conductivity is increased, which is preferable. The protective film 19 has a function of covering the energization electrodes and the heat generating portion 18 of the heat generating element array and protecting them from wear due to pressure contact or sliding contact of the recording medium and corrosion due to contact with moisture contained in the atmosphere. .

次に、上記サーマルプリントヘッド１０の製造方法について述べる。先ず、Ａｌ2Ｏ3セラミックスからなり副走査方向の幅が数ｍｍ程度、板厚が０．５ｍｍ〜１ｍｍの細長の支持基板１３を用意する。そして、この支持基板１３の主面上に膜厚が２５〜２００μｍ、例えば１００μｍのグレーズ層１４を形成する。このグレーズ層１１ｂの形成では、ＳｉＯ２のガラス粉末に適当な有機溶媒、溶剤を添加・混合して得たガラスペーストを周知のスクリーン印刷法で塗布形成する。そして、所定の温度で焼成することで所要の膜厚のガラス膜を支持基板１３表面に形成させる。 Next, a method for manufacturing the thermal print head 10 will be described. First, an elongated support substrate 13 made of Al 2 O 3 ceramics and having a width in the sub-scanning direction of about several mm and a plate thickness of 0.5 mm to 1 mm is prepared. Then, a glaze layer 14 having a film thickness of 25 to 200 μm, for example, 100 μm, is formed on the main surface of the support substrate 13. In forming the glaze layer 11b, a glass paste obtained by adding and mixing an appropriate organic solvent and solvent to the SiO 2 glass powder is applied and formed by a well-known screen printing method. Then, a glass film having a required film thickness is formed on the surface of the support substrate 13 by baking at a predetermined temperature.

次に、グレーズ層１４表面上に、例えばスパッタ法により膜厚が０．０５μｍ程度のＴａＳｉＯ２膜を成膜し、引き続いて、スパッタ法により上記発熱抵抗体層１５を被覆して例えば膜厚が０．５μｍ程度のＡｌ膜、ＡｌＣｕ合金膜等の金属層３０を電極膜として成膜する。そして、フォトエングレービングプロセスにより、発熱素子アレイの金属層３０と発熱抵抗体層１５をパターニング形成し、更に、フォトエングレービングプロセスにより、通電用電極である共通電極１６および個別電極１７に間隙Ｇを設けるエッチングを行って発熱部１８を形成する。 Next, a TaSiO 2 film having a thickness of about 0.05 μm is formed on the surface of the glaze layer 14 by sputtering, for example, and then the heating resistor layer 15 is coated by sputtering to have a film thickness of, for example, A metal layer 30 such as an Al film of about 0.5 μm or an AlCu alloy film is formed as an electrode film. Then, the metal layer 30 and the heating resistor layer 15 of the heating element array are formed by patterning by a photoengraving process, and further, a gap is formed between the common electrode 16 and the individual electrode 17 that are energization electrodes by a photoengraving process. Etching for providing G is performed to form the heat generating portion 18.

その後、スパッタ法により全面を被覆する保護膜１９を成膜する。ここで、保護膜１９は、例えば膜厚が５μｍ〜１０μｍ程度に堆積される。   Thereafter, a protective film 19 that covers the entire surface is formed by sputtering. Here, the protective film 19 is deposited to a thickness of, for example, about 5 μm to 10 μm.

次に、保護膜１９上にドライフィルムレジストを貼付し、フォトリソグラフィにより個別電極１７の端部を開口する位置のレジスト部分を除去して開口し、これをマスクとした保護膜１９のドライエッチングにより開口部２０を形成する。そして、開口部２０を形成後、マスクとして用いたドライフィルムレジストを除去する。   Next, a dry film resist is pasted on the protective film 19, the resist portion at the position where the end of the individual electrode 17 is opened is removed by photolithography, and the protective film 19 is used as a mask by dry etching. Opening 20 is formed. And after forming the opening part 20, the dry film resist used as a mask is removed.

そして、開口部２０のところにせり上がり電気接続部２１を形成する。このせり上がり電気接続部２１は、例えばＡｕあるいはＡｕ基合金のバンプ用ボールを熱圧着により押圧し扁平変形させることにより形成する。例えば、Ａｕ線によるワイヤボンディングにおいて、ワイヤ先端を溶融して形成したＡｕボールをボンディングヘッドで開口部２０の個別電極１７に熱圧着した後に、上記Ａｕボールをワイヤから切り離すことで、せり上がり電気接続部２１が簡便に形成できる。ここで、上述した円盤状のせり上がり電気接続部２１の直径はＡｕボールの径の大きさおよび熱圧着の押圧力を調節することにより簡便に制御できる。   Then, the electrical connection portion 21 is formed at the opening portion 20. The raised electrical connection portion 21 is formed, for example, by pressing a bump ball made of Au or an Au-based alloy by thermocompression bonding and causing a flat deformation. For example, in wire bonding using Au wire, an Au ball formed by melting the tip of the wire is thermocompression bonded to the individual electrode 17 of the opening 20 with a bonding head, and then the Au ball is separated from the wire so that the electrical connection rises. The part 21 can be easily formed. Here, the diameter of the above-described disk-shaped rising electrical connection portion 21 can be easily controlled by adjusting the size of the Au ball and the pressing force of thermocompression bonding.

次に、上記抵抗体基板部１２Ａおよび駆動回路基板部１２ＢをＡｌ板等から成る放熱基板１１上に接着剤を介して載置し固着させる。そして、発熱素子アレイの個別電極１７のせり上がり電気接続部２１と駆動用ＩＣ２３のボンディンブパッド２４とを例えばＡｌ線あるいはＡｕ線から成るボンディングワイヤＷで電気接続する。また、図示しないが、駆動用ＩＣ２３と駆動回路基板２２の回路パターンとをボンディングワイヤＷで電気接続する。最後に、周知の実装技術により、せり上がり電気接続部２１、駆動用ＩＣ２３およびボンディングワイヤＷを樹脂封止材により気密封止する。このようにして、本実施形態のサーマルプリントヘッド１０が出来上がる。   Next, the resistor substrate portion 12A and the drive circuit substrate portion 12B are placed and fixed on the heat dissipation substrate 11 made of an Al plate or the like via an adhesive. Then, the rising electrical connecting portion 21 of the individual electrode 17 of the heating element array and the bonding pad 24 of the driving IC 23 are electrically connected by a bonding wire W made of, for example, Al wire or Au wire. Although not shown, the driving IC 23 and the circuit pattern of the driving circuit board 22 are electrically connected by a bonding wire W. Finally, the raised electrical connection portion 21, the driving IC 23, and the bonding wire W are hermetically sealed with a resin sealing material by a known mounting technique. Thus, the thermal print head 10 of this embodiment is completed.

通常、サーマルプリントヘッドの製造においては、上記ワイヤボンディングをする工程の前に、各発熱素子の不良チェックのために共通電極１６と各個別電極１７間において通電検査が行われる。ここで、本実施形態のせり上がり電気接続部２１は保護膜１９上に延在していることから、上記通電検査において検査用プローブが上記せり上がり電気接続部２１に極めて簡便に接触できる。このために、通電検査が簡便にできるようになる。また、検査用プローブ接触によるせり上がり電気接続部２１表面の損傷は、従来技術の場合の金属層自体のボンディングパッドに比べて大幅に低減するようになる。   In general, in the manufacture of a thermal print head, an energization inspection is performed between the common electrode 16 and each individual electrode 17 in order to check each heating element for defects before the wire bonding step. Here, since the raised electrical connection portion 21 of the present embodiment extends on the protective film 19, the inspection probe can contact the raised electrical connection portion 21 very simply in the energization test. For this reason, it becomes possible to easily conduct an energization inspection. Further, the damage of the surface of the electrical connection portion 21 due to the contact with the inspection probe is greatly reduced as compared with the bonding pad of the metal layer itself in the case of the prior art.

本実施形態では、サーマルプリントヘッド１０は、その主走査方向に配置された所定数の発熱素子アレイの各発熱素子の通電用電極である個別電極１７がせり上がり電気接続部２１を介して駆動用ＩＣとワイヤボンディングされる構造になる。このような構造であると、個別電極１７の簡便な狭ピッチ化が可能になり発熱素子の主走査方向における高密度化が容易となる。そして、サーマルプリントヘッドの印画の動作における高画質化が実現できる。   In the present embodiment, the thermal print head 10 is used for driving through the electrical connection portion 21 with the individual electrodes 17 as the energization electrodes of the heating elements of a predetermined number of heating element arrays arranged in the main scanning direction rising. The structure is wire bonded to the IC. With such a structure, it is possible to easily reduce the pitch of the individual electrodes 17 and to easily increase the density of the heating elements in the main scanning direction. Further, high image quality can be realized in the printing operation of the thermal print head.

また、せり上がり電気接続部２１であると電気接続部面が保護膜面上にあるために、ワイヤボンディングをする前に行われる共通電極１６と各個別電極１７間の通電検査、あるいはそのワイヤボンディングにおいて、従来必要としていた副走査方向におけるワイヤボンディンの余裕寸法は必要でなくなる。これにより、上記主走査方向の狭ピッチ化と相俟ってサーマルプリントヘッドの小型化、それに伴う低コスト化が容易になる。   In addition, since the electrical connection portion surface is on the protective film surface in the case of the rising electrical connection portion 21, the current inspection between the common electrode 16 and each individual electrode 17 performed before wire bonding, or the wire bonding thereof is performed. However, the marginal dimension of the wire bond in the sub-scanning direction, which was conventionally required, is no longer necessary. This facilitates the downsizing of the thermal print head and the associated cost reduction in combination with the narrowing of the pitch in the main scanning direction.

また、一方、従来技術では、検査用プローブ接触によるボンディングパッドの表面の損傷が生じ易く、その後のワイヤボンディングが難しくなることがある。上記通電検査において、せり上がり電気接続部２１表面の検査用プローブ接触時の損傷が小さくなることから、ボンディングワイヤＷとの接合強度が増大すると共に、その接合の信頼性が向上する。このように、従来技術に比べて高信頼性を有するサーマルプリントヘッドが高歩留まりに製造できるようになる。そして、これ等のことからも高品位性を有するサーマルプリントヘッドが低コスト化に製造できる。   On the other hand, in the prior art, the surface of the bonding pad is likely to be damaged due to contact with the inspection probe, and the subsequent wire bonding may be difficult. In the energization inspection, since the damage on the surface of the electrical connection portion 21 that rises and contacts the inspection probe is reduced, the bonding strength with the bonding wire W is increased and the reliability of the bonding is improved. In this way, a thermal print head having higher reliability than that of the prior art can be manufactured with a high yield. From these points, a thermal print head having high quality can be manufactured at low cost.

次に、本発明の他の実施形態について図３および図４を参照して説明する。ここで、図３は本実施形態にかかるサーマルプリントヘッドの副走査方向に切断した断面図、図４は主走査方向に切断した一部断面図である。以下、第１の実施形態の場合と互いに同一または類似の部分には共通の符号を付して、重複説明は一部省略される。この場合も図面は模式的なものであり、各寸法の比率等は現実のものとは異なる。この実施形態のサーマルプリントヘッドは、上述したせり上がり電気接続部２１ａが開口部２０内部に埋め込まれて形成されることを特徴する。なお、上記駆動回路基板部１２Ｂの駆動用ＩＣ２３は、抵抗体基板部１２Ａと同一の支持基板１４上に形成する構造で示している。   Next, another embodiment of the present invention will be described with reference to FIGS. Here, FIG. 3 is a sectional view of the thermal print head according to the present embodiment cut in the sub-scanning direction, and FIG. 4 is a partial sectional view cut in the main scanning direction. Hereinafter, the same or similar parts as those in the first embodiment are denoted by the same reference numerals, and a part of the overlapping description is omitted. Also in this case, the drawings are schematic, and the ratio of each dimension is different from the actual one. The thermal print head of this embodiment is characterized in that the above-described rising electrical connection portion 21a is embedded in the opening 20 and formed. The driving IC 23 of the driving circuit board portion 12B is shown as a structure formed on the same support substrate 14 as the resistor substrate portion 12A.

図に示されるように、サーマルプリントヘッド１０ａでは、放熱基板１１上に形成した抵抗体基板部１２Ａに駆動用ＩＣ２３が搭載されている。なお、駆動回路基板部１２Ｂの配線板は図示していない。この抵抗体基板部１２Ａでは、放熱基板１１の主面上に支持基板１３が貼着され、支持基板１３上にグレーズ層１４が形成され、グレーズ層１４上に発熱抵抗体層１５が配置されている。   As shown in the figure, in the thermal print head 10a, the driving IC 23 is mounted on the resistor substrate portion 12A formed on the heat dissipation substrate 11. The wiring board of the drive circuit board portion 12B is not shown. In this resistor substrate portion 12A, a support substrate 13 is adhered on the main surface of the heat dissipation substrate 11, a glaze layer 14 is formed on the support substrate 13, and a heating resistor layer 15 is disposed on the glaze layer 14. Yes.

そして、発熱抵抗体層１５上に、金属層３０である共通電極１６および個別電極１７が間隙Ｇを挟んで対向して配列され、これ等の通電用電極は発熱抵抗体層１５に重層して電気接続し、間隙Ｇで露出する発熱抵抗体層１５が発熱部１８となる。共通電極１６、個別電極１７および発熱部１８により１つの発熱素子が形成され、この発熱素子はサーマルプリントヘッド１０の主走査方向に、所定発熱部のドット数の発熱素子アレイとして一列に配設してある。そして、保護膜１９がこの発熱素子アレイを被覆するように形成されている。なお、駆動用ＩＣ２３は図３に示すように保護膜１９上にエポキシなどの絶縁材料による貼着により実装してある。   On the heat generating resistor layer 15, the common electrode 16 and the individual electrode 17 that are the metal layers 30 are arranged to face each other with the gap G interposed therebetween, and these energizing electrodes are layered on the heat generating resistor layer 15. The heat generating resistor layer 15 that is electrically connected and exposed in the gap G becomes the heat generating portion 18. One heating element is formed by the common electrode 16, the individual electrode 17, and the heating part 18, and this heating element is arranged in a line as a heating element array of dots of a predetermined heating part in the main scanning direction of the thermal print head 10. It is. A protective film 19 is formed so as to cover the heating element array. The driving IC 23 is mounted on the protective film 19 by sticking with an insulating material such as epoxy as shown in FIG.

各発熱素子の個別電極１７の配線パターンの端部に開口部２０が設けられ、この開口部２０にせり上がり電気接続部２１ａが形成されている。開口部２０は個別電極１７上に開けられ、その上側に広幅段部２０ａが形成されている。広幅段部２０ａは任意のパターン例えば円形や四辺形でよく、個別電極１７ａに隣接する個別電極１７ｂ直上にまで延在している。電気接続部２１ａを構成する金属体は開口部２０に充填され、個別電極１７ａに接続されさらに広幅段部面全体に広がっている。   An opening 20 is provided at the end of the wiring pattern of the individual electrode 17 of each heating element, and an electrical connection portion 21 a is formed on the opening 20 so as to rise. The opening 20 is opened on the individual electrode 17, and a wide stepped portion 20a is formed on the upper side thereof. The wide stepped portion 20a may be an arbitrary pattern, for example, a circle or a quadrilateral, and extends up to just above the individual electrode 17b adjacent to the individual electrode 17a. The metal body constituting the electrical connection portion 21a is filled in the opening 20, connected to the individual electrode 17a, and further spread over the entire surface of the wide stepped portion.

このように、せり上がり電気接続部２１ａは、開口部２０の内部に埋め込まれるように形成され、広幅段部２０ａの隣接する個別電極１７ｂ上の保護膜部分上まで延在している。このせり上がり電気接続部２１ａは、例えばリソグラフィ、スパッタ、メッキなどの常套手法によって容易に形成される。   In this way, the rising electrical connection portion 21a is formed so as to be embedded in the opening portion 20, and extends to the protective film portion on the adjacent individual electrode 17b of the wide step portion 20a. The raised electrical connection portion 21a is easily formed by a conventional method such as lithography, sputtering, or plating.

そして、発熱素子アレイの個別電極１７のせり上がり電気接続部２１ａと駆動用ＩＣ２３のボンディングパッド２４とがボンディングワイヤＷで電気接続される。そして、図示しないが、周知の実装技術によってせり上がり電気接続部２１ａ、駆動用ＩＣ２３およびボンディングワイヤＷは樹脂封止材で気密封止される構造になる。   Then, the rising electrical connection portion 21a of the individual electrode 17 of the heating element array and the bonding pad 24 of the driving IC 23 are electrically connected by the bonding wire W. Although not shown, the electrical connection portion 21a, the driving IC 23, and the bonding wire W are hermetically sealed with a resin sealing material by a known mounting technique.

この実施形態のサーマルプリントヘッド１０ａでは、第１の実施形態で説明したのとほぼ同様な効果が奏される。そして、ヘッドの主、副走査方向における更なる小型化が可能になる。いずれにしてもサーマルプリントヘッドの小型化および低コスト化が容易になる。   In the thermal print head 10a according to this embodiment, substantially the same effect as described in the first embodiment can be obtained. Further, further downsizing of the head in the main and sub-scanning directions is possible. In any case, it is easy to reduce the size and cost of the thermal print head.

図５は本発明の他の実施形態で、個別電極１７ｃ，１７ｄとせり上がり電気接続部２１ｂを示しており、電気接続部は１／３ピッチずれの３段千鳥足状パターンに配置されている。１つの個別電極１７ｃの電気接続部２１ｂは、隣接する個別電極１７ｄの保護膜上にまたがるため、個別電極の線幅を狭めても、ワイヤボンディングに対応することができる径大または広幅の電気接続部パターンに設計することが可能で、高密度ヘッド構造に適している。さらなる高密度化のために、千鳥足状パターンの段数は４段など任意の段数に増やすことができるが、本発明によれば、必要最小限の段数に止めて抵抗体基板の板幅を抑えることが可能である。   FIG. 5 shows another embodiment of the present invention, in which individual electrodes 17c and 17d and a raised electrical connection portion 21b are shown. The electrical connection portions are arranged in a three-stage staggered pattern with a 1/3 pitch shift. Since the electrical connection portion 21b of one individual electrode 17c extends over the protective film of the adjacent individual electrode 17d, the large-diameter or wide-width electrical connection that can support wire bonding even if the line width of the individual electrode is reduced. It is possible to design a part pattern, which is suitable for a high-density head structure. In order to further increase the density, the number of staggered pattern patterns can be increased to an arbitrary number such as four, but according to the present invention, the plate width of the resistor substrate can be suppressed by keeping the minimum number of stages. Is possible.

以上、本発明の好適な実施形態について説明したが、上述した実施形態は本発明を限定するものでない。当業者にあっては、具体的な実施態様において本発明の技術思想および技術範囲から逸脱せずに種々の変形・変更を加えることが可能である。   Although the preferred embodiments of the present invention have been described above, the above-described embodiments do not limit the present invention. Those skilled in the art can make various modifications and changes in specific embodiments without departing from the technical idea and technical scope of the present invention.

例えば、上記駆動回路基板部１２Ｂは、サーマルプリントヘッド１０，１０ａとは別のところに配置されても構わない。例えば、記録機器の制御装置に取り付けられて例えば駆動用ＩＣ２３の出力がフレキシブル配線板の回路配線を通って抵抗体基板部１２Ａに伝送されるようになっていてもよい。   For example, the drive circuit board portion 12B may be arranged at a location different from the thermal print heads 10 and 10a. For example, it may be attached to a control device of a recording device, and for example, the output of the driving IC 23 may be transmitted to the resistor substrate portion 12A through the circuit wiring of the flexible wiring board.

また、放熱基板への支持基板１３および駆動回路基板２２の貼着は、それぞれ異なる接着剤を用いて行うようにしてもよい。これは、支持基板１３および駆動回路基板２２が異なる熱膨張係数を有する場合に、クラックによる破損等を防止する上で好ましくなる。   Further, the support substrate 13 and the drive circuit substrate 22 may be attached to the heat dissipation substrate using different adhesives. This is preferable for preventing breakage due to cracks when the support substrate 13 and the drive circuit substrate 22 have different thermal expansion coefficients.

本発明の実施形態にかかるサーマルプリントヘッドの一部を抜き出した一部平面図。FIG. 3 is a partial plan view of a part of the thermal print head according to the embodiment of the present invention. 図１のＸ−Ｘ矢視の断面図。Sectional drawing of the XX arrow of FIG. 本発明の別の実施形態にかかるサーマルプリントヘッドの断面図。Sectional drawing of the thermal print head concerning another embodiment of this invention. 図３のＹ−Ｙ矢視一部断面図。FIG. 4 is a partial cross-sectional view taken along line YY in FIG. 3. 本発明の別の実施形態にかかるサーマルプリントヘッドの電気接続部配置パターンの平面図。The top view of the electrical connection part arrangement | positioning pattern of the thermal print head concerning another embodiment of this invention. 従来の技術におけるサーマルプリントヘッドの一部を抜き出した一部平面図。The partial top view which extracted a part of thermal print head in a prior art. 図６のＺ−Ｚ矢視の断面図。Sectional drawing of the ZZ arrow of FIG.

符号の説明Explanation of symbols

１０，１０ａ…サーマルプリントヘッド，１１…放熱基板，１２Ａ…抵抗体基板部，１２Ｂ…駆動回路基板部，１３…支持基板，１４…グレーズ層，１５…発熱抵抗体層，１６…共通電極，１７（１７ａ〜１７ｄ）…個別電極，１８…発熱部，１９，１９ａ…保護膜，２０…開口部，２１，２１ａ…せり上がり電気接続部，２２…駆動回路基板，２３…駆動用ＩＣ，２４…ボンディングパッド，３０…金属層，Ｇ…間隙，Ｗ… ボンディングワイヤ   DESCRIPTION OF SYMBOLS 10, 10a ... Thermal print head, 11 ... Radiation board, 12A ... Resistor board part, 12B ... Drive circuit board part, 13 ... Support board, 14 ... Glaze layer, 15 ... Heating resistor layer, 16 ... Common electrode, 17 (17a to 17d) ... individual electrode, 18 ... heat generating portion, 19, 19a ... protective film, 20 ... opening, 21,21a ... lifting electrical connecting portion, 22 ... driving circuit board, 23 ... driving IC, 24 ... Bonding pad, 30 ... metal layer, G ... gap, W ... bonding wire

Claims (4)

絶縁基板と、
前記絶縁基板の上に配置された発熱抵抗体層と、
前記発熱抵抗体層に設けられた複数の発熱部にそれぞれに通電する電極を形成する金属層が並行に複数配列されて成る発熱素子群と、
前記発熱部と前記金属層を少なくとも被覆し前記絶縁基板上に積層する保護膜と、
前記金属層を被覆する前記保護膜に開口部が形成され、前記開口部に設けられた電気接続部とを具備するサーマルプリントヘッドにおいて、
前記開口部は前記複数の金属層が並行配列される方向に千鳥足状に設けられ、前記電気接続部のうち少なくとも前記金属層が隣接する位置に配置された電気接続部は前記開口部において前記開口部からせり上がり隣接する前記金属層の直上の前記保護膜上に延在するパターンに形成された金属体を有することを特徴とするサーマルプリントヘッド。 An insulating substrate;
A heating resistor layer disposed on the insulating substrate;
A heating element group in which a plurality of metal layers forming electrodes that respectively energize a plurality of heating portions provided in the heating resistor layer are arranged in parallel;
A protective film that covers at least the heat generating portion and the metal layer and is laminated on the insulating substrate;
An opening is formed in the protective film covering the metal layer, and a thermal print head comprising an electrical connection provided in the opening,
The openings are provided in a staggered manner in a direction in which the plurality of metal layers are arranged in parallel, and at least the electrical connection portions arranged at positions where the metal layers are adjacent to each other among the electrical connection portions are the openings in the openings. A thermal print head comprising a metal body formed in a pattern extending above the protective film directly above the adjacent metal layer rising from the portion. 前記発熱素子群の駆動を制御する駆動用ＩＣが備えられ、前記電気接続部は前記駆動用ＩＣとボンディングワイヤで接続されていることを特徴とする請求項１に記載のサーマルプリントヘッド。   2. The thermal print head according to claim 1, further comprising a driving IC that controls driving of the heat generating element group, wherein the electrical connection portion is connected to the driving IC by a bonding wire. 前記電気接続部の金属体は前記開口部に充填されていることを特徴とする請求項１に記載のサーマルプリントヘッド。 The thermal print head according to claim 1, wherein a metal body of the electrical connection portion is filled in the opening. 前記発熱部から延長された金属層の幅は前記開口部においても同じ幅であることを特徴とする請求項１又は２に記載のサーマルプリントヘッド。   3. The thermal print head according to claim 1, wherein the width of the metal layer extended from the heat generating portion is the same in the opening.
JP2008097974A 2008-04-04 2008-04-04 Thermal print head Expired - Fee Related JP5080335B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008097974A JP5080335B2 (en) 2008-04-04 2008-04-04 Thermal print head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008097974A JP5080335B2 (en) 2008-04-04 2008-04-04 Thermal print head

Publications (2)

Publication Number Publication Date
JP2009248415A true JP2009248415A (en) 2009-10-29
JP5080335B2 JP5080335B2 (en) 2012-11-21

Family

ID=41309553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008097974A Expired - Fee Related JP5080335B2 (en) 2008-04-04 2008-04-04 Thermal print head

Country Status (1)

Country Link
JP (1) JP5080335B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069374A (en) * 2012-09-28 2014-04-21 Toshiba Hokuto Electronics Corp Thermal print head, and method for manufacturing the same
JP2016190463A (en) * 2015-03-31 2016-11-10 東芝ホクト電子株式会社 Thermal print head and thermal printer
WO2023210426A1 (en) * 2022-04-28 2023-11-02 ローム株式会社 Thermal print head and thermal printer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206562A (en) * 1989-02-06 1990-08-16 Ricoh Co Ltd Thermal head
JPH0529377A (en) * 1991-07-25 1993-02-05 Nec Corp Semiconductor device
JPH05226404A (en) * 1991-09-06 1993-09-03 Rohm Co Ltd Semiconductor device
JPH09246314A (en) * 1996-03-12 1997-09-19 Mitsubishi Electric Corp Semiconductor device
JP2006272851A (en) * 2005-03-30 2006-10-12 Toshiba Hokuto Electronics Corp Thermal head

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206562A (en) * 1989-02-06 1990-08-16 Ricoh Co Ltd Thermal head
JPH0529377A (en) * 1991-07-25 1993-02-05 Nec Corp Semiconductor device
JPH05226404A (en) * 1991-09-06 1993-09-03 Rohm Co Ltd Semiconductor device
JPH09246314A (en) * 1996-03-12 1997-09-19 Mitsubishi Electric Corp Semiconductor device
JP2006272851A (en) * 2005-03-30 2006-10-12 Toshiba Hokuto Electronics Corp Thermal head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069374A (en) * 2012-09-28 2014-04-21 Toshiba Hokuto Electronics Corp Thermal print head, and method for manufacturing the same
JP2016190463A (en) * 2015-03-31 2016-11-10 東芝ホクト電子株式会社 Thermal print head and thermal printer
WO2023210426A1 (en) * 2022-04-28 2023-11-02 ローム株式会社 Thermal print head and thermal printer

Also Published As

Publication number Publication date
JP5080335B2 (en) 2012-11-21

Similar Documents

Publication Publication Date Title
JP6371529B2 (en) Thermal print head, thermal printer
JP6367962B2 (en) Thermal head and thermal printer
JP6431200B2 (en) Thermal head and thermal printer
JP5080335B2 (en) Thermal print head
JP6096997B2 (en) Thermal head and thermal printer
JP6346108B2 (en) Thermal head and thermal printer
JP5322509B2 (en) Thermal print head
JP5063018B2 (en) Recording head and printer using the same
JP6584641B2 (en) Thermal head and thermal printer
JP6767296B2 (en) Thermal head and thermal printer
JP6525819B2 (en) Thermal head and thermal printer
JP2008001062A (en) Thermal print head
JP7141520B2 (en) Thermal head and thermal printer
JP5329887B2 (en) Thermal head
JP2009066854A (en) Thermal print head and method for manufacturing the same
JP7122460B2 (en) Thermal head and thermal printer
JP7444972B2 (en) Thermal head and thermal printer
JP5260038B2 (en) Thermal print head and manufacturing method thereof
JP2018034371A (en) Thermal head and thermal printer
JP6130618B1 (en) Thermal head and thermal printer
JP2009131994A (en) Thermal printing head and its manufacturing method
JP5649439B2 (en) Thermal head
JP2014069374A (en) Thermal print head, and method for manufacturing the same
JP6426541B2 (en) Thermal head and thermal printer
JP6525822B2 (en) Thermal head and thermal printer

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110318

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20110506

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120704

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120814

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120830

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150907

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5080335

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees