JP2009246052A - Laminated electronic component and its manufacturing method - Google Patents

Laminated electronic component and its manufacturing method Download PDF

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JP2009246052A
JP2009246052A JP2008088866A JP2008088866A JP2009246052A JP 2009246052 A JP2009246052 A JP 2009246052A JP 2008088866 A JP2008088866 A JP 2008088866A JP 2008088866 A JP2008088866 A JP 2008088866A JP 2009246052 A JP2009246052 A JP 2009246052A
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external electrode
laminated
electronic component
ceramic
multilayer
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Shunichi Ono
俊一 大野
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component with the high peeling strength of external electrodes. <P>SOLUTION: In a laminated capacitor 10, the external electrodes 20, 22, 24 and 26 are formed on surfaces 12A and 12B of a laminated body 12 where ceramic 14 and a plurality of internal electrodes 16 and 18 are alternately laminated. The external electrodes 20 and 24 are connected to the internal electrodes 18 by a side electrode 30. The external electrodes 22 and 26 are connected to the inner electrodes 16 by a side electrode 32. The external electrode 26 has a projection 26A engaged into ceramic 14 and has a projection 26B swelled up from the laminated body surface 12B as shown in Fig.1(B). Since the projection 26A is engaged into ceramic 14, the peeling strength of the external electrode 26 becomes high, and sufficient electric connectability with the side electrode 32 is secured by the projection 26B. The other external electrodes 20, 22 and 24 have similar configurations. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、積層電子部品及びその製造方法に関し、更に具体的には、外部電極の剥離強度の改善に関するものである。   The present invention relates to a multilayer electronic component and a method for manufacturing the same, and more specifically, relates to an improvement in peel strength of an external electrode.

積層チップコンデンサなどの積層電子部品は、内部用導体（内部電極や内部配線など）を備えた積層体の表面に外部電極を形成した構成となっている。積層コンデンサの場合は、内部電極パターンが形成されたセラミックスのシートを複数積層し、圧着した後に外部電極を作成し焼成する，もしくは、圧着した後に焼成し、その後、外部電極を作成することによって形成されている。このような技術としては、例えば、下記特許文献１の積層セラミック電子部品の製造方法がある。該特許文献１に記載の技術には、電極層が形成されたシートを複数積層した積層グリーン体を、剛体キャリア板と剛性板で挟んで静水圧プレスすることにより、圧力歪みを減少させることが開示されている。
特開平５−２８３２７７号公報 A multilayer electronic component such as a multilayer chip capacitor has a configuration in which an external electrode is formed on the surface of a multilayer body having an internal conductor (such as an internal electrode or internal wiring). In the case of multilayer capacitors, a plurality of ceramic sheets on which internal electrode patterns are formed are stacked and bonded to form external electrodes and then fired, or fired after being pressed and then formed to form external electrodes. Has been. As such a technique, for example, there is a method of manufacturing a multilayer ceramic electronic component disclosed in Patent Document 1 below. In the technique described in Patent Document 1, pressure distortion can be reduced by hydrostatic pressure pressing a laminated green body in which a plurality of sheets on which electrode layers are formed are sandwiched between a rigid carrier plate and a rigid plate. It is disclosed.
JP-A-5-283277

ところで、上述した特許文献１に記載の技術では、圧着した積層グリーン体を切断した後に焼成し、得られたコンデンサ素体の端部に外部電極を形成している。前記端部は、積層中央部よりも厚みが若干小さくなっており、ここに前記外部電極を形成することで、基板実装時の安定性を得ることが可能となっている。しかしながら、前記外部電極は、第６図に示すように、コンデンサ素体とほぼ平面で接触しているため、剥離強度が十分に高いとはいえないという不都合がある。   By the way, in the technique described in Patent Document 1 described above, the laminated green body that has been pressure-bonded is cut and then fired, and external electrodes are formed at the ends of the obtained capacitor element body. The end portion has a thickness slightly smaller than the central portion of the stack, and by forming the external electrode here, it is possible to obtain stability during mounting on the substrate. However, as shown in FIG. 6, the external electrode is in contact with the capacitor element body in a substantially flat surface, so that the peel strength is not sufficiently high.

本発明は、以上の点に着目したもので、その目的は、外部電極の剥離強度が高い積層電子部品及びその製造方法を提供することである。   The present invention pays attention to the above points, and an object thereof is to provide a multilayer electronic component having a high peel strength of an external electrode and a manufacturing method thereof.

前記目的を達成するため、本発明の積層電子部品は、複数のセラミックス層と内部用導体とを有する積層体の表面に、外部電極を設けた積層電子部品であって、前記外部電極が、前記積層体のセラミックス部分に食い込む凸部を有することを特徴とする。主要な形態の一つは、前記外部電極が、前記積層体表面に盛り上がった突出部を有することを特徴とする。   In order to achieve the above object, the multilayer electronic component of the present invention is a multilayer electronic component in which an external electrode is provided on the surface of a multilayer body having a plurality of ceramic layers and internal conductors, and the external electrode is It has the convex part which bites into the ceramic part of a laminated body. One of the main forms is characterized in that the external electrode has a protruding portion raised on the surface of the laminate.

本発明の積層電子部品の製造方法は、内部用導体パターンが形成されたセラミックスシートを積層するとともに、積層体表面に外部電極用の導体パターンを凸状に形成する工程，前記積層体を一対の硬板で挟み込み、前記外部電極用の導体パターンの少なくとも一部が、前記積層体のセラミックス部分に食い込む凸部を形成するように圧着する工程，該圧着工程後の積層体を焼成する工程，を含むことを特徴とする。   The method for manufacturing a laminated electronic component according to the present invention includes a step of laminating a ceramic sheet on which an internal conductor pattern is formed and forming a conductor pattern for an external electrode in a convex shape on the surface of the laminate. A step of crimping so that at least a part of the conductor pattern for the external electrode bites into a ceramic portion of the laminate, and a step of firing the laminate after the crimping step, sandwiched between hard plates It is characterized by including.

主要な形態の一つは、前記内部用導体パターン及び外部電極用の導体パターンが、前記セラミックスシートの主面上及び積層体の表面上に多数分割形成されているときに、前記圧着工程後の積層体を焼成する前に、個々のチップが前記外部電極用の導体パターンの凸部を含むような位置で、前記積層体を複数のチップに分割する工程，を含むことを特徴とする。他の形態は、前記圧着工程において、前記積層体と硬板との間に、圧力緩和用フィルムを設けて圧着を行うことを特徴とする。   One of the main forms is that when the internal conductor pattern and the external electrode conductor pattern are formed in multiple divisions on the main surface of the ceramic sheet and the surface of the laminate, A step of dividing the multilayer body into a plurality of chips at a position where each chip includes a convex portion of the conductor pattern for the external electrode before firing the multilayer body. Another embodiment is characterized in that, in the pressure bonding step, pressure bonding is performed by providing a pressure relaxation film between the laminate and the hard plate.

他の発明の積層電子部品は、前記いずれかに記載の製造方法によって形成したことを特徴とする。本発明の前記及び他の目的，特徴，利点は、以下の詳細な説明及び添付図面から明瞭になろう。   According to another aspect of the present invention, there is provided a multilayer electronic component formed by any one of the manufacturing methods described above. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

本発明は、複数のセラミックス層と内部用導体とを有する積層体の表面に、該積層体のセラミックス部分に凸部が食い込むように外部電極を設けて積層電子部品を形成することとしたので、外部電極の剥離強度の向上を図ることができる。また、前記外部電極が、前記積層体表面から盛り上がった突出部を有するように形成することで、側面電極との良好な接続性が得られるという効果がある。   Since the present invention is to form a multilayer electronic component by providing an external electrode on the surface of a multilayer body having a plurality of ceramic layers and internal conductors so that convex portions bite into the ceramic portion of the multilayer body. The peel strength of the external electrode can be improved. Moreover, there exists an effect that favorable connectivity with a side electrode is acquired by forming the said external electrode so that it may have the protrusion part which rose from the said laminated body surface.

以下、本発明を実施するための最良の形態を、実施例に基づいて詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

最初に、図１〜図６を参照しながら本発明の実施例１を説明する。本実施例は、本発明の積層電子部品として、積層コンデンサを例に挙げて説明したものである。図１(A)は、本実施例の積層コンデンサの断面図，図１(B)は外部電極の断面拡大図である。図２は、本実施例の積層構造を示す図であり、(A)は分解斜視図，(B)は前記(A)を＃Ａ−＃Ａ線に沿って切断し矢印方向に見た断面図である。図３は、本発明の外部電極の基本的な圧着及び分割工程を示す断面図，図４は、比較例の外部電極の圧着及び分割工程を示す断面図，図５は、本実施例の外部電極の圧着工程を示す断面図である。図６は、本発明及び比較例における外部電極と側面電極の接続例を示す断面図である。   First, Embodiment 1 of the present invention will be described with reference to FIGS. In this embodiment, a multilayer capacitor is described as an example of the multilayer electronic component of the present invention. FIG. 1A is a cross-sectional view of the multilayer capacitor of this example, and FIG. 1B is an enlarged cross-sectional view of the external electrode. 2A and 2B are diagrams showing a laminated structure of the present embodiment, in which FIG. 2A is an exploded perspective view, and FIG. 2B is a cross-section taken along line # A- # A and viewed in the direction of the arrow. FIG. 3 is a cross-sectional view showing the basic crimping and dividing process of the external electrode of the present invention, FIG. 4 is a cross-sectional view showing the crimping and dividing process of the external electrode of the comparative example, and FIG. 5 is an external view of the present example. It is sectional drawing which shows the crimping | compression-bonding process of an electrode. FIG. 6 is a cross-sectional view showing an example of connection between an external electrode and a side electrode in the present invention and a comparative example.

図１に示すように、本実施例の積層コンデンサ１０は、セラミックス１４と内部電極１６及び１８が交互に複数積層した積層体１２の表面１２Ａ，１２Ｂに、外部電極２０，２２，２４，２６を形成したものである。前記外部電極２０及び２４は、側面電極３０によって前記内部電極１８と接続され、前記外部電極２２及び２６は、側面電極３２によって前記内部電極１６と接続されている。前記外部電極２６は、図１(B)に示すように、セラミックス１４に食い込んだ凸部２６Ａを有するとともに、積層体表面１２Ｂから若干盛り上がった突出部２６Ｂを有している。セラミックス部分に食い込む凸部２６Ａを有するということは、前記セラミックス１４の外部電極塗布部のセラミックス素体が谷状に凹み、そこに外部電極導体が充填された形状であると表現することもできる。前記凸部２６Ａがセラミックス１４に食い込んでいるため、外部電極２６の剥離強度が高くなる。また、前記突出部２６Ｂは、前記側面電極３２と良好な接続性を維持するために設けられているものであり、側面電極３２を用いずに、内部電極１８とビアホール接続などを行う場合には、外部電極２６の表面が積層体表面１２Ｂと面一となるように形成してもよい。他の外部電極２０，２２，２４についても、前記外部電極２６と同様の構成となっている。   As shown in FIG. 1, in the multilayer capacitor 10 of this embodiment, external electrodes 20, 22, 24, and 26 are provided on the surfaces 12A and 12B of a laminate 12 in which a plurality of ceramics 14 and internal electrodes 16 and 18 are alternately laminated. Formed. The external electrodes 20 and 24 are connected to the internal electrode 18 by side electrodes 30, and the external electrodes 22 and 26 are connected to the internal electrode 16 by side electrodes 32. As shown in FIG. 1B, the external electrode 26 has a convex portion 26A that bites into the ceramic 14 and a protruding portion 26B that slightly rises from the laminate surface 12B. Having the convex portion 26A that bites into the ceramic portion can also be expressed as a shape in which the ceramic body of the external electrode application portion of the ceramic 14 is recessed in a valley shape and filled with the external electrode conductor. Since the convex portion 26A bites into the ceramic 14, the peel strength of the external electrode 26 is increased. Further, the protruding portion 26B is provided to maintain good connectivity with the side electrode 32, and when the internal electrode 18 is connected to the via hole without using the side electrode 32, etc. The surface of the external electrode 26 may be formed so as to be flush with the laminate surface 12B. The other external electrodes 20, 22, 24 have the same configuration as the external electrode 26.

次に、本実施例の製造方法の一例を説明する。通常、工業的に生産を行う場合には、1個１個のチップを作成せずに、チップが複数個まとめられた成型体を作成してから、後に個片化すると効率がよいため、以下の説明においても、複数個のチップをまとめて作成する方法を例示する。   Next, an example of the manufacturing method of a present Example is demonstrated. Usually, when producing industrially, it is more efficient to create a molded body in which a plurality of chips are gathered together without creating each chip individually, and then separate into individual pieces. In the explanation, the method of creating a plurality of chips together is exemplified.

(1)グリーンシートの作成・・・まず、材料１００重量部に対して、１０〜２０重量部のバインダと、同じく１０〜４０重量部の溶剤を、ボールミル等で混合したスラリーを、市販の塗工装置によってシート状に塗工し、６０〜８０℃で乾燥させてロール状のグリーンシートを得る。前記材料としては、例えば、チタン酸バリウムが用いられる。また、前記バインダは、ブチラール系やアクリル樹脂系であってもよいし、それ以外の公知のものを用いてもよい。溶剤についても、トルエン，エタノール，イソプロピルアルコール等の公知の溶剤から適宜選択してよい。なお、前記グリーンシートはロール状のままであっても、また、ロールを枚葉状に切り離して個別シート化しても本質は同じであり、同様のプロセスを行うことができる。そこで、本実施例では、理解を容易にするために枚葉法にて以下の説明を行うこととする。   (1) Preparation of green sheet: First, a slurry obtained by mixing 10 to 20 parts by weight of a binder and 10 to 40 parts by weight of a solvent with a ball mill or the like with respect to 100 parts by weight of a material is commercially available. It coats in a sheet form with a construction apparatus and is dried at 60 to 80 ° C. to obtain a roll-shaped green sheet. As the material, for example, barium titanate is used. Further, the binder may be a butyral type or an acrylic resin type, or other known ones may be used. The solvent may be appropriately selected from known solvents such as toluene, ethanol, isopropyl alcohol and the like. In addition, even if the green sheet remains in a roll shape, or the roll is cut into individual sheets and separated into individual sheets, the essence is the same, and the same process can be performed. Therefore, in this embodiment, in order to facilitate understanding, the following description will be given by the single wafer method.

(2)内部電極パターンの作成・・・内部電極用導体については、例えば、Ｎｉ，Ｃｕ，Ａｇ−Ｐｄ，Ａｇなど所望の電極・導体材料を用い、スクリーン印刷，転写，インクジェットなどの適宜方法によって、パターン毎に作成し、必要に応じて乾燥などを行う。本実施例では、図２(A)に示すように、内部電極１６用の導体パターン１６Ｐをグリーンシート上に形成した内部電極シート１４Ａと、内部電極１８用の導体パターン１８Ｐをグリーンシート上に形成した内部電極シート１４Ｂの２種類のシートを形成する。   (2) Creation of internal electrode pattern: For the internal electrode conductor, for example, a desired electrode / conductor material such as Ni, Cu, Ag-Pd, or Ag is used, and by an appropriate method such as screen printing, transfer, or inkjet. Create for each pattern, and dry as needed. In this embodiment, as shown in FIG. 2A, the internal electrode sheet 14A in which the conductor pattern 16P for the internal electrode 16 is formed on the green sheet and the conductor pattern 18P for the internal electrode 18 are formed on the green sheet. Two types of sheets of the internal electrode sheet 14B thus formed are formed.

(3)外部電極パターンの形成・・・積層コンデンサ１０の一方の表面（図１の上側）の外部電極２０，２２については、例えば、Ｎｉ，Ｃｕ，Ａｇ−Ｐｄなどの所望の電極材料によって、グリーンシート上に導体パターンを形成する。本実施例では、図２(A)に示すように、外部電極２０，２２用の導体パターン２０Ｐ，２２Ｐをグリーンシート上に形成した外部電極シート１４Ｄが形成される。一方、積層コンデンサ１０の他方の表面（図１の下側）の外部電極２４，２６については、前記外部電極シート１４Ｄと同じ側に電極層を形成すると、積層の関係上、外部電極として機能しない。   (3) Formation of external electrode pattern: For the external electrodes 20 and 22 on one surface of the multilayer capacitor 10 (upper side in FIG. 1), for example, by a desired electrode material such as Ni, Cu, Ag-Pd, A conductor pattern is formed on the green sheet. In this embodiment, as shown in FIG. 2A, an external electrode sheet 14D in which conductor patterns 20P, 22P for the external electrodes 20, 22 are formed on a green sheet is formed. On the other hand, regarding the external electrodes 24 and 26 on the other surface of the multilayer capacitor 10 (lower side in FIG. 1), if an electrode layer is formed on the same side as the external electrode sheet 14D, it does not function as an external electrode due to the multilayer. .

このため、
(a)グリーンシートの裏側に導体パターン２４Ｐ，２６Ｐを形成した外部電極シート１４Ｅを使用する，
(b)積層工程後の積層バー４０の裏面に外部電極の導体パターン２４Ｐ，２６Ｐを形成する，
のいずれかの手法を用いて外部電極パターン２４Ａ，２６Ｐを形成する。なお、上側，下側を問わず、外部電極の形成にあたっても、工法によっては必要に応じて乾燥を行う。以上のような内部電極シート１４Ａ及び１４Ｂ、外部電極シート１４Ｄ，１４Ｅのほか、導体パターンが形成されていないカバーシート１４Ｃが所定枚数用意される。 For this reason,
(a) Use an external electrode sheet 14E having conductor patterns 24P and 26P formed on the back side of the green sheet.
(b) forming conductor patterns 24P and 26P of external electrodes on the back surface of the laminated bar 40 after the lamination step;
The external electrode patterns 24A and 26P are formed using any one of the methods. It should be noted that, regardless of the upper side or the lower side, drying is performed as necessary depending on the construction method in forming the external electrode. In addition to the internal electrode sheets 14A and 14B and the external electrode sheets 14D and 14E as described above, a predetermined number of cover sheets 14C on which no conductor pattern is formed are prepared.

(4)積層・・・次に、図２(A)に示す層構成となるように、一括、もしくは、逐次一層ずつシートを積んでいく。この場合、積層前にグリーンシートのキャリアフィルムであるＰＥＴを剥離しておいて一括もしくは逐次で積層を行ってもよいし、逐次一層積層後にＰＥＴを剥離していくようにしてもよい。使用したバインダによって、適宜グリーンシートに７０℃程度の温度をかけながら、数ＭＰａ〜数十ＭＰａの圧力をかけて積層を行っていく。   (4) Lamination ... Next, the sheets are stacked one at a time or one by one so that the layer structure shown in FIG. In this case, PET, which is a carrier film of the green sheet, may be peeled off before lamination, and may be laminated all at once or sequentially, or PET may be peeled off after successive layering. Lamination is performed by applying a pressure of several MPa to several tens of MPa while appropriately applying a temperature of about 70 ° C. to the green sheet depending on the binder used.

なお、上述したように、最終層については、外部電極の方向の観点から、電極パターン２４Ｐ，２６Ｐをシート裏面に形成した外部電極シート１４Ｅか、あるいは、カバーシート１４Ｃを積層し、その後すぐに積層バー４０の裏面に印刷その他の手法で外部電極の導体パターン２４Ｐ，２６Ｐを形成するようにしてもよい。このように、上から、外部電極シート１４Ｄ，所定枚数のカバーシート１４Ｃ，内部電極層数分の内部電極シート１４Ａ及び１４Ｂ，所定枚数のカバーシート１４Ｃ，外部電極シート１４Ｅ（もしくは積層後にひっくり返して導体パターン２４Ｐ，２６Ｐが印刷されるカバーシート）が順に積層した積層バー４０が得られる。   As described above, from the viewpoint of the direction of the external electrode, the external electrode sheet 14E in which the electrode patterns 24P and 26P are formed on the back surface of the sheet or the cover sheet 14C is stacked, and then the final layer is stacked immediately thereafter. The conductor patterns 24P and 26P of the external electrodes may be formed on the back surface of the bar 40 by printing or other methods. Thus, from the top, the external electrode sheet 14D, the predetermined number of cover sheets 14C, the internal electrode sheets 14A and 14B corresponding to the number of internal electrode layers, the predetermined number of cover sheets 14C, and the external electrode sheet 14E (or turn over after lamination) A laminated bar 40 in which the cover sheets on which the conductor patterns 24P and 26P are printed) is sequentially laminated.

(5)圧着，外部電極の加工，切断・・・以上の工程によって形成された積層バー４０は、図２(B)の断面に示すように、上下の外部電極用の導体パターン２０Ｐ，２２Ｐ，２４Ｐ，２６Ｐが、積層バー４０の表面から盛り上がった凸状となっている。そこで、図３(A)に示すように、前記積層バー４０の表裏両面を、ＳＵＳ板などの硬板５０，５２に挟み込んだ後、図３(B)に示すように、加熱しながら数分間圧着を行う。前記硬板５０，５２は、離型処理がしてあると都合がよい。前記圧着は、１軸の油圧プレスであっても外部電極の加工自体は可能であるが、積層バー４０の側面からのサポートがないと、積層バー４０の伸びなどの原因になるため、通常は、静水圧プレスなどの等方圧のプレスを用いる。温度については、８０〜１２０℃まで、選択したバインダに応じた温度を適宜選択する。   (5) Crimping, processing of external electrode, cutting ... The laminated bar 40 formed by the above steps is formed of conductor patterns 20P, 22P for upper and lower external electrodes, as shown in the cross section of FIG. 24P and 26P are convex shapes raised from the surface of the laminated bar 40. Therefore, as shown in FIG. 3 (A), the both sides of the laminated bar 40 are sandwiched between hard plates 50 and 52 such as SUS plates, and then heated for several minutes as shown in FIG. 3 (B). Crimp. The hard plates 50 and 52 are conveniently subjected to a mold release process. For the crimping, the external electrode itself can be processed even if it is a uniaxial hydraulic press, but if there is no support from the side of the laminated bar 40, it will cause the laminated bar 40 to stretch. An isotropic pressure press such as an isostatic press is used. About temperature, the temperature according to the selected binder is suitably selected from 80-120 degreeC.

以上のような圧着後、積層バー４０を図３(C)に点線Ｌで示す位置で切断すると、図３(D)に示すように、セラミックス１４の内部に外部電極２０〜２６（導体パターン２０Ｐ〜２６Ｐ）が凸状に食い込んだ積層チップ５６が得られる。積層バー４０は、例えば、ダイサー機にダイヤモンドブレードなどの刃を用いて、個々のチップに切断する。仮に、図４(A)に示す比較例の積層バー６０（内部の積層構造は省略）のように、表裏両面に導体パターン６２Ｐ，６４Ｐを設け、図４(B)に示すように硬板５０，５２で挟み込んで圧着し、図４(C)に点線Ｌで示すように、導体パターン６２Ｐ，６４Ｐの中央部で切り離して個別の積層チップ６８を得るとする。この場合、図４(D)に示すように、積層チップ６８の端面における外部電極６２Ａ，６２Ｂ，６４Ａ，６４Ｂの断面形状は、略１／４楕円形状となる。すなわち、図６(A)に示すように、側面電極３０，３２との接続性は良好であっても、セラミックス６６に食い込む凸状部分がなく、緩やかな曲面でセラミックスと接触しているため、外部電極６２Ａ，６２Ｂ，６４Ａ，６４Ｂの剥離強度が弱くなってしまう。これに対し、本実施例では、前記積層チップ５６の端面における導体パターン２０Ｐ〜２６Ｐの断面形状は略半円形であり、セラミックス１４に食い込む凸部２６Ａを有しているため、外部電極の剥離強度が高い。   After the pressure bonding as described above, when the laminated bar 40 is cut at a position indicated by a dotted line L in FIG. 3C, external electrodes 20 to 26 (conductor pattern 20P) are formed inside the ceramic 14 as shown in FIG. ˜26P) is obtained in the convex shape. The laminated bar 40 is cut into individual chips using a blade such as a diamond blade in a dicer machine, for example. As shown in FIG. 4 (A), conductor patterns 62P and 64P are provided on both the front and back sides as in a laminated bar 60 of a comparative example (the internal laminated structure is omitted), and a hard plate 50 is formed as shown in FIG. 4 (B). , 52 and crimped, and as shown by a dotted line L in FIG. 4 (C), it is separated at the center of the conductor patterns 62P, 64P to obtain individual laminated chips 68. In this case, as shown in FIG. 4D, the cross-sectional shapes of the external electrodes 62A, 62B, 64A, and 64B on the end face of the multilayer chip 68 are approximately 1/4 elliptical. That is, as shown in FIG. 6 (A), even if the connectivity with the side electrodes 30, 32 is good, there is no convex portion that bites into the ceramic 66, and it is in contact with the ceramic with a gentle curved surface. The peel strength of the external electrodes 62A, 62B, 64A, 64B will be weakened. On the other hand, in the present embodiment, the cross-sectional shape of the conductor patterns 20P to 26P on the end face of the multilayer chip 56 is substantially semicircular and has a convex portion 26A that bites into the ceramic 14, so that the peel strength of the external electrode Is expensive.

ところで、図３(A)〜(D)に示す圧着・切断工程で形成した積層チップ５６は、該積層チップ５６の表面と外部電極２０〜２６の表面が面一のため、図６(B)に示すように、側面電極３０，３２を必要とする構造の場合には、良好な接続を確保するために、回り込み部３０Ａ，３０Ｂ，３２Ａ，３２Ｂを設ける必要がある。そこで、本実施例では、前記側面電極３０，３２との接続性を向上させるために、図５(A-1)及び(A-2)に示すように、前記積層バー４０と硬板５０，５２との間に、圧力緩和用のフィルム７０，７２を設けて圧着を行うこととしている。前記フィルム７０，７２は、例えば、ＰＥＴフィルムなどであって、該フィルム７０，７２を介して圧着を行うことにより，導体パターン２０Ｐ〜２６Ｐのつぶし量をコントロールできる。   By the way, the laminated chip 56 formed by the crimping / cutting process shown in FIGS. 3A to 3D is the same as the surface of the laminated chip 56 and the surface of the external electrodes 20 to 26. As shown in FIG. 5, in the case of a structure that requires the side electrodes 30 and 32, it is necessary to provide the wraparound portions 30A, 30B, 32A, and 32B in order to ensure good connection. Therefore, in this embodiment, in order to improve the connectivity with the side electrodes 30, 32, as shown in FIGS. 5A-1 and 5A-2, the laminated bar 40 and the hard plate 50, The pressure relaxation films 70 and 72 are provided between the film 52 and the film 52 for pressure bonding. The said films 70 and 72 are PET films etc., for example, Comprising: By crimping via the said films 70 and 72, the crushing amount of the conductor patterns 20P-26P can be controlled.

例えば、図５(B-1)及び(B-2)，図６(C)に示すように、導体パターン２６Ｐ（ないし外部電極２６）が完全にセラミックス１４に食い込まず、セラミックス１４の表面から若干盛り上がった突出部２６Ｂを形成するようにつぶし量をコントロールすることにより、外部電極の剥離強度を高く維持したまま、側面電極３０，３２との電気的接続性が良好な積層チップ５８を得ることができる。このような外部電極の形状は、フィルム７０，７２の硬さや厚みによって調整可能である。なお、本実施例の積層コンデンサ１０では、図１(A)及び図６(C)に示すように、側面電極３０，３２を設ける構成としたが、上下の外部電極２０〜２６と、内部電極１６，１８をビアホールなどによって接続し、側面電極３０，３２が不要な構成の場合には、図６(B)に示す構造であってもよい。   For example, as shown in FIGS. 5 (B-1), (B-2), and FIG. 6 (C), the conductor pattern 26P (or the external electrode 26) does not completely bite into the ceramic 14, but slightly from the surface of the ceramic 14. By controlling the amount of crushing so as to form a raised protrusion 26B, it is possible to obtain a laminated chip 58 with good electrical connectivity with the side electrodes 30, 32 while maintaining the peel strength of the external electrode high. it can. The shape of such external electrodes can be adjusted by the hardness and thickness of the films 70 and 72. In the multilayer capacitor 10 of this embodiment, as shown in FIGS. 1A and 6C, the side electrodes 30 and 32 are provided. However, the upper and lower external electrodes 20 to 26 and the internal electrodes are provided. In the case where 16 and 18 are connected by via holes or the like and the side electrodes 30 and 32 are unnecessary, the structure shown in FIG.

(6)側面電極形成・・・次に個々の積層チップ５８に、ローラ塗布法などの適宜手法を用いて側面電極３０，３２を形成する。側面電極３０，３２は、外部電極２０〜２６と同じ材料であってもよいし、異なる材料を用いてもよく、必要に応じて乾燥を行う。   (6) Side electrode formation: Next, the side electrodes 30 and 32 are formed on the individual laminated chips 58 by using an appropriate method such as a roller coating method. The side electrodes 30 and 32 may be made of the same material as the external electrodes 20 to 26, or may be made of a different material, and are dried as necessary.

(7)脱バインダ及び焼成・・・前記側面電極３０，３２の形成後、使用したバインダの分解温度で一定時間温度を保持して脱バインダを進めたのち、焼成温度まで昇温し、所望の焼結体を得る。使用する材料系によって、温度，雰囲気は変わるが、例えば、チタン酸バリウム系の材料であれば、１３００度付近で水素濃度１％未満の弱還元性雰囲気で焼成すればよい。これを実現するための焼成炉，焼成鞘などは適宜選択してよい。焼成後の積層チップ５８は、積層コンデンサ１０として機能し、必要に応じて端子メッキや特性検査、テーピング等の後工程へ送られる。   (7) Debinding and firing: After the formation of the side electrodes 30 and 32, the temperature is maintained for a certain period of time at the decomposition temperature of the binder used and the binder is advanced. A sintered body is obtained. The temperature and atmosphere vary depending on the material system used. For example, in the case of a barium titanate-based material, it may be fired in a weakly reducing atmosphere with a hydrogen concentration of less than 1% at around 1300 degrees. A firing furnace, a firing sheath, and the like for realizing this may be appropriately selected. The fired multilayer chip 58 functions as the multilayer capacitor 10 and is sent to subsequent processes such as terminal plating, characteristic inspection, and taping as necessary.

このように、実施例１によれば、次のような効果がある。
(1)セラミックス１４と複数の内部電極１６，１８が交互に積層した積層体１２の表面に、前記セラミックス１４に食い込む凸部を有する外部電極２０，２２，２４，２６を設けて積層コンデンサ１０を形成することとしたので、外部電極２０〜２６の剥離強度の向上を図ることができる。
(2)前記外部電極２０〜２６が、前記積層体１２の表面から若干盛り上がった突出部を有するように形成したので、外部電極の剥離強度を高く維持しながら、側面電極３０，３２との接続性の向上を図ることができる。
(3)積層バー４０を硬板５０，５２で圧着する際に、前記積層バー４０と硬板５０，５２の間にＰＥＴなどのフィルム７０，７２を設けて圧力の緩和を図ることとしたので、外部電極形状のコントロールが可能である。 Thus, according to the first embodiment, there are the following effects.
(1) On the surface of the laminate 12 in which the ceramics 14 and the plurality of internal electrodes 16 and 18 are alternately laminated, external electrodes 20, 22, 24, and 26 having convex portions that bite into the ceramics 14 are provided, so that the multilayer capacitor 10 is provided. Since it is formed, the peel strength of the external electrodes 20 to 26 can be improved.
(2) Since the external electrodes 20 to 26 are formed so as to have protrusions slightly raised from the surface of the laminate 12, the connection with the side electrodes 30 and 32 is maintained while maintaining a high peel strength of the external electrodes. It is possible to improve the performance.
(3) When the laminated bar 40 is pressure-bonded with the hard plates 50 and 52, the films 70 and 72 such as PET are provided between the laminated bar 40 and the hard plates 50 and 52 so as to reduce the pressure. The external electrode shape can be controlled.

なお、本発明は、上述した実施例に限定されるものではなく、本発明の要旨を逸脱しないは範囲内において種々変更を加え得ることができる。例えば、以下のものも含まれる。
(1)前記実施例で示した導体パターンは一例であり、必要に応じて適宜変更してよい。例えば、前記実施例１では、外部電極シート１４Ｄ，１４Ｅを利用することとしたが、外部電極シート１４Ｄを表裏反転して対称性が得られるのであれば、該外部電極シート１４Ｄを外部電極シート１４Ｅの代わりに使用してもよい。このほかにも、外部電極の導体パターンが積層バー４０の両面に凸状に形成される方法であれば、他の手法を用いるようにしてもよい。また、前記実施例では、２種類の内部電極シート１４Ａ，１４Ｂを用意することとしたが、グリーンシートにＶＩＡ加工した上で内部導体を形成することによって、積層インダクタやＬＣＲ複合部品などを作成する場合には、２パターン以上のシートを用意して積層体を構成するようにしてよい。 In addition, this invention is not limited to the Example mentioned above, A various change can be added within the range, without deviating from the summary of this invention. For example, the following are also included.
(1) The conductor pattern shown in the above embodiment is an example, and may be appropriately changed as necessary. For example, in the first embodiment, the external electrode sheets 14D and 14E are used. However, if the external electrode sheet 14D is reversed so that symmetry is obtained, the external electrode sheet 14D is used as the external electrode sheet 14E. It may be used instead of. In addition, other methods may be used as long as the conductor pattern of the external electrode is formed in a convex shape on both surfaces of the laminated bar 40. In the above embodiment, two types of internal electrode sheets 14A and 14B are prepared. However, a multilayer inductor, an LCR composite part, and the like are created by forming an internal conductor after VIA processing is performed on a green sheet. In some cases, a laminate may be formed by preparing two or more patterns of sheets.

(2)前記実施例で示したシートの積層数は一例であり、必要に応じて適宜増減してよい。
(3)前記実施例で示した圧着方法，切断方法も一例であり、同様の効果を奏するものであれば、公知の各種の方法を用いてよい。
(4)前記実施例では、積層体１２に側面電極３０，３２を形成することとしたが、これも一例であり、上下外部電極２０〜２６にビアホール接続などを行うことにより、側面電極を必要としない構成としてもよい。
(5)前記実施例で示した材料は一例であり、同様の効果を奏するように適宜変更してよい。
(6)前記実施例は、積層コンデンサに本発明を適用したものであるが、本発明は、公知の各種の積層電子部品に適用可能である。例えば、前記実施例では、積層コンデンサを例に挙げたため、積層体中の内部用導体は内部電極に相当するが、積層インダクタに本発明を適用した場合は、前記内部用導体は、螺旋状あるいは線状の導体を意味することになる。 (2) The number of stacked sheets shown in the above embodiment is an example, and may be appropriately increased or decreased as necessary.
(3) The pressure-bonding method and the cutting method shown in the above-described embodiments are examples, and various known methods may be used as long as the same effects can be obtained.
(4) In the above embodiment, the side electrodes 30, 32 are formed on the laminate 12, but this is also an example, and the side electrodes are required by connecting via holes to the upper and lower external electrodes 20-26. It is good also as a structure which is not.
(5) The materials shown in the above embodiments are merely examples, and may be appropriately changed so as to achieve the same effect.
(6) In the above embodiment, the present invention is applied to a multilayer capacitor. However, the present invention can be applied to various known multilayer electronic components. For example, in the above embodiment, since the multilayer capacitor is taken as an example, the internal conductor in the multilayer body corresponds to the internal electrode. However, when the present invention is applied to the multilayer inductor, the internal conductor is spiral or This means a linear conductor.

本発明によれば、複数のセラミックス層と内部用導体とを有する積層体の表面に、該積層体のセラミックス部分に凸部が食い込むように外部電極を設けて、外部電極の剥離強度の向上を図ることとしたので、積層電子部品の用途に適用できる。   According to the present invention, an external electrode is provided on the surface of a multilayer body having a plurality of ceramic layers and internal conductors so that the convex portion bites into the ceramic portion of the multilayer body, thereby improving the peel strength of the external electrode. Since it is intended, it can be applied to the use of laminated electronic components.

本発明の実施例１の積層コンデンサを示す図であり、(A)は断面図，(B)は外部電極の断面拡大図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the multilayer capacitor of Example 1 of this invention, (A) is sectional drawing, (B) is a cross-sectional enlarged view of an external electrode. 前記実施例１の積層構造を示す図であり、(A)は分解斜視図，(B)は前記(A)を＃Ａ−＃Ａ線に沿って切断し矢印方向に見た断面図である。It is a figure which shows the laminated structure of the said Example 1, (A) is a disassembled perspective view, (B) is sectional drawing which cut | disconnected said (A) along the # A- # A line and looked at the arrow direction. . 本発明の外部電極の基本的な圧着及び分割工程を示す断面図である。It is sectional drawing which shows the basic crimping | compression-bonding and division | segmentation process of the external electrode of this invention. 比較例の外部電極の圧着及び分割工程を示す断面図である。It is sectional drawing which shows the crimping | compression-bonding and division | segmentation process of the external electrode of a comparative example. 前記実施例１の外部電極の圧着工程を示す断面図である。It is sectional drawing which shows the crimping | compression-bonding process of the external electrode of the said Example 1. FIG. 本発明及び比較例における外部電極と側面電極の接続例を示す断面図である。It is sectional drawing which shows the example of a connection of the external electrode and side electrode in this invention and a comparative example.

符号の説明Explanation of symbols

１０：積層コンデンサ
１２：積層体
１２Ａ，１２Ｂ：表面
１４：セラミックス
１４Ａ，１４Ｂ：内部電極シート
１４Ｃ：カバーシート
１４Ｄ，１４Ｅ：外部電極シート
１６，１８：内部電極
１６Ｐ，１８Ｐ：導体パターン
２０，２２，２４，２６：外部電極
２０Ｐ，２２Ｐ，２４Ｐ，２６Ｐ：導体パターン
２６Ａ：凸部
２６Ｂ：突出部
３０，３２：側面電極
３０Ａ，３０Ｂ，３２Ａ，３２Ｂ：回り込み部
４０：積層バー
５０，５２：硬板
５６，５８：積層チップ
６０：積層バー
６２Ａ，６２Ｂ，６４Ａ，６４Ｂ：外部電極
６２Ｐ，６４Ｐ：導体パターン
６６：セラミックス
６８：積層チップ
７０，７２：フィルム 10: multilayer capacitor 12: multilayer body 12A, 12B: surface 14: ceramics 14A, 14B: internal electrode sheet 14C: cover sheet 14D, 14E: external electrode sheet 16, 18: internal electrode 16P, 18P: conductor patterns 20, 22, 24, 26: external electrodes 20P, 22P, 24P, 26P: conductor pattern 26A: convex portion 26B: protruding portion 30, 32: side electrodes 30A, 30B, 32A, 32B: wraparound portion 40: laminated bar 50, 52: hard plate 56, 58: Laminated chip 60: Laminated bars 62A, 62B, 64A, 64B: External electrodes 62P, 64P: Conductor pattern 66: Ceramics 68: Laminated chips 70, 72: Film

Claims (6)

複数のセラミックス層と内部用導体とを有する積層体の表面に、外部電極を設けた積層電子部品であって、
前記外部電極が、前記積層体のセラミックス部分に食い込む凸部を有することを特徴とする積層電子部品。 A multilayer electronic component in which an external electrode is provided on the surface of a multilayer body having a plurality of ceramic layers and an internal conductor,
The multilayer electronic component, wherein the external electrode has a convex portion that bites into a ceramic portion of the multilayer body. 前記外部電極が、前記積層体表面に盛り上がった突出部を有することを特徴とする請求項１記載の積層電子部品。   The multilayer electronic component according to claim 1, wherein the external electrode has a protruding portion raised on the surface of the multilayer body. 内部用導体パターンが形成されたセラミックスシートを積層するとともに、積層体表面に外部電極用の導体パターンを凸状に形成する工程，
前記積層体を一対の硬板で挟み込み、前記外部電極用の導体パターンの少なくとも一部が、前記積層体のセラミックス部分に食い込む凸部を形成するように圧着する工程，
該圧着工程後の積層体を焼成する工程，
を含むことを特徴とする積層電子部品の製造方法。 A step of laminating ceramic sheets on which an internal conductor pattern is formed and forming a conductor pattern for an external electrode in a convex shape on the surface of the laminate;
Sandwiching the laminated body between a pair of hard plates, and crimping so that at least a part of the conductor pattern for the external electrode forms a convex portion that bites into a ceramic portion of the laminated body,
A step of firing the laminate after the crimping step,
A method of manufacturing a laminated electronic component comprising: 前記内部用導体パターン及び外部電極用の導体パターンが、前記セラミックスシートの主面上及び積層体の表面上に多数分割形成されているときに、
前記圧着工程後の積層体を焼成する前に、個々のチップが前記外部電極用の導体パターンの凸部を含むような位置で、前記積層体を複数のチップに分割する工程，
を含むことを特徴とする請求項３記載の積層電子部品の製造方法。 When the conductor pattern for the internal and the conductor pattern for the external electrode are formed in multiple divisions on the main surface of the ceramic sheet and the surface of the laminate,
Dividing the laminate into a plurality of chips at a position where each chip includes a convex portion of the conductor pattern for the external electrode before firing the laminate after the crimping step;
The method for manufacturing a laminated electronic component according to claim 3, wherein: 前記圧着工程において、前記積層体と硬板との間に、圧力緩和用フィルムを設けて圧着を行うことを特徴とする請求項３又は４記載の積層電子部品の製造方法。   5. The method for manufacturing a laminated electronic component according to claim 3, wherein in the crimping step, a pressure relaxation film is provided between the laminate and the hard plate to perform crimping. 請求項３〜５のいずれかに記載の製造方法によって形成したことを特徴とする積層電子部品。   A multilayer electronic component formed by the manufacturing method according to claim 3.
JP2008088866A 2008-03-29 2008-03-29 Laminated electronic component and its manufacturing method Withdrawn JP2009246052A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092900A (en) * 2008-10-03 2010-04-22 Tdk Corp Electronic component, manufacturing method thereof and electronic component assembly
KR101173420B1 (en) 2010-07-21 2012-08-10 가부시키가이샤 무라타 세이사쿠쇼 Ceramic electronic component
JP2015095496A (en) * 2013-11-11 2015-05-18 パナソニックＩｐマネジメント株式会社 Laminated component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010092900A (en) * 2008-10-03 2010-04-22 Tdk Corp Electronic component, manufacturing method thereof and electronic component assembly
KR101173420B1 (en) 2010-07-21 2012-08-10 가부시키가이샤 무라타 세이사쿠쇼 Ceramic electronic component
JP2015095496A (en) * 2013-11-11 2015-05-18 パナソニックＩｐマネジメント株式会社 Laminated component

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