JP2009241525A - Cream solder printing device - Google Patents

Cream solder printing device Download PDF

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JP2009241525A
JP2009241525A JP2008093766A JP2008093766A JP2009241525A JP 2009241525 A JP2009241525 A JP 2009241525A JP 2008093766 A JP2008093766 A JP 2008093766A JP 2008093766 A JP2008093766 A JP 2008093766A JP 2009241525 A JP2009241525 A JP 2009241525A
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printing
cream solder
workpiece
suction
printing mask
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Yosuke Kondo
洋介 近藤
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain a reasonable priced cream solder printing device which can cream solder print even on a bad work piece of having an uneven adsorbing surface and therefore inferior in adhesion with an adsorbing surface. <P>SOLUTION: The device is equipped with a work holding table 12 which has; a printing mask installation surface 12h, a work piece accommodation casing part 12a which is formed as a concave form in a place one step lower from the printing mask installation surface 12h and a bottom surface of which becomes as a work piece adsorbing surface 12f, a negative pressure chamber 12b which is formed as a concave form in a place one step lower from the work piece adsorbing surface 12f and is blocked by a work piece 11, a suction hole 12c which connects the negative pressure chamber 12b to a vacuum generator, a ventilator 12e which connects the work piece accommodation casing part 12a on which the printing mask 13 is installed and blocked out to open air; and a squeegee 15 which performs cream solder printing 14 on the work piece 11 sliding over the printing mask 13 and through the opening pattern 13a of the printing mask 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、真空吸着したセラミック基板等のワークに、クリームはんだを印刷するクリームはんだ印刷装置に関するものである。   The present invention relates to a cream solder printing apparatus for printing cream solder on a workpiece such as a vacuum-adsorbed ceramic substrate.

従来、クリームはんだ印刷においては、印刷時におけるワークの位置ズレを防止するため、ワークを機械的に固定するか、若しくは、真空吸着して固定する。真空吸着による固定では、ワークを吸着面に密着させ、その間に負圧を発生させることによってワークを保持する。それ故、十分な固定力を得るには、ワークと吸着面との密着性や真空発生装置の吸込み能力が重要となる。   Conventionally, in cream solder printing, in order to prevent the positional deviation of the workpiece during printing, the workpiece is mechanically fixed or fixed by vacuum suction. In fixing by vacuum suction, the work is held by bringing the work into close contact with the suction surface and generating a negative pressure therebetween. Therefore, in order to obtain a sufficient fixing force, the adhesion between the workpiece and the suction surface and the suction capability of the vacuum generator are important.

しかしながら、ワークの反りや凹凸などにより、吸着面との密着が不十分な場合や、ワークにスルーホール等の穴が形成されている場合には、密着の不十分な箇所やスルーホールからエア漏れが発生してしまい、十分な固定力が得られない。   However, if the workpiece is not sufficiently adhered to the suction surface due to warpage or unevenness, or if a hole such as a through hole is formed in the workpiece, air leaks from the insufficiently adhered portion or through hole. Will occur and a sufficient fixing force cannot be obtained.

さらに、エア漏れの影響により、印刷時に、クリームはんだが吸込まれる不具合が発生する。不具合の形態には、印刷マスクとワークとの間にクリームはんだが印刷形状よりも大きく広がるにじみやダレ、隣接するはんだ同士がつながるブリッジなどがある。   Further, due to the influence of air leakage, there is a problem that cream solder is sucked during printing. The forms of defects include bleeding and sagging where the cream solder spreads larger than the printed shape between the printing mask and the workpiece, and a bridge where adjacent solders are connected.

従来、基板にクリームはんだを印刷するクリームはんだ印刷機において、クリームはんだの印刷時に前記基板を印刷位置で保持する保持手段を備えるクリームはんだ印刷機のワーク保持装置であって、前記保持手段に設けられ、吸着により前記基板を固定する吸着固定手段と、該吸着手段による吸着のＯＮ／ＯＦＦを制御する制御手段をと、を備え、該制御手段は、前記吸着固定手段による前記基板の吸着をＯＮとして前記保持手段に前記基板を保持させたのちに、印刷動作中に、前記吸着固定手段による前記基板の吸着をＯＦＦとし、印刷終了後に、吸着固定手段による基板の吸着をＯＮとし、基板を確実に保持させるものがある（例えば、特許文献１参照）。   Conventionally, in a cream solder printing machine for printing cream solder on a substrate, it is a work holding device of a cream solder printing machine that includes a holding unit that holds the substrate in a printing position during cream solder printing, and is provided in the holding unit. A suction fixing means for fixing the substrate by suction; and a control means for controlling ON / OFF of suction by the suction means. The control means turns on suction of the substrate by the suction fixing means. After the substrate is held by the holding means, during the printing operation, the suction of the substrate by the suction fixing means is turned OFF, and after the printing is finished, the suction of the substrate by the suction fixing means is turned ON to ensure the substrate There is what is held (see, for example, Patent Document 1).

また、前記吸着固定手段は、複数のエリアごとに設けられ、かつ、エリアごとに独立して吸着のＯＮ／ＯＦＦが可能な複数の吸着部を備え、前記制御手段は、前記複数の吸着部ごとに前記吸着固定手段による前記基板の吸着のＯＮ／ＯＦＦを制御することにより、スルーホールにエアの流れを発生させてクリームはんだを吸引する位置にある吸着部だけを選択して吸着をＯＦＦし、吸引される畏れがない吸着部については、印刷動作中においても吸着させることができ、基板を確実に保持している。   The suction fixing means includes a plurality of suction sections that are provided for each of the plurality of areas and can be turned on / off independently for each area, and the control means is provided for each of the plurality of suction sections. By controlling the ON / OFF of the suction of the substrate by the suction fixing means, the suction is turned off by selecting only the suction part at the position where the air flow is generated in the through hole and the cream solder is sucked, The suction part that is not twisted can be sucked even during the printing operation, and the substrate is securely held.

特開２００２−００１９０８号公報JP 2002-001908 A

しかしながら、上記特許文献１に記載された従来の技術によれば、吸着手段による吸着のＯＮ／ＯＦＦを制御する制御手段が必要となり、例えば、手印刷（手刷り）を行う簡易的な印刷機においては、スキージの手動操作に連動する制御手段でなければ適用が難しい。そのため、簡易的な印刷機にそぐわない高価な印刷機となってしまう、という問題があった。   However, according to the conventional technique described in Patent Document 1, a control unit that controls ON / OFF of suction by the suction unit is required. For example, in a simple printing machine that performs manual printing (hand printing). Is difficult to apply unless the control means is linked to manual operation of the squeegee. For this reason, there has been a problem that it becomes an expensive printing machine not suitable for a simple printing machine.

また、印刷中にワークの吸着を解除すると、スキージや印刷マスクの動きとともにワークが位置ズレしてしまうので、スキージの移動とともにワーク吸着のＯＮ／ＯＦＦを制御する必要があり、多数の吸引孔が必要となるが、吸着面に凹凸があり、吸着箇所が一箇所に限定されるワークに対しては、上記特許文献１に記載された技術を適用するのは困難である。   Also, if the suction of the workpiece is canceled during printing, the workpiece will be displaced with the movement of the squeegee and the printing mask. Therefore, it is necessary to control the ON / OFF of the workpiece suction along with the movement of the squeegee. Although necessary, it is difficult to apply the technique described in Patent Document 1 to a workpiece in which the suction surface is uneven and the suction location is limited to one location.

また、個々に反りの傾向にばらつきがあり、吸着面との密着性が悪いワークにおいては、エア漏れが発生する箇所が特定できないため、吸着におけるエアの吸込みを効果的に抑制するのが難しい、という問題もある。   In addition, there is variation in the tendency of warping individually, and in a work with poor adhesion to the suction surface, it is difficult to effectively suppress air suction during suction because the location where air leakage occurs cannot be specified. There is also a problem.

本発明は、上記に鑑みてなされたものであって、吸着面に凹凸等があり、吸着面との密着性が悪いワークであってもクリームはんだ印刷を行なうことができ、安価なクリームはんだ印刷装置を得ることを目的とする。   The present invention has been made in view of the above, and it is possible to perform cream solder printing even on a work having poor adhesion to the adsorption surface, such as unevenness on the adsorption surface, and inexpensive cream solder printing. The object is to obtain a device.

上述した課題を解決し、目的を達成するために、本発明は、印刷マスク載置面と、前記印刷マスク載置面から一段低い凹部として形成され底面がワーク吸着面となるワーク収容部と、前記ワーク吸着面から一段低い凹部として形成されワークにより閉塞される負圧室と、前記負圧室を真空発生器に連通させる吸引孔と、印刷マスクが載置されて閉塞された前記ワーク収容部を外気に連通させる通気孔と、を有するワーク保持テーブルと、前記印刷マスク上を摺動し前記印刷マスクの開口パターンを介して前記ワークにクリームはんだを印刷するスキージと、を備えることを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a printing mask mounting surface, and a workpiece storage portion that is formed as a recess that is one step lower than the printing mask mounting surface, and whose bottom surface is a workpiece suction surface. A negative pressure chamber that is formed as a recess that is one step lower than the workpiece suction surface, is closed by a workpiece, a suction hole that communicates the negative pressure chamber with a vacuum generator, and the workpiece storage portion that is closed by placing a printing mask A work holding table that communicates with the outside air, and a squeegee that slides on the printing mask and prints cream solder on the work through an opening pattern of the printing mask. To do.

この発明によれば、吸着面に凹凸等があり、吸着面との密着性が悪いワークであってもクリームはんだ印刷を行なうことができ、安価なクリームはんだ印刷装置が得られる、という効果を奏する。   According to the present invention, there is an effect that cream solder printing can be performed even on a workpiece having unevenness on the suction surface and having poor adhesion to the suction surface, and an inexpensive cream solder printing apparatus can be obtained. .

以下に、本発明にかかるクリームはんだ印刷装置の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Embodiments of a cream solder printing apparatus according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

実施の形態
図１は、本発明にかかるクリームはんだ印刷装置の要部分解斜視図であり、図２は、真空発生器を接続した実施の形態のクリームはんだ印刷装置を示す縦断面図であり、図３は、スキージ送り装置を備えた実施の形態のクリームはんだ印刷装置を示す縦断面図であり、図４は、手刷りを行なう実施の形態のクリームはんだ印刷装置を示す縦断面図であり、図５は、本実施の形態のクリームはんだ印刷装置の要部拡大縦断面図であり、図６は、クリームはんだ印刷の工程図であり、図７は、クリームはんだオフセット印刷の工程図であり、図８は、クリームはんだコンタクト印刷の工程図であり、図９は、比較例として示す従来のクリームはんだ印刷装置の要部拡大断面図であり、図１０−１及び図１０−２は、本実施の形態のクリームはんだ印刷装置の通気孔の説明図である。 Embodiment FIG. 1 is an exploded perspective view of a main part of a cream solder printing apparatus according to the present invention, and FIG. 2 is a longitudinal sectional view showing a cream solder printing apparatus according to an embodiment to which a vacuum generator is connected, FIG. 3 is a longitudinal sectional view showing the cream solder printing apparatus according to the embodiment including the squeegee feeding device, and FIG. 4 is a longitudinal sectional view showing the cream solder printing apparatus according to the embodiment for performing hand printing, FIG. 5 is an enlarged longitudinal sectional view of a main part of the cream solder printing apparatus according to the present embodiment, FIG. 6 is a process diagram of cream solder printing, and FIG. 7 is a process diagram of cream solder offset printing. FIG. 8 is a process diagram of cream solder contact printing, FIG. 9 is an enlarged cross-sectional view of a main part of a conventional cream solder printing apparatus shown as a comparative example, and FIGS. 10-1 and 10-2 show the present embodiment. Form of chestnut It is explanatory drawing of the air vent of a solder paste printer.

図１に示すように、本実施の形態のクリームはんだ印刷装置１０は、ワークとしてのセラミック基板１１をワーク吸着面１２ｆ上に保持するワーク保持テーブル１２と、開口パターン１３ａが形成され、セラミック基板１１を覆うようにワーク保持テーブル１２の印刷マスク載置面１２ｈ上に載置される平板状の印刷マスク１３と、印刷マスク１３上を摺動し印刷マスク１３の開口パターン１３ａを介してワーク１１にクリームはんだ１４を印刷するスキージ１５と、を備えている。   As shown in FIG. 1, the cream solder printing apparatus 10 according to the present embodiment includes a workpiece holding table 12 that holds a ceramic substrate 11 as a workpiece on a workpiece suction surface 12f, and an opening pattern 13a. A flat plate-shaped printing mask 13 placed on the printing mask placement surface 12 h of the workpiece holding table 12 so as to cover the workpiece 11 and the workpiece 11 through the opening pattern 13 a of the printing mask 13 that slides on the printing mask 13. And a squeegee 15 for printing the cream solder 14.

図１〜図３に示すように、ワーク保持テーブル１２は、印刷マスク載置面１２ｈと、印刷マスク載置面１２ｈから一段低い矩形の凹部として形成され底面がワーク吸着面１２ｆとなるワーク収容部１２ａと、ワーク吸着面１２ｆから一段低い凹部として形成されワーク（セラミック基板）１１により閉塞される負圧室１２ｂと、負圧室１２ｂを真空発生器１７に連通させる吸引孔１２ｃと、印刷マスク１３が載値されて閉塞されたワーク収容部１２ａを外気に連通させる通気孔１２ｅと、を有している。   As shown in FIGS. 1 to 3, the work holding table 12 includes a print mask placement surface 12 h and a work storage portion that is formed as a rectangular recess that is one step lower than the print mask placement surface 12 h and has a bottom surface serving as a work suction surface 12 f. 12a, a negative pressure chamber 12b formed as a recess that is one step lower than the workpiece suction surface 12f, closed by the workpiece (ceramic substrate) 11, a suction hole 12c for communicating the negative pressure chamber 12b with the vacuum generator 17, and a printing mask 13 And a vent hole 12e for communicating the closed work accommodating portion 12a with the outside air.

凹部１２ａの深さは、セラミック基板１１の厚さにばらつきがあっても、印刷マスク下面１３ｂとセラミック基板上面１１ａとが印刷時に隙間なく密着することができるような深さになっていて、セラミック基板１１の厚さよりも浅い場合もあれば深い場合もある。負圧室１２ｂは、凹部１２ａの中央に形成されている。矩形のワーク収容部１２ａの対向する２辺の中央には、通気孔１２ｅが開口する切欠き部１２ｄが設けられている。   The depth of the recess 12a is such that even if the thickness of the ceramic substrate 11 varies, the print mask lower surface 13b and the ceramic substrate upper surface 11a can adhere to each other without a gap during printing. The thickness may be shallower or deeper than the thickness of the substrate 11. The negative pressure chamber 12b is formed at the center of the recess 12a. At the center of the two opposing sides of the rectangular workpiece accommodating portion 12a, a notch portion 12d in which a vent hole 12e is opened is provided.

図２に示すように、セラミック基板１１を、ワーク保持テーブル１２のワーク収容部１２ａ内に収容してワーク吸着面１２ｆ上に設置し、真空発生器１７により負圧室１２ｂ内の空気を吸引して負圧にし、セラミック基板１１をワーク吸着面１２ｆに吸着させる。   As shown in FIG. 2, the ceramic substrate 11 is accommodated in the workpiece accommodating portion 12 a of the workpiece holding table 12 and placed on the workpiece adsorption surface 12 f, and the air in the negative pressure chamber 12 b is sucked by the vacuum generator 17. Thus, the negative pressure is applied, and the ceramic substrate 11 is adsorbed on the workpiece adsorption surface 12f.

図３に示すように、スキージ１５は、ボールスクリュー方式のスキージ送り装置１６により、印刷マスク１３に傾斜して押付けられ、印刷マスク１３上を図３の右方向に摺動し、クリームはんだ１４を、印刷マスク１３の開口パターン１３ａを介してセラミック基板１１に塗り込んで印刷する。図４に示すように、スキージ１５を手１８で持って、印刷マスク１３上を摺動させ、手印刷（手刷り）を行なうこともできる。   As shown in FIG. 3, the squeegee 15 is inclined and pressed against the printing mask 13 by a ball screw type squeegee feeder 16, and slides on the printing mask 13 in the right direction of FIG. Then, the ceramic substrate 11 is coated through the opening pattern 13a of the printing mask 13 and printed. As shown in FIG. 4, it is also possible to perform manual printing (hand printing) by holding the squeegee 15 with the hand 18 and sliding it on the printing mask 13.

次に、図６を参照して、クリームはんだ印刷のメカニズムについて説明する。クリームはんだ印刷とは、ワークとしてのセラミック基板１１へ、印刷マスク１３の所定の開口パターン１３ａを介して、所定量のクリームはんだ１４を転移する印刷方法をいう。   Next, the mechanism of cream solder printing will be described with reference to FIG. Cream solder printing refers to a printing method in which a predetermined amount of cream solder 14 is transferred to a ceramic substrate 11 as a work through a predetermined opening pattern 13a of a printing mask 13.

クリームはんだ印刷の工程は、図６の（１）に示す、スキージ１５の移動により、クリームはんだ１４を印刷マスク１３の上面で回転させるローリング工程と、（２）に示す、クリームはんだ１４を印刷マスク１３の開口パターン１３ａへ充填・転移する転移工程と、（３）及び（４）に示す、クリームはんだ１４がセラミック基板１１の上面に転移され、開口パターン１３ａからクリームはんだ１４が抜ける版離れ工程と、を有している。   The cream solder printing process includes a rolling process in which the cream solder 14 is rotated on the upper surface of the print mask 13 by the movement of the squeegee 15 shown in FIG. 6A, and the cream solder 14 shown in FIG. A transfer step of filling and transferring to the 13 opening patterns 13a, and a plate separating step shown in (3) and (4), in which the cream solder 14 is transferred to the upper surface of the ceramic substrate 11 and the cream solder 14 comes out of the opening pattern 13a. ,have.

印刷方式としては、図７に示す、転移工程と版離れ工程とがほぼ同時に行なわれるオフセット（ギャップ）印刷方式と、図８に示す、転移工程と版離れ工程とが別々に行なわれるコンタクト印刷方式がある。   As the printing method, an offset (gap) printing method shown in FIG. 7 in which the transfer step and the plate separation step are performed almost simultaneously, and a contact printing method shown in FIG. 8 in which the transfer step and the plate separation step are performed separately. There is.

図６の（１）に示すように、クリームはんだ１４は、接合用の母材として用いられるはんだ粉末１４ａと、はんだ付け面の清浄化、印刷時の適正な粘度の維持及び部品の固定に必要な粘着性等、多様な機能を有するフラックス１４ｂと、を含んで成る。   As shown in (1) of FIG. 6, the cream solder 14 is necessary for solder powder 14a used as a base material for joining, cleaning of the soldering surface, maintenance of proper viscosity during printing, and fixing of components. Flux 14b having various functions such as adhesiveness.

クリームはんだ印刷において、クリームはんだ１４に求められる性能は、印刷マスク１３の開口パターン１３ａのパターンを忠実に再現する印刷精度、かつ、再現したパターンを維持する保形性、開口パターン１３ａにクリームはんだ１４が充填されるための適正な粘度である。求められる性能を満足させるための、はんだ粉末１４ａの粒径と多種のフラックス１４ｂとの組合せがある。   In the cream solder printing, the performance required for the cream solder 14 is that the printing accuracy to faithfully reproduce the pattern of the opening pattern 13a of the printing mask 13, the shape retaining property to maintain the reproduced pattern, and the cream solder 14 to the opening pattern 13a. Is the proper viscosity for filling. There are combinations of the particle size of the solder powder 14a and various types of fluxes 14b to satisfy the required performance.

例えば、粘度の低いフラックス１４ｂを含むクリームはんだ１４は、印刷時の開口パターン１３ａへの充填性はよいが、印刷後の保形性は悪く、図６の（５）に示すように、形状が崩れてダレ１４ｘやにじみ１４ｙが発生しやすくなるため、印刷には不向きである。また、逆に、粘度が高いクリームはんだ１４は、充填性が悪くなる。従って、適正な粘度を有するものが、印刷性のよいクリームはんだである。   For example, the cream solder 14 containing the low-viscosity flux 14b has good filling properties into the opening pattern 13a at the time of printing, but has poor shape retention after printing, and has a shape as shown in (5) of FIG. Since it collapses and sag 14x and blur 14y are likely to occur, it is not suitable for printing. Conversely, the cream solder 14 having a high viscosity has poor filling properties. Therefore, a cream solder having a proper viscosity is a printable solder.

にじみ１４ｙは、図９に示すように、印刷時に、ワーク１１を吸着するための真空発生器１７の吸込みによって、クリームはんだ１４が、印刷マスク１３の開口パターン１３ａを通り、印刷マスク下面へ回り込むことにより発生する。にじみ１４ｙは、ワーク１１とワーク保持テーブル１２のワーク吸着面１２ｆとの密着が悪く、エア漏れＭが発生したときに起こりやすい。   As shown in FIG. 9, the blur 14 y causes the cream solder 14 to pass through the opening pattern 13 a of the printing mask 13 to the lower surface of the printing mask 13 due to the suction of the vacuum generator 17 for sucking the workpiece 11 during printing. Caused by. The blur 14y is likely to occur when the air leak M occurs due to poor adhesion between the workpiece 11 and the workpiece suction surface 12f of the workpiece holding table 12.

印刷時は、スキージ１５が、印刷マスク１３をワーク保持テーブル１２に押付けて印刷を行なうため、ワーク保持テーブル１２、ワーク１１、印刷マスク１３及びクリームはんだ１４により、ワーク収容部１２ａは閉じられた空間となる。   During printing, since the squeegee 15 presses the print mask 13 against the work holding table 12 to perform printing, the work accommodating portion 12a is closed by the work holding table 12, the work 11, the print mask 13, and the cream solder 14. It becomes.

ワーク１１とワーク保持テーブル１２のワーク吸着面１２ｆとの間に隙間１２ｇがあると、エア漏れＭが発生し、その結果、ワーク収容部１２ａ内が負圧となり、クリームはんだ１４がワーク収容部１２ａ内に吸込まれ、印刷マスク下面１３ｂを伝って広がる。クリームはんだ１４に含まれるフラックス１４ｂは、吸込みによって、印刷マスク下面１３ｂとワーク１１に挟まれたわずかな隙間でも、毛細管現象により短時間で広がり、にじみ１４ｙとなる。   If there is a gap 12g between the workpiece 11 and the workpiece holding surface 12f of the workpiece holding table 12, an air leak M occurs. As a result, the inside of the workpiece accommodating portion 12a becomes negative pressure, and the cream solder 14 is transferred to the workpiece accommodating portion 12a. It is sucked in and spreads along the print mask lower surface 13b. The flux 14b contained in the cream solder 14 spreads in a short time due to capillary action even in a slight gap sandwiched between the print mask lower surface 13b and the work 11 due to suction, and becomes a blur 14y.

次に、図５と図９とを比較参照しながら、図５に示す実施の形態のクリームはんだ印刷装置１０について詳細に説明する。クリームはんだ印刷装置１０では、ワークとしてセラミック基板１１を用いている。セラミック基板１１は、反り易く、割れ易く、割れによる個片化により端部形状がいびつになりやすい。   Next, the cream solder printing apparatus 10 of the embodiment shown in FIG. 5 will be described in detail with reference to FIG. 5 and FIG. In the cream solder printing apparatus 10, a ceramic substrate 11 is used as a workpiece. The ceramic substrate 11 is easily warped, is easily cracked, and the end shape is liable to be distorted by singulation.

図９に示すように、セラミック基板１１をワーク保持テーブル１２で保持するとき、チャッキング等で機械的に固定すると、セラミック基板１１に、欠け、割れ又はクラックが発生する。そのため、セラミック基板１１は、真空吸着によりワーク保持テーブル１２に固定されるが、反り或いは縁部の凹凸により、ワーク吸着面１２ｆとセラミック基板１１との間に隙間１２ｇが生じ、エア漏れＭが発生し、クリームはんだ１４が、印刷マスク下面１３ｂやセラミック基板１１の上面１１ａに、にじみ１４ｙとなって広がる不具合が起こる。   As shown in FIG. 9, when the ceramic substrate 11 is held by the work holding table 12, if it is mechanically fixed by chucking or the like, the ceramic substrate 11 is chipped, cracked or cracked. Therefore, the ceramic substrate 11 is fixed to the work holding table 12 by vacuum suction, but a gap 12g is generated between the workpiece suction surface 12f and the ceramic substrate 11 due to warpage or unevenness of the edge, and air leakage M occurs. However, the problem that the cream solder 14 spreads as a blur 14y on the print mask lower surface 13b and the upper surface 11a of the ceramic substrate 11 occurs.

また、クリームはんだ１４のにじみ１４ｙを放置すると、連続で印刷作業を行なったときに、印刷マスク下面１３ｂに回りこんだクリームはんだ１４が、印刷マスク１３とセラミック基板１１の間に挟まれて隙間が生じ、余計ににじみ１４ｙが拡大し、印刷不具合を増大させてしまう。そのため、印刷マスク下面１３ｂの清掃を、にじみ１４ｙが発生する度に行なわねばならず、印刷マスク１３の清掃作業の頻度が増えるという問題も起こる。   Further, if the bleed 14y of the cream solder 14 is left, the cream solder 14 that has wrapped around the lower surface 13b of the printing mask when the printing operation is continuously performed is sandwiched between the printing mask 13 and the ceramic substrate 11 so that a gap is left. As a result, the blur 14y is excessively enlarged and printing defects are increased. For this reason, the printing mask lower surface 13b must be cleaned every time the bleeding 14y occurs, and the frequency of cleaning the printing mask 13 increases.

図９に示すように、セラミック基板１１は、セラミック基板１１を収容するワーク収容部１２ａ、吸引孔１２ｃ及びワーク吸着面１２ｆにより保持され、印刷時に、スキージ１５で押さえつけられることにより、印刷マスク下面１３ｂとセラミック基板上面１１ａが接触する。   As shown in FIG. 9, the ceramic substrate 11 is held by a work accommodating portion 12 a that accommodates the ceramic substrate 11, a suction hole 12 c, and a work suction surface 12 f, and is pressed by a squeegee 15 during printing, whereby a print mask lower surface 13 b And the ceramic substrate upper surface 11a contact.

接触と同時に、開口パターン１３ａに充填されたクリームはんだ１４が、セラミック基板上面１１ａのランド１１ｃ上に押出され、開口の形状に形成されたクリームはんだ１４が印刷（転写）される。このとき、印刷マスク下面１３ｂとセラミック基板上面１１ａ、及び、印刷マスク下面１３ｂと印刷マスク載置面１２ｈが、スキージ１５の押付けにより、密着した状態となる。   Simultaneously with the contact, the cream solder 14 filled in the opening pattern 13a is extruded onto the land 11c on the upper surface 11a of the ceramic substrate, and the cream solder 14 formed in the shape of the opening is printed (transferred). At this time, the printing mask lower surface 13 b and the ceramic substrate upper surface 11 a and the printing mask lower surface 13 b and the printing mask placement surface 12 h are brought into close contact with each other by pressing the squeegee 15.

この密着状態において、セラミック基板下面１１ｂとワーク吸着面１２ｆとの間に隙間１２ｇが生じていると、エア漏れＭによって、ワーク収容部１２ａが負圧となり、開口パターン１３ａからセラミック基板１１へ転移されたクリームはんだ１４が、印刷マスク下面１３ｂへ広がるにじみ１４ｙが発生する。   If a gap 12g is formed between the ceramic substrate lower surface 11b and the workpiece suction surface 12f in this tight contact state, the work accommodating portion 12a becomes negative pressure due to air leakage M, and is transferred from the opening pattern 13a to the ceramic substrate 11. Bleeding 14y that the cream solder 14 spreads to the lower surface 13b of the printing mask occurs.

図５に示す、クリームはんだ印刷装置１０では、印刷時に、印刷マスク３とセラミック基板１１とが密着しているときに、ワーク収容部１２ａが負圧とならないように、ワーク保持テーブル１２の切欠き部１２ｄに開口し、ワーク収容部１２ａを外気に連通させる通気孔１２ｅを設けている。   In the cream solder printing apparatus 10 shown in FIG. 5, when the printing mask 3 and the ceramic substrate 11 are in close contact with each other at the time of printing, the work holding table 12 is notched so as not to have a negative pressure. A vent hole 12e is provided in the portion 12d to allow the work accommodating portion 12a to communicate with the outside air.

通気孔１２ｅは、吸引孔１２ｃとは直接連通しておらず、セラミック基板１１の吸着力に影響を与えることはない。通気孔１２ｅは、印刷時に、ワーク収容部１２ａに連通する空気流路となり、ワーク収容部１２ａが負圧になるのを防ぐ。従来の技術のように、印刷時に、吸着ＯＮ／ＯＦＦの切替えをする必要がなく、簡素な構造でクリームはんだ１４のにじみ１４ｙを防止することができる。   The ventilation hole 12e does not directly communicate with the suction hole 12c and does not affect the suction force of the ceramic substrate 11. The air hole 12e serves as an air flow path that communicates with the work housing portion 12a during printing, and prevents the work housing portion 12a from becoming a negative pressure. Unlike the prior art, there is no need to switch the suction ON / OFF during printing, and the cream solder 14 can be prevented from bleeding 14y with a simple structure.

なお、図１０−１に示すように、通気孔１２ｅの径Ｄ２が、ワーク収容部１２ａの容積に対して小さすぎると、通気孔１２ｅの管路損失が増大し、ワーク収容部１２ａにおいて負圧が発生しやすくなるため、図１０−２に示すように、通気孔径Ｄ２は、吸引孔径Ｄ１の０．７倍以上とするのが望ましい。 Negative Incidentally, as shown in Figure 10-1, the diameter D 2 of the vent 12e is too small for the volume of the workpiece accommodating portion 12a, the conduit loss vent 12e is increased, the work storing section 12a since pressure is likely to occur, as shown in Figure 10-2, the vent hole diameter D 2, it is desirable to not less than 0.7 times the suction hole diameter D 1.

以上説明したように、本実施の形態のクリームはんだ印刷装置１０は、従来のワーク保持テーブル１２に通気孔１２ｅを設けるだけなので、装置の製造に当たり、高額な設備追加や制御機構の追加という、コスト的な問題は生じない。低コストで製造することができるので、クリームはんだ手印刷装置にも適用することができる。   As described above, the cream solder printing apparatus 10 according to the present embodiment is merely provided with the vent holes 12e in the conventional work holding table 12, and therefore, in the manufacture of the apparatus, the cost of adding expensive equipment or adding a control mechanism is increased. No problems arise. Since it can be manufactured at a low cost, it can also be applied to a cream solder manual printing apparatus.

以上のように、本発明にかかるクリームはんだ印刷装置は、簡易、安価な印刷装置として有用である。   As described above, the cream solder printing apparatus according to the present invention is useful as a simple and inexpensive printing apparatus.

本発明にかかるクリームはんだ印刷装置の要部分解斜視図である。It is a principal part disassembled perspective view of the cream solder printing apparatus concerning this invention. 真空発生器を接続した実施の形態のクリームはんだ印刷装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the cream solder printing apparatus of embodiment which connected the vacuum generator. スキージ送り装置を備えた実施の形態のクリームはんだ印刷装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the cream solder printing apparatus of embodiment provided with the squeegee feeder. 手刷りを行なう実施の形態のクリームはんだ印刷装置を示す縦断面図である。It is a longitudinal cross-sectional view which shows the cream solder printing apparatus of embodiment which performs hand-printing. クリームはんだ印刷装置の要部拡大縦断面図である。It is a principal part expanded longitudinal cross-sectional view of a cream solder printing apparatus. クリームはんだ印刷の工程図である。It is process drawing of cream solder printing. クリームはんだオフセット印刷の工程図である。It is process drawing of cream solder offset printing. クリームはんだコンタクト印刷の工程図である。It is process drawing of cream solder contact printing. 比較例として示す従来のクリームはんだ印刷装置の要部拡大断面図である。It is a principal part expanded sectional view of the conventional cream solder printing apparatus shown as a comparative example. クリームはんだ印刷装置の通気孔の説明図である。It is explanatory drawing of the air vent of a cream solder printing apparatus. クリームはんだ印刷装置の通気孔の説明図である。It is explanatory drawing of the air vent of a cream solder printing apparatus.

符号の説明Explanation of symbols

１０ クリームはんだ印刷装置
１１ セラミック基板（ワーク）
１１ａ セラミック基板上面
１１ｂ セラミック基板下面
１１ｃ ランド
１２ ワーク保持テーブル
１２ａ ワーク収容部（凹部、閉空間）
１２ｂ 負圧室
１２ｃ 吸引孔
１２ｄ 切欠き部
１２ｅ 通気孔
１２ｆ ワーク吸着面
１２ｇ 隙間
１２ｈ 印刷マスク載置面
１３ 印刷マスク
１３ａ 開口パターン（開口）
１３ｂ 印刷マスク下面
１４ クリームはんだ
１４ａ はんだ粉末
１４ｂ フラックス
１４ｘ ダレ
１４ｙ にじみ
１５ スキージ
１６ スキージ送り装置
１７ 真空発生器
１８ 手 10 Cream solder printer 11 Ceramic substrate (work)
11a Ceramic substrate upper surface 11b Ceramic substrate lower surface 11c Land 12 Work holding table 12a Work receiving portion (recess, closed space)
12b Negative pressure chamber 12c Suction hole 12d Notch portion 12e Vent hole 12f Workpiece suction surface 12g Clearance 12h Print mask placement surface 13 Print mask 13a Opening pattern (opening)
13b Print mask lower surface 14 Cream solder 14a Solder powder 14b Flux 14x Sag 14y Smudge 15 Squeegee 16 Squeegee feeder 17 Vacuum generator 18 Hand

Claims (2)

印刷マスク載置面と、前記印刷マスク載置面から一段低い凹部として形成され底面がワーク吸着面となるワーク収容部と、前記ワーク吸着面から一段低い凹部として形成されワークにより閉塞される負圧室と、前記負圧室を真空発生器に連通させる吸引孔と、印刷マスクが載値されて閉塞された前記ワーク収容部を外気に連通させる通気孔と、を有するワーク保持テーブルと、
前記印刷マスク上を摺動し前記印刷マスクの開口パターンを介して前記ワークにクリームはんだを印刷するスキージと、
を備えることを特徴とするクリームはんだ印刷装置。 A printing mask placement surface, a workpiece accommodating portion formed as a step lower than the printing mask placement surface and having a bottom surface serving as a workpiece suction surface, and a negative pressure formed as a depression lower than the workpiece suction surface and blocked by the workpiece. A work holding table having a chamber, a suction hole that communicates the negative pressure chamber with a vacuum generator, and a vent hole that communicates the work accommodating portion that is closed with a printing mask mounted thereon, to the outside air;
A squeegee that slides on the printing mask and prints cream solder on the workpiece through the opening pattern of the printing mask;
A cream solder printing apparatus comprising: 前記スキージを、前記印刷マスク上で摺動させるスキージ送り装置を更に備えることを特徴とする請求項１に記載のクリームはんだ印刷装置。   The cream solder printing apparatus according to claim 1, further comprising a squeegee feeding device that slides the squeegee on the printing mask.
JP2008093766A 2008-03-31 2008-03-31 Cream solder printing device Pending JP2009241525A (en)

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Application Number Priority Date Filing Date Title
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JP2008093766A JP2009241525A (en) 2008-03-31 2008-03-31 Cream solder printing device

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Application Number Title Priority Date Filing Date
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011126228A (en) * 2009-12-21 2011-06-30 Mitsubishi Electric Corp Printing machine
JP2013012588A (en) * 2011-06-29 2013-01-17 Mitsubishi Electric Corp Method of manufacturing solar battery electrode, printing machine, solar battery cell and solar battery module
US20130188002A1 (en) * 2012-01-24 2013-07-25 Yamaha Hatsudoki Kabushiki Kaisha Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device
CN114905841A (en) * 2022-04-15 2022-08-16 陕西华经微电子股份有限公司 High-precision high-temperature-resistant ceramic printing jig based on circular substrate thick film printing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011126228A (en) * 2009-12-21 2011-06-30 Mitsubishi Electric Corp Printing machine
JP2013012588A (en) * 2011-06-29 2013-01-17 Mitsubishi Electric Corp Method of manufacturing solar battery electrode, printing machine, solar battery cell and solar battery module
US20130188002A1 (en) * 2012-01-24 2013-07-25 Yamaha Hatsudoki Kabushiki Kaisha Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device
US8767025B2 (en) * 2012-01-24 2014-07-01 Yamaha Hatsudoki Kabushiki Kaisha Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device
CN114905841A (en) * 2022-04-15 2022-08-16 陕西华经微电子股份有限公司 High-precision high-temperature-resistant ceramic printing jig based on circular substrate thick film printing

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