JP2009233830A - Cutter - Google Patents

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JP2009233830A
JP2009233830A JP2008086025A JP2008086025A JP2009233830A JP 2009233830 A JP2009233830 A JP 2009233830A JP 2008086025 A JP2008086025 A JP 2008086025A JP 2008086025 A JP2008086025 A JP 2008086025A JP 2009233830 A JP2009233830 A JP 2009233830A
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diameter
small
substrate
cutter
plate
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JP5190771B2 (en
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Toshihiro Ichijo
敏博 一條
Tomoyuki Izumi
智幸 和泉
Yukio Terunuma
由喜夫 照沼
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Koki Holdings Co Ltd
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Hitachi Koki Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutter can thin its base plate and chips without reducing its overall rigidity, and suppress deflection during cutting. <P>SOLUTION: The cutter includes the base plate 1 with a mounting hole formed therein and the chips 4 containing abrasive grains bonded on the outer circumferential side of the base plate, wherein a circular small-diameter plate 3 smaller in outside diameter than the base plate 1 and having equal-diameter mounting holes 2, 3d is laminated on the base plate 1 in a concentric arc shape, and the base plate 1 and the small-diameter plate 3 are fixed at their internal circumferential sides. The diameter of the small-diameter plate 3 is smaller than a value obtained by subtracting a maximum cutting depth of the cutter from the diameter thereof. The base plate 1 and the small-diameter plate 3 are welded at a position overlapping a fixing region by a flange of a rotary tool to be attached or at a position immediately outside the fixing region. The small-diameter plate 3 has an elevated portion 3b formed on the radially outer diameter side and disposed so as to come into contact with the base plate 1 in an outermost circumferential region 3a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ディスクグラインダ等の回転工具に取付けられて使用されるカッターに関する。   The present invention relates to a cutter used by being attached to a rotary tool such as a disc grinder.

一般に切断用のカッターは、円板状の基板と、その外周縁に形成された複数の刃部から構成される。この刃部は、例えば切削刃部材である多数のチップを、円周方向に所定ピッチで基板に固着または溶接にて外周縁部分にて固定される。   In general, a cutter for cutting is composed of a disk-shaped substrate and a plurality of blade portions formed on the outer periphery thereof. The blade portion is fixed at the outer peripheral edge portion by fixing or welding a large number of chips, which are cutting blade members, for example, to the substrate at a predetermined pitch in the circumferential direction.

カッターの切削性能は、チップの厚さ、ダイヤモンドをはじめとする切削用砥粒の粒径とその含有量、切削用砥粒を固定するボンドの磨耗および強度特性、チップの形状に左右される。切削作業においては粉塵の発生や騒音を伴うため、短時間で効率良く切断できるカッターの要求が強く、この要求に対して切り刃形状の改善の他に切断面積を少なくする手法、すなわちチップの厚さを薄くすることで切削面積を少なくしたカッターの開発がなされている。切断スピードを速くするためには、基板外周部に接合されるチップの厚さを薄くして、切断時の切削抵抗を小さくすれば良いことは周知のことである。しかし、チップを薄くするには基板を薄くする必要があるが、基板が薄くなるとその剛性が低くなる。そのため、基板に焼き入れ材を用いることで強度向上を図っているが、それでも更なる基板の薄板化の要求が高い。   The cutting performance of the cutter depends on the thickness of the chip, the particle diameter and content of cutting abrasive grains including diamond, the wear and strength characteristics of the bond fixing the cutting abrasive grains, and the shape of the chip. The cutting work involves generation of dust and noise, so there is a strong demand for a cutter that can cut efficiently in a short time. In addition to improving the cutting edge shape, there is a need to reduce the cutting area, that is, the thickness of the chip. Cutters that reduce the cutting area by reducing the thickness have been developed. In order to increase the cutting speed, it is well known that the thickness of the chip bonded to the outer peripheral portion of the substrate should be reduced to reduce the cutting resistance at the time of cutting. However, in order to make the chip thinner, it is necessary to make the substrate thinner, but as the substrate becomes thinner, its rigidity becomes lower. Therefore, although the strength is improved by using a quenching material for the substrate, there is still a high demand for further thinning of the substrate.

基板を薄くすると基板の剛性が不足し、被削材を切断加工すると摩擦熱により熱膨張して内部に応力を生じたり、切断時の力が加わって撓みが発生し、狙った切断線上を真っ直ぐ切断することが難しいという問題が生じ、切断性能が低下する。また、基板の振動に起因する騒音が大きくなるおそれがある。   If the substrate is thinned, the rigidity of the substrate will be insufficient, and if the work material is cut, it will thermally expand due to frictional heat and stress will be generated inside, or bending will occur due to the force at the time of cutting, and it will be straight on the target cutting line The problem that it is difficult to cut arises, and cutting performance falls. Further, there is a risk that noise due to the vibration of the substrate will increase.

基板の撓みを防止する技術として、特許文献１には、２枚以上の金属板を張り合わせて基板を構成するカッターが開示されている。   As a technique for preventing the bending of the substrate, Patent Document 1 discloses a cutter that forms a substrate by bonding two or more metal plates together.

特開平１１‐２３５６７１号公報JP-A-11-235671

特許文献１に記載のカッターは、基板の撓みを防止することに効果があるものの、外径の等しい２枚の基板を貼り付けて、それらの外周にチップを接合しているため、チップの厚さは貼り合わせた基板２枚分の厚さよりも厚くなる。そのため、切削抵抗が大きくなり、切断スピードを速くすることが難しかった。   Although the cutter described in Patent Document 1 is effective in preventing the substrate from being bent, since the two substrates having the same outer diameter are attached and the chips are bonded to the outer periphery thereof, the thickness of the chip The thickness becomes thicker than the thickness of two bonded substrates. For this reason, the cutting resistance increases and it is difficult to increase the cutting speed.

本発明の目的は、全体としての剛性を低下させることなく、基板やチップを薄くできるカッターを提供することにある。   An object of the present invention is to provide a cutter capable of thinning a substrate or a chip without reducing the overall rigidity.

本発明の別の目的は、切断時の基板の撓みを抑制し、切り曲がりのないまっすぐな切断が可能なカッターを提供することにある。   Another object of the present invention is to provide a cutter capable of suppressing straight bending during cutting and capable of performing straight cutting without bending.

本発明の別の目的は、切断時に発生する基板の振動を減衰させ、振動や振動に起因する騒音を低減できるカッターを提供することにある。   Another object of the present invention is to provide a cutter capable of attenuating vibrations of a substrate generated during cutting and reducing vibrations and noise caused by vibrations.

本願において開示される発明のうち、代表的なものの特徴を説明すれば、次の通りである。   Of the inventions disclosed in the present application, typical features will be described as follows.

本発明の一つの特徴によれば、取付け穴が形成された略円形の基板と、基板の外周側に接合された砥粒を含むチップを備えたカッターにおいて、基板よりも外径が小さく、取付け孔を有する小径板を基板とこれらの回転中心が一致するように同心に重ね、基板と小径板を内周側において固定した。小径板は略円形であり、完全な円形を含むのはもちろんであるが、チップを形成した後に外径が円形になるカッターの基板用であれば、チップ取り付け用の突出を有する基板であっても、ここでは略円形というものとする。小径板の直径は、カッターの直径から最大切断深さを引いた径よりも小さくする。そして、基板と小径板は、取付けられる回転工具のフランジによる固定領域と重複する位置、又は、固定領域のすぐ外側の重複しない位置で溶接または接着にて固定される。溶接は電気溶接、ろう付けなど、任意の溶接方法を用いることができる。   According to one aspect of the present invention, in a cutter including a substantially circular substrate having mounting holes formed therein and a chip including abrasive grains bonded to the outer peripheral side of the substrate, the outer diameter is smaller than that of the substrate and the mounting is performed. The small-diameter plate having holes was concentrically overlapped with the substrate so that their centers of rotation coincided, and the substrate and the small-diameter plate were fixed on the inner peripheral side. The small-diameter plate is substantially circular and includes a complete circle, but of course, if it is for a cutter substrate whose outer diameter is circular after the chip is formed, it is a substrate having a chip mounting protrusion. Here, it is assumed to be substantially circular. The diameter of the small diameter plate is made smaller than the diameter obtained by subtracting the maximum cutting depth from the diameter of the cutter. And a board | substrate and a small diameter board are fixed by welding or adhesion | attachment in the position which overlaps with the fixed area | region by the flange of the rotary tool to be attached, or the position which does not overlap just outside a fixed area | region. For welding, any welding method such as electric welding or brazing can be used.

本発明の他の特徴によれば、小径板は単なる平板では無く、回転工具のフランジによる固定領域と重複する位置から外周部の間に凹凸や***部を形成する、又は、外径が角位置によって変化する、例えば歯車形や星形であるように構成する。凹凸の形状は、板厚を変えることにより形成しても良いし、板を曲げて凹凸が形成されるようにしても良い。この際、小径板の最外周領域において基板と接触するように固定すると良い。   According to another feature of the present invention, the small-diameter plate is not a mere flat plate, but has irregularities and ridges formed between the outer peripheral portion from the position overlapping with the fixing region by the flange of the rotary tool, or the outer diameter is an angular position. For example, a gear shape or a star shape. The shape of the unevenness may be formed by changing the plate thickness, or the unevenness may be formed by bending the plate. At this time, it is preferable that the outermost peripheral region of the small-diameter plate is fixed so as to be in contact with the substrate.

請求項１の発明によれば、基板よりも外径が小さく、取付け孔を有する小径板を基板と同心に重ね、基板と小径板を内周側において固定するので、基板の厚さを薄くすることができ、その結果チップが薄いカッターを実現でき、切断スピードを速くすることができる。また、基板が薄くても、小径板の重ね合わせによりカッター全体の剛性が高まり、切断時の基板の撓みを押さえることができ、切り曲がりのない、真っ直ぐな切断を行うことができる。   According to the first aspect of the present invention, the small-diameter plate having an outer diameter smaller than that of the substrate and having a mounting hole is concentrically overlapped with the substrate, and the substrate and the small-diameter plate are fixed on the inner peripheral side. As a result, a cutter with a thin chip can be realized, and the cutting speed can be increased. Further, even if the substrate is thin, the rigidity of the entire cutter is increased by overlapping the small-diameter plates, so that bending of the substrate at the time of cutting can be suppressed, and straight cutting without bending can be performed.

請求項２の発明によれば、カッターが取付けられる回転工具のフランジによる固定領域と重複する位置で、基板と小径板が固定されるので、切断時に基板が撓もうとした場合、小径板の外周部側面と圧接状態となり、基板の撓みが規制される。また、基板と小径板の当接面が僅かに擦れることで、切断時に発生する基板の振動が減衰され、切断時の振動・騒音を低減できる。   According to the invention of claim 2, since the substrate and the small-diameter plate are fixed at a position overlapping with the fixing region by the flange of the rotary tool to which the cutter is attached, the outer periphery of the small-diameter plate when the substrate is bent during cutting It will be in a press-contact state with a part side surface, and the bending of a board | substrate will be controlled. Further, since the contact surface between the substrate and the small-diameter plate is rubbed slightly, the vibration of the substrate that occurs during cutting is attenuated, and vibration and noise during cutting can be reduced.

請求項３の発明によれば、カッターが取付けられる回転工具のフランジによる固定領域の外側の近傍において、基板と小径板が固定されるので、切断時に基板が撓もうとした場合、小径板の外周部側面と圧接状態となり、基板の撓みが規制される。また、基板と小径板の当接面が僅かに擦れることで、切断時に発生する基板の振動が減衰され、切断時の振動・騒音を低減できる。   According to the invention of claim 3, since the substrate and the small-diameter plate are fixed in the vicinity of the outside of the fixed region by the flange of the rotary tool to which the cutter is attached, the outer periphery of the small-diameter plate when the substrate is bent during cutting It will be in a press-contact state with a part side surface, and the bending of a board | substrate will be controlled. Further, since the contact surface between the substrate and the small-diameter plate is rubbed slightly, the vibration of the substrate that occurs during cutting is attenuated, and vibration and noise during cutting can be reduced.

請求項４の発明によれば、小径板の最大径を、カッターの直径から最大切断深さを引いた径よりも小さくするので、小径板の外周部が被削材に接触することが無く、切削に影響を与えずにカッター全体の剛性を高めることができる。   According to the invention of claim 4, since the maximum diameter of the small diameter plate is made smaller than the diameter obtained by subtracting the maximum cutting depth from the diameter of the cutter, the outer peripheral portion of the small diameter plate does not come into contact with the work material, The rigidity of the entire cutter can be increased without affecting the cutting.

請求項５の発明によれば、小径板を円形にしたので、カッターの角位置によって重量が変化せずに、回転時のバランスをとりやすくなる。   According to the invention of claim 5, since the small-diameter plate is made circular, the weight does not change depending on the angular position of the cutter, and it becomes easy to balance during rotation.

請求項６の発明によれば、小径板には凹凸が形成されるので、切断時の放熱性を向上させることができ、蓄熱によるチップ材質の劣化を抑制し、カッターの寿命を延ばすことができる。   According to the sixth aspect of the present invention, since the irregularities are formed on the small-diameter plate, it is possible to improve the heat dissipation at the time of cutting, suppress the deterioration of the chip material due to heat storage, and extend the life of the cutter. .

請求項７の発明によれば、小径板は、最外周領域において、基板と接触するように固定されるので、基板と小径板の当接面が擦れることで、切断時に発生する基板の振動が減衰され、切断時の振動・騒音を低減することができる。   According to the invention of claim 7, since the small diameter plate is fixed so as to contact the substrate in the outermost peripheral region, the contact surface between the substrate and the small diameter plate is rubbed, so that the vibration of the substrate generated at the time of cutting is rubbed. It is attenuated and vibration and noise during cutting can be reduced.

請求項８の発明によれば、小径板は、外周の輪郭が歯車形または星形であるので、基板の外周部の形状に伴い撓みやすいところに小径板が突出するように構成でき、基板撓みやすい箇所と小径板を積極的に当接させることができ、切断時に発生する基板の振動が減衰され、切断時の振動・騒音を低減することができる。また、その最大径は前記カッターの直径から最大切断深さを引いた径よりも小さいので、小径板がカッターの切削に影響を与えることがない。   According to the invention of claim 8, since the outline of the outer periphery of the small-diameter plate is a gear shape or a star shape, the small-diameter plate can be configured to protrude at a place where the small-diameter plate is easily bent along with the shape of the outer peripheral portion of the substrate. It is possible to positively abut the easy-to-contact portion and the small-diameter plate, and the vibration of the substrate that occurs during cutting is attenuated, so that vibration and noise during cutting can be reduced. Further, since the maximum diameter is smaller than the diameter obtained by subtracting the maximum cutting depth from the diameter of the cutter, the small diameter plate does not affect the cutting of the cutter.

本発明の上記及び他の目的ならびに新規な特徴は、以下の明細書の記載及び図面から明らかになるであろう。   The above and other objects and novel features of the present invention will become apparent from the following description and drawings.

本発明に係るカッター１の実施形態を、図１〜図３を参照して説明する。図１は、本発明の実施形態に係るカッターの外観を示す図で、（１）はその正面図、（２）はその側面図である。図２は、本発明の実施形態に係るカッターの外観を示す斜視図である。図３は、図１のカッターの部分拡大図で、（１）はチップ４の取付け部付近の拡大図、（２）は***部３ｂ付近の拡大図である。   An embodiment of a cutter 1 according to the present invention will be described with reference to FIGS. Drawing 1 is a figure showing the appearance of the cutter concerning the embodiment of the present invention, (1) is the front view, and (2) is the side view. FIG. 2 is a perspective view showing an appearance of the cutter according to the embodiment of the present invention. 3 is a partially enlarged view of the cutter of FIG. 1, in which (1) is an enlarged view of the vicinity of the attachment portion of the chip 4 and (2) is an enlarged view of the vicinity of the raised portion 3b.

図１、２において、基板１は、中心に回転工具への取付け用の取付け穴２が形成された１枚の薄い円形の金属板であり、強度向上を図るため、例えば焼き入れ材を用いる。基板１の外周部には、複数のチップ４が接合される。チップ４は、ダイヤモンドを主とする硬質の砥粒をＷ、Ｃｕ、Ｎｉ、Ｃｏ、Ｓｎ、Ａｇ、などの金属粉体を混合したボンドにより焼結したものである。カッターの直径は、例えば１２５ｍｍであり、１０，０００〜１１，０００回転／分程度で回転させる。しかし、カッターの直径は切断対象に応じて、小径のものから大径のものまで様々である。   1 and 2, a substrate 1 is a thin circular metal plate in which a mounting hole 2 for mounting to a rotary tool is formed in the center. For example, a quenching material is used to improve strength. A plurality of chips 4 are bonded to the outer peripheral portion of the substrate 1. The chip 4 is obtained by sintering hard abrasive grains mainly composed of diamond by a bond in which metal powders such as W, Cu, Ni, Co, Sn, and Ag are mixed. The diameter of the cutter is, for example, 125 mm, and is rotated at about 10,000 to 11,000 rotations / minute. However, the diameter of the cutter varies from a small diameter to a large diameter depending on the object to be cut.

基板１と小径板３が同心円状に重ね合わせられる。小径板３は、基板１と同軸、同径の取付け穴３ｄを有する１枚の薄い円形の金属板であり、取付け穴３ｄの近傍付近で、複数箇所の点溶接５が施されることによって、基板１に貼り合わされる。点溶接５を施す箇所の数は、図１では６カ所であるが、基板１と小径板３の大きさに合わせて、或いは、製造上の容易性からその数を選択し、複数箇所とすれば良い。点溶接５を施す箇所は、取付け穴３ｄの外周側であって、その近傍であることが好ましく、図１の例では、図示しない回転工具に装着した際に、回転工具のフランジが接する位置の外径位置６よりも、内周部であるのが最も好ましい。しかしながら、点溶接５を施す箇所は、フランジの外径位置６上、あるいは、外径位置６よりもやや外周側であっても良い。   The substrate 1 and the small-diameter plate 3 are superimposed concentrically. The small-diameter plate 3 is a thin circular metal plate that is coaxial with the substrate 1 and has an attachment hole 3d having the same diameter, and by performing a plurality of spot welds 5 in the vicinity of the attachment hole 3d, Affixed to the substrate 1. The number of spots to be spot welded 5 is six in FIG. 1, but the number is selected according to the size of the substrate 1 and the small-diameter plate 3 or according to the ease of manufacturing. It ’s fine. The spot welding 5 is preferably on the outer peripheral side of the mounting hole 3d and in the vicinity thereof. In the example of FIG. 1, when the rotary tool is mounted on a rotary tool (not shown), The inner peripheral portion is most preferable than the outer diameter position 6. However, the spot welding 5 may be performed on the outer diameter position 6 of the flange or on the outer peripheral side slightly from the outer diameter position 6.

基板１の外周部のチップ４には、スリット８が形成される。チップ４は、図３（１）に示すように、基板１の外周よりも先端側に、突出するように取付けられた、その断面形状が略長方形状である。この長方形状の短辺の長さを短くする、即ちチップの厚さを薄くすると、被削材に食い込みやすく、切断面積を小さくすることができ、作業性が向上する。   A slit 8 is formed in the chip 4 on the outer peripheral portion of the substrate 1. As shown in FIG. 3 (1), the chip 4 is attached so as to protrude from the outer periphery of the substrate 1 so as to protrude, and has a substantially rectangular cross-sectional shape. When the length of the short side of the rectangular shape is shortened, that is, when the thickness of the chip is reduced, it is easy to bite into the work material, the cutting area can be reduced, and workability is improved.

小径板３は、その表面積を大きくするための任意の形状の凹凸又は***が施される。本実施形態では、小径板３の円周上に連続した波形の***部３ｂが形成される。また、***部３ｂの外周側、即ち、小径板３の外周部３ａの側面は、図３（２）に示すように、基板１の側面１ａに接触させるか、又は、微少距離をもって隣接させる。***部３ｂは、回転工具への取付けに影響がでない程度に大きくとることにより、空気と触れる表面積が大きくなり、冷却効果を向上できる。***部３ｂの大きさは作業性、チップ４の寿命など目的に応じて決定できる。   The small-diameter plate 3 is provided with irregularities or ridges of any shape for increasing the surface area. In the present embodiment, a continuous corrugated raised portion 3 b is formed on the circumference of the small-diameter plate 3. Further, the outer peripheral side of the raised portion 3b, that is, the side surface of the outer peripheral portion 3a of the small-diameter plate 3 is brought into contact with the side surface 1a of the substrate 1 or adjacent to each other with a small distance as shown in FIG. By making the raised portion 3b large enough not to affect the attachment to the rotary tool, the surface area in contact with air is increased, and the cooling effect can be improved. The size of the raised portion 3b can be determined according to purposes such as workability and the life of the chip 4.

小径板３の外径は、基板１の最大切り込み深さ位置７よりも小さくする。ここで、最大切り込み深さＸ（図１）は、カッターの外径から回転工具の取付け部分の大きさを引いて、２で割った値である。回転工具の取付け部分の大きさは、例えば、ディスクグラインダのキヤカバー外径などであり、使用する回転工具によってその大きさは異なる。   The outer diameter of the small-diameter plate 3 is made smaller than the maximum cutting depth position 7 of the substrate 1. Here, the maximum cutting depth X (FIG. 1) is a value obtained by subtracting the size of the mounting portion of the rotary tool from the outer diameter of the cutter and dividing by 2. The size of the mounting portion of the rotary tool is, for example, the outer diameter of the disc cover of the disc grinder, and the size varies depending on the rotary tool used.

このように小径板３の大きさを制限したことによって、回転工具を最大切り込み深さＸで使用した場合でも、小径板３は被削材に接触しない。このように小径板３は被削材に接触しないため、小径板３の半径方向中間部分の形状は比較的自由度があり、例えば、本実施形態の***部３ｂの***の高さ、即ち軸方向の厚さは、チップ４の部分の厚さを超えても良い。図１（２）では、***部３ｂと基板１を合わせた厚さは、チップ４の厚さよりも厚くなっている。   By limiting the size of the small-diameter plate 3 as described above, even when the rotary tool is used at the maximum cutting depth X, the small-diameter plate 3 does not contact the work material. Since the small-diameter plate 3 does not come into contact with the work material as described above, the shape of the intermediate portion in the radial direction of the small-diameter plate 3 has a relatively high degree of freedom. For example, the height of the bulge of the bulge portion 3b of this embodiment, that is, the shaft The thickness in the direction may exceed the thickness of the chip 4 portion. In FIG. 1 (2), the total thickness of the raised portion 3 b and the substrate 1 is greater than the thickness of the chip 4.

次に、本実施形態による小径板３を用いる効果について説明する。図４は、本実施形態に係るカッターの動きを説明するための模式図であり、寸法などは正しく描かれていない。図４（１）は、被削物を切断していない段階での位置関係を示す。図４（１）において、小径板３は、最内周から外周に向かって平坦部３ｃ、***部３ｂ、平坦部３ａが形成される。平坦部３ｃは点溶接５をするためと回転工具に取り付ける取り付け面とするために形成されるもので、小径板３の内周側に形成される。***部３ｂは主に小径板３の外周側に形成されるが、外周側だけでなく内周側に延びるように配置しても良い。平坦部３ａは小径板３の最外周側に形成するもので、その側面が基板１と接触させる面となる。このカッターは、図４（１）では回転工具のモータが右側、カッターを押さえるフランジが左側から固定されると好ましい。尚、説明の便宜上、基板１と小径板３の間に隙間が空いているように描いているが、実際には接触しているか、又は、きわめて微少な隙間で両者は隣接している。   Next, the effect of using the small diameter plate 3 according to the present embodiment will be described. FIG. 4 is a schematic diagram for explaining the movement of the cutter according to the present embodiment, and dimensions and the like are not drawn correctly. FIG. 4 (1) shows the positional relationship when the work is not cut. In FIG. 4A, the small diameter plate 3 is formed with a flat portion 3c, a raised portion 3b, and a flat portion 3a from the innermost periphery toward the outer periphery. The flat portion 3 c is formed for spot welding 5 and as an attachment surface attached to the rotary tool, and is formed on the inner peripheral side of the small diameter plate 3. The raised portions 3b are mainly formed on the outer peripheral side of the small-diameter plate 3, but may be arranged so as to extend not only on the outer peripheral side but also on the inner peripheral side. The flat portion 3 a is formed on the outermost peripheral side of the small-diameter plate 3, and the side surface thereof is a surface that contacts the substrate 1. In FIG. 4A, this cutter is preferably fixed from the right side of the motor of the rotary tool and from the left side of the flange that holds the cutter. For convenience of explanation, the gap is drawn between the substrate 1 and the small-diameter plate 3, but in actuality, they are in contact with each other or are adjacent to each other with a very small gap.

本実施形態によるカッターを使って被削材を切断すると、切断時には基板１が軸方向に撓むことにより振動する。図４（２）は左側に撓んだ状態を示す。このように切断時に基板１が撓もうとすると、小径板３の外周部３ａの側面と基板１の側面の部分領域１ａが圧接状態となり、基板１の撓みが規制される。また、切断時に発生する基板１の振動により、基板１と小径板３の当接面とが僅かに擦れる。その結果、小径板３は板バネと同様の作用で制震作用を果たすことができる。この制震作用を効果的にするために、小径板３には***部３ｂが形成されており、この***部３ｂの形状や、小径板３の材質を工夫することによって板バネとしての効果を向上させることができる。尚、小径板３の材質は、ばね性の高い材料が好ましく、例えばばね鋼が好ましい。また、小径板３は基板１と必ずしも同等の強度を有する必要はなく、基板１とは異なる材質からなるようにしても良い。また、小径板３の厚さは、基板１と必ずしも同じである必要はなく、基板１に比べて薄い板厚としても良い。   When the work material is cut using the cutter according to the present embodiment, the substrate 1 vibrates by bending in the axial direction at the time of cutting. FIG. 4 (2) shows a state bent to the left side. Thus, when the substrate 1 tries to bend at the time of cutting, the side surface of the outer peripheral portion 3a of the small-diameter plate 3 and the partial region 1a of the side surface of the substrate 1 are in a pressure contact state, and the bending of the substrate 1 is restricted. Further, the substrate 1 and the contact surface of the small-diameter plate 3 are slightly rubbed due to the vibration of the substrate 1 generated during cutting. As a result, the small-diameter plate 3 can achieve a vibration control action by the same action as the leaf spring. In order to make this damping effect effective, the small-diameter plate 3 is formed with a raised portion 3b. By devising the shape of the raised portion 3b and the material of the small-diameter plate 3, the effect as a leaf spring can be obtained. Can be improved. In addition, the material of the small diameter plate 3 is preferably a material having high spring property, for example, spring steel is preferable. Further, the small-diameter plate 3 does not necessarily have the same strength as the substrate 1 and may be made of a material different from that of the substrate 1. Further, the thickness of the small-diameter plate 3 is not necessarily the same as that of the substrate 1 and may be thinner than that of the substrate 1.

図４（３）は右側に撓んだ状態を示す。この場合は、小径板３の作用がないために、この方向に対する制震作用はほとんど期待できない。しかしながら、基板１の振動は必ず左側と右側に及ぶ振幅を有する振動であるので、左側だけの振幅を制震するだけでも、全体としての制震作用は大きいものである。尚、右側への撓みを押さえるために、基板１の両面、すなわち、右側にも小径板３を設けることも考えられる。このようにすれば、制震効果としては非常に好ましいが、基板を３枚重ねることにより厚くなりすぎて回転工具の取付け部のフランジに取付けられなくなるおそれがあること、コストが上昇してしまうこと、カッターが重くなり操作性が悪くなってしまうこと、などの理由から好ましくない。尚、これらの欠点が問題にならないような状況下においては、小径板３を基板１の両側に設けるようにしても良い。   FIG. 4 (3) shows a state bent to the right. In this case, since there is no action of the small-diameter plate 3, almost no vibration control action in this direction can be expected. However, since the vibration of the substrate 1 is always vibration having an amplitude extending to the left side and the right side, even if only the amplitude of the left side is controlled, the overall damping effect is large. In order to suppress the bending to the right side, it is also conceivable to provide the small-diameter plate 3 on both sides of the substrate 1, that is, on the right side. In this way, it is very preferable as a seismic control effect, but it may become too thick to be attached to the flange of the mounting part of the rotary tool by stacking three substrates, and the cost will increase. It is not preferable because the cutter becomes heavy and the operability is deteriorated. Note that the small-diameter plate 3 may be provided on both sides of the substrate 1 in a situation where these drawbacks do not become a problem.

本実施形態によれば、基板全体としての剛性を低下させることなく、外周部にチップ４を接合する基板１を薄くすることができるので、チップ４の厚さを薄くすることができる。このため、チップ４の薄いカッターが提供でき、コンクリートやタイルなどの切断作業において、切断スピートが速くなり、作業効率を向上させることができる。さらに、小径板の重ね合わせにより、基板全体の剛性が高くなるため、切断時の基板１の撓みが抑制され、切り曲がりのない、真っ直ぐな切断が可能になる。   According to this embodiment, since the board | substrate 1 which joins the chip | tip 4 to an outer peripheral part can be made thin, without reducing the rigidity as the whole board | substrate, the thickness of the chip | tip 4 can be made thin. For this reason, a cutter with a thin chip 4 can be provided, and in cutting work such as concrete or tile, cutting speed can be increased and work efficiency can be improved. Furthermore, since the rigidity of the entire substrate is increased by overlapping the small-diameter plates, the bending of the substrate 1 during cutting is suppressed, and straight cutting without bending is possible.

また、基板１と小径板３の当接面が僅かに擦れることで、切断時に発生する基板１の振動が減衰され、振動が低減されると共に、振動に起因する騒音も低減することができる。さらに、小径板３に波形などの凹凸形状を施して表面積を大きくすることができるので、切断時の放熱性を向上させ、蓄熱によるチップ材質の劣化を抑制し、カッターの寿命を延ばすことができる。また、凹凸形状にしたことにより切断時に小径板がフィンの役割を果たし、半径方向外方への風を発生させるため、チップ４の更なる放熱性の向上と、発生する切り粉を効率良く排出することが可能になる。   Moreover, since the contact surface of the board | substrate 1 and the small diameter board 3 rubs slightly, the vibration of the board | substrate 1 which generate | occur | produces at the time of a cutting | disconnection is attenuated, vibration can be reduced, and the noise resulting from a vibration can also be reduced. Furthermore, since the surface area can be increased by giving the corrugated shape or the like to the small-diameter plate 3, it is possible to improve the heat dissipation during cutting, suppress the deterioration of the chip material due to heat storage, and extend the life of the cutter. . In addition, because of the concave and convex shape, the small-diameter plate plays the role of fins when cutting and generates a radially outward wind, further improving the heat dissipation of the chip 4 and efficiently discharging generated chips. It becomes possible to do.

次に図５を用いて、溶接箇所について説明する。図５は、本実施形態に係るカッターの溶接箇所を説明するための図である。図５においては、説明の便宜上チップ４の記載を省略している。また、寸法を除いて各部を模式的に記載している。図５において、基板１と小径板３は、３カ所の点溶接５によって接合される。点溶接される箇所は、ある程度の直径を有する円領域であり、（１）の例では回転工具の取付け部のフランジ（図示せず）の外径位置６より内周側に位置し、（２）の例では外径位置６と重複する位置にあり、（３）は外径位置６の近くの外周側に位置する。前述したように、小径板３のバネ効果は、主に点溶接した箇所から小径板の外周までの距離ｂの範囲で発揮されるため、（３）の最内周から点溶接した箇所までの距離ａと距離ｂの大きさがａ＜ｂの関係であることが望ましい。従って、本実施例では（１）〜（３）のいずれの溶接箇所も、小径板を内周側（ａ＜ｃ／２）に配置している。   Next, a welding location will be described with reference to FIG. FIG. 5 is a view for explaining a welding portion of the cutter according to the present embodiment. In FIG. 5, the description of the chip 4 is omitted for convenience of explanation. Moreover, each part is typically described except the dimension. In FIG. 5, the substrate 1 and the small-diameter plate 3 are joined by spot welding 5 at three locations. The spot-welded portion is a circular region having a certain diameter. In the example of (1), it is located on the inner peripheral side from the outer diameter position 6 of the flange (not shown) of the mounting portion of the rotary tool, (2 In the example of (), the outer diameter position 6 is overlapped, and (3) is located on the outer peripheral side near the outer diameter position 6. As described above, the spring effect of the small-diameter plate 3 is exerted mainly in the range of the distance b from the spot-welded location to the outer periphery of the small-diameter plate, so that from (3) the innermost circumference to the spot-welded location. It is desirable that the distances a and b have a relationship of a <b. Therefore, in this embodiment, the small-diameter plate is arranged on the inner peripheral side (a <c / 2) in any of the welding locations (1) to (3).

尚、上述の条件から外れても距離ｂがある程度確保されていればバネ効果を有する。一方、ａ＞ｂとすると基板１と小径板３を強固に接合することになるので基板の強度アップが図れる。よって基板の強度アップを目的とするか、基板の振動防止を目的とするかに応じてａとｂの長さ関係を適宜設定すればよい。また、点溶接される箇所の数は、本実施形態では３つであるが、複数以上であれば任意の箇所で接合しても良い。また、実施形態では点溶接する箇所をすべて同じ半径の円周上に配置したが、必ずしもこれに限定されずに、複数の半径の円周上に配置するようにしても良い。   In addition, even if it deviates from the above-mentioned conditions, if the distance b is secured to some extent, it has a spring effect. On the other hand, if a> b, the substrate 1 and the small-diameter plate 3 are firmly bonded, so that the strength of the substrate can be increased. Therefore, the length relationship between a and b may be appropriately set depending on whether the purpose is to increase the strength of the substrate or to prevent vibration of the substrate. Moreover, although the number of the spot-welded places is three in this embodiment, as long as it is more than one, you may join in arbitrary places. Further, in the embodiment, all the spots to be spot-welded are arranged on the circumference of the same radius, but the present invention is not necessarily limited thereto, and may be arranged on the circumference of a plurality of radii.

次に図６を用いて、本発明の第２の実施形態を説明する。第２の実施形態では、いわゆるセグメントタイプのカッターで、スリット１８を有する略円形の基板１１に小径板１３を重ねて、３カ所の点溶接５で接合したものである。前述した第１の実施形態と異なり、ここでは小径板１３には凹凸はなく、平らな板である。しかし、その外径は、円でなく、外側に突出する突出部１３ａと内側に窪んでいる引っ込み部１３ｂが交互に形成された、いわば歯車のような形状である。基板１１と小径板１３は、接触した状態で接合されるか、或いは、ほんの僅かな隙間を有するように接合される。本実施形態においては、切削時に基板１１が振動した際に、小径板１３の突出部１３ａが基板１３に接触することによって制震作用を果たす。特に、本実施形態では、基板１自体にスリット１８が形成されたセグメントタイプのカッターであるので、各セグメント部の振動が出やすい。よって、基板１のブレード状に延在している箇所に突出部１３ａが位置し、引っ込み部１３ｂはスリット１８の穴１９に対応する位置になるように配置すれば、振動する各セグメントを効果的に制振することができる。   Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, a so-called segment type cutter is formed by superposing a small-diameter plate 13 on a substantially circular substrate 11 having slits 18 and joining them by spot welding 5 at three locations. Unlike the above-described first embodiment, the small-diameter plate 13 is not flat and has a flat plate here. However, the outer diameter is not a circle, but a so-called gear shape in which protruding portions 13a protruding outward and recessed portions 13b recessed inward are alternately formed. The board | substrate 11 and the small diameter board 13 are joined in the state which contacted, or are joined so that there may be only a slight clearance gap. In this embodiment, when the board | substrate 11 vibrates at the time of cutting, the protrusion part 13a of the small diameter board 13 will contact the board | substrate 13, and a damping effect will be achieved. In particular, in this embodiment, since it is a segment type cutter in which the slit 18 is formed in the substrate 1 itself, vibration of each segment portion is likely to occur. Therefore, if the protruding portion 13a is located at a portion extending in a blade shape of the substrate 1 and the retracting portion 13b is arranged so as to correspond to the hole 19 of the slit 18, each vibrating segment is effective. Can be controlled.

第２の実施形態では、小径板１３は平板であるので製造コストを安くすることができ、小径板１３の外周部の形状を、基板１１の形状に対応させるだけで良く、簡単な構成で切断時の基板の撓みを押さえることができる。尚、小径板１３の形状は、歯車のような形状だけにとどまらず、星形、花形、正多角形など、円ではない形状でも良いが、小径板１３もカッターと共に回転する関係上、回転させてもバランスのとれる形状であることが望ましい。   In the second embodiment, since the small-diameter plate 13 is a flat plate, the manufacturing cost can be reduced. The shape of the outer peripheral portion of the small-diameter plate 13 only needs to correspond to the shape of the substrate 11 and is cut with a simple configuration. The bending of the substrate at the time can be suppressed. The shape of the small-diameter plate 13 is not limited to the shape like a gear, but may be a non-circular shape such as a star shape, a flower shape, or a regular polygon. However, the small-diameter plate 13 is also rotated because it rotates together with the cutter. However, it is desirable that the shape be balanced.

以上の説明から明らかなように、本発明によれば、基板の厚さを薄くしてチップ厚さも薄いカッターとすることができ、切断スピードを速くすることができる。また、基板が薄くても、小径板の重ね合わせによりカッター全体の剛性が高まり、切断時の基板の撓みを押さえることができ、切り曲がりのない、真っ直ぐな切断を行うことができる。   As is apparent from the above description, according to the present invention, the thickness of the substrate can be reduced and the cutter can be made thin, and the cutting speed can be increased. Further, even if the substrate is thin, the rigidity of the entire cutter is increased by overlapping the small-diameter plates, so that bending of the substrate at the time of cutting can be suppressed, and straight cutting without bending can be performed.

さらに、本発明によれば、切断時に基板が撓もうとした場合、小径板の外周部側面と圧接状態となり、基板の撓みが規制される。また、基板と小径板の当接面が僅かに擦れることで、切断時に発生する基板の振動が減衰され、切断時の振動・騒音を低減することができる。   Further, according to the present invention, when the substrate is to be bent at the time of cutting, the substrate is brought into pressure contact with the side surface of the outer peripheral portion of the small-diameter plate, and the bending of the substrate is restricted. Further, since the contact surface between the substrate and the small-diameter plate is slightly rubbed, the vibration of the substrate that occurs during cutting is attenuated, and vibration and noise during cutting can be reduced.

以上、本発明を示す実施形態に基づき説明したが、本発明は上述の形態に限定されるものではなく、その趣旨を逸脱しない範囲内で種々の変更が可能である。   As mentioned above, although demonstrated based on embodiment which shows this invention, this invention is not limited to the above-mentioned form, A various change is possible within the range which does not deviate from the meaning.

たとえば、小径板３、１３の取付け穴３ｄ、１３ｄの大きさは、基板１、１１の取り付け穴２、１２と完全に同じである必要はなく、異なってもよい。一般に基板１、１１の取り付け穴２、１２はカッターとしての取り付け位置あわせに重要であるが、小径板３、１３の取付け穴３ｄ、１３ｄは取り付け位置あわせにはさほど重要ではないので、取り付け穴２、１２よりもやや大きくしても良い。また、小径板３、１３の取付け穴３ｄ、１３ｄを比較的大きめにして、フランジの外径位置６よりも大きくしても良い。   For example, the sizes of the mounting holes 3d and 13d of the small diameter plates 3 and 13 do not have to be completely the same as the mounting holes 2 and 12 of the substrates 1 and 11, and may be different. In general, the mounting holes 2 and 12 of the substrates 1 and 11 are important for adjusting the mounting position as a cutter, but the mounting holes 3d and 13d of the small diameter plates 3 and 13 are not so important for adjusting the mounting position. , 12 may be slightly larger. Further, the mounting holes 3d and 13d of the small diameter plates 3 and 13 may be made relatively large so as to be larger than the outer diameter position 6 of the flange.

さらに、本実施形態では、いわゆるリムタイプの基板１（図１）には外形が円形の小径板３を用い、いわゆるセグメントタイプの基板１１（図６）には外形が歯車形の小径板１３を用いたが、これらの組み合わせはこれらに限られず、違う組合せであっても良い。   Furthermore, in this embodiment, a small diameter plate 3 having a circular outer shape is used for the so-called rim type substrate 1 (FIG. 1), and a small diameter plate 13 having a gear shape is used for the so-called segment type substrate 11 (FIG. 6). However, these combinations are not limited to these, and may be different combinations.

本発明の実施形態に係るカッターの外観を示す図で、（１）はその正面図、（２）はその側面図である。It is a figure which shows the external appearance of the cutter which concerns on embodiment of this invention, (1) is the front view, (2) is the side view. 本発明の実施形態に係るカッターの外観を示す斜視図である。It is a perspective view which shows the external appearance of the cutter which concerns on embodiment of this invention. 図１のカッターの部分拡大図で、（１）はチップ４の取付け部付近の拡大図、（２）は***部３ｂ付近の拡大図である。FIG. 2 is a partially enlarged view of the cutter of FIG. 1, (1) is an enlarged view of the vicinity of the attachment portion of the chip 4, and (2) is an enlarged view of the vicinity of the raised portion 3 b. 本実施形態に係るカッターの動きを説明するための模式図である。It is a schematic diagram for demonstrating the motion of the cutter which concerns on this embodiment. 本実施形態に係るカッターの溶接箇所を説明するための図である。It is a figure for demonstrating the welding location of the cutter which concerns on this embodiment. 本発明の第２の実施形態に係るカッターの外観を示す図で、（１）はその正面図、（２）はその側面図である。It is a figure which shows the external appearance of the cutter which concerns on the 2nd Embodiment of this invention, (1) is the front view, (2) is the side view.

符号の説明Explanation of symbols

１、１１ 基板 ２、１２ 取付け穴 ３、１３ 小径板
３ａ （小径板の）外周部 ３ｂ（小径板の）***部
３ｃ （小径板の）平坦部 ３ｄ（小径板の）取付け穴
４ チップ ５ 点溶接 ６ （フランジの）外径位置
７ 最大切り込み深さ位置 ８ スリット １３ａ （小径版の）突出部
１３ｂ （小径版の）引っ込み部 １３ｄ （小径板の）取付け穴
１４ チップ １８ スリット １９ 穴 1, 11 Substrate 2, 12 Mounting hole 3, 13 Small diameter plate 3a (small diameter plate) outer peripheral portion 3b (small diameter plate) raised portion 3c (small diameter plate) flat portion 3d (small diameter plate) mounting hole 4 Tip 5 points Welding 6 Outer diameter position (of flange) 7 Maximum cutting depth position 8 Slit 13a Protruding portion 13b (for small diameter plate) Recessed portion 13d (for small diameter plate) Mounting hole 14 Tip 18 Slit 19 hole

Claims (8)

取付け穴が形成された略円形の基板と、該基板の外周側に接合された砥粒を含むチップを備えたカッターにおいて、
前記基板よりも外径が小さく、取付け孔を有する小径板を前記基板と同心に重ね、
前記基板と前記小径板を内周側において固定したことを特徴とするカッター。 In a cutter having a substantially circular substrate in which mounting holes are formed, and a chip including abrasive grains bonded to the outer peripheral side of the substrate,
The outer diameter is smaller than the substrate, a small-diameter plate having a mounting hole is concentrically stacked with the substrate,
A cutter characterized in that the substrate and the small-diameter plate are fixed on the inner peripheral side. 前記基板と前記小径板は、取付けられる回転工具のフランジによる固定領域と重複する位置で、固定されることを特徴とする請求項１に記載のカッター。   The cutter according to claim 1, wherein the substrate and the small-diameter plate are fixed at a position overlapping with a fixing region by a flange of a rotary tool to be attached. 前記基板と前記小径板は、取付けられる回転工具のフランジによる固定領域の外側の近傍において、固定されることを特徴とする請求項１に記載のカッター。   The cutter according to claim 1, wherein the substrate and the small-diameter plate are fixed in the vicinity of the outside of a fixed region by a flange of a rotary tool to be attached. 前記小径板の最大径は、前記カッターの直径から最大切断深さを引いた径よりも小さいことを特徴とする請求項２又は３に記載のカッター。   The cutter according to claim 2 or 3, wherein a maximum diameter of the small-diameter plate is smaller than a diameter obtained by subtracting a maximum cutting depth from the diameter of the cutter. 前記小径板は円形であることを特徴とする請求項４に記載のカッター。   The cutter according to claim 4, wherein the small-diameter plate is circular. 前記小径板は、凹凸が形成されることを特徴とする請求項１〜５のいずれか一項に記載のカッター。   6. The cutter according to any one of claims 1 to 5, wherein the small-diameter plate is formed with irregularities. 前記小径板は、最外周領域において、前記基板と接触するように固定されることを特徴とする請求項１〜６のいずれか一項に記載のカッター。   The said small diameter board is fixed so that it may contact with the said board | substrate in an outermost periphery area | region, The cutter as described in any one of Claims 1-6 characterized by the above-mentioned. 前記小径板は、外周の輪郭が歯車形または星形であることを特徴とする請求項４に記載のカッター。   The cutter according to claim 4, wherein the outer diameter of the small-diameter plate is a gear shape or a star shape.
JP2008086025A 2008-03-28 2008-03-28 cutter Expired - Fee Related JP5190771B2 (en)

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JP2011137348A (en) * 2009-12-30 2011-07-14 Takamatsu Kk Method for repairing groove upper structure, cutting disk and method for setting groove lid
JP2013129953A (en) * 2011-12-20 2013-07-04 Bestem Service Co Ltd Dry process for horizontal cutting expansion joint, and concrete cutter
WO2014152063A1 (en) * 2013-03-15 2014-09-25 Western Saw Manufacturers, Inc. Laminated blade cores
JP2016005851A (en) * 2014-06-20 2016-01-14 ダイヤテック株式会社 Rotary blade

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JPH0331568B2 (en) * 1986-05-07 1991-05-07 Nippon Hume Pipe
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JPH0885066A (en) * 1994-09-16 1996-04-02 Osaka Diamond Ind Co Ltd Super abrasive particle blade and menufacture thereof
WO2002051605A1 (en) * 2000-12-26 2002-07-04 Diapeople Incorporation, Ltd. Anti-noise saw equipped with vibration-proof material
GB2382544A (en) * 2001-11-30 2003-06-04 Turbolite Ag Rotary cutting blade
JP2003175467A (en) * 2001-12-10 2003-06-24 Asahi Diamond Industrial Co Ltd Off-set type cutter, and cover for the same

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Publication number Priority date Publication date Assignee Title
JPS61144958U (en) * 1985-02-27 1986-09-06
JPH0331568B2 (en) * 1986-05-07 1991-05-07 Nippon Hume Pipe
JPH0885065A (en) * 1994-09-16 1996-04-02 Osaka Diamond Ind Co Ltd Super abrasive grain blade
JPH0885066A (en) * 1994-09-16 1996-04-02 Osaka Diamond Ind Co Ltd Super abrasive particle blade and menufacture thereof
WO2002051605A1 (en) * 2000-12-26 2002-07-04 Diapeople Incorporation, Ltd. Anti-noise saw equipped with vibration-proof material
GB2382544A (en) * 2001-11-30 2003-06-04 Turbolite Ag Rotary cutting blade
JP2003175467A (en) * 2001-12-10 2003-06-24 Asahi Diamond Industrial Co Ltd Off-set type cutter, and cover for the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011137348A (en) * 2009-12-30 2011-07-14 Takamatsu Kk Method for repairing groove upper structure, cutting disk and method for setting groove lid
JP2013129953A (en) * 2011-12-20 2013-07-04 Bestem Service Co Ltd Dry process for horizontal cutting expansion joint, and concrete cutter
WO2014152063A1 (en) * 2013-03-15 2014-09-25 Western Saw Manufacturers, Inc. Laminated blade cores
JP2016005851A (en) * 2014-06-20 2016-01-14 ダイヤテック株式会社 Rotary blade

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