JP2009200236A - Board with contact terminal, ic memory card, and manufacturing method of board with contact terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology capable of inexpensively and easily achieving evenness of gloss of a contact terminal, in a board with contact terminals for an IC memory card. <P>SOLUTION: This manufacturing method of a board with contact terminals is characterized by providing a hard gold-plated terminal 11 by subjecting a surface of hard electric gold plating 15b applied to a contact terminal 14 to a satin finished surface treatment. This board with contact terminals, and this IC memory card equipped with the board with contact terminals are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ＩＣメモリーカード用の接触端子付き基板、この接触端子付き基板を具備してなるＩＣメモリーカード、接触端子を具備する接触端子付き基板の製造方法に関する。   The present invention relates to a substrate with a contact terminal for an IC memory card, an IC memory card comprising the substrate with a contact terminal, and a method for producing a substrate with a contact terminal comprising a contact terminal.

ＩＣメモリーカードは書き込みや読み出しのための駆動装置を必要としないので低消費電力型の記憶媒体である。また軽量、薄型、小型であるため携帯用電子機器、例えばデジタルカメラ、携帯音楽プレーヤー、電子辞書、携帯電話、携帯情報端末等に広く用いられている。また、パソコン、プリンタ等の機器に、ＩＣメモリーカードの接続用のコネクタ部を設けることも広く普及している。
ＩＣメモリーカードとしては種々の呼称のものがあるが、いずれも半導体メモリを記憶媒体に使用したものである。これらのＩＣメモリーカードには電子機器（例えば、既述の携帯用電子機器、パソコン、プリンタ等）との接続のために接触型の端子が複数設けられている。
例えば特許文献１にはメモリーカードの接触端子の例が開示されている。接触端子表面には接触抵抗が低く接触抵抗の変化が少ない金属である金めっき膜が施されている。ＩＣメモリーカードは電子機器のコネクタ部に挿入して使用される。メモリーカードはコネクタ部に設けられているスロットに挿抜可能に差し込まれる。メモリーカードがスロットに差し込まれると、メモリーカードの接触端子が、スロット内に設けられている弾性片端子と接触される。これにより、電子機器内の電子回路とＩＣメモリーカード側の配線との電気導通が確保される。
また、端子は使用者の目に触れる露出した形でＩＣメモリーカードに設けられていることが一般的である。
特開２００２−２６４７８号公報 The IC memory card is a low power consumption type storage medium because it does not require a drive device for writing and reading. In addition, since it is lightweight, thin, and small, it is widely used in portable electronic devices such as digital cameras, portable music players, electronic dictionaries, mobile phones, and portable information terminals. It is also widespread to provide a connector portion for connecting an IC memory card to a device such as a personal computer or a printer.
There are various names of IC memory cards, but all use semiconductor memory as a storage medium. These IC memory cards are provided with a plurality of contact-type terminals for connection with electronic devices (for example, the aforementioned portable electronic devices, personal computers, printers, etc.).
For example, Patent Document 1 discloses an example of a contact terminal of a memory card. The surface of the contact terminal is provided with a gold plating film which is a metal with low contact resistance and little change in contact resistance. An IC memory card is used by being inserted into a connector portion of an electronic device. The memory card is removably inserted into a slot provided in the connector portion. When the memory card is inserted into the slot, the contact terminal of the memory card is brought into contact with the elastic piece terminal provided in the slot. Thereby, electrical conduction between the electronic circuit in the electronic device and the wiring on the IC memory card side is ensured.
In general, the terminal is provided on the IC memory card in an exposed form so as to be in contact with the eyes of the user.
JP 2002-26478 A

上記の通りＩＣメモリーカードの接触端子表面には金めっきが施されている。この金めっきは、光沢剤を含むめっき浴を使用した光沢電気金めっきによって接触端子表面に施すことが一般的である。金めっきは製品の品質イメージに強い影響を与える因子の一つである。接点としての機能に問題が無くても外観が均一でないものは不良品として排除される。高価な金めっきを施した後に不良品になるので製造コストへの影響は大きい。
金めっきの外観が不均一になる原因としては、めっき前の接触端子表面のバフ研磨工程によって形成される微小な研磨筋が金めっきの表面状態に影響を与えることが挙げられる。しかしながら研磨筋の影響を解消することは容易ではない。このため、低コストで実現できる有効な対策が求められていた。 As described above, the surface of the contact terminal of the IC memory card is plated with gold. This gold plating is generally applied to the contact terminal surface by bright electrogold plating using a plating bath containing a brightener. Gold plating is one of the factors that have a strong influence on the product quality image. Even if there is no problem in the function as a contact point, a non-uniform appearance is eliminated as a defective product. Since it becomes a defective product after expensive gold plating, the influence on the manufacturing cost is great.
The cause of the non-uniform appearance of the gold plating is that the fine polishing streaks formed by the buffing process on the contact terminal surface before plating affects the surface condition of the gold plating. However, it is not easy to eliminate the influence of abrasive lines. For this reason, an effective measure that can be realized at low cost has been demanded.

本発明は、上述の課題に鑑みて、端子表面の外観の均一性を低コストで安定に確保できるＩＣメモリーカード用の接触端子付き基板、この接触端子付き基板を具備してなるＩＣメモリーカード、接触端子を具備する接触端子付き基板の製造方法を提供することを目的とする。   In view of the above-described problems, the present invention provides a substrate with a contact terminal for an IC memory card that can stably ensure the uniformity of the appearance of the terminal surface at low cost, an IC memory card comprising the substrate with a contact terminal, It aims at providing the manufacturing method of the board | substrate with a contact terminal which comprises a contact terminal.

本発明は、上記課題を解決するため、以下の手段を提供する。
第１の発明は、ＩＣメモリーカード用の接触端子付き基板であって、配線基板に設けられた接触端子が硬質電気金めっきを表層とするめっき膜で被覆され、前記硬質電気金めっきの表面が梨地状とされていることを特徴とする接触端子付き基板を提供する。
第２の発明は、前記硬質電気金めっき表面は、該硬質電気金めっき表面に入射角４５度で照射した入射光の反射光を受光器で受光して、前記入射光に対する反射角４５±２５度の角度範囲について反射光強度分布を解析した場合に、反射角４５±２５度の範囲の全受光量Ａと、反射角４５±３度の範囲の全受光量ＢとがＢ／Ａ≦０．４を満たす梨地表面であることを特徴とする第１の発明の接触端子付き基板を提供する。
第３の発明は、梨地状表面を有する前記硬質電気金めっきが、光沢電気めっきによって得られた硬質電気金めっき膜の表面を、ジェットスクラブ処理又は液体ホーニング処理によって梨地状としたものであることを特徴とする第１又は第２の発明の接触端子付き基板を提供する。
第４の発明は、前記めっき膜が、前記接触端子の表面に形成されたニッケルめっきと、このニッケルめっきを覆うように形成された前記硬質電気金めっきとを具備する多層めっき膜であることを特徴とする第１〜３のいずれかの発明の接触端子付き基板を提供する。
第５の発明は、前記配線基板は、絶縁樹脂板の表面に、補強繊維によってメッシュ状に形成された補強材が樹脂中に埋め込まれてなる補強層を備え、パッド状の前記接触端子が前記補強層上に形成されていることを特徴とする第１〜４のいずれかの発明の接触端子付き基板を提供する。
第６の発明は、第１〜５のいずれかの発明の接触端子付き基板を具備することを特徴とするＩＣメモリーカードを提供する。
第７の発明は、硬質電気金めっきを表層とするめっき膜で被覆された接触端子を具備する接触端子付き基板の製造方法であって、配線基板に設けられている接触端子に、硬質電気金めっきを表層とするめっき膜を形成するめっき工程と、前記硬質電気金めっきの表面を、ジェットスクラブ処理又は液体ホーニング処理によって梨地状とする梨地処理工程とを具備することを特徴とする接触端子付き基板の製造方法を提供する。
第８の発明は、前記めっき工程は、光沢剤を含むめっき浴を用いる光沢電気めっきによって前記接触端子に電気ニッケルめっきを施すニッケルめっき工程と、前記ニッケルめっき工程にて得た前記電気ニッケルめっきの表面に、光沢剤を含むめっき浴を用いる光沢電気めっきによって前記硬質電気金めっきを施す硬質電気金めっき工程とを具備することを特徴とする第７の発明の接触端子付き基板の製造方法を提供する。
第９の発明は、前記梨地処理工程にて、前記硬質電気金めっきに、該硬質電気金めっき表面に入射角４５度で照射した入射光の反射光を受光器で受光して、前記入射光に対する反射角４５±２５度の角度範囲について反射光強度分布を解析した場合に、反射角４５±２５度の範囲の全受光量Ａと、反射角４５±３度の範囲の全受光量ＢとがＢ／Ａ≦０．４を満たす梨地表面を形成することを特徴とする第７又は第８の発明の接触端子付き基板の製造方法を提供する。
第１０の発明は、前記接触端子をバフ研磨する研磨工程を行ってから前記めっき工程を行うことを特徴とする第７〜９のいずれかの発明の接触端子付き基板の製造方法を提供する。 The present invention provides the following means in order to solve the above problems.
1st invention is a board | substrate with a contact terminal for IC memory cards, Comprising: The contact terminal provided in the wiring board is coat | covered with the plating film which makes hard electrogold plating a surface layer, The surface of the said hard electrogold plating is Provided is a substrate with a contact terminal which is characterized by a satin finish.
According to a second aspect of the present invention, the hard electrogold plating surface receives reflected light of incident light irradiated onto the hard electrogold plating surface at an incident angle of 45 degrees with a light receiver, and a reflection angle of 45 ± 25 with respect to the incident light. When the reflected light intensity distribution is analyzed for an angular range of degrees, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees are B / A ≦ 0 The substrate with contact terminals according to the first aspect of the present invention is provided with a satin surface satisfying .4.
According to a third aspect of the present invention, the hard electrogold plating having a satin-like surface is obtained by making the surface of a hard electrogold plating film obtained by gloss electroplating into a satin-like state by a jet scrub treatment or a liquid honing treatment. A substrate with a contact terminal according to the first or second invention is provided.
4th invention is that the said plating film is a multilayer plating film which comprises the nickel plating formed in the surface of the said contact terminal, and the said hard electrogold plating formed so that this nickel plating might be covered A substrate with a contact terminal according to any one of the first to third aspects of the invention is provided.
According to a fifth aspect of the present invention, the wiring board includes a reinforcing layer in which a reinforcing material formed in a mesh shape with reinforcing fibers is embedded in a resin on a surface of an insulating resin plate, and the pad-shaped contact terminal includes the pad-shaped contact terminal. Provided is a substrate with a contact terminal according to any one of the first to fourth aspects, wherein the substrate is formed on a reinforcing layer.
A sixth invention provides an IC memory card comprising the substrate with contact terminals of any one of the first to fifth inventions.
7th invention is a manufacturing method of the board | substrate with a contact terminal which comprises the contact terminal coat | covered with the plating film which makes hard electrogold plating a surface layer, Comprising: A hard electrical gold is provided in the contact terminal provided in the wiring board. With a contact terminal, comprising: a plating step for forming a plating film having plating as a surface layer; and a satin finish treatment step in which the surface of the hard electrogold plating is made into a satin finish by jet scrub treatment or liquid honing treatment A method for manufacturing a substrate is provided.
In an eighth aspect of the invention, the plating step includes a nickel plating step in which the contact terminals are electronicked by gloss electroplating using a plating bath containing a brightener, and the electronickel plating obtained in the nickel plating step. A method of manufacturing a substrate with a contact terminal according to a seventh aspect of the present invention, comprising: a hard electrogold plating step of applying the hard electrogold plating by gloss electroplating using a plating bath containing a brightener on the surface. To do.
In a ninth aspect of the present invention, in the matte treatment step, reflected light of incident light irradiated on the surface of the hard electrogold plating at an incident angle of 45 degrees is received by the light receiver on the hard electrogold plating, and the incident light When the reflected light intensity distribution is analyzed with respect to the angle range of 45 ± 25 degrees with respect to the angle, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees The present invention provides a method for manufacturing a substrate with a contact terminal according to the seventh or eighth invention, wherein a satin finish surface satisfying B / A ≦ 0.4 is formed.
A tenth aspect of the invention provides the method for manufacturing a substrate with a contact terminal according to any one of the seventh to ninth aspects, wherein the plating step is performed after performing a polishing step of buffing the contact terminal.

硬質電気金めっきとしては、金以外の異種金属として、コバルト、鉄、ニッケル、インジウムから選択される１以上を微量に含むものである。硬質電気金めっき（硬質電気金めっき膜）に含まれる前記異種金属の含有量は０．０５％〜１％（重量％）の範囲である。   The hard electrogold plating includes a trace amount of one or more selected from cobalt, iron, nickel, and indium as different metals other than gold. The content of the different metal contained in the hard electrogold plating (hard electrogold plating film) is in the range of 0.05% to 1% (% by weight).

本発明では、接触端子に施した硬質金めっきの表面を梨地処理（例えば、ジェットスクラブ処理、液体ホーニング処理）して、梨地表面を有する硬質電気金めっき膜を得る。
硬質電気金めっき表面は、梨地処理前は高い光反射率を有しているが、梨地処理によって照射光の散乱率が高められる。梨地処理によって、微細な凹凸を均一に形成させた、艶消し仕上げの梨地表面が得られる。その結果、いわば半光沢の状態となる。
硬質電気金めっき表面が梨地仕上げであることによって光沢ムラが抑制され、外観の光沢が均一な端子（硬質金めっき付き接触端子）を持つ接触端子付き基板、ＩＣメモリーカードを提供することができる。
なお、本明細書において、光沢が均一、とは、目視においてどの方向から見ても光沢ムラが殆どあるいは全く確認できない状態を指す。 In the present invention, the surface of the hard gold plating applied to the contact terminals is subjected to a matte treatment (for example, a jet scrub treatment or a liquid honing treatment) to obtain a hard electrogold plating film having a matte surface.
The hard electrogold plating surface has a high light reflectance before the satin treatment, but the scattering rate of irradiation light is increased by the satin treatment. By the matte finish, a matte finish satin surface with uniform fine irregularities is obtained. As a result, a semi-gloss state is obtained.
By providing the matte finish on the surface of the hard electroplated gold, it is possible to provide a substrate with a contact terminal and an IC memory card having terminals (contact terminals with hard gold plating) with uniform luster on the appearance and gloss unevenness.
In the present specification, “uniform gloss” refers to a state in which little or no gloss unevenness can be confirmed by visual observation from any direction.

本発明によれば、外観の光沢が均一な端子（硬質金めっき付き接触端子）を持つ接触端子付き基板、ＩＣメモリーカードを提供することができる。製造上、外観の光沢が不均一であることのみを原因とする不良品の処理数を減少させることができ、製造コストの低減を実現できる。外観の光沢が均一な端子（硬質金めっき付き接触端子）によって、ＩＣメモリーカードの品質イメージの確保に有効に寄与する。
また、硬質電気金めっきを表層とするめっき膜で被覆された接触端子（硬質金めっき付き接触端子）であれば、目視で目立つような傷が付きにくいため、製品の搬送等における端子表面の保護を簡素化できるといった利点もある。
また、本発明によれば、硬質電気金めっきの梨地表面によって、外観の光沢の均一化を図る構成は、光沢の均一化を低コストで簡単に実現できる。硬質電気金めっき表面の梨地処理によって光沢の均一化を図る構成であれば、例えば、半光沢電気めっきのように構成が複雑で扱いが難しいめっき浴を使用して半光沢めっきを得る場合に比べて、光沢の均一化を容易に実現できる。また、低コスト化も容易に実現できる。めっき工程に特別な工夫、調整等を要することなく、手間及びコストを抑えながら光沢の均一化を図ることができる。 ADVANTAGE OF THE INVENTION According to this invention, the board | substrate with a contact terminal and IC memory card which have a terminal (contact terminal with hard gold plating) with uniform appearance gloss can be provided. In production, it is possible to reduce the number of processing of defective products only due to non-uniform gloss of appearance, thereby realizing reduction in manufacturing cost. Terminals with uniform appearance (contact terminals with hard gold plating) contribute effectively to ensuring the quality image of IC memory cards.
In addition, contact terminals (contact terminals with hard gold plating) coated with a plating film with hard electro gold plating as the surface layer are hard to be visually noticeable, so that the terminal surface is protected during product transportation. There is also an advantage that can be simplified.
In addition, according to the present invention, the configuration for making the appearance gloss uniform by the matte surface of the hard electrogold plating can easily realize the gloss uniformity at a low cost. Compared to the case where semi-gloss plating is obtained using a plating bath that is complex and difficult to handle, such as semi-gloss electroplating, if the structure is intended to make the gloss uniform by matte treatment of the hard electrogold plating surface. Thus, uniform gloss can be easily achieved. Moreover, cost reduction can be easily realized. Gloss uniformity can be achieved while reducing labor and cost without requiring any special device or adjustment in the plating process.

以下、本発明を実施した接触端子付き基板、ＩＣメモリーカード、接触端子付き基板の製造方法について、図面を参照して説明する。   Hereinafter, a method for manufacturing a substrate with contact terminals, an IC memory card, and a substrate with contact terminals according to the present invention will be described with reference to the drawings.

図１は、接触端子付き基板１を外装ケース２内に組み込んでなるＩＣメモリーカード３の一例を示す図、図２は接触端子付き基板１に設けられている硬質金めっき付き接触端子１１（以下、硬質金めっき端子とも言う）付近を拡大して示した斜視図、図３（ａ）、（ｂ）は硬質金めっき端子１１付近の構造を拡大して示した断面図、図４（ａ）、（ｂ）は別態様の硬質めっき端子の構造を示す断面図、図５は硬質めっき端子１１の構造を示す拡大断面図である。
なお、本明細書においては、図２〜図５において、上側を上、下側を下として説明するが、これは本発明の構成要素の相対関係を簡単に説明するために便宜的に「上」、「下」を規定したものであり、本発明を実施する場合の製造時や使用時の方向を限定するものではない。 FIG. 1 is a view showing an example of an IC memory card 3 in which a substrate 1 with a contact terminal is incorporated in an exterior case 2, and FIG. 2 is a contact terminal 11 with hard gold plating (hereinafter referred to as a contact terminal 11) provided on the substrate 1 with a contact terminal. FIG. 3A and FIG. 3B are enlarged sectional views showing the structure near the hard gold plating terminal 11, and FIG. 4A. (B) is sectional drawing which shows the structure of the hard plating terminal of another aspect, FIG. 5: is an expanded sectional view which shows the structure of the hard plating terminal 11. FIG.
In this specification, in FIGS. 2 to 5, the upper side is described as the upper side and the lower side is set as the lower side. However, this is simply described as “upper” for the sake of simplicity. ”And“ below ”are defined, and do not limit the direction during production or use when the present invention is carried out.

図１、図２に示すように、接触端子付き基板１は、硬質金めっき端子１１及び配線１２を具備する配線基板である。図中、符号１３は電気絶縁性の絶縁樹脂板であり、硬質金めっき端子１１及び配線１２は絶縁樹脂板１３の主面に設けられている。   As shown in FIGS. 1 and 2, the substrate 1 with a contact terminal is a wiring substrate including a hard gold plating terminal 11 and a wiring 12. In the figure, reference numeral 13 denotes an electrically insulating insulating resin plate, and the hard gold plating terminal 11 and the wiring 12 are provided on the main surface of the insulating resin plate 13.

ＩＣメモリーカード３において、接触端子付き基板１の硬質金めっき端子１１は、外装ケース２に形成された窓２１を介して外装ケース２の外側から目視可能になっている。
硬質金めっき端子１１は、メモリーカード３を電子機器のコネクタ部のスロットに差し込んだときに、スロット内に設けられている弾性片端子と接触される。弾性片端子は、外装ケース２の窓２１を介して硬質金めっき端子１１と接触する。また、メモリーカード３のスロットに対する挿抜操作によって、硬質金めっき端子１１が弾性片端子に対して接離する。 In the IC memory card 3, the hard gold-plated terminal 11 of the substrate 1 with contact terminal is visible from the outside of the outer case 2 through a window 21 formed in the outer case 2.
The hard gold plating terminal 11 is brought into contact with an elastic piece terminal provided in the slot when the memory card 3 is inserted into the slot of the connector portion of the electronic device. The elastic piece terminal contacts the hard gold plating terminal 11 through the window 21 of the outer case 2. Further, the hard gold plated terminal 11 comes in contact with and separates from the elastic piece terminal by the insertion / extraction operation with respect to the slot of the memory card 3.

接触端子付き基板１の硬質金めっき端子１１は、絶縁樹脂板１３上に配線１２と該配線１２に連続して形成されたパッド状（ランド状）の接触端子１４（図３（ａ）、（ｂ）参照。以下、端子部とも言う）とを有する配線基板（以下、端子部付き配線基板とも言う）の前記接触端子１４に、硬質電気金めっき（図３（ａ）、（ｂ）中、符号１５ｂ）を表層とするめっき膜（図３（ａ）、（ｂ）中、符号１５）が形成され、前記硬質電気金めっき表面が梨地状とされているものである。   The hard gold-plated terminal 11 of the substrate 1 with a contact terminal includes a wiring 12 on the insulating resin plate 13 and a pad-shaped (land-shaped) contact terminal 14 formed continuously with the wiring 12 (FIG. 3A, ( b) See also, hereinafter, the contact terminals 14 of a wiring board (hereinafter also referred to as a terminal board with a terminal part) having a hard electro-gold plating (in FIGS. 3A and 3B), A plating film (reference numeral 15 in FIGS. 3 (a) and 3 (b)) is formed with the reference numeral 15b) as a surface layer, and the surface of the hard electrogold plating has a satin finish.

前記端子部付き配線基板は、プリント配線板の製造に適用される周知の製造方法を適用して作製できる。
端子部付き配線基板では、端子部（接触端子１４）を含む配線部に銅が使用される。この配線部（配線１２と接触端子１４とで構成）は、例えば、銅張積層板の表層の銅箔のパターンエッチング、あるいは、絶縁樹脂板への回路パターンのパターンめっき等によって得ることができる。 The wiring board with terminal portions can be manufactured by applying a well-known manufacturing method applied to the manufacture of a printed wiring board.
In the wiring board with a terminal part, copper is used for the wiring part including the terminal part (contact terminal 14). This wiring part (consisting of the wiring 12 and the contact terminal 14) can be obtained, for example, by pattern etching of a copper foil on the surface layer of a copper clad laminate, or pattern plating of a circuit pattern on an insulating resin plate.

硬質金めっき端子１１は、前記端子部付き配線基板の接触端子１４の表面をバフ研磨（研磨工程）した後、接触端子１４に、硬質電気金めっき１５ｂ（以下、硬質電気金めっき膜とも言う）を表層とするめっき膜１５を形成（以下、めっき工程とも言う）し、次いで、硬質電気金めっき１５ｂの表面を、ジェットスクラブ処理又は液体ホーニング処理によって梨地状とする（梨地処理。以下、梨地処理工程とも言う）ことで得られる。
なお、めっき膜１５及び該めっき膜１５を形成するめっき工程の詳細は後述する。 The hard gold plating terminal 11 buffs the surface of the contact terminal 14 of the wiring board with the terminal portion (polishing process), and then the contact terminal 14 is hard electroplated 15b (hereinafter also referred to as a hard electrogold plating film). Is formed as a surface layer (hereinafter also referred to as a plating step), and then the surface of the hard electrogold plating 15b is made into a satin finish by a jet scrub process or a liquid honing process (a satin process. Also called a process).
The details of the plating film 15 and the plating process for forming the plating film 15 will be described later.

めっき工程について図３（ａ）、（ｂ）、図５を参照して説明する。
ここでは、めっき工程にて、高光反射率の光沢表面（梨地処理前の表面）を有する硬質電気金めっき１５ｂを表層とするめっき膜１５を形成する場合について説明する。
このめっき工程では、研磨工程にて表面研磨後の前記接触端子１４に、光沢剤を含むめっき浴での光沢電気めっきによって電気ニッケルめっき１５ａ（ニッケルめっき。以下、光沢電気ニッケルめっきとも言う）を施す（ニッケルめっき工程）。次いで、電気ニッケルめっき１５ａの表面に、光沢剤を含むめっき浴での光沢電気めっきによって硬質電気金めっき１５ｂ（以下、光沢硬質電気金めっきとも言う）を施す（硬質金めっき工程）。 The plating process will be described with reference to FIGS. 3 (a), 3 (b) and FIG.
Here, the case where the plating film 15 which makes the surface layer the hard electrogold plating 15b which has the glossy surface (surface before a satin processing) of a high light reflectance in a plating process is demonstrated.
In this plating step, the contact terminals 14 whose surfaces have been polished in the polishing step are subjected to electro nickel plating 15a (nickel plating; hereinafter also referred to as gloss electro nickel plating) by gloss electroplating in a plating bath containing a brightener. (Nickel plating process). Next, the surface of the electro nickel plating 15a is subjected to hard electro gold plating 15b (hereinafter also referred to as luster hard electro gold plating) by gloss electro plating in a plating bath containing a brightener (hard gold plating step).

ニッケルめっき工程、硬質金めっき工程にて用いるめっき浴、光沢剤としては、電気めっき（光沢電気めっき）で使用される周知のものを採用できる。ニッケルめっき工程では例えばワット浴を採用することが好ましい。
このめっき工程により、前記接触端子１４に施された電気ニッケルめっき１５ａと、この電気ニッケルめっき１５ａを覆うように施された硬質電気金めっき１５ｂとを具備する多層のめっき膜１５が形成される。以下、めっき膜１５を多層めっき膜とも言う。
なお、電気ニッケルめっき１５ａの膜厚は１〜２５μｍ、硬質電気金めっきの膜厚は０．２〜１．５μｍであることが好ましい。 As the plating bath and brightening agent used in the nickel plating step and the hard gold plating step, known ones used in electroplating (bright electroplating) can be employed. In the nickel plating process, for example, a Watt bath is preferably employed.
By this plating step, a multilayer plating film 15 is formed which includes an electric nickel plating 15a applied to the contact terminal 14 and a hard electric gold plating 15b applied so as to cover the electric nickel plating 15a. Hereinafter, the plating film 15 is also referred to as a multilayer plating film.
In addition, it is preferable that the film thickness of the electro nickel plating 15a is 1 to 25 μm, and the film thickness of the hard electro gold plating is 0.2 to 1.5 μm.

図３（ａ）、（ｂ）では、パッド状の接触端子１４の端子面１４ａ（絶縁樹脂板１３とは反対側の面。上面）を含む表面全体に形成（めっき膜１５で被覆）した構成の硬質金めっき端子１１を例示している。硬質金めっき端子１１には、接触端子１４の端子面１４ａを被覆する硬質電気金めっき１５ｂ（硬質電気金めっき１５ｂにおいて、接触端子１４の端子面１４ａを被覆した部分）によって、メモリーカード３を電子機器のコネクタ部のスロットに差し込んだときにスロット内に設けられている弾性片端子と接触される、平坦な接触端子面１５ｃが形成されている。   3A and 3B, a configuration in which the entire surface including the terminal surface 14a (surface opposite to the insulating resin plate 13; upper surface) of the pad-like contact terminal 14 is formed (covered with the plating film 15). The hard gold plating terminal 11 is illustrated. The hard gold plated terminal 11 has a memory card 3 as an electron by a hard electro gold plating 15b covering the terminal surface 14a of the contact terminal 14 (a portion of the hard electro gold plating 15b covering the terminal surface 14a of the contact terminal 14). A flat contact terminal surface 15c is formed, which is brought into contact with an elastic piece terminal provided in the slot when inserted into the slot of the connector portion of the device.

但し、本発明では、図４（ａ）、（ｂ）に示すように、パッド状の接触端子１４の端子面１４ａ（絶縁樹脂板１３とは反対側の面。上面）のみにめっき膜１５を形成（めっき膜１５で被覆）した構成の硬質金めっき端子１１（図中、区別のため符号１１Ａを付す）も可能である。接触端子１４の外周の端面にはめっき膜１５を形成していない。
なお、接触端子１４の端子面１４ａのみにめっき膜１５を形成した構成は、例えば、めっきレジストの使用等によって容易に得られる。 However, in the present invention, as shown in FIGS. 4A and 4B, the plating film 15 is formed only on the terminal surface 14 a (surface opposite to the insulating resin plate 13, upper surface) of the pad-like contact terminal 14. It is also possible to form a hard gold plated terminal 11 (covered with a plating film 15) (indicated by reference numeral 11A for distinction). The plating film 15 is not formed on the outer peripheral end face of the contact terminal 14.
In addition, the structure which formed the plating film 15 only in the terminal surface 14a of the contact terminal 14 is easily obtained by use of a plating resist etc., for example.

図３（ａ）、（ｂ）、図４（ａ）、（ｂ）に示すように、硬質金めっき端子１１は、外観パッド状に形成されており、平坦な接触端子面１５ｃを持つ。この硬質金めっき端子１１を用いて構成したＩＣメモリーカード３においては、硬質金めっき端子１１の接触端子面１５ｃの光沢の均一性が、視覚的に、ユーザーの品質イメージに与える影響が大きい。
このため、図３（ａ）、（ｂ）のように、接触端子１４の外周の端面を含む表面全体を被覆するめっき膜１５を形成した場合も、硬質電気金めっき１５ｂの内、接触端子１４の端子面１４ａ上に積層（端子面１４ａを被覆）するように形成された部分の表面（接触端子面１５ｃ）に光沢の均一性を確保することが肝要である。めっき工程にて得た硬質電気金めっき１５ｂに梨地表面を得るための梨地処理は、その処理対象領域に接触端子面１５ｃを含むことを必須とし、接触端子面１５ｃの光沢を均一化するべく実施する。 As shown in FIGS. 3 (a), 3 (b), 4 (a), and 4 (b), the hard gold plated terminal 11 is formed in an external pad shape and has a flat contact terminal surface 15c. In the IC memory card 3 configured using the hard gold plated terminal 11, the uniformity of the gloss of the contact terminal surface 15c of the hard gold plated terminal 11 has a great influence on the quality image of the user visually.
For this reason, as shown in FIGS. 3A and 3B, even when the plating film 15 covering the entire surface including the end face of the outer periphery of the contact terminal 14 is formed, the contact terminal 14 of the hard electrogold plating 15b is formed. It is important to ensure the uniformity of gloss on the surface (contact terminal surface 15c) of the portion formed so as to be laminated (covering the terminal surface 14a) on the terminal surface 14a. The matte surface treatment for obtaining the matte surface on the hard electrogold plating 15b obtained in the plating step is required to include the contact terminal surface 15c in the region to be treated, and is performed to make the gloss of the contact terminal surface 15c uniform. To do.

梨地処理工程では、既述のように、ジェットスクラブ処理又は液体ホーニング処理を採用する。ジェットスクラブ処理および液体ホーニング処理は酸化アルミニウムや炭化ケイ素などの砥粒を水に分散させた液体を被処理物の表面に噴射させて被処理物表面に付着している異物の洗浄や被処理物表面に微細な凹凸面を与える方法である。   In the satin treatment process, as described above, the jet scrub process or the liquid honing process is adopted. In the jet scrub process and liquid honing process, a liquid in which abrasive grains such as aluminum oxide and silicon carbide are dispersed in water is sprayed onto the surface of the object to be processed to clean the foreign matter adhering to the surface of the object to be processed and the object to be processed This is a method of giving a fine uneven surface to the surface.

ジェットスクラブ処理、液体ホーニング処理であれば、硬質電気金めっき１５ｂの表面（具体的には接触端子面１５ｃ）全体の均等な梨地処理を容易に実現できる。つまり、硬質電気金めっき１５ｂ表面への砥粒の衝突により硬質電気金めっき１５ｂ表面に極めて微細な凹凸を形成するため、接触端子面１５ｃの外周部においても、外周部よりも内側の部分と同様の処理（凹凸の形成）を行える。   If it is a jet scrub process and a liquid honing process, the uniform satin process of the whole surface (specifically contact terminal surface 15c) of the hard electrogold plating 15b is easily realizable. That is, since extremely fine irregularities are formed on the surface of the hard electrogold plating 15b by the collision of abrasive grains with the surface of the hard electrogold plating 15b, the outer peripheral portion of the contact terminal surface 15c is the same as the inner portion of the outer peripheral portion. Can be performed (formation of irregularities).

例えばバフロール研磨では一方向に方向性を持つ研磨筋が発生するが、ジェットスクラブ処理、液体ホーニング処理の場合は方向性の無い凹凸形成が可能である。また、バフロール研磨の場合は、接触端子面１５ｃの外周部が接触端子面１５ｃの中央部に比べてバフロールの接触圧が高くなる傾向が避けられず、接触端子面１５ｃ全体の均等な梨地処理を実現することは困難である。これに対して、ジェットスクラブ処理、液体ホーニング処理の場合は、接触端子面１５ｃの外周部においても、外周部よりも内側の部分と同様の処理（凹凸の形成）を行えるため、接触端子面１５ｃ全体の均等な梨地処理を容易に実現できる。   For example, polishing streaks having directionality in one direction are generated in the buffol polishing, but unevenness without directionality can be formed in the jet scrub process and the liquid honing process. Moreover, in the case of buffling, it is inevitable that the contact pressure of the bafrol is higher in the outer peripheral portion of the contact terminal surface 15c than in the central portion of the contact terminal surface 15c. It is difficult to realize. On the other hand, in the case of the jet scrub process and the liquid honing process, the same processing (formation of irregularities) as the inner portion of the outer peripheral portion can be performed on the outer peripheral portion of the contact terminal surface 15c. The entire satin finish can be easily realized.

この梨地処理工程によって、硬質金めっき端子１１の表層の硬質電気金めっき１５ｂの梨地表面が得られる。
なお、ジェットスクラブや液体ホーニングは接触端子付き基板１を静止させた状態で処理することもできるが、接触端子付き基板１を搬送しながら処理する方法が生産性が高いので望ましい。 By this matte treatment process, the matte surface of the hard electrogold plating 15b on the surface layer of the hard gold plating terminal 11 is obtained.
Jet scrub and liquid honing can be processed while the substrate 1 with contact terminals is stationary, but a method of processing while conveying the substrate 1 with contact terminals is preferable because of high productivity.

次に、硬質金めっき端子１１の表面（具体的には接触端子面１５ｃ）の光反射特性（以下、単に反射特性とも言う）について説明する。
図６は、反射特性を測定するための装置（反射特性測定装置４）を示す。
図６中、符号４１は光照射器、４２は受光器、４３は支持台である。
支持台４３には、供試品（ここでは接続端子付き基板１）を着脱可能に保持するためのホルダ（図示略）が設けられている。 Next, the light reflection characteristics (hereinafter also simply referred to as reflection characteristics) of the surface of the hard gold plating terminal 11 (specifically, the contact terminal surface 15c) will be described.
FIG. 6 shows an apparatus for measuring reflection characteristics (reflection characteristic measuring apparatus 4).
In FIG. 6, reference numeral 41 denotes a light irradiator, 42 denotes a light receiver, and 43 denotes a support base.
The support base 43 is provided with a holder (not shown) for detachably holding a specimen (here, the substrate 1 with connection terminals).

図６は、支持台４３に接続端子付き基板１をセットした状態を示す。
但し、この反射特性測定装置４は、例えば、支持台４３に、後述の比較例１、２の光沢硬質金めっき端子を具備する配線基板をセットすることで、光沢硬質金めっき端子の接触端子面の反射特性測定にも利用できる。 FIG. 6 shows a state in which the substrate 1 with connection terminals is set on the support base 43.
However, the reflection characteristic measuring apparatus 4 is configured such that, for example, a contact board surface of a glossy hard gold-plated terminal is set on the support base 43 by setting a wiring board having a glossy hard gold-plated terminal of Comparative Examples 1 and 2 described later. It can also be used to measure the reflection characteristics.

この反射特性測定装置４を使用して硬質金めっき端子１１表面（硬質電気金めっき１５ｂ表面）の反射特性を調べる反射特性測定は、光照射器４１から、接触端子面１５ｃ（具体的には接触端子面１５ｃ）に入射角４５度の入射光４４を照射し、この入射光が硬質電気金めっき１５ｂ表面で反射した反射光４５を受光器４２で受光して反射光強度分布を解析する。   The reflection characteristic measurement for examining the reflection characteristic of the surface of the hard gold plating terminal 11 (the surface of the hard electric gold plating 15b) using the reflection characteristic measuring device 4 is performed from the light irradiator 41 to the contact terminal surface 15c (specifically, the contact terminal surface 15c). The terminal surface 15c) is irradiated with incident light 44 having an incident angle of 45 degrees, the reflected light 45 reflected by the surface of the hard electroplated gold 15b is received by the light receiver 42, and the reflected light intensity distribution is analyzed.

入射光４４の接触端子面１５ｃに対する入射角は４５度で固定する。入射光４４は光照射器４１から細いビーム状に出力されて硬質電気金めっき１５ｂ表面に照射される。
図６中、符号４６は、硬質電気金めっき１５ｂ表面における入射光４４の照射点であり、詳細には、入射光４４の光軸と硬質電気金めっき１５ｂ表面（接触端子面１５ｃ）との交点である。
図中、符号４７は、前記照射点４６を通り接触端子面１５ｃに垂直の仮想垂直線である。入射角４５度の入射光４４は、この仮想垂直線４７に対する傾斜角度α（入射角）が４５度である。
受光器４２は、図示略の移動装置によって、前記照射点４６を中心とする円周上を移動させる。受光器４２が移動する円周は、仮想垂直線４７及び入射光４４の光軸と重なる仮想平面内にある。 The incident angle of the incident light 44 with respect to the contact terminal surface 15c is fixed at 45 degrees. Incident light 44 is output in the form of a thin beam from the light irradiator 41 and irradiated onto the surface of the hard electrogold plating 15b.
In FIG. 6, reference numeral 46 denotes an irradiation point of the incident light 44 on the surface of the hard electric gold plating 15b. Specifically, the intersection of the optical axis of the incident light 44 and the surface of the hard electric gold plating 15b (contact terminal surface 15c). It is.
In the figure, reference numeral 47 is a virtual vertical line passing through the irradiation point 46 and perpendicular to the contact terminal surface 15c. The incident light 44 having an incident angle of 45 degrees has an inclination angle α (incident angle) with respect to the virtual vertical line 47 of 45 degrees.
The light receiver 42 is moved on the circumference around the irradiation point 46 by a moving device (not shown). The circumference along which the light receiver 42 moves is in a virtual plane that overlaps the virtual vertical line 47 and the optical axis of the incident light 44.

上述の反射特性測定装置４を用いた接触端子付き基板１の硬質電気金めっき１５ｂ表面の反射特性測定は、接触端子面１５ｃに入射角４５度で入射光４４を照射し、受光器４２を前記照射点４６を中心とする円周上を移動させて、仮想垂直線４７に対して例えば１度刻みで受光データ（反射光強度。受光強度）を取得し、反射角４５±２５度の範囲の反射光強度分布を解析する。   In the reflection characteristic measurement of the surface of the hard electroplating 15b of the substrate 1 with a contact terminal 1 using the reflection characteristic measuring device 4 described above, the incident light 44 is irradiated to the contact terminal surface 15c at an incident angle of 45 degrees, By moving on the circumference centered on the irradiation point 46, the received light data (reflected light intensity, received light intensity) is obtained in increments of 1 degree with respect to the virtual vertical line 47, and the reflection angle is within a range of 45 ± 25 degrees. Analyze the reflected light intensity distribution.

ここで、反射角は、仮想垂直線４７を介して入射光４４とは反対の側における、前記仮想垂直線４７に対する角度（照射点４６を中心とする仮想垂直線４７に対する角度）を指す。詳細には、仮想垂直線４７及び入射光４４の光軸と重なる前記仮想平面内における、前記仮想垂直線４７に対する角度である。この反射角は、照射点４６を中心に、仮想垂直線４７と重なる所を０度とし、仮想垂直線４７を介して入射光４４とは反対の側、つまり、図６において仮想垂直線４７から右側の角度を言う。図６中、角度γは反射角４５度を示す。また、図６中、照射点４６を通り仮想垂直線４７に垂直の仮想面１５Ｓの、仮想垂直線４７から右側の所が反射角９０度である。
また、反射角４５度は換言すれば入射角４５度の入射光４４（詳細にはその光軸）に対する傾斜角度が９０度（照射点４６を中心とする角度）、反射角４５±２５度の角度範囲は、換言すれば、前記入射光４４に対する９０±２５度の角度範囲（照射点４６を中心とする角度範囲）を意味する。 Here, the reflection angle refers to an angle with respect to the virtual vertical line 47 on the side opposite to the incident light 44 through the virtual vertical line 47 (an angle with respect to the virtual vertical line 47 with the irradiation point 46 as the center). Specifically, the angle is an angle with respect to the virtual vertical line 47 in the virtual plane overlapping the virtual vertical line 47 and the optical axis of the incident light 44. The reflection angle is set to 0 degree with respect to the irradiation point 46 and overlapping with the virtual vertical line 47, and from the side opposite to the incident light 44 via the virtual vertical line 47, that is, from the virtual vertical line 47 in FIG. Say right angle. In FIG. 6, the angle γ indicates a reflection angle of 45 degrees. Further, in FIG. 6, the reflection angle 90 degrees is on the right side of the virtual vertical line 47 of the virtual surface 15S passing through the irradiation point 46 and perpendicular to the virtual vertical line 47.
In other words, the reflection angle is 45 degrees, that is, the inclination angle with respect to the incident light 44 (specifically, its optical axis) with an incident angle of 45 degrees is 90 degrees (an angle centered on the irradiation point 46), and the reflection angle is 45 ± 25 degrees. In other words, the angle range means an angle range of 90 ± 25 degrees with respect to the incident light 44 (an angle range around the irradiation point 46).

反射特性測定では、受光器によって取得した反射角４５±２５度の範囲の受光データから、反射角４５±２５度の範囲の反射光分布を解析する。
上述の反射特性測定装置４を用いた反射特性測定については、照射点４６を中心とする円周上に移動させる受光器４２によって入射光４４が接触端子面１５ｃで反射した反射光４５を受光し、取得した受光データから、仮想垂直線４７に対する４５±２５度の角度範囲について反射光強度分布を解析する。受光器４２による受光データの取得は、反射角４５±２５度を含む角度範囲について行う。 In the reflection characteristic measurement, the reflected light distribution in the range of the reflection angle 45 ± 25 degrees is analyzed from the received light data in the range of the reflection angle 45 ± 25 degrees acquired by the light receiver.
In the reflection characteristic measurement using the reflection characteristic measurement device 4 described above, the reflected light 45 reflected by the contact terminal surface 15c is received by the light receiver 42 that moves on the circumference centered on the irradiation point 46. The reflected light intensity distribution is analyzed for the angle range of 45 ± 25 degrees with respect to the virtual vertical line 47 from the received light reception data. Acquisition of light reception data by the light receiver 42 is performed for an angle range including a reflection angle of 45 ± 25 degrees.

本発明に係る接触端子付き基板１の硬質金めっき端子１１の梨地処理済みの接触端子面１５ｃは、上述の変角反射特性測定（以下、変角反射特性測定とも言う）を行った場合、反射角４５±２５度の角度範囲の全受光量Ａと、反射角４５±３度の角度範囲の全受光量ＢとがＢ／Ａ≦０．４を満たす梨地表面である。
なお、全受光量Ａ、Ｂは、それぞれ、かかる角度範囲において受光器４２によって取得した受光量の合計値であり、例えば、照射点４６を中心とする円周上を移動させた受光器４２によって１度刻みで受光データを取得した場合は、全受光量Ａは反射角４５±２５度の角度範囲における受光器４２による１度刻みの取得データの合計値、全受光量Ｂは反射角４５±３度の角度範囲における受光器４２による１度刻みの取得データの合計値である。 The matte-treated contact terminal surface 15c of the hard gold-plated terminal 11 of the substrate 1 with a contact terminal according to the present invention is reflected when the above-mentioned variable reflection characteristic measurement (hereinafter also referred to as variable reflection characteristic measurement) is performed. The total surface received light amount A in the angle range of 45 ± 25 degrees and the total light received amount B in the angle range of the reflection angle 45 ± 3 degrees are the satin surface satisfying B / A ≦ 0.4.
Note that the total received light amounts A and B are total values of the received light amounts acquired by the light receiver 42 in such an angle range, for example, by the light receiver 42 moved on the circumference around the irradiation point 46. When the received light data is acquired in 1 degree increments, the total received light amount A is the total value of the acquired data in 1 degree increments in the angle range of the reflection angle 45 ± 25 degrees, and the total received light amount B is the reflection angle 45 ±. It is the total value of the acquired data in increments of 1 degree by the light receiver 42 in the angle range of 3 degrees.

なお、前記照射点４６を中心とする円周上での受光器４２の移動による受光データの取得は１度刻みに限定されず、例えば、０．５度刻み、０．２度刻み等であっても良い。
また、仮想垂直線４７に対して４５±２５度（入射光４４に対して９０±２５度）の角度範囲（但し、前記仮想平面における角度範囲）の反射光強度分布の解析は、前記照射点４６を中心とする円周上で移動させる受光器４２による受光データの取得に限定されない。例えば、反射角４５±２５度の角度範囲における一部又は全部の受光データの取得を、光照射器４１あるいは仮想垂直線４７に対して定位置に設置した受光器によって行う構成としても良い。 The acquisition of the received light data by moving the light receiver 42 on the circumference around the irradiation point 46 is not limited to 1 degree, for example, 0.5 degree, 0.2 degree, etc. May be.
The analysis of the reflected light intensity distribution in the angle range of 45 ± 25 degrees with respect to the virtual vertical line 47 (90 ± 25 degrees with respect to the incident light 44) (however, the angle range in the virtual plane) It is not limited to the acquisition of the light reception data by the light receiver 42 that moves on the circumference centering on 46. For example, a part or all of the received light data in the angle range of the reflection angle of 45 ± 25 degrees may be obtained by a light receiver installed at a fixed position with respect to the light irradiator 41 or the virtual vertical line 47.

Ｂ／Ａが０．４以下（Ｂ／Ａ≦０．４）であれば、研磨工程のバフ研磨にて接触端子１４表面に形成される研磨筋に起因する光沢ムラを光散乱によって目立たなくする効果が充分に得られ、光沢の均一化により品質イメージの確保に有効に寄与する。   If B / A is 0.4 or less (B / A ≦ 0.4), gloss unevenness caused by polishing streaks formed on the surface of the contact terminal 14 by buffing in the polishing step is made inconspicuous by light scattering. The effect is sufficiently obtained, and it contributes effectively to securing the quality image by making the gloss uniform.

ジェットスクラブ処理、液体ホーニング処理であれば、例えば、砥粒の粒径の選択、砥粒の供給量の調整、硬質電気金めっき１５ｂ表面に対する衝突速度の調整等によって、硬質金めっき１５ｂ表面に形成する凹凸の大きさや密度等を容易に調整できる。このため、Ｂ／Ａ≦０．４の反射特性を持つ硬質電気金めっき１５ｂの梨地表面を容易に得ることができる。   In the case of jet scrubbing or liquid honing, for example, it is formed on the surface of the hard gold plating 15b by selecting the grain size of the abrasive grains, adjusting the supply amount of the abrasive grains, adjusting the collision speed against the surface of the hard electrogold plating 15b, etc. The size and density of the unevenness to be adjusted can be easily adjusted. For this reason, the satin finish surface of the hard electrogold plating 15b having a reflection characteristic of B / A ≦ 0.4 can be easily obtained.

硬質金めっき端子１１の硬質電気金めっき１５ｂ表面が、ジェットスクラブ処理、液体ホーニング処理といった梨地処理を施して得た梨地表面である構成は、接触端子面１５ｃの外観の光沢の均一化に有効に寄与する。
例えば、接触端子に金めっきを施した後、梨地処理を行わない場合（既述の従来技術）は、めっき前のバフ研磨工程によって接触端子に形成された微細な研磨筋が、接触端子を覆うように形成した金めっき表面状態に影響を与え、これが金めっき表面の光沢ムラの原因となる。 The structure in which the surface of the hard electroplating 15b of the hard gold plating terminal 11 is a matte surface obtained by performing a matte process such as a jet scrub process or a liquid honing process is effective for uniforming the gloss of the appearance of the contact terminal surface 15c. Contribute.
For example, after the gold plating is applied to the contact terminal, when the matte treatment is not performed (the above-described conventional technology), the fine polishing streaks formed on the contact terminal by the buff polishing process before plating covers the contact terminal. The surface of the gold plating formed in this manner is affected, and this causes uneven gloss on the gold plating surface.

これに対して、本発明では、硬質金めっき工程にて接触端子１４に施した硬質電気金めっき１５ｂ（光沢硬質電気金めっき）の高光反射率を有する表面を梨地処理して光散乱率を高め、いわば半光沢の状態とする。梨地表面は、微細な凹凸を均一に形成させた、艶消し仕上げとなる。このため、照射光の散乱によって、研磨工程にて接触端子１４表面（詳細には端子面１４ａ）に形成された研磨筋に起因する光沢ムラを目立たなくする、あるいは、目視確認が困難な程度に解消することができる。その結果、接触端子面１５ｃの光沢を均一化することができる。   On the other hand, in the present invention, the surface having high light reflectance of the hard electrogold plating 15b (glossy hard electrogold plating) applied to the contact terminal 14 in the hard gold plating process is satin-finished to increase the light scattering rate. In other words, a semi-glossy state is assumed. The matte surface has a matte finish with uniform fine irregularities. For this reason, the unevenness of gloss caused by the polishing streaks formed on the surface of the contact terminal 14 (specifically, the terminal surface 14a) in the polishing process is made inconspicuous by scattering of the irradiation light, or it is difficult to visually check. Can be resolved. As a result, the gloss of the contact terminal surface 15c can be made uniform.

前記研磨工程では、端子部付き配線基板の端子部（接触端子１４。以下も同じ）とめっき膜１５との密着力の確保や端子部表面の汚染物等除去のために、端子部表面に研磨を施す。この研磨には、円盤形のバフあるいはロール形バフ（バフロール）を具備する研磨装置が使用される。そのため研磨装置のバフの回転方向に沿って端子部表面に研磨筋が形成される。
研磨筋が形成された端子部表面にニッケルめっき（電気ニッケルめっき）、次いで硬質電気金めっきを施しても、硬質電気金めっき表面に研磨筋が残るケースが生じやすい。硬質電気金めっき表面に研磨筋が残った場合、梨地処理前の硬質電気金めっき表面は、研磨筋方向と研磨筋に直角の方向とで光沢が異なるようになり、光沢が不均一となる。 In the polishing step, the surface of the terminal portion is polished to ensure adhesion between the terminal portion (contact terminal 14; the same applies to the following) of the wiring board with terminal portion and the plating film 15 and to remove contaminants on the surface of the terminal portion. Apply. For this polishing, a polishing apparatus having a disk-shaped buff or a roll-type buff (buffol) is used. Therefore, polishing streaks are formed on the surface of the terminal portion along the buff rotation direction of the polishing apparatus.
Even if nickel plating (electro nickel plating) is applied to the surface of the terminal portion on which the polishing streaks are formed, and then hard electro gold plating is performed, a case in which the polishing streaks remain on the hard electro gold plating surface is likely to occur. When the polishing streaks remain on the hard electroplating surface, the gloss of the hard electrogold plating surface before the matte finish becomes different between the polishing streak direction and the direction perpendicular to the polishing streak, and the gloss is not uniform.

しかしながら、本発明では、硬質金めっき工程にて接触端子１４に施した硬質電気金めっき１５ｂ（光沢硬質電気金めっき）表面について行う梨地処理は、ジェットスクラブ処理、液体ホーニング処理によって方向性の無い凹凸形成が可能であり、この梨地処理を行うことで、梨地処理前の硬質電気金めっきに存在した研磨筋の影響を殆ど無くすことができる。したがって、梨地処理の結果、研磨筋の方向に関係無く、研磨筋に起因する光沢ムラを目立たなくする、あるいは、目視確認が困難な程度に解消することができる。
その結果、研磨筋方向及び研磨筋に直角の方向のいずれについても、目視で容易に視認できるような光沢ムラを無くすことができ、硬質電気金めっき１５ｂ表面の光沢を均一化することができる。 However, in the present invention, the matte treatment performed on the surface of the hard electrogold plating 15b (glossy hard electrogold plating) applied to the contact terminal 14 in the hard gold plating step is uneven with no directionality by jet scrub treatment or liquid honing treatment. It is possible to form, and by performing this matte treatment, it is possible to almost eliminate the influence of polishing streaks existing in the hard electrogold plating before the matte treatment. Therefore, as a result of the satin treatment, it is possible to make the uneven gloss caused by the polishing streak inconspicuous or to the extent that visual confirmation is difficult regardless of the direction of the polishing streak.
As a result, the gloss unevenness that can be easily visually recognized can be eliminated in both the polishing streak direction and the direction perpendicular to the polishing streak, and the surface gloss of the hard electrogold plating 15b can be made uniform.

接触端子１４と硬質電気金めっき１５ｂとの間に光沢電気ニッケルめっき１５ａを介在させることは、硬質金めっき工程にて接触端子１４に施した硬質電気金めっき１５ｂ（光沢硬質電気金めっき）の表面（梨地処理前の表面）の光沢、光反射率の確保に有効に寄与するものである。
また、電気ニッケルめっき１５ａは、接触端子１４に対する硬質電気金めっき膜１５ｂの接着性を高め、剥がれにくくする機能を果たす。 Interposing the bright nickel electroplating 15a between the contact terminal 14 and the hard electrogold plating 15b means that the surface of the hard electrogold plating 15b (gloss hard electrogold plating) applied to the contact terminal 14 in the hard gold plating process. It effectively contributes to securing the gloss and light reflectance of the (surface before the satin treatment).
Further, the electro nickel plating 15a functions to enhance the adhesion of the hard electro gold plating film 15b to the contact terminal 14 and make it difficult to peel off.

また、光沢電気ニッケルめっき１５ａは、一般に、光沢剤の作用によって硬質のめっき膜が得られる。このため、硬質金めっき工程にて得た硬質電気金めっき膜１５ｂにジェットスクラブ処理、液体ホーニング処理といった梨地処理を施す際に、硬質電気金めっき膜１５ｂに必要以上の予期しない大きい変形が生じてしまうといった不都合を防止できる。その結果、砥粒供給量等の梨地処理の処理条件の設定による硬質電気金めっき膜１５ｂ表面の反射特性の調整を精度良く行えるようになり、Ｂ／Ａ≦０．４の反射特性を持つ梨地表面の形成を容易に得られるようになる。   The bright electronickel plating 15a generally provides a hard plating film by the action of a brightener. For this reason, when the hard electrogold plating film 15b obtained in the hard gold plating process is subjected to a matte treatment such as a jet scrub process or a liquid honing process, the hard electrogold plating film 15b is unnecessarily large and unexpectedly deformed. Inconvenience such as end can be prevented. As a result, it becomes possible to accurately adjust the reflection characteristics of the surface of the hard electroplated gold film 15b by setting the processing conditions of the matte treatment such as the abrasive grain supply amount, and the satin having a reflection characteristic of B / A ≦ 0.4. Surface formation can be easily obtained.

硬質のニッケルめっき１５ａ（光沢電気ニッケルめっき）は、硬質電気金めっき１５ｂの変形防止に有効に寄与するため、例えば、電子機器のコネクタ部の弾性片端子が硬質金めっき端子１１に弾性接触することによる接触痕の発生抑制、といった効果も得られる。
硬質金めっき端子１１の表層の硬質電気金めっき１５ｂは、既述の通り、コバルト、鉄、ニッケル、インジウムといった異種金属を０．０５％〜１％（重量％）の範囲で含むものであり、いわゆる純金めっき（金純度９９．９％以上の電気金めっき。但し、上述の異種金属を含まない）に比べて格段に高い硬度を持つ。硬質金めっき端子１１は、表層が硬質電気金めっき１５ｂであることに加えて、硬質の電気ニッケルめっき１５ａ（ニッケルめっき）を具備する多層めっき膜１５の採用により、硬質電気金めっき１５ｂの変形、傷付きが生じにくくなり、長期の美観維持が可能である。 Since the hard nickel plating 15a (bright electric nickel plating) effectively contributes to preventing deformation of the hard electric gold plating 15b, for example, the elastic piece terminal of the connector portion of the electronic device is in elastic contact with the hard gold plating terminal 11. It is also possible to obtain the effect of suppressing the generation of contact marks due to
As described above, the hard electrogold plating 15b on the surface layer of the hard gold plating terminal 11 includes a different metal such as cobalt, iron, nickel, and indium in the range of 0.05% to 1% (weight%). Compared with so-called pure gold plating (electrogold plating with a gold purity of 99.9% or more, but not including the above-mentioned dissimilar metals), it has a much higher hardness. The hard gold-plated terminal 11 has the surface layer of the hard electro-gold plating 15b, and in addition to the deformation of the hard electro-gold plating 15b by adopting the multilayer plating film 15 provided with the hard electro-nickel plating 15a (nickel plating). Scratches are less likely to occur and long-term aesthetic maintenance is possible.

電気めっきによって形成した硬質電気金めっき１５ｂ表面の梨地処理によって、硬質電気金めっき１５ｂ表面（具体的には接触端子面１５ｃ）の光沢の均一化を図る構成であれば、例えば、接触端子に半光沢電気めっきを施す場合（特に、接触端子に形成するめっき膜の表層として半光沢電気めっきを施す場合）に比べて、めっき膜表面の光沢の均一化を低コストで簡単に実現できる。   For example, if the surface of the hard electrogold plating 15b (specifically, the contact terminal surface 15c) is made uniform by the matte treatment of the surface of the hard electrogold plating 15b formed by electroplating, for example, the contact terminals are half-finished. Compared with the case where the bright electroplating is performed (particularly, when the semi-gloss electroplating is applied as the surface layer of the plating film formed on the contact terminal), it is possible to easily realize the uniform gloss on the surface of the plating film at a low cost.

半光沢電気めっきは、光沢電気めっきに比べて構成が複雑なめっき浴を必要とする。電流密度等のめっき条件の調整も複雑であり、光沢電気めっきに比べて手間とコストを要する。
これに対して、接触端子１４に施した硬質電気金めっき１５ｂ表面の梨地処理によって、硬質金めっき端子１１表面の光沢の均一化を図る構成であれば、接触端子１４に形成するめっき膜１５の構成の制約が小さい。既述の多層めっき膜１５のように、光沢電気めっきによって得られるめっき膜１５を採用した場合でも硬質金めっき端子１１表面の光沢の均一化を図ることができる。 Semi-bright electroplating requires a plating bath that is more complex than bright electroplating. Adjustment of plating conditions such as current density is also complicated and requires more labor and cost than bright electroplating.
On the other hand, the plating film 15 formed on the contact terminal 14 has a structure in which the gloss of the surface of the hard gold plating terminal 11 is made uniform by the matte treatment of the surface of the hard electroplating 15b applied to the contact terminal 14. Configuration constraints are small. Even when the plating film 15 obtained by gloss electroplating is employed as in the multilayer plating film 15 described above, the surface of the hard gold plating terminal 11 can be made uniform in gloss.

例えば、光沢電気ニッケルめっき用のワット浴は、通常の電気ニッケルめっき用のワット浴に光沢剤を添加することで得られることが一般的であり、半光沢電気めっきに比べてワット浴構成以外の電流密度等のめっき条件の調整も複雑では無い。
一般に光沢電気めっき用の光沢剤は、通常の電気めっき用のめっき浴に添加しても、めっき浴構成以外の電流密度等のめっき条件に大きな影響を与えない設計となっている。しかしながら、半光沢電気めっきでは、光沢剤の調整が難しく、めっき浴も特別な構成のものを必要とするため、通常の電気めっき用のめっき浴を使用できないことが一般的である。
このため、硬質電気金めっき１５ｂ表面の梨地処理によって、接触端子面１５ｃの光沢の均一化を図る構成であれば、半光沢電気めっきを施す場合に比べて、接触端子面１５ｃの光沢の均一化を低コストで簡単に実現できる。 For example, a watt bath for bright electro-nickel plating is generally obtained by adding a brightener to a watt bath for ordinary electro-nickel plating. Adjustment of plating conditions such as current density is not complicated.
Generally, brighteners for bright electroplating are designed so that even when added to a plating bath for normal electroplating, the plating conditions such as current density other than the plating bath configuration are not greatly affected. However, in semi-gloss electroplating, since it is difficult to adjust the brightener and the plating bath also requires a special configuration, it is general that a plating bath for normal electroplating cannot be used.
For this reason, if it is the structure which makes uniform the glossiness of the contact terminal surface 15c by the matte treatment of the surface of hard electroplating 15b, compared with the case where semi-gloss electroplating is performed, the glossiness of the contact terminal surface 15c is made uniform. Can be easily realized at low cost.

次に、実施例１、比較例１、２を用いて、硬質電気金めっき１５ｂ表面の梨地処理前、梨地処理後の反射特性の対比、梨地処理による光沢均一化の効果を検証する。
まず、比較例１、２について説明し、次いで、実施例１を説明する。 Next, using Example 1 and Comparative Examples 1 and 2, the reflection characteristics before and after the matte treatment on the surface of the hard electrogold plating 15b are compared, and the effect of uniforming the gloss by the satin treatment is verified.
First, Comparative Examples 1 and 2 will be described, and then Example 1 will be described.

（比較例１）
日立化成工業（株）製の樹脂層の厚さ０．２ｍｍ、銅箔の厚さ１８μｍの銅張積層板（商品名：Ｅ−６７）を準備した。所望の個所にＮＣドリル加工装置を使用して貫通穴を加工し厚さ１５μｍの電気銅めっきを行った。次に電気銅めっきの表面をバフ研磨、酸洗浄した後、ドライフィルムタイプのエッチングレジストをラミネートし、諸物パターンを紫外線露光し、更に現像してエッチングレジストパターンを形成した。次に塩化鉄−塩酸系の銅エッチング液と接触させてエッチングレジストで覆われていない個所の銅箔を溶解除去して銅配線パターンを形成した。これにより、配線及び該配線に連続するパッド状の接触端子とを具備する端子部付き配線基板を得た。 (Comparative Example 1)
A copper-clad laminate (trade name: E-67) having a resin layer thickness of 0.2 mm and a copper foil thickness of 18 μm manufactured by Hitachi Chemical Co., Ltd. was prepared. A through hole was machined at a desired location using an NC drilling machine, and electrolytic copper plating with a thickness of 15 μm was performed. Next, the surface of the electrolytic copper plating was buffed and acid-washed, then a dry film type etching resist was laminated, the various patterns were exposed to ultraviolet light, and further developed to form an etching resist pattern. Next, a copper wiring pattern was formed by contacting with an iron chloride-hydrochloric acid-based copper etching solution to dissolve and remove the copper foil not covered with the etching resist. Thereby, the wiring board with a terminal part which comprises a wiring and the pad-shaped contact terminal continuous with this wiring was obtained.

次にソルダーレジスト膜を形成した。但し、ソルダーレジスト膜は接触端子を避けて、接触端子の端子面１４ａを覆わないように形成した。
次にソルダーレジストで覆われていない接触端子表面をバフ研磨した後、接触端子に厚さ５μｍの電気ニッケルめっきを施し、続いて厚さ０．５μｍの硬質電気金めっきを施した。但し、電気ニッケルめっき、硬質電気金めっきは、光沢剤（有機化合物光沢剤）を含むめっき浴を用いる光沢電気めっき法を採用して、光沢電気ニッケルめっき、光沢硬質電気金めっきを施した。得られためっき付きの端子を、以下、光沢硬質金めっき端子と称して説明する。この光沢硬質金めっき端子は、表層の光沢硬質電気金めっきによって光沢表面を有する。また、この光沢硬質金めっき端子は、平坦な接触端子面を有する外観パッド状である。 Next, a solder resist film was formed. However, the solder resist film was formed so as to avoid the contact terminal and not cover the terminal surface 14a of the contact terminal.
Next, the surface of the contact terminal not covered with the solder resist was buffed, and then the contact terminal was subjected to electronickel plating with a thickness of 5 μm, followed by hard electrogold plating with a thickness of 0.5 μm. However, for the electro nickel plating and the hard electro gold plating, the gloss electro nickel plating and the gloss hard electro gold plating were performed by adopting a gloss electroplating method using a plating bath containing a brightener (organic compound brightener). Hereinafter, the obtained terminal with plating will be referred to as a glossy hard gold plating terminal. This glossy hard gold plating terminal has a glossy surface by glossy hard electrogold plating on the surface layer. Moreover, this luster hard gold plating terminal is the appearance pad shape which has a flat contact terminal surface.

光沢硬質金めっき端子を具備する配線基板を反射特性測定装置にセットして、光沢硬質金めっき端子の接触端子面について既述の変角反射特性測定を行った。測定装置（反射特性測定装置）は（株）村上色彩技術研究所製の三次元変角光度計ＧＰ−２００を使用した。光源には照射面積の小さいφ０．９ｍｍ（入射光であるレーザビームの径）のレーザ光源を使用した。入射角を４５度（図６の角度α）に固定し、受光器４２によって、反射角４５±２５度の角度範囲の受光量（受光強度。換言すれば反射光強度）を１度刻みで測定した。入射光は、光沢硬質金めっき端子の接触端子面における光沢ムラの箇所を選択して照射した。
この測定は、接触端子の端子面１４ａ（例えば図３（ａ）、（ｂ）参照）の研磨方向（研磨筋に沿った方向）と、研磨方向に対する直角方向とについてそれぞれ行った。研磨方向の測定は、入射光を、端子面１４ａに垂直かつ研磨筋に沿う仮想垂直面と平行となる向き（仮想垂直線４７（図６参照）及び入射光４４の光軸と重なる仮想平面の向きを研磨筋に揃える）で端子面１４ａに照射して変角反射特性測定を行うものである。研磨方向に対する直角方向の測定は、仮想垂直線４７（図６参照）及び入射光４４の光軸と重なる仮想平面が研磨筋に対して垂直となる向きで入射光を端子面１４ａに照射して変角反射特性測定を行うものである。 The wiring board provided with the glossy hard gold-plated terminal was set in a reflection characteristic measuring apparatus, and the above-mentioned variable reflection characteristic measurement was performed on the contact terminal surface of the glossy hard gold-plated terminal. As a measuring device (reflection characteristic measuring device), a 3D variable angle photometer GP-200 manufactured by Murakami Color Research Laboratory Co., Ltd. was used. As the light source, a laser light source having a small irradiation area of φ0.9 mm (a diameter of a laser beam as incident light) was used. The incident angle is fixed at 45 degrees (angle α in FIG. 6), and the amount of light received (the received light intensity, in other words, the reflected light intensity) in the angle range of the reflection angle 45 ± 25 degrees is measured by the light receiver 42 in increments of 1 degree. did. Incident light was irradiated by selecting a portion of uneven glossiness on the contact terminal surface of the glossy hard gold plated terminal.
This measurement was performed for the polishing direction (direction along the polishing streak) of the terminal surface 14a of the contact terminal (for example, see FIGS. 3A and 3B) and the direction perpendicular to the polishing direction. The measurement of the polishing direction is performed by measuring the incident light in a direction that is perpendicular to the terminal surface 14a and parallel to the virtual vertical plane along the polishing line (virtual vertical line 47 (see FIG. 6)) and the virtual plane that overlaps the optical axis of the incident light 44. The terminal surface 14a is irradiated with the orientation aligned with the polishing streaks to measure the variable reflection characteristics. Measurement in a direction perpendicular to the polishing direction is performed by irradiating the terminal surface 14a with incident light so that a virtual plane 47 (see FIG. 6) and a virtual plane overlapping the optical axis of the incident light 44 are perpendicular to the polishing streak. A variable reflection characteristic is measured.

測定データから、反射角４５±２５度の角度範囲の全受光量Ａにおいて、反射角４５±２５度の角度範囲の全受光量Ｂが占める割合Ｂ／Ａを求めた。図７、図８に、反射角４５±２５度の角度範囲の反射光強度分布を示す。図７は、研磨方向の測定結果、図８は研磨方向に対する直角方向の測定結果である。
反射角４５±２５度の角度範囲は、光沢硬質金めっき端子の接触端子面を基準面（図６の仮想面１５Ｓを参照）としたときの該基準面に対する傾斜角度（以下、受光角とも言う）で表せば２０〜７０度の角度範囲である。図７、図８では、横軸に受光角の角度、縦軸に反射光強度を採り反射光強度分布を示した。
なお、図９〜図１１についても、横軸が受光角の角度、縦軸が反射光強度である。 From the measured data, the ratio B / A of the total received light amount A in the angle range with a reflection angle of 45 ± 25 degrees in the total received light amount A in the angle range with a reflection angle of 45 ± 25 degrees was obtained. 7 and 8 show the reflected light intensity distribution in the angle range of the reflection angle of 45 ± 25 degrees. FIG. 7 shows the measurement result in the polishing direction, and FIG. 8 shows the measurement result in the direction perpendicular to the polishing direction.
The angle range of the reflection angle 45 ± 25 degrees is an inclination angle (hereinafter also referred to as a light receiving angle) with respect to the reference surface when the contact terminal surface of the glossy hard gold-plated terminal is used as a reference surface (see the virtual surface 15S in FIG. 6). ) Is an angle range of 20 to 70 degrees. 7 and 8, the horizontal axis represents the angle of the light receiving angle, and the vertical axis represents the reflected light intensity.
9 to 11, the horizontal axis represents the angle of the light receiving angle, and the vertical axis represents the reflected light intensity.

また、変角反射特性測定の測定結果と、光沢硬質金めっき端子の光沢の目視確認結果を表１に記載した。なお、表１には、後述の比較例２、実施例１の端子の接触端子面の変角反射特性測定の測定結果、及び、光沢の目視確認結果も記載した。   In addition, Table 1 shows the measurement results of the variable angle reflection characteristic measurement and the visual confirmation results of the gloss of the glossy hard gold plated terminal. In Table 1, the measurement results of the variable reflection characteristics of the contact terminal surfaces of the terminals of Comparative Example 2 and Example 1 which will be described later, and the visual confirmation result of the gloss are also described.

表１、図７、図８から明らかなように、比較例１では受光角２０〜７０度の角度範囲の全受光量Ｂが受光角２０〜７０度の角度範囲の全受光量Ａに占める割合Ｂ／Ａが高く、光沢表面であることが確認できた。研磨方向と研磨方向に直角の方向のいずれについても、受光角４５度（図６の角度γ参照）付近をピークとする反射光強度分布が得られる。但し、研磨方向の測定結果に比べて研磨方向に直角の方向の測定結果の方が、Ｂ／Ａの値がかなり大きくなっており、研磨方向の測定結果と研磨方向に直角の方向の測定結果とで反射特性に大きな差が認められた。また、研磨方向、研磨方向に対する直角方向のいずれについても、反射特性は、Ｂ／Ａ≦０．４を満たしていなかった。   As is apparent from Table 1, FIG. 7 and FIG. 8, in Comparative Example 1, the ratio of the total received light amount B in the angle range of the light receiving angle of 20 to 70 degrees to the total received light amount A in the angle range of the received light angle of 20 to 70 degrees. B / A was high, and it was confirmed that the surface was glossy. In both the polishing direction and the direction perpendicular to the polishing direction, a reflected light intensity distribution having a peak near 45 ° (see angle γ in FIG. 6) is obtained. However, the measurement result in the direction perpendicular to the polishing direction has a considerably larger B / A value than the measurement result in the polishing direction, and the measurement result in the direction perpendicular to the polishing direction and the measurement result in the direction perpendicular to the polishing direction. There was a large difference in reflection characteristics. Also, the reflection characteristics did not satisfy B / A ≦ 0.4 in both the polishing direction and the direction perpendicular to the polishing direction.

（比較例２）
比較例１で作製した光沢めっき端子表面（接触端子面）について、別途、光沢ムラの個所（光沢ムラ部分。見る方向によって光反射の強さが異なって見える個所。）と、光沢ムラ部分以外の個所（光沢ムラが視認されない箇所。以下、正常部）とを選択して、比較例１と同じ方法で反射特性を測定した。光沢ムラ部分と正常部とについて、それぞれ、研磨方向に対する直角方向の反射光強度と研磨方向の反射光強度の差（ΔＨ）を算出した。図９に、この反射光強度差（ΔＨ）の、受光角２０〜７０度の角度範囲における分布を示す。光沢ムラ部分、正常部では、いずれも、研磨方向の測定結果、研磨方向に対する直角方向の測定結果の内、一方が他方よりも受光角２０〜７０度の角度範囲全体にわたって反射光強度の値が大きくなっていた。
表１および図９から明らかなように、光沢ムラの個所（図９中「光沢ムラ」のグラフ）は正常部の個所と比べて反射光強度差（ΔＨ）が格段に大きく、正常部の個所と比べて反射特性に大きな差が認められた。光沢硬質金めっき端子表面の場所における反射特性の差が外観の光沢ムラの原因であることが判った。
なお、光沢ムラの個所、正常部の測定データは、研磨方向、研磨方向に対する直角方向のいずれについても既述のＢ／Ａは０．４よりも大きく、Ｂ／Ａ≦０．４を満たしていなかった。 (Comparative Example 2)
For the surface of the gloss-plated terminal (contact terminal surface) produced in Comparative Example 1, a portion of uneven gloss (a portion of uneven gloss. A portion where the intensity of light reflection looks different depending on the viewing direction) and a portion other than the uneven gloss portion A part (a part where gloss unevenness was not visually recognized; hereinafter, a normal part) was selected, and the reflection characteristics were measured by the same method as in Comparative Example 1. For the uneven gloss portion and the normal portion, the difference (ΔH) between the reflected light intensity in the direction perpendicular to the polishing direction and the reflected light intensity in the polishing direction was calculated. FIG. 9 shows a distribution of this reflected light intensity difference (ΔH) in an angle range of a light receiving angle of 20 to 70 degrees. In the gloss unevenness portion and the normal portion, both of the measurement result in the polishing direction and the measurement result in the direction perpendicular to the polishing direction, one has a reflected light intensity value over the entire angle range with a light receiving angle of 20 to 70 degrees than the other. It was getting bigger.
As is clear from Table 1 and FIG. 9, the location of gloss unevenness (“gloss unevenness” graph in FIG. 9) has a significantly larger reflected light intensity difference (ΔH) than the normal portion, and the normal portion. A large difference was observed in the reflection characteristics as compared with. It was found that the difference in reflection characteristics at the surface of the glossy hard gold plated terminal surface was the cause of uneven glossiness of the appearance.
In the measurement data of the gloss unevenness portion and the normal part, the above-described B / A is larger than 0.4 and satisfies B / A ≦ 0.4 in both the polishing direction and the direction perpendicular to the polishing direction. There wasn't.

（実施例１）
比較例２と同じ光沢ムラを含む光沢硬質金めっき端子表面にジェットスクラブ処理を行い、梨地表面を有する硬質金めっき端子を得た。ジェットスクラブ装置は（株）石井表記製を使用した。砥粒には粒径範囲が１０４μｍ〜５０μｍの商品名サクランダム＃２２０を用いた。スプレー圧０．２ＭＰａ、搬送速度２．５ｍ／分の条件で処理した。
比較例１と同じ条件で反射特性を測定した。得られた反射光強度分布のグラフを図１０および図１１に示す。図１０は研磨方向の測定結果、図１１は研磨方向に対する直角方向の測定結果である。 Example 1
The surface of the glossy hard gold-plated terminal including the same gloss unevenness as in Comparative Example 2 was subjected to jet scrub treatment to obtain a hard gold-plated terminal having a satin surface. A jet scrub apparatus manufactured by Ishii Notation Co., Ltd. was used. As the abrasive grains, trade name Sac Random # 220 having a particle size range of 104 μm to 50 μm was used. The treatment was performed under conditions of a spray pressure of 0.2 MPa and a conveyance speed of 2.5 m / min.
The reflection characteristics were measured under the same conditions as in Comparative Example 1. The graphs of the obtained reflected light intensity distribution are shown in FIGS. FIG. 10 shows the measurement result in the polishing direction, and FIG. 11 shows the measurement result in the direction perpendicular to the polishing direction.

研磨方向、研磨方向に対する直角方向のいずれについても、Ｂ／Ａ≦０．４を満たす反射特性が得られていることを確認できた。
また、表１、図１０、図１１の結果から、ジェットスクラブ処理を行うことによって、比較例１、２に比べて受光角４５度±３度の角度範囲の反射光強度が相対的に低下し、それ以外の角度の反射光強度が相対的に増加していることが判った。ジェットスクラブ処理前に目視で光沢ムラが観察されていた個所とそれ以外の個所との反射特性の差がほとんど認められなかった。研磨方向、研磨方向に対する直角方向のいずれについても接触端子面の光沢ムラは目視では殆ど確認できない程度であり、どの方向から見ても外観の光沢が均一であった。 It was confirmed that reflection characteristics satisfying B / A ≦ 0.4 were obtained in both the polishing direction and the direction perpendicular to the polishing direction.
Further, from the results of Table 1, FIG. 10, and FIG. 11, by performing the jet scrub process, the reflected light intensity in the angle range of the light receiving angle of 45 degrees ± 3 degrees is relatively lowered as compared with Comparative Examples 1 and 2. It was found that the reflected light intensity at other angles was relatively increased. There was almost no difference in reflection characteristics between the portion where uneven gloss was visually observed before the jet scrub treatment and the other portions. In both the polishing direction and the direction perpendicular to the polishing direction, the gloss unevenness on the contact terminal surface was almost unnoticeable by visual observation, and the gloss of the appearance was uniform from any direction.

上述のように、本発明によれば、硬質金めっき端子の接触端子面を、梨地処理によって、Ｂ／Ａ≦０．４を満たす反射特性を持つ梨地表面とすることにより、接触端子面の光沢を均一化することができる。その結果、高い品質イメージを確保できる。   As described above, according to the present invention, the contact terminal surface of the hard gold-plated terminal is made into a satin surface having a reflection characteristic satisfying B / A ≦ 0.4 by the satin treatment, so that the gloss of the contact terminal surface is obtained. Can be made uniform. As a result, a high quality image can be secured.

図１２は、絶縁樹脂板１３の表面に、補強繊維５１によってメッシュ状に形成された補強材５２が樹脂中に埋め込まれてなる補強層５３を備え、この補強層５３上にパッド状の前記接触端子１４、硬質金めっき端子１１が形成されている構成の接触端子付き基板を示す。補強層５３は、繰り返し挿抜による基板及び硬質金めっき端子１１の局所的な変形を防止するものであり、絶縁樹脂板１３の表面の内、接触端子１４の形成位置に設けられる。配線１２の形成位置に設ける必要は無い。
この場合、補強層５３の補強繊維５１の存在が、接触端子１４に施した硬質電気金めっき１５ｂの梨地処理前の表面状態に影響を与えて、接触端子面１５ｃに、補強繊維５１に対応する筋状の光沢ムラが観察されるケースがある。しかしながら、本発明では、硬質電気金めっき１５ｂ表面の梨地処理によって、接触端子面１５ｃの光沢を均一にすることができる。このため、補強層５３を設けても、接触端子面１５ｃの美観を容易に確保できる。 12 includes a reinforcing layer 53 in which a reinforcing material 52 formed in a mesh shape with reinforcing fibers 51 is embedded in a resin on the surface of the insulating resin plate 13, and the pad-like contact is formed on the reinforcing layer 53. The board | substrate with a contact terminal of the structure in which the terminal 14 and the hard gold plating terminal 11 are formed is shown. The reinforcing layer 53 prevents local deformation of the substrate and the hard gold plating terminal 11 due to repeated insertion and extraction, and is provided at the position where the contact terminal 14 is formed on the surface of the insulating resin plate 13. It is not necessary to provide the wiring 12 at the position where it is formed.
In this case, the presence of the reinforcing fiber 51 of the reinforcing layer 53 affects the surface state of the hard electrogold plating 15b applied to the contact terminal 14 before the matte treatment, and corresponds to the reinforcing fiber 51 on the contact terminal surface 15c. There are cases where streaky uneven gloss is observed. However, in the present invention, the gloss of the contact terminal surface 15c can be made uniform by the satin treatment on the surface of the hard electrogold plating 15b. For this reason, even if the reinforcing layer 53 is provided, the aesthetic appearance of the contact terminal surface 15c can be easily ensured.

硬質金めっき端子としては、必ずしも、平坦な接触端子面を持つものに限定されず、例えば図１３（ａ）に示す硬質金めっき端子１１（区別のため、図中符号１１Ｂを付す）ように、接触端子面が湾曲面になっているものも採用可能である。
例えば、端子部付き配線基板の端子部１４へのめっき膜１５の形成をセミアディティブ法で行う場合、めっき条件によっては、端子部１４の周囲に形成したパターンめっきレジスト１６の近傍で端子部１４の端子面１４ａの中央部に比べてめっきが析出しにくい傾向が顕著になり、端子部１４の端子面１４ａ上に、凸曲面の接触端子面１５ｃを持つめっき膜１５が形成される。端子部１４の端子面１４ａが長方形状の場合は、端子面１４ａ上にめっき膜１５が略半割り円柱状（いわゆる蒲鉾状）に形成される。この場合、接触端子面１５ｃのジェットスクラブ処理又は液体ホーニング処理は、例えば端子部付き配線基板を傾動させて、砥粒を水に分散させた液体の接触端子面に対する照射角度を変えること等によって、接触端子面全体の梨地処理を実現できる。 The hard gold-plated terminal is not necessarily limited to one having a flat contact terminal surface, for example, as shown in FIG. 13 (a), a hard gold-plated terminal 11 (indicated by reference numeral 11B in the figure). A contact terminal surface having a curved surface can also be used.
For example, when the plating film 15 is formed on the terminal portion 14 of the wiring board with the terminal portion by a semi-additive method, depending on the plating conditions, the terminal portion 14 is formed near the pattern plating resist 16 formed around the terminal portion 14. The tendency for plating to be less likely to deposit compared to the central portion of the terminal surface 14a becomes prominent, and the plating film 15 having the convex contact terminal surface 15c is formed on the terminal surface 14a of the terminal portion 14. When the terminal surface 14a of the terminal portion 14 is rectangular, the plating film 15 is formed on the terminal surface 14a in a substantially halved columnar shape (so-called bowl shape). In this case, the jet scrub process or the liquid honing process for the contact terminal surface 15c is performed by, for example, tilting the wiring board with terminal portions and changing the irradiation angle of the liquid in which abrasive grains are dispersed in water with respect to the contact terminal surface. It is possible to achieve a satin finish on the entire contact terminal surface.

図１３（ｂ）に示すように、上述の硬質金めっき端子１１Ｂについても、図６に例示した反射特性測定装置４を用いて反射特性測定を行える。
接触端子面１５ｃに、入射光４４を照射する照射点４６を設定し、該照射点４６において前記接触端子面１５ｃに垂直の仮想垂直線４７に対する傾斜角度（入射角）が４５度の入射光４４を接触端子面１５ｃに照射する。入射光４４はその光軸を照射点４６に一致させる。そして、入射光４４が接触端子面１５ｃで反射した反射光を受光器４２で受光して、反射角４５±２５度の角度範囲の反射光強度分布を解析する。 As shown in FIG. 13B, the above-described hard gold plating terminal 11B can also perform reflection characteristic measurement using the reflection characteristic measuring device 4 illustrated in FIG.
An irradiation point 46 for irradiating incident light 44 is set on the contact terminal surface 15c, and the incident light 44 has an inclination angle (incident angle) of 45 degrees with respect to a virtual vertical line 47 perpendicular to the contact terminal surface 15c at the irradiation point 46. Is applied to the contact terminal surface 15c. Incident light 44 has its optical axis aligned with irradiation point 46. The reflected light reflected by the contact terminal surface 15c of the incident light 44 is received by the light receiver 42, and the reflected light intensity distribution in the angle range of the reflection angle 45 ± 25 degrees is analyzed.

本発明は、上記実施形態に限定されず、適宜変更が可能である。
硬質金めっき端子１１の表面の光沢の要求度が低く、光沢が乏しくても良い場合には、硬質電気金めっきとして、光沢硬質電気めっきを採用する必要は無く、光沢剤を含まないめっき浴での電気めっきによって得た硬質電気金めっきを採用することも可能である。この場合でも、硬質電気金めっき表面の梨地処理が、接触端子１４にバフ研磨によって形成される研磨筋や既述の補強繊維が接触端子面の表面状態、美観に影響を与えることの抑制あるいは防止に寄与することは言うまでも無い。
また、本発明では、硬質電気金めっきの梨地表面によって、硬質金めっき端子の美観確保を容易に実現できることから、硬質電気金めっきを表層とするめっき膜を形成する前の接触端子表面の研磨の精度管理を緩和できる等の利点があり、研磨時間の短縮等が可能である。また、接触端子に清浄な表面が確保されている場合は、研磨工程を省略することも可能となる。 The present invention is not limited to the above embodiment, and can be modified as appropriate.
When the required level of gloss on the surface of the hard gold plating terminal 11 is low and the luster may be poor, it is not necessary to use the glossy hard electroplating as the hard electrogold plating, and the plating bath does not contain a brightener. It is also possible to employ hard electrogold plating obtained by electroplating. Even in this case, the matte treatment of the surface of the hard electroplated gold can suppress or prevent the polishing streaks formed by buffing the contact terminals 14 and the reinforcing fibers described above from affecting the surface state and aesthetics of the contact terminal surface. Needless to say, it contributes to
Further, in the present invention, it is possible to easily realize the aesthetic appearance of the hard gold plated terminal by the surface of the hard electro gold plating, so that the surface of the contact terminal is polished before forming the plating film having the hard electro gold plating as a surface layer. There is an advantage that accuracy control can be relaxed and the polishing time can be shortened. Further, when a clean surface is secured on the contact terminal, the polishing step can be omitted.

本発明に係る１実施形態のＩＣメモリーカードを示す図である。1 is a diagram showing an IC memory card according to an embodiment of the present invention. 本発明に係る１実施形態の接触端子付き基板に設けられている硬質金めっき端子付近を拡大して示した斜視図である。It is the perspective view which expanded and showed the hard gold plating terminal vicinity provided in the board | substrate with a contact terminal of one Embodiment which concerns on this invention. 図２の接触端子付き基板の硬質金めっき端子付近の構造を拡大して示した断面図であり、（ａ）は図２のＡ−Ａ線断面矢視図、（ｂ）は図２のＢ−Ｂ線断面矢視図である。It is sectional drawing which expanded and showed the structure of the hard gold plating terminal vicinity of the board | substrate with a contact terminal of FIG. 2, (a) is the sectional view on the AA line of FIG. 2, (b) is B of FIG. FIG. （ａ）、（ｂ）は別態様の硬質金めっき端子の構造を示す断面図である。(A), (b) is sectional drawing which shows the structure of the hard gold plating terminal of another aspect. 硬質金めっき端子の構造を示す拡大断面図である。It is an expanded sectional view showing the structure of a hard gold plating terminal. 反射特性測定装置の構成を示す図である。It is a figure which shows the structure of a reflection characteristic measuring apparatus. 比較例１の光沢硬質金めっき端子の接触端子面の研磨方向における光反射特性の測定結果を示すグラフである。It is a graph which shows the measurement result of the light reflection characteristic in the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of the comparative example 1. 比較例１の光沢硬質金めっき端子の接触端子面の研磨方向に対する直角方向における光反射特性の測定結果を示すグラフである。It is a graph which shows the measurement result of the light reflection characteristic in the direction orthogonal to the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of the comparative example 1. 比較例２の光反射特性の測定結果を示すグラフであり、光沢硬質金めっき端子の光沢ムラ部分と正常部とについて、接触端子面の研磨方向に対する直角方向における光反射特性を測定した結果を示す。It is a graph which shows the measurement result of the light reflection characteristic of the comparative example 2, and shows the result of measuring the light reflection characteristic in the direction perpendicular to the polishing direction of the contact terminal surface for the gloss uneven portion and the normal portion of the glossy hard gold plated terminal. . 実施例１の光沢硬質金めっき端子の接触端子面の研磨方向における光反射特性の測定結果を示すグラフである。It is a graph which shows the measurement result of the light reflection characteristic in the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of Example 1. FIG. 実施例１の光沢硬質金めっき端子の接触端子面の研磨方向に対する直角方向における光反射特性の測定結果を示すグラフである。It is a graph which shows the measurement result of the light reflection characteristic in the direction orthogonal to the grinding | polishing direction of the contact terminal surface of the glossy hard gold plating terminal of Example 1. FIG. 補強繊維からなるメッシュ状の補強材が樹脂中に埋設されている補強層を具備する接触端子付き基板の例を示す断面図である。It is sectional drawing which shows the example of the board | substrate with a contact terminal which comprises the reinforcement layer by which the mesh-shaped reinforcement which consists of a reinforcement fiber is embed | buried in resin. （ａ）は湾曲面（凸曲面）の接触端子面を持つ硬質金めっき端子、該硬質金めっき端子を具備する接触端子付き基板の例を示す図、（ｂ）は図１３（ａ）の硬質金めっき端子の反射特性特性を説明する図である。形成する(A) is a figure which shows the example of the hard gold plating terminal which has a contact terminal surface of a curved surface (convex curved surface), and a board | substrate with a contact terminal which comprises this hard gold plating terminal, (b) is the hard of FIG. 13 (a). It is a figure explaining the reflective characteristic characteristic of a gold plating terminal. Form

符号の説明Explanation of symbols

１…接触端子付き基板、１１…硬質金めっき端子、１２…配線、１３…絶縁樹脂板、１４…接触端子、１４ａ…端子面、１５…めっき膜、１５ａ…ニッケルめっき、電気ニッケルめっき（光沢電気ニッケルめっき）、１５ｂ…硬質金めっき（光沢硬質電気金めっき）、１５ｃ…接触端子面、１６…パターンめっきレジスト、２…外装ケース、２１…窓、３…ＩＣメモリーカード、４…反射特性測定装置、４２…受光器、５１…補強繊維、５２…補強材、５３…補強層。   DESCRIPTION OF SYMBOLS 1 ... Board | substrate with a contact terminal, 11 ... Hard gold plating terminal, 12 ... Wiring, 13 ... Insulating resin board, 14 ... Contact terminal, 14a ... Terminal surface, 15 ... Plating film, 15a ... Nickel plating, electro nickel plating (gloss electric) Nickel plating), 15b ... hard gold plating (bright hard electro gold plating), 15c ... contact terminal surface, 16 ... pattern plating resist, 2 ... exterior case, 21 ... window, 3 ... IC memory card, 4 ... reflection characteristic measuring device , 42 ... light receiver, 51 ... reinforcing fiber, 52 ... reinforcing material, 53 ... reinforcing layer.

Claims (10)

ＩＣメモリーカード用の接触端子付き基板であって、
配線基板に設けられた接触端子が硬質電気金めっきを表層とするめっき膜で被覆され、前記硬質電気金めっきの表面が梨地状とされていることを特徴とする接触端子付き基板。 A substrate with contact terminals for an IC memory card,
A substrate with a contact terminal, wherein a contact terminal provided on a wiring board is coated with a plating film having a hard electrogold plating as a surface layer, and the surface of the hard electrogold plating has a satin finish. 前記硬質電気金めっき表面は、該硬質電気金めっき表面に入射角４５度で照射した入射光の反射光を受光器で受光して、前記入射光に対する反射角４５±２５度の角度範囲について反射光強度分布を解析した場合に、反射角４５±２５度の範囲の全受光量Ａと、反射角４５±３度の範囲の全受光量ＢとがＢ／Ａ≦０．４を満たす梨地表面であることを特徴とする請求項１記載の接触端子付き基板。   The hard electrogold plating surface receives reflected light of incident light irradiated on the hard electrogold plating surface at an incident angle of 45 degrees with a light receiver, and reflects the reflected light with respect to an angle range of 45 ± 25 degrees with respect to the incident light. When analyzing the light intensity distribution, the satin surface where the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees satisfy B / A ≦ 0.4 The substrate with contact terminals according to claim 1, wherein: 梨地状表面を有する前記硬質電気金めっきが、光沢電気めっきによって得られた硬質電気金めっき膜の表面を、ジェットスクラブ処理又は液体ホーニング処理によって梨地状としたものであることを特徴とする請求項１又は２記載の接触端子付き基板。   The hard electrogold plating having a matte surface is characterized in that the surface of a hard electrogold plating film obtained by gloss electroplating is made into a satin state by jet scrubbing or liquid honing. The substrate with a contact terminal according to 1 or 2. 前記めっき膜が、前記接触端子の表面に形成されたニッケルめっきと、このニッケルめっきを覆うように形成された前記硬質電気金めっきとを具備する多層めっき膜であることを特徴とする請求項１〜３のいずれかに記載の接触端子付き基板。   2. The multilayer plating film according to claim 1, wherein the plating film includes a nickel plating formed on a surface of the contact terminal and the hard electric gold plating formed so as to cover the nickel plating. The board | substrate with a contact terminal in any one of -3. 前記配線基板は、絶縁樹脂板の表面に、補強繊維によってメッシュ状に形成された補強材が樹脂中に埋め込まれてなる補強層を備え、パッド状の前記接触端子が前記補強層上に形成されていることを特徴とする請求項１〜４のいずれかに記載の接触端子付き基板。   The wiring board includes a reinforcing layer in which a reinforcing material formed in a mesh shape with reinforcing fibers is embedded in a resin on the surface of an insulating resin plate, and the pad-shaped contact terminals are formed on the reinforcing layer. The board | substrate with a contact terminal in any one of Claims 1-4 characterized by the above-mentioned. 請求項１〜５のいずれかに記載の接触端子付き基板を具備することを特徴とするＩＣメモリーカード。   An IC memory card comprising the substrate with contact terminals according to claim 1. 硬質電気金めっきを表層とするめっき膜で被覆された接触端子を具備する接触端子付き基板の製造方法であって、
配線基板に設けられている接触端子に、硬質電気金めっきを表層とするめっき膜を形成するめっき工程と、前記硬質電気金めっきの表面を、ジェットスクラブ処理又は液体ホーニング処理によって梨地状とする梨地処理工程とを具備することを特徴とする接触端子付き基板の製造方法。 A method of manufacturing a substrate with a contact terminal comprising a contact terminal coated with a plating film having a hard electrogold plating as a surface layer,
A plating step for forming a plating film having hard electrogold plating as a surface layer on a contact terminal provided on the wiring board, and a satin finish in which the surface of the hard electrogold plating is subjected to a jet scrub treatment or a liquid honing treatment. A process for producing a substrate with contact terminals, comprising: a treatment step. 前記めっき工程は、光沢剤を含むめっき浴を用いる光沢電気めっきによって前記接触端子に電気ニッケルめっきを施すニッケルめっき工程と、前記ニッケルめっき工程にて得た前記電気ニッケルめっきの表面に、光沢剤を含むめっき浴を用いる光沢電気めっきによって前記硬質電気金めっきを施す硬質金めっき工程とを具備することを特徴とする請求項７記載の接触端子付き基板の製造方法。   In the plating step, a brightening agent is applied to the surface of the nickel electroplating obtained in the nickel plating step, and a nickel plating step of applying electronickel plating to the contact terminals by bright electroplating using a plating bath containing a brightening agent. A method for producing a substrate with a contact terminal according to claim 7, further comprising: a hard gold plating step in which the hard electrogold plating is performed by gloss electroplating using a plating bath. 前記梨地処理工程にて、前記硬質電気金めっきに、該硬質電気金めっき表面に入射角４５度で照射した入射光の反射光を受光器で受光して、前記入射光に対する反射角４５±２５度の角度範囲について反射光強度分布を解析した場合に、反射角４５±２５度の範囲の全受光量Ａと、反射角４５±３度の範囲の全受光量ＢとがＢ／Ａ≦０．４を満たす梨地表面を形成することを特徴とする請求項７又は８記載の接触端子付き基板の製造方法。   In the matte treatment step, reflected light of incident light irradiated onto the surface of the hard electrogold plating at an incident angle of 45 degrees is received by a light receiver in the hard electrogold plating, and a reflection angle of 45 ± 25 with respect to the incident light is received. When the reflected light intensity distribution is analyzed for an angular range of degrees, the total received light amount A in the range of the reflection angle 45 ± 25 degrees and the total received light quantity B in the range of the reflection angle 45 ± 3 degrees are B / A ≦ 0 9. A method for producing a substrate with a contact terminal according to claim 7, wherein a satin surface satisfying .4 is formed. 前記接触端子をバフ研磨する研磨工程を行ってから前記めっき工程を行うことを特徴とする請求項７〜９のいずれかに記載の接触端子付き基板の製造方法。   The method for manufacturing a substrate with contact terminals according to claim 7, wherein the plating step is performed after performing a polishing step of buffing the contact terminals.

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