JP2009170835A5 - - Google Patents
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- Publication number
- JP2009170835A5 JP2009170835A5 JP2008010121A JP2008010121A JP2009170835A5 JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5 JP 2008010121 A JP2008010121 A JP 2008010121A JP 2008010121 A JP2008010121 A JP 2008010121A JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- external electrode
- main body
- electronic component
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000000919 ceramic Substances 0.000 claims 4
- 230000001590 oxidative Effects 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Claims (3)
F1>F2
の関係を満たしていることを特徴とするセラミック電子部品。 A main body, an internal electrode opposed to the internal electrode at a predetermined interval, and an external electrode electrically connected to the internal electrode and provided outside the main body, the external electrode being an internal electrode A ceramic electronic component having a resin external electrode that is electrically connected to the main body and does not include glass provided in contact with the main body, and a plating electrode provided on an outer surface of the resin external electrode. When the bonding strength of the resin external electrode is F1, and the bonding strength of the resin external electrode and the plating electrode is F2,
F1> F2
A ceramic electronic component characterized by satisfying the above relationship.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008010121A JP5071118B2 (en) | 2008-01-21 | 2008-01-21 | Ceramic electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008010121A JP5071118B2 (en) | 2008-01-21 | 2008-01-21 | Ceramic electronic components |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009170835A JP2009170835A (en) | 2009-07-30 |
JP2009170835A5 true JP2009170835A5 (en) | 2011-03-03 |
JP5071118B2 JP5071118B2 (en) | 2012-11-14 |
Family
ID=40971654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008010121A Active JP5071118B2 (en) | 2008-01-21 | 2008-01-21 | Ceramic electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5071118B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5246207B2 (en) * | 2010-06-04 | 2013-07-24 | 株式会社村田製作所 | Chip-type electronic components |
US8988855B2 (en) | 2011-10-31 | 2015-03-24 | Murata Manufacturing Co., Ltd. | Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle |
US9202640B2 (en) | 2011-10-31 | 2015-12-01 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
US9490055B2 (en) | 2011-10-31 | 2016-11-08 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
JP6673273B2 (en) * | 2016-09-28 | 2020-03-25 | 株式会社村田製作所 | Electronic components |
KR20190116158A (en) * | 2019-08-23 | 2019-10-14 | 삼성전기주식회사 | Multilayered electronic component |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3887870B2 (en) * | 1997-04-02 | 2007-02-28 | 松下電器産業株式会社 | Conductive connection structure |
JP2005217126A (en) * | 2004-01-29 | 2005-08-11 | Kyocera Corp | Manufacturing method for capacitor |
JP2007073883A (en) * | 2005-09-09 | 2007-03-22 | Rohm Co Ltd | Chip capacitor |
KR101358977B1 (en) * | 2005-12-22 | 2014-02-06 | 나믹스 코포레이션 | Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste |
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2008
- 2008-01-21 JP JP2008010121A patent/JP5071118B2/en active Active
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