JP2009135295A - Flexible substrate supporting device, flexible substrate, and mounting method thereof - Google Patents

Flexible substrate supporting device, flexible substrate, and mounting method thereof Download PDF

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JP2009135295A
JP2009135295A JP2007310678A JP2007310678A JP2009135295A JP 2009135295 A JP2009135295 A JP 2009135295A JP 2007310678 A JP2007310678 A JP 2007310678A JP 2007310678 A JP2007310678 A JP 2007310678A JP 2009135295 A JP2009135295 A JP 2009135295A
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flexible substrate
mounting
hole
substrate support
component
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Nobutaka Itabashi
信隆 板橋
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Panasonic Corp
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Panasonic Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible substrate supporting device improved in positioning precision of a mounted component. <P>SOLUTION: A flexible substrate supporting device 9 comprises a mounting reference part 11 provided at the position corresponding to a fitting reference hole 6 provided to a flexible substrate 1. The mounting reference part 11 has such feature color as detectable with a sensor of a component mounting device through the mounting reference hole 6. In a component mounting process to the flexible substrate 1, a component 3 is mounted, using the mounting reference part 11 as a reference position. In a fitting process of the flexible substrate 1, the flexible substrate 1 is fitted using the fitting reference hole 6 as a reference position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、フレキシブル基板への部品実装工程で用いられるフレキシブル基板支持装置およびフレキシブル基板に関するものである。   The present invention relates to a flexible substrate support device and a flexible substrate used in a component mounting process on a flexible substrate.

カメラ装置などの電子機器には、様々な電子部品（ＣＣＤチップやマイコンチップなど）を実装したモジュールが組み込まれている。モジュールは、フレキシブル基板上に電子部品を実装した後に、電子機器の筐体等に取り付けられる。   Electronic devices such as camera devices incorporate modules in which various electronic components (CCD chips, microcomputer chips, etc.) are mounted. The module is mounted on a housing or the like of the electronic device after mounting the electronic component on the flexible substrate.

従来、フレキシブル基板に部品を実装する方法として、フレキシブル基板の端部に実装装置のセンサが認識可能な実装用認識マークを設けておき、この実装用認識マークを基準として部品の位置決めをして実装を行う方法が知られている（例えば特許文献１）。部品の実装が完了した後、フレキシブル基板の端部が取り除かれて、モジュールが生産される。
特開２００７−１７３３２９号公報（第３−５頁、第１図） Conventionally, as a method of mounting a component on a flexible board, a mounting recognition mark that can be recognized by the sensor of the mounting device is provided at the end of the flexible board, and the component is positioned and mounted based on this mounting recognition mark. There is known a method of performing (for example, Patent Document 1). After the component mounting is completed, the end of the flexible substrate is removed to produce a module.
JP 2007-173329 A (page 3-5, FIG. 1)

このようなモジュールを電子機器の筐体等に取り付ける方法としては、従来、モジュールの端部に位置合わせ取付け用の基準穴を設けておき、この基準穴を基準としてモジュールの位置合わせをして取付けを行う方法が知られている（例えば特許文献２）。
特開２００２−６５１５号公報（第２−５頁、第３図、第８図） As a method of attaching such a module to a housing of an electronic device or the like, conventionally, a reference hole for alignment and attachment is provided at the end of the module, and the module is aligned and attached using this reference hole as a reference. There is known a method of performing (for example, Patent Document 2).
Japanese Patent Laid-Open No. 2002-6515 (page 2-5, FIGS. 3 and 8)

しかしながら、従来の実装方法と取付け方法では、部品の実装用の基準（実装用認識マーク）とモジュールの取付け用の基準（基準穴）とがそれぞれ別々に設けられているので、その分だけ最終的な部品の位置精度（実装取付け後の部品の位置精度）に限界があるという問題があった。すなわち、従来の方法では、実装の位置決め誤差と取付けの位置合わせ誤差に、実装用の基準と取付け用の基準との間の位置の誤差が加算されることになり、その分だけ最終的な部品の位置精度が低下することになる。   However, in the conventional mounting method and mounting method, the reference for mounting the component (recognition mark for mounting) and the reference for mounting the module (reference hole) are provided separately. There is a problem in that there is a limit to the position accuracy of parts (position accuracy of parts after mounting). In other words, in the conventional method, the positional error between the mounting reference and the mounting reference is added to the mounting positioning error and the mounting alignment error, and the final part is accordingly added. The position accuracy will be lowered.

本発明は、上記従来の問題を解決するためになされたもので、実装取付け後の部品の位置精度を向上することのできるフレキシブル基板支持装置、フレキシブル基板および実装取付け方法を提供することを目的とする。   The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide a flexible substrate support device, a flexible substrate, and a mounting attachment method capable of improving the positional accuracy of components after mounting attachment. To do.

本発明のフレキシブル基板支持装置は、フレキシブル基板への部品実装工程において、前記フレキシブル基板を支持する基板支持部と、前記フレキシブル基板に設けられた取付け用基準穴に対応する位置に設けられ、前記取付け用基準穴を通して部品実装装置のセンサによって検出可能な特徴色を有する実装用基準部と、を備えた構成を有している。   The flexible substrate support device of the present invention is provided at a position corresponding to a substrate support portion for supporting the flexible substrate and a mounting reference hole provided in the flexible substrate in a component mounting process on the flexible substrate, And a mounting reference portion having a characteristic color that can be detected by a sensor of the component mounting apparatus through the reference hole.

この構成により、フレキシブル基板への部品実装工程では、フレキシブル基板の取付け用基準穴を通してフレキシブル基板支持装置の実装用基準部を部品実装装置のセンサが検出し、実装用基準部の位置を基準として、部品の実装が行われる。そして、フレキシブル基板の取付け工程では、フレキシブル基板の取付け用基準穴の位置を基準として、フレキシブル基板の取付けが行われる。このように、実装用の基準と取付け用の基準を共通にすることにより、実装用の基準と取付け用の基準との間の位置の誤差がなくなり、その分だけ実装取付け後の部品の位置精度が向上する。   With this configuration, in the component mounting process on the flexible substrate, the sensor of the component mounting device detects the mounting reference portion of the flexible substrate support device through the reference hole for mounting the flexible substrate, and the position of the mounting reference portion is used as a reference. Parts are mounted. In the flexible substrate mounting process, the flexible substrate is mounted on the basis of the position of the reference hole for mounting the flexible substrate. In this way, by making the mounting standard and mounting standard common, there is no positional error between the mounting standard and mounting standard, and the positional accuracy of parts after mounting and mounting is reduced accordingly. Will improve.

また、本発明のフレキシブル基板支持装置では、前記実装用基準部は、前記基板支持部に設けられた貫通孔部と、前記貫通孔部を覆うように前記基板支持部の裏面側に貼り付けられたテープ部とで構成されており、前記テープ部の貼付け面が前記特徴色を有する構成を有している。   In the flexible substrate support apparatus of the present invention, the mounting reference portion is attached to the through hole portion provided in the substrate support portion and the back surface side of the substrate support portion so as to cover the through hole portion. The tape portion has a configuration in which the sticking surface of the tape portion has the characteristic color.

この構成により、部品実装装置のセンサは、フレキシブル基板の取付け用基準穴と基板支持部の貫通孔部を通して、基板支持部の裏面側に貼り付けられたテープ部の貼付け面の特徴色を検出することができる。このように、貫通孔部とテープ部という比較的簡易な構成で、実装用基準部を構成することができる。この場合、テープ部が基板支持部の裏面側から貼り付けられるので、フレキシブル基板の載置面である表面側にはテープ部による段差が形成されず、フレキシブル基板が安定に支持される。   With this configuration, the sensor of the component mounting apparatus detects the characteristic color of the attachment surface of the tape portion attached to the back surface side of the substrate support portion through the reference hole for mounting the flexible substrate and the through hole portion of the substrate support portion. be able to. Thus, the mounting reference portion can be configured with a relatively simple configuration of the through-hole portion and the tape portion. In this case, since the tape part is affixed from the back surface side of the substrate support part, a step due to the tape part is not formed on the front surface side, which is the mounting surface of the flexible substrate, and the flexible substrate is stably supported.

本発明のフレキシブル基板は、部品実装工程において、上記のフレキシブル基板支持装置に支持されるフレキシブル基板であって、前記フレキシブル基板の取付け工程における基準位置に取付け用基準穴を備え、前記取付け基準穴は、前記フレキシブル基板支持装置の実装用基準部に対応する位置に設けられた構成を有している。   The flexible substrate of the present invention is a flexible substrate supported by the flexible substrate support device in the component mounting process, and includes a mounting reference hole at a reference position in the mounting process of the flexible substrate, and the mounting reference hole is And a configuration provided at a position corresponding to the mounting reference portion of the flexible substrate support device.

この構成により、フレキシブル基板への部品実装工程では、フレキシブル基板の取付け用基準穴を通してフレキシブル基板支持装置の実装用基準部を部品実装装置のセンサが検出し、実装用基準部の位置を基準として、部品の実装が行われる。そして、フレキシブル基板の取付け工程では、フレキシブル基板の取付け用基準穴の位置を基準として、フレキシブル基板の取付けが行われる。このように、実装用の基準と取付け用の基準を共通にすることにより、実装用の基準と取付け用の基準との間の位置の誤差がなくなり、その分だけ実装取付け後の部品の位置精度が向上する。   With this configuration, in the component mounting process on the flexible substrate, the sensor of the component mounting device detects the mounting reference portion of the flexible substrate support device through the reference hole for mounting the flexible substrate, and the position of the mounting reference portion is used as a reference. Parts are mounted. In the flexible substrate mounting process, the flexible substrate is mounted on the basis of the position of the reference hole for mounting the flexible substrate. In this way, by making the mounting standard and mounting standard common, there is no positional error between the mounting standard and mounting standard, and the positional accuracy of parts after mounting and mounting is reduced accordingly. Will improve.

また、本発明のフレキシブル基板では、前記取付け基準穴は、前記取付け工程の基準位置に対する遊びがないように形成された構成を有している。   In the flexible substrate of the present invention, the attachment reference hole has a configuration formed so that there is no play with respect to the reference position in the attachment process.

この構成により、フレキシブル基板の取付けのときの位置合わせ誤差がなくなり、その分だけ実装取付け後の部品の位置精度が向上する。   With this configuration, there is no alignment error when mounting the flexible substrate, and the positional accuracy of the parts after mounting is improved accordingly.

本発明の実装取付け方法は、フレキシブル基板への部品実装工程において、上記のフレキシブル基板支持装置の上に、上記のフレキシブル基板を重ね、部品実装装置のセンサにより、前記フレキシブル基板の取付け用基準穴を通して前記フレキシブル基板支持装置の実装用基準部を検出し、前記実装用基準部を基準位置として用いて、前記フレキシブル基板への部品の実装を行い、前記フレキシブル基板の取付け工程において、前記取付け用基準穴を基準位置として用いて、前記フレキシブル基板の取付けを行う。   In the mounting mounting method of the present invention, in the component mounting process on the flexible substrate, the flexible substrate is overlaid on the flexible substrate support device, and the sensor of the component mounting device passes through the reference hole for mounting the flexible substrate. A mounting reference portion of the flexible substrate supporting device is detected, and the mounting reference portion is used as a reference position to mount a component on the flexible substrate. In the mounting step of the flexible substrate, the mounting reference hole The flexible substrate is attached using as a reference position.

この方法により、フレキシブル基板への部品実装工程では、フレキシブル基板の取付け用基準穴を通してフレキシブル基板支持装置の実装用基準部を部品実装装置のセンサが検出し、実装用基準部の位置を基準として、部品の実装が行われる。そして、フレキシブル基板の取付け工程では、フレキシブル基板の取付け用基準穴の位置を基準として、フレキシブル基板の取付けが行われる。このように、実装用の基準と取付け用の基準を共通にすることにより、実装用の基準と取付け用の基準との間の位置の誤差がなくなり、その分だけ実装取付け後の部品の位置精度を向上することができる。   With this method, in the component mounting process on the flexible substrate, the sensor of the component mounting device detects the mounting reference portion of the flexible substrate supporting device through the reference hole for mounting the flexible substrate, and the position of the mounting reference portion is used as a reference. Parts are mounted. In the flexible substrate mounting process, the flexible substrate is mounted on the basis of the position of the reference hole for mounting the flexible substrate. In this way, by making the mounting standard and mounting standard common, there is no positional error between the mounting standard and mounting standard, and the positional accuracy of parts after mounting and mounting is reduced accordingly. Can be improved.

本発明は、フレキシブル基板に設けられた組立用基準穴に対応する位置に実装用基準部を設けることにより、実装取付け後の部品の位置精度を向上することができるという効果を有するフレキシブル基板支持装置を提供することができるものである。   The present invention provides a flexible substrate support apparatus having an effect that the positional accuracy of components after mounting can be improved by providing a mounting reference portion at a position corresponding to an assembly reference hole provided in the flexible substrate. Can be provided.

以下、本発明の実施の形態のフレキシブル基板およびフレキシブル基板支持装置について、図面を用いて説明する。本実施の形態では、フレキシブル基板にＣＣＤチップ等の電子部品を実装して、カメラ装置用のカメラモジュールを製造する場合を例示する。   Hereinafter, a flexible substrate and a flexible substrate support device according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a case where a camera module for a camera device is manufactured by mounting electronic components such as a CCD chip on a flexible substrate is illustrated.

本実施の形態のフレキシブル基板とフレキシブル基板支持装置の構成を、図１〜図４を用いて説明する。図１は、フレキシブル基板とフレキシブル基板支持装置の斜視図である。図２は、フレキシブル基板の平面図であり、図３は、フレキシブル基板支持装置の平面図である。図４は、フレキシブル基板とフレキシブル基板支持装置の断面図である。   Configurations of the flexible substrate and the flexible substrate support device of the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a flexible substrate and a flexible substrate support device. FIG. 2 is a plan view of the flexible substrate, and FIG. 3 is a plan view of the flexible substrate support device. FIG. 4 is a cross-sectional view of the flexible substrate and the flexible substrate support device.

図１および図２に示すように、フレキシブル基板１の中央部には、カメラモジュールの外形に沿った切込み部２が設けられている。そして、切込み部２の内側の部分に、ＣＣＤチップ等の電子部品３が実装されるカメラモジュール部４が形成されている。この場合、カメラモジュール部４が、切込み部２によって画定されているともいえる。このカメラモジュール部４は、フレキシブル基板１に電子部品３を実装した後、切込み部２に沿って切り取るとカメラモジュールになる部分である。   As shown in FIGS. 1 and 2, a cut portion 2 is provided at the center of the flexible substrate 1 along the outer shape of the camera module. A camera module portion 4 on which an electronic component 3 such as a CCD chip is mounted is formed inside the cut portion 2. In this case, it can be said that the camera module section 4 is defined by the cut section 2. The camera module portion 4 is a portion that becomes a camera module when the electronic component 3 is mounted on the flexible substrate 1 and then cut along the cut portion 2.

カメラモジュール部４の所定箇所には、電子部品３を実装するための実装スペース５が設けられている。また、カメラモジュール部４の端部には、３つの取付け用基準穴６が貫通して設けられている。この取付け用基準穴６は、カメラモジュール部４を取り付けるときの基準位置として用いられる。また、後述するように、この取付け用基準穴６は、電子部品３を実装するときの基準位置としても用いられる。   A mounting space 5 for mounting the electronic component 3 is provided at a predetermined location of the camera module unit 4. Further, three reference holes 6 for attachment are provided through the end portion of the camera module section 4. The mounting reference hole 6 is used as a reference position when the camera module unit 4 is mounted. Further, as will be described later, the mounting reference hole 6 is also used as a reference position when the electronic component 3 is mounted.

この取付け用基準穴６は、取付け工程の基準位置に対する遊びがないように形成されている。例えば、カメラ装置の取付けフレーム７の取付け用凸部８に取付け用基準穴６を嵌め込んで位置合わせが行われる場合、取付け用基準穴６は取付け用凸部８に適嵌する大きさに設定される。   The mounting reference hole 6 is formed so that there is no play with respect to the reference position in the mounting process. For example, when the mounting reference hole 6 is fitted into the mounting convex portion 8 of the mounting frame 7 of the camera device for alignment, the mounting reference hole 6 is set to a size that fits the mounting convex portion 8 appropriately. Is done.

このようなフレキシブル基板１に電子部品３を実装する際、フレキシブル基板１はフレキシブル基板支持装置９の上に載置される（図５参照）。フレキシブル基板１の端部には、フレキシブル基板支持装置９との位置合わせを行うための位置合わせ穴１０が３つ設けられている（図１参照）。   When mounting the electronic component 3 on such a flexible substrate 1, the flexible substrate 1 is placed on the flexible substrate support device 9 (see FIG. 5). At the end of the flexible substrate 1, three alignment holes 10 are provided for alignment with the flexible substrate support device 9 (see FIG. 1).

図１および図３に示すように、フレキシブル基板支持装置９には、フレキシブル基板１に設けられた取付け用基準穴６に対応する位置に、３つの貫通孔１１が設けられている。そして、図４に示すように、この貫通孔１１には裏面側から白色のテープ１２が貼り付けられている。なお、テープ１２は、少なくとも貼付け面が白色であればよい。また、テープ１２の色は、白色に限られるものではなく、部品実装装置（図示せず）の位置決めセンサによって検出可能な色であれば、白色以外の色であってもよい。   As shown in FIGS. 1 and 3, the flexible substrate support device 9 is provided with three through holes 11 at positions corresponding to the attachment reference holes 6 provided in the flexible substrate 1. And as shown in FIG. 4, the white tape 12 is affixed on this through-hole 11 from the back surface side. In addition, the tape 12 should just be a pasting surface at least white. The color of the tape 12 is not limited to white, and may be a color other than white as long as it can be detected by a positioning sensor of a component mounting apparatus (not shown).

また、上述のように、フレキシブル基板１に電子部品３を実装する際、フレキシブル基板１がフレキシブル基板支持装置９の上に載置される（図５参照）。そのため、フレキシブル基板支持装置９の端部には、フレキシブル基板１の位置合わせ穴１０に対応する位置に３つの位置合わせ穴１３が設けられている（図１参照）。本実施の形態では、フレキシブル基板支持装置９の上面の略全面（貫通孔１１や位置合わせ穴１３以外の部分）でフレキシブル基板１が支持される。このような部分は、フレキシブル基板１を支持する基板支持部であるともいえる。   Further, as described above, when the electronic component 3 is mounted on the flexible substrate 1, the flexible substrate 1 is placed on the flexible substrate support device 9 (see FIG. 5). Therefore, three alignment holes 13 are provided at positions corresponding to the alignment holes 10 of the flexible substrate 1 at the end of the flexible substrate support device 9 (see FIG. 1). In the present embodiment, the flexible substrate 1 is supported by substantially the entire upper surface of the flexible substrate support device 9 (portions other than the through holes 11 and the alignment holes 13). It can be said that such a portion is a substrate support portion that supports the flexible substrate 1.

なお、この基板支持部の表面は適度な粘着性を有しており、部品実装工程の途中ではフレキシブル基板１がずれるのを防止することができるとともに、部品実装工程が終了後はフレキシブル基板１を容易に引き剥がすことができる。本実施の形態では、フレキシブル基板支持装置９の基材材質として、例えばガラスエポキシ材などが使用され、粘着材質として、例えばシリコン樹脂などが使用される。   In addition, the surface of this board | substrate support part has moderate adhesiveness, and it can prevent that the flexible substrate 1 slip | deviates in the middle of a component mounting process, and after completion | finish of a component mounting process, the flexible substrate 1 is attached. It can be easily peeled off. In the present embodiment, for example, a glass epoxy material or the like is used as a base material of the flexible substrate support device 9, and a silicon resin or the like is used as an adhesive material.

また、ここでは特に図示しないが、フレキシブル基板支持装置９には、部品実装工程が終了後にフレキシブル基板１を押出しピンを用いて取り外すための押出しピン挿通孔が設けられていてもよい。押出しピンを用いることにより、部品実装工程が終了後にフレキシブル基板１を容易に引き離すことができる。   Although not particularly shown here, the flexible substrate support device 9 may be provided with an extrusion pin insertion hole for removing the flexible substrate 1 using an extrusion pin after the component mounting process is completed. By using the extrusion pin, the flexible substrate 1 can be easily pulled away after the component mounting process is completed.

以上のように構成されたフレキシブル基板１とフレキシブル基板支持装置９を用いた部品実装工程および取付け工程について、図５〜図８を用いて説明する。   A component mounting process and an attaching process using the flexible substrate 1 and the flexible substrate support device 9 configured as described above will be described with reference to FIGS.

本発明の実施の形態のフレキシブル基板１に電子部品３を実装するときには、まず、図５に示すように、フレキシブル基板支持装置９にフレキシブル基板１を載置する。このとき、フレキシブル基板１の位置合わせ穴１０とフレキシブル基板支持装置９の位置合わせ穴１３に位置合わせピン１４を挿入して、フレキシブル基板１とフレキシブル基板支持装置９の位置合わせを行う。   When the electronic component 3 is mounted on the flexible substrate 1 according to the embodiment of the present invention, first, the flexible substrate 1 is placed on the flexible substrate support device 9 as shown in FIG. At this time, the alignment pins 14 are inserted into the alignment holes 10 of the flexible substrate 1 and the alignment holes 13 of the flexible substrate support device 9 to align the flexible substrate 1 and the flexible substrate support device 9.

位置合わせを行った後、フレキシブル基板１の位置合わせ穴１０とフレキシブル基板支持装置９の位置合わせ穴１３を位置合わせピン１４から引き抜いて、フレキシブル基板１をフレキシブル基板支持装置９に載置したままの状態で次工程へ移す。このとき、フレキシブル基板支持装置９の表面（載置面）が適度な粘着性を有しているので、フレキシブル基板１を次工程へ移すときに、フレキシブル基板１の位置がフレキシブル基板支持装置９上でずれることが防止される。   After the alignment, the alignment hole 10 of the flexible substrate 1 and the alignment hole 13 of the flexible substrate support device 9 are pulled out from the alignment pins 14, and the flexible substrate 1 remains mounted on the flexible substrate support device 9. Move on to the next process. At this time, since the surface (mounting surface) of the flexible substrate support device 9 has appropriate adhesiveness, when the flexible substrate 1 is moved to the next process, the position of the flexible substrate 1 is on the flexible substrate support device 9. It is prevented from shifting.

つぎに、図６に示すように、フレキシブル基板１の取付け用基準穴６とフレキシブル基板支持装置９の貫通孔１１を通して、フレキシブル基板支持装置９の裏面側のテープ１２を部品実装装置の位置決めセンサによって検出する。そして、取付け用基準穴６を基準位置として用いて、フレキシブル基板１への電子部品３の実装を行う。このようにして、フレキシブル基板１への部品実装工程が完了する。   Next, as shown in FIG. 6, the tape 12 on the back surface side of the flexible substrate support device 9 is passed through the reference hole 6 for mounting the flexible substrate 1 and the through hole 11 of the flexible substrate support device 9 by the positioning sensor of the component mounting device. To detect. Then, the electronic component 3 is mounted on the flexible substrate 1 using the mounting reference hole 6 as a reference position. In this way, the component mounting process on the flexible substrate 1 is completed.

フレキシブル基板１への電子部品３の実装が完了した後、押出しピン（図示せず）を用いて、フレキシブル基板１をフレキシブル基板支持装置９から引き剥がし、図７に示すように電子部品３が実装されたフレキシブル基板１（カメラモジュール部４）を切り取る。すなわち、切込み部２に沿ってフレキシブル基板１を切り取って、カメラモジュール部４を切り離す。   After the mounting of the electronic component 3 on the flexible substrate 1 is completed, the flexible substrate 1 is peeled off from the flexible substrate support device 9 using an extrusion pin (not shown), and the electronic component 3 is mounted as shown in FIG. Cut the flexible substrate 1 (camera module unit 4). That is, the flexible substrate 1 is cut out along the cut portion 2 to separate the camera module portion 4.

そして、図８に示すように、取付け用基準穴６を基準位置として用いて、電子部品３が実装されたフレキシブル基板１（カメラモジュール部４）の取付けを行う。例えば、取付け用基準穴６をカメラ装置の取付けフレーム７の取付け用凸部８に嵌め込んで、カメラモジュール部４をねじ止めする。このようにして、フレキシブル基板１の取付け工程が完了する。   Then, as shown in FIG. 8, the flexible substrate 1 (camera module unit 4) on which the electronic component 3 is mounted is attached using the attachment reference hole 6 as a reference position. For example, the mounting reference hole 6 is fitted into the mounting convex portion 8 of the mounting frame 7 of the camera device, and the camera module portion 4 is screwed. In this way, the mounting process of the flexible substrate 1 is completed.

このような本発明の実施の形態のフレキシブル基板支持装置９によれば、フレキシブル基板１に設けられた組立用基準穴に対応する位置に実装用基準部を設けることにより、実装取付け後の電子部品３の位置精度を向上することができる。   According to the flexible substrate support device 9 of the embodiment of the present invention as described above, by providing the mounting reference portion at a position corresponding to the assembly reference hole provided in the flexible substrate 1, the electronic component after mounting is mounted. 3 position accuracy can be improved.

すなわち、フレキシブル基板１への部品実装工程では、フレキシブル基板１の取付け用基準穴６を通してフレキシブル基板支持装置９の実装用基準部を部品実装装置のセンサが検出し、実装用基準部の位置を基準として、電子部品３の実装が行われる。そして、フレキシブル基板１の取付け工程では、フレキシブル基板１の取付け用基準穴６の位置を基準として、フレキシブル基板１の取付けが行われる。このように、実装用の基準と取付け用の基準を共通にすることにより、実装用の基準と取付け用の基準との間の位置の誤差がなくなり、その分だけ実装取付け後の電子部品３の位置精度が向上する。   That is, in the component mounting process on the flexible substrate 1, the component mounting device sensor detects the mounting reference portion of the flexible substrate support device 9 through the mounting reference hole 6 of the flexible substrate 1, and the position of the mounting reference portion is used as a reference. As a result, the electronic component 3 is mounted. In the mounting process of the flexible substrate 1, the flexible substrate 1 is mounted on the basis of the position of the mounting reference hole 6 of the flexible substrate 1. In this way, by making the mounting reference and the mounting reference common, there is no position error between the mounting reference and the mounting reference, and the electronic component 3 after mounting is mounted by that much. Position accuracy is improved.

特に、本実施の形態の高画素の撮像素子を用いたカメラ装置では、ＣＣＤチップ３の位置決め精度として、±０．２ｍｍという非常に高い精度が要求される。従来の方法では、カメラモジュールの取付け用の基準穴を形成する際の公差が±０．０５ｍｍ、ＣＣＤチップの実装用の基準マークをプリントパターンで形成する際の公差が±０．１ｍｍ、基準穴と基準マークとの基準同士の公差が±０．１ｍｍである。したがって、基準穴と基準マークを別々に設ける従来の方法では、累積公差が±０．２５ｍｍとなり、±０．２ｍｍというＣＣＤチップ３の位置決め精度の要求を満たすことができない。一方、本実施の形態では、基準穴と基準マークとの基準同士の公差がないので、累積公差が±０．１５ｍｍとなり、±０．２ｍｍというＣＣＤチップ３の非常に高い位置決め精度の要求を満たすことが可能になる。   In particular, in the camera device using the high-pixel imaging device of the present embodiment, a very high accuracy of ± 0.2 mm is required as the positioning accuracy of the CCD chip 3. In the conventional method, the tolerance when forming the reference hole for mounting the camera module is ± 0.05 mm, the tolerance when forming the reference mark for mounting the CCD chip as a print pattern is ± 0.1 mm, and the reference hole The tolerance between the reference marks and the reference mark is ± 0.1 mm. Therefore, in the conventional method in which the reference hole and the reference mark are separately provided, the accumulated tolerance is ± 0.25 mm, and the requirement of the positioning accuracy of the CCD chip 3 of ± 0.2 mm cannot be satisfied. On the other hand, in the present embodiment, since there is no tolerance between the reference holes and the reference marks, the cumulative tolerance is ± 0.15 mm, which satisfies the requirement for the very high positioning accuracy of the CCD chip 3 of ± 0.2 mm. It becomes possible.

また、本実施の形態では、部品実装装置のセンサが、フレキシブル基板１の取付け用基準穴６と基板支持部の貫通孔１１を通して、基板支持部の裏面側に貼り付けられたテープ１２の貼付け面の特徴色を検出することができる。このように、貫通孔１１とテープ１２という比較的簡易な構成で、実装用基準部を構成することができる。この場合、テープ１２が基板支持部の裏面側から貼り付けられるので、フレキシブル基板１の載置面である表面側にはテープ１２による段差が形成されず、フレキシブル基板１が安定に支持される。   In the present embodiment, the sensor of the component mounting apparatus is attached to the tape 12 attached to the back side of the substrate support part through the reference hole 6 for mounting the flexible substrate 1 and the through hole 11 of the substrate support part. Can be detected. Thus, the mounting reference portion can be configured with a relatively simple configuration of the through hole 11 and the tape 12. In this case, since the tape 12 is affixed from the back surface side of the substrate support portion, a step due to the tape 12 is not formed on the front surface which is the mounting surface of the flexible substrate 1, and the flexible substrate 1 is stably supported.

また、本実施の形態では、フレキシブル基板１の取付け基準穴が、取付け工程の基準位置に対する遊びがないように形成されているので、フレキシブル基板１の取付けのときの位置合わせ誤差がなくなり、その分だけ実装取付け後の電子部品３の位置精度が向上する。   Further, in the present embodiment, the mounting reference hole of the flexible substrate 1 is formed so as not to play with respect to the reference position in the mounting process, so that there is no alignment error when the flexible substrate 1 is mounted. Only the positional accuracy of the electronic component 3 after mounting is improved.

以上、本発明の実施の形態を例示により説明したが、本発明の範囲はこれらに限定されるものではなく、請求項に記載された範囲内において目的に応じて変更・変形することが可能である。   The embodiments of the present invention have been described above by way of example, but the scope of the present invention is not limited to these embodiments, and can be changed or modified according to the purpose within the scope of the claims. is there.

以上の例では、実装用基準部を貫通孔とテープで構成した例について説明したが、本発明の範囲はこれに限定されるものではない。例えば、実装用基準部のテープの代わりに、貫通孔に適嵌する嵌込み部材を用いてもよい。また、実装用基準部として貫通孔を形成せず、フレキシブル基板支持装置の上面に印刷等により着色を施してもよい。   In the above example, the example in which the mounting reference portion is configured by the through hole and the tape has been described, but the scope of the present invention is not limited to this. For example, a fitting member that fits into the through hole may be used instead of the tape of the mounting reference portion. Further, the through hole may not be formed as the mounting reference portion, and the upper surface of the flexible substrate support device may be colored by printing or the like.

以上のように、本発明にかかるフレキシブル基板支持装置は、実装取付け後の部品の位置精度を向上することができるという効果を有し、カメラ装置等の部品実装工程で用いられ、有用である。   As described above, the flexible substrate support device according to the present invention has an effect of improving the positional accuracy of components after mounting and mounting, and is useful in the component mounting process of camera devices and the like.

本実施の形態におけるフレキシブル基板とフレキシブル基板支持装置の斜視図The perspective view of the flexible substrate in this Embodiment and a flexible substrate support apparatus フレキシブル基板の平面図Top view of flexible substrate フレキシブル基板支持装置の平面図Plan view of flexible substrate support device フレキシブル基板とフレキシブル基板支持装置の断面図Cross section of flexible substrate and flexible substrate support device フレキシブル基板支持装置にフレキシブル基板を載置した状態を示す斜視図The perspective view which shows the state which mounted the flexible substrate in the flexible substrate support apparatus フレキシブル基板に部品を実装する様子を示す斜視図The perspective view which shows a mode that components are mounted in a flexible substrate 部品を実装したフレキシブル基板を切り離した後の斜視図Perspective view after cutting off the flexible board on which the component is mounted フレキシブル基板を取り付ける様子を示す斜視図The perspective view which shows a mode that a flexible substrate is attached

符号の説明Explanation of symbols

１ フレキシブル基板
３ 電子部品
４ カメラモジュール部
６ 取付け用基準穴
９ フレキシブル基板支持装置
１１ 貫通孔
１２ テープ DESCRIPTION OF SYMBOLS 1 Flexible substrate 3 Electronic component 4 Camera module part 6 Reference hole for attachment 9 Flexible substrate support apparatus 11 Through-hole 12 Tape

Claims (5)

フレキシブル基板への部品実装工程において、前記フレキシブル基板を支持する基板支持部と、
前記フレキシブル基板に設けられた取付け用基準穴に対応する位置に設けられ、前記取付け用基準穴を通して部品実装装置のセンサによって検出可能な特徴色を有する実装用基準部と、
を備えたことを特徴とするフレキシブル基板支持装置。 In the component mounting process on the flexible substrate, a substrate support portion for supporting the flexible substrate,
A mounting reference portion provided at a position corresponding to a mounting reference hole provided in the flexible substrate and having a characteristic color that can be detected by a sensor of a component mounting device through the mounting reference hole;
A flexible substrate supporting apparatus comprising: 前記実装用基準部は、前記基板支持部に設けられた貫通孔部と、前記貫通孔部を覆うように前記基板支持部の裏面側に貼り付けられたテープ部とで構成されており、
前記テープ部の貼付け面が前記特徴色を有することを特徴とする請求項１に記載のフレキシブル基板支持装置。 The mounting reference portion is composed of a through-hole portion provided in the substrate support portion, and a tape portion attached to the back side of the substrate support portion so as to cover the through-hole portion,
The flexible substrate support device according to claim 1, wherein a surface to which the tape portion is attached has the characteristic color. 部品実装工程において、請求項１に記載のフレキシブル基板支持装置に支持されるフレキシブル基板であって、
前記フレキシブル基板の取付け工程における基準位置に取付け用基準穴を備え、
前記取付け基準穴は、前記フレキシブル基板支持装置の実装用基準部に対応する位置に設けられたことを特徴とするフレキシブル基板。 In the component mounting step, a flexible substrate supported by the flexible substrate support device according to claim 1,
A reference hole for mounting is provided at a reference position in the mounting process of the flexible substrate,
The flexible substrate, wherein the attachment reference hole is provided at a position corresponding to a mounting reference portion of the flexible substrate support device. 前記取付け基準穴は、前記取付け工程の基準位置に対する遊びがないように形成されたことを特徴とする請求項３に記載のフレキシブル基板。   The flexible substrate according to claim 3, wherein the attachment reference hole is formed so that there is no play with respect to a reference position in the attachment step. フレキシブル基板への部品実装工程において、
請求項１に記載のフレキシブル基板支持装置の上に、請求項３に記載のフレキシブル基板を重ね、
部品実装装置のセンサにより、前記フレキシブル基板の取付け用基準穴を通して前記フレキシブル基板支持装置の実装用基準部を検出し、
前記実装用基準部を基準位置として用いて、前記フレキシブル基板への部品の実装を行い、
前記フレキシブル基板の取付け工程において、
前記取付け用基準穴を基準位置として用いて、前記フレキシブル基板の取付けを行うことを特徴とするフレキシブル基板の実装取付け方法。 In the component mounting process on the flexible board,
The flexible substrate according to claim 3 is overlaid on the flexible substrate support device according to claim 1,
The mounting reference part of the flexible substrate support device is detected through the reference hole for mounting the flexible substrate by the sensor of the component mounting device,
Using the mounting reference portion as a reference position, mounting the component on the flexible substrate,
In the mounting process of the flexible substrate,
A mounting method for mounting a flexible board, wherein the flexible board is mounted using the mounting reference hole as a reference position.
JP2007310678A 2007-11-30 2007-11-30 Flexible substrate supporting device, flexible substrate, and mounting method thereof Pending JP2009135295A (en)

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US9274289B2 (en) 2009-12-11 2016-03-01 International Business Machines Corporation Fabricating an optical assembly
US8444328B2 (en) 2009-12-11 2013-05-21 International Business Machines Corporation Electro-optical assembly fabrication
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