JP2009132153A - 誘電体シート及び多層セラミック基板の製造方法 - Google Patents
誘電体シート及び多層セラミック基板の製造方法 Download PDFInfo
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- JP2009132153A JP2009132153A JP2008304510A JP2008304510A JP2009132153A JP 2009132153 A JP2009132153 A JP 2009132153A JP 2008304510 A JP2008304510 A JP 2008304510A JP 2008304510 A JP2008304510 A JP 2008304510A JP 2009132153 A JP2009132153 A JP 2009132153A
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- dielectric sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Capacitors (AREA)
- Producing Shaped Articles From Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】本発明の一側面にかかる誘電体シートの製造方法は、キャリアフィルム上に熱可塑性物質からなる陽刻パターンを形成する段階と、上記キャリアフィルム上に上記陽刻パターンを覆うように誘電体スラリーをキャスティングして誘電体シートを形成する段階と、上記陽刻パターンに対応する形状を有する陰刻パターンが上記誘電体シートに残るように上記キャリアフィルムと上記陽刻パターンを除去する段階と、上記誘電体シートの上記陰刻パターンに導電性物質を充填する段階を含む。
【選択図】 図2
Description
101 陽刻パターン
102 異形体
103 キャリアフィルム
200 誘電体シート
201 電極パターン
10 内部電極
50 外部電極
V 導電性ビア
Claims (11)
- キャリアフィルム上に熱可塑性物質からなる陽刻パターンを形成する段階と、
前記キャリアフィルム上に前記陽刻パターンを覆うように誘電体スラリーをキャスティングして誘電体シートを形成する段階と、
前記陽刻パターンに対応する形状を有する陰刻パターンが前記誘電体シートに残るように前記キャリアフィルムと前記陽刻パターンを除去する段階と、
前記誘電体シートの前記陰刻パターンに導電性物質を充填する段階と、
を含むことを特徴とする誘電体シートの製造方法。 - 前記陽刻パターンは、高分子物質からなることを特徴とする請求項1に記載の誘電体シートの製造方法。
- 前記陽刻パターンは、ポリエチレン(PE)、ポリプロピレン(PP)、ポリエチレンテレフタラート(PET)、ポリ塩化ビニル(PVC)またはセルロースからなることを特徴とする請求項1に記載の誘電体シートの製造方法。
- 前記キャリアフィルムと前記陽刻パターンとは同じ物質からなることを特徴とする請求項1に記載の誘電体シートの製造方法。
- 前記誘電体シートを形成する段階の前に前記陽刻パターン上に異形体を形成する段階をさらに含むことを特徴とする請求項1に記載の誘電体シートの製造方法。
- 前記異形体は、シリコン系物質またはフッ素系物質からなることを特徴とする請求項5に記載の誘電体シートの製造方法。
- 前記陽刻パターンを形成する段階は、スクリーン印刷法、グラビア印刷法またはインクジェット印刷法により行われることを特徴とする請求項1に記載の誘電体シートの製造方法。
- 前記誘電体シートを形成する段階は、
前記誘電体スラリーをキャスティングしてから、前記誘電体スラリーを乾燥する段階を含むことを特徴とする請求項1に記載の誘電体シートの製造方法。 - 前記導電性物質は、Ag、Cu、Niのうちの少なくとも1つの物質を含むことを特徴とする請求項1に記載の誘電体シートの製造方法。
- 請求項1〜9のいずれか一項に記載の製造方法により製造された誘電体シートを少なくとも1つ以上含み且つ層間を電気的に連結するための導電性ビアを有する誘電体積層構造物を設ける段階と、
前記誘電体積層構造物を前記誘電体シートの焼成温度で焼成する段階と、
を含むことを特徴とする多層セラミック基板の製造方法。 - 前記多層セラミック基板は、低温同時焼成セラミック基板であることを特徴とする請求項10に記載の多層セラミック基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122163A KR100916067B1 (ko) | 2007-11-28 | 2007-11-28 | 유전체 시트 및 다층 세라믹 기판 제조방법 |
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JP2009132153A true JP2009132153A (ja) | 2009-06-18 |
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JP2008304510A Pending JP2009132153A (ja) | 2007-11-28 | 2008-11-28 | 誘電体シート及び多層セラミック基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090133806A1 (ja) |
JP (1) | JP2009132153A (ja) |
KR (1) | KR100916067B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013542092A (ja) * | 2010-08-26 | 2013-11-21 | エプコス アーゲー | セラミックグリーンシートの製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101682913B1 (ko) * | 2016-01-28 | 2016-12-07 | 한국세라믹기술원 | Ltcc 기반의 유전영동 소자의 제조 방법 |
US10636690B2 (en) * | 2016-07-20 | 2020-04-28 | Applied Materials, Inc. | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62272590A (ja) * | 1986-05-20 | 1987-11-26 | 富士通株式会社 | セラミツク基板の製造方法 |
JPH10199750A (ja) * | 1997-01-10 | 1998-07-31 | Murata Mfg Co Ltd | 積層セラミック電子部品及びその製造方法 |
JP2004063913A (ja) * | 2002-07-30 | 2004-02-26 | Kyocera Corp | 積層型電子部品の製法 |
JP2004319960A (ja) * | 2003-04-01 | 2004-11-11 | Mitsubishi Electric Corp | 多層セラミックパッケージの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240671A (en) * | 1992-06-01 | 1993-08-31 | Microelectronics And Computer Technology Corporation | Method of forming recessed patterns in insulating substrates |
US5935358A (en) * | 1998-04-17 | 1999-08-10 | New Create Corporation | Method of producing a laminate ceramic capacitor |
US20020174935A1 (en) * | 2001-05-25 | 2002-11-28 | Motorola, Inc. | Methods for manufacturing patterned ceramic green-sheets and multilayered ceramic packages |
JP2003197461A (ja) | 2001-12-26 | 2003-07-11 | Kyocera Corp | 積層型電子部品の製法 |
US6733607B2 (en) * | 2002-04-15 | 2004-05-11 | Harris Corporation | Embedded hermetic cavity formation in low temperature cofired ceramic |
JP4360608B2 (ja) | 2003-07-25 | 2009-11-11 | 京セラ株式会社 | 複合シートの製造方法、並びに積層部品の製造方法 |
KR100571246B1 (ko) | 2004-07-23 | 2006-04-13 | 전자부품연구원 | 저온 동시 소성 유전체 조성물, 그를 이용한 그린시트 및그 제조 방법 |
JP2006140400A (ja) | 2004-11-15 | 2006-06-01 | Kyocera Corp | セラミック多層基板及びその製造方法 |
-
2007
- 2007-11-28 KR KR1020070122163A patent/KR100916067B1/ko not_active IP Right Cessation
-
2008
- 2008-11-28 JP JP2008304510A patent/JP2009132153A/ja active Pending
- 2008-11-28 US US12/324,964 patent/US20090133806A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62272590A (ja) * | 1986-05-20 | 1987-11-26 | 富士通株式会社 | セラミツク基板の製造方法 |
JPH10199750A (ja) * | 1997-01-10 | 1998-07-31 | Murata Mfg Co Ltd | 積層セラミック電子部品及びその製造方法 |
JP2004063913A (ja) * | 2002-07-30 | 2004-02-26 | Kyocera Corp | 積層型電子部品の製法 |
JP2004319960A (ja) * | 2003-04-01 | 2004-11-11 | Mitsubishi Electric Corp | 多層セラミックパッケージの製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013542092A (ja) * | 2010-08-26 | 2013-11-21 | エプコス アーゲー | セラミックグリーンシートの製造方法 |
Also Published As
Publication number | Publication date |
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KR20090055312A (ko) | 2009-06-02 |
KR100916067B1 (ko) | 2009-09-08 |
US20090133806A1 (en) | 2009-05-28 |
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