JP2009127014A - Prepreg and its manufacturing method, and metal-clad laminated board and its manufacturing method - Google Patents

Prepreg and its manufacturing method, and metal-clad laminated board and its manufacturing method Download PDF

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JP2009127014A
JP2009127014A JP2007306571A JP2007306571A JP2009127014A JP 2009127014 A JP2009127014 A JP 2009127014A JP 2007306571 A JP2007306571 A JP 2007306571A JP 2007306571 A JP2007306571 A JP 2007306571A JP 2009127014 A JP2009127014 A JP 2009127014A
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metal
rich layer
prepreg
resin
filler
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Koichi Nogami
晃一 野上
Eiji Motobe
英次 元部
Takeshi Koizumi
健 小泉
Tatsushi Takahashi
龍史 高橋
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of prepreg permitting easily manufacturing of a metal-clad laminated board whose metal film has strong adhesiveness, a low coefficient of thermal expansion and high rigidity. <P>SOLUTION: The manufacturing method of prepreg 6 is disclosed. Varnish containing a thermosetting resin and an inorganic filler is applied and penetrated onto one side of a base material 3 with a coater head 1. On the application side, a filler rich layer 4 with much content of the inorganic filler is formed. On the other side, a resin rich layer 5 with little content of the inorganic filler is formed. Then, the prepreg is heated and dried until being in a semi-hardened state. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、プリント配線板の材料として用いられるプリプレグ及びその製造方法並びに金属張積層板及びその製造方法に関するものである。   The present invention relates to a prepreg used as a material for a printed wiring board, a manufacturing method thereof, a metal-clad laminate, and a manufacturing method thereof.

プリント配線板の材料として用いられる金属張積層板は様々な方法で製造されている（例えば、特許文献１参照。）。一般的には、熱硬化性樹脂及び無機フィラー等を配合してワニスを調製し、このワニスをガラスクロス等の基材に含浸させた後、これを半硬化状態になるまで加熱乾燥することによって、まずプリプレグを製造する。そして、このプリプレグの片面又は両面に銅箔等の金属箔を重ね合わせた後、これを加熱加圧成形することによって、金属張積層板を製造することができる。
特開平１１−２２００５３号公報 Metal-clad laminates used as printed wiring board materials are manufactured by various methods (see, for example, Patent Document 1). Generally, a varnish is prepared by blending a thermosetting resin and an inorganic filler, and after impregnating the varnish into a substrate such as a glass cloth, it is heated and dried until it becomes a semi-cured state. First, a prepreg is manufactured. And after laminating | stacking metal foils, such as copper foil, on the single side | surface or both surfaces of this prepreg, a metal-clad laminated board can be manufactured by heat-pressing this.
Japanese Patent Laid-Open No. 11-220053

しかし、上記のような従来の金属張積層板にあっては、金属箔の密着性が弱いという問題がある。これは無機フィラーが原因であると考えられるが、無機フィラーの含有量を少なくすると相対的に熱硬化性樹脂の含有量が増加し、金属張積層板の熱膨張率が高くなって寸法安定性が低下してしまうという問題が生じる。また従来の金属張積層板にあっては、剛性が低いという問題もある。   However, the conventional metal-clad laminate as described above has a problem that the adhesion of the metal foil is weak. This is considered to be caused by inorganic filler, but if the content of inorganic filler is decreased, the content of thermosetting resin is relatively increased, and the coefficient of thermal expansion of the metal-clad laminate is increased, resulting in dimensional stability. This causes a problem of lowering. Further, the conventional metal-clad laminate has a problem of low rigidity.

本発明は上記の点に鑑みてなされたものであり、金属箔の密着性が強く、熱膨張率が低く、剛性が高い金属張積層板を容易に製造することができるプリプレグ及びその製造方法並びに金属張積層板及びその製造方法を提供することを目的とするものである。   The present invention has been made in view of the above points, and a prepreg capable of easily producing a metal-clad laminate having strong metal foil adhesion, low coefficient of thermal expansion, and high rigidity, and a production method thereof, and An object of the present invention is to provide a metal-clad laminate and a manufacturing method thereof.

本発明の請求項１に係るプリプレグの製造方法は、熱硬化性樹脂及び無機フィラーを含有するワニスをコーターヘッド１で基材３の片面に塗布して浸透させ、塗布面に無機フィラーの含有量の多いフィラーリッチ層４を形成すると共に、反対面に無機フィラーの含有量の少ない樹脂リッチ層５を形成した後、これを半硬化状態になるまで加熱乾燥することを特徴とするものである。   In the method for producing a prepreg according to claim 1 of the present invention, a varnish containing a thermosetting resin and an inorganic filler is applied on one side of a base material 3 with a coater head 1 to be infiltrated, and the content of the inorganic filler on the coated surface. In addition to forming the filler rich layer 4 with a large amount, and forming the resin rich layer 5 with a small content of inorganic filler on the opposite surface, it is dried by heating until it is in a semi-cured state.

本発明の請求項２に係るプリプレグは、請求項１に記載の方法により製造されたプリプレグ６であって、基材３の一方面にフィラーリッチ層４が形成されていると共に、他方面に樹脂リッチ層５が形成されていることを特徴とするものである。   The prepreg according to claim 2 of the present invention is the prepreg 6 manufactured by the method according to claim 1, wherein the filler-rich layer 4 is formed on one surface of the substrate 3 and the resin is formed on the other surface. The rich layer 5 is formed.

本発明の請求項３に係る金属張積層板の製造方法は、請求項２に記載のプリプレグ６を２枚用い、フィラーリッチ層４同士を重ね合わせると共に、各樹脂リッチ層５に金属箔７を重ね合わせた後、これを加熱加圧成形することを特徴とするものである。   The method for producing a metal-clad laminate according to claim 3 of the present invention uses two prepregs 6 according to claim 2 and superimposes the filler-rich layers 4 on each other, and a metal foil 7 on each resin-rich layer 5. After the overlapping, this is heat-pressed and molded.

本発明の請求項４に係る金属張積層板は、請求項３に記載の方法により製造された金属張積層板８であって、２枚の基材３の間にフィラーリッチ層４が形成されていると共に、各基材３と金属箔７との間に樹脂リッチ層５が形成されていることを特徴とするものである。   The metal-clad laminate according to claim 4 of the present invention is a metal-clad laminate 8 produced by the method according to claim 3, wherein the filler-rich layer 4 is formed between the two substrates 3. In addition, a resin rich layer 5 is formed between each base material 3 and the metal foil 7.

本発明の請求項１に係るプリプレグの製造方法によれば、金属箔の密着性が強く、熱膨張率が低く、剛性が高い金属張積層板の製造に用いられるプリプレグを容易に製造することができるものである。   According to the method for producing a prepreg according to claim 1 of the present invention, it is possible to easily produce a prepreg used for producing a metal-clad laminate having strong metal foil adhesion, low coefficient of thermal expansion, and high rigidity. It can be done.

本発明の請求項２に係るプリプレグによれば、金属箔の密着性が強く、熱膨張率が低く、剛性が高い金属張積層板を容易に製造することができるものである。   According to the prepreg according to claim 2 of the present invention, a metal-clad laminate having high adhesion of metal foil, low coefficient of thermal expansion, and high rigidity can be easily produced.

本発明の請求項３に係る金属張積層板の製造方法によれば、金属箔の密着性が強く、熱膨張率が低く、剛性が高い金属張積層板を容易に製造することができるものである。   According to the method for producing a metal-clad laminate according to claim 3 of the present invention, it is possible to easily produce a metal-clad laminate having a strong metal foil adhesion, a low coefficient of thermal expansion, and a high rigidity. is there.

本発明の請求項４に係る金属張積層板によれば、金属箔と直に接触しているのは無機フィラーの含有量の少ない樹脂リッチ層であるため金属箔の密着性が強くなり、また樹脂リッチ層の他に無機フィラーの含有量の多いフィラーリッチ層も形成されているので熱膨張率が低くなり、さらに１枚ではなく２枚の基材を用いて形成されているので剛性が高いものである。   According to the metal-clad laminate according to claim 4 of the present invention, since the resin-rich layer with a small content of inorganic filler is in direct contact with the metal foil, the adhesion of the metal foil is increased, and In addition to the resin-rich layer, a filler-rich layer containing a large amount of inorganic filler is also formed, so the coefficient of thermal expansion is low, and the rigidity is high because it is formed using two substrates instead of one. Is.

以下、本発明の実施の形態を説明する。   Embodiments of the present invention will be described below.

本発明においてプリプレグ６を製造するにあたっては、まずワニスを調製する。ワニスは、熱硬化性樹脂及び無機フィラーを含有するものであり、熱硬化性樹脂としては、例えば、エポキシ樹脂、シアン酸エステル樹脂、マレイミド−シアン酸エステル樹脂、マレイミド樹脂、ポリイミド樹脂、トリアジン樹脂、ベンゾオキサジン樹脂、カルボジイミド樹脂、不飽和ポリフェニレンエーテル樹脂等を用いることができ、また無機フィラーとしては、例えば、水酸化アルミニウム、炭酸カルシウム、アルミナ、酸化チタン、マイカ、ベーマイト、炭酸アルミニウム、水酸化マグネシウム、ケイ酸マグネシウム、ケイ酸アルミニウム、シリカ、クレー、ガラス短繊維、ホウ酸アルミニウムウィスカ、炭酸ケイ素ウィスカ等を用いることができる。さらに熱硬化性樹脂及び無機フィラー以外の成分として、例えば、難燃剤、カップリング材、レベリング材、消泡剤、触媒、着色剤、各種ゴム成分、熱可塑性樹脂等を用いることができ、また溶剤としては、特に限定されるものではない。   In producing the prepreg 6 in the present invention, first, a varnish is prepared. The varnish contains a thermosetting resin and an inorganic filler. Examples of the thermosetting resin include epoxy resins, cyanate ester resins, maleimide-cyanate ester resins, maleimide resins, polyimide resins, triazine resins, Benzoxazine resin, carbodiimide resin, unsaturated polyphenylene ether resin, etc. can be used, and as inorganic filler, for example, aluminum hydroxide, calcium carbonate, alumina, titanium oxide, mica, boehmite, aluminum carbonate, magnesium hydroxide, Magnesium silicate, aluminum silicate, silica, clay, short glass fiber, aluminum borate whisker, silicon carbonate whisker and the like can be used. Furthermore, as a component other than the thermosetting resin and the inorganic filler, for example, a flame retardant, a coupling material, a leveling material, an antifoaming agent, a catalyst, a colorant, various rubber components, a thermoplastic resin, and the like can be used. There is no particular limitation.

そして、上記のような熱硬化性樹脂及び無機フィラー等を配合することによってワニスを調製した後、図１のように基材３を一定方向に送りながらワニスをコーターヘッド１で基材３の片面に塗布する。ここで基材３としては、例えば、ガラスクロス、ガラス不織布を用いたり、液晶ポリマー、テフロン（登録商標）樹脂、カーボン繊維、ポリエステル繊維、ポリアミド繊維、ポリアミドイミド繊維等を用いて形成された織布や不織布を用いたり、ポリイミド樹脂等の熱硬化性樹脂を用いて形成されたフィルム等を用いたりすることができる。そして基材３の片面に塗布されたワニスは、この塗布面から基材３中を浸透した後、反対面に滲み出てくる。このときワニス中の熱硬化性樹脂は基材３中を浸透しやすいが、無機フィラーは浸透しにくい。そのため、塗布面には無機フィラーが比較的多く残り、無機フィラーの含有量の多いフィラーリッチ層４が形成される。一方、反対面には無機フィラーがあまり滲み出てこないので、無機フィラーの含有量の少ない樹脂リッチ層５が形成される。その後、フィラーリッチ層４及び樹脂リッチ層５が半硬化状態（Ｂステージ状態）になるまでこの基材３を加熱乾燥することによって、プリプレグ６を容易に製造することができる。   And after preparing a varnish by mix | blending the above thermosetting resins, an inorganic filler, etc., it sends the base material 3 to a fixed direction like FIG. Apply to. Here, as the substrate 3, for example, a glass cloth, a glass nonwoven fabric, or a woven fabric formed using a liquid crystal polymer, a Teflon (registered trademark) resin, a carbon fiber, a polyester fiber, a polyamide fiber, a polyamideimide fiber, or the like is used. Or a non-woven fabric, or a film formed using a thermosetting resin such as a polyimide resin can be used. And the varnish apply | coated to the single side | surface of the base material 3 osmose | permeates into the opposite surface, after osmose | permeating the inside of the base material 3 from this application surface. At this time, the thermosetting resin in the varnish easily penetrates into the substrate 3, but the inorganic filler hardly penetrates. Therefore, a relatively large amount of inorganic filler remains on the coated surface, and the filler-rich layer 4 having a large content of inorganic filler is formed. On the other hand, since the inorganic filler does not ooze out on the opposite surface, the resin rich layer 5 with a small content of the inorganic filler is formed. Then, the prepreg 6 can be easily manufactured by heat-drying this base material 3 until the filler rich layer 4 and the resin rich layer 5 are in a semi-cured state (B stage state).

図２はこのようにして製造されたプリプレグ６を示すものであり、このプリプレグ６の基材３の一方面にはフィラーリッチ層４が形成されていると共に、他方面には樹脂リッチ層５が形成されている。   FIG. 2 shows the prepreg 6 manufactured as described above. The filler-rich layer 4 is formed on one surface of the base material 3 of the prepreg 6 and the resin-rich layer 5 is formed on the other surface. Is formed.

次に本発明において金属張積層板８を製造するにあたっては、上記のようにして製造されたプリプレグ６を２枚用いる。そして図３（ａ）のように２枚のプリプレグ６のフィラーリッチ層４同士を重ね合わせると共に、各樹脂リッチ層５に金属箔７を重ね合わせる。ここで金属箔７としては、銅箔等を用いることができる。その後、２枚のプリプレグ６と金属箔７を重ね合わせたものを加熱加圧成形することによって、金属張積層板８を容易に製造することができる。   Next, in manufacturing the metal-clad laminate 8 in the present invention, two prepregs 6 manufactured as described above are used. Then, as shown in FIG. 3A, the filler rich layers 4 of the two prepregs 6 are overlapped with each other, and the metal foil 7 is overlapped with each resin rich layer 5. Here, as the metal foil 7, a copper foil or the like can be used. Thereafter, the metal-clad laminate 8 can be easily manufactured by subjecting the two prepregs 6 and the metal foil 7 to the superposition and pressure forming.

図３（ｂ）はこのようにして製造された金属張積層板８を示すものであり、この金属張積層板８の２枚の基材３の間にはフィラーリッチ層４が形成されていると共に、各基材３と金属箔７との間に樹脂リッチ層５が形成されている。このように、金属箔７と直に接触しているのは無機フィラーの含有量の少ない樹脂リッチ層５であるため、金属箔７の密着性が強くなるものである。また、金属張積層板８には樹脂リッチ層５の他に無機フィラーの含有量の多いフィラーリッチ層４も形成されているので、熱膨張率が低くなり、寸法安定性が高くなるものである。さらに、金属張積層板８は１枚の基材３のみで形成されているのではなく、２枚の基材３を用いて形成されているので、剛性が高くなるものである。   FIG. 3B shows the metal-clad laminate 8 manufactured in this manner, and a filler-rich layer 4 is formed between the two substrates 3 of the metal-clad laminate 8. At the same time, a resin rich layer 5 is formed between each substrate 3 and the metal foil 7. Thus, since it is the resin rich layer 5 with little content of an inorganic filler that is contacting the metal foil 7 directly, the adhesiveness of the metal foil 7 becomes strong. In addition to the resin-rich layer 5, the metal-clad laminate 8 is also formed with the filler-rich layer 4 having a large amount of inorganic filler, so that the coefficient of thermal expansion is reduced and the dimensional stability is increased. . Further, the metal-clad laminate 8 is not formed by only one base material 3, but is formed by using the two base materials 3, so that the rigidity is increased.

プリプレグの製造工程の一例を示す断面図である。It is sectional drawing which shows an example of the manufacturing process of a prepreg. プリプレグの一例を示す断面図である。It is sectional drawing which shows an example of a prepreg. 金属張積層板の製造工程の一例を示す断面図である。It is sectional drawing which shows an example of the manufacturing process of a metal-clad laminated board.

符号の説明Explanation of symbols

１ コーターヘッド
３ 基材
４ フィラーリッチ層
５ 樹脂リッチ層
６ プリプレグ
７ 金属箔
８ 金属張積層板 DESCRIPTION OF SYMBOLS 1 Coater head 3 Base material 4 Filler rich layer 5 Resin rich layer 6 Prepreg 7 Metal foil 8 Metal-clad laminate

Claims (4)

熱硬化性樹脂及び無機フィラーを含有するワニスをコーターヘッドで基材の片面に塗布して浸透させ、塗布面に無機フィラーの含有量の多いフィラーリッチ層を形成すると共に、反対面に無機フィラーの含有量の少ない樹脂リッチ層を形成した後、これを半硬化状態になるまで加熱乾燥することを特徴とするプリプレグの製造方法。   A varnish containing a thermosetting resin and an inorganic filler is applied on one side of the substrate with a coater head and infiltrated to form a filler rich layer with a high content of inorganic filler on the coated surface, and an inorganic filler on the opposite side. A method for producing a prepreg characterized by forming a resin-rich layer with a low content and then drying it by heating until a semi-cured state is obtained. 請求項１に記載の方法により製造されたプリプレグであって、基材の一方面にフィラーリッチ層が形成されていると共に、他方面に樹脂リッチ層が形成されていることを特徴とするプリプレグ。   A prepreg produced by the method according to claim 1, wherein a filler-rich layer is formed on one side of the substrate and a resin-rich layer is formed on the other side. 請求項２に記載のプリプレグを２枚用い、フィラーリッチ層同士を重ね合わせると共に、各樹脂リッチ層に金属箔を重ね合わせた後、これを加熱加圧成形することを特徴とする金属張積層板の製造方法。   A metal-clad laminate comprising the two prepregs according to claim 2, wherein the filler-rich layers are overlapped with each other, and a metal foil is overlapped with each resin-rich layer, followed by heating and pressing. Manufacturing method. 請求項３に記載の方法により製造された金属張積層板であって、２枚の基材の間にフィラーリッチ層が形成されていると共に、各基材と金属箔との間に樹脂リッチ層が形成されていることを特徴とする金属張積層板。   A metal-clad laminate produced by the method according to claim 3, wherein a filler-rich layer is formed between two substrates, and a resin-rich layer is formed between each substrate and the metal foil. A metal-clad laminate, characterized in that is formed.
JP2007306571A 2007-11-27 2007-11-27 Prepreg and its manufacturing method, and metal-clad laminated board and its manufacturing method Pending JP2009127014A (en)

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WO2015180206A1 (en) 2014-05-27 2015-12-03 广东生益科技股份有限公司 Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate
CN108368396A (en) * 2015-11-25 2018-08-03 罗杰斯公司 The circuit pack for bonding sheet material and being formed by it
CN110871610A (en) * 2018-08-30 2020-03-10 深圳市昱谷科技有限公司 Nano carbon fiber composite material copper-clad plate

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JP2005029734A (en) * 2003-07-10 2005-02-03 Taiyo Ink Mfg Ltd Prepreg for printed circuit board and multilayer printed circuit board produced by using the same

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WO2015180206A1 (en) 2014-05-27 2015-12-03 广东生益科技股份有限公司 Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate
CN105172270A (en) * 2014-05-27 2015-12-23 广东生益科技股份有限公司 Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate
EP3162561A4 (en) * 2014-05-27 2018-04-11 Shengyi Technology Co., Ltd. Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate
CN108368396A (en) * 2015-11-25 2018-08-03 罗杰斯公司 The circuit pack for bonding sheet material and being formed by it
CN108368396B (en) * 2015-11-25 2022-03-04 罗杰斯公司 Adhesive sheet material and circuit assembly formed therefrom
CN110871610A (en) * 2018-08-30 2020-03-10 深圳市昱谷科技有限公司 Nano carbon fiber composite material copper-clad plate
CN110871610B (en) * 2018-08-30 2022-01-07 深圳市昱谷科技有限公司 Carbon nanotube composite material copper-clad plate

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