JP2009124004A - Electronic circuit module - Google Patents

Electronic circuit module Download PDF

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JP2009124004A
JP2009124004A JP2007297769A JP2007297769A JP2009124004A JP 2009124004 A JP2009124004 A JP 2009124004A JP 2007297769 A JP2007297769 A JP 2007297769A JP 2007297769 A JP2007297769 A JP 2007297769A JP 2009124004 A JP2009124004 A JP 2009124004A
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hole
circuit board
electronic circuit
circuit module
electronic
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Takanori Sekido
孝典 関戸
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Olympus Corp
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Olympus Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To simply produce an electronic circuit module configured by connecting respective members, and to achieve high density of respective members configuring the electronic circuit module. <P>SOLUTION: The electronic circuit module 1 includes circuit boards 11, 13 arranged so as to be opposed to each other and a metal pole 15 which is mechanically and electrically connected between the circuit boards 11, 13. A non-through-hole 111 is formed on a prescribed position of the upper surface of the lower circuit board 11 and an electronic component 12 which is a member such as an electronic circuit is mounted so as to avoid the non-through-hole 111. At the same time, a plane electrode 131 is formed on the lower surface of the upper circuit board 13. One-end side of the metal pole 15 is inserted into the non-through-hole 111 of the circuit board 11 and the other end face of the metal pole 15 is brought into contact with the plane electrode 131 of the circuit board 13 to connect between the circuit boards 11, 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、互いに対向配置された複数の部材と、各部材間を機械的および電気的に接続する導電部材とを備えた電子回路モジュールに関するものである。   The present invention relates to an electronic circuit module including a plurality of members arranged to face each other and a conductive member that mechanically and electrically connects each member.

基板上に半導体チップを高密度実装するための技術として、基板の主面上に導電ピンを立設し、この導電ピンとチップとを電気的に接続するものが知られている。また、導電ピンの基部にフランジ部を設け、基板上のスルーホールにフランジ部を係止して半田等で固定するようにしたものが知られている（特許文献１：図８参照）。   As a technique for high-density mounting of semiconductor chips on a substrate, a method is known in which conductive pins are erected on the main surface of the substrate and the conductive pins and the chips are electrically connected. Also known is a structure in which a flange portion is provided at the base portion of a conductive pin, and the flange portion is locked to a through hole on a substrate and fixed with solder or the like (Patent Document 1: FIG. 8).

特開平５−６３１３８号公報JP-A-5-63138

しかしながら、特許文献１の技術を適用して回路基板や電子部品等の各部材間を接続する場合、導電ピンにフランジ部を設ける必要があった。また、例えば電子部品が実装される回路基板上に他の部材を接続する等の場合に、フランジ部が配置される分だけ回路基板上の電子部品の実装領域が狭まるという問題があった。   However, when connecting members such as a circuit board and an electronic component by applying the technique of Patent Document 1, it is necessary to provide a flange portion on the conductive pin. In addition, for example, when another member is connected to the circuit board on which the electronic component is mounted, there is a problem that the mounting area of the electronic component on the circuit board is narrowed by the amount of the flange portion.

本発明は、上記に鑑みなされたものであって、各部材間が接続されて構成される電子回路モジュールを簡単に作製することができ、かつこの電子回路モジュールを構成する各部材の高密度化を実現することができる電子回路モジュールを提供することを目的とする。   The present invention has been made in view of the above, and it is possible to easily produce an electronic circuit module configured by connecting each member, and to increase the density of each member constituting the electronic circuit module. An object of the present invention is to provide an electronic circuit module capable of realizing the above.

上述した課題を解決し、目的を達成するため、本発明にかかる電子回路モジュールは、互いに対向配置された複数の部材と、各部材間を機械的および電気的に接続する導電部材とを備えた電子回路モジュールであって、前記複数の部材のうち、少なくとも対向する一方の部材に非貫通穴が形成されており、前記導電部材の端部が前記非貫通穴に挿入されて他方の部材との間が接続されることを特徴とする。   In order to solve the above-described problems and achieve the object, an electronic circuit module according to the present invention includes a plurality of members arranged to face each other, and a conductive member that mechanically and electrically connects each member. In the electronic circuit module, a non-through hole is formed in at least one of the plurality of members facing each other, and an end portion of the conductive member is inserted into the non-through hole and It is characterized in that they are connected.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記他方の部材は前記一方の部材と対向する面に端子部が形成された電子部品であり、前記導電部材の一端部が前記非貫通穴に挿入され、他端部が前記端子部と接触されて前記一方の部材と前記他方の部材との間が接続されることを特徴とする。   In the electronic circuit module according to the present invention, in the above invention, the other member is an electronic component in which a terminal portion is formed on a surface facing the one member, and one end portion of the conductive member is the non-contact portion. It is inserted into the through hole, and the other end is brought into contact with the terminal portion to connect between the one member and the other member.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記一方の部材には複数の非貫通穴が形成されており、各非貫通穴に異なる長さに形成された導電部材の一端部が挿入され、各導電部材の他端部にそれぞれ別の部材が接続されて前記各部材が積層されて配置されることを特徴とする。   In the electronic circuit module according to the present invention, in the above invention, the one member is formed with a plurality of non-through holes, and one end portion of the conductive member formed in each non-through hole with a different length Is inserted, and another member is connected to the other end of each conductive member, and the respective members are stacked and arranged.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記一方の部材には深さの異なる複数の非貫通穴が形成されており、各非貫通穴に同一の長さに形成された導電部材の一端部が挿入され、各導電部材の他端部にそれぞれ別の部材が接続されて前記各部材が積層されて配置されることを特徴とする。   In the electronic circuit module according to the present invention, in the above invention, the one member is formed with a plurality of non-through holes having different depths, and each non-through hole has the same length. One end portion of the conductive member is inserted, and another member is connected to the other end portion of each conductive member, and the respective members are stacked and arranged.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記一方の部材は中間層を有する基板であり、前記非貫通穴の底部に前記中間層が露出していることを特徴とする。   In the electronic circuit module according to the present invention as set forth in the invention described above, the one member is a substrate having an intermediate layer, and the intermediate layer is exposed at the bottom of the non-through hole.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記非貫通穴の底部に予め半田材料が配置されており、前記非貫通穴に挿入された前記導電部材の一端部が前記中間層と半田接続されることを特徴とする。   In the electronic circuit module according to the present invention, in the above invention, a solder material is disposed in advance at the bottom of the non-through hole, and one end of the conductive member inserted into the non-through hole is the intermediate layer. And solder-connected.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記一方の部材は基板であり、前記非貫通穴の底部に導体層が露出していることを特徴とする。   In the electronic circuit module according to the present invention as set forth in the invention described above, the one member is a substrate, and a conductor layer is exposed at the bottom of the non-through hole.

また、本発明にかかる電子回路モジュールは、上記の発明において、前記非貫通穴の底部に予め半田材料が配置されており、前記非貫通穴に挿入された前記導電部材の一端部が前記導体層と半田接続されることを特徴とする。   In the electronic circuit module according to the present invention, in the above invention, a solder material is disposed in advance at the bottom of the non-through hole, and one end of the conductive member inserted into the non-through hole is the conductor layer. And solder-connected.

本発明によれば、対向する一方の部材に非貫通穴を形成し、この非貫通穴に導電部材を挿入して他方の部材との間を接続することができるので、簡単な構成で各部材間を接続した電子回路モジュールを作製することができる。また、一方の部材に形成された非貫通穴に、端部を挿入することによって導電部材を固定できるので、部材に導電部材を固定するためのフランジ部等が必要ない。したがって、部材上に他の部材を効率良く接続でき、電子回路モジュールを構成する部材の高密度化が実現できる。   According to the present invention, a non-through hole is formed in one of the opposing members, and a conductive member can be inserted into this non-through hole to connect the other member. An electronic circuit module in which the gaps are connected can be manufactured. Further, since the conductive member can be fixed by inserting the end portion into the non-through hole formed in one member, a flange portion or the like for fixing the conductive member to the member is not necessary. Therefore, another member can be efficiently connected on the member, and the density of the members constituting the electronic circuit module can be increased.

以下、図面を参照し、本発明の好適な実施の形態について詳細に説明する。なお、本実施の形態によって本発明が限定されるものではない。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the present embodiment.

（実施の形態１）
図１は、実施の形態１の電子回路モジュール１の一例を模式的に示す斜視図である。図１に示すように、実施の形態１の電子回路モジュール１は、互いに対向配置された部材である回路基板１１，１３と、回路基板１１，１３間を機械的および電気的に接続する導電部材である金属柱１５とを備える。 (Embodiment 1)
FIG. 1 is a perspective view schematically showing an example of the electronic circuit module 1 according to the first embodiment. As shown in FIG. 1, the electronic circuit module 1 according to the first embodiment includes circuit boards 11 and 13 that are members arranged to face each other, and a conductive member that mechanically and electrically connects the circuit boards 11 and 13. And a metal column 15.

下側の回路基板１１には、上面の所定位置に非貫通穴１１１が形成されており、この非貫通穴１１１を避けて電子回路等の部材である電子部品１２が実装されている。非貫通穴１１１は、回路基板１１の上面にドリルやレーザ照射等によって穴あけ加工されて形成され、表面に金属膜がめっき形成される。一方、上側の回路基板１３には、下面に平面電極１３１が形成されている。回路基板１１の非貫通穴１１１は、回路基板１１，１３が対向配置されたときにこの平面電極１３１と対向する位置に形成される。そして、回路基板１１の非貫通穴１１１に金属柱１５の一端側が挿入され、この金属柱１５の他端面が回路基板１３の平面電極１３１と接触されて回路基板１１，１３間が接続される。金属柱１５は、予め規定される非貫通穴１１１の深さおよび回路基板１１の上面から回路基板１３の下面までの高さによって定まる長さに形成される。   A non-through hole 111 is formed at a predetermined position on the upper surface of the lower circuit board 11, and an electronic component 12 that is a member such as an electronic circuit is mounted avoiding the non-through hole 111. The non-through hole 111 is formed by drilling on the upper surface of the circuit board 11 with a drill, laser irradiation, or the like, and a metal film is plated on the surface. On the other hand, a planar electrode 131 is formed on the lower surface of the upper circuit board 13. The non-through hole 111 of the circuit board 11 is formed at a position facing the planar electrode 131 when the circuit boards 11 and 13 are arranged to face each other. Then, one end side of the metal pillar 15 is inserted into the non-through hole 111 of the circuit board 11, and the other end face of the metal pillar 15 is brought into contact with the planar electrode 131 of the circuit board 13 to connect the circuit boards 11 and 13. The metal pillar 15 is formed to have a length determined by a predetermined depth of the non-through hole 111 and a height from the upper surface of the circuit board 11 to the lower surface of the circuit board 13.

この電子回路モジュール１を作製する際には、回路基板１１上面の所定位置に非貫通穴１１１を形成し、表面に金属膜をめっき形成するとともに、電子部品１２を半田等で実装する。そして、非貫通穴１１１に金属柱１５の一端側を挿入し、非貫通穴１１１表面の金属膜と金属柱１５の一端とを接続する。続いて、回路基板１３を回路基板１１と対向配置し、非貫通穴１１１と平面電極１３１とを対向させて金属柱１５の他端面を平面電極１３１と接触させ、例えば半田等で接続する。これにより、回路基板１１，１３間の機械的および電気的接続を得る。そして、回路基板１１，１３間の間隙Ｅに封止樹脂を充填し、内部の部材を固定し保護する。   When the electronic circuit module 1 is manufactured, a non-through hole 111 is formed at a predetermined position on the upper surface of the circuit board 11, a metal film is plated on the surface, and the electronic component 12 is mounted with solder or the like. Then, one end side of the metal pillar 15 is inserted into the non-through hole 111 to connect the metal film on the surface of the non-through hole 111 and one end of the metal pillar 15. Subsequently, the circuit board 13 is disposed opposite to the circuit board 11, the non-through hole 111 and the planar electrode 131 are opposed to each other, the other end surface of the metal pillar 15 is brought into contact with the planar electrode 131, and is connected by, for example, solder. Thereby, the mechanical and electrical connection between the circuit boards 11 and 13 is obtained. Then, the gap E between the circuit boards 11 and 13 is filled with sealing resin to fix and protect the internal members.

この実施の形態１によれば、電子部品１２が実装される回路基板１１上面の所定位置に非貫通穴１１１を形成し、この非貫通穴１１１を避けて電子部品１２を実装することができる。そして、非貫通穴１１１に金属柱１５の一端側を挿入し、他端面を回路基板１３の平面電極１３１と接触させることによって、回路基板１１，１３間を機械的および電気的に接続することができる。したがって、簡単な構成で回路基板１１，１３間を接続した電子回路モジュールを作製することができる。また、回路基板１１上に金属柱１５を固定するためのフランジ部等が必要ない。したがって、回路基板１１上の電子部品１２の実装領域を狭めることがなく、スペースを有効に使って電子部品等の部材を実装して電子回路モジュール１を作製することができるので、電子回路モジュール１の高密度化が実現できる。これによれば、電子回路モジュール１全体の小型化が図れるとともにコストの低減も図れる。また、非貫通穴１１１の位置決めが容易であり、設計自由度も高い。   According to the first embodiment, the non-through hole 111 is formed at a predetermined position on the upper surface of the circuit board 11 on which the electronic component 12 is mounted, and the electronic component 12 can be mounted avoiding the non-through hole 111. Then, by inserting one end side of the metal pillar 15 into the non-through hole 111 and bringing the other end surface into contact with the planar electrode 131 of the circuit board 13, the circuit boards 11 and 13 can be mechanically and electrically connected. it can. Therefore, an electronic circuit module in which the circuit boards 11 and 13 are connected with a simple configuration can be manufactured. Further, there is no need for a flange portion or the like for fixing the metal pillar 15 on the circuit board 11. Therefore, the electronic circuit module 1 can be produced by mounting a member such as an electronic component using the space effectively without narrowing the mounting area of the electronic component 12 on the circuit board 11. High density can be realized. According to this, the entire electronic circuit module 1 can be reduced in size and the cost can be reduced. Further, the positioning of the non-through hole 111 is easy and the degree of design freedom is high.

なお、実施の形態１では、回路基板１１，１３間を接続する場合について説明したが、金属柱による接続対象は回路基板に限定されるものではない。すなわち、回路基板と電子回路モジュール等の部材とを接続する場合や、電子回路モジュール間を接続する場合、２つの電子部品を積層させて接続する場合にも同様に適用できる。また、３枚以上の回路基板を接続する場合や、３つ以上の電子部品や電子回路モジュールを積層させて接続する場合にも同様に適用できる。   In addition, in Embodiment 1, although the case where the circuit boards 11 and 13 were connected was demonstrated, the connection object by a metal pillar is not limited to a circuit board. That is, when connecting a circuit board and members, such as an electronic circuit module, when connecting between electronic circuit modules, it is applicable similarly when connecting two electronic parts by laminating | stacking. In addition, the present invention can be similarly applied to a case where three or more circuit boards are connected or a case where three or more electronic components or electronic circuit modules are stacked and connected.

また、金属柱１５の一端側を回路基板１１の非貫通穴１１１に挿入するとともに、他端面を回路基板１３の平面電極１３１と接触させる場合を例示したが、上側の部材の下面にも非貫通穴を形成してこの非貫通穴に金属柱の他端側を挿入し、非貫通穴表面の金属膜と金属柱の他端とを接続することによって各部材間の機械的および電気的接続を得る構成としてもよい。   Further, the case where one end side of the metal pillar 15 is inserted into the non-through hole 111 of the circuit board 11 and the other end surface is brought into contact with the planar electrode 131 of the circuit board 13 is illustrated. By forming a hole and inserting the other end of the metal pillar into this non-through hole, and connecting the metal film on the surface of the non-through hole and the other end of the metal pillar, mechanical and electrical connection between each member is achieved. It is good also as a structure to obtain.

（実施の形態２）
図２は、実施の形態２の電子回路モジュール２の一例を模式的に示す斜視図である。図２に示すように、実施の形態２の電子回路モジュール２は、互いに対向配置された回路基板２１，２３と、回路基板２１と接続されて回路基板２１，２３間に配置された電子回路や電子回路モジュール等の部材である電子部品２５と、回路基板２１，２３間を機械的および電気的に接続する金属柱２７および回路基板２１と電子部品２５との間を機械的および電気的に接続する金属柱２９とを備え、回路基板２１，２３および電子部品２５が積層されて配置されている。 (Embodiment 2)
FIG. 2 is a perspective view schematically showing an example of the electronic circuit module 2 according to the second embodiment. As shown in FIG. 2, the electronic circuit module 2 according to the second embodiment includes circuit boards 21 and 23 arranged to face each other, and an electronic circuit connected to the circuit board 21 and arranged between the circuit boards 21 and 23. The electronic component 25 which is a member such as an electronic circuit module and the metal pillar 27 which mechanically and electrically connects the circuit boards 21 and 23 and the circuit board 21 and the electronic component 25 are mechanically and electrically connected. The circuit boards 21 and 23 and the electronic component 25 are laminated and arranged.

下側の回路基板２１には、上面の所定位置に実施の形態１と同様にして複数の非貫通穴２１１が形成されており、この非貫通穴２１１を避けて電子回路等の電子部品２２が実装されている。一方、上側の回路基板２３には、下面に平面電極２３１が形成されている。また、電子部品２５には、下面に端子部である平面電極２５１が形成されている。回路基板２１の非貫通穴２１１は、回路基板２１，２３が対向配置されたときに回路基板２３の平面電極２３１と対向する位置、および回路基板２１と電子部品２５とが対向配置されたときに電子部品２５の平面電極２５１と対向する位置に形成される。そして、回路基板２３の平面電極２３１と対向される非貫通穴２１１には金属柱２７の一端側が挿入され、この金属柱２７の他端面が回路基板２３の平面電極２３１と接触されて回路基板２１，２３間が接続される。また、電子部品２５の平面電極２５１と対向される非貫通穴２１１には金属柱２９の一端側が挿入され、この金属柱２９の他端面が電子部品２５の平面電極２５１と接触されて回路基板２１と電子部品２５との間が接続される。   In the lower circuit board 21, a plurality of non-through holes 211 are formed at predetermined positions on the upper surface in the same manner as in the first embodiment. By avoiding the non-through holes 211, electronic components 22 such as an electronic circuit are provided. Has been implemented. On the other hand, a planar electrode 231 is formed on the lower surface of the upper circuit board 23. The electronic component 25 is provided with a planar electrode 251 as a terminal portion on the lower surface. The non-through hole 211 of the circuit board 21 is positioned so as to face the planar electrode 231 of the circuit board 23 when the circuit boards 21 and 23 are arranged to face each other, and when the circuit board 21 and the electronic component 25 are arranged to face each other. It is formed at a position facing the planar electrode 251 of the electronic component 25. Then, one end side of the metal pillar 27 is inserted into the non-through hole 211 facing the planar electrode 231 of the circuit board 23, and the other end surface of the metal pillar 27 is brought into contact with the planar electrode 231 of the circuit board 23 to be circuit board 21. , 23 are connected. In addition, one end side of the metal column 29 is inserted into the non-through hole 211 facing the planar electrode 251 of the electronic component 25, and the other end surface of the metal column 29 is brought into contact with the planar electrode 251 of the electronic component 25 to be circuit board 21. And the electronic component 25 are connected.

金属柱２７，２９は、互いに異なる長さに形成されている。具体的には、金属柱２７は、予め規定される非貫通穴２１１の深さおよび回路基板２１の上面から回路基板２３の下面までの高さによって定まる長さに形成される。一方、金属柱２９は、予め規定される非貫通穴２１１の深さおよび回路基板２１の上面から電子部品２５の下面までの高さによって定まる長さに形成される。   The metal columns 27 and 29 are formed to have different lengths. Specifically, the metal pillar 27 is formed to have a length determined by a predetermined depth of the non-through hole 211 and a height from the upper surface of the circuit board 21 to the lower surface of the circuit board 23. On the other hand, the metal pillar 29 is formed to have a length determined by a predetermined depth of the non-through hole 211 and a height from the upper surface of the circuit board 21 to the lower surface of the electronic component 25.

この電子回路モジュール２を作製する際には、回路基板２１上面の所定位置に非貫通穴２１１を形成し、表面に金属膜をめっき形成するとともに、電子部品２２を半田実装する。そして、回路基板２１，２３間を接続するための非貫通穴２１１に金属柱２７の一端側を挿入し、非貫通穴２１１表面の金属膜と金属柱２７の一端とを接続するとともに、回路基板２１を電子部品２５と接続するための非貫通穴２１１に金属柱２９を挿入し、非貫通穴２１１表面の金属膜と金属柱２９の一端とを接続する。続いて、電子部品２５を回路基板２１と対向配置し、非貫通穴２１１と平面電極２５１とを対向させて金属柱２９の他端面を平面電極２５１と接触させ、半田等で接続する。また、電子部品２５の上方で回路基板２３を回路基板２１と対向配置し、非貫通穴２１１と平面電極２３１とを対向させて金属柱２７の他端面を平面電極２３１と接触させ、半田等で接続する。これにより、回路基板２１，２３間および回路基板２１と電子部品２５との間の機械的および電気的接続を得る。そして、回路基板２１，２３の間隙に封止樹脂を充填し、内部の部材を固定し保護する。   When the electronic circuit module 2 is manufactured, a non-through hole 211 is formed at a predetermined position on the upper surface of the circuit board 21, a metal film is plated on the surface, and the electronic component 22 is solder mounted. Then, one end side of the metal pillar 27 is inserted into the non-through hole 211 for connecting the circuit boards 21 and 23 to connect the metal film on the surface of the non-through hole 211 and one end of the metal pillar 27. A metal pillar 29 is inserted into a non-through hole 211 for connecting 21 to the electronic component 25, and the metal film on the surface of the non-through hole 211 is connected to one end of the metal pillar 29. Subsequently, the electronic component 25 is disposed to face the circuit board 21, the non-through hole 211 and the planar electrode 251 are opposed to each other, the other end surface of the metal pillar 29 is brought into contact with the planar electrode 251, and is connected by soldering or the like. In addition, the circuit board 23 is disposed opposite to the circuit board 21 above the electronic component 25, the non-through hole 211 and the planar electrode 231 are opposed to each other, the other end surface of the metal pillar 27 is brought into contact with the planar electrode 231, and solder or the like is used. Connecting. As a result, mechanical and electrical connections between the circuit boards 21 and 23 and between the circuit board 21 and the electronic component 25 are obtained. Then, the gap between the circuit boards 21 and 23 is filled with sealing resin to fix and protect the internal members.

この実施の形態２によれば、実施の形態１と同様の効果を奏することができるとともに、長さの異なる金属柱２７，２９を組み合わせることによって、回路基板２１，２３間に電子部品２５を介在させることができる。したがって、回路基板２１，２３や電子部品２５が積層されて配置された電子回路モジュール２を容易に作製することができる。また、電子回路モジュール２をより一層高密度化でき、より小型化が図れる。   According to the second embodiment, the same effect as in the first embodiment can be obtained, and the electronic components 25 are interposed between the circuit boards 21 and 23 by combining the metal pillars 27 and 29 having different lengths. Can be made. Therefore, the electronic circuit module 2 in which the circuit boards 21 and 23 and the electronic component 25 are stacked can be easily manufactured. Further, the electronic circuit module 2 can be further densified and further downsized.

なお、実施の形態２では、回路基板２１，２３間に一つの電子部品２５を介在させた電子回路モジュール２を作製する場合について説明したが、金属柱の長さを調整することによって、回路基板間に２つ以上の回路基板や電子部品、電子回路モジュール等の部材を介在させることも可能である。また、３枚以上の回路基板を接続する場合や、３つ以上の電子部品や電子回路モジュールを積層させて接続する場合にも同様に適用できる。   In the second embodiment, the case where the electronic circuit module 2 in which one electronic component 25 is interposed between the circuit boards 21 and 23 has been described. However, the circuit board can be adjusted by adjusting the length of the metal pillar. It is also possible to interpose two or more circuit boards, electronic components, electronic circuit modules and other members between them. In addition, the present invention can be similarly applied to a case where three or more circuit boards are connected or a case where three or more electronic components or electronic circuit modules are stacked and connected.

（実施の形態３）
図３は、実施の形態３の電子回路モジュール３の一例を模式的に示す斜視図である。図３に示すように、実施の形態３の電子回路モジュール３は、互いに対向配置された回路基板３１，３３と、回路基板３１と接続されて回路基板３１，３３間に配置された電子部品３５と、回路基板３１，３３間を機械的および電気的に接続するそれぞれ同一の長さを有する金属柱３７とを備え、回路基板３１，３３および電子部品３５が積層されて配置されている。 (Embodiment 3)
FIG. 3 is a perspective view schematically showing an example of the electronic circuit module 3 according to the third embodiment. As shown in FIG. 3, the electronic circuit module 3 according to the third embodiment includes circuit boards 31 and 33 arranged to face each other, and an electronic component 35 connected to the circuit board 31 and arranged between the circuit boards 31 and 33. And metal pillars 37 having the same length for mechanically and electrically connecting the circuit boards 31 and 33, and the circuit boards 31 and 33 and the electronic components 35 are stacked and arranged.

下側の回路基板３１には、上面の所定位置に深さの異なる非貫通穴３１１，３１３が実施の形態１と同様にして形成されており、この非貫通穴３１１，３１３を避けて電子回路等の電子部品３２が実装されている。各非貫通穴３１１，３１３は、それぞれ異なる深さに形成される。具体的には、非貫通穴３１１の深さは、予め規定される金属柱３７の長さおよび回路基板３１の上面から回路基板３３の下面までの高さによって定まる長さに形成される。また、非貫通穴３１３の深さは、予め規定される金属柱３７の長さおよび回路基板３１の上面から電子部品３５の下面までの高さによって定まる長さに形成される。一方、上側の回路基板３３には、下面に平面電極３３１が形成されている。また、電子部品３５には、下面に端子部である平面電極３５１が形成されている。回路基板３１の非貫通穴３１１は、回路基板３１，３３が対向配置されたときに回路基板３３の平面電極３３１と対向する位置に形成され、非貫通穴３１３は、回路基板３１と電子部品３５とが対向配置されたときに電子部品３５の平面電極３５１と対向する位置に形成される。そして、非貫通穴３１１には金属柱３７の一端側が挿入され、この金属柱３７の他端面が回路基板３３の平面電極３３１と接触されて回路基板３１，３３間が接続される。また、非貫通穴３１３には金属柱３７の一端側が挿入され、この金属柱３７の他端面が電子部品３５の平面電極３５１と接触されて回路基板３１と電子部品３５との間が接続される。   In the lower circuit board 31, non-through holes 311 and 313 having different depths are formed at predetermined positions on the upper surface in the same manner as in the first embodiment. The electronic circuit avoids these non-through holes 311 and 313. An electronic component 32 such as is mounted. The non-through holes 311 and 313 are formed at different depths. Specifically, the depth of the non-through hole 311 is formed to be a length determined by a predetermined length of the metal pillar 37 and a height from the upper surface of the circuit board 31 to the lower surface of the circuit board 33. In addition, the depth of the non-through hole 313 is formed to a length determined by a predetermined length of the metal pillar 37 and a height from the upper surface of the circuit board 31 to the lower surface of the electronic component 35. On the other hand, a planar electrode 331 is formed on the lower surface of the upper circuit board 33. The electronic component 35 is provided with a planar electrode 351 as a terminal portion on the lower surface. The non-through hole 311 of the circuit board 31 is formed at a position facing the planar electrode 331 of the circuit board 33 when the circuit boards 31 and 33 are arranged to face each other, and the non-through hole 313 is formed between the circuit board 31 and the electronic component 35. Is formed at a position facing the planar electrode 351 of the electronic component 35. One end side of the metal pillar 37 is inserted into the non-through hole 311, and the other end face of the metal pillar 37 is brought into contact with the planar electrode 331 of the circuit board 33 to connect the circuit boards 31 and 33. In addition, one end side of the metal column 37 is inserted into the non-through hole 313, and the other end surface of the metal column 37 is brought into contact with the planar electrode 351 of the electronic component 35 to connect between the circuit board 31 and the electronic component 35. .

この電子回路モジュール３を作製する際には、回路基板３１上面の所定位置に非貫通穴３１１，３１３を形成し、表面に金属膜をめっき形成するとともに、電子部品３２を半田実装する。そして、非貫通穴３１１，３１３にそれぞれ金属柱３７の一端側を挿入し、非貫通穴３１１，３１３表面の金属膜と金属柱３７の一端とを接続する。続いて、電子部品３５を回路基板３１と対向配置し、非貫通穴３１３と平面電極３５１とを対向させて金属柱３７の他端面を平面電極３５１と接触させ、半田等で接続する。また、電子部品３５の上方で回路基板３３を回路基板３１と対向配置し、非貫通穴３１１と平面電極３３１とを対向させて金属柱３７の他端面を平面電極３３１と接触させ、半田等で接続する。これにより、回路基板３１，３３間および回路基板３１と電子部品３５との間の機械的および電気的接続を得る。そして、回路基板３１，３３の間隙に封止樹脂を充填し、内部の部材を固定し保護する。   When the electronic circuit module 3 is manufactured, the non-through holes 311 and 313 are formed at predetermined positions on the upper surface of the circuit board 31, a metal film is formed on the surface, and the electronic component 32 is mounted by soldering. Then, one end side of the metal pillar 37 is inserted into each of the non-through holes 311 and 313, and the metal film on the surface of the non-through holes 311 and 313 is connected to one end of the metal pillar 37. Subsequently, the electronic component 35 is disposed to face the circuit board 31, the non-through hole 313 and the planar electrode 351 are opposed to each other, the other end surface of the metal pillar 37 is brought into contact with the planar electrode 351, and connected with solder or the like. Further, the circuit board 33 is disposed above the electronic component 35 so as to face the circuit board 31, the non-through hole 311 and the planar electrode 331 are opposed to each other, the other end surface of the metal pillar 37 is brought into contact with the planar electrode 331, and solder or the like is used. Connecting. Thereby, mechanical and electrical connection between the circuit boards 31 and 33 and between the circuit board 31 and the electronic component 35 is obtained. Then, the gap between the circuit boards 31 and 33 is filled with sealing resin to fix and protect the internal members.

この実施の形態３によれば、実施の形態１と同様の効果を奏することができるとともに、非貫通穴３１１，３１３の深さを調整して組み合わせることによって、回路基板３１，３３間に電子部品３５を介在させることができる。したがって、回路基板３１，３３や電子部品３５が積層されて配置された電子回路モジュール３を容易に作製することができる。また、電子回路モジュール３をより一層高密度化でき、より小型化が図れる。さらに、共通の金属柱３７を用いて回路基板３１，３３間および回路基板３１と電子部品３５との間を接続することができるので、実施の形態２のように異なる長さの金属柱を用いる場合と比較してコストの低減が図れる。   According to the third embodiment, the same effects as those of the first embodiment can be obtained, and the electronic components are arranged between the circuit boards 31 and 33 by adjusting and combining the depths of the non-through holes 311 and 313. 35 can be interposed. Therefore, it is possible to easily manufacture the electronic circuit module 3 in which the circuit boards 31 and 33 and the electronic component 35 are stacked and arranged. In addition, the electronic circuit module 3 can be further densified and further downsized. Furthermore, since the common metal pillar 37 can be used to connect between the circuit boards 31 and 33 and between the circuit board 31 and the electronic component 35, metal pillars having different lengths are used as in the second embodiment. Cost can be reduced compared to the case.

なお、実施の形態３では、回路基板３１，３３間に一つの電子部品３５を介在させた電子回路モジュール３を作製する場合について説明したが、非貫通穴の深さを調整して組み合わせることによって、回路基板間に２つ以上の回路基板や電子部品、電子回路モジュール等の部材を介在させることも可能である。また、３枚以上の回路基板を接続する場合や、３つ以上の電子部品や電子回路モジュールを積層させて接続する場合にも同様に適用できる。   In the third embodiment, the case where the electronic circuit module 3 in which one electronic component 35 is interposed between the circuit boards 31 and 33 has been described. However, by adjusting the depth of the non-through holes and combining them, It is also possible to interpose two or more circuit boards, electronic components, electronic circuit modules and other members between the circuit boards. In addition, the present invention can be similarly applied to a case where three or more circuit boards are connected or a case where three or more electronic components or electronic circuit modules are stacked and connected.

また、上記した実施の形態１〜３では、非貫通穴の表面に金属膜をめっき形成して回路基板と金属柱との電気的な接続を得ることとしたが、回路基板上に形成されている配線パターンと接続されるようにドリルやレーザ照射等によって穴あけ加工して非貫通穴を形成し、この配線パターンに金属柱の側面を接触させることによって回路基板と金属柱との電気的な接続を得ることとしてもよい。   In the above first to third embodiments, the metal film is plated on the surface of the non-through hole to obtain an electrical connection between the circuit board and the metal pillar. A non-through hole is formed by drilling or laser irradiation so that it is connected to the wiring pattern that is connected, and the circuit board and the metal pillar are electrically connected by contacting the side surface of the metal pillar with this wiring pattern. It is also good to get.

（実施の形態４）
実施の形態４の電子回路モジュールは、回路基板上に他の回路基板や電子部品、電子回路モジュール等の部材が導電部材であるマイクロピンによって接続されて構成される。図４および図５は、実施の形態４の電子回路モジュールにおける回路基板４１とマイクロピン４３，４４，４５との接続構造を説明する図であり、図４は、回路基板４１に対するマイクロピン４３，４４，４５の半田付け工程前の回路基板４１の断面図を示し、図５は、半田付け工程後の回路基板４１の断面図を示している。図４および図５に示すように、実施の形態４では、回路基板４１が中間層を有する基板（多層基板）で構成される。 (Embodiment 4)
The electronic circuit module according to the fourth embodiment is configured by connecting members such as other circuit boards, electronic components, and electronic circuit modules on the circuit board with micro pins as conductive members. 4 and 5 are diagrams for explaining a connection structure between the circuit board 41 and the micro pins 43, 44, and 45 in the electronic circuit module according to the fourth embodiment. FIG. A cross-sectional view of the circuit board 41 before the soldering process 44 and 45 is shown, and FIG. 5 shows a cross-sectional view of the circuit board 41 after the soldering process. As shown in FIGS. 4 and 5, in the fourth embodiment, the circuit board 41 is configured by a board (multilayer board) having an intermediate layer.

図４に示すように、回路基板４１は、中間層４１３，４１４を含む複数の導体層４１１〜４１４が積層され、各導体層間が絶縁層４１５で絶縁されて構成されている。そして、底部にそれぞれ中間層４１３，４１４を露出させた非貫通穴４１６，４１７や、絶縁層４１５を貫通して導体層４１１を露出させた非貫通穴４１８が形成されている。各非貫通穴４１６，４１７，４１８の底部には、予め半田ボールや半田ペースト等の半田材料４１９が配置されており、この半田材料４１９によって、中間層４１４とマイクロピン４３の一端、中間層４１３とマイクロピン４４の一端および導体層４１１とマイクロピン４５の一端がそれぞれ接続される。具体的には、回路基板４１は、ヒートツールや加熱炉等で例えば半田材料４１９の近傍を加熱する半田付け工程を経て、図５に示すように、非貫通穴４１６の底部に露出した中間層４１４とこの非貫通穴４１６に挿入されるマイクロピン４３の一端とが半田接続され、非貫通穴４１７の底部に露出した中間層４１３とこの非貫通穴４１７に挿入されるマイクロピン４４の一端とが半田接続され、非貫通穴４１８の底部に露出した導体層４１１とこの非貫通穴４１８に挿入されるマイクロピン４５の一端とが半田接続される。   As shown in FIG. 4, the circuit board 41 is configured by laminating a plurality of conductor layers 411 to 414 including intermediate layers 413 and 414 and insulating each conductor layer with an insulating layer 415. Then, non-through holes 416 and 417 in which the intermediate layers 413 and 414 are exposed, and non-through holes 418 in which the conductor layer 411 is exposed through the insulating layer 415 are formed at the bottom. A solder material 419 such as a solder ball or a solder paste is disposed in advance at the bottom of each non-through hole 416, 417, 418. And one end of the micro pin 44 and the conductor layer 411 and one end of the micro pin 45 are connected to each other. Specifically, the circuit board 41 is subjected to a soldering process in which, for example, the vicinity of the solder material 419 is heated with a heat tool or a heating furnace, as shown in FIG. 414 and one end of the micro pin 43 inserted into the non-through hole 416 are solder-connected, and an intermediate layer 413 exposed at the bottom of the non-through hole 417 and one end of the micro pin 44 inserted into the non-through hole 417 Are connected by soldering, and the conductor layer 411 exposed at the bottom of the non-through hole 418 and one end of the micro pin 45 inserted into the non-through hole 418 are solder-connected.

この電子回路モジュールを作製する際には、回路基板４１上面の所定位置に中間層４１３，４１４をそれぞれ露出させた非貫通穴４１６，４１７を形成するとともに、導体層４１１を露出させた非貫通穴４１８を形成する。続いて、各非貫通穴４１６，４１７，４１８の底部に半田材料４１９を配置する。そして、非貫通穴４１６，４１７，４１８にマイクロピン４３，４４，４５の一端側をそれぞれ挿入し、マイクロピン４３，４４，４５の一端を非貫通穴４１６，４１７，４１８の底部の半田材料４１９と接触させ、半田付け工程を経てこれらの間を半田接続する。これにより、非貫通穴４１６，４１７，４１８にマイクロピン４３，４４，４５がそれぞれ固定され、回路基板４１を構成する中間層４１３，４１４とマイクロピン４３，４４との間を機械的および電気的に接続するとともに、導体層４１１とマイクロピン４５との間を機械的および電気的に接続する。そしてこの後、マイクロピン４３，４４，４５の他端側に他の回路基板や電子部品、電子回路モジュール等の部材を半田等で接続する。そして、回路基板４１と他の部材との間隙に封止樹脂を充填し、内部の部材を固定し保護する。   When manufacturing this electronic circuit module, non-through holes 416 and 417 in which the intermediate layers 413 and 414 are respectively exposed are formed at predetermined positions on the upper surface of the circuit board 41, and non-through holes in which the conductor layer 411 is exposed are formed. 418 is formed. Subsequently, a solder material 419 is disposed at the bottom of each non-through hole 416, 417, 418. Then, one end sides of the micro pins 43, 44, and 45 are inserted into the non-through holes 416, 417, and 418, respectively, and one end of each of the micro pins 43, 44, and 45 is inserted into the solder material 419 at the bottom of the non-through holes 416, 417, and 418. Then, a solder connection is made between them through a soldering process. As a result, the micro pins 43, 44, 45 are respectively fixed to the non-through holes 416, 417, 418, and mechanical and electrical connection between the intermediate layers 413, 414 constituting the circuit board 41 and the micro pins 43, 44 is achieved. And the conductor layer 411 and the micro pin 45 are mechanically and electrically connected to each other. Thereafter, other circuit boards, electronic components, electronic circuit modules, and other members are connected to the other end sides of the micro pins 43, 44, 45 by soldering or the like. Then, a sealing resin is filled in a gap between the circuit board 41 and another member to fix and protect the internal member.

ここで、多層基板上にマイクロピンを接続する接続構造について、図６に示す従来の接続構造と比較して説明する。図６に示すように、従来は、多層基板である回路基板５１の各層と複数のマイクロピン５３，５４，５５との導通をとる際には、ビア等の層間接続部材５１７によって下層の導体層５１１，５１３，５１４との間が電気的に接続された最上層の導体層５１２上にマイクロピン５３，５４，５５が半田５１９等で機械的および電気的に接続されて構成されていた。これに対し、本実施の形態４では、マイクロピン４３，４４，４５を回路基板４１に固定するための非貫通穴４１６，４１７を中間層４１３，４１４が露出するように形成することができる。そして、この非貫通穴４１６，４１７の底部に予め半田材料４１９を配置しておき、非貫通穴４１６，４１７の底部とマイクロピン４３，４４の一端とを半田接続することによってこれらを機械的および電気的に接続することができる。したがって、実施の形態１と同様の効果を奏することができるとともに、非貫通穴４１６，４１７に対するマイクロピン４３，４４の接続を強固にでき、非貫通穴４１６，４１７底部の中間層４１３，４１４とマイクロピン４３，４４との間の機械的および電気的な接続信頼性を向上させることができるとともに、接続抵抗値を低くすることができる。   Here, a connection structure for connecting the micro pins on the multilayer substrate will be described in comparison with the conventional connection structure shown in FIG. As shown in FIG. 6, conventionally, when each layer of the circuit board 51, which is a multilayer board, is connected to the plurality of micro pins 53, 54, 55, a lower conductor layer is formed by an interlayer connection member 517 such as a via. Micropins 53, 54, and 55 are mechanically and electrically connected by solder 519 or the like on the uppermost conductor layer 512 that is electrically connected to 511, 513, and 514. On the other hand, in the fourth embodiment, the non-through holes 416 and 417 for fixing the micro pins 43, 44 and 45 to the circuit board 41 can be formed so that the intermediate layers 413 and 414 are exposed. A solder material 419 is disposed in advance at the bottom of the non-through holes 416 and 417, and the bottom of the non-through holes 416 and 417 and one end of the micro pins 43 and 44 are connected by soldering. Can be electrically connected. Therefore, the same effects as those of the first embodiment can be obtained, and the connection of the micro pins 43 and 44 to the non-through holes 416 and 417 can be strengthened, and the intermediate layers 413 and 414 at the bottom of the non-through holes 416 and 417 The mechanical and electrical connection reliability between the micro pins 43 and 44 can be improved, and the connection resistance value can be lowered.

なお、上記した実施の形態４では、非貫通穴４１６，４１７等の底部に半田材料４１９を配置しておく場合について説明したが、非貫通穴４１６，４１７等に挿入されてその底部と接続されるマイクロピン４３，４４の一端面に半田材料を予め供給しておく構成としてもよい。   In the above-described fourth embodiment, the case where the solder material 419 is disposed at the bottom of the non-through holes 416, 417, etc. has been described. However, the solder material 419 is inserted into the non-through holes 416, 417, etc. and connected to the bottom thereof. A configuration may be adopted in which a solder material is supplied in advance to one end surfaces of the micro pins 43 and 44.

また、多層基板上に他の部材を接続するためのマイクロピンを挿入する非貫通穴にスルーホールを設ける構成としてもよい。図７は、本変形例における多層基板である回路基板６１とマイクロピンとの接続構造を説明する図である。図７に示す回路基板６１は、中間層６１３，６１４を含む複数の導体層６１１〜６１４が積層されて構成される。そして、底部にそれぞれ中間層６１３，６１４を露出させた非貫通穴６１６，６１７や、導体層６１１を露出させた非貫通穴６１８にそれぞれスルーホール６１５が設けられており、半田材料６１９によって、中間層６１４とマイクロピン６３の一端、中間層６１３とマイクロピン６４の一端および導体層６１１とマイクロピン６５の一端がそれぞれ接続される。本構成の場合も、実施の形態４と同様の効果を奏することができる。   Moreover, it is good also as a structure which provides a through hole in the non-through hole which inserts the micro pin for connecting another member on a multilayer substrate. FIG. 7 is a diagram for explaining a connection structure between a circuit board 61 which is a multilayer board and micro pins in this modification. The circuit board 61 shown in FIG. 7 is configured by laminating a plurality of conductor layers 611 to 614 including intermediate layers 613 and 614. Through holes 615 are respectively provided in the non-through holes 616 and 617 in which the intermediate layers 613 and 614 are exposed at the bottom, and the non-through holes 618 in which the conductor layer 611 is exposed. The layer 614 and one end of the micro pin 63, the intermediate layer 613 and one end of the micro pin 64, and the conductor layer 611 and one end of the micro pin 65 are connected to each other. Also in the case of this configuration, the same effect as in the fourth embodiment can be obtained.

また、実施の形態４では、中間層が形成された多層基板上に他の部材を接続する場合について説明したが、中間層が形成されていない基板上に他の部材を接続する場合にも同様に適用できる。この場合には、底部に導体層を露出させた非貫通穴にマイクロピンの一端側を挿入して半田接続する。そして、マイクロピン他端側に他の回路基板や電子部品、電子回路モジュール等の部材を半田等で接続する。   In the fourth embodiment, the case where another member is connected to the multilayer substrate on which the intermediate layer is formed has been described. However, the same applies to the case where another member is connected to the substrate on which the intermediate layer is not formed. Applicable to. In this case, one end side of the micro pin is inserted into the non-through hole with the conductor layer exposed at the bottom and soldered. Then, other circuit boards, electronic components, electronic circuit modules and other members are connected to the other end of the micropins with solder or the like.

また、上記した実施の形態では、部材間を金属柱やマイクロピン等の導電部材で接続して電子回路モジュールを組み立てた後で、内部の部材を固定し保護するための封止樹脂を充填して電子回路モジュールを作製する場合について説明したが、電子回路モジュールの作製方法はこれに限定されない。図８は、電子回路モジュールの作製方法の変形例を説明する図である。図８に示す電子回路モジュールの作製方法では、先ず、回路基板７０上の所定位置に非貫通穴７１を形成し、表面に金属膜をめっき形成するとともに（図８（ａ））、この非貫通穴７１を避けて電子部品７２を半田等で実装する（図８（ｂ））。そして、非貫通穴７１に導電部材７３の一端側を挿入し、非貫通穴７１表面の金属膜と導電部材７３の一端とを接続する（図８（ｃ））。続いて、絶縁層７４を形成して導電部材７３および電子部品７２を補強する（図８（ｄ））。続いて、絶縁層７４の上面を研磨して平坦化するとともに、導電部材７３の他端面をそれぞれ露出させる（図８（ｅ））。そして、露出した導電部材７３の他端に金属膜７５を形成し、この金属膜上にバンプ７６を形成する（図８（ｆ））。なお、図示しないが、この後、バンプ７６を介して回路基板７０と他の部材とを対向配置し、これらの機械的および電気的な接続を得る。本作製方法によれば、導電部材７３の長さを正確に規定できない場合であっても、対向する部材間を確実に接続することができる。   Further, in the above-described embodiment, after assembling the electronic circuit module by connecting the members with conductive members such as metal pillars and micro pins, the sealing resin for fixing and protecting the internal members is filled. Although the case where the electronic circuit module is manufactured has been described, the method for manufacturing the electronic circuit module is not limited to this. FIG. 8 is a diagram illustrating a modification of the method for manufacturing the electronic circuit module. In the method of manufacturing the electronic circuit module shown in FIG. 8, first, a non-through hole 71 is formed at a predetermined position on the circuit board 70, and a metal film is formed on the surface by plating (FIG. 8A). The electronic component 72 is mounted with solder or the like while avoiding the hole 71 (FIG. 8B). Then, one end side of the conductive member 73 is inserted into the non-through hole 71, and the metal film on the surface of the non-through hole 71 is connected to one end of the conductive member 73 (FIG. 8C). Subsequently, the insulating layer 74 is formed to reinforce the conductive member 73 and the electronic component 72 (FIG. 8D). Subsequently, the upper surface of the insulating layer 74 is polished and flattened, and the other end surface of the conductive member 73 is exposed (FIG. 8E). Then, a metal film 75 is formed on the other end of the exposed conductive member 73, and bumps 76 are formed on the metal film (FIG. 8F). Although not shown in the figure, the circuit board 70 and other members are disposed opposite to each other via the bumps 76 to obtain mechanical and electrical connections therebetween. According to this manufacturing method, even when the length of the conductive member 73 cannot be accurately defined, the opposing members can be reliably connected.

実施の形態１の電子回路モジュールの一例を模式的に示す斜視図である。1 is a perspective view schematically showing an example of an electronic circuit module according to Embodiment 1. FIG. 実施の形態２の電子回路モジュールの一例を模式的に示す斜視図である。It is a perspective view which shows typically an example of the electronic circuit module of Embodiment 2. FIG. 実施の形態３の電子回路モジュールの一例を模式的に示す斜視図である。FIG. 6 is a perspective view schematically showing an example of an electronic circuit module according to a third embodiment. 実施の形態４における半田付け工程前の回路基板の断面図を示す図である。FIG. 6 is a diagram showing a cross-sectional view of a circuit board before a soldering process in a fourth embodiment. 実施の形態４における半田付け工程後の回路基板の断面図を示す図である。FIG. 10 is a diagram showing a cross-sectional view of a circuit board after a soldering process in Embodiment 4. 中間層を有する基板上にマイクロピンを接続する従来の接続構造を説明する図である。It is a figure explaining the conventional connection structure which connects a micro pin on the board | substrate which has an intermediate | middle layer. 変形例における中間層を有する基板とマイクロピンとの接続構造を説明する図である。It is a figure explaining the connection structure of the board | substrate which has an intermediate | middle layer in a modification, and a micro pin. 電子回路モジュールの作製方法の変形例を説明する図である。It is a figure explaining the modification of the preparation methods of an electronic circuit module.

符号の説明Explanation of symbols

１，２，３ 電子回路モジュール
１１，１３，２１，２３，３１，３３ 回路基板
１１１，２１１，３１１，３１３ 非貫通穴
１２，２２，２５，３２，３５ 電子部品
１３１，１３３，２３１，２５１，３３１，３５１ 平面電極
１５，２７，２９，３７ 金属柱
４１ 回路基板
４１１，４１２ 導体層
４１３，４１４ 中間層
４１６〜４１８ 非貫通穴
４１９ 半田材料
４３〜４５ マイクロピン 1, 2, 3 Electronic circuit module 11, 13, 21, 23, 31, 33 Circuit board 111, 211, 311, 313 Non-through hole 12, 22, 25, 32, 35 Electronic component 131, 133, 231, 251 331, 351 Planar electrode 15, 27, 29, 37 Metal pillar 41 Circuit board 411, 412 Conductive layer 413, 414 Intermediate layer 416-418 Non-through hole 419 Solder material 43-45 Micro pin

Claims (8)

互いに対向配置された複数の部材と、各部材間を機械的および電気的に接続する導電部材とを備えた電子回路モジュールであって、
前記複数の部材のうち、少なくとも対向する一方の部材に非貫通穴が形成されており、前記導電部材の端部が前記非貫通穴に挿入されて他方の部材との間が接続されることを特徴とする電子回路モジュール。 An electronic circuit module comprising a plurality of members arranged opposite to each other, and a conductive member that mechanically and electrically connects each member,
A non-through hole is formed in at least one of the plurality of members facing each other, and an end of the conductive member is inserted into the non-through hole so that the other member is connected. Electronic circuit module characterized. 前記他方の部材は前記一方の部材と対向する面に端子部が形成された電子部品であり、前記導電部材の一端部が前記非貫通穴に挿入され、他端部が前記端子部と接触されて前記一方の部材と前記他方の部材との間が接続されることを特徴とする請求項１に記載の電子回路モジュール。   The other member is an electronic component in which a terminal portion is formed on a surface facing the one member, one end portion of the conductive member is inserted into the non-through hole, and the other end portion is in contact with the terminal portion. The electronic circuit module according to claim 1, wherein the one member and the other member are connected to each other. 前記一方の部材には複数の非貫通穴が形成されており、各非貫通穴に異なる長さに形成された導電部材の一端部が挿入され、各導電部材の他端部にそれぞれ別の部材が接続されて前記各部材が積層されて配置されることを特徴とする請求項１または２に記載の電子回路モジュール。   A plurality of non-through holes are formed in the one member, and one end portion of a conductive member formed in a different length is inserted into each non-through hole, and another member is inserted into the other end portion of each conductive member. The electronic circuit module according to claim 1, wherein the members are stacked and arranged in a stacked manner. 前記一方の部材には深さの異なる複数の非貫通穴が形成されており、各非貫通穴に同一の長さに形成された導電部材の一端部が挿入され、各導電部材の他端部にそれぞれ別の部材が接続されて前記各部材が積層されて配置されることを特徴とする請求項１または２に記載の電子回路モジュール。   A plurality of non-through holes with different depths are formed in the one member, and one end portion of the conductive member formed in the same length is inserted into each non-through hole, and the other end portion of each conductive member The electronic circuit module according to claim 1, wherein different members are connected to each other, and the respective members are stacked. 前記一方の部材は中間層を有する基板であり、前記非貫通穴の底部に前記中間層が露出していることを特徴とする請求項１〜４のいずれか一つに記載の電子回路モジュール。   The electronic circuit module according to claim 1, wherein the one member is a substrate having an intermediate layer, and the intermediate layer is exposed at a bottom of the non-through hole. 前記非貫通穴の底部に予め半田材料が配置されており、前記非貫通穴に挿入された前記導電部材の一端部が前記中間層と半田接続されることを特徴とする請求項５に記載の電子回路モジュール。   The solder material is previously arranged at the bottom of the non-through hole, and one end of the conductive member inserted into the non-through hole is solder-connected to the intermediate layer. Electronic circuit module. 前記一方の部材は基板であり、前記非貫通穴の底部に導体層が露出していることを特徴とする請求項１〜４のいずれか一つに記載の電子回路モジュール。   5. The electronic circuit module according to claim 1, wherein the one member is a substrate, and a conductor layer is exposed at a bottom portion of the non-through hole. 前記非貫通穴の底部に予め半田材料が配置されており、前記非貫通穴に挿入された前記導電部材の一端部が前記導体層と半田接続されることを特徴とする請求項７に記載の電子回路モジュール。   The solder material is previously arranged at the bottom of the non-through hole, and one end of the conductive member inserted into the non-through hole is solder-connected to the conductor layer. Electronic circuit module.
JP2007297769A 2007-11-16 2007-11-16 Electronic circuit module Withdrawn JP2009124004A (en)

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JP2015128100A (en) * 2013-12-27 2015-07-09 富士通株式会社 Wiring board and manufacturing method of the same

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JP2015128100A (en) * 2013-12-27 2015-07-09 富士通株式会社 Wiring board and manufacturing method of the same

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