JP2009099822A - Physical quantity detector - Google Patents

Physical quantity detector Download PDF

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JP2009099822A
JP2009099822A JP2007270830A JP2007270830A JP2009099822A JP 2009099822 A JP2009099822 A JP 2009099822A JP 2007270830 A JP2007270830 A JP 2007270830A JP 2007270830 A JP2007270830 A JP 2007270830A JP 2009099822 A JP2009099822 A JP 2009099822A
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physical quantity
sensor
quantity detection
detection device
substrate
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Kazuhiko Terajima
寺嶋　　一彦
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Citizen Holdings Co Ltd
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Citizen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

<P>PROBLEM TO BE SOLVED: To provide a physical quantity detector capable of preventing a joint failure of a wire and breakage of a sensor in ultrasonic bonding, and excelling in impact resistance. <P>SOLUTION: The physical quantity detector 20 includes a sensor part 19 mounted on a board 7. In the sensor part 19, a weight part 1 is jointed to a frame part 3 through a pair of beam parts 2, and suspended in an opening of the frame part 3. A lower lid 4 is jointed to a lower part of the frame part 3. Pad electrodes 5 are arranged on the upper parts of the frame part 3, and electrically connected to board electrodes 8 arranged on the board 7 through connection wires 6. The sensor part 19 is supported on the board 7 from the lower side of the lower lid 4 by support members 9. The support members 9 support the sensor part 19 on the board 7 in a state fixed to either of the sensor part 19 or the board 7. The sensor part 19 supported to the support members 9 is fixed to the board 7 by an elastic adhesive 10. The support member 9 is formed with a member having hardness higher than that of the elastic adhesive 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、被測定体に加わる加速度や傾斜角などの物理量を検出しこれを電気的信号に変換する物理量検出装置に関する。   The present invention relates to a physical quantity detection device that detects a physical quantity such as an acceleration or an inclination angle applied to an object to be measured and converts it into an electrical signal.

物理量検出装置とは、機械的な物理量を電気的な信号に変換する変換器の総称であり、傾斜角度に応じた電気信号を出力する傾斜センサや、加速度に応じた電気信号を出力する加速度センサが知られている。傾斜センサでは、傾斜角に応じて異なる情報を入力するための入力手段などにも使われており、加速度センサは、自動車のエアバッグ作動手段の検出手段などにも使われている。   The physical quantity detection device is a general term for converters that convert mechanical physical quantities into electrical signals. An inclination sensor that outputs an electrical signal according to an inclination angle and an acceleration sensor that outputs an electrical signal according to acceleration. It has been known. The tilt sensor is also used as an input means for inputting different information depending on the tilt angle, and the acceleration sensor is also used as a detection means for an airbag operating means of an automobile.

このような物理量検出装置として多くの種類が提案されている。中でも、梁等により懸架された錘部を有し、印加される物理量に応じた錘部の変位を検出するものとして、ゲージ抵抗の歪みによる抵抗値の変化により物理量を検出する抵抗型物理量検出装置が知られており、多くの提案を見るものである（例えば、特許文献１参照）。   Many types of physical quantity detection devices have been proposed. Among them, a resistance type physical quantity detection device that has a weight part suspended by a beam or the like and detects a physical quantity based on a change in resistance value due to a strain of a gauge resistance as a means for detecting displacement of the weight part according to an applied physical quantity. Is known, and many proposals are seen (for example, refer to Patent Document 1).

特許文献１に記載された従来技術の構成と機能について図面を用いて説明する。図３は特許文献１に記載された従来技術を説明しやすいようにその趣旨を逸脱しない範囲で書き直した断面図である。   The configuration and function of the prior art described in Patent Document 1 will be described with reference to the drawings. FIG. 3 is a cross-sectional view rewritten without departing from the spirit of the prior art described in Patent Document 1 so as to facilitate explanation.

特許文献１に記載された従来の物理量検出装置１２０は、枠部１０３と、薄肉で可撓性である一対の梁部１０２を介して枠部１０３中央の開口部に懸架された錘部１０１とを有する。枠部１０３は低弾性接着剤１１０を用いて基板１０７に接着されている。また従来の物理量検出装置１２０は、枠部１０３上面にパッド電極１０５を設けるとともに、基板１０７上面には基板電極１０８を設け、パット電極１０５と基板電極１０８とを接続ワイヤー１０６を介して電気的に接続している。   The conventional physical quantity detection device 120 described in Patent Document 1 includes a frame portion 103 and a weight portion 101 suspended from an opening at the center of the frame portion 103 via a pair of thin and flexible beam portions 102. Have The frame portion 103 is bonded to the substrate 107 using a low elastic adhesive 110. In addition, the conventional physical quantity detection device 120 is provided with the pad electrode 105 on the upper surface of the frame 103 and the substrate electrode 108 on the upper surface of the substrate 107, and the pad electrode 105 and the substrate electrode 108 are electrically connected via the connection wire 106. Connected.

このように構成すると、固定された物理量検出装置１２０が加速度等の物理量を受けた際に、枠部１０３の開口部に懸架された錘部１０１は慣性運動するため、印加された加速度の大きさと方向に応じて梁部１０２に撓みを生じることとなる。
知られているように、前述の梁部１０２上に例えばピエゾ抵抗素子を形成して、そのピエゾ抵抗素子を含んだホイートストン・ブリッジを構成すれば、ブリッジ平衡電圧の変動から物理量検出装置１２０に加わった加速度等の物理量を検出することができる。 With this configuration, when the fixed physical quantity detection device 120 receives a physical quantity such as acceleration, the weight part 101 suspended in the opening of the frame part 103 is inertially moved. Depending on the direction, the beam 102 will be bent.
As is known, if, for example, a piezoresistive element is formed on the beam 102 and a Wheatstone bridge including the piezoresistive element is formed, the physical quantity detection device 120 is added due to fluctuations in the bridge equilibrium voltage. It is possible to detect physical quantities such as acceleration.

また特許文献１に示す物理量検出装置１２０においては、耐衝撃性を向上させる目的で、シリコン樹脂等からなる低弾性接着剤１１０を用いて枠部１０３を基板１０７に固着している。さらに低弾性接着剤１１０の熱膨張を抑えるため、低弾性接着剤１１０に粒子を含有させている。   In the physical quantity detection device 120 shown in Patent Document 1, the frame portion 103 is fixed to the substrate 107 using a low elastic adhesive 110 made of silicon resin or the like for the purpose of improving impact resistance. Furthermore, in order to suppress the thermal expansion of the low elastic adhesive 110, the low elastic adhesive 110 contains particles.

特開２００７−３５９６５号公報（第７〜１０頁、図２）Japanese Patent Laying-Open No. 2007-35965 (7th to 10th pages, FIG. 2)

しかし、従来技術の物理量検出装置では次のような問題がある。一般に、接続ワイヤーの電極への接合方法としては、超音波振動と加熱を併用する超音波ボンディング手段が広く用いられている。
従来技術の物理量検出装置１２０においては、枠部１０３が低弾性接着剤１１０で基板
１０７に固着されている。このため、超音波接合する際にパッド電極１０５と接続ワイヤー１０６とに加えられる圧力が、低弾性接着剤１１０によって緩和されてパッド電極１０５と接続ワイヤー１０６との界面に有効に作用しない。この結果、接続ワイヤー１０６とパッド電極１０５とが正しく接合されない問題があった。 However, the conventional physical quantity detection device has the following problems. In general, as a method for bonding a connection wire to an electrode, ultrasonic bonding means using both ultrasonic vibration and heating is widely used.
In the physical quantity detection device 120 of the prior art, the frame portion 103 is fixed to the substrate 107 with a low elastic adhesive 110. For this reason, the pressure applied to the pad electrode 105 and the connection wire 106 during ultrasonic bonding is relaxed by the low elastic adhesive 110 and does not effectively act on the interface between the pad electrode 105 and the connection wire 106. As a result, there is a problem that the connection wire 106 and the pad electrode 105 are not correctly joined.

また、従来技術の物理量検出装置１２０においては、枠部１０３が低弾性接着剤１１０を介して基板１０７に接着されているため、ワイヤーボンディング時の超音波振動により、枠部１０３が共振して梁部１０２を損傷するという問題を生じていた。   In the physical quantity detection device 120 of the prior art, since the frame portion 103 is bonded to the substrate 107 via the low-elastic adhesive 110, the frame portion 103 resonates due to ultrasonic vibration during wire bonding. The problem that the part 102 was damaged occurred.

そこで本発明の目的は、上記の課題を解決して、超音波ボンディング時のワイヤーの接合不良およびセンサの破損を防ぐとともに、耐衝撃性に優れた物理量検出装置を提供することである。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and provide a physical quantity detection device excellent in impact resistance while preventing wire bonding failure and sensor breakage during ultrasonic bonding.

上記課題を解決するために、本発明の物理量検出装置は、下記記載の構成を採用するものである。   In order to solve the above problems, the physical quantity detection device of the present invention adopts the following configuration.

本発明の物理量検出装置は、印加される物理量を検出するセンサが基板上に搭載され、ワイヤーボンディングするためのパッド電極がセンサに設けられた物理量検出装置において、センサを、パッド電極の反対側から基板上で支持する支持部材と、支持部材により基板上で支持されたセンサを、基板に対して固着する接着剤とを備え、支持部材は接着剤より高い硬度を有することを特徴とするものである。   The physical quantity detection device of the present invention is a physical quantity detection device in which a sensor for detecting an applied physical quantity is mounted on a substrate, and a pad electrode for wire bonding is provided on the sensor. A support member supported on the substrate; and an adhesive for fixing the sensor supported on the substrate by the support member to the substrate, wherein the support member has higher hardness than the adhesive. is there.

また本発明の物理量検出装置は、上記記載の構成に加えて、センサまたは基板の、支持部材と当接する箇所に凹部を設けることを特徴とするものである。   In addition to the above-described configuration, the physical quantity detection device of the present invention is characterized in that a recess is provided at a location where the sensor or the substrate comes into contact with the support member.

さらに本発明の物理量検出装置は、上記記載の構成に加えて、支持部材は、センサまたは基板と一体に形成されることを特徴とするものである。   Furthermore, in addition to the above-described configuration, the physical quantity detection device of the present invention is characterized in that the support member is formed integrally with the sensor or the substrate.

本発明の物理量検出装置では、センサは、支持部材より硬度の低い接着剤で基板に対して固着される。このため、外部からの衝撃を接着剤により緩和することにより、センサの破損を防ぐことができる。
また本発明の物理量検出装置では、センサが、パッド電極の反対側から支持部材により支持されている。このため、超音波ボンディングによる接続ワイヤー接合の際に、接続ワイヤーとパッド電極との界面に有効な圧力が印加される。これにより、接続ワイヤーとパッド電極との接合を良好に行うことができる。
さらに本発明の物理量検出装置では、超音波ボンディングによる接続ワイヤー接合の際に、超音波振動が支持部材を介して基板側に伝わるので、センサの共振による破損を防ぐことができる。 In the physical quantity detection device of the present invention, the sensor is fixed to the substrate with an adhesive having a lower hardness than the support member. For this reason, damage to the sensor can be prevented by reducing the impact from the outside with an adhesive.
In the physical quantity detection device of the present invention, the sensor is supported by the support member from the opposite side of the pad electrode. For this reason, effective pressure is applied to the interface between the connection wire and the pad electrode when the connection wire is joined by ultrasonic bonding. Thereby, joining of a connection wire and a pad electrode can be performed favorably.
Furthermore, in the physical quantity detection device of the present invention, since ultrasonic vibration is transmitted to the substrate side via the support member during connection wire bonding by ultrasonic bonding, damage due to resonance of the sensor can be prevented.

以下図面を参照しながら本発明の最適な実施の形態における物理量検出装置について詳細に説明する。   Hereinafter, a physical quantity detection device according to an optimal embodiment of the present invention will be described in detail with reference to the drawings.

＜実施例１＞
図１は、本発明の実施例１における物理量検出装置の構造を模式的に示す断面図である。図１に示すように、実施例１における物理量検出装置２０は、センサ部１９が基板７上に搭載された構成を備える。センサ部１９は、略立方形の錘部１と、薄肉で可撓性の梁部２と、中央に開口部を有する枠部３と、下蓋４とからなる。錘部１は一対の梁部２を介し
て枠部３と接合しており、枠部３の開口部のほぼ中央に懸架されている。下蓋４は略四角形の平面形状を有し、端部において枠部３の下部と接合している。 <Example 1>
FIG. 1 is a cross-sectional view schematically showing the structure of the physical quantity detection device in Embodiment 1 of the present invention. As illustrated in FIG. 1, the physical quantity detection device 20 according to the first embodiment includes a configuration in which a sensor unit 19 is mounted on a substrate 7. The sensor portion 19 includes a substantially cubic weight portion 1, a thin and flexible beam portion 2, a frame portion 3 having an opening at the center, and a lower lid 4. The weight portion 1 is joined to the frame portion 3 via a pair of beam portions 2 and is suspended substantially at the center of the opening portion of the frame portion 3. The lower lid 4 has a substantially rectangular planar shape, and is joined to the lower portion of the frame portion 3 at the end.

錘部１と梁部２と枠部３と下蓋４の材料としては、例えば、シリコン単結晶やガラス板を用いることができる。このような材料を用いると、フォトリソグラフィ技術や異方性ドライエッチング（Ｒｅａｃｔｉｖｅ Ｉｏｎ Ｅｔｃｈｉｎｇ：ＲＩＥ）等の知られている加工手段により小型の物理量検出装置２０を形成することができる。
また、梁部２の部材としては、シリコン単結晶やガラスの他、窒化シリコン、酸化シリコン、ポリイミド樹脂、エポキシ樹脂等の可撓性材料を用いることができる。 As a material of the weight part 1, the beam part 2, the frame part 3, and the lower lid 4, for example, a silicon single crystal or a glass plate can be used. When such a material is used, the small physical quantity detection device 20 can be formed by a known processing means such as a photolithography technique or anisotropic dry etching (RIE).
Moreover, as a member of the beam part 2, flexible materials, such as a silicon nitride, a silicon oxide, a polyimide resin, an epoxy resin other than a silicon single crystal and glass, can be used.

また物理量測定装置２０では、センサ部１９の枠部３の上部にパッド電極５が設けられる。このパッド電極５は、基板７上に設けられた基板電極８と接続ワイヤー６を介して電気的に接続している。   In the physical quantity measuring device 20, the pad electrode 5 is provided on the upper part of the frame part 3 of the sensor part 19. The pad electrode 5 is electrically connected to a substrate electrode 8 provided on the substrate 7 via a connection wire 6.

さらに物理量測定装置２０では、センサ部１９は、略立方体形状の支持部材９により下蓋４の下側から基板７上で支持される。ここで支持部材９は、パッド電極５の真下からセンサ部１９を支持することが望ましい。支持部材９はセンサ部１９または基板７のいずれか一方に固着された状態で、センサ部１９を基板７上で支持する。
支持部材９に支持されたセンサ部１９は、弾性接着剤１０により基板７に対して固着されている。ここで、支持部材９は弾性接着剤１０より硬度の高い部材により構成される。
支持部材９は、例えば、半導体集積回路チップの突起電極を形成する方法により、Ａｕ、Ｃｕ、ハンダ等の金属材料を用いて形成される。弾性接着剤１０の材料としては、例えば、弾性率の低いシリコン樹脂等を用いることができる。 Further, in the physical quantity measuring device 20, the sensor unit 19 is supported on the substrate 7 from the lower side of the lower lid 4 by the substantially cubic support member 9. Here, the support member 9 desirably supports the sensor unit 19 from directly below the pad electrode 5. The support member 9 supports the sensor unit 19 on the substrate 7 while being fixed to either the sensor unit 19 or the substrate 7.
The sensor unit 19 supported by the support member 9 is fixed to the substrate 7 by the elastic adhesive 10. Here, the support member 9 is composed of a member having a hardness higher than that of the elastic adhesive 10.
The support member 9 is formed using a metal material such as Au, Cu, or solder by, for example, a method of forming a protruding electrode of a semiconductor integrated circuit chip. As a material of the elastic adhesive 10, for example, a silicon resin having a low elastic modulus can be used.

物理量検出装置２０は、上述した構成を備えることにより、固定された物理量検出装置２０が加速度等の物理量を受けた際に、内部に懸架された錘部１は慣性運動するため、印加された加速度の大きさと方向に対応する撓みが梁部２に生じることとなる。知られているように、前述の梁部２上に例えばピエゾ抵抗素子を形成して、そのピエゾ抵抗素子を含んだホイートストン・ブリッジを構成すれば、ブリッジ平衡電圧の変動から物理量検出装置２０に加わった加速度等の物理量を検出することができる。
また、図１に示す梁部２とは別に、例えば一対の梁を梁部２に対して垂直方向に設けることにより、２軸・３軸の物理量検出装置を構成することができる。 Since the physical quantity detection device 20 has the above-described configuration, when the fixed physical quantity detection device 20 receives a physical quantity such as acceleration, the weight portion 1 suspended therein undergoes an inertial movement, and thus applied acceleration. Deflection corresponding to the size and direction of the beam will occur in the beam portion 2. As is known, if, for example, a piezoresistive element is formed on the beam portion 2 and a Wheatstone bridge including the piezoresistive element is formed, the physical quantity detection device 20 is added due to fluctuations in the bridge equilibrium voltage. It is possible to detect physical quantities such as acceleration.
In addition to the beam part 2 shown in FIG. 1, for example, by providing a pair of beams in a direction perpendicular to the beam part 2, a biaxial / three-axis physical quantity detection device can be configured.

また、本発明の実施例１の物理量検出装置２０においては、センサ部１９は、弾性接着剤１０より硬度の高い支持部材９により下蓋４の下側から基板７上で支持される。望ましくは、パッド電極５の真下から、支持部材９によりセンサ部１９は支持される。
このため、パッド電極５上に接続ワイヤー６を超音波接合する際のパッド電極５と接続ワイヤー６とに加えられる圧力が、弾性接着剤１０によって緩和されることなく、パッド電極５と接続ワイヤー６との界面に有効に印加される。また、超音波振動も、パッド電極５と接続ワイヤー６との界面に有効に作用する。これにより、本発明の第１実施例の物理量検出装置２０においては、接続ワイヤー６とパッド電極５との接合を良好に行うことができる。 In the physical quantity detection device 20 according to the first embodiment of the present invention, the sensor unit 19 is supported on the substrate 7 from the lower side of the lower lid 4 by the support member 9 having a hardness higher than that of the elastic adhesive 10. Desirably, the sensor unit 19 is supported by the support member 9 from directly below the pad electrode 5.
For this reason, the pressure applied to the pad electrode 5 and the connection wire 6 when the connection wire 6 is ultrasonically bonded to the pad electrode 5 is not relaxed by the elastic adhesive 10, and the pad electrode 5 and the connection wire 6. Is effectively applied to the interface. Also, ultrasonic vibrations effectively act on the interface between the pad electrode 5 and the connection wire 6. Thereby, in the physical quantity detection apparatus 20 of 1st Example of this invention, joining of the connection wire 6 and the pad electrode 5 can be performed favorably.

さらに、本発明の実施例１の物理量検出装置２０においては、超音波ボンディングによる接続ワイヤー接合の際に、超音波振動が枠部３と支持部材９とを介して基板７側に伝わる。このため、枠部３の共振による梁部２の破損を防ぐことができる。   Furthermore, in the physical quantity detection device 20 according to the first embodiment of the present invention, ultrasonic vibration is transmitted to the substrate 7 side through the frame portion 3 and the support member 9 when connecting wires are joined by ultrasonic bonding. For this reason, damage to the beam portion 2 due to resonance of the frame portion 3 can be prevented.

さらに、本発明の実施例１の物理量検出装置２０においては、センサ部１９は、支持部材９より硬度の低い弾性接着剤１０で基板７に対して固着される。このため、外部からの衝撃を弾性接着剤１０により緩和することにより、センサ部１９の破損を防ぐことができ
る。 Furthermore, in the physical quantity detection device 20 according to the first embodiment of the present invention, the sensor unit 19 is fixed to the substrate 7 with the elastic adhesive 10 having a hardness lower than that of the support member 9. For this reason, damage to the sensor unit 19 can be prevented by reducing the impact from the outside with the elastic adhesive 10.

図１においては、支持部材９が略立方体形状を有してセンサ部１９を支持する構成例を示した。しかし本発明はこれに限定されるものではなく、支持部材９が、例えば球形状、半球形状を有してセンサ部１９を支持する構成であっても良い。   FIG. 1 shows a configuration example in which the support member 9 has a substantially cubic shape and supports the sensor unit 19. However, the present invention is not limited to this, and the support member 9 may have a spherical shape or a hemispherical shape to support the sensor unit 19.

また、図１においては、支持部材９が、下蓋４および基板７と別体で形成された構成例を示した。しかし本発明はこれに限定されるものではなく、下蓋４または基板７と一体に形成されていても良い。
支持部材９と下蓋４とを一体に形成する場合は、例えば、エッチング手段により下蓋４と一体となる突起形状を設けて、これを支持部材９とすることができる。また、基板７と下蓋４とを一体に形成する場合は、例えば、配線パターン・レジストパターンを形成するエッチング手段などにより突起形状を設けて、これを支持部材９とすることができる。 Further, FIG. 1 shows a configuration example in which the support member 9 is formed separately from the lower lid 4 and the substrate 7. However, the present invention is not limited to this, and may be formed integrally with the lower lid 4 or the substrate 7.
When the support member 9 and the lower lid 4 are integrally formed, for example, a protrusion shape that is integral with the lower lid 4 is provided by etching means, and this can be used as the support member 9. When the substrate 7 and the lower lid 4 are integrally formed, for example, a protrusion shape can be provided by an etching means for forming a wiring pattern / resist pattern, and this can be used as the support member 9.

＜実施例２＞
次に、本発明の実施例２の物理量検出装置について、図面を用いて説明する。すでに説明した同一の構成には同一の符号を付与しており、その説明は省略する。実施例２の物理量検出装置は、支持部材および基板の構成が、実施例１の物理量検出装置と異なることを特徴とするものである。図２は、本発明の第２の実施例における物理量検出装置の構造を説明するために模式的に示す断面図である。 <Example 2>
Next, a physical quantity detection apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. The same reference numerals are given to the same components that have already been described, and descriptions thereof are omitted. The physical quantity detection device according to the second embodiment is characterized in that the configuration of the support member and the substrate is different from that of the physical quantity detection device according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing the structure of the physical quantity detection device according to the second embodiment of the present invention.

図２に示すように、本発明の実施例２の物理量検出装置２１は、支持部材９が略球形状に形成される。この略球状の支持部材９は、基板７に設けられた凹部１１内で固定される。この略球状の支持部材９として、例えば、市販の球状材料であるシリカ粒子やエポキシ、ウレタン、アクリル、ポリイミド等の樹脂粒子を用いることができる。さらに、Ｎｉ、Ｃｕ、Ａｕ、ハンダ等の金属粒子を支持部材９として用いることができる。基板７上の凹部１１は、例えば、エッチング手段により形成される。   As shown in FIG. 2, in the physical quantity detection device 21 according to the second embodiment of the present invention, the support member 9 is formed in a substantially spherical shape. The substantially spherical support member 9 is fixed in a recess 11 provided in the substrate 7. As the substantially spherical support member 9, for example, commercially available spherical materials such as silica particles and resin particles such as epoxy, urethane, acrylic, and polyimide can be used. Furthermore, metal particles such as Ni, Cu, Au, and solder can be used as the support member 9. The recess 11 on the substrate 7 is formed by, for example, etching means.

実施例２の物理量検出装置２１においても、実施例１の物理量検出装置２０と同様に、パッド電極５の真下から、支持部材９によりセンサ部１９が支持されることが望ましい。   Also in the physical quantity detection device 21 of the second embodiment, it is desirable that the sensor unit 19 is supported by the support member 9 from directly below the pad electrode 5 as in the physical quantity detection device 20 of the first embodiment.

実施例２の物理量検出装置２１は、例えば、基板７上の所定の位置に凹部１１が形成され、略球状の支持部材９が内部に分散された弾性接着剤１０により、センサ部１９と基板７とが固着される。これにより、実施例２の物理量検出装置２１は、実施例１の物理量検出装置２０と比較して、センサ部１９が支持部材９により基板７上で支持された構成を、容易に作製することが可能となる。   In the physical quantity detection device 21 according to the second embodiment, for example, the concave portion 11 is formed at a predetermined position on the substrate 7, and the sensor unit 19 and the substrate 7 are formed by the elastic adhesive 10 in which the substantially spherical support member 9 is dispersed. And are fixed. Thereby, the physical quantity detection device 21 according to the second embodiment can easily produce a configuration in which the sensor unit 19 is supported on the substrate 7 by the support member 9 as compared with the physical quantity detection device 20 according to the first embodiment. It becomes possible.

実施例２の物理量検出装置２１は、実施例１の物理量検出装置２０と同様に、センサ部１９が、弾性接着剤１０より硬度の高い支持部材９により下蓋４の下側から基板７上で支持される。このため、パッド電極５上に接続ワイヤー６を超音波接合する際のパッド電極５と接続ワイヤー６とに加えられる圧力が、パッド電極５と接続ワイヤー６の界面に有効に印加され、接続ワイヤー６とパッド電極５との接合を良好に行うことができる。   Similar to the physical quantity detection device 20 of the first embodiment, the physical quantity detection device 21 of the second embodiment has the sensor unit 19 on the substrate 7 from the lower side of the lower lid 4 by the support member 9 having a hardness higher than that of the elastic adhesive 10. Supported. For this reason, the pressure applied to the pad electrode 5 and the connection wire 6 when the connection wire 6 is ultrasonically bonded onto the pad electrode 5 is effectively applied to the interface between the pad electrode 5 and the connection wire 6. And the pad electrode 5 can be bonded satisfactorily.

さらに、本発明の実施例２の物理量検出装置２１においては、超音波ボンディングによる接続ワイヤー接合の際に、超音波振動が枠部３と支持部材９とを介して基板７側に伝わる。このため、枠部３の共振による梁部２の破損を防ぐことができる。
さらに、本発明の実施例２の物理量検出装置２１においては、センサ部１９は、支持部材９より硬度の低い弾性接着剤１０で基板７に対して固着されため、外部からの衝撃を弾性接着剤１０により緩和して、センサ部１９の破損を防ぐことができる。 Furthermore, in the physical quantity detection device 21 according to the second embodiment of the present invention, ultrasonic vibration is transmitted to the substrate 7 side through the frame 3 and the support member 9 when connecting wires are joined by ultrasonic bonding. For this reason, damage to the beam portion 2 due to resonance of the frame portion 3 can be prevented.
Furthermore, in the physical quantity detection device 21 according to the second embodiment of the present invention, the sensor unit 19 is fixed to the substrate 7 with the elastic adhesive 10 having a hardness lower than that of the support member 9, so that an external impact is applied to the elastic adhesive. 10 can be relaxed and damage to the sensor unit 19 can be prevented.

上述した実施例１および実施例２においては、梁部にピエゾ抵抗素子などの検出素子を設け、錘部の変位による梁部の撓みを検出する抵抗型のセンサが、支持部材により基板上で支持されるとともに弾性接着剤で固着される例を示した。
しかし、本発明は抵抗型のセンサを備える物理量検出装置に限定されるものではなく、例えば、錘部に第１の電極を設けるとともに枠部に第２の電極を設け、錘部の変位による電極間の電気的容量を検出する容量型センサなど、他の方式のセンサを備える物理量検出装置に対しても適用可能である。 In the first embodiment and the second embodiment described above, a detection element such as a piezoresistive element is provided in the beam portion, and the resistance type sensor that detects the deflection of the beam portion due to the displacement of the weight portion is supported on the substrate by the support member. And an example of fixing with an elastic adhesive.
However, the present invention is not limited to a physical quantity detection device including a resistance type sensor. For example, the first electrode is provided in the weight portion, the second electrode is provided in the frame portion, and the electrode due to the displacement of the weight portion is provided. The present invention can also be applied to a physical quantity detection device including another type of sensor, such as a capacitive sensor that detects an electrical capacitance between them.

センサの種類、方式を問わず、ワイヤーボンディングするためのパッド電極を備えるセンサを、支持部材により基板上で支持するとともに弾性接着剤で固着することにより、超音波ボンディング時のワイヤーの接合不良およびセンサの破損を防ぐとともに、耐衝撃性に優れた物理量検出装置を提供することが可能となる。   Regardless of sensor type and method, a sensor having a pad electrode for wire bonding is supported on a substrate by a support member and fixed with an elastic adhesive, so that the bonding failure of the wire during ultrasonic bonding and the sensor It is possible to provide a physical quantity detection device with excellent impact resistance.

本発明の実施例１における物理量検出装置の構造を示す断面図である。It is sectional drawing which shows the structure of the physical quantity detection apparatus in Example 1 of this invention. 本発明の実施例２における物理量検出装置の構造を示す断面図である。It is sectional drawing which shows the structure of the physical quantity detection apparatus in Example 2 of this invention. 従来技術の物理量検出装置の構造を示す断面図である。It is sectional drawing which shows the structure of the physical quantity detection apparatus of a prior art.

符号の説明Explanation of symbols

１ 錘部
２ 梁部
３ 枠部
４ 下蓋
５ パッド電極
６ 接続ワイヤー
７ 基板
８ 基板電極
９ 支持部材
１０ 弾性接着剤
１１ 凹部
１９ センサ部
２０、２１ 物理量検出装置 DESCRIPTION OF SYMBOLS 1 Weight part 2 Beam part 3 Frame part 4 Lower lid 5 Pad electrode 6 Connection wire 7 Substrate 8 Substrate electrode 9 Support member 10 Elastic adhesive 11 Recessed part 19 Sensor part 20, 21 Physical quantity detection apparatus

Claims (3)

印加される物理量を検出するセンサが基板上に搭載され、ワイヤーボンディングするためのパッド電極が前記センサ上に設けられた物理量検出装置において、
前記センサを、前記パッド電極の反対側から前記基板上で支持する支持部材と、
前記支持部材により前記基板上で支持された前記センサを、前記基板に対して固着する接着剤とを備え、
前記支持部材は前記接着剤より高い硬度を有する
ことを特徴とする物理量検出装置。 In the physical quantity detection device in which a sensor for detecting the applied physical quantity is mounted on the substrate and a pad electrode for wire bonding is provided on the sensor,
A support member for supporting the sensor on the substrate from the opposite side of the pad electrode;
An adhesive for fixing the sensor supported on the substrate by the support member to the substrate;
The physical quantity detection device, wherein the support member has a higher hardness than the adhesive. 前記センサまたは前記基板の、前記支持部材と当接する箇所に凹部を設ける
ことを特徴とする請求項１に記載の物理量検出装置。 The physical quantity detection device according to claim 1, wherein a concave portion is provided at a location where the sensor or the substrate contacts the support member. 前記支持部材は、前記センサまたは前記基板と一体に形成される
ことを特徴とする請求項１または２に記載の物理量検出装置。 The physical quantity detection device according to claim 1, wherein the support member is formed integrally with the sensor or the substrate.
JP2007270830A 2007-10-18 2007-10-18 Physical quantity detector Pending JP2009099822A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120049300A1 (en) * 2010-08-31 2012-03-01 Mitsumi Electric Co., Ltd. Sensor apparatus and method for mounting semiconductor sensor device
US9632105B2 (en) 2011-09-30 2017-04-25 Panasonic Intellectual Property Management Co., Ltd. Angular velocity sensor for suppressing fluctuation of detection sensitivity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120049300A1 (en) * 2010-08-31 2012-03-01 Mitsumi Electric Co., Ltd. Sensor apparatus and method for mounting semiconductor sensor device
US20150235980A1 (en) * 2010-08-31 2015-08-20 Mitsumi Electric Co., Ltd. Method for mounting semiconductor sensor device
US9632105B2 (en) 2011-09-30 2017-04-25 Panasonic Intellectual Property Management Co., Ltd. Angular velocity sensor for suppressing fluctuation of detection sensitivity

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