JP2009099794A

JP2009099794A - Electronic circuit unit

Info

Publication number: JP2009099794A
Application number: JP2007270335A
Authority: JP
Inventors: Sei Iimure; 聖飯牟礼
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2007-10-17
Filing date: 2007-10-17
Publication date: 2009-05-07

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is high in reliability of continuity between a shield case and a ground pattern and excellent in assembly operability. <P>SOLUTION: Disclosed is the electronic circuit unit which comprises a circuit board 1 where a high-frequency circuit is arranged and a pair of frame bodies 2 and 3 fitted to the circuit board 1 and made of metal plates to function as the shield case, wherein the first frame body 2 enclosing one surface 1a of the circuit board 1 has a first projection 23 formed on a partition wall 21 and a tip portion of the partition wall 21 and the second frame body 3 enclosing the other surface 1b of the circuit board 1 has a second projection 33 formed on a partition wall 31 and a tip portion of the partition wall 31. The first and second projections 23 and 33 are inserted into a through-hole 6 of the circuit board 1 from mutually opposite directions and soldered to a wall surface conductor 6a in the through-hole 6 electrically connected to the ground pattern 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、テレビジョン受信用チューナ等の高周波回路が配設された回路基板に金属板からなる枠体が取り付けられている電子回路ユニットに係り、特に、回路基板の接地パターンに導通されてシールドケースとして機能する枠体の取付構造に関する。 The present invention relates to an electronic circuit unit in which a frame body made of a metal plate is attached to a circuit board on which a high-frequency circuit such as a tuner for television reception is disposed, and in particular, is shielded by being conducted to a ground pattern of the circuit board. The present invention relates to a frame mounting structure that functions as a case.

この種の電子回路ユニットにおいては、金属板からなる枠体や仕切り板を回路基板に取り付け、これら枠体や仕切り板を回路基板の接地パターンに導通させることにより、テレビジョン受信用チューナ等の高周波回路で懸念される局部発振信号の漏れを抑制したり回路特性の安定化を図っている。このような電子回路ユニットの従来例として、回路基板を囲繞する金属板製の枠体に仕切り壁を一体的に設け、この仕切り壁の先端部を回路基板に挿通して接地パターンに半田付けすると共に、枠体の開口端を蓋閉する金属板製のカバーに切り起こし片を設け、この切り起こし片を仕切り壁の先端部に弾接させることにより、枠体およびカバーを回路基板のシールドケースとして機能させるようにしたものが知られている。 In this type of electronic circuit unit, a frame or partition plate made of a metal plate is attached to a circuit board, and the frame or partition plate is electrically connected to a grounding pattern of the circuit board, whereby a high frequency such as a tuner for television reception is used. The leakage of the local oscillation signal which is a concern in the circuit is suppressed and the circuit characteristics are stabilized. As a conventional example of such an electronic circuit unit, a partition wall is integrally provided on a frame made of a metal plate surrounding a circuit board, and a tip end portion of the partition wall is inserted into the circuit board and soldered to a ground pattern. In addition, a cut-and-raised piece is provided in a cover made of a metal plate that closes the opening end of the frame body, and the cut-and-raised piece is elastically contacted with the tip of the partition wall, whereby the frame body and the cover are shielded from the circuit board. What is made to function as is known.

しかしながら、このように構成された電子回路ユニットでは、カバーの切り起こし片が自身の弾性によって仕切り壁の先端部に当接しているだけなので、切り起こし片と仕切り壁との接触状態が不安定でカバーのシールド効果が損なわれやすいという問題があった。つまり、外部から振動や衝撃が加わったり、切り起こし片にへたり等の塑性変形が生じると、この切り起こし片が仕切り壁の先端部に対して接触不良を起こしやすくなるため、カバーが接地パターンと導通されなくなる虞があった。 However, in the electronic circuit unit configured as described above, the cut-and-raised piece of the cover is only in contact with the tip of the partition wall by its own elasticity, so the contact state between the cut-and-raised piece and the partition wall is unstable. There was a problem that the shielding effect of the cover was easily impaired. In other words, if vibration or impact is applied from the outside, or plastic deformation such as sag on the cut-and-raised piece occurs, this cut-and-raised piece tends to cause poor contact with the tip of the partition wall. There was a possibility that it could not be conducted.

そこで他の従来例として、枠体とカバーにそれぞれ複数のスリット部を形成すると共に、回路基板上で起立して接地パターンに半田付けされた金属板製の仕切り板を設け、この仕切り板の上下両端に形成した複数の爪片を枠体とカバーのスリット部に挿通して捻じることによって、枠体やカバーと仕切り板とが電気的かつ機械的に接続できるようにした電子回路ユニットが提案されている（例えば、特許文献１参照）。かかる従来技術では、仕切り板の爪片を捻じって枠体やカバーにかしめ付けるので、該爪片を枠体やカバーに安定的に圧着させることができ、それゆえ仕切り板と枠体およびカバーからなるシールドケースを回路基板の接地パターンと確実に導通させることができる。
特開平１０−２８４８６６号公報 Therefore, as another conventional example, a plurality of slit portions are formed in the frame body and the cover, respectively, and a partition plate made of a metal plate that is erected on the circuit board and soldered to the ground pattern is provided. Proposed electronic circuit unit that allows frame and cover and partition plate to be connected electrically and mechanically by inserting and twisting multiple claw pieces formed at both ends into slits of frame and cover (For example, refer to Patent Document 1). In such prior art, the claw pieces of the partition plate are twisted and caulked to the frame body or cover, so that the claw pieces can be stably crimped to the frame body or cover. The shield case made of can be reliably connected to the ground pattern of the circuit board.
Japanese Patent Laid-Open No. 10-284866

前述したように、特許文献１に開示された従来の電子回路ユニットでは、仕切り板に形成した複数の爪片を捻じって枠体やカバーにかしめ付けているので、シールドケースと接地パターンとの導通の信頼性は向上するものの、組立時に複数の爪片を一つずつ手作業で捻じらなければならないため、組立作業性が悪くなるという問題があると共に、爪片を捻じる際の応力で仕切り板の半田付け箇所が剥離する虞もあった。 As described above, in the conventional electronic circuit unit disclosed in Patent Document 1, a plurality of claw pieces formed on the partition plate are twisted and caulked to the frame body or the cover. Although reliability of continuity is improved, there is a problem that assembly workability is deteriorated because a plurality of claw pieces must be manually twisted one by one at the time of assembly. There is also a possibility that the soldering portion of the partition plate may be peeled off.

本発明は、このような従来技術の実情に鑑みてなされたものであり、その目的は、シールドケースと接地パターンとの導通の信頼性が高く組立作業性も良好な電子回路ユニットを提供することにある。 The present invention has been made in view of the situation of the prior art as described above, and an object thereof is to provide an electronic circuit unit that has high reliability in electrical connection between the shield case and the ground pattern and that has good assembly workability. It is in.

上記の目的を達成するため、本発明の電子回路ユニットは、高周波回路が配設されていると共に接地パターンに導通されたスルーホールを有する回路基板と、この回路基板の片面側を囲繞して該片面の少なくとも一部を覆う金属板製の第１の枠体と、前記回路基板の他面側を囲繞して前記第１の枠体と電気的に接続される金属板製の第２の枠体とを備え、前記第１の枠体に前記スルーホール内へ片面側から挿入される第１の突起を設けると共に、前記第２の枠体に前記スルーホール内へ他面側から挿入される第２の突起を設け、これら第１および第２の突起を前記スルーホールの内部で半田付けするという構成にした。 In order to achieve the above object, an electronic circuit unit of the present invention includes a circuit board having a high-frequency circuit and a through-hole connected to a ground pattern, and surrounding one side of the circuit board. A first frame made of a metal plate that covers at least a part of one side, and a second frame made of a metal plate that surrounds the other side of the circuit board and is electrically connected to the first frame. A first projection that is inserted into the through-hole from one side into the through-hole and is inserted into the through-hole from the other side into the through-hole. A second protrusion was provided, and the first and second protrusions were soldered inside the through hole.

このように構成された電子回路ユニットは、回路基板を囲繞する金属板製の第１および第２の枠体がそれぞれ、接地パターンに導通されたスルーホール内へ互いに反対方向から挿入される第１の突起と第２の突起を有し、これら第１および第２の突起がスルーホールの内部で半田付けされるため、シールドケースとして機能する第１および第２の枠体を回路基板の接地パターンに確実に接続することができ、両枠体の回路基板に対する取付強度も高めやすい。また、組立時には第１の突起と第２の突起をスルーホール内へ挿入した状態で、回路基板上に搭載した各種電子部品と一括してリフロー半田を行うことができるので、両枠体を回路基板に容易に取り付けることができて組立作業性が良好となる。 In the electronic circuit unit configured as described above, the first and second frame members made of a metal plate surrounding the circuit board are respectively inserted into the through holes connected to the ground pattern from opposite directions. Since the first and second protrusions are soldered inside the through hole, the first and second frames that function as shield cases are used as the ground pattern of the circuit board. Can be reliably connected, and it is easy to increase the attachment strength of the two frames to the circuit board. In addition, since reflow soldering can be performed together with various electronic components mounted on the circuit board with the first and second protrusions inserted into the through-holes during assembly, both frames can be connected to the circuit. It can be easily attached to the substrate and the assembly workability is improved.

上記の構成において、第１の枠体に回路基板の片面に向かって垂下する第１の仕切り壁を設け、この第１の仕切り壁の先端部に第１の突起を形成すると共に、第２の枠体に回路基板の他面に向かって起立する第２の仕切り壁を設け、この第２の仕切り壁の先端部に第２の突起を形成してあると、組立時に第１および第２の仕切り壁を回路基板の表面（片面や他面）に押し当てることによって両枠体の取付高さを規定でき、かつ第１および第２の突起をスルーホールの壁面で位置規制することによって回路基板の表面に沿う平面内での両枠体の取付位置も規定できるため、組立作業性が一層向上させやすくなる。しかも、両枠体の第１の仕切り壁や第２の仕切り壁で回路基板上の特定部位から漏れる信号を電磁的にシールドすることができるため、シールド効果の高いシールドケースを少ない部品点数で実現することができる。 In the above-described configuration, the first frame body is provided with a first partition wall that hangs down toward one side of the circuit board, the first projection is formed at the tip of the first partition wall, and the second If the frame is provided with a second partition wall that stands up toward the other surface of the circuit board, and the second protrusion is formed at the tip of the second partition wall, the first and second portions are assembled during assembly. The mounting height of both frames can be defined by pressing the partition wall against the surface (one side or the other side) of the circuit board, and the position of the first and second protrusions is regulated by the wall surface of the through hole. Since the mounting positions of both frame bodies in a plane along the surface of the frame can be defined, the assembly workability can be further improved. In addition, since the signal leaking from a specific part on the circuit board can be electromagnetically shielded by the first partition wall and the second partition wall of both frames, a shield case with a high shielding effect is realized with a small number of parts. can do.

本発明の電子回路ユニットによれば、回路基板を囲繞する金属板製の第１および第２の枠体がそれぞれ、接地パターンに導通されたスルーホール内へ互いに反対方向から挿入される第１の突起と第２の突起を有し、これら第１および第２の突起がスルーホールの内部で半田付けされるため、シールドケースとして機能する第１および第２の枠体を回路基板の接地パターンに確実に接続することができ、両枠体の回路基板に対する取付強度も高めやすい。また、組立時には第１の突起と第２の突起をスルーホール内へ挿入した状態で、回路基板上に搭載した各種電子部品と一括してリフロー半田を行うことができるので、両枠体を回路基板に容易に取り付けることができて組立作業性が良好となる。 According to the electronic circuit unit of the present invention, the first and second frame members made of a metal plate surrounding the circuit board are respectively inserted into the through holes connected to the ground pattern from opposite directions. Since the first and second protrusions are soldered inside the through hole, the first and second frames functioning as a shield case are used as the ground pattern of the circuit board. It is possible to reliably connect, and it is easy to increase the attachment strength of the two frames to the circuit board. In addition, since reflow soldering can be performed together with various electronic components mounted on the circuit board with the first and second protrusions inserted into the through-holes during assembly, both frames can be connected to the circuit. It can be easily attached to the substrate and the assembly workability is improved.

発明の実施の形態を図面を参照して説明すると、図１は本発明の実施形態例に係る電子回路ユニットの外観斜視図、図２は該電子回路ユニットの平面図、図３は図２のＡ−Ａ線に沿う断面図、図４は図３のＢ部拡大図、図５は該電子回路ユニットの分解斜視図である。 1 is a perspective view of an electronic circuit unit according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic circuit unit, and FIG. FIG. 4 is an enlarged view of a portion B in FIG. 3 and FIG. 5 is an exploded perspective view of the electronic circuit unit.

これらの図に示す電子回路ユニットは、テレビジョン受信用チューナ等の高周波回路が配設された回路基板１と、この回路基板１に取り付けられた金属板からなる第１および第２の枠体２，３とによって主に構成されており、第１および第２の枠体２，３を組み合わせてなる筐体がシールドケースとして機能する。 The electronic circuit unit shown in these drawings includes a circuit board 1 on which a high-frequency circuit such as a television receiving tuner is disposed, and first and second frames 2 made of a metal plate attached to the circuit board 1. , 3, and a housing formed by combining the first and second frames 2, 3 functions as a shield case.

回路基板１には、配線パターン（図示せず）や接地パターン４が形成されていると共に、これら配線パターンや接地パターン４に接続された各種の電子部品５が片面１ａ上に実装されている。また、回路基板１には複数箇所に接地用のスルーホール６が設けられており、各スルーホール６の壁面導体６ａ（図４参照）が接地パターン４および半田ランド７に導通されている。このほか、回路基板１には、電気的に孤立した半田ランド８や、配線パターンに接続された図示せぬスルーホール等が設けられている。なお、図４中の符号１０は半田を示している。 On the circuit board 1, a wiring pattern (not shown) and a ground pattern 4 are formed, and various electronic components 5 connected to the wiring pattern and the ground pattern 4 are mounted on one side 1a. The circuit board 1 is provided with grounding through holes 6 at a plurality of locations, and the wall conductors 6 a (see FIG. 4) of the through holes 6 are electrically connected to the ground pattern 4 and the solder lands 7. In addition, the circuit board 1 is provided with electrically isolated solder lands 8 and through holes (not shown) connected to the wiring pattern. In addition, the code | symbol 10 in FIG. 4 has shown the solder.

第１の枠体２は金属板をプレス抜きして所定形状に折曲加工したものであり、その一端（図５における下端）が回路基板１と略同形の開口端となっている。この第１の枠体２は、回路基板１の片面１ａ側を囲繞する四角枠状の側板部２０と、回路基板１の片面１ａに向かって垂下する複数の仕切り壁２１と、回路基板１の片面１ａ上の一部を覆う天板部２２と、仕切り壁２１の先端部に突設された第１の突起２３と、回路基板１に係着させるための複数の係合片２４とを備えている。仕切り壁２１は第１の突起２３を除く先端部分が回路基板１の片面１ａと略同等の高さ位置まで垂下しており、図４に示すように、仕切り壁２１の先端部分の適宜箇所が半田ランド８等に半田付けされている。また、第１の突起２３はスルーホール６内へ挿入されて壁面導体６ａに半田付けされており、該第１の突起２３の基端近傍において仕切り壁２１の先端部分が半田ランド７に半田付けされている。なお、第１の枠体２の側板部２０には一辺に沿って合成樹脂製の端子保持板２５が取着されており、この端子保持板２５に複数本の端子２６が保持されている。 The first frame 2 is formed by pressing a metal plate and bending it into a predetermined shape, and one end (the lower end in FIG. 5) is an open end that is substantially the same shape as the circuit board 1. The first frame 2 includes a rectangular frame-shaped side plate portion 20 that surrounds one side 1 a of the circuit board 1, a plurality of partition walls 21 that hang down toward the one side 1 a of the circuit board 1, and the circuit board 1. A top plate portion 22 that covers a part on one side 1 a, a first protrusion 23 that projects from the tip of the partition wall 21, and a plurality of engagement pieces 24 that are engaged with the circuit board 1. ing. The partition wall 21 has a tip portion excluding the first protrusion 23 depending on a height position substantially equal to the one surface 1a of the circuit board 1, and an appropriate portion of the tip portion of the partition wall 21 is provided as shown in FIG. Soldered to the solder land 8 or the like. The first protrusion 23 is inserted into the through hole 6 and soldered to the wall conductor 6 a, and the distal end portion of the partition wall 21 is soldered to the solder land 7 in the vicinity of the base end of the first protrusion 23. Has been. A synthetic resin terminal holding plate 25 is attached to the side plate portion 20 of the first frame 2 along one side, and a plurality of terminals 26 are held by the terminal holding plate 25.

第２の枠体３も金属板をプレス抜きして所定形状に折曲加工したものであり、その一端（図５における上端）が回路基板１と略同形の開口端となっている。この第２の枠体３は、回路基板１の他面１ｂ側を囲繞する四角枠状の側板部３０と、回路基板１の他面１ｂに向かって起立する複数の仕切り壁３１と、回路基板１の他面１ｂ上の一部を覆う底板部３２と、仕切り壁３１の先端部に突設された第２の突起３３と、回路基板１に係着させるための複数の係合片３４とを備えている。仕切り壁３１は第２の突起３３を除く先端部分が回路基板１の他面１ｂと略同等の高さ位置まで起立しており、第２の突起３３はスルーホール６内へ挿入されて壁面導体６ａに半田付けされている。 The second frame 3 is also formed by pressing a metal plate and bending it into a predetermined shape, and one end thereof (the upper end in FIG. 5) is an open end that is substantially the same shape as the circuit board 1. The second frame 3 includes a square frame-shaped side plate portion 30 surrounding the other surface 1b side of the circuit board 1, a plurality of partition walls 31 rising toward the other surface 1b of the circuit board 1, and a circuit board. A bottom plate portion 32 that covers a part on the other surface 1 b of the first surface, a second protrusion 33 that protrudes from the tip of the partition wall 31, and a plurality of engagement pieces 34 that are engaged with the circuit board 1. It has. The partition wall 31 has a tip portion excluding the second protrusion 33 standing up to a height position substantially equal to the other surface 1b of the circuit board 1, and the second protrusion 33 is inserted into the through hole 6 to be a wall conductor. It is soldered to 6a.

このような構成の電子回路ユニットを組み立てる際には、まず、回路基板１の片面１ａ上に図示せぬクリーム半田を印刷して各種の電子部品５を搭載する。このとき、スルーホール６内にはクリーム半田を充填させておく。そして、この回路基板１を片面１ａを上に向けたまま第２の枠体３の仕切り壁３１上に搭載して、スルーホール６内に第２の突起３３を挿入すると共に、係合片３４を回路基板１の周縁部に係着（スナップ止め）させる。次に、回路基板１の片面１ａ側から第１の枠体２を取り付けてスルーホール６内に第１の突起２３を挿入すると共に、係合片２４を回路基板１の周縁部に係着（スナップ止め）させる。これにより、第１の枠体２と第２の枠体３が回路基板１に仮固定された状態となり、第１および第２の枠体２，３どうしの相対位置も規定される。しかる後、かかる仮固定状態の回路基板１と第１および第２の枠体２，３をリフロー炉へ搬送してクリーム半田を溶融させるというリフロー半田工程を行うことによって、各種の電子部品５が回路基板１の片面１ａ上に実装されると共に、第１および第２の突起２３，３３がスルーホール６の内部で壁面導体６ａに半田付けされる。また、かかるリフロー半田工程によって、第１および第２の枠体２，３の各仕切り壁２１，３１の先端部分が半田ランド７や半田ランド８に半田付けされると共に、端子２６群が回路基板１の配線パターンに半田付けされる。したがって、第１および第２の枠体２，３は接地パターン４に導通された状態で回路基板１に確実に固定され、かつ回路基板１に配設された高周波回路は端子２６群を介して外部回路と接続可能となり、図１〜図３に示す電子回路ユニットが得られる。 When assembling the electronic circuit unit having such a configuration, first, various types of electronic components 5 are mounted by printing cream solder (not shown) on one side 1a of the circuit board 1. At this time, the through-hole 6 is filled with cream solder. Then, the circuit board 1 is mounted on the partition wall 31 of the second frame 3 with the one surface 1a facing upward, the second protrusion 33 is inserted into the through hole 6, and the engagement piece 34 is inserted. Is fastened (snapped) to the peripheral edge of the circuit board 1. Next, the first frame 2 is attached from the one surface 1a side of the circuit board 1 and the first protrusion 23 is inserted into the through hole 6, and the engagement piece 24 is engaged with the peripheral edge of the circuit board 1 ( Snap). As a result, the first frame body 2 and the second frame body 3 are temporarily fixed to the circuit board 1, and the relative positions of the first and second frame bodies 2 and 3 are also defined. After that, by carrying out a reflow soldering process of transporting the temporarily fixed circuit board 1 and the first and second frame bodies 2 and 3 to the reflow furnace and melting the cream solder, various electronic components 5 are obtained. The first and second protrusions 23 and 33 are mounted on one surface 1 a of the circuit board 1 and soldered to the wall surface conductor 6 a inside the through hole 6. In addition, by such a reflow soldering process, the leading end portions of the partition walls 21 and 31 of the first and second frames 2 and 3 are soldered to the solder lands 7 and the solder lands 8, and the terminals 26 groups are connected to the circuit board. Soldered to one wiring pattern. Therefore, the first and second frames 2 and 3 are securely fixed to the circuit board 1 in a state where they are electrically connected to the ground pattern 4, and the high-frequency circuit disposed on the circuit board 1 is connected via the terminal 26 group. It becomes connectable with an external circuit, and the electronic circuit unit shown in FIGS. 1-3 is obtained.

以上説明したように、本実施形態例に係る電子回路ユニットは、回路基板１を囲繞する金属板製の第１および第２の枠体２，３がそれぞれ、回路基板１の接地用のスルーホール６内へ互いに反対方向から挿入される第１の突起２３と第２の突起３３を有し、これら第１および第２の突起２３，３３がスルーホール６の内部で壁面導体６ａに半田付けされるため、シールドケースとして機能する第１および第２の枠体２，３を回路基板１の接地パターン４に確実に導通させることができ、第１および第２の枠体２，３の回路基板１に対する取付強度も高めやすい。また、組立時には第１の突起２３と第２の突起３３をスルーホール６内へ挿入した状態で、回路基板１上に搭載した各種の電子部品５と一括してリフロー半田を行うことができるため、第１および第２の枠体２，３を回路基板１に容易に取り付けることができて組立作業性が良好となる。しかも、第１および第２の突起２３，３３が仕切り壁２１，３１の先端部に突設されていることから、組立時に仕切り壁２１，３１を回路基板１の表面（片面１ａや他面１ｂ）に押し当てることによって第１および第２の枠体２，３の取付高さを規定でき、かつ第１および第２の突起２３，３３をスルーホール６の壁面で位置規制することにより、回路基板１の表面に沿う平面内での第１および第２の枠体２，３の取付位置も規定できる。したがって、この電子回路ユニットは組立作業性が極めて良好となる。 As described above, in the electronic circuit unit according to this embodiment, the first and second frame bodies 2 and 3 made of metal plates surrounding the circuit board 1 are each a through hole for grounding the circuit board 1. The first and second projections 23 and 33 are inserted into the inner side 6 from opposite directions, and the first and second projections 23 and 33 are soldered to the wall surface conductor 6 a inside the through hole 6. Therefore, the first and second frames 2 and 3 functioning as shield cases can be reliably conducted to the ground pattern 4 of the circuit board 1, and the circuit boards of the first and second frames 2 and 3 can be connected. 1 is easy to increase the mounting strength. Further, during assembly, reflow soldering can be performed together with the various electronic components 5 mounted on the circuit board 1 with the first protrusion 23 and the second protrusion 33 inserted into the through hole 6. The first and second frames 2 and 3 can be easily attached to the circuit board 1 and the assembly workability is improved. In addition, since the first and second protrusions 23 and 33 project from the distal ends of the partition walls 21 and 31, the partition walls 21 and 31 are placed on the surface (one side 1a or other side 1b) of the circuit board 1 during assembly. ), The mounting height of the first and second frame bodies 2 and 3 can be defined, and the position of the first and second projections 23 and 33 is regulated by the wall surface of the through hole 6, thereby The mounting positions of the first and second frames 2 and 3 in a plane along the surface of the substrate 1 can also be defined. Therefore, this electronic circuit unit has very good assembly workability.

また、この電子回路ユニットは、第１および第２の枠体２，３の仕切り壁２１，３１や天板部２２，３２によって、回路基板１上の特定部位から漏れる信号を電磁的にシールドすることができるため、シールド効果の高いシールドケースを少ない部品点数で実現することができる。さらに、この電子回路ユニットは、スルーホール６内に半田１０が充填されているため、回路基板１に対する第１および第２の枠体２，３の取付強度や導通の信頼性が極めて高くなっている。 In addition, the electronic circuit unit electromagnetically shields a signal leaking from a specific portion on the circuit board 1 by the partition walls 21 and 31 and the top plate portions 22 and 32 of the first and second frames 2 and 3. Therefore, a shield case having a high shielding effect can be realized with a small number of parts. Furthermore, since the electronic circuit unit is filled with the solder 10 in the through hole 6, the mounting strength and conduction reliability of the first and second frames 2 and 3 with respect to the circuit board 1 become extremely high. Yes.

なお、上記実施形態例では、リフロー半田工程の前に第１および第２の枠体２，３を回路基板１に仮固定させるために、回路基板１の周縁部にスナップ止めできる係合片２４，３４を第１および第２の枠体２，３に設けているが、他の適宜手段によって回路基板１と第１および第２の枠体２，３を仮固定状態にすることも可能である。例えば、第２の枠体３の開口端近傍に回路基板１を仮保持できる凹段部等を設け、このような第２の枠体３の開口端近傍に第１の枠体２を外嵌させるようにしても良い。 In the above embodiment, the engagement piece 24 that can be snapped to the peripheral edge of the circuit board 1 in order to temporarily fix the first and second frames 2 and 3 to the circuit board 1 before the reflow soldering process. , 34 are provided on the first and second frames 2 and 3, but the circuit board 1 and the first and second frames 2 and 3 can be temporarily fixed by other appropriate means. is there. For example, a concave step or the like that can temporarily hold the circuit board 1 is provided in the vicinity of the opening end of the second frame 3, and the first frame 2 is externally fitted in the vicinity of the opening end of the second frame 3. You may make it let it.

本発明の実施形態例に係る電子回路ユニットの外観斜視図である。1 is an external perspective view of an electronic circuit unit according to an embodiment of the present invention. 該電子回路ユニットの平面図である。It is a top view of this electronic circuit unit. 図２のＡ−Ａ線に沿う断面図である。It is sectional drawing which follows the AA line of FIG. 図３のＢ部拡大図である。It is the B section enlarged view of FIG. 該電子回路ユニットの分解斜視図である。It is a disassembled perspective view of this electronic circuit unit.

符号の説明Explanation of symbols

１回路基板
２第１の枠体
３第２の枠体
４接地パターン
５電子部品
６（接地用）スルーホール
６ａ壁面導体
７，８半田ランド
２１仕切り壁（第１の仕切り壁）
２３第１の突起
３１仕切り壁（第２の仕切り壁）
３３第２の突起 DESCRIPTION OF SYMBOLS 1 Circuit board 2 1st frame 3 2nd frame 4 Ground pattern 5 Electronic component 6 (For grounding) Through hole 6a Wall conductor 7, 8 Solder land 21 Partition wall (1st partition wall)
23 1st protrusion 31 Partition wall (2nd partition wall)
33 Second protrusion

Claims

高周波回路が配設されていると共に接地パターンに導通されたスルーホールを有する回路基板と、この回路基板の片面側を囲繞して該片面の少なくとも一部を覆う金属板製の第１の枠体と、前記回路基板の他面側を囲繞して前記第１の枠体と電気的に接続される金属板製の第２の枠体とを備え、
前記第１の枠体に前記スルーホール内へ片面側から挿入される第１の突起を設けると共に、前記第２の枠体に前記スルーホール内へ他面側から挿入される第２の突起を設け、これら第１および第２の突起を前記スルーホールの内部で半田付けしたことを特徴とする電子回路ユニット。 A circuit board having a high-frequency circuit and having a through hole connected to a ground pattern, and a first frame made of a metal plate surrounding at least a part of the one side of the circuit board And a second frame made of a metal plate that surrounds the other surface side of the circuit board and is electrically connected to the first frame,
The first frame is provided with a first protrusion that is inserted into the through hole from one side, and the second frame is provided with a second protrusion that is inserted into the through hole from the other side. An electronic circuit unit characterized in that the first and second protrusions are provided and soldered inside the through hole.

請求項１の記載において、前記第１の枠体に前記回路基板の片面に向かって垂下する第１の仕切り壁を設け、この第１の仕切り壁の先端部に前記第１の突起を形成すると共に、前記第２の枠体に前記回路基板の他面に向かって起立する第２の仕切り壁を設け、この第２の仕切り壁の先端部に前記第２の突起を形成したことを特徴とする電子回路ユニット。 2. The first partition body according to claim 1, wherein the first frame body is provided with a first partition wall that hangs down toward one surface of the circuit board, and the first protrusion is formed at a tip portion of the first partition wall. In addition, the second frame body is provided with a second partition wall that stands up toward the other surface of the circuit board, and the second protrusion is formed at the tip of the second partition wall. Electronic circuit unit to do.