JP2009068607A - Valve opening and closing device and vacuum processing device - Google Patents

Valve opening and closing device and vacuum processing device Download PDF

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JP2009068607A
JP2009068607A JP2007238039A JP2007238039A JP2009068607A JP 2009068607 A JP2009068607 A JP 2009068607A JP 2007238039 A JP2007238039 A JP 2007238039A JP 2007238039 A JP2007238039 A JP 2007238039A JP 2009068607 A JP2009068607 A JP 2009068607A
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valve
valve opening
closing device
valve seat
gas
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Hisashi Watanabe
恒 渡辺
Hiroshi Komata
宏 小俣
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Canon Anelva Corp
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Canon Anelva Technix Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To adjust a gas of a certain flow rate excellent in the reproducibility of a full close state due to no plastic deformation. <P>SOLUTION: This valve opening and closing device in which a gas flow passage 3 is formed is provided with a valve element 2 having a piston 6 at the flow passage and a valve seat 4 for contacting with and separating from the valve element and a gas flow rate is controlled by making the valve element and the valve seat contact with and separate from each other. The valve opening and closing device is provided with a driving body 9 by which the valve element presses the valve seat by pressure equal to or lower than predetermined pressure in the case that the movement of a piston is controlled and the valve element is in contact with the valve seat. The vacuum processing device is provided with the valve opening and closing device. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば、スパッタリング装置あるいはCVD装置による薄膜形成用のプロセスガス、または、主に、表面処理装置等に使用される、基板へのエッチングにおけるエッチングガス、あるいはガス分析装置に使用される処理ガスなどの配管に使用される弁開閉装置及びそれを用いた真空処理装置に関する。   The present invention is, for example, a process gas for forming a thin film by a sputtering apparatus or a CVD apparatus, or an etching gas used for etching a substrate, which is mainly used for a surface treatment apparatus, or a process used for a gas analyzer. The present invention relates to a valve opening / closing device used for piping such as gas and a vacuum processing device using the same.

半導体製造工程等の成膜装置で使用するガス供給量は、成膜の製品品質を大きく左右するため、一定な流量を保証することが求められる。   A gas supply amount used in a film formation apparatus such as a semiconductor manufacturing process greatly affects the product quality of the film formation, and thus it is required to guarantee a constant flow rate.

しかしながら、弁開閉装置を構成する弁体が弁座に接触して処理ガスの流路を塞いだ状態（以下、全閉状態という。）にする際、弁体の駆動を手動で行われ処理ガスが供給される容器の圧力表示で調整されることが多いため、弁体が弁座に所定以上に強く押し付けられることがあり、そのため弁座が塑性変形を起こし弁体と弁座の接触状態が変わってしまうという課題があった。   However, when the valve body constituting the valve opening / closing device comes into contact with the valve seat and closes the flow path of the processing gas (hereinafter referred to as a fully closed state), the valve body is manually driven to process gas. In many cases, the valve body is pressed against the valve seat more strongly than the predetermined pressure, so that the valve seat is plastically deformed and the contact state between the valve body and the valve seat is There was a problem of changing.

この種の弁開閉装置としては、特許文献１がある、ここでは弁体の駆動を手動で行うことの記載がある。
特開平１１−８２７８７号公報 As this type of valve opening and closing device, there is Patent Document 1, which describes that the valve body is driven manually.
Japanese Patent Laid-Open No. 11-82787

本発明の目的は、前述の課題に鑑み、弁体が弁座を強く押し付けることが無く、従って、塑性変形させることがないため再現性よく一定の流量のガスを調整できる弁開閉装置及び真空処理装置を提供することにある。   In view of the above-mentioned problems, the object of the present invention is to provide a valve opening / closing device and a vacuum process capable of adjusting gas at a constant flow rate with good reproducibility because the valve body does not strongly press the valve seat and therefore does not plastically deform. To provide an apparatus.

本発明の弁開閉装置は、内部に気体の流路が形成され、該流路にピストンを有する弁体と、該弁体が離接する弁座とが配され、該弁体と該弁座とが離接することにより該気体の流量が制御される弁開閉装置であって、
前記弁体と前記弁座が接触している場合に、前記弁体が前記弁座を所定の圧力以下で押すように、前記ピストンの移動を制御する駆動体を具備する弁開閉装置である。 The valve opening and closing device of the present invention has a gas flow path formed therein, a valve body having a piston in the flow path, and a valve seat to which the valve body is separated and connected, and the valve body and the valve seat Is a valve opening and closing device in which the flow rate of the gas is controlled by separating and contacting
When the valve body and the valve seat are in contact with each other, the valve body is a valve opening / closing device including a drive body that controls the movement of the piston so that the valve body pushes the valve seat at a predetermined pressure or less.

本発明によれば、弁体が弁座を強く押し付けることが無く、塑性変形させることがないため再現性よく一定の流量のガスを調整できる。   According to the present invention, since the valve body does not strongly press the valve seat and is not plastically deformed, a gas having a constant flow rate can be adjusted with good reproducibility.

以下、図面を参照して本発明の一実施形態の弁開閉装置について説明する。   Hereinafter, a valve opening and closing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

図１は、本発明の一実施形態の弁開閉装置を示す断面図である。弁開閉装置は、例えば、処理ガスによる成膜、エッチング等またはガス分析処理等が行われる真空容器と処理ガスの供給を繋ぐ配管との間に接続される。   FIG. 1 is a cross-sectional view showing a valve opening and closing apparatus according to an embodiment of the present invention. The valve opening / closing device is connected, for example, between a vacuum vessel in which film formation, etching, gas analysis processing, or the like is performed with a processing gas and a pipe that connects the supply of the processing gas.

弁開閉装置は、装置本体１内で弁体２が弁座４に対して上下移動することで、弁体と弁座との離接が制御され、流路3を流れる処理ガスの流量（リーク量）を調整する。すなわち、ピストン6が上方に移動することにより、弁体２が弁座４に対して上方向に移動し、流路3を流れる処理ガスの流量を増やすことができる。一方、ピストン６が下方に移動することにより、弁体２が弁座４に対して下方向に移動し、流路3を流れる処理ガスの流量を減少させることができる。ベローズシール１０は流路３と弁開閉装置の内部とを仕切る役割を担う。   In the valve opening / closing device, the valve body 2 moves up and down with respect to the valve seat 4 in the apparatus main body 1 so that the separation and contact between the valve body and the valve seat is controlled, and the flow rate (leakage) of the processing gas flowing through the flow path 3 is controlled. Adjust the amount. That is, when the piston 6 moves upward, the valve body 2 moves upward with respect to the valve seat 4 and the flow rate of the processing gas flowing through the flow path 3 can be increased. On the other hand, when the piston 6 moves downward, the valve body 2 moves downward with respect to the valve seat 4, and the flow rate of the processing gas flowing through the flow path 3 can be reduced. The bellows seal 10 plays a role of partitioning the flow path 3 and the inside of the valve opening / closing device.

ばね５は、ピストン６の先端が作用体７に接触するようにピストン６を上方に押し上げている。そして、ばね5は、ピストン6の直進運動を安定させる役割を担う。作用体７は、支持点８を支点にして、上面（図中右側の上面）がステッピングモーター等からなる駆動体9と連結され、下面（図中左側の下面）がピストン６の先端に突き当たっており、てこの原理によりピストンの上下移動の制御が可能となっている。リニアガイド１１は駆動体９の位置を確認し、調整を行うためのものである。駆動体９は作用体７の一方を上下に直線移動できればよく、ここではステッピングモーターと、該ステッピングモーターの回転を直線運動に変える部材（例えば、ステッピングモーターにギアを取り付け、回転を直線運動に変える部材としてそのギアとかみ合う小型ジャッキを用いる）とで構成している。   The spring 5 pushes the piston 6 upward so that the tip of the piston 6 contacts the action body 7. The spring 5 plays a role of stabilizing the straight movement of the piston 6. The acting body 7 has a support point 8 as a fulcrum and an upper surface (the upper surface on the right side in the figure) is connected to a driving body 9 made of a stepping motor or the like, and a lower surface (the lower surface on the left side in the figure) abuts against the tip of the piston 6. Therefore, the vertical movement of the piston can be controlled by the lever principle. The linear guide 11 is for confirming the position of the driving body 9 and performing adjustment. The driver 9 only needs to be able to linearly move one of the acting bodies 7 up and down. Here, the stepping motor and a member that changes the rotation of the stepping motor into a linear motion (for example, a gear is attached to the stepping motor to change the rotation into a linear motion). A small jack that meshes with the gear is used as a member.

駆動体9が作用体7の図中右側の上面を下方に押すことにより、支持点8を支点にして、ピストン６が押し下げられ、弁体2は弁座4に対して下方向に押し下げられる。そして、弁体2は弁座4を押圧する。一方、駆動体9が作用体7の図中右側の上面を引き上げることにより、支持点8を支点にして、ピストン６が押し上げられ、弁体2を弁座4に対して上方向に押し上げる。なお駆動体９は作用体7の図中右側の下面と連結するように下面側に設けられてもよい。   When the driving body 9 pushes the upper surface on the right side of the working body 7 in the drawing downward, the piston 6 is pushed down with the support point 8 as a fulcrum, and the valve body 2 is pushed down with respect to the valve seat 4. Then, the valve body 2 presses the valve seat 4. On the other hand, when the driving body 9 pulls up the upper surface on the right side of the working body 7 in the drawing, the piston 6 is pushed up with the support point 8 as a fulcrum, and the valve body 2 is pushed up with respect to the valve seat 4. The driving body 9 may be provided on the lower surface side so as to be connected to the lower surface on the right side of the working body 7 in the drawing.

図２は本実施形態の弁開閉装置における、ステッピングモーターのモーターステップ数とヘリウムガスのリーク量（流量）との特性を示す図である。なお、1.00E-06は1.00×10-6を意味する。本実施形態の弁開閉装置のピストンを繰り返し上下移動させ、特性の経時変化を調べたが、塑性変形を起こすことなく再現性が確認された。本実施形態の弁開閉装置は、6.7×10-9Pa・ｍ3/sec以上の流量の制御に特に好適に使用することができる。流量の上限は例えば1.5Pa・ｍ3/sec以下である。また、弁体が弁座に接した後は、弁体が弁座を押圧する圧力が強くなると塑性変形を起こすことになる。従って、ステッピングモーターのモーターステップ数は接触後一定値以下となるように制御し、弁体が弁座を所定の圧力以下で押すようにする。 FIG. 2 is a diagram showing the characteristics of the number of motor steps of the stepping motor and the leak amount (flow rate) of helium gas in the valve opening / closing device of the present embodiment. Note that 1.00E-06 means 1.00 × 10 −6 . The piston of the valve opening / closing device of the present embodiment was repeatedly moved up and down to examine the change in characteristics over time, but reproducibility was confirmed without causing plastic deformation. The valve opening / closing device of the present embodiment can be particularly suitably used for controlling a flow rate of 6.7 × 10 −9 Pa · m 3 / sec or more. The upper limit of the flow rate is, for example, 1.5 Pa · m 3 / sec or less. In addition, after the valve body comes into contact with the valve seat, plastic deformation occurs when the pressure with which the valve body presses the valve seat becomes strong. Accordingly, the number of motor steps of the stepping motor is controlled so as to become a predetermined value or less after contact, and the valve body pushes the valve seat at a predetermined pressure or less.

駆動体9は、弁座4に加わる力を直接数値化できなくても、力を別の物理量（例えば、電気等）に換算できる機能を備えていればよい。従って、本実施形態では駆動体としてステッピングモーターと回転を直線移動に変える部材を用い、作用体を介してピストンを上下させているが、駆動体としてピエゾ素子等の他の手段を用いてもよい。また、本実施形態では作用体を用いてピストンを駆動しているが、直接駆動体によりピストンを駆動してもよい。   Even if the driving body 9 cannot directly digitize the force applied to the valve seat 4, it only needs to have a function of converting the force into another physical quantity (for example, electricity). Therefore, in this embodiment, a stepping motor and a member that changes rotation to linear movement are used as the driving body, and the piston is moved up and down via the action body, but other means such as a piezo element may be used as the driving body. . Further, in the present embodiment, the piston is driven using the operating body, but the piston may be driven directly by the driving body.

この数値化された弁座4の力を塑性変形が生じない限度以下で使用することで、弁座4が変形することを防ぎ、再現性よく一定量の処理ガスを供給することができる。   By using the digitized force of the valve seat 4 below the limit at which plastic deformation does not occur, it is possible to prevent the valve seat 4 from being deformed and supply a certain amount of processing gas with good reproducibility.

本実施形態の弁開閉装置は、弁体が弁座を押圧する力が所定の値になるような駆動体が具備されているため、弁座を塑性変形してしまうことが無く、処理ガスを一定量供給することができる。   The valve opening and closing device of the present embodiment is provided with a drive body in which the force with which the valve body presses the valve seat becomes a predetermined value, so that the valve seat is not plastically deformed, and the processing gas is discharged. A certain amount can be supplied.

なお、本実施形態の弁開閉装置は、処理ガスの流量調整に限られること無く、減圧された容器の真空排気に適用することも可能である。   Note that the valve opening / closing device of the present embodiment is not limited to the adjustment of the flow rate of the processing gas, but can also be applied to evacuation of a decompressed container.

以下、本実施形態の弁開閉装置を用いた真空処理装置について説明する。   Hereinafter, a vacuum processing apparatus using the valve opening / closing apparatus of this embodiment will be described.

図３は真空処理装置の構成を示す断面図である。図３に示すように、本実施形態の真空処理装置は、排気系２０を備えたエッチングチャンバー２Ｄと、エッチングチャンバー２Ｄ内に設けられた基板ホルダー２５と、エッチングチャンバー２Ｄ内に所定のガスを導入するガス導入手段２６と、ガス導入手段２６により導入されたガスにエネルギーを与えて基板ホルダー２５を臨むエッチングチャンバー２Ｄ内の空間にプラズマＰを形成するプラズマ形成手段２７とを備えている。エッチングチャンバー２Ｄは、側壁部分にゲートバルブ２１を備えた気密な真空容器である。   FIG. 3 is a cross-sectional view showing the configuration of the vacuum processing apparatus. As shown in FIG. 3, the vacuum processing apparatus of this embodiment introduces an etching chamber 2D provided with an exhaust system 20, a substrate holder 25 provided in the etching chamber 2D, and a predetermined gas into the etching chamber 2D. Gas introducing means 26 for forming the plasma P in a space in the etching chamber 2D that gives energy to the gas introduced by the gas introducing means 26 and faces the substrate holder 25. The etching chamber 2D is an airtight vacuum vessel provided with a gate valve 21 on a side wall portion.

ガス導入手段２６は、プラズマ形成手段２７によってプラズマ化されるガスをエッチングチャンバー２Ｄ内に導入するものである。ここでは、アルゴンガスをエッチングチャンバー２Ｄ内に導入するようになっている。アルゴンガスのプラズマ中では、アルゴンのイオンが生成され、このイオンが基板２９に入射することでエッチングが行われる。ガス導入手段２６は、具体的には、アルゴンガスを貯めた不図示のガスボンベ、ガスボンベとエッチングチャンバー２Ｄとを繋ぐ配管に設けたバルブや流量調整器等によって構成される。   The gas introducing means 26 introduces the gas that is converted into plasma by the plasma forming means 27 into the etching chamber 2D. Here, argon gas is introduced into the etching chamber 2D. In the argon gas plasma, argon ions are generated, and the ions are incident on the substrate 29 for etching. Specifically, the gas introduction means 26 includes a gas cylinder (not shown) that stores argon gas, a valve provided in a pipe that connects the gas cylinder and the etching chamber 2D, a flow rate regulator, and the like.

排気系２０は、ターボ分子ポンプ等の真空ポンプを備えてエッチングチャンバー２Ｄ内を１０−７Ｔｏｒｒ程度まで排気可能に構成される。 The exhaust system 20 includes a vacuum pump such as a turbo molecular pump, and is configured to be able to exhaust the etching chamber 2D to about 10 −7 Torr.

基板ホルダー２５は、基板２９より大きな径の円盤状のホルダーステージ５１と、ホルダーステージ５１の上に設けられた高周波電極５２と、ホルダーステージ５１を支えるホルダー支柱５３と、高周波電極５２に高周波を導入するための高周波導入棒５４とから主に構成されている。   The substrate holder 25 introduces a high frequency into the disk-shaped holder stage 51 having a larger diameter than the substrate 29, the high-frequency electrode 52 provided on the holder stage 51, the holder column 53 that supports the holder stage 51, and the high-frequency electrode 52. It is mainly composed of a high-frequency introduction rod 54 for the purpose.

高周波電極５２の周囲には、ホルダーシールド５５が設けられている。   A holder shield 55 is provided around the high-frequency electrode 52.

ホルダー支柱５３は、内部が空洞になっている。そして、高周波導入棒５４は、このホルダー支柱５３の内部に配置されているとともに、ホルダーステージ５１を貫通して先端が高周波電極５２に達している。この高周波導入棒５４の周囲は、円筒状の絶縁管５６で覆われている。また、ホルダー支柱５３内に位置する高周波導入棒５４の部分の周囲には、アース管５７が設けられている。アース管５７と高周波導入棒５４との間には絶縁管５６が介在している。   The holder column 53 is hollow inside. The high-frequency introduction rod 54 is disposed inside the holder column 53 and penetrates through the holder stage 51 to reach the high-frequency electrode 52. The periphery of the high-frequency introduction rod 54 is covered with a cylindrical insulating tube 56. An earth pipe 57 is provided around the portion of the high-frequency introduction rod 54 located in the holder column 53. An insulating tube 56 is interposed between the ground tube 57 and the high-frequency introduction rod 54.

一方、基板ホルダー２５の上方には、プラズマ形成空間を取り囲むシールド８１が設けられている。プラズマ形成手段２７は、基板ホルダー２５内の高周波導入棒５４及び高周波電極５２を経由してエッチングチャンバー２Ｄ内のガスに高周波エネルギーを与えるようになっている。具体的には、プラズマ形成手段２７は、基板ホルダー２５内の高周波導入棒５４に高周波電力を供給する高周波電源７１と、高周波電源７１からの高周波の供給路に設けられた整合器７２とから主に構成されている。   On the other hand, a shield 81 surrounding the plasma formation space is provided above the substrate holder 25. The plasma forming means 27 applies high frequency energy to the gas in the etching chamber 2 </ b> D via the high frequency introducing rod 54 and the high frequency electrode 52 in the substrate holder 25. Specifically, the plasma forming means 27 is mainly composed of a high-frequency power source 71 that supplies high-frequency power to the high-frequency introduction rod 54 in the substrate holder 25, and a matching unit 72 provided in a high-frequency supply path from the high-frequency power source 71. It is configured.

また、エッチングチャンバー２Ｄの上側には、磁石８２が設けられている。磁石８２は、基板９への前工程エッチングの分布を調整するものである。   A magnet 82 is provided above the etching chamber 2D. The magnet 82 adjusts the distribution of the pre-process etching on the substrate 9.

移動機構５８は、基板ホルダー５のホルダー支柱５３を保持した保持アーム５８１と、保持アーム５８１に連結された上下駆動源５８２とから主に構成されている。図３に示すように、エッチングチャンバー２Ｄの下面には開口が形成されており、ホルダー支柱５３はこの開口に挿通されている。そして、ホルダー支柱５３の下端には、アーム取り付け板５８３が固定されている。保持アーム５８１の先端は、このアーム取り付け板５８３に固定されている。   The moving mechanism 58 mainly includes a holding arm 581 that holds the holder column 53 of the substrate holder 5, and a vertical drive source 582 that is connected to the holding arm 581. As shown in FIG. 3, an opening is formed in the lower surface of the etching chamber 2D, and the holder column 53 is inserted through this opening. An arm attachment plate 583 is fixed to the lower end of the holder column 53. The distal end of the holding arm 581 is fixed to the arm attachment plate 583.

上下駆動源５８２は、例えば保持アーム５８１が螺合する上下方向に長い精密ねじと、精密ねじを回転させるサーボモータ等から構成される。上下駆動源５８２が駆動すると、精密ねじが回転して保持アーム５８１が上下動する。   The vertical drive source 582 includes, for example, a precision screw that is long in the vertical direction to which the holding arm 581 is screwed, a servo motor that rotates the precision screw, and the like. When the vertical drive source 582 is driven, the precision screw rotates and the holding arm 581 moves up and down.

本実施形態の弁開閉装置はガス導入手段を構成するバルブや流量調整器となり、また排気系を構成するバルブや流量調整器となる。本実施形態の弁開閉装置は配管の途中に取り付けたり、処理チャンバーに固定して取り付けることができる。   The valve opening / closing device of the present embodiment is a valve or a flow regulator that constitutes the gas introduction means, and a valve or a flow regulator that constitutes the exhaust system. The valve opening and closing device of the present embodiment can be attached in the middle of the piping or fixed to the processing chamber.

本発明は、スパッタリング装置、CVD装置、表面処理装置等のガス導入系や排気系に使用される弁開閉装置に適用される。   The present invention is applied to a valve opening / closing device used for a gas introduction system or an exhaust system such as a sputtering apparatus, a CVD apparatus, and a surface treatment apparatus.

本発明の一実施形態の弁開閉装置を示す断面図である。It is sectional drawing which shows the valve opening / closing apparatus of one Embodiment of this invention. 本実施形態の弁開閉装置における、ステッピングモーターのモーターステップ数と処理ガスのリーク量との特性を示す図である。It is a figure which shows the characteristic of the motor step number of a stepping motor, and the leak amount of a process gas in the valve opening and closing apparatus of this embodiment. 真空処理装置の構成を示す断面図である。It is sectional drawing which shows the structure of a vacuum processing apparatus.

符号の説明Explanation of symbols

１ 装置本体
２ 弁体
３ 流路
４ 弁座
５ ばね
６ ピストン
７ 作用体
８ 支持点
９ 駆動体
１０ ベローズシール
１１ リニアガイド
DESCRIPTION OF SYMBOLS 1 Apparatus main body 2 Valve body 3 Flow path 4 Valve seat 5 Spring 6 Piston 7 Action body 8 Supporting point 9 Drive body 10 Bellows seal 11 Linear guide

Claims (5)

内部に気体の流路が形成され、該流路にピストンを有する弁体と、該弁体が離接する弁座とが配され、該弁体と該弁座とが離接することにより該気体の流量が制御される弁開閉装置であって、
前記弁体と前記弁座が接触している場合に、前記弁体が前記弁座を所定の圧力以下で押すように、前記ピストンの移動を制御する駆動体を具備する弁開閉装置。 A gas flow path is formed therein, and a valve body having a piston in the flow path and a valve seat to which the valve body is separated from and contacted are arranged, and the valve body and the valve seat are separated from and brought into contact with each other. A valve opening and closing device in which the flow rate is controlled,
A valve opening / closing device comprising a driving body for controlling movement of the piston so that the valve body pushes the valve seat at a predetermined pressure or less when the valve body and the valve seat are in contact with each other. 前記駆動体は駆動量を数値化し、該数値に基づいて前記ピストンの移動量を制御することを特徴とする請求項１に記載の弁開閉装置。   The valve opening / closing apparatus according to claim 1, wherein the driving body digitizes a driving amount and controls a moving amount of the piston based on the numerical value. 前記駆動体はステッピングモーターと、該ステッピングモーターの回転を直線運動に変える部材とを備えていることを特徴とする請求項１又は２に記載の弁開閉装置。   The valve opening / closing apparatus according to claim 1 or 2, wherein the driving body includes a stepping motor and a member that changes the rotation of the stepping motor into a linear motion. 6.7×10-9Pa・ｍ3/sec以上の流量で使用されることを特徴とする請求項１から３のいずれか１項に記載の弁開閉装置。 4. The valve opening / closing device according to claim 1, wherein the valve opening / closing device is used at a flow rate of 6.7 × 10 −9 Pa · m 3 / sec or more. 請求項１から請求項４のいずれか１項に記載の弁開閉装置を具備した真空処理装置。   The vacuum processing apparatus which comprised the valve opening / closing apparatus of any one of Claims 1-4.
JP2007238039A 2007-09-13 2007-09-13 Valve opening and closing device and vacuum processing device Withdrawn JP2009068607A (en)

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US9234595B2 (en) 2011-02-02 2016-01-12 Ckd Corporation Vacuum control valve and vacuum control apparatus
JP2013224713A (en) * 2012-04-23 2013-10-31 Ckd Corp Linear actuator, vacuum control device and computer program
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