JP2009057501A5 - - Google Patents
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- JP2009057501A5 JP2009057501A5 JP2007227199A JP2007227199A JP2009057501A5 JP 2009057501 A5 JP2009057501 A5 JP 2009057501A5 JP 2007227199 A JP2007227199 A JP 2007227199A JP 2007227199 A JP2007227199 A JP 2007227199A JP 2009057501 A5 JP2009057501 A5 JP 2009057501A5
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- crosslinking
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- 239000007787 solid Substances 0.000 claims description 30
- 238000004132 cross linking Methods 0.000 claims description 20
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive Effects 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229910052783 alkali metal Inorganic materials 0.000 claims description 10
- 150000001340 alkali metals Chemical class 0.000 claims description 10
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- -1 triazine compound Chemical class 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 229910052708 sodium Inorganic materials 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 125000005741 alkyl alkenyl group Chemical group 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 150000003464 sulfur compounds Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000012190 activator Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 230000001747 exhibiting Effects 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 2
- 0 *c1nc(*)nc(*)n1 Chemical compound *c1nc(*)nc(*)n1 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Description
(式中、R2は−OR3(R3は炭素数1〜4のアルキル基)、−NR4R5(R4、R5はそれぞれ同じであっても異なっていてもよく、又R4、R5が結合していてもよく、H、炭素数1〜4のアルキル基、アルキレン基、アルケニル基、又はフェニレン基であって、アルキレン基には−NH−、−CO−、−O−、−S−、−COO−を含んでいてもよい)又は−SM1(M1はアルカリ金属又はHである)であり、M2、M3はそれぞれ同じであっても異なっていてもよく、アルカリ金属又はHである。)
で表されるトリアジン化合物を含む項6記載の架橋反応性固体表面の製造方法。
項8.一般式(5):
Xa(YO)3-aSiR1Z’ (5)
(式中、X、Yは同じであっても異なっていてもよく、炭素数1〜4のアルキル基又はアルケニル基であり、R1は炭素数1〜18のアルキレン基又はフェニレン基であって、アルキレン基には−NH−、−CO−、−O−、−S−、−COO−、−C6H4−を含んでいてもよい。Z’は、−Cl、−Brである。aは0、1又は2である。)
で表されるシランカップリング剤を含む溶液と、表面にOH基を有する固体表面を接触させて、シランカップリング剤を含む溶液と接触した固体表面を加熱して得られた反応性固体表面に、
一般式(6):
M4 pZ (6)
(式中、M4はH、Li、Na、K又はCsであり、Zは、−SH、−SCSN(CH3)2、−SSCSN(CH3)2、−SCSN(C2H5)2、−SCSN(C4H9)2、−SCSN(C8H17)2、−SS−、−SSS−、−SSSS−、
(Wherein R 2 is —OR 3 (R 3 is an alkyl group having 1 to 4 carbon atoms), —NR 4 R 5 (R 4 and R 5 may be the same or different, and R 4 and R 5 may be bonded to each other, H, an alkyl group having 1 to 4 carbon atoms, an alkylene group, an alkenyl group, or a phenylene group, and the alkylene group includes —NH—, —CO—, —O -, - S -, - a COO- or may contain) -SM 1 (M 1 is an alkali metal or H), be different even M 2, M 3 are respectively the same Well, it is alkali metal or H.)
Item 7. A method for producing a cross-linking reactive solid surface according to Item 6, comprising a triazine compound represented by the formula:
Item 8. General formula (5):
X a (YO) 3-a SiR 1 Z ′ (5)
(In the formula, X and Y may be the same or different and each represents an alkyl group or alkenyl group having 1 to 4 carbon atoms; R 1 is an alkylene group or phenylene group having 1 to 18 carbon atoms; The alkylene group may contain —NH—, —CO—, —O—, —S—, —COO—, —C 6 H 4 —, wherein Z ′ is —Cl, —Br. a is 0, 1 or 2.)
A reactive solid surface obtained by heating a solid surface in contact with a solution containing a silane coupling agent by bringing the solution containing the silane coupling agent represented by ,
General formula (6):
M 4 p Z (6)
(In the formula, M 4 is H, Li, Na, K or Cs , and Z is —SH, —SCSN (CH 3 ) 2 , —SSCSN (CH 3 ) 2 , —SCSN (C 2 H 5 ) 2. , -SCSN (C 4 H 9) 2, -SCSN (C 8 H 17) 2, -SS -, - SSS -, - SSSS-,
M1〜M3は、それぞれ同じであっても異なっていてもよく、アルカリ金属又はHであり、アルカリ金属としては、Li、Na、K、Csなどを挙げることができる。 M 1 to M 3 may be the same or different, and are an alkali metal or H. Examples of the alkali metal include Li, Na, K, and Cs .
また、加熱条件としては、40〜250℃で1秒〜600分間行うことが好ましく、50〜200℃で1〜60分間がより好ましく、さらには1〜30分間が好ましい。加熱条件がこの範囲にあることで、生産性が高く経済的にも好ましい。 The heating conditions, preferably carried out for 1 second to 600 minutes at 40-250 ° C., more preferably between 1-6 0 minutes at 50 to 200 ° C., more preferably from 1 to 30 minutes. When the heating condition is within this range, productivity is high and economically preferable.
次に、前記架橋反応性固体表面の第2の製造方法としては、
一般式(5):
Xa(YO)3-aSiR1Z’ (5)
(式中、X、Y、R1、aは前記同様であり、Z’は、−Cl、−Brである。)
で表されるシランカップリング剤を含む溶液と、OH基含有固体表面を接触させて、加熱して得られた反応性固体表面に、
一般式(6):
M4 pZ (6)
(式中、M4はH、Li、Na、K又はCsであり、Zは前記同様である。pは1又は2である。)
で表される硫黄化合物を含む溶液を接触させる工程を含む方法である。
Next, as the second production method of the cross-linking reactive solid surface,
General formula (5):
X a (YO) 3-a SiR 1 Z ′ (5)
(In the formula, X, Y, R 1 and a are the same as described above, and Z ′ is —Cl and —Br.)
A reactive solid surface obtained by bringing a solution containing a silane coupling agent represented by the following formula into contact with an OH group-containing solid surface and heating,
General formula (6):
M 4 p Z (6)
(In the formula, M 4 is H, Li, Na, K, or Cs , and Z is the same as described above. P is 1 or 2.)
It is the method including the process of contacting the solution containing the sulfur compound represented by these.
一般式(6)中のM4は、H、Li、Na、K又はCsであり、これらの中でも、Nae、Kが好ましい。 M 4 in the general formula (6) is H, Li, Na, K or Cs , and among these, Nae and K are preferable.
この固体表面をXPSにより分析したところ、S4由来の硫黄に基づくS2pピーク、S4に由来の珪素に基づくSi2pピークがサーベイスペクトルで確認された。また比較のために、未処理のOH基含有エポキシ樹脂基板についてもXPSにより分析したところ、硫黄、珪素に基づく各ピークは確認されなかった。 The solid surface was analyzed by XPS, S2p peak based on sulfur S 4 - derived, Si2p peak based on silicon from S 4 was confirmed by survey spectrum. For comparison, an untreated OH group-containing epoxy resin substrate was also analyzed by XPS, and each peak based on sulfur and silicon was not confirmed.
<90°剥離試験方法>
得られたエポキシ樹脂基板/NR接着物を24時間放置後、接着物のNR架橋ゴム部分にカッターで幅1cmの切れ目を入れて、剥離強度を20℃、50±5mm/minの速度で引張試験(JIS K−6854(1977))((株)島津製作所製、島津オートグラフAGS−1kND)により測定した。
<90 ° peel test method>
The obtained epoxy resin substrate / NR bonded material was allowed to stand for 24 hours, then a 1 cm wide cut was made with a cutter in the NR cross-linked rubber part of the bonded material, and a tensile test was performed at a peel strength of 20 ° C. and a speed of 50 ± 5 mm / min. (JIS K-6854 (1977)) (manufactured by Shimadzu Corporation, Shimadzu Autograph AGS-1kND).
実施例2〜3、比較例1、2
表1に示す分子接着剤を用いた以外は、実施例1と同様にしてエポキシ樹脂基板/NR接着物を得、架橋反応性固体表面を得た。この固体表面をXPSにより分析したところ、S4、SH由来の硫黄に基づくS2pピーク、S4、SH、エポキシに由来の珪素に基づくSi2pピークがサーベイスペクトルで確認された。
得られたエポキシ樹脂基板/NR接着物の90°剥離試験を行った。その結果を表1に示す。
Examples 2-3, Comparative Examples 1 and 2
Except that the molecular adhesive shown in Table 1 was used, an epoxy resin substrate / NR adhesive was obtained in the same manner as in Example 1 to obtain a cross-linking reactive solid surface . When this solid surface was analyzed by XPS, S2p peaks based on sulfur derived from S4 and SH, and Si2p peaks based on silicon derived from S4, SH, and epoxy were confirmed in the survey spectrum.
The obtained epoxy resin substrate / NR adhesive was subjected to a 90 ° peel test. The results are shown in Table 1.
実施例7〜12、比較例3〜8
(OH基含有基板の製造)
コロナマスターPS−1M(信光電気計装(株)製、電圧;0〜14kV、周波数;15kHz)を用いて、対象基板(エポキシ樹脂基板:1.0×30×60mm、(株)大昌電子製、アルミ基板:1.0×30×60mm、ニラコ製、SUS304:0.1×30×60mm、ニラコ製)を室温で30秒間表面処理した。いずれの固体表面の濡れ性が向上しており、表面にOH基が存在していることが確認できた。
Examples 7-12, Comparative Examples 3-8
(Manufacture of OH group-containing substrates)
Using a corona master PS-1M (manufactured by Shinko Electric Instrumentation Co., Ltd., voltage: 0-14 kV, frequency: 15 kHz), the target substrate (epoxy resin substrate: 1.0 × 30 × 60 mm, manufactured by Daisho Electronics Co., Ltd.) , Aluminum substrate: 1.0 × 30 × 60 mm, manufactured by Nilaco , SUS304: 0.1 × 30 × 60 mm, manufactured by Nilaco ) was surface-treated at room temperature for 30 seconds. It was confirmed that the wettability of any solid surface was improved and OH groups were present on the surface.
実施例13〜20、比較例9〜16
基板として、アルミ基板(1×30×60mm、ニラコ製)を用い、表3に示された分子接着剤の2mMエタノール溶液、またはトリアジン化合を含む場合(実施例14、16、18、20)は、モル比で1:1分子接着剤:トリアジン化合物)の割合で添加し、2mMエタノール溶液とし、かつ、表3に示すゴム架橋配合物(1)〜(4)(表5参照)を用いた以外は、実施例1と同様にして、アルミ基板/各種ゴム接着物を得た。得られたアルミ基板/各種ゴム接着物の90°剥離試験を行った。その結果を表3に示す。
Examples 13-20, Comparative Examples 9-16
When an aluminum substrate (1 × 30 × 60 mm, manufactured by Niraco ) is used as a substrate and a 2 mM ethanol solution of a molecular adhesive shown in Table 3 or a triazine compound is included (Examples 14, 16, 18, and 20) In a molar ratio of 1: 1 molecular adhesive: triazine compound), a 2 mM ethanol solution was used, and the rubber crosslinking compounds (1) to (4) (see Table 5) shown in Table 3 were used. Except for this, an aluminum substrate / various rubber adhesives were obtained in the same manner as in Example 1. The obtained aluminum substrate / various rubber adhesives were subjected to a 90 ° peel test. The results are shown in Table 3.
Claims (10)
[Xa(YO)3-aSiR1]bZ (1)
(式中、X、Yは同じであっても異なっていてもよく、炭素数1〜4のアルキル基又はアルケニル基であり、R1は炭素数1〜18のアルキレン基又はフェニレン基であって、アルキレン基には−NH−、−CO−、−O−、−S−、−COO−、−C6H4−を含んでいてもよい。Zは、−SH、−SCSN(CH3)2、−SSCSN(CH3)2、−SCSN(C2H5)2、−SCSN(C4H9)2、−SCSN(C8H17)2、−SS−、−SSS−、−SSSS−、
で表される化合物からなる架橋反応性を示すことを特徴とする分子接着剤。 General formula (1):
[X a (YO) 3 -a SiR 1 ] b Z (1)
(In the formula, X and Y may be the same or different and each represents an alkyl group or alkenyl group having 1 to 4 carbon atoms; R 1 is an alkylene group or phenylene group having 1 to 18 carbon atoms; The alkylene group may include —NH—, —CO—, —O—, —S—, —COO—, —C 6 H 4 —, wherein Z is —SH, —SCSN (CH 3 ). 2 , -SSSCN (CH 3 ) 2 , -SCSN (C 2 H 5 ) 2 , -SCSN (C 4 H 9 ) 2 , -SCSN (C 8 H 17 ) 2 , -SS-, -SSS-, -SSSS −,
A molecular adhesive characterized by exhibiting crosslinking reactivity comprising a compound represented by the formula:
で表されるトリアジン化合物を含む分子接着剤組成物。 The molecular adhesive according to claim 1 and the general formula (2):
The molecular-adhesive composition containing the triazine compound represented by these.
[Xa(YO)3-aSiR1]bZ (1)
(式中、X、Yは同じであっても異なっていてもよく、炭素数1〜4のアルキル基又はアルケニル基であり、R1は炭素数1〜18のアルキレン基又はフェニレン基であって、アルキレン基には−NH−、−CO−、−O−、−S−、−COO−、−C6H4−を含んでいてもよい。Zは、−SH、−SCSN(CH3)2、−SSCSN(CH3)2、−SCSN(C2H5)2、−SCSN(C4H9)2、−SCSN(C8H17)2、−SS−、−SSS−、−SSSS−、
で表される架橋反応性を示すことを特徴とする分子接着剤を含む溶液と、表面にOH基を有する固体表面とを接触させる工程、分子接着剤を含む溶液と接触した固体表面を加熱する工程を含む架橋反応性固体表面の製造方法。 General formula (1):
[X a (YO) 3 -a SiR 1 ] b Z (1)
(In the formula, X and Y may be the same or different and each represents an alkyl group or alkenyl group having 1 to 4 carbon atoms; R 1 is an alkylene group or phenylene group having 1 to 18 carbon atoms; The alkylene group may include —NH—, —CO—, —O—, —S—, —COO—, —C 6 H 4 —, wherein Z is —SH, —SCSN (CH 3 ). 2 , -SSSCN (CH 3 ) 2 , -SCSN (C 2 H 5 ) 2 , -SCSN (C 4 H 9 ) 2 , -SCSN (C 8 H 17 ) 2 , -SS-, -SSS-, -SSSS −,
Heating the solution containing the molecules adhesive agent characterized in that indicating the cross-linking reaction, expressed, contacting the solid surface with OH groups on the surface, the solid surface in contact with the solution containing the molecules adhesive manufacturing method of including cross-linking reactive solid surface steps.
で表されるトリアジン化合物を含む請求項3記載の架橋反応性固体表面の製造方法。 In addition to the solution containing the molecular adhesive, the general formula (2):
The manufacturing method of the crosslinking reactive solid surface of Claim 3 containing the triazine compound represented by these.
Xa(YO)3-aSiR1Z’ (5)
(式中、X、Yは同じであっても異なっていてもよく、炭素数1〜4のアルキル基又はアルケニル基であり、R1は炭素数1〜18のアルキレン基又はフェニレン基であって、アルキレン基には−NH−、−CO−、−O−、−S−、−COO−、−C6H4−を含んでいてもよい。Z’は、−Cl又は−Brである。aは0、1又は2である。)
で表されるシランカップリング剤を含む溶液と、表面にOH基を有する固体表面を接触させて、シランカップリング剤を含む溶液と接触した固体表面を加熱して得られた反応性固体表面に、
一般式(6):
M4 pZ (6)
(式中、M4はH、Li、Na、K又はCsであり、Zは、−SH、−SCSN(CH3)2、−SSCSN(CH3)2、−SCSN(C2H5)2、−SCSN(C4H9)2、−SCSN(C8H17)2、−SS−、−SSS−、−SSSS−、
で表される硫黄化合物を含む溶液を接触させる工程を含む架橋反応性固体表面の製造方法。 General formula (5):
X a (YO) 3-a SiR 1 Z ′ (5)
(In the formula, X and Y may be the same or different and each represents an alkyl group or alkenyl group having 1 to 4 carbon atoms; R 1 is an alkylene group or phenylene group having 1 to 18 carbon atoms; The alkylene group may contain —NH—, —CO—, —O—, —S—, —COO—, —C 6 H 4 —, wherein Z ′ is —Cl or —Br. a is 0, 1 or 2.)
A reactive solid surface obtained by heating a solid surface in contact with a solution containing a silane coupling agent by bringing the solution containing the silane coupling agent represented by ,
General formula (6):
M 4 p Z (6)
(In the formula, M 4 is H, Li, Na, K or Cs , and Z is —SH, —SCSN (CH 3 ) 2 , —SSCSN (CH 3 ) 2 , —SCSN (C 2 H 5 ) 2. , -SCSN (C 4 H 9) 2, -SCSN (C 8 H 17) 2, -SS -, - SSS -, - SSSS-,
Method for producing a process of including cross-linking reactive solid surfaces contacting the solution in containing represented by sulfur compounds.
一般式(2):
で表されるトリアジン化合物を含む溶液とを接触させる工程、トリアジン化合物を含む溶液と接触した固体表面を加熱する工程を含む請求項4に記載の架橋反応性固体表面の製造方法。 The resulting cross-linking reactive solid surface;
General formula (2):
The method for producing a cross-linking reactive solid surface according to claim 4, comprising a step of contacting a solution containing the triazine compound represented by the formula: and a step of heating the solid surface in contact with the solution containing the triazine compound.
Priority Applications (1)
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JP2007227199A JP5191192B2 (en) | 2007-08-31 | 2007-08-31 | Molecular adhesive, cross-linking reactive solid surface, and method for producing the cross-linking reactive solid surface |
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JP2007227199A JP5191192B2 (en) | 2007-08-31 | 2007-08-31 | Molecular adhesive, cross-linking reactive solid surface, and method for producing the cross-linking reactive solid surface |
Publications (3)
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JP2009057501A JP2009057501A (en) | 2009-03-19 |
JP2009057501A5 true JP2009057501A5 (en) | 2010-10-07 |
JP5191192B2 JP5191192B2 (en) | 2013-04-24 |
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Families Citing this family (4)
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WO2009154083A1 (en) * | 2008-06-16 | 2009-12-23 | 株式会社いおう化学研究所 | Laminated body and circuit wiring board |
KR101706582B1 (en) * | 2010-02-17 | 2017-02-27 | 니폰 가세이 가부시키가이샤 | Triazine derivative, and application thereof |
JP6452918B1 (en) * | 2017-03-30 | 2019-01-16 | リンテック株式会社 | Adhesive sheet and laminate manufacturing method |
JP6605779B2 (en) * | 2017-03-30 | 2019-11-20 | リンテック株式会社 | Adhesive sheet and laminate manufacturing method |
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JPS50104279A (en) * | 1974-01-25 | 1975-08-18 | ||
JPH0411684A (en) * | 1990-04-27 | 1992-01-16 | Uchiyama Mfg Corp | Adhesive composition |
JP2000351852A (en) * | 1999-04-05 | 2000-12-19 | Yokohama Rubber Co Ltd:The | Method for bonding nickel-plated steel cord to rubber |
JP5076139B2 (en) * | 2005-09-28 | 2012-11-21 | 国立大学法人岩手大学 | Molecular adhesive for bonding resin and rubber, bonding method between resin and rubber, and bonded composite product of resin and rubber |
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