JP2009043773A - Hermetically-sealing structure for electronic apparatus - Google Patents
Hermetically-sealing structure for electronic apparatus Download PDFInfo
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- JP2009043773A JP2009043773A JP2007204241A JP2007204241A JP2009043773A JP 2009043773 A JP2009043773 A JP 2009043773A JP 2007204241 A JP2007204241 A JP 2007204241A JP 2007204241 A JP2007204241 A JP 2007204241A JP 2009043773 A JP2009043773 A JP 2009043773A
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- sealing structure
- electronic device
- peripheral surface
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- 239000013013 elastic material Substances 0.000 claims abstract description 4
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical class CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
Description
本発明は、電子装置用密封構造に関する。
また、本発明は、防水機能を備えた電子装置用密封構造に関する。
The present invention relates to a sealing structure for an electronic device.
The present invention also relates to a sealing structure for an electronic device having a waterproof function.
更に、本発明は、開閉する蓋部材から、外部の水等が電子装置内に浸入するのを防止する電子装置用密封構造に関する。
更にまた、本発明は、デジタルカメラ等の電子装置用密封構造として有効に用いられる。
Furthermore, the present invention relates to a sealing structure for an electronic device that prevents external water or the like from entering the electronic device from a lid member that opens and closes.
Furthermore, the present invention is effectively used as a sealing structure for electronic devices such as digital cameras.
従来、電子機器の蓋部材、例えば、デジタルカメラ等の接続端子部や電池収納部に使用されている蓋部材には防水を目的として密封部材が設けられる。
一般に、この様な密封部材は、ハウジング側との密着性や追随性に優れた低硬度のシリコーンゴムが使用される。
そして、電子装置用密封構造に用いられるOリングの蓋部材への取付は、Oリングを蓋部材の外周面に設けた環状の溝部内に配置する構成としている。
2. Description of the Related Art Conventionally, a lid member of an electronic device, for example, a lid member used for a connection terminal portion or a battery housing portion of a digital camera or the like is provided with a sealing member for the purpose of waterproofing.
In general, for such a sealing member, a low-hardness silicone rubber excellent in adhesion to the housing side and followability is used.
The O-ring used for the sealing structure for an electronic device is attached to the lid member by placing the O-ring in an annular groove provided on the outer peripheral surface of the lid member.
しかしながら、低硬度のシリコーンゴムからなる防水ガスケットは、伸びやすく、かつ、捻じれやすい傾向あり、特に矩形の外周面に設けた溝部に配置した場合は、長手方向の中間位置で、溝部に追随できないたるみが発生した。
具体的には、図4及び図5に示す様に、蓋部材10の外周面110に設けた溝部120からOリング20が浮き上がった状態が招来する。
尚、図5は図4のC−C断面図である。
However, waterproof gaskets made of low-hardness silicone rubber tend to stretch and twist easily, especially when placed in a groove provided on a rectangular outer peripheral surface, the groove cannot follow the groove at an intermediate position in the longitudinal direction. Sagging occurred.
Specifically, as shown in FIGS. 4 and 5, a state in which the O-
5 is a cross-sectional view taken along the line CC of FIG.
この結果、この様な状態で、図4の蓋部材10をハウジング30に向って閉じると、蓋部材10とハウジング30との間で、Oリング20を噛み込んでしまう問題を惹起した。
この傾向は、Oリング20の蓋部材10の長手方向の中央部付近で顕著であった。
これは、Oリング20を矩形の外周面に設けた溝部に配置した場合、長手方向の中間位置で、溝部に追随できないたるみが発生する傾向が強いためである。
As a result, in this state, when the
This tendency was remarkable in the vicinity of the central portion of the O-
This is because, when the O-
本発明は、このような課題に鑑みてなされたものであり、取り扱いが容易で、蓋部材とハウジングとの間で、Oリングを噛み込む心配がなく、二部材間の良好なシール性能を維持出来る電子装置用密封構造を提供することを目的とする。 The present invention has been made in view of such problems, is easy to handle, has no fear of biting the O-ring between the lid member and the housing, and maintains good sealing performance between the two members. An object is to provide a sealing structure for an electronic device.
本発明の電子装置用密封構造は、電子装置の蓋部材の外周面に設けた環状の溝部内に配置されたゴム状弾製材製のOリングと、前記蓋部材を受け入れ、前記Oリングと密封接触する環状内周面を備えるハウジングとからなる密封構造において、前記外周面が矩形状であると共に、前記蓋部材が短い側面側を支点として開閉運動するようになしたことを特徴とする。 The sealing structure for an electronic device according to the present invention includes an O-ring made of rubber-like elastic material disposed in an annular groove provided on an outer peripheral surface of a lid member of the electronic device, and the lid member, and seals the O-ring. In the sealing structure including a housing having an annular inner peripheral surface in contact with the housing, the outer peripheral surface is rectangular, and the lid member is opened and closed with a short side surface as a fulcrum.
本発明は、以下に記載されるような効果を奏する。
請求項1記載の電子装置用密封構造によれば、蓋部材とハウジングとの間で、Oリングを噛み込む心配がなく、二部材間の良好なシール性能を維持出来る。
また、請求項2記載の電子装置用密封構造によれば、蓋部材を閉じる初期段階において、ハウジングとOリングとの間の滑動が円滑に行える。
The present invention has the following effects.
According to the sealing structure for an electronic device according to the first aspect, there is no fear that the O-ring is caught between the lid member and the housing, and a good sealing performance between the two members can be maintained.
Further, according to the sealing structure for an electronic device according to the second aspect, the sliding between the housing and the O-ring can be smoothly performed in the initial stage of closing the lid member.
更に、請求項3記載の電子装置用密封構造によれば、製作が安価に行え、良好なる密封性能を発揮出来る。
また、請求項4記載の密封装置によれば、蓋部材開閉時の摺動抵抗を下げ、Oリングの捩れを防止できる。
Further, according to the sealing structure for an electronic device according to the third aspect, the manufacturing can be performed at a low cost, and a good sealing performance can be exhibited.
According to the sealing device of the fourth aspect, the sliding resistance when the lid member is opened and closed can be lowered, and the twisting of the O-ring can be prevented.
更に、請求項5記載の電子装置用密封構造によれば、蓋部材開閉時の摺動抵抗を下げ、Oリングの噛み込みがより確実に阻止できる。
また同様に、請求項6記載の電子装置用密封構造によれば、蓋部材開閉時の摺動抵抗を下げ、Oリングの噛み込みがより確実に阻止できる。
Further, according to the sealing structure for an electronic device according to the fifth aspect, the sliding resistance when the lid member is opened and closed can be lowered, and the O-ring can be more reliably prevented.
Similarly, according to the sealing structure for an electronic device according to the sixth aspect, the sliding resistance when the lid member is opened and closed can be lowered, and the O-ring can be more reliably prevented from being bitten.
以下、本発明を実施するための最良の形態について説明する。
図1乃至図3に基づき発明を実施するための最良の形態について説明する。
図2は図1のA−A断面図である。
図3は図1のB−B断面図である。
Hereinafter, the best mode for carrying out the present invention will be described.
The best mode for carrying out the invention will be described with reference to FIGS.
2 is a cross-sectional view taken along the line AA in FIG.
3 is a cross-sectional view taken along the line BB of FIG.
電子装置用密封構造は、電子装置の蓋部材1の外周面11に設けた環状の溝部12内に配置されたゴム状弾製材製のOリング2と、この蓋部材1を受け入れ、Oリング2と密封接触する環状内周面31を備えるハウジング3とから構成されている。
この環状の溝部12は、蓋部材1の閉じる側の側面に設けた矩形の凸状部13の外周面に設ける態様としているが、凸状部13を設けず、蓋部材1の外周面に直接設ける態様でも良い。
The sealing structure for an electronic device receives an O-
The
また、外周面11は矩形状であり、蓋部材1は短い側面14側を支点15として、開閉運動するような構成としている。
この矩形状とは、長方形状の意味であるが、その角部は円弧形状であってもよく、また、各辺が全体的に湾曲する形状であってもよい。
このため、本実施例では、短い側面14側の外周面11が円弧形状部111となっている。
The outer
The rectangular shape means a rectangular shape, but the corner portion may be an arc shape or a shape in which each side is entirely curved.
For this reason, in this embodiment, the outer
更に、蓋部材1の開閉運動の支点15は、蓋部材1と一体的に樹脂材で製作されている。このため、製作が安価に出来るばかりでなく、構造が簡単なため、良好な密封構造とすることが容易である。
また、Oリング2の表面は、表面処理剤で処理したり、梨地処理してあるため、蓋部材開閉時の摺動抵抗を下げ、Oリングの捩れを防止できる。
また、その馴染み性が改善されることから、たるみが生ずる危険性を効果的に回避出来る。
Further, the fulcrum 15 of the opening / closing movement of the
Further, since the surface of the O-
Moreover, since the familiarity is improved, the risk of sagging can be effectively avoided.
また、Oリング2は、硬度がJISA50〜70°の範囲のもので、シリコーンゴム、フッ素ゴム、NBR,水素化NBR、EPDM,SBR、アクリルゴム等の合成ゴム、天然ゴム、熱可塑性エラストマー、等から適宜選択して用いられる。
The O-
更に、Oリング2の表面処理剤は、反応性表面処理剤、シリコーンコーティング剤、フッ素コーティング剤等が適宜選択して用いられるが、反応性表面処理剤が特に好ましい。
Oリング2の表面が処理されることにより、Oリング2は、溝部12に装着される際、その馴染み性が改善されることから、たるみが生ずる危険性を効果的に回避出来る。
この反応性表面処理剤としては、Si−NCO基を有するシリルイソシアネート化合物が採用される。
Furthermore, as the surface treatment agent for the O-
By treating the surface of the O-
As this reactive surface treating agent, a silyl isocyanate compound having a Si-NCO group is employed.
この種化合物としては、1個のNCO基がケイ素原子に結合した、トリエチルシリルイソシアネート[(C2H5)3SiNCO]、3個のNCO基がケイ素原子に結合した、
ブトキシシラントリイソシアネート[C4H9OSi(NCO)3]等が単独若しくは組み合わせて使用できる。
As this kind of compound, one NCO group was bonded to a silicon atom, triethylsilyl isocyanate [(C2H5) 3SiNCO], three NCO groups were bonded to a silicon atom,
Butoxysilane triisocyanate [C4H9OSi (NCO) 3] or the like can be used alone or in combination.
特に、以下の組み合わせからなる反応性表面処理剤が好適に用いられる。
(1)末端水酸基を含有するポリシロキサンとシリルイソシアネ−トとの反応生成物、
(2)イソシアネート基と反応性を有する官能基を含有するオリゴマーとシリルイソシアネートとの反応生成物、
(3)一般式
(ここで、Rはアルキル基、アリール基またはイソシアネート基であり、nは1以上の整数である)で表わされるシリルイソシアネートオリゴマーおよび(4)有機溶媒可溶性ゴムよりなる反応性表面処理剤。
In particular, a reactive surface treatment agent comprising the following combinations is preferably used.
(1) a reaction product of a polysiloxane containing a terminal hydroxyl group and a silyl isocyanate,
(2) a reaction product of an oligomer containing a functional group having reactivity with an isocyanate group and silyl isocyanate,
(3) General formula
(Wherein R is an alkyl group, an aryl group or an isocyanate group, and n is an integer of 1 or more) and (4) a reactive surface treating agent comprising an organic solvent-soluble rubber.
(1)成分の反応生成物を形成する末端水酸基を含有するポリシロキサンとしては、分子中に少くとも1個の末端水酸基を有するポリシロキサン、例えばα,ω-ジヒドロキシポリジメチルシロキサン、α,ω-ジヒドロキシポリジフェニルシロキサン等が用いられ、これらのポリシロキサンは、約100〜100,000cst、好ましくは約100〜10,000cstの粘度(室温)のものが用いられる。 The polysiloxane containing a terminal hydroxyl group that forms the reaction product of component (1) is a polysiloxane having at least one terminal hydroxyl group in the molecule, such as α, ω-dihydroxypolydimethylsiloxane, α, ω- Dihydroxypolydiphenylsiloxane or the like is used, and those polysiloxanes having a viscosity (room temperature) of about 100 to 100,000 cst, preferably about 100 to 10,000 cst are used.
また、(2)成分の反応生成物を形成するオリゴマーとしては、水酸基、カルボキシル基、アミノ基、チオール等のイソシアネート基と反応性を有する官能基を有する、分子量が約10,000以下、好ましくは約1000〜7000のオリゴマーが用いられ、例えばこれらの官能基を有するオリゴマ−状のポリエステル樹脂、ブチラール樹脂、アクリル樹脂、フッ素樹脂、ニトロセルロース等が用いられ、好ましくは水酸基含有ポリエステル樹脂、水酸基含有フッ素樹脂、ブチラール樹脂、ニトロセルロース等が用いられる。 The oligomer that forms the reaction product of component (2) includes a functional group having reactivity with an isocyanate group such as a hydroxyl group, a carboxyl group, an amino group, and a thiol, and a molecular weight of about 10,000 or less, preferably about 1000. ~ 7000 oligomers are used, for example, oligomeric polyester resins having these functional groups, butyral resins, acrylic resins, fluororesins, nitrocellulose, etc., preferably hydroxyl group-containing polyester resins, hydroxyl group-containing fluororesins, Butyral resin, nitrocellulose and the like are used.
これらの官能基を有するポリシロキサンおよびオリゴマーは、予め当量以上、一般には1〜100倍当量、好ましくは1〜50当量のシリルイソシアネートと反応させた上で用いられる。シリルイソシアネートとしては例えばメチルトリイソシアネートシラン、エチルトリイソシアネートシラン、イソプロピルトリイソシアネートシラン、ブチルトリイソシアネートシラン、フェニルトリイソシアネートシラン、ジメチルジイソシアネートシラン、ジエチルジイソシアネートシラン、テトライソシアネートシラン等が用いられる。 The polysiloxane and oligomer having these functional groups are used after reacting with silyl isocyanate in an equivalent amount or more, generally 1 to 100 times equivalent, preferably 1 to 50 equivalents in advance. Examples of the silyl isocyanate include methyl triisocyanate silane, ethyl triisocyanate silane, isopropyl triisocyanate silane, butyl triisocyanate silane, phenyl triisocyanate silane, dimethyl diisocyanate silane, diethyl diisocyanate silane, and tetraisocyanate silane.
反応性官能基を有するポリシロキサンまたはオリゴマーとシリルイソシアネートとの間の反応は、ポリシロキサンまたはオリゴマーの有機溶媒溶液中に、シリルイソシアネートを滴下することによって行われ、ポリシロキサンとオリゴマーとは一般に別個に反応させるが、同時に反応させることも可能である。反応は、室温乃至約150℃、好ましくは室温乃至約100℃で行われる。 The reaction between the polysiloxane or oligomer having a reactive functional group and the silyl isocyanate is carried out by dropping silyl isocyanate into an organic solvent solution of the polysiloxane or oligomer, and the polysiloxane and the oligomer are generally separated from each other. Although it is made to react, it is also possible to react simultaneously. The reaction is carried out at room temperature to about 150 ° C, preferably room temperature to about 100 ° C.
反応溶媒として用いられる有機溶媒としては、ポリシロキサンまたはオリゴマーを溶解させかつイソシアネート基と反応しないものであれば任意のものを用いることができ、例えば酢酸エチル、酢酸ブチル、プロピレングリコールモノメチルアセテート、エチルセロソルブアセテート等のエステル類、ジブチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールジブチルエーテル、テトラヒドロフラン等のエーテル類、トルエン、キシレン等の芳香族炭化水素類、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン類、ジメチルホルムアミド、ジメチルアセトアミド、ジメチルスルホキシド、N-メチル-2-ピロリドン等のプロトン性極性溶媒などが、単独であるいは組合せて用いられる。 As the organic solvent used as the reaction solvent, any solvent can be used as long as it dissolves polysiloxane or oligomer and does not react with isocyanate groups. For example, ethyl acetate, butyl acetate, propylene glycol monomethyl acetate, ethyl cellosolve Esters such as acetate, ethers such as dibutyl ether, ethylene glycol dimethyl ether, ethylene glycol dibutyl ether and tetrahydrofuran, aromatic hydrocarbons such as toluene and xylene, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, dimethyl Protic polar solvents such as formamide, dimethylacetamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, etc. are used alone or in combination
(3)成分のシリルイソシアネートオリゴマーとしては、前記一般式で表わされるものが用いられ、ここでRはメチル基、エチル基、イソプロピル基、ブチル基等のアルキル基、フェニル基によって代表されるアリール基またはイソシアネート基であり、nは好ましくは1〜4である。 As the silyl isocyanate oligomer of component (3), those represented by the above general formula are used, wherein R is an aryl group represented by an alkyl group such as a methyl group, an ethyl group, an isopropyl group, or a butyl group, or a phenyl group. Or it is an isocyanate group, and n is preferably 1-4.
更に、(4)成分の有機溶媒可溶性ゴムとしては、前記の如き各種有機溶媒に可溶性のNBR、SBR、イソプレンゴム、ブタジエンゴム、クロロプレンゴム、ブチルゴム、EPDM、ウレタンゴム、フッ素ゴム、アクリルゴム、エピクロロヒドリンゴム、塩素化ポリエチレン、クロロスルホン化ポリエチレン等の合成ゴムまたは天然ゴムであって、好ましくはNBR、特に好ましくはカルボキシル基または水酸基含有NBR、カルボキシル基またはアミノ基変性ブタジエン-アクリロニトリル共重合体等が用いられる。 Further, the organic solvent-soluble rubber of component (4) includes NBR, SBR, isoprene rubber, butadiene rubber, chloroprene rubber, butyl rubber, EPDM, urethane rubber, fluoro rubber, acrylic rubber, epi rubber, which are soluble in various organic solvents as described above. Synthetic rubber or natural rubber such as chlorohydrin rubber, chlorinated polyethylene, chlorosulfonated polyethylene, etc., preferably NBR, particularly preferably carboxyl group or hydroxyl group-containing NBR, carboxyl group or amino group modified butadiene-acrylonitrile copolymer, etc. Is used.
以上の各成分は、(1)成分が約1〜50重量%、好ましくは約1〜10重量%、(2)成分が約1〜50重量%、好ましくは約1〜10重量%、(3)成分が約3〜50重量%、好ましくは約3〜20重量%、また(4)成分が約0.01〜10重量%、好ましくは約0.05〜5重量%の割合でそれぞれ用いられ、残部は有機溶媒よりなる。 In each of the above components, the component (1) is about 1 to 50% by weight, preferably about 1 to 10% by weight, the component (2) is about 1 to 50% by weight, preferably about 1 to 10% by weight, (3 ) Component is used in an amount of about 3 to 50% by weight, preferably about 3 to 20% by weight, and (4) component is used in a proportion of about 0.01 to 10% by weight, preferably about 0.05 to 5% by weight, with the remainder being organic It consists of a solvent.
これらの各成分の混合割合において、これ以下の使用割合では、(1)成分では非粘着性が低下するようになり、(2)成分、(3)成分、(4)成分では密着性が低下するようになる。一方、これ以上の割合で用いられると、(1)成分ではその成分の脱落が生ずるようになり、(2)成分、(4)成分では非粘着性が低下し、また(3)成分ではポットライフが短かくなる。 In the mixing ratio of each of these components, the non-adhesiveness decreases with the (1) component, and the adhesiveness decreases with the (2) component, (3) component, and (4) component. Will come to do. On the other hand, if it is used in a proportion higher than this, the component (1) will come off, the (2) component, the (4) component will be non-tacky, and the (3) component will be a pot. Life is shortened.
以上の各成分を必須成分とする表面処理剤は、一旦約5〜20重量%程度の固形分濃度を有する有機溶媒溶液として調製された後、塗布厚みや塗布方法に応じて更に有機溶媒で希釈されて用いられる。 The surface treatment agent containing the above components as essential components is once prepared as an organic solvent solution having a solid content concentration of about 5 to 20% by weight, and further diluted with an organic solvent according to the coating thickness and coating method. To be used.
その塗布厚みは、通常約1〜20μm、好ましくは約2〜10μmであり、これ以下の塗布厚みでは処理表面すべてを覆うことができず、非粘着性が損われるばかりではなく、シール材に適用した場合にシール性が損われるようになる。一方、塗布厚みがこれよりも厚いと、シール材表面の剛性が高くなり、シール性や柔軟性が損われることもあり得るようになる。その塗布方法も任意であり、一般には浸漬法、スプレー法、ロールコーター法、フローコーター法等が用いられ、塗布後約80〜250℃、好ましくは約120〜200℃での加熱処理が約3分間乃至1時間程度行われる。 The coating thickness is usually about 1 to 20 μm, preferably about 2 to 10 μm. If the coating thickness is less than this, not all of the treatment surface can be covered, and not only the non-adhesiveness is impaired, but also applied to the sealing material. If this happens, the sealing performance will be impaired. On the other hand, if the coating thickness is thicker than this, the rigidity of the sealing material surface becomes high, and the sealing performance and flexibility may be impaired. The application method is also arbitrary, and generally a dipping method, a spray method, a roll coater method, a flow coater method or the like is used. After the application, heat treatment at about 80 to 250 ° C., preferably about 120 to 200 ° C. is performed for about 3 It takes about 1 to 1 hour.
また、Oリング2表面の梨地処理は、Oリング2の成形金型面を、ショットブラスト等により梨地処理する事により形成するか、成形後、Oリング2表面に直接梨地処理を施す事により形成される。
In addition, the surface of the O-
以上に述べた構成の本発明は、以下に述べる作用及び効果を招来する。
すなわち、矩形状の溝部12に装着されたOリング2は、図2に示す様に、長手方向の両端側において、浮き上がりは生じないが、図3に示す様に、長手方向の中央部近傍においては、不可避的に浮き上がりが発生する。
しかし、蓋部材1の短い側面14側を支点15としているため、まず、Oリング2の浮きが生じない短い側面14側が、ハウジング3の環状内周面31内に速やかに収まる。
The present invention having the above-described configuration invites the following operations and effects.
That is, as shown in FIG. 2, the O-
However, since the
ついで、Oリング2は、長手方向の支点14側から中央部に向って、順次、環状内周面31内に収まって行く。
このため、たとえ、長手方向の中央部近傍に浮き上がりが発生していたとしても、Oリング2は、環状内周面31にガイドされて、溝部12内に収まり、噛み込まれることはない。
特に、Oリング2の表面が表面処理されていると、噛み込みをより効果的に防止できる。
Subsequently, the O-
For this reason, even if the floating has occurred near the central portion in the longitudinal direction, the O-
In particular, when the surface of the O-
また、本発明は上述の発明を実施するための最良の形態に限らず本発明の要旨を逸脱することなくその他種々の構成を採り得ることはもちろんである。 Further, the present invention is not limited to the best mode for carrying out the invention described above, and various other configurations can be adopted without departing from the gist of the present invention.
1 蓋部材
2 Oリング
3 ハウジング
11 外周面
12 溝部
13 凸状部
14 短い側面
15 支点
DESCRIPTION OF
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