JP2009026824A - Electronic appliance - Google Patents

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JP2009026824A
JP2009026824A JP2007186114A JP2007186114A JP2009026824A JP 2009026824 A JP2009026824 A JP 2009026824A JP 2007186114 A JP2007186114 A JP 2007186114A JP 2007186114 A JP2007186114 A JP 2007186114A JP 2009026824 A JP2009026824 A JP 2009026824A
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rail member
harness
circuit board
electronic
electronic component
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JP5022800B2 (en
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Masashi Minoue
真史 巳上
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic appliance which can reduce by its space smaller than conventional ones the effect given to its wires by radio waves radiated from the periphery of its wires. <P>SOLUTION: In the electronic appliance, a harness 18 is so kept away from an electronic component 15 by a rail member 19 as not to be induced with radio waves radiated from the electronic component 15. The rail member 19 is connected electrically with the ground of a circuit board 13 via screws 12. The rail member 19 so has an installing portion 19d for installing thereon the harness 18 as to mount the harness 18 on a recessed portion 19g along a side-wall 19f of the rail member 19. In the rail member 19, wall portions 19b are so formed as to separate the recessed portion 19g for mounting thereon the harness 18 from a top surface 13a of the circuit board 13. By adopting such a structure, the effect given to the harness by the radio waves radiated from the electronic component can be reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電子機器に関し、特にシールド構造に関する。   The present invention relates to an electronic device, and more particularly to a shield structure.

電子機器の小型化や高集積化に伴い、電子機器内部から発生する電磁波ノイズへの対策が益々重要になっている。放射される電磁波ノイズは、無線機器など周辺装置の誤作動やノイズ発生源となる機器自身の誤作動にも繋がることがある。電磁波ノイズへの対策として、一つには筐体に鉄やアルミニウム等の金属を使用して電子機器から放射される電磁波を遮蔽する方法がある。ノートパソコン等の持ち運び可能な電子機器では軽量化が求められるため、樹脂製の筐体に金属めっきを施し導電層が設けられ、電磁波シールド層が形成されることもある。   With miniaturization and high integration of electronic devices, countermeasures against electromagnetic wave noise generated from the inside of electronic devices are becoming increasingly important. Radiated electromagnetic noise may lead to malfunctions of peripheral devices such as wireless devices and malfunctions of the devices themselves that generate noise. As a countermeasure against electromagnetic wave noise, one method is to use a metal such as iron or aluminum for the casing to shield electromagnetic waves emitted from electronic devices. Since portable electronic devices such as notebook computers are required to be lighter, a conductive layer is provided on a resin casing by metal plating, and an electromagnetic wave shielding layer may be formed.

特許文献１には、電線に伝わる信号にノイズが重畳するのを防止する目的で、基板表面に形成されたレールにカバーを係合して、その内面に電磁波シールド材を付着させた配線ダクトが開示されている。
特開平１０−６６２２０号公報 Patent Document 1 discloses a wiring duct in which a cover is engaged with a rail formed on a substrate surface and an electromagnetic wave shielding material is attached to the inner surface for the purpose of preventing noise from being superimposed on a signal transmitted to an electric wire. It is disclosed.
Japanese Patent Laid-Open No. 10-66220

しかし、上記の方式の場合、電線の周りを配線ダクトで囲うため大きなスペースが必要になり、電子機器の実装密度の向上の妨げになるという問題がある。   However, in the case of the above-described method, there is a problem that a large space is required to surround the electric wire with a wiring duct, which hinders improvement in mounting density of electronic devices.

そこで本発明の目的は、より少ないスペースで周囲から放出される電波が電線に与える影響を少なくすることの可能な電子機器を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device that can reduce the influence of electric waves emitted from the surroundings on electric wires in a smaller space.

上記目的を達成するために本発明に係る電子機器は、筐体と、筐体内に設けられるとともに、ノイズを発する電子部品が実装される回路基板と、前記回路基板上に設けられるコネクタに接続されるハーネスと、導電性を有するとともに、前記電子部品を覆うように前記回路基板上に設けられるレール部材と、を備え、前記レール部材は、前記電子部品を覆う下面と反対側の面に前記ハーネスを架設するための架設部を有することを特徴とする。   In order to achieve the above object, an electronic apparatus according to the present invention is connected to a housing, a circuit board on which electronic components that generate noise are mounted, and a connector provided on the circuit board. And a rail member that has conductivity and is provided on the circuit board so as to cover the electronic component, the rail member on the surface opposite to the lower surface that covers the electronic component. It has the erection part for erection.

本発明によれば、より少ないスペースで周囲から放出される電波が電線に与える影響を少なくすることの可能な電子機器を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can reduce the influence which the electromagnetic wave emitted from the periphery with less space has on an electric wire can be provided.

以下本発明に係る実施の形態を、図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は本発明の実施形態に係る電子機器を示す外観斜視図である。電子機器１は筐体２を備え、筐体２にはディスプレイユニット３がヒンジ部４を介して回動可能に取り付けられている。ディスプレイユニット３は筐体２の上面２ａが開放される開き位置と、筐体２の上面２ａが覆われる閉じ位置とで回動可能である。ディスプレイユニット３内にはＬＣＤ（Ｌｉｑｕｉｄ Ｃｒｙｓｔａｌ Ｄｉｓｐｌａｙ）５から構成される表示装置が組み込まれる。筐体２内には複数の電子部品を搭載した回路基板が収容されている。筐体２の上面２ａにはタッチパッド６およびキーボード７が取り付けられる。筐体２は樹脂製あるいはマグネシウム合金等の金属製の上ケース８及び下ケース９とから構成され、筐体２内には複数の電子部品を搭載した後述する回路基板が収容されている。   FIG. 1 is an external perspective view showing an electronic apparatus according to an embodiment of the present invention. The electronic device 1 includes a housing 2, and a display unit 3 is rotatably attached to the housing 2 via a hinge portion 4. The display unit 3 is rotatable between an open position where the upper surface 2a of the housing 2 is opened and a closed position where the upper surface 2a of the housing 2 is covered. A display device including an LCD (Liquid Crystal Display) 5 is incorporated in the display unit 3. A circuit board on which a plurality of electronic components are mounted is accommodated in the housing 2. A touch pad 6 and a keyboard 7 are attached to the upper surface 2 a of the housing 2. The housing 2 is composed of an upper case 8 and a lower case 9 made of a resin or a metal such as magnesium alloy, and a circuit board (described later) on which a plurality of electronic components are mounted is accommodated in the housing 2.

図２は本発明の実施形態に係る電子機器の内部を示す断面図である。図３は本発明の実施形態に係る電子機器に内蔵される回路基板を示す斜視図である。図４は本発明の実施形態に係るレール部材を図３の矢印Ａの方向から見た図を示している。上ケース８の内面８ａには必要に応じてメッキが施される。   FIG. 2 is a cross-sectional view showing the inside of the electronic apparatus according to the embodiment of the present invention. FIG. 3 is a perspective view showing a circuit board built in the electronic apparatus according to the embodiment of the present invention. 4 shows a rail member according to an embodiment of the present invention as viewed from the direction of arrow A in FIG. The inner surface 8a of the upper case 8 is plated as necessary.

下ケース９の内面９ａにはボス１１が複数設けられる。回路基板１３には図示しないネジ穴が設けられ、ボス１１を介してネジ１２により下ケース９と回路基板１３とがネジ止めされる。回路基板１３には、電子部品１５が実装される。メモリ、クロックジェネレーター、スイッチング電源回路等に代表される電子部品１５は周囲に対して電波を発するためノイズ源となる。また、回路基板１３には、コネクタ１６が設けられ、ハーネス１８の端部１８ａに設けられた端子と回路基板１３上のコネクタ１６が接続される。ハーネス１８は、信号線、グランド線、電源線などが束ねられたものであり、スピーカーのケーブル、ＨＤＤ（Ｈａｒｄ Ｄｉｓｃ Ｄｒｉｖｅ）のケーブル、ＬＡＮケーブル等に用いられる。   A plurality of bosses 11 are provided on the inner surface 9 a of the lower case 9. A screw hole (not shown) is provided in the circuit board 13, and the lower case 9 and the circuit board 13 are screwed by the screw 12 through the boss 11. An electronic component 15 is mounted on the circuit board 13. The electronic component 15 typified by a memory, a clock generator, a switching power supply circuit and the like emits radio waves to the surroundings and becomes a noise source. The circuit board 13 is provided with a connector 16, and a terminal provided at the end 18 a of the harness 18 is connected to the connector 16 on the circuit board 13. The harness 18 is a bundle of signal lines, ground lines, power lines, and the like, and is used for speaker cables, HDD (Hard Disc Drive) cables, LAN cables, and the like.

レール部材１９はシールド効果を発揮するように、導電性を有する材質のものが使用される。金属製のものや、樹脂で作製したレール部材にメッキを施すようにしても良い。電子部品１５から放出される電波がハーネス１８に乗り移らないように、レール部材１９によって、電子部品１５とハーネス１８とが遠ざけられる。レール部材１９は、脚部１９ａに設けられた図示しないネジ穴を介して、回路基板１３と固定される。レール部材１９はネジ１２を介して回路基板１３のグランドと電気的に接続される。レール部材１９は、脚部１９ａから起立する壁部１９ｂとともに、レール部材１９の下面１９ｃは壁部１９ｂの高さ分だけ回路基板１３の上面１３ａと隔てられている。レール部材１９はハーネス１８を架設するための架設部１９ｄを有する。架設部１９ｄは、回路基板１３上の電子部品１５を覆う下面１９ｃと反対側の面に設けられる。架設部１９ｄには上面１９ｅ、側壁１９ｆ、凹部１９ｇが設けられ、ハーネス１８はレール部材１９の側壁１９ｆに沿って凹部１９ｇに載置される。レール部材１９は、回路基板１３の上面１３ａとハーネス１８の載置される凹部１９ｇとが隔てられるように壁部１９ｂが形成される。   The rail member 19 is made of a conductive material so as to exhibit a shielding effect. A metal member or a rail member made of resin may be plated. The rail member 19 keeps the electronic component 15 and the harness 18 away so that radio waves emitted from the electronic component 15 do not transfer to the harness 18. The rail member 19 is fixed to the circuit board 13 through a screw hole (not shown) provided in the leg portion 19a. The rail member 19 is electrically connected to the ground of the circuit board 13 via the screw 12. The rail member 19 is separated from the upper surface 13a of the circuit board 13 by the height of the wall portion 19b together with the lower surface 19c of the rail member 19 together with the wall portion 19b rising from the leg portion 19a. The rail member 19 has an installation part 19d for installing the harness 18. The installation portion 19 d is provided on the surface opposite to the lower surface 19 c that covers the electronic component 15 on the circuit board 13. The installation part 19d is provided with an upper surface 19e, a side wall 19f, and a recess 19g, and the harness 18 is placed along the side wall 19f of the rail member 19 in the recess 19g. The rail member 19 is formed with a wall portion 19b so that the upper surface 13a of the circuit board 13 and the concave portion 19g on which the harness 18 is placed are separated.

このような構造を採用することで、電子部品から放出される電波がハーネスに対して与える影響を少なくすることができる。また、シールド効果を上げるためには、ハーネス１８自体にメッキを施しても良い。   By adopting such a structure, it is possible to reduce the influence of radio waves emitted from the electronic component on the harness. Further, in order to increase the shielding effect, the harness 18 itself may be plated.

図５は本発明の第２の実施形態に係る電子機器に内蔵される回路基板を示す斜視図である。図６は本発明の第２の実施形態に係るレール部材を図５の矢印Ｂの方向から見た図を示している。以下の説明では、図１乃至図４に示したものと同一の構成については、同一の符号を付し重複した説明を省略する。   FIG. 5 is a perspective view showing a circuit board built in an electronic apparatus according to the second embodiment of the present invention. FIG. 6 shows a rail member according to the second embodiment of the present invention as viewed from the direction of arrow B in FIG. In the following description, the same components as those shown in FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description is omitted.

図５に示したように、筐体２の上ケース８の内面８ａにメッキを施した上で、ガスケット４１を介してレール部材１９と上ケース８とを接触させることで、導通させることもできる。上ケース８の内面８ａはガスケット４１の上面４１ａと接触し、レール部材１９の上面１９ｄはガスケット４１の下面４１ｂと接触する。レール部材１９をメッキされた筐体２と電気的に接続させることでシールドし、電子部品１５から放出される電波がハーネス１８に移るのを防止することができる。   As shown in FIG. 5, after the inner surface 8a of the upper case 8 of the housing 2 is plated, the rail member 19 and the upper case 8 can be brought into contact with each other via the gasket 41 so as to be electrically connected. . The inner surface 8 a of the upper case 8 is in contact with the upper surface 41 a of the gasket 41, and the upper surface 19 d of the rail member 19 is in contact with the lower surface 41 b of the gasket 41. The rail member 19 is shielded by being electrically connected to the plated housing 2, and the radio wave emitted from the electronic component 15 can be prevented from moving to the harness 18.

この場合も、電子部品１５からハーネス１８を遠ざけることで、電子部品１５から放出される電波がハーネス１８に与える影響を少なくすることができる。   Also in this case, the influence of the radio wave emitted from the electronic component 15 on the harness 18 can be reduced by moving the harness 18 away from the electronic component 15.

図７は本発明の第３の実施形態に係る電子機器に内蔵される回路基板を示す斜視図である。第３の実施形態に係る電子機器では、レール部材３０が採用される。レール部材３０は、回路基板１３と固定されるとともに、回路基板１３のグランドと電気的に接続される。レール部材３０はハーネス１８を架設するための架設部３０ｄを有する。架設部３０ｄには上面３０ｅ、側壁３０ｆ、凹部３０ｇが設けられ、ハーネス１８はレール部材３０の側壁３０ｆに沿って凹部３０ｇに載置される。レール部材３０は、回路基板１３の上面１３ａとハーネス１８の載置される凹部３０ｇとが隔てられるように形成される。   FIG. 7 is a perspective view showing a circuit board built in an electronic apparatus according to the third embodiment of the present invention. In the electronic device according to the third embodiment, the rail member 30 is employed. The rail member 30 is fixed to the circuit board 13 and is electrically connected to the ground of the circuit board 13. The rail member 30 has an installation part 30d for installing the harness 18. The installation portion 30d is provided with an upper surface 30e, a side wall 30f, and a recess 30g, and the harness 18 is placed along the side wall 30f of the rail member 30 in the recess 30g. The rail member 30 is formed such that the upper surface 13a of the circuit board 13 and the recess 30g on which the harness 18 is placed are separated.

回路基板１３の上面１３ａには、メモリスロット３１が設けられ、メモリスロット３１にはメモリモジュール３２が差し込まれる。回路基板１３には様々な電子部品が実装され、中には、メモリスロット３１のように比較的寸法が高い部品もある。メモリスロット３１のような部品を跨いでハーネス１８を引き回すことは回路基板１３全体の高さが大きくなることにつながるため避けることが望ましい。また、部品レイアウト上の要請から、ハーネス１８を架設するレール部材３０を直線状に設けることができないこともある。そのような場合、図７に示すようにレール部材３０の一部に屈曲部３３を設けることで、メモリスロット３１を避けるようにレール部材３０を設置してハーネス１８を引き回すことができる。ハーネス１８は、レール部材３０の側壁３０ｆに沿って凹部３０ｇに載置される。また、ハーネス１８は押さえ部材３４によって、押さえられる。   A memory slot 31 is provided on the upper surface 13 a of the circuit board 13, and a memory module 32 is inserted into the memory slot 31. Various electronic components are mounted on the circuit board 13, and some components such as the memory slot 31 have relatively high dimensions. It is desirable to avoid routing the harness 18 across parts such as the memory slot 31 because the overall height of the circuit board 13 is increased. In addition, the rail member 30 for laying the harness 18 may not be provided in a straight line due to a requirement in component layout. In such a case, as shown in FIG. 7, by providing the bent portion 33 in a part of the rail member 30, the rail member 30 can be installed and the harness 18 can be routed so as to avoid the memory slot 31. The harness 18 is placed in the recess 30 g along the side wall 30 f of the rail member 30. Further, the harness 18 is pressed by the pressing member 34.

図７に示したような構造を採用することで、部品レイアウト等、設計上の自由度が増すことになる。この場合も、電子部品１５からハーネス１８を遠ざけることで、電子部品１５から放出される電波がハーネス１８に与える影響を少なくすることができる。   By adopting the structure as shown in FIG. 7, the degree of freedom in design such as component layout is increased. Also in this case, the influence of the radio wave emitted from the electronic component 15 on the harness 18 can be reduced by moving the harness 18 away from the electronic component 15.

以上の説明のように、本発明の各実施形態によれば、より少ないスペースで周囲から放出される電波が電線に与える影響を少なくすることの可能な電子機器を提供することができる。   As described above, according to each embodiment of the present invention, it is possible to provide an electronic device capable of reducing the influence of radio waves emitted from the surroundings on the electric wire in a smaller space.

本発明ではその主旨を逸脱しない範囲であれば、上記の実施形態に限定されるものではなく種々の変形が可能である。   The present invention is not limited to the above embodiment as long as it does not depart from the gist of the present invention, and various modifications are possible.

本発明の実施形態に係る電子機器を示す外観斜視図。1 is an external perspective view showing an electronic apparatus according to an embodiment of the present invention. 本発明の実施形態に係る電子機器の内部を示す断面図。Sectional drawing which shows the inside of the electronic device which concerns on embodiment of this invention. 本発明の実施形態に係る電子機器に内蔵される回路基板を示す斜視図。The perspective view which shows the circuit board incorporated in the electronic device which concerns on embodiment of this invention. 本発明の実施形態に係るレール部材を図３の矢印Ａの方向から見た図。The figure which looked at the rail member which concerns on embodiment of this invention from the direction of arrow A of FIG. 本発明の第２の実施形態に係る電子機器に内蔵される回路基板を示す斜視図。The perspective view which shows the circuit board built in the electronic device which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係るレール部材を図５の矢印Ｂの方向から見た図。The figure which looked at the rail member which concerns on the 2nd Embodiment of this invention from the direction of arrow B of FIG. 本発明の第３の実施形態に係る電子機器に内蔵される回路基板を示す斜視図。The perspective view which shows the circuit board incorporated in the electronic device which concerns on the 3rd Embodiment of this invention.

符号の説明Explanation of symbols

１…電子機器、２…筐体、３…ディスプレイユニット、４…ヒンジ部、８…上ケース、９…下ケース、１３…回路基板、１５…電子部品、１６…コネクタ、１８…ハーネス、１９…レール部材、１９ａ…脚部、１９ｂ…壁部、１９ｃ…下面、１９ｄ…架設部、１９ｅ…上面、１９ｆ…側壁、１９ｇ…凹部、３０…レール部材、３１…メモリスロット、３２…メモリモジュール、３３…屈曲部、３４…押さえ部材、４１…ガスケット DESCRIPTION OF SYMBOLS 1 ... Electronic device, 2 ... Housing | casing, 3 ... Display unit, 4 ... Hinge part, 8 ... Upper case, 9 ... Lower case, 13 ... Circuit board, 15 ... Electronic component, 16 ... Connector, 18 ... Harness, 19 ... Rail member, 19a ... Leg part, 19b ... Wall part, 19c ... Lower surface, 19d ... Installation part, 19e ... Upper surface, 19f ... Side wall, 19g ... Recess, 30 ... Rail member, 31 ... Memory slot, 32 ... Memory module, 33 ... Bent part, 34 ... Presser member, 41 ... Gasket

Claims (5)

筐体と、
筐体内に設けられるとともに、ノイズを発する電子部品が実装される回路基板と、
前記回路基板上に設けられるコネクタに接続されるハーネスと、
導電性を有するとともに、前記電子部品を覆うように前記回路基板上に設けられるレール部材と、を備え、
前記レール部材は、前記電子部品を覆う下面と反対側の面に前記ハーネスを架設するための架設部を有することを特徴とする電子機器。 A housing,
A circuit board that is provided in the housing and on which electronic components that generate noise are mounted;
A harness connected to a connector provided on the circuit board;
A rail member provided on the circuit board so as to cover the electronic component while having conductivity, and
The rail device has an erection part for erection of the harness on a surface opposite to a lower surface that covers the electronic component. 前記レール部材は、回路基板とネジ止めされるネジ穴を有する脚部を備え、前記レール部材はネジ止め箇所で回路基板のグランドと導通されることを特徴とする請求項１記載の電子機器。   The electronic device according to claim 1, wherein the rail member includes a leg portion having a screw hole screwed to the circuit board, and the rail member is electrically connected to a ground of the circuit board at a screwing position. 前記レール部材は前記架設部に凹部を有し、前記ハーネスは前記凹部に沿って架設されるとともに、前記ハーネスを押さえる押さえ部材を備えることを特徴とする請求項１記載の電子機器。   The electronic device according to claim 1, wherein the rail member has a recess in the installation portion, and the harness is provided along the recess and includes a pressing member that holds the harness. 前記レール部材の上面に導電面が設けられ、前記導電面は前記筐体内部に形成された導電層と接することを特徴とする請求項１記載の電子機器。   The electronic device according to claim 1, wherein a conductive surface is provided on an upper surface of the rail member, and the conductive surface is in contact with a conductive layer formed inside the housing. 前記回路基板上であって前記レール部材が設けられた領域の近傍に前記レール部材よりも高さの大きい部品が実装されるとともに、前記レール部材は前記部品を避けるように形成されることを特徴とする請求項１記載の電子機器。   A component having a height higher than that of the rail member is mounted on the circuit board in the vicinity of the region where the rail member is provided, and the rail member is formed so as to avoid the component. The electronic device according to claim 1.
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JP2010238745A (en) * 2009-03-30 2010-10-21 Toshiba Corp Electronic apparatus
JP2018066794A (en) * 2016-10-18 2018-04-26 株式会社リコー Image forming apparatus
JP2019145587A (en) * 2018-02-16 2019-08-29 パナソニックＩｐマネジメント株式会社 Electrical equipment and power distribution board
WO2023043380A1 (en) 2021-09-17 2023-03-23 Iskra, D.O.O. A capacitor power supply loss reduction circuit

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JP2010238745A (en) * 2009-03-30 2010-10-21 Toshiba Corp Electronic apparatus
JP2018066794A (en) * 2016-10-18 2018-04-26 株式会社リコー Image forming apparatus
JP2019145587A (en) * 2018-02-16 2019-08-29 パナソニックＩｐマネジメント株式会社 Electrical equipment and power distribution board
JP7203345B2 (en) 2018-02-16 2023-01-13 パナソニックＩｐマネジメント株式会社 Electrical equipment and distribution boards
WO2023043380A1 (en) 2021-09-17 2023-03-23 Iskra, D.O.O. A capacitor power supply loss reduction circuit

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