JP2009023031A - Blanking die - Google Patents

Blanking die Download PDF

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JP2009023031A
JP2009023031A JP2007187223A JP2007187223A JP2009023031A JP 2009023031 A JP2009023031 A JP 2009023031A JP 2007187223 A JP2007187223 A JP 2007187223A JP 2007187223 A JP2007187223 A JP 2007187223A JP 2009023031 A JP2009023031 A JP 2009023031A
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cutting edge
die
cutting
cutting blade
punching
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JP2007187223A
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Inventor
Tadashi Mitamura
正 三田村
Tadashi Kasai
忠 笠井
Tomomi Kunida
知己 國田
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KYB Corp
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Kayaba Industry Co Ltd
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Priority to JP2007187223A priority Critical patent/JP2009023031A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a blanking die maintaining sharpness of a cutting edge. <P>SOLUTION: The blanking die having the cutting edge 1 projected from a base material 2 is characterized in that a diamond-like carbon film 3 containing carbon as a main component is formed on the surface of the cutting edge. Chips and an adhesive produced in blanking then hardly adhere to the diamond-like carbon film 3. The degradation of sharpness of the cutting edge 9 associated with adhesion is thereby restrained to extend the service life of the cutting edge 9 and to increase the number of blanking. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、フィルムや紙のようなシート状部材を所定の形状に打ち抜く抜き型の改良に関するものである。   The present invention relates to an improvement of a punching die for punching a sheet-like member such as a film or paper into a predetermined shape.

シート状の部材を所定の形状に打ち抜く切刃を備えた抜き型として、用途に応じて種々の抜き型が使い分けられている。例えば、比較的厚みのあるシート部材を打ち抜く場合には、ベニヤ合板にSK材等の刃物を埋め込んだトムソン型が用いられ、一方、より高精度が要求される薄物の打ち抜きの場合には、基材にエッチングを施して切刃を形成するエッチングダイやこのエッチングダイの刃先をさらに鋭く研削加工したピナクルダイ、あるいはNCマシニングセンターにより基材から切刃を形成するNC彫刻刃型が用いられる。   Various punching dies are properly used depending on the application as a punching die provided with a cutting blade for punching a sheet-like member into a predetermined shape. For example, when punching a relatively thick sheet member, a Thomson type in which a cutting tool such as SK material is embedded in a veneer plywood is used. On the other hand, when punching a thin object that requires higher accuracy, An etching die that forms a cutting edge by etching a material, a pinnacle die obtained by further sharpening the cutting edge of the etching die, or an NC engraving blade type that forms a cutting edge from a substrate by an NC machining center are used.

しかしながら、従来の抜き型の切刃にあっては、紙、フィルム、銅箔、アルミ箔等及びこれらを接着剤を介して積層した積層シートを打ち抜く場合に、切り屑や接着剤が切刃の刃先近傍側面に凝着して、切刃の切れ味を悪くし、打ち抜き形状の精度の低下、切刃のメンテナンス頻度の増大という問題点があった。   However, in a conventional cutting blade, when cutting a paper, a film, a copper foil, an aluminum foil or the like and a laminated sheet obtained by laminating these with an adhesive, the chips and the adhesive are Adhering to the side surface in the vicinity of the cutting edge, there is a problem that the sharpness of the cutting edge is deteriorated, the accuracy of the punching shape is lowered, and the maintenance frequency of the cutting edge is increased.

本発明は、上記の問題点に鑑みてなされたものであり、切り屑や接着剤の凝着を抑制して切り味が低下しにくい切刃を備えた抜き型を提供することを目的とする。   This invention is made | formed in view of said problem, and it aims at providing the cutting die provided with the cutting blade which suppresses adhesion of a chip and an adhesive agent and a cutting quality does not fall easily. .

本発明は、基材から突出した切刃を備えた抜き型において、前記切刃の表面に炭素を主成分としたダイヤモンドライクカーボン膜を形成したことを特徴とする抜き型である。   The present invention is a punching die provided with a cutting blade protruding from a base material, wherein a diamond-like carbon film mainly composed of carbon is formed on the surface of the cutting blade.

本発明によると、抜き型の切刃表面にダイヤモンドライクカーボン膜を形成したので打ち抜き時の切り屑や接着剤が切刃に凝着しにくくなり、切刃の切れ味が低下しにくいという効果がある。   According to the present invention, since the diamond-like carbon film is formed on the surface of the cutting edge of the punching die, chips and adhesives at the time of punching are less likely to adhere to the cutting edge, and the sharpness of the cutting edge is unlikely to deteriorate. .

以下、本発明の実施形態を添付図面に基づいて説明する。図1は、抜き型の代表的な一例であるトムソン型の切刃部分の部分断面図である。   Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a partial cross-sectional view of a Thomson-type cutting blade portion which is a typical example of a punching die.

トムソン型は、板状の基材2、例えば、ベニア板などのような木製の合板、プラスチック製板、金属製板からなる基材2に抜き形状に対応した溝4を設け、その溝4に帯状の切刃(トムソン刃)1をはめ込んで固定したものである。基材2に溝4を形成する手段としては、レーザー光線によるレーザーカット法、エンドミルを用いるエンドミルカット法、ワイヤを用いるワイヤカット法等が採用される。   The Thomson type is provided with a groove 4 corresponding to a punched shape in a base material 2 made of a plate-like base material 2, for example, a wooden plywood such as a veneer board, a plastic plate, or a metal plate. A band-shaped cutting blade (Thomson blade) 1 is fitted and fixed. As means for forming the groove 4 in the substrate 2, a laser cut method using a laser beam, an end mill cut method using an end mill, a wire cut method using a wire, or the like is employed.

切刃1は、工具用炭素鋼SK材や機械構造用炭素鋼S45C等を用いて形成され、刃先のみならずその表面全体に渡り、本発明の要旨とするところである、炭素を主成分としたアモルファス構造体からなるダイヤモンドライクカーボン(以下、DLC)膜3を形成する。DLC膜3の厚さは、例えば3μm以下である。   The cutting blade 1 is formed using a carbon steel SK material for tools, a carbon steel S45C for machine structure, and the like, and has carbon as a main component over the entire surface as well as the cutting edge. A diamond-like carbon (hereinafter referred to as DLC) film 3 made of an amorphous structure is formed. The thickness of the DLC film 3 is, for example, 3 μm or less.

DLC膜3は、アンバランスマグネトロンスパッタ法(以下、「UBMスパッタ法」と称する)によって形成される。   The DLC film 3 is formed by an unbalanced magnetron sputtering method (hereinafter referred to as “UBM sputtering method”).

スパッタの原理は、図2に示すように、アルゴン等の不活性ガスを導入した真空中でターゲット41を陰極として陽極の間でグロー放電させてプラズマを形成し、このプラズマ中のイオンをターゲット41に衝突させてターゲット41の原子を弾き飛ばし、この原子をターゲット41と対向して配置されたワーク(切刃1)21上に堆積させて皮膜を形成するようになっている。   As shown in FIG. 2, the principle of sputtering is that a plasma is formed by glow discharge between anodes using a target 41 as a cathode in a vacuum in which an inert gas such as argon is introduced, and ions in the plasma are converted into ions in the target 41. The atoms of the target 41 are blown off by being collided with each other, and the atoms are deposited on the work (cutting blade 1) 21 disposed to face the target 41 to form a film.

UBMスパッタ法は、スパッタ蒸発源40a〜40dにターゲット41の中心部と周辺部で異なる磁気特性を有する磁場42、43が配置されて、プラズマを形成しつつ強力な磁場42により発生する磁力線の一部がワーク21の近傍に達し、ワーク21にバイアス電圧を印加することによって、ターゲット41を構成する物質がワーク21上に堆積される。   In the UBM sputtering method, magnetic fields 42 and 43 having different magnetic characteristics in the central portion and the peripheral portion of the target 41 are arranged in the sputter evaporation sources 40a to 40d, and one of the lines of magnetic force generated by the strong magnetic field 42 while forming plasma. When the part reaches the vicinity of the work 21 and a bias voltage is applied to the work 21, the material constituting the target 41 is deposited on the work 21.

図3は、UBMスパッタ装置50の基本構成を示す。真空チャンバ51に4つのスパッタ蒸発源40a〜40dが設けられ、その中央に配置された自公転式ワークテーブル56上にワーク21が置かれ、ワーク21にコーティングが行われる。スパッタ蒸発源40a〜40dには皮膜材料となる平板状ターゲットが取り付けられる。真空チャンバ51にはアルゴン等の不活性ガスとメタンガス等の炭化水素ガスが所定量充填される。   FIG. 3 shows a basic configuration of the UBM sputtering apparatus 50. Four sputter evaporation sources 40 a to 40 d are provided in the vacuum chamber 51, the work 21 is placed on a self-revolving work table 56 disposed at the center thereof, and the work 21 is coated. A flat target as a film material is attached to the sputter evaporation sources 40a to 40d. The vacuum chamber 51 is filled with a predetermined amount of an inert gas such as argon and a hydrocarbon gas such as methane gas.

スパッタ蒸発源40a、40cにはターゲットとしてグラファイトを使用し、スパッタ蒸発源40b、40dにはターゲットとして金属を使用する。   Sputter evaporation sources 40a and 40c use graphite as a target, and sputter evaporation sources 40b and 40d use metal as a target.

以上のように構成されて、次に作用について説明する。   Next, the operation will be described.

DLC膜3は、切刃として用いられる炭素鋼より低摩擦係数を備えている。したがって、このようなDLC膜3を切刃1の表面に形成することにより、打ち抜き時に生じる切り屑や接着剤を切刃1に凝着しにくくすることが可能となる。このため、凝着に伴う切刃1の切れ味の低下を抑制し、切刃1の寿命を延ばし、またはメンテナンスの頻度を低下させることができる。また、切刃の切れ味低下による抜き精度の悪化を抑制することができる。   The DLC film 3 has a lower coefficient of friction than carbon steel used as a cutting edge. Therefore, by forming such a DLC film 3 on the surface of the cutting blade 1, it becomes possible to make it difficult for chips and adhesives generated during punching to adhere to the cutting blade 1. For this reason, the fall of the sharpness of the cutting blade 1 accompanying adhesion can be suppressed, the lifetime of the cutting blade 1 can be extended, or the frequency of maintenance can be reduced. Further, it is possible to suppress the deterioration of the punching accuracy due to the sharpness reduction of the cutting blade.

なお、DLC膜3を切刃1表面に形成後、DLC膜3表面を研磨し、平滑化してもよい。この場合には、DLC膜3表面の平滑化により切り屑や接着剤の凝着が一層抑制され、低摩擦係数に伴う効果を一層高めることができる。   In addition, after forming the DLC film 3 on the surface of the cutting blade 1, the surface of the DLC film 3 may be polished and smoothed. In this case, the adhesion of chips and adhesives is further suppressed by smoothing the surface of the DLC film 3, and the effect associated with the low friction coefficient can be further enhanced.

図4は、抜き型の代表的な一例であるピナクルダイの切刃部分の部分断面図である。   FIG. 4 is a partial cross-sectional view of a cutting edge portion of a pinnacle die which is a typical example of a punching die.

ピナクルダイは、従来から行われているエッチングにより切刃を形成するエッチングダイの切刃の刃先の丸みを研削加工して鋭利にしたものであり、エッチングダイでは抜くことができなかった紙やフィルム等を抜くことができる。   The pinnacle die is formed by grinding the edge of the cutting edge of the etching die that forms the cutting edge by conventional etching and sharpening it. Paper and film that could not be removed by the etching die Etc. can be removed.

したがって、ピナクルダイにDLC膜3を形成する場合には、まず基材5にエッチング加工を施し、従来のエッチングダイ相当の形状を形成する。その後、刃先を研削して所定の形状及び切刃高さに加工してピナクルダイを形成する。次に、ピナクルダイの切刃6の表面にDLC膜7を前述したUBMスパッタ法等を用いて形成する。   Therefore, when the DLC film 3 is formed on the pinnacle die, the base material 5 is first etched to form a shape corresponding to a conventional etching die. Thereafter, the cutting edge is ground and processed into a predetermined shape and cutting edge height to form a pinnacle die. Next, the DLC film 7 is formed on the surface of the cutting edge 6 of the pinnacle die using the above-described UBM sputtering method or the like.

ピナクルダイの切刃6表面にDLC膜7を形成することにより、打ち抜き時に生じる切り屑や接着剤をDLC膜7に凝着しにくくすることが可能となる。このため、凝着に伴う切刃6の切れ味の低下を抑制し、切刃6の寿命を延ばし、またはメンテナンスの頻度を低下させることができる。また、切刃6の切れ味低下による抜き精度の悪化を抑制することができる。   By forming the DLC film 7 on the surface of the cutting edge 6 of the pinnacle die, it becomes possible to make it difficult for chips and adhesives generated during punching to adhere to the DLC film 7. For this reason, the fall of the sharpness of the cutting blade 6 accompanying adhesion can be suppressed, the lifetime of the cutting blade 6 can be extended, or the frequency of maintenance can be reduced. Further, it is possible to suppress the deterioration of the extraction accuracy due to the sharpness reduction of the cutting edge 6.

図5は、抜き型の代表的な一例である彫刻刃型の切刃部分の部分断面図である。   FIG. 5 is a partial cross-sectional view of a cutting blade portion of an engraving blade mold that is a typical example of a punching die.

彫刻刃型は、トムソン型に用いられる材料と同等の硬度を有するステンレス材を高速高精度のマシニングセンタを用いて切削加工し、切刃を形成したもので、抜き精度の向上と高耐久性とを両立することを目的とするものである。   The engraving blade mold is a stainless steel material that has the same hardness as the material used for the Thomson mold and is cut using a high-speed and high-precision machining center to form a cutting blade. The purpose is to achieve both.

彫刻刃型にDLC膜形成する場合には、まずステンレス基材8にマシニングセンタを用いて切削加工を施し、所定形状の切刃9を形成する。その後、切刃9の表面にDLC膜10を前述したUBMスパッタ法等を用いて形成する。   When the DLC film is formed on the engraving blade mold, first, the stainless steel substrate 8 is cut using a machining center to form a cutting blade 9 having a predetermined shape. Thereafter, the DLC film 10 is formed on the surface of the cutting edge 9 by using the UBM sputtering method described above.

彫刻刃型の切刃9表面にDLC膜10を形成することにより、打ち抜き時に生じる切り屑や接着剤をDLC膜10に凝着しにくくすることが可能となる。このため、凝着に伴う切刃9の切れ味の低下を抑制し、切刃9の寿命を延ばし、抜き数を増大することができる。また、切刃9の切れ味低下による抜き精度の悪化を抑制することができる。   By forming the DLC film 10 on the surface of the engraving blade-type cutting edge 9, it becomes possible to make it difficult for chips and adhesives generated during punching to adhere to the DLC film 10. For this reason, the fall of the sharpness of the cutting blade 9 accompanying adhesion can be suppressed, the lifetime of the cutting blade 9 can be extended, and the number of extraction can be increased. Further, it is possible to suppress the deterioration of the extraction accuracy due to the sharpness reduction of the cutting edge 9.

なお、これまでの説明で切刃表面にDLC膜3、7、10を形成したが、切刃表面にDLC膜3、7、10を形成後、DLC膜表面を研磨し、平滑化してもよい。この場合には、DLC膜表面の平滑化により切り屑や接着剤の凝着が一層抑制され、低摩擦係数に伴う効果を一層高めることができる。   In the above description, the DLC films 3, 7, and 10 are formed on the surface of the cutting edge. However, after the DLC films 3, 7, and 10 are formed on the surface of the cutting edge, the surface of the DLC film may be polished and smoothed. . In this case, the adhesion of chips and adhesives is further suppressed by smoothing the surface of the DLC film, and the effect associated with the low friction coefficient can be further enhanced.

本発明は上記の実施形態に限定されずに、その技術的な思想の範囲内において種々の変更がなしうることは明白である。   The present invention is not limited to the above-described embodiment, and it is obvious that various modifications can be made within the scope of the technical idea.

本発明は、シート状部材を所定形状に打ち抜く抜き型に利用できる。   The present invention can be used for a punching die for punching a sheet-like member into a predetermined shape.

本発明の実施形態を示し、トムソン型の切刃部分の部分断面図。The fragmentary sectional view of the Thomson type cutting edge part which shows embodiment of this invention. 同じくスパッタ法の原理を示す説明図。Explanatory drawing which similarly shows the principle of a sputtering method. 同じくUBMスパッタ装置の構成図。The block diagram of a UBM sputtering device similarly. ピナクルダイの切刃部分の部分断面図。The fragmentary sectional view of the cutting edge part of Pinnacle die. 彫刻刃型の切刃部分の部分断面図。The fragmentary sectional view of the cutting-blade part of an engraving blade type.

符号の説明Explanation of symbols

1 切刃
2 基材
3 DLC膜
4 溝
5 基材
6 切刃
7 DLC膜
8 ステンレス基材
9 切刃
10 DLC膜
DESCRIPTION OF SYMBOLS 1 Cutting blade 2 Base material 3 DLC film 4 Groove 5 Base material 6 Cutting blade 7 DLC film 8 Stainless steel base material 9 Cutting blade 10 DLC film

Claims (2)

基材から突出した切刃を備えた抜き型において、
前記切刃の表面に炭素を主成分としたダイヤモンドライクカーボン膜を形成したことを特徴とする抜き型。
In a die with a cutting blade protruding from the base material,
A cutting die characterized in that a diamond-like carbon film mainly composed of carbon is formed on the surface of the cutting edge.
前記切刃に形成したダイヤモンドライクカーボン膜を研磨することを特徴とする請求項1に記載の抜き型。   2. The die according to claim 1, wherein the diamond-like carbon film formed on the cutting edge is polished.
JP2007187223A 2007-07-18 2007-07-18 Blanking die Pending JP2009023031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007187223A JP2009023031A (en) 2007-07-18 2007-07-18 Blanking die

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JP2009023031A true JP2009023031A (en) 2009-02-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011173225A (en) * 2010-02-25 2011-09-08 Tsukatani Hamono Seisakusho:Kk Die cutter and method of manufacturing the same
JP2012061559A (en) * 2010-09-16 2012-03-29 Toyohashi Univ Of Technology Tool for machining fine hole, method of producing the same, and method of processing polymer film
WO2017179544A1 (en) * 2016-04-11 2017-10-19 株式会社江東彫刻 Punching device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011173225A (en) * 2010-02-25 2011-09-08 Tsukatani Hamono Seisakusho:Kk Die cutter and method of manufacturing the same
JP2012061559A (en) * 2010-09-16 2012-03-29 Toyohashi Univ Of Technology Tool for machining fine hole, method of producing the same, and method of processing polymer film
WO2017179544A1 (en) * 2016-04-11 2017-10-19 株式会社江東彫刻 Punching device
JPWO2017179544A1 (en) * 2016-04-11 2018-10-04 株式会社江東彫刻 Punching device

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