JP2009016388A - Original transfer device, exposure device, and method for manufacturing device - Google Patents

Original transfer device, exposure device, and method for manufacturing device Download PDF

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JP2009016388A
JP2009016388A JP2007173116A JP2007173116A JP2009016388A JP 2009016388 A JP2009016388 A JP 2009016388A JP 2007173116 A JP2007173116 A JP 2007173116A JP 2007173116 A JP2007173116 A JP 2007173116A JP 2009016388 A JP2009016388 A JP 2009016388A
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original
plate
substrate
holding
stage
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Japanese (ja)
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Akira Morohashi
明 諸橋
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Canon Inc
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Canon Inc
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the deterioration of the positioning accuracy of an original upon the transfer of the original. <P>SOLUTION: This original transfer device comprises a holding mechanism 20 for holding the original R, and a driving mechanism for moving the holding mechanism 20. The holding mechanism 20 comprises a first plate spring 101 having a first end 101a and a second end 101b, a second plate spring 102 having a first end 102a and a second end 102b, a base 8 for holding respective first ends of the first plate spring 101 and the second plate spring 102 so that the first plate spring 101 and the second plate spring 102 extend horizontally and in the directions opposite to each other, a first attracting portion 91 which is supported by the second end 101b of the first plate spring 101 so that it has flexibility of movement in the vertical direction and attracts the upper surface of the original R, and a second attracting portion 92 which is supported by the second end 102b of the second plate spring 102 so that it has flexibility of movement in the vertical direction and attracts the upper surface of the original R. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、原版搬送装置、該原版搬送装置を備える露光装置、および、該露光装置を用いてデバイスを製造するデバイス製造方法に関する。   The present invention relates to an original transport apparatus, an exposure apparatus including the original transport apparatus, and a device manufacturing method for manufacturing a device using the exposure apparatus.

半導体デバイス等のデバイスの製造のためのリソグラフィー工程において露光装置が使用される。露光装置は、原版ステージに保持された原版のパターンを投影光学系によって基板に投影して該基板を露光する。これによって、原版のパターンが基板上の感光剤に転写される。原版は、原版搬送機構によって原版ステージに提供され、および／または、原版ステージから回収される。   An exposure apparatus is used in a lithography process for manufacturing a device such as a semiconductor device. The exposure apparatus projects the pattern of the original held on the original stage onto the substrate by the projection optical system to expose the substrate. Thereby, the pattern of the original plate is transferred to the photosensitive agent on the substrate. The original is provided to the original stage by the original transport mechanism and / or collected from the original stage.

特許文献１には、基板の一方の面を吸着する第１保持部と、基板の他方の面に当接して基板を支持する第２保持部と、基板を吸着した第１保持部を前記第２保持部側に押し付ける手段とを備える基板保持機構が開示されている。特許文献１における基板とは、例えば、レチクル（原版）である。
特開２００５−１３６２８９号公報 In Patent Document 1, a first holding unit that sucks one surface of a substrate, a second holding unit that contacts the other surface of the substrate and supports the substrate, and a first holding unit that sucks the substrate are described in the above. 2) A substrate holding mechanism including means for pressing the holding unit side is disclosed. The substrate in Patent Document 1 is, for example, a reticle (original plate).
JP 2005-136289 A

予め位置決めされた原版を原版搬送装置によって原版ステージに提供する場合を考える。原版搬送機構は、その保持機構によって原版を保持し該保持機構を移動させることによって原版ステージの所定位置まで原版を搬送して原版ステージに渡す。この過程において、保持機構に対する原版の位置が変化したとすると、原版ステージに渡される段階で原版の位置決め精度が低下することになる。特許文献１には、原版の搬送の際における位置決め精度を考慮した具体的な構成は開示されていない。   Consider a case where a pre-positioned original is provided to an original stage by an original conveying device. The original conveyance mechanism holds the original by the holding mechanism and moves the original to a predetermined position of the original stage by moving the holding mechanism and delivers the original to the original stage. In this process, if the position of the original plate with respect to the holding mechanism is changed, the positioning accuracy of the original plate is lowered at the stage of passing to the original plate stage. Patent Document 1 does not disclose a specific configuration in consideration of positioning accuracy when the original is conveyed.

本発明は、上記の課題認識に基づいてなされたものであり、例えば、原版の搬送に起因した原版の位置決め精度の低下を低減することを目的とする。   The present invention has been made on the basis of the above-mentioned problem recognition, and an object of the present invention is, for example, to reduce a decrease in the positioning accuracy of the original plate due to the conveyance of the original plate.

本発明の１つの側面は、原版を搬送する原版搬送装置に係り、前記原版搬送装置は、前記原版を保持する保持機構と、前記保持機構を移動させる駆動機構とを備える。前記保持機構は、第１端および第２端を有する第１板バネと、第１端および第２端を有する第２板バネと、前記第１板バネおよび前記第２板バネが水平方向かつ互いに反対方向に延びるように前記第１板バネおよび前記第２板バネのそれぞれの第１端を支持するベースと、鉛直方向に移動の自由度を有するように前記第１板バネの第２端によって支持されて前記原版の上面を吸着する第１吸着部と、鉛直方向に移動の自由度を有するように前記第２板バネの第２端によって支持されて前記原版の上面を吸着する第２吸着部とを備える。   One aspect of the present invention relates to an original conveying apparatus that conveys an original, and the original conveying apparatus includes a holding mechanism that holds the original and a drive mechanism that moves the holding mechanism. The holding mechanism includes a first leaf spring having a first end and a second end, a second leaf spring having a first end and a second end, and the first leaf spring and the second leaf spring in a horizontal direction. A base that supports the first ends of the first leaf spring and the second leaf spring so as to extend in directions opposite to each other, and a second end of the first leaf spring so as to have a freedom of movement in the vertical direction. A first suction portion that is supported by the first suction portion and sucks the upper surface of the original plate; and a second suction portion that is supported by the second end of the second leaf spring so as to have a freedom of movement in the vertical direction. An adsorption part.

本発明によれば、例えば、原版の搬送に起因した原版の位置決め精度の低下を低減することができる。   According to the present invention, for example, a decrease in the positioning accuracy of the original plate due to the conveyance of the original plate can be reduced.

以下、添付図面を参照しながら本発明の好適な実施形態を説明する。   Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

図１は、本発明の好適な実施形態の露光装置の構成を模式的に示す図である。照明光学系１から出射された光束によって、不図示の位置決め機構によって位置決めされる原版ステージ２によって保持された原版（レチクル）Ｒが照明される。照明された原版Ｒのパターンは、投影光学系３によって基板Ｗに投影され、これによって基板Ｗが露光され、基板Ｗ上の感光剤に原版Ｒのパターンが転写される。基板Ｗは、不図示の位置決め機構によって位置決めされる基板ステージ４によって保持される。   FIG. 1 is a diagram schematically showing a configuration of an exposure apparatus according to a preferred embodiment of the present invention. An original (reticle) R held by an original stage 2 positioned by a positioning mechanism (not shown) is illuminated by a light beam emitted from the illumination optical system 1. The illuminated pattern of the original R is projected onto the substrate W by the projection optical system 3, whereby the substrate W is exposed, and the pattern of the original R is transferred to the photosensitive agent on the substrate W. The substrate W is held by the substrate stage 4 that is positioned by a positioning mechanism (not shown).

原版Ｒは、予備位置決めステージ５で位置決めされ、露光位置とは異なる原版受渡し位置に移動してきた原版ステージ２に対して、原版搬送装置６によって搬送される。原版ステージ２の原版保持部と予備位置決めステージ５の原版保持部は同じ高さを有するように構成または調整される。なお、図１では、原版ステージ２は露光位置にあり、原版交換時には−Ｙ方向に移動する。   The original R is positioned by the preliminary positioning stage 5 and conveyed by the original conveying device 6 to the original stage 2 that has moved to the original delivery position different from the exposure position. The original plate holding portion of the original plate stage 2 and the original plate holding portion of the preliminary positioning stage 5 are configured or adjusted to have the same height. In FIG. 1, the original stage 2 is in the exposure position and moves in the −Y direction when the original is replaced.

図２は、本発明の好適な実施形態の原版搬送装置６の概略構成を示す図である。原版搬送装置６は、原版を保持する保持機構２０と、保持機構２０を移動させる駆動機構７とを備える。   FIG. 2 is a diagram showing a schematic configuration of the original conveying device 6 according to a preferred embodiment of the present invention. The original transport device 6 includes a holding mechanism 20 that holds the original and a drive mechanism 7 that moves the holding mechanism 20.

図２に示す実施形態では、原版搬送装置６は、２つの保持機構２０を備える。２つの保持機構２０は、アーム３０の両端に配置されている。駆動機構７は、アーム３０を旋回および昇降させる機構を含む。駆動機構７の旋回機構の回転軸は、予備位置決めステージ５の原版保持部と原版ステージ２の原版保持部との中間点に位置する。駆動機構７がアーム３０を旋回させることによって、予備位置決めステージ５の原版保持部に置かれた原版を原版ステージ２の原版保持部に置くこと、および、原版ステージ２の原版保持部に置かれた原版を予備位置決めステージ５の原版保持部に置くことができる。１つの保持機構２０によって予備位置決めステージ５の原版保持部の上の原版を保持し、他の保持機構２０によって原版ステージ２の原版保持部の上の原版を保持してアーム３０を旋回させることによって２つの原版を入れ替えることができる。   In the embodiment shown in FIG. 2, the original transport device 6 includes two holding mechanisms 20. The two holding mechanisms 20 are disposed at both ends of the arm 30. The drive mechanism 7 includes a mechanism for turning and raising / lowering the arm 30. The rotation axis of the turning mechanism of the drive mechanism 7 is located at an intermediate point between the original holding unit of the preliminary positioning stage 5 and the original holding unit of the original stage 2. The drive mechanism 7 rotates the arm 30 to place the original placed on the original holding unit of the preliminary positioning stage 5 on the original holding unit of the original stage 2 and placed on the original holding unit of the original stage 2. The original can be placed on the original holder of the preliminary positioning stage 5. By holding the original on the original holding part of the preliminary positioning stage 5 by one holding mechanism 20 and holding the original on the original holding part of the original stage 2 by the other holding mechanism 20 and rotating the arm 30 You can swap the two originals.

図３は、原版搬送装置６の保持機構２０の概略構成を示す図である。保持機構２０は、第１板バネ１０１と、第２板バネ１０２と、ベース８と、第１吸着部９１と、第２吸着部９２とを含む。第１板バネ１０１は、第１端１０１ａおよび第２端１０１ｂを有する。第２板バネ１０２は、第１端１０２ａおよび第２端１０２ｂを有する。ベース８は、第１板バネ１０１および第２板バネ１０２が水平方向かつ互いに反対方向に延びるように第１板バネ１０１の第１端１０１ａ、第２板バネ１０２の１０２ａをそれぞれ第１凸部８１、第２凸部８２で支持する。   FIG. 3 is a diagram illustrating a schematic configuration of the holding mechanism 20 of the original transport device 6. The holding mechanism 20 includes a first leaf spring 101, a second leaf spring 102, a base 8, a first suction portion 91, and a second suction portion 92. The first leaf spring 101 has a first end 101a and a second end 101b. The second leaf spring 102 has a first end 102a and a second end 102b. The base 8 is configured so that the first end 101a of the first leaf spring 101 and the 102a of the second leaf spring 102 are the first convex portions so that the first leaf spring 101 and the second leaf spring 102 extend in the horizontal direction and in opposite directions to each other. 81 and the second convex part 82.

第１吸着部９１は、鉛直方向に移動の自由度を有するように第１板バネ１０１の第２端１０１ｂによって支持されて原版Ｒの上面を吸着する。第２吸着部９２は、鉛直方向に移動の自由度を有するように第２板バネ１０２の第２端１０２ｂによって支持されて原版Ｒの上面を吸着する。第１吸着部９１、第２吸着部９２は、水平方向に延びた板バネ１０１、１０２によって支持されているので、水平方向の移動の自由度が与えられていない。したがって、第１吸着部９１、第２吸着部９２によって吸着された原版Ｒは、鉛直方向には移動の自由度を有するが、水平方向には移動の自由度を有しないので、水平方向の位置決め精度が維持された状態で搬送される。   The first suction portion 91 is supported by the second end 101b of the first leaf spring 101 so as to have a degree of freedom of movement in the vertical direction and sucks the upper surface of the original plate R. The second suction part 92 is supported by the second end 102b of the second leaf spring 102 so as to have a degree of freedom of movement in the vertical direction and sucks the upper surface of the original R. Since the first suction portion 91 and the second suction portion 92 are supported by the leaf springs 101 and 102 extending in the horizontal direction, the degree of freedom of movement in the horizontal direction is not given. Therefore, the original plate R adsorbed by the first adsorbing unit 91 and the second adsorbing unit 92 has a degree of freedom of movement in the vertical direction but does not have a degree of freedom of movement in the horizontal direction. It is transported in a state where accuracy is maintained.

水平方向の位置決め精度を更に高く維持するために、第１吸着部９１、第２吸着部９２の水平方向における位置を規制しつつ第１吸着部９１、第２吸着部９２の鉛直方向における移動を許す第１ガイド１２１、第２ガイド１２２を更に備えることが好ましい。   In order to maintain higher positioning accuracy in the horizontal direction, the first suction portion 91 and the second suction portion 92 are moved in the vertical direction while restricting the positions of the first suction portion 91 and the second suction portion 92 in the horizontal direction. It is preferable to further include a first guide 121 and a second guide 122 that allow it.

第１吸着部９１および第２吸着部９２の鉛直方向における自由度は、例えば、原版Ｒに対してその上方から第１吸着部９１および第２吸着部９２が接近して原版Ｒに当接した際に原版Ｒに加わる衝撃の低減に寄与する。第１吸着部９１および第２吸着部９２の鉛直方向における自由度は、更に、後述の下面支持部１１と協働して原版Ｒを支持することにも寄与する。   The degree of freedom in the vertical direction of the first suction portion 91 and the second suction portion 92 is, for example, that the first suction portion 91 and the second suction portion 92 approach the original plate R from the upper side with respect to the original plate R, for example. This contributes to a reduction in impact applied to the original R. The degree of freedom in the vertical direction of the first suction portion 91 and the second suction portion 92 further contributes to supporting the original R in cooperation with the lower surface support portion 11 described later.

吸着部９１、９２は、例えば、セラミックス、金属、樹脂などで構成されうる。吸着部９１、９２による原版Ｒの吸着は、例えば、真空吸着、静電吸着によってなされうる。或いは、吸着部９１、９２は、ベルヌーイチャックを含んで構成されてもよい。吸着部９１、９２は、原版Ｒを保持していないときは、ベース８に着座している。   The adsorption portions 91 and 92 can be made of, for example, ceramics, metal, resin, or the like. The original R can be adsorbed by the adsorbing portions 91 and 92 by, for example, vacuum adsorption or electrostatic adsorption. Alternatively, the suction portions 91 and 92 may be configured to include a Bernoulli chuck. The suction portions 91 and 92 are seated on the base 8 when the original R is not held.

保持機構２０は、更に、原版Ｒの下面を支持する一対の下面支持部１１、１１を備えることが好ましい。一対の下面支持部１１、１１は、開閉機構１２によって開閉される。換言すると、一対の下面支持部１１、１１の間隔は、開閉機構１２によって調整される。下面支持部１１は、原版Ｒを吸着する機構を有することが好ましいが、有しなくてもよい。   The holding mechanism 20 preferably further includes a pair of lower surface support portions 11 and 11 that support the lower surface of the original R. The pair of lower surface support parts 11, 11 are opened and closed by an opening / closing mechanism 12. In other words, the distance between the pair of lower surface support portions 11, 11 is adjusted by the opening / closing mechanism 12. The lower surface support portion 11 preferably has a mechanism for adsorbing the original R, but may not have the mechanism.

下面支持部１１によって原版Ｒの下面が支持されている状態において、変形した第１板バネ１０１および第２板バネ１０２が復元力により第１吸着部９１および第２吸着部９２を原版Ｒに押し付ける。下面支持部１１は、ｙ方向における原版Ｒの位置を規制する機能をも有する。   In a state where the lower surface of the original plate R is supported by the lower surface support portion 11, the deformed first plate spring 101 and the second plate spring 102 press the first adsorption portion 91 and the second adsorption portion 92 against the original plate R by restoring force. . The lower surface support part 11 also has a function of regulating the position of the original R in the y direction.

保持機構２０は、原版Ｒの水平方向（ｘ方向）への移動を規制する規制部１３を更に備えることが好ましい。   The holding mechanism 20 preferably further includes a restricting portion 13 that restricts the movement of the original R in the horizontal direction (x direction).

図４は、本発明の好適な実施形態の原版搬送装置６によって原版ステージ２の上の原版Ｒを回収する手順を示す図である。なお、図４は、原版搬送装置６の大雑把な動作を説明することを目的とする図であるので、保持機構２０は、模式化されている。   FIG. 4 is a diagram showing a procedure for collecting the original R on the original stage 2 by the original conveying device 6 according to a preferred embodiment of the present invention. Note that FIG. 4 is a diagram for explaining the rough operation of the original transport device 6, and thus the holding mechanism 20 is schematically illustrated.

まず、図４（ａ）に示すように、一対の下面支持部１１が開いた状態で保持機構２０が下降を開始する。一対の下面支持部１１が開いた状態では、原版Ｒと下面支持部１１とが干渉しない。次いで、図４（ｂ）に示すように、吸着部９１、９２が原版Ｒの上面に当接し、この状態で吸着部９１、９２による原版Ｒの吸着が開始される。保持機構２０が更に下降すると、それにしたがって板バネ１０１、１０２が弾性変形する。保持機構２０は、下面支持部１１が原版Ｒの下面よりも低い位置に到達するまで下降する。この状態で、原版ステージ２による原版Ｒの吸着が停止される。次いで、図４（ｃ）に示すように、一対の下面支持部１１が閉じられる。次いで、図４（ｄ）に示すように、保持機構２０が上昇し、下面支持部１１が原版Ｒの下面と接触する。この状態では、第１板バネ１０１および第２板バネ１０２が復元力により第１吸着部９１および第２吸着部９２が前記原版に押し付ける。   First, as shown in FIG. 4A, the holding mechanism 20 starts to descend in a state where the pair of lower surface support portions 11 are opened. In the state where the pair of lower surface support portions 11 are opened, the original plate R and the lower surface support portion 11 do not interfere with each other. Next, as shown in FIG. 4B, the suction portions 91 and 92 are brought into contact with the upper surface of the original R, and in this state, the suction of the original R by the suction portions 91 and 92 is started. When the holding mechanism 20 is further lowered, the leaf springs 101 and 102 are elastically deformed accordingly. The holding mechanism 20 is lowered until the lower surface support portion 11 reaches a position lower than the lower surface of the original R. In this state, the adsorption of the original R by the original stage 2 is stopped. Next, as shown in FIG. 4C, the pair of lower surface support portions 11 are closed. Next, as shown in FIG. 4D, the holding mechanism 20 is raised and the lower surface support portion 11 comes into contact with the lower surface of the original plate R. In this state, the first and second leaf springs 101 and 102 are pressed against the original plate by the first suction portion 91 and the second suction portion 92 by the restoring force.

図５は、本発明の好適な実施形態の原版搬送装置６によって原版ステージ２の上に原版Ｒを提供する手順を示す図である。なお、図５は、原版搬送装置６の大雑把な動作を説明することを目的とする図であるので、保持機構２０は、模式化されている。   FIG. 5 is a diagram showing a procedure for providing the original R on the original stage 2 by the original conveying device 6 according to a preferred embodiment of the present invention. Note that FIG. 5 is a diagram for explaining the rough operation of the original transport device 6, and thus the holding mechanism 20 is schematically illustrated.

まず、図５（ａ）に示すように、原版Ｒを保持した保持機構２０が下降する。次いで、図５（ｂ）に示すように、原版Ｒが原版ステージ２の上に置かれ、原版ステージ２が原版Ｒの吸着を開始する。そして、更に板バネ１０１、１０２を変形させながら、下面支持部１１が原版Ｒの下面から離れるまで保持機構２０が下降する。この状態で、吸着部９１、９２による原版Ｒの吸着を停止する。次いで、図５（ｃ）に示すように、一対の下面支持部１１を開いた状態にする。次いで、図５（ｄ）に示すように、保持機構２０が上昇し、吸着部９１、９２がベース８に着座する。保持機構２０は、更に、駆動機構７によって保持機構２０を旋回させる位置まで上昇する。   First, as shown in FIG. 5A, the holding mechanism 20 holding the original R is lowered. Next, as shown in FIG. 5B, the original R is placed on the original stage 2 and the original stage 2 starts to adsorb the original R. Then, while further deforming the leaf springs 101 and 102, the holding mechanism 20 is lowered until the lower surface support portion 11 is separated from the lower surface of the original R. In this state, the adsorption of the original R by the adsorption units 91 and 92 is stopped. Next, as shown in FIG. 5C, the pair of lower surface support portions 11 are opened. Next, as shown in FIG. 5 (d), the holding mechanism 20 is raised, and the suction portions 91 and 92 are seated on the base 8. The holding mechanism 20 is further raised to a position where the holding mechanism 20 is turned by the driving mechanism 7.

以上のような原版ステージ２からの基板の回収および原版ステージへの基板の提供の手順は、予備位置決めステージ５からの基板の回収および予備位置決めステージ５への基板の提供についても同様である。   The procedures for recovering the substrate from the original stage 2 and providing the substrate to the original stage are the same for the recovery of the substrate from the preliminary positioning stage 5 and the provision of the substrate to the preliminary positioning stage 5.

図６および図７は、下面支持部１１と原版Ｒとの好ましい寸法関係を説明する図である。図６および図７において、一対の下面支持部１１、１１は閉じた状態である。原版Ｒのｙ方向の長さをＬｙ、一対の下面支持部１１のうち一方の先端から他方の根元までのｙ方向の距離をＡとすると、一対の下面支持部１１、１１が閉じた状態において、Ｌｙ＞Ａが満たされることが好ましい。このような寸法関係によれば、故障または電力遮断等によって吸着部９１、９２による原版Ｒの吸着が切れて、図７に例示すように原版Ｒがｙ方向に滑ったとしても、原版Ｒは下面支持部１１によって依然として支持されているため、落下することはない。   6 and 7 are views for explaining a preferable dimensional relationship between the lower surface support portion 11 and the original plate R. FIG. 6 and 7, the pair of lower surface support portions 11 and 11 are in a closed state. When the length of the original plate R in the y direction is Ly and the distance in the y direction from one tip of the pair of lower surface support portions 11 to the other root is A, the pair of lower surface support portions 11 and 11 are in a closed state. , Ly> A is preferably satisfied. According to such a dimensional relationship, even if the original R is absorbed by the adsorbing portions 91 and 92 due to failure or power interruption or the like, and the original R slides in the y direction as shown in FIG. Since it is still supported by the lower surface support part 11, it does not fall.

図８および図９は、下面支持部１１と原版Ｒとの好ましい寸法関係を説明する図である。原版Ｒのｘ方向の長さをＬｘ、規制部１３から当該側面支持部に最も遠い下面支持部１１までの距離をＢとすると、Ｌｘ＞Ｂが満たされることが好ましい。このような寸法関係によれば、故障または電力遮断等によって吸着部９１、９２による原版Ｒの吸着が切れて、図９に例示するように、原版ＲがＸ方向に滑ったとしても、原版Ｒは下面支持部１１によって依然として支持されているため、落下することはない。   8 and 9 are diagrams for explaining a preferable dimensional relationship between the lower surface support portion 11 and the original plate R. FIG. It is preferable that Lx> B is satisfied, where Lx is the length of the original plate R in the x direction and B is the distance from the restricting portion 13 to the lower surface support portion 11 farthest from the side surface support portion. According to such a dimensional relationship, even if the original R is attracted by the adsorbing portions 91 and 92 due to a failure or power interruption or the like and the original R slides in the X direction as illustrated in FIG. Since it is still supported by the lower surface support part 11, it does not fall.

図６ないし図９では、４個の下面支持部１１と４個の規制部１３が設けられているが、これらの個数は変更可能である。原版Ｒの各側面について、少なくとも１個ずつ下面支持部１１と規制部１３が設けられればよい。   In FIG. 6 to FIG. 9, four lower surface support portions 11 and four restricting portions 13 are provided, but the number of these can be changed. For each side surface of the original plate R, at least one lower surface support portion 11 and a restriction portion 13 may be provided.

また、図６ないし図９では、下面支持部１１がｙ方向の規制用、規制部１３がｘ方向の規制用に配置されているが、下面支持部１１がｘ方向の規制用、規制部１３がｙ方向の規制用に配置されてもよい。また、図１０に例示するように、規制部１３の機能を下面支持部１１に取り込んでもよい。   6 to 9, the lower surface support portion 11 is arranged for restriction in the y direction and the restriction portion 13 is arranged for restriction in the x direction. However, the lower surface support portion 11 is arranged for restriction in the x direction, and the restriction portion 13. May be arranged for restriction in the y direction. Further, as illustrated in FIG. 10, the function of the restricting portion 13 may be incorporated into the lower surface support portion 11.

次に上記の露光装置を利用したデバイス製造方法を説明する。図１１は、半導体デバイスの全体的な製造プロセスのフローを示す図である。ステップ１（回路設計）では半導体デバイスの回路設計を行う。ステップ２（レチクル作製）では設計した回路パターンに基づいてレチクル（原版またはマスクともいう）を作製する。一方、ステップ３（ウエハ製造）ではシリコン等の材料を用いてウエハ（基板ともいう）を製造する。ステップ４（ウエハプロセス）は前工程と呼ばれ、上記のレチクルとウエハを用いて、リソグラフィー技術によってウエハ上に実際の回路を形成する。次のステップ５（組み立て）は後工程と呼ばれ、ステップ４によって作製されたウエハを用いて半導体チップ化する工程であり、アッセンブリ工程（ダイシング、ボンディング）、パッケージング工程（チップ封入）等の組み立て工程を含む。ステップ６（検査）ではステップ５で作製された半導体デバイスの動作確認テスト、耐久性テスト等の検査を行う。こうした工程を経て半導体デバイスが完成し、これを出荷（ステップ７）する。   Next, a device manufacturing method using the above exposure apparatus will be described. FIG. 11 is a diagram showing a flow of an entire manufacturing process of a semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (reticle fabrication), a reticle (also referred to as an original or a mask) is fabricated based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacture), a wafer (also referred to as a substrate) is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the reticle and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

図１２は、上記ウエハプロセスの詳細なフローを示す図である。ステップ１１（酸化）ではウエハの表面を酸化させる。ステップ１２（ＣＶＤ）ではウエハ表面に絶縁膜を成膜する。ステップ１３（電極形成）ではウエハ上に電極を蒸着によって形成する。ステップ１４（イオン打込み）ではウエハにイオンを打ち込む。ステップ１５（ＣＭＰ）ではＣＭＰ工程によって絶縁膜を平坦化する。ステップ１６（レジスト処理）ではウエハに感光剤を塗布する。ステップ１７（露光）では上記の露光装置を使って、回路パターンが形成されたマスクを介し感光剤が塗布されたウエハを露光してレジストに潜像パターンを形成する。ステップ１８（現像）ではウエハ上のレジストに形成された潜像パターンを現像してレジストパターンを形成する。ステップ１９（エッチング）ではレジストパターンが開口した部分を通してレジストパターンの下にある層又は基板をエッチングする。ステップ２０（レジスト剥離）ではエッチングが済んで不要となったレジストを取り除く。これらのステップを繰り返し行うことによって、ウエハ上に多重に回路パターンを形成する。   FIG. 12 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (CMP), the insulating film is planarized by a CMP process. In step 16 (resist process), a photosensitive agent is applied to the wafer. In step 17 (exposure), the above exposure apparatus is used to expose the wafer coated with the photosensitive agent through the mask on which the circuit pattern is formed, thereby forming a latent image pattern on the resist. In step 18 (development), the latent image pattern formed on the resist on the wafer is developed to form a resist pattern. In step 19 (etching), the layer or substrate under the resist pattern is etched through the portion where the resist pattern is opened. In step 20 (resist stripping), the resist that has become unnecessary after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

本発明の好適な実施形態の露光装置の構成を模式的に示す図である。It is a figure which shows typically the structure of the exposure apparatus of suitable embodiment of this invention. 本発明の好適な実施形態の原版搬送装置６の概略構成を示す図である。It is a figure which shows schematic structure of the original conveying apparatus 6 of suitable embodiment of this invention. 原版搬送装置６の保持機構２０の概略構成を示す図である。FIG. 2 is a diagram illustrating a schematic configuration of a holding mechanism 20 of an original plate transport device 6. 本発明の好適な実施形態の原版搬送装置によって原版ステージの上の原版を回収する手順を示す図である。It is a figure which shows the procedure which collect | recovers the original on an original stage with the original conveying apparatus of suitable embodiment of this invention. 本発明の好適な実施形態の原版搬送装置によって原版ステージの上に原版を提供する手順を示す図である。It is a figure which shows the procedure which provides an original on the original stage by the original conveying apparatus of suitable embodiment of this invention. 下面支持部と原版との好ましい寸法関係を説明する図である。It is a figure explaining the preferable dimensional relationship of a lower surface support part and an original plate. 下面支持部と原版との好ましい寸法関係を説明する図である。It is a figure explaining the preferable dimensional relationship of a lower surface support part and an original plate. 下面支持部と原版との好ましい寸法関係を説明する図である。It is a figure explaining the preferable dimensional relationship of a lower surface support part and an original plate. 下面支持部と原版との好ましい寸法関係を説明する図である。It is a figure explaining the preferable dimensional relationship of a lower surface support part and an original plate. 下面支持部の他の構成例を示す図である。It is a figure which shows the other structural example of a lower surface support part. 半導体デバイスの製造プロセスのフローを示す図である。It is a figure which shows the flow of the manufacturing process of a semiconductor device. 半導体デバイスの製造プロセスのフローを示す図である。It is a figure which shows the flow of the manufacturing process of a semiconductor device.

符号の説明Explanation of symbols

１：照明光学系、２：原版ステージ、３：投影光学系，４：基板ステージ、５：予備位置決めステージ、６：原版搬送装置、７：駆動機構、８：ベース、９１：第１吸着部、９２：第２吸着部、１０１：第１板バネ、１０２：第２板バネ、１０１ａ、１０２ａ：第１端部、１０１ｂ、１０２ｂ：第２端部、１１：下面支持部、１２：開閉機構、１３：規制部、１２１：第１ガイド、１２２：第２ガイド、２０：保持機構、３０：アーム、８１：第１凸部、８２：第２凸部、Ｒ：原版、Ｗ：基板 1: illumination optical system, 2: original stage, 3: projection optical system, 4: substrate stage, 5: preliminary positioning stage, 6: original transport device, 7: drive mechanism, 8: base, 91: first suction unit, 92: 2nd adsorption | suction part, 101: 1st leaf | plate spring, 102: 2nd leaf | plate spring, 101a, 102a: 1st edge part, 101b, 102b: 2nd edge part, 11: Lower surface support part, 12: Opening-closing mechanism, 13: restriction part, 121: first guide, 122: second guide, 20: holding mechanism, 30: arm, 81: first convex part, 82: second convex part, R: original plate, W: substrate

Claims (8)

原版を搬送する原版搬送装置であって、
前記原版を保持する保持機構と、
前記保持機構を移動させる駆動機構とを備え、
前記保持機構は、
第１端および第２端を有する第１板バネと、
第１端および第２端を有する第２板バネと、
前記第１板バネおよび前記第２板バネが水平方向かつ互いに反対方向に延びるように前記第１板バネおよび前記第２板バネのそれぞれの第１端を支持するベースと、
鉛直方向に移動の自由度を有するように前記第１板バネの第２端によって支持されて前記原版の上面を吸着する第１吸着部と、
鉛直方向に移動の自由度を有するように前記第２板バネの第２端によって支持されて前記原版の上面を吸着する第２吸着部と、
を備えることを特徴とする原版搬送装置。 An original conveying device for conveying an original,
A holding mechanism for holding the original plate;
A drive mechanism for moving the holding mechanism;
The holding mechanism is
A first leaf spring having a first end and a second end;
A second leaf spring having a first end and a second end;
A base that supports the first ends of the first plate spring and the second plate spring so that the first plate spring and the second plate spring extend in a horizontal direction and in opposite directions to each other;
A first suction portion that is supported by the second end of the first leaf spring so as to have a degree of freedom of movement in the vertical direction and sucks the upper surface of the original plate;
A second suction part that is supported by the second end of the second leaf spring so as to have a degree of freedom of movement in the vertical direction and sucks the upper surface of the original plate;
An original conveying apparatus comprising: 前記原版の下面を支持する下面支持部を更に備えることを特徴とする請求項１に記載の原版搬送装置。   The original transport apparatus according to claim 1, further comprising a lower surface support portion that supports a lower surface of the original. 前記下面支持部によって前記原版の下面が支持されている状態において、前記第１板バネおよび前記第２板バネが復元力により前記第１吸着部および前記第２吸着部を前記原版に押し付ける、ことを特徴とする請求項２に記載の原版搬送装置。   The first leaf spring and the second leaf spring press the first suction portion and the second suction portion against the original plate with a restoring force in a state where the lower surface of the original plate is supported by the lower surface support portion. The original transport apparatus according to claim 2, wherein: 前記原版の水平方向への移動を規制する規制部を更に備えることを特徴とする請求項１ないし３のいずれか１項に記載の原版搬送装置。   The original conveying apparatus according to any one of claims 1 to 3, further comprising a restricting unit that restricts movement of the original in the horizontal direction. 前記第１吸着部および前記第２吸着部の水平方向における位置をそれぞれ規制しかつ前記第１吸着部および前記第２吸着部の鉛直方向における移動をそれぞれ許す第１および第２ガイドを更に備えることを特徴とする請求項１ないし４のいずれか１項に記載の原版搬送装置。   A first guide and a second guide for restricting positions of the first suction portion and the second suction portion in the horizontal direction and allowing movement of the first suction portion and the second suction portion in the vertical direction, respectively; The original transport apparatus according to any one of claims 1 to 4, wherein: 前記駆動機構は、前記保持機構を旋回および昇降させる機構を含む、ことを特徴とする請求項１ないし５のいずれか１項に記載の原版搬送装置。   The original transport apparatus according to claim 1, wherein the drive mechanism includes a mechanism for turning and lifting the holding mechanism. 原版のパターンを基板に投影し該基板を露光する露光装置であって、
前記原版を保持する原版ステージと、
前記原版のパターンを前記基板に投影する投影光学系と、
前記基板を保持する基板ステージと、
前記原版ステージへの前記原版の提供、および、前記原版ステージからの前記原版の回収の少なくとも一方を行うように構成された請求項１ないし６のいずれか１項に記載の原版搬送装置と、
を備えることを特徴とする露光装置。 An exposure apparatus that projects a pattern of an original plate onto a substrate and exposes the substrate,
An original stage holding the original, and
A projection optical system that projects the pattern of the original onto the substrate;
A substrate stage for holding the substrate;
The original transport apparatus according to any one of claims 1 to 6, configured to perform at least one of provision of the original to the original stage and recovery of the original from the original stage,
An exposure apparatus comprising: デバイス製造方法であって、
請求項７に記載の露光装置を用いて基板を露光する工程と、
該露光された基板を現像する工程と、
を含むことを特徴とするデバイス製造方法。 A device manufacturing method comprising:
A step of exposing the substrate using the exposure apparatus according to claim 7;
Developing the exposed substrate;
A device manufacturing method comprising:
JP2007173116A 2007-06-29 2007-06-29 Original transfer device, exposure device, and method for manufacturing device Withdrawn JP2009016388A (en)

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JP2014036023A (en) * 2012-08-07 2014-02-24 Nikon Corp Exposure method, manufacturing method for flat panel display, and manufacturing method for device
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CN104662481B (en) * 2012-08-07 2017-01-18 株式会社尼康 Exposure method, method for manufacturing flat-panel display, and method for manufacturing device
KR102206141B1 (en) * 2012-08-07 2021-01-21 가부시키가이샤 니콘 Exposure method, method for manufacturing flat-panel display, and method for manufacturing device
JP2019133192A (en) * 2019-04-26 2019-08-08 株式会社ニコン Object transportation device, exposure device, method of producing flat panel display, and method of producing device
JP7430074B2 (en) 2020-02-20 2024-02-09 株式会社荏原製作所 Substrate holding device

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