JP2009010212A - Heat sink structure - Google Patents

Heat sink structure Download PDF

Info

Publication number
JP2009010212A
JP2009010212A JP2007170827A JP2007170827A JP2009010212A JP 2009010212 A JP2009010212 A JP 2009010212A JP 2007170827 A JP2007170827 A JP 2007170827A JP 2007170827 A JP2007170827 A JP 2007170827A JP 2009010212 A JP2009010212 A JP 2009010212A
Authority
JP
Japan
Prior art keywords
heat
fluid inflow
heat sink
fin groups
receiving body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007170827A
Other languages
Japanese (ja)
Inventor
Hiroo Nagamoto
博夫 長本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2007170827A priority Critical patent/JP2009010212A/en
Publication of JP2009010212A publication Critical patent/JP2009010212A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain flexibility in arrangement including design by achieving uniform heat control of multiple heating elements. <P>SOLUTION: The heat sink structure is constituted by arranging first and second heat dissipation fin groups 12 and 13 which are provided with projecting heat dissipation fins 121 and 131 on a heat receiving element 10 across a fluid inflowing path 11 and part mounting parts 101 and 102 on which the heating elements 14 are mounted in response to the first and second heat dissipation fin groups 12 and 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、例えばアナログ式、デジタル式テレビ送信機、ＦＭ送信機、中波送信機等の電子機器の熱制御に用いるのに好適するヒートシンク構造に関する。   The present invention relates to a heat sink structure suitable for use in thermal control of electronic devices such as analog and digital television transmitters, FM transmitters, and medium wave transmitters.

一般に、電子機器には、電力増幅器等の多数の発熱体が収容配置されており、その発熱体で発熱した熱量を、ヒートシンクを用いて放熱することにより、発熱体を所望の温度に熱制御して、性能特性を得る方法が採られている。   In general, electronic devices contain a large number of heating elements such as power amplifiers, and the heat generated by the heating elements is dissipated using a heat sink, so that the heating elements are thermally controlled to a desired temperature. Thus, a method for obtaining performance characteristics is employed.

このようなヒートシンクは、発熱体が搭載される受熱体の部品搭載部に複数の放熱用フィンが所定の間隔に突設された放熱フィン群が配されて、十分な放熱面積を確保するように構成され、その部品搭載部上に搭載した発熱体からの熱量を、多数の放熱用フィンに熱移送して放熱することで、効率的な放熱効率を得ている。この際、ヒートシンクの複数の放熱用フィンには、空気等の流体が強制的に流されて、更に、その放熱効率が高められるように構成されている。   In such a heat sink, a heat radiating fin group in which a plurality of heat radiating fins project at a predetermined interval is arranged on the component mounting portion of the heat receiving body on which the heat generating body is mounted so as to ensure a sufficient heat radiating area. The heat dissipation from the heat generating element mounted on the component mounting portion is transferred to a large number of heat dissipating fins to dissipate heat, thereby obtaining efficient heat dissipation efficiency. At this time, a fluid such as air is forced to flow through the plurality of heat dissipating fins of the heat sink, and the heat dissipating efficiency is further improved.

ところが、上記ヒートシンクにあっては、受熱体の部品搭載部に多数の発熱体を並べて搭載した場合、放熱フィン群の放熱用フィンに流す流体の下流側に配置した発熱体が上流側に配した発熱体よい冷却効率が劣るために、その配置構成に制約を有するという問題を有する。   However, in the above heat sink, when a large number of heat generating elements are mounted side by side on the component mounting portion of the heat receiving element, the heat generating elements arranged on the downstream side of the fluid flowing through the heat dissipating fins of the heat dissipating fin group are arranged on the upstream side. Since the cooling efficiency of the heating element is inferior, there is a problem in that the arrangement configuration is limited.

そこで、複数の放熱用フィンに冷却風案内体を組付け配置して流体の流す方向の末端まで、冷却風を均一的に導いて安定した熱制御を行うように構成したものが提案されている（例えば、特許文献１参照。）。
特開２００３−２４３５８６号公報 Therefore, a configuration has been proposed in which cooling air guides are assembled and arranged on a plurality of heat dissipating fins and the cooling air is uniformly guided to the end in the direction in which the fluid flows to perform stable heat control. (For example, refer to Patent Document 1).
JP 2003-243586 A

しかしながら、上記ヒートシンクでは、放熱フィン群の多数の放熱用フィンに冷却風案内体を、組付け配置しなければならない構成上、その組立てを含む製作が面倒で、多数の発熱体を並列状に並べて搭載した配列構造に適用することが困難であるという問題を有する。   However, in the above heat sink, the cooling air guide body must be assembled and arranged on a large number of heat radiation fins of the heat radiation fin group, and the production including assembly is troublesome, and a large number of heat generating elements are arranged in parallel. There is a problem that it is difficult to apply to the mounted arrangement structure.

この発明は、上記の事情に鑑みてなされたもので、簡易な構成で、多数の発熱体の均一的な熱制御を実現して、設計を含む配置の自由を得られるようにしたヒートシンク構造を提供することを目的とする。   The present invention has been made in view of the above circumstances, and has a heat sink structure that achieves uniform thermal control of a large number of heating elements with a simple configuration and allows freedom of arrangement including design. The purpose is to provide.

この発明は、一方の面に複数の発熱体が並列状に搭載される部品搭載部が設けられ、他方の面に流体が供給される流体流入路が設けられた受熱体と、この受熱体の他方の面に設けられ、前記流体流入路をその流体入口側から流体流入方向に沿って幅狭とするように形成し、流体流入方向と直交する方向に配置される複数の放熱用フィンが突設された第１及び第２の放熱フィン群とを備えてヒートシンク構造を構成した。   The present invention provides a heat receiving body provided with a component mounting portion in which a plurality of heating elements are mounted in parallel on one surface, and provided with a fluid inflow path through which fluid is supplied to the other surface. A plurality of heat dissipating fins provided on the other surface, formed so as to narrow the fluid inflow path from the fluid inlet side along the fluid inflow direction, and arranged in a direction perpendicular to the fluid inflow direction. A heat sink structure was configured including the first and second radiating fin groups provided.

上記構成によれば、受熱体の部品搭載部に搭載された発熱体の熱は、第１及び第２の放熱フィン群の各放熱用フィンに熱移送され、この第１及び第２の放熱フィン群の各放熱用フィンに対して流体流入路に供給された流体が、該流体流入路から双方に均一的に分配されて導かれることにより、双方で同様に放熱される。   According to the above configuration, the heat of the heating element mounted on the component mounting portion of the heat receiving body is transferred to the heat dissipation fins of the first and second radiation fin groups, and the first and second radiation fins. The fluid supplied to the fluid inflow path with respect to each heat dissipating fin of the group is uniformly distributed and guided to both sides from the fluid inflow path, so that heat is radiated in the same manner on both sides.

これにより、受熱体の部品搭載部上に搭載した複数の発熱体を、その配置位置に制約を受けることなく、同様な温度条件に設定することが可能となる。従って、複数の発熱体の配置の自由が得られて、電子機器システムの設計の自由度の向上に寄与することが可能となる。   Thereby, it becomes possible to set the several heat generating body mounted on the component mounting part of a heat receiving body to the same temperature conditions, without receiving restrictions on the arrangement position. Therefore, the freedom of arrangement of the plurality of heating elements can be obtained, which can contribute to the improvement of the degree of freedom in designing the electronic device system.

以上述べたように、この発明によれば、簡易な構成で、多数の発熱体の均一的な熱制御を実現して、設計を含む配置の自由を得られるようにしたヒートシンク構造を提供することができる。   As described above, according to the present invention, it is possible to provide a heat sink structure that realizes uniform thermal control of a large number of heating elements with a simple configuration and can obtain freedom of arrangement including design. Can do.

以下、この発明の実施の形態について、図面を参照して詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、この発明の一実施の形態に係るヒートシンク構造を示すもので、ヒートシンクを構成する受熱体１０は、例えば銅等の金属材料で形成される。この受熱体１０の一方の面には、例えば略Ｖ字状の流体流入路１１が設けられ、この流体流入路１１は、その幅広側の端部から外部空気が供給される（図２参照）。   FIG. 1 shows a heat sink structure according to an embodiment of the present invention, and a heat receiving body 10 constituting the heat sink is formed of a metal material such as copper, for example. For example, a substantially V-shaped fluid inflow path 11 is provided on one surface of the heat receiving body 10, and external air is supplied to the fluid inflow path 11 from an end portion on the wide side (see FIG. 2). .

また、受熱体１０の一方の面には、第１及び第２の放熱フィン群１２，１３が上記流体流入路１１を挟んで設けられる。この第１及び第２の放熱フィン群１２，１３は、例えば複数の放熱用フィン１２１，１３１が、上記流体流入路１１に対して所定の間隔、且つ、略直交する方向に流路を形成するように並設されて形成され、上記流体流入路１１に空気が導かれると、該空気が分配供給される。この放熱用フィン１２１，１３１は、例えば板状、ピン状等に形成される。   Further, first and second radiating fin groups 12 and 13 are provided on one surface of the heat receiving body 10 with the fluid inflow path 11 interposed therebetween. In the first and second radiating fin groups 12 and 13, for example, the plurality of radiating fins 121 and 131 form a flow path in a direction substantially orthogonal to the fluid inflow path 11 at a predetermined interval. When air is guided to the fluid inflow path 11, the air is distributed and supplied. The heat radiation fins 121 and 131 are formed in a plate shape, a pin shape, or the like, for example.

上記受熱体１０の他方の面には、部品搭載部１０１，１０２が上記第１及び第２の放熱フィン群１２，１３に対応して上記流体流入路１１を挟んで設けられる（図２参照）。そして、この部品搭載部１０１，１０２には、電力増幅器等の複数の発熱体１４が、例えば１列づつ並べて搭載される。この部品搭載部１０１，１０２に配置した発熱体１４は、その駆動に伴う熱が、各列毎に第１の放熱フィン群１２の放熱用フィン１２１及び第２の放熱フィン群１３の放熱用フィン１３１に移送される。   On the other surface of the heat receiving body 10, component mounting portions 101 and 102 are provided so as to sandwich the fluid inflow passage 11 corresponding to the first and second radiating fin groups 12 and 13 (see FIG. 2). . A plurality of heating elements 14 such as power amplifiers are mounted in the component mounting portions 101 and 102, for example, one by one. The heat generating elements 14 arranged in the component mounting portions 101 and 102 have heat generated by driving the heat dissipating fins 121 of the first heat dissipating fin group 12 and the heat dissipating fins of the second heat dissipating fin group 13 for each row. It is transferred to 131.

上記構成により、流体流入路１１に供給された空気は、第１及び第２の放熱フィン群１２，１３に向けて分配され、各放熱用フィン１２１，１３１間に導かれることで、熱制御に供する空気の温度特性Ａが同一条件となる。この結果、各部品搭載部１０１，１０２に配置した発熱体１４は、第１及び第２の放熱フィン群１２，１３により均一的に熱制御される。   With the above configuration, the air supplied to the fluid inflow path 11 is distributed toward the first and second radiating fin groups 12 and 13 and guided between the radiating fins 121 and 131 for heat control. The temperature characteristic A of the supplied air is the same condition. As a result, the heating elements 14 arranged in the component mounting portions 101 and 102 are uniformly thermally controlled by the first and second radiating fin groups 12 and 13.

なお、空気を供給する空気供給手段としては、例えば空気取入側あるいは空気排気側の少なくとも一方にファンが設けられる。   As an air supply means for supplying air, for example, a fan is provided on at least one of the air intake side and the air exhaust side.

ここで、上記発熱体１４が部品搭載部１０１，１０２に搭載された受熱体１０の使用例について説明する。   Here, a usage example of the heat receiving body 10 in which the heating element 14 is mounted on the component mounting portions 101 and 102 will be described.

即ち、上記受熱体１０は、例えば図３に示すように複数個が機器筐体１５内に図示しない仕切り部材を用いて空気的に所望の間隙を有するように積重状に収容配置されて使用に供される。この場合、機器筐体１５には、例えば上端面に排気ファン１６が配置され、この排気ファン１６により、例えば機器筐体１１に設けた図示しない空気取入窓から外部空気が取り込まれて、各受熱体１０の流体流入路１１に外部空気が供給されるように構成される。   That is, for example, as shown in FIG. 3, a plurality of the heat receiving bodies 10 are housed and arranged in a stacked manner so as to have a desired gap in the air by using a partition member (not shown) in the device casing 15. To be served. In this case, for example, an exhaust fan 16 is disposed on the upper end surface of the device casing 15, and external air is taken in from an air intake window (not shown) provided in the device casing 11 by the exhaust fan 16. External air is configured to be supplied to the fluid inflow path 11 of the heat receiving body 10.

ここで、機器筐体１５内に取り込まれた外部空気は、各受熱体１０の流体流入路１１から第１及び第２の放熱フィン群１２，１３にそれぞれ分配されて各放熱用フィン１２１，１３１に供給され、同様の温度条件に設定される。これにより、各受熱体１０の部品搭載部１０１，１０２に搭載した発熱体１４は、上述したように各第１及び第２の放熱フィン群１２，１３の放熱用フィン１２１，１３１により均一的に熱制御される。   Here, the external air taken into the device casing 15 is distributed from the fluid inflow path 11 of each heat receiving body 10 to the first and second radiating fin groups 12, 13, respectively, and radiating fins 121, 131. And are set to similar temperature conditions. As a result, the heating elements 14 mounted on the component mounting portions 101 and 102 of the heat receiving bodies 10 are evenly distributed by the heat dissipating fins 121 and 131 of the first and second heat dissipating fin groups 12 and 13 as described above. Heat controlled.

なお、上記図３においては、排気ファン１６を用いて外部空気を取り込むように構成した場合について説明したが、これに限ることなく、その他、例えば空気取入側に吸気ファンを配して構成することも可能で、同様に有効な効果が期待される。   In addition, although the case where it comprised so that external air may be taken in using the exhaust fan 16 was demonstrated in the said FIG. 3, it does not restrict to this, For example, it arranges by arrange | positioning an intake fan, for example on the air intake side. It is also possible to expect effective effects as well.

このように、上記ヒートシンク構造は、受熱体１０に流体流入路１１を挟んで放熱用フィン１２１，１３１が突設された第１及び第２の放熱フィン群１２，１３を設けて、この第１及び第２の放熱フィン郡１２，１３に対応して発熱体１４を搭載する部品搭載部１０１，１０２を設けて構成した。   As described above, the heat sink structure is provided with the first and second radiating fin groups 12 and 13 in which the heat radiating fins 121 and 131 protrude from the heat receiving body 10 with the fluid inflow path 11 interposed therebetween. In addition, the component mounting portions 101 and 102 for mounting the heating element 14 are provided corresponding to the second radiating fin groups 12 and 13.

これによれば、受熱体１０の部品搭載部１０１，１０２に搭載した発熱体１４の熱は、第１及び第２の放熱フィン群１２，１３の各放熱用フィン１２１，１３１に熱移送され、この第１及び第２の放熱フィン群１２，１３の各放熱用フィン１２１，１３１に対して流体流入路１１に供給された空気が、該流体流入路１１から双方に均一的に分配されて導かれることにより、双方で同様に放熱することができる。   According to this, the heat of the heat generating body 14 mounted on the component mounting portions 101 and 102 of the heat receiving body 10 is transferred to the heat dissipating fins 121 and 131 of the first and second heat dissipating fin groups 12 and 13, The air supplied to the fluid inflow path 11 with respect to the heat radiating fins 121 and 131 of the first and second radiating fin groups 12 and 13 is uniformly distributed to the both sides from the fluid inflow path 11 and guided. As a result, heat can be dissipated in the same way on both sides.

この結果、受熱体１４の部品搭載部１０１，１０２上に搭載した複数の発熱体１４を、その配置位置に制約を受けることなく、同様な温度条件に設定することが可能となることにより、複数の発熱体１４の配置の自由が得られるため、その電子機器システムの設計の自由度の向上に寄与することが可能となる。   As a result, the plurality of heating elements 14 mounted on the component mounting portions 101 and 102 of the heat receiving body 14 can be set to the same temperature condition without being restricted by the arrangement positions thereof. Therefore, it is possible to contribute to an improvement in the degree of freedom in designing the electronic device system.

なお、上記実施の形態では、空気を流体流入路１１の一方から供給するように構成した場合について説明したが、これに限ることなく、その他、図４に示すように流体流入路１１ａの両端部から空気を供給するように構成してもよい。
但し、この図４においては、上記図１及び図２と同一部分について同一符号を付して、その詳細な説明を省略する。 In the above embodiment, the case where air is supplied from one side of the fluid inflow path 11 has been described. However, the present invention is not limited to this, and other end portions of the fluid inflow path 11a as shown in FIG. You may comprise so that air may be supplied from.
However, in FIG. 4, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

即ち、上記受熱体１０には、その一方の面に中間部が両端部より、幅狭な流体流入路１１ａが形成されると共に、流体流入路１１ａの形状に対応して第１及び第２の放熱フィン群１２ａ，１３ａの形状が、中間部が幅広に形成されて、両端が幅狭に形成される。これにより、流体流入路１１ａは、その両端から空気が供給されると、該空気が第１及び第２の放熱フィン群１２ａ，１３ａに均一的に分配して、部品搭載部１０１，１０２にそれぞれ搭載される発熱体１４（図４中では、図の都合上、図示せず、図１参照）の安定した熱制御を実現する。   That is, the heat receiving body 10 is formed with a fluid inflow passage 11a having a narrower intermediate portion than both end portions on one surface thereof, and the first and second corresponding to the shape of the fluid inflow passage 11a. The shape of the radiating fin groups 12a and 13a is formed such that the middle part is wide and both ends are narrow. As a result, when air is supplied from both ends of the fluid inflow path 11a, the air is uniformly distributed to the first and second radiating fin groups 12a and 13a, and is supplied to the component mounting portions 101 and 102, respectively. Stable thermal control of the mounted heating element 14 (in FIG. 4, not shown for convenience of illustration, see FIG. 1) is realized.

また、上記実施の形態では、第１及び第２の放熱フィン群１２，１３（１２ａ，１３ａ）に発熱体１４を１列配置するように構成した場合について説明したが、これに限ることなく、２列以上を配置するように構成することも可能である。   Moreover, although the said embodiment demonstrated the case where it comprised so that the heating element 14 may be arrange | positioned at 1st and 2nd radiation fin group 12, 13 (12a, 13a), it does not restrict to this, It is also possible to arrange to arrange two or more rows.

よって、この発明は、上記実施の形態に限ることなく、その他、実施段階ではその要旨を逸脱しない範囲で種々の変形を実施し得ることが可能である。さらに、上記実施の形態には、種々の段階の発明が含まれており、開示される複数の構成要件における適宜な組合せにより種々の発明が抽出され得る。   Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

例えば実施の形態に示される全構成要件から幾つかの構成要件が削除されても、発明が解決しようとする課題の欄で述べた課題が解決でき、発明の効果で述べられている効果が得られる場合には、この構成要件が削除された構成が発明として抽出され得る。   For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

この発明の一実施の形態に係るヒートシンク構造を説明するために示した構成図である。It is the block diagram shown in order to demonstrate the heat sink structure which concerns on one embodiment of this invention. 図１の外観構成を示した斜視図である。It is the perspective view which showed the external appearance structure of FIG. 図１の使用例を示した分解斜視図である。It is the disassembled perspective view which showed the usage example of FIG. この発明の他の実施の形態に係るヒートシンク構造の外観構成を示した斜視図である。It is the perspective view which showed the external appearance structure of the heat sink structure which concerns on other embodiment of this invention.

符号の説明Explanation of symbols

１０…受熱体、１０１，１０２…部品搭載部、１１，１１ａ…流体流入路、１２，１２ａ…第１の放熱フィン群、１２１…放熱用フィン、１３，１３ａ…第２の放熱フィン群、１３１…放熱用フィン、１４…発熱体、１５…機器筐体、１６…排気ファン。   DESCRIPTION OF SYMBOLS 10 ... Heat receiving body, 101, 102 ... Component mounting part, 11, 11a ... Fluid inflow path, 12, 12a ... 1st radiation fin group, 121 ... Radiation fin, 13, 13a ... 2nd radiation fin group, 131 ... heat dissipation fins, 14 ... heating elements, 15 ... equipment casing, 16 ... exhaust fan.

Claims (4)

一方の面に複数の発熱体が並列状に搭載される部品搭載部が設けられ、他方の面に流体が供給される流体流入路が設けられた受熱体と、
この受熱体の他方の面に設けられ、前記流体流入路をその流体入口側から流体流入方向に沿って幅狭とするように形成し、流体流入方向と直交する方向に配置される複数の放熱用フィンが突設された第１及び第２の放熱フィン群と、
を具備することを特徴とするヒートシンク構造。 A heat receiving body provided with a component mounting portion in which a plurality of heating elements are mounted in parallel on one surface, and provided with a fluid inflow path through which fluid is supplied to the other surface;
A plurality of heat dissipated in the direction perpendicular to the fluid inflow direction, formed on the other surface of the heat receiving body, so that the fluid inflow passage is narrowed from the fluid inlet side along the fluid inflow direction. First and second heat dissipating fin groups on which the fins are protruded;
A heat sink structure comprising: 前記第１及び第２の放熱フィン群が発熱体の配列に対応して設けられることを特徴とする請求項１記載のヒートシンク構造。   2. The heat sink structure according to claim 1, wherein the first and second radiating fin groups are provided corresponding to the arrangement of the heating elements. 前記流体流入路を前記受熱体の一端から他端にテ−パ状に形成するように前記第１及び第２の放熱フィン群を設置することを特徴とする請求項１記載のヒートシンク構造。   2. The heat sink structure according to claim 1, wherein the first and second radiating fin groups are installed so that the fluid inflow path is formed in a taper shape from one end to the other end of the heat receiving body. 前記流体流入路口が受熱体の両端部に設けられ、その中間部が次第に幅狭に形成するように前記第１及び第２の放熱フィン群を設置することを特徴とする請求項１記載のヒートシンク構造。 2. The heat sink according to claim 1, wherein the fluid inflow passage ports are provided at both ends of the heat receiving body, and the first and second heat dissipating fin groups are installed so that an intermediate portion thereof is gradually narrowed. Construction.
JP2007170827A 2007-06-28 2007-06-28 Heat sink structure Pending JP2009010212A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007170827A JP2009010212A (en) 2007-06-28 2007-06-28 Heat sink structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007170827A JP2009010212A (en) 2007-06-28 2007-06-28 Heat sink structure

Publications (1)

Publication Number Publication Date
JP2009010212A true JP2009010212A (en) 2009-01-15

Family

ID=40324999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007170827A Pending JP2009010212A (en) 2007-06-28 2007-06-28 Heat sink structure

Country Status (1)

Country Link
JP (1) JP2009010212A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012172650A1 (en) * 2011-06-15 2012-12-20 トヨタ自動車株式会社 Cooling structure for semiconductor element
JP2020092055A (en) * 2018-12-07 2020-06-11 株式会社小糸製作所 Lighting fixture unit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012172650A1 (en) * 2011-06-15 2012-12-20 トヨタ自動車株式会社 Cooling structure for semiconductor element
CN103597591A (en) * 2011-06-15 2014-02-19 丰田自动车株式会社 Cooling structure for semiconductor element
US8912645B2 (en) 2011-06-15 2014-12-16 Toyota Jidosha Kabushiki Kaisha Semiconductor element cooling structure
JPWO2012172650A1 (en) * 2011-06-15 2015-02-23 トヨタ自動車株式会社 Semiconductor device cooling structure
EP2722877A4 (en) * 2011-06-15 2015-06-17 Toyota Motor Co Ltd Cooling structure for semiconductor element
JP2020092055A (en) * 2018-12-07 2020-06-11 株式会社小糸製作所 Lighting fixture unit
JP7321701B2 (en) 2018-12-07 2023-08-07 株式会社小糸製作所 lighting unit

Similar Documents

Publication Publication Date Title
US6308771B1 (en) High performance fan tail heat exchanger
JPH053272A (en) Heatsink, heatsink apparatus and manufacture of heatsink
US20080055855A1 (en) Heat sink for electronic components
EP3441667B1 (en) Omni-directional, convectional, active heat sink and stage light using same
US11107749B2 (en) Heat dissipation fin structure and cooling structure for electric substrate using the same
JP2004228484A (en) Cooling device and electronic device
TWM528417U (en) Heat radiator that achieves low wind pressure requirement, low noise, and high performance with heat sink arrangement
JP2012060002A (en) Structure for cooling semiconductor element
JP2009010212A (en) Heat sink structure
JP2012004454A (en) Air cooling heat dissipation device
JPH1154680A (en) Heat sink and electronic device using the same
JPH10125836A (en) Heat sink cooling apparatus
JP4135960B2 (en) Heat sink cooling device
JP2010093034A (en) Cooling device for electronic component
JP7452979B2 (en) Heat sinks and cooling devices with heat sinks
JP2010123891A (en) Cooler
JP2005197454A (en) Cooler
CN112739156A (en) Heat dissipation module, radiator and power equipment
KR200228898Y1 (en) Heat sink
JP2016086018A (en) heat sink
JP2003007935A (en) Heat sink
JP2013229461A (en) Servo amplifier including heat sink with fins having wall thickness and pitch dependent on distance from heat source
CN218499489U (en) Radiator and radiating device
WO2023181481A1 (en) Cooling device
JP2009076704A (en) Fan motor with heat sink