JP2009002740A - Pressure sensor - Google Patents

Pressure sensor Download PDF

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JP2009002740A
JP2009002740A JP2007162623A JP2007162623A JP2009002740A JP 2009002740 A JP2009002740 A JP 2009002740A JP 2007162623 A JP2007162623 A JP 2007162623A JP 2007162623 A JP2007162623 A JP 2007162623A JP 2009002740 A JP2009002740 A JP 2009002740A
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pressure sensor
flexible substrate
elastic
pressure
protrusions
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Japanese (ja)
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Atsushi Sugawara
淳 菅原
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Toshiba Corp
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Toshiba Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor having improved durability with respect to repeated application of pressure. <P>SOLUTION: This pressure sensor is equipped with a first elastic substrate; a plurality of first projecting parts provided on the main surface of the first elastic substrate; a first flexible substrate, arranged on the main surface side of the first elastic substrate and having a plurality of first electrodes and a plurality of first hole parts; a second flexible substrate, arranged in a state of facing the first flexible substrate, and having a plurality of second electrodes and a plurality of second hole parts; and a second elastic substrate, arranged on the opposite surface side to the surface in the facing state to the first flexible substrate of the second flexible substrate. Each of the first projecting parts has each tip part penetrating the plurality of first hole parts, respectively close to or in contact with the second flexible substrate, and second projection parts have each tip part penetrating the plurality of second hole parts, respectively close to or in contact with the first flexible substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は，圧力センサに関する。   The present invention relates to a pressure sensor.

圧力の分布を測定できる圧力分布センサが用いられている。圧力分布センサは，自動車座席での着座圧力分布，寝たきり患者用ベッドでの体重分布，スポーツシューズの靴底圧力分布等の分布測定等の測定に利用される。また，ロボットハンドの手先での把持物保護やシャーシ外壁での衝突時保護などにも利用できる。   A pressure distribution sensor capable of measuring the pressure distribution is used. The pressure distribution sensor is used for measurement such as distribution measurement of seating pressure distribution in a car seat, weight distribution in a bed for a bedridden patient, shoe sole pressure distribution of sports shoes, and the like. It can also be used to protect the gripped object at the tip of the robot hand and to protect against collisions on the chassis outer wall.

圧力分布センサには，感圧インク方式，感圧ゴム方式，静電容量方式がある。感圧インク方式，感圧ゴム方式は，静電容量方式よりも普及しているが，素材の価格等に課題がある。静電容量方式はこれらの課題に関しては優れているが，まだ一般的に普及してはいない。なお，複数の感圧素子等を用いる圧力分布センサに関する技術が公開されている（特許文献１参照）。
特開２００６−２５０７０５号公報 The pressure distribution sensor includes a pressure-sensitive ink method, a pressure-sensitive rubber method, and a capacitance method. The pressure-sensitive ink method and the pressure-sensitive rubber method are more popular than the capacitance method, but there are problems with the price of the material. Capacitance methods are excellent in terms of these issues, but have not yet become popular. A technique related to a pressure distribution sensor using a plurality of pressure sensitive elements or the like has been disclosed (see Patent Document 1).
JP 2006-250705 A

ここで，圧力が繰り返し印加されることで，圧力センサが劣化する可能性がある。
上記に鑑み，本発明は耐久性を向上した圧力センサを提供することを目的とする。 Here, there is a possibility that the pressure sensor is deteriorated by repeatedly applying the pressure.
In view of the above, an object of the present invention is to provide a pressure sensor with improved durability.

本発明の一態様に係る圧力センサは，第１の弾性基板と，前記第１の弾性基板の主面に設けられた複数の第１の突起部と，前記第１の弾性基板の前記主面側に配置され，複数の第１の電極と，複数の第１の穴部と，を有する第１のフレキシブル基板と，前記第１のフレキシブル基板と対向して配置され，複数の第２の電極と，複数の第２の穴部と，を有する第２のフレキシブル基板と，前記第２のフレキシブル基板の前記第１のフレキシブル基板と対向する面とは反対の面側に配置される第２の弾性基板と，を具備し，前記第１の突起部は，前記複数の第１の穴部をそれぞれ貫通し，前記第２のフレキシブル基板と近接または接触する先端部分を有し，前記第２の突起部は，前記複数の第２の穴部をそれぞれ貫通し，前記第１のフレキシブル基板と近接または接触する先端部分を有する，ことを特徴とする。   A pressure sensor according to an aspect of the present invention includes a first elastic substrate, a plurality of first protrusions provided on a main surface of the first elastic substrate, and the main surface of the first elastic substrate. A first flexible substrate disposed on the side and having a plurality of first electrodes and a plurality of first holes, and a plurality of second electrodes disposed opposite the first flexible substrate. And a second flexible substrate having a plurality of second holes, and a second flexible substrate disposed on a surface of the second flexible substrate opposite to the surface facing the first flexible substrate. An elastic substrate, and each of the first protrusions has a tip portion that penetrates each of the plurality of first holes and is close to or in contact with the second flexible substrate. Protrusions pass through the plurality of second holes, respectively, and the first flexible Having a tip portion adjacent or contacting the plate, characterized in that.

本発明によれば，耐久性を向上した圧力センサを提供できる。   According to the present invention, a pressure sensor with improved durability can be provided.

以下，図面を参照して，本発明の実施の形態を詳細に説明する。
なお，以下の説明及び図面は，後述するカバー１７０の圧力Ｐを受ける面側を仮に上と定義した前提で行う。本発明の実施の形態に係る圧力センサは，その使用される方向に伴って，上下左右の関係が変化することは明らかである。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In the following description and drawings, the surface side that receives the pressure P of the cover 170 described later is assumed to be defined as the upper side. It is clear that the pressure sensor according to the embodiment of the present invention changes in the vertical and horizontal relations according to the direction in which the pressure sensor is used.

（第１の実施の形態）
図１は本発明の第１実施形態に係る圧力センサ１００を表す断面図である。
圧力センサ１００は，弾性体シート１１０，１２０，フレキシブル基板１３０，１４０，配線基板１５０，絶縁フィルム１６０，カバー１７０を有する。フレキシブル基板１３０，１４０がそれぞれ搭載された弾性体シート１１０，１２０が対向して配置される。弾性体シート１１０およびフレキシブル基板１３０，弾性体シート１２０およびフレキシブル基板１４０はそれぞれ，接着剤等によって接着される。
図２は，弾性体シート１１０を上面から見た状態を表す上面図である。この図には，後述の柱状突起１２２が配置される位置が表されている。
図３は，フレキシブル基板１３０，１４０，配線基板１５０を表す上面図である。 (First embodiment)
FIG. 1 is a sectional view showing a pressure sensor 100 according to the first embodiment of the present invention.
The pressure sensor 100 includes elastic sheets 110 and 120, flexible substrates 130 and 140, a wiring substrate 150, an insulating film 160, and a cover 170. The elastic sheets 110 and 120 on which the flexible substrates 130 and 140 are respectively mounted are arranged to face each other. The elastic sheet 110 and the flexible board 130, and the elastic sheet 120 and the flexible board 140 are bonded to each other by an adhesive or the like.
FIG. 2 is a top view illustrating a state in which the elastic sheet 110 is viewed from above. This figure shows a position where a columnar protrusion 122 described later is arranged.
FIG. 3 is a top view showing the flexible boards 130 and 140 and the wiring board 150.

弾性体シート１１０には，シリコンゴム等を使用でき，シート本体１１１，複数の柱状突起１１２，土手１１３を有する。
弾性体シート１２０には，シリコンゴム等を使用でき，シート本体１２１，複数の柱状突起１２２を有する。 Silicone rubber or the like can be used for the elastic sheet 110 and has a sheet body 111, a plurality of columnar protrusions 112, and a bank 113.
Silicone rubber or the like can be used for the elastic sheet 120 and has a sheet main body 121 and a plurality of columnar protrusions 122.

シート本体１１１，１２１にはそれぞれ，例えば，シリコンゴムを使用できる。またシリコンゴムの他，圧力印加時に変形する弾性体を用いる事ができる。シート本体１１１，１２１はそれぞれ，弾性基板として機能する。
柱状突起１１２，１２２はそれぞれ，シート本体１１１，１２１間の間隔（ギャップ）を保持するものであり，剛体でもよいが，弾性体であることが好ましい。
土手１１３は，弾性体シート１１０，１２０の周囲近傍で，シート本体１１１，１２１の間隔を保持するためのものであり，剛体でもよいが，弾性体であることが好ましい。 For example, silicon rubber can be used for the sheet bodies 111 and 121, respectively. In addition to silicon rubber, an elastic body that deforms when pressure is applied can be used. Each of the sheet main bodies 111 and 121 functions as an elastic substrate.
Each of the columnar protrusions 112 and 122 holds a gap (gap) between the sheet main bodies 111 and 121, and may be a rigid body, but is preferably an elastic body.
The bank 113 is for holding the space between the sheet main bodies 111 and 121 in the vicinity of the periphery of the elastic sheets 110 and 120, and may be a rigid body, but is preferably an elastic body.

シート本体１１１，柱状突起１１２，土手１１３は，一体的に形成されることが取り扱いの便宜上好ましい。同様に，シート本体１２１，柱状突起１２２も，一体的に形成されることが取り扱いの便宜上好ましい。   The sheet body 111, the columnar protrusion 112, and the bank 113 are preferably formed integrally for convenience of handling. Similarly, it is preferable that the sheet main body 121 and the columnar protrusion 122 are integrally formed for convenience of handling.

フレキシブル基板１３０は，ベースフィルム１３１，走査電極１３２，スルーホール１３３を有する。
ベースフィルム１３１上に短冊（矩形）状の走査電極１３２が複数並行に配置される。ベースフィルム１３１の走査電極１３２の間に，スルーホール１３３が配置される。スルーホール１３３を柱状突起１１２が貫通する。 The flexible substrate 130 has a base film 131, a scanning electrode 132, and a through hole 133.
A plurality of strip (rectangular) scanning electrodes 132 are arranged in parallel on the base film 131. A through hole 133 is disposed between the scanning electrodes 132 of the base film 131. The columnar protrusion 112 passes through the through hole 133.

フレキシブル基板１４０は，ベースフィルム１４１，検出電極１４２，スルーホール１４３を有する。
ベースフィルム１４１上に短冊（矩形）状の検出電極１４２が複数並行に配置される。ベースフィルム１４１の検出電極１４２の間に，スルーホール１４３が配置される。スルーホール１４３を柱状突起１２２が貫通する。 The flexible substrate 140 has a base film 141, a detection electrode 142, and a through hole 143.
A plurality of strip (rectangular) detection electrodes 142 are arranged in parallel on the base film 141. A through hole 143 is disposed between the detection electrodes 142 of the base film 141. The columnar protrusion 122 passes through the through hole 143.

走査電極１３２，検出電極１４２はそれぞれ，第１，第２の電極として機能し，金属等の導電膜を利用できる。即ち，ベースフィルム１３１，１４１上に，導電膜を形成し，走査電極１３２，検出電極１４２とすることができる。なお，導電膜に換えて，例えば，導電性繊維を走査電極１３２，検出電極１４２として利用することも可能である。   The scan electrode 132 and the detection electrode 142 function as first and second electrodes, respectively, and a conductive film such as metal can be used. That is, a conductive film can be formed on the base films 131 and 141 to form the scanning electrode 132 and the detection electrode 142. Instead of the conductive film, for example, conductive fibers can be used as the scanning electrode 132 and the detection electrode 142.

走査電極１３２と検出電極１４２が間隔を有して交差している。柱状突起１１２，１２２によって，この交差部の間隔（ギャップ）が保持されることで，コンデンサ（静電容量）が形成される。   The scan electrode 132 and the detection electrode 142 intersect each other with an interval. Capacitors (capacitance) are formed by maintaining the interval (gap) between the intersections by the columnar protrusions 112 and 122.

配線基板１５０は，ベースフィルム１５１，引き出し配線１５２，シールド電極１５３，１５４を有し，走査電極１３２，検出電極１４２から配線を引き出す。
シールド電極１５３，１５４は，引き出し配線１５２をノイズから保護する。 The wiring board 150 has a base film 151, lead-out wiring 152, and shield electrodes 153 and 154, and leads out from the scanning electrode 132 and the detection electrode 142.
The shield electrodes 153 and 154 protect the lead-out wiring 152 from noise.

フレキシブル基板１３０，１４０，配線基板１５０は，一体的に形成され，図３の一点鎖線（Ａ−Ａ）で折り曲げることで，フレキシブル基板１３０，１４０が対向される。このとき，シールド電極１５３，１５４も一点鎖線（Ａ−Ａ，Ｂ−Ｂ）で折り曲げられ，引き出し配線１５２の裏表に被される。   The flexible boards 130 and 140 and the wiring board 150 are integrally formed, and the flexible boards 130 and 140 are opposed to each other by being bent along a one-dot chain line (AA) in FIG. At this time, the shield electrodes 153 and 154 are also bent along the alternate long and short dash lines (AA, BB) and covered on the back and front of the lead-out wiring 152.

絶縁フィルム１６０は，走査電極１３２，検出電極１４２の電気的短絡を防ぐための膜であり，例えば，ポリエチレンを用いることができる。
カバー１７０は，例えば，厚さが１００μｍのシリコンゴム等シートを用いることが可能であり，弾性体シート１１０，１２０，フレキシブル基板１３０，１４０を覆う。 The insulating film 160 is a film for preventing an electrical short circuit between the scanning electrode 132 and the detection electrode 142, and for example, polyethylene can be used.
For example, the cover 170 may be a sheet of silicon rubber or the like having a thickness of 100 μm, and covers the elastic sheets 110 and 120 and the flexible substrates 130 and 140.

圧力センサ１００では，柱状突起１１２，１２２の先端が互いに対向するフレキシブル基板１３０，１４０を押さえ，弾性体シート１１０，１２０とフレキシブル基板１３０，１４０を固定する接着剤が経年変化で剥がれることを防止する。フレキシブル基板１３０と弾性体シート１１０間での接着力が弱まったとしても，外部圧力の印加時に柱状突起１１２，１２２がフレキシブル基板１３０，１４０を押し込むことで，弾性体シート１１０，１２０とフレキシブル基板１３０，１４０の剥がれを防止できる。その結果，静電容量の経年変化を低減できる。   In the pressure sensor 100, the tips of the columnar protrusions 112 and 122 press the flexible substrates 130 and 140 facing each other, and the adhesive that fixes the elastic sheets 110 and 120 and the flexible substrates 130 and 140 is prevented from being peeled off over time. . Even if the adhesive force between the flexible substrate 130 and the elastic sheet 110 is weakened, the columnar protrusions 112 and 122 push the flexible substrates 130 and 140 when an external pressure is applied, so that the elastic sheets 110 and 120 and the flexible substrate 130 are pressed. 140 can be prevented from peeling off. As a result, the secular change in capacitance can be reduced.

本実施形態では，図２に示すように，柱状突起１１２，１２２が一直線の列をなすように交互に配置される。このようにすることにより，後述する第２の実施形態よりも柔軟な構造となる。   In this embodiment, as shown in FIG. 2, the columnar protrusions 112 and 122 are alternately arranged so as to form a straight line. By doing in this way, it becomes a flexible structure rather than 2nd Embodiment mentioned later.

（比較例）
図４は，本発明の比較例に係る圧力センサ１００ｘを表す断面図である。
圧力センサ１００ｘは，弾性体シート１１０，１２０ｘ，フレキシブル基板１３０，１４０ｘ，配線基板１５０，絶縁フィルム１６０，カバー１７０を有する。弾性体シート１１０およびフレキシブル基板１３０，弾性体シート１２０ｘおよびフレキシブル基板１４０ｘはそれぞれ，接着剤等によって接着される。 (Comparative example)
FIG. 4 is a cross-sectional view showing a pressure sensor 100x according to a comparative example of the present invention.
The pressure sensor 100x includes elastic sheets 110 and 120x, flexible substrates 130 and 140x, a wiring substrate 150, an insulating film 160, and a cover 170. The elastic sheet 110 and the flexible substrate 130, the elastic sheet 120x, and the flexible substrate 140x are bonded to each other by an adhesive or the like.

図５は，圧力センサ１００ｘの弾性体シート１１０を上面から見た状態を表す上面図である。
図６は，圧力センサ１００ｘのフレキシブル基板１３０，１４０ｘ，配線基板１５０を表す上面図である。 FIG. 5 is a top view illustrating a state in which the elastic sheet 110 of the pressure sensor 100x is viewed from above.
FIG. 6 is a top view showing the flexible boards 130 and 140x and the wiring board 150 of the pressure sensor 100x.

弾性体シート１２０ｘは，第１の実施形態に係る弾性体シート１２０と異なり，柱状突起１２２を有しない。また，フレキシブル基板１４０ｘは，第１の実施形態に係るフレキシブル基板１４０と異なり，スルーホール１４３を有しない。
即ち，圧力センサ１００Ｘでは，フレキシブル基板１３０を押圧する柱状突起１２２に対応する構造体が存在しない。このため，圧力センサ１００ｘへの圧力印加の繰り返しにより，弾性体シート１１０とフレキシブル基板１３０間の接着が剥がれる可能性がある。 Unlike the elastic sheet 120 according to the first embodiment, the elastic sheet 120x does not have the columnar protrusion 122. Further, unlike the flexible substrate 140 according to the first embodiment, the flexible substrate 140x does not have the through hole 143.
That is, in the pressure sensor 100X, there is no structure corresponding to the columnar protrusion 122 that presses the flexible substrate 130. For this reason, the adhesion between the elastic sheet 110 and the flexible substrate 130 may be peeled off due to repeated application of pressure to the pressure sensor 100x.

これに対して，圧力センサ１００では，フレキシブル基板１３０に柱状突起１２２の先端が近接または接触している。圧力センサ１００に圧力を印加すると，弾性体シート１１０およびフレキシブル基板１３０が柱状突起１２２によって押圧される。このため，弾性体シート１１０およびフレキシブル基板１３０間に圧力が印加され，これらの間の接着が剥がれることが防止される。   On the other hand, in the pressure sensor 100, the tip of the columnar protrusion 122 is close to or in contact with the flexible substrate 130. When pressure is applied to the pressure sensor 100, the elastic sheet 110 and the flexible substrate 130 are pressed by the columnar protrusions 122. For this reason, pressure is applied between the elastic sheet 110 and the flexible substrate 130, and the adhesion between them is prevented from peeling off.

なお，柱状突起１２２は，フレキシブル基板１３０に必ずしも常時接触している必要はない。圧力センサ１００に圧力を印加していないときに，柱状突起１２２がフレキシブル基板１３０から離間し，圧力を印加したときに，柱状突起１２２がフレキシブル基板１３０に接触，押圧すれば足りる。柱状突起１１２とフレキシブル基板１４０においてもこの関係は成立する。   Note that the columnar protrusion 122 is not necessarily in contact with the flexible substrate 130 at all times. When no pressure is applied to the pressure sensor 100, the columnar protrusion 122 is separated from the flexible substrate 130, and when the pressure is applied, the columnar protrusion 122 only needs to contact and press the flexible substrate 130. This relationship is also established between the columnar protrusion 112 and the flexible substrate 140.

（圧力センサの製造）
圧力センサ１００の製造方法を説明する。
（１）弾性体シート１１０，１２０，フレキシブル基板１３０，１４０の作成
弾性体シート１１０，１２０をそれぞれ一体的に作成する。また，フレキシブル基板１３０，１４０をそれぞれ作成する。 (Manufacture of pressure sensors)
A method for manufacturing the pressure sensor 100 will be described.
(1) Creation of Elastic Sheets 110 and 120 and Flexible Substrates 130 and 140 The elastic sheets 110 and 120 are respectively created integrally. In addition, flexible substrates 130 and 140 are respectively created.

（２）弾性体シート１１０とフレキシブル基板１３０，弾性体シート１２０とフレキシブル基板１４０の接着（図７〜図１０）
弾性体シート１１０に接着剤ＡＤを塗布し，フレキシブル基板１３０と接着する（図７，図８）。弾性体シート１２０に接着剤ＡＤを塗布し，フレキシブル基板１４０と接着する（図９，図１０）。 (2) Adhesion of elastic body sheet 110 and flexible substrate 130, elastic body sheet 120 and flexible substrate 140 (FIGS. 7 to 10)
An adhesive AD is applied to the elastic sheet 110 and bonded to the flexible substrate 130 (FIGS. 7 and 8). An adhesive AD is applied to the elastic sheet 120 and bonded to the flexible substrate 140 (FIGS. 9 and 10).

（３）弾性体シート１１０，１２０，絶縁フィルム１６０，カバー１７０の接続（図１１）
フレキシブル基板１３０，１４０がそれぞれ接着された弾性体シート１１０，１２０を対向させ，その間に絶縁フィルム１６０を挟み，カバー１７０を被せる。この結果，圧力センサ１００が形成される。 (3) Connection of the elastic sheets 110 and 120, the insulating film 160, and the cover 170 (FIG. 11)
The elastic sheets 110 and 120 to which the flexible substrates 130 and 140 are bonded are opposed to each other, the insulating film 160 is sandwiched therebetween, and the cover 170 is covered. As a result, the pressure sensor 100 is formed.

（圧力の検知）
図１２は，圧力Ｐが印加された圧力センサ１００を表す断面図である。
例えば人間の指で圧力センサ１００に圧力Ｐを印加する。圧力Ｐによって，弾性体シート１１０，１２０が撓み，弾性体シート１１０，１２０の間隔が部分的に変化する。即ち，走査電極１３２，検出電極１４２の交差部の間隔が狭まり，走査電極１３２，検出電極１４２によって構成されるコンデンサの静電容量を変化する。この静電容量Ｃの変化量を読み取ることで，圧力Ｐが検出される。 (Pressure detection)
FIG. 12 is a cross-sectional view showing the pressure sensor 100 to which the pressure P is applied.
For example, the pressure P is applied to the pressure sensor 100 with a human finger. The elastic sheets 110 and 120 are bent by the pressure P, and the interval between the elastic sheets 110 and 120 is partially changed. That is, the interval between the scanning electrode 132 and the detection electrode 142 is narrowed, and the capacitance of the capacitor formed by the scanning electrode 132 and the detection electrode 142 is changed. By reading the change amount of the capacitance C, the pressure P is detected.

図１３は，圧力センサ１００の静電容量を検出するための回路構成を表す模式図である。
信号源Ｖで発生した交流電圧（例えば，１００Ｈｚの正弦波）が，選択用のアナログＳＷを通じて，走査電極１３２に順次に（一本ずつ）印加される。この交流電圧は，走査電極１３２と検出電極１４２間の交差部の静電容量Ｃを介して，検出電極１４２に伝わり，容量検出回路１８０に入力される。容量検出回路１８０は，静電容量Ｃをデジタル出力する回路である。容量検出回路１８０からの出力をデータ収集部１９０で収集することで，圧力Ｐの分布をデジタル量として計測することができる。 FIG. 13 is a schematic diagram illustrating a circuit configuration for detecting the capacitance of the pressure sensor 100.
An alternating voltage (for example, a 100 Hz sine wave) generated by the signal source V is sequentially (one by one) applied to the scan electrodes 132 through the analog SW for selection. This AC voltage is transmitted to the detection electrode 142 via the electrostatic capacitance C at the intersection between the scanning electrode 132 and the detection electrode 142 and is input to the capacitance detection circuit 180. The capacitance detection circuit 180 is a circuit that digitally outputs the capacitance C. By collecting the output from the capacitance detection circuit 180 by the data collection unit 190, the distribution of the pressure P can be measured as a digital quantity.

図１４は，容量検出回路１８０の内部構成の一例を表す回路図である。
容量検出回路１８０は，ＣＶ（容量−電圧）変換回路１８１，整流回路１８２，ＡＤ変換回路１８３を有する。
ＣＶ変換回路１８１は，容量を電圧に変換する（静電容量Ｃの変化によるインピーダンス変化を電圧変化に変換する）回路であり，オペアンプ１８４，コンデンサ１８５を有する積分回路を用いることができる。
ＣＶ変換回路１８１から出力される信号を整流回路１８２で整流し，ＡＤ変換回路１８３でデジタル値に変換することで，静電容量Ｃのデジタル値が出力される。 FIG. 14 is a circuit diagram illustrating an example of the internal configuration of the capacitance detection circuit 180.
The capacitance detection circuit 180 includes a CV (capacitance-voltage) conversion circuit 181, a rectification circuit 182, and an AD conversion circuit 183.
The CV conversion circuit 181 is a circuit that converts a capacitance into a voltage (converts an impedance change due to a change in the capacitance C into a voltage change), and an integration circuit having an operational amplifier 184 and a capacitor 185 can be used.
The signal output from the CV conversion circuit 181 is rectified by the rectification circuit 182 and converted into a digital value by the AD conversion circuit 183, whereby the digital value of the capacitance C is output.

この例では，複数の検出電極１４２それぞれが，容量検出回路１８０と個別に接続されている。これに換えて，複数の検出電極１４２をアナログスイッチで切り替えて一個の容量検出回路１８０に接続しても良い。
このようにして，外部からの圧力による静電容量変化を検出することで，圧力分布を計測できる。 In this example, each of the plurality of detection electrodes 142 is individually connected to the capacitance detection circuit 180. Alternatively, the plurality of detection electrodes 142 may be switched by an analog switch and connected to one capacitance detection circuit 180.
In this way, the pressure distribution can be measured by detecting the change in capacitance due to external pressure.

（第２の実施の形態）
本発明の第２の実施形態を説明する。
図１５は本発明の第２実施形態に係る圧力センサ２００を表す断面図である。
圧力センサ２００は，弾性体シート２１０，２２０，フレキシブル基板２３０，２４０，配線基板１５０，絶縁フィルム２６０，カバー１７０を有する。
図１６は，弾性体シート２１０を上面から見た状態を表す上面図である。この図には，柱状突起２２２が配置される位置が表されている。
図１７は，フレキシブル基板２３０，２４０，配線基板１５０を表す上面図である。 (Second Embodiment)
A second embodiment of the present invention will be described.
FIG. 15 is a sectional view showing a pressure sensor 200 according to the second embodiment of the present invention.
The pressure sensor 200 includes elastic sheets 210 and 220, flexible substrates 230 and 240, a wiring substrate 150, an insulating film 260, and a cover 170.
FIG. 16 is a top view illustrating a state in which the elastic sheet 210 is viewed from above. In this figure, the positions where the columnar protrusions 222 are arranged are shown.
FIG. 17 is a top view showing the flexible boards 230 and 240 and the wiring board 150.

弾性体シート２１０は，シリコンゴム等を使用でき，シート本体１１１，複数の柱状突起２１２，土手１１３を有する。
弾性体シート２２０は，シリコンゴム等を使用でき，シート本体１２１，複数の柱状突起２２２を有する。
フレキシブル基板２３０は，ベースフィルム１３１，走査電極２３２，スルーホール２３３を有する。
フレキシブル基板２４０は，ベースフィルム１４１，検出電極２４２，スルーホール２４３を有する。 The elastic sheet 210 can use silicon rubber or the like, and has a sheet main body 111, a plurality of columnar protrusions 212, and a bank 113.
The elastic sheet 220 can use silicon rubber or the like, and has a sheet main body 121 and a plurality of columnar protrusions 222.
The flexible substrate 230 has a base film 131, a scanning electrode 232, and a through hole 233.
The flexible substrate 240 has a base film 141, a detection electrode 242, and a through hole 243.

圧力センサ２００の柱状突起２１２，２２２，スルーホール２３３，２４３の配置は，圧力センサ１００の柱状突起１１２，１２２，スルーホール１３３，１４３と異なる。走査電極２３２，検出電極２４２の配置も圧力センサ１００の走査電極１３２，検出電極１４２の配置と異なる。また，柱状突起２１２，２２２の配置の関係で，絶縁フィルム２６０の形状は絶縁フィルム１６０の形状と幾分異なる。
以上の点で圧力センサ２００は圧力センサ１００と相違する。他の点では圧力センサ２００，１００に特段の相違はないので，詳細な説明を省略する。 The arrangement of the columnar protrusions 212 and 222 and the through holes 233 and 243 of the pressure sensor 200 is different from that of the columnar protrusions 112 and 122 and the through holes 133 and 143 of the pressure sensor 100. The arrangement of the scanning electrode 232 and the detection electrode 242 is also different from the arrangement of the scanning electrode 132 and the detection electrode 142 of the pressure sensor 100. Further, the shape of the insulating film 260 is slightly different from the shape of the insulating film 160 due to the arrangement of the columnar protrusions 212 and 222.
The pressure sensor 200 is different from the pressure sensor 100 in the above points. Since there is no particular difference between the pressure sensors 200 and 100 in other points, detailed description is omitted.

図１６に示すように，圧力センサ２００では，柱状突起２１２，２２２が千鳥状に配置される。即ち，柱状突起２１２，２２２が異なる列にずれて配置される。言い換えれば，柱状突起２１２，２２２の配置は，柱状突起１１２，１２２の配置よりも均一である。圧力センサ２００では，柱状突起２１２，２２２が均一に（ほぼ等間隔で）配置されることで，圧力センサ１００よりも硬くて丈夫になる。   As shown in FIG. 16, in the pressure sensor 200, the columnar protrusions 212 and 222 are arranged in a staggered manner. In other words, the columnar protrusions 212 and 222 are arranged in different rows. In other words, the arrangement of the columnar protrusions 212 and 222 is more uniform than the arrangement of the columnar protrusions 112 and 122. In the pressure sensor 200, the columnar protrusions 212 and 222 are arranged uniformly (substantially at equal intervals), so that the pressure sensor 200 is harder and stronger than the pressure sensor 100.

これに対して，圧力センサ１００では，柱状突起１１２，１２２が一直線の列をなすように配置される。このため，柱状突起１１２，１２２間の間隔は，柱状突起２１２，２２２の間隔より狭い。この結果，圧力センサ１００での柱状突起１１２，１２２の分布は，圧力センサ２００での柱状突起２１２，２２２の分布に対して，不均一となる。この不均一性が圧力センサ１００を柔らかく高感度としている。即ち，柱状突起１２２が配置されない柱状突起１１２間において，弾性体シート１２０の変形が容易となる（低い圧力で弾性体シート１２０が大きく変形する）。   On the other hand, in the pressure sensor 100, the columnar protrusions 112 and 122 are arranged so as to form a straight line. For this reason, the interval between the columnar protrusions 112 and 122 is narrower than the interval between the columnar protrusions 212 and 222. As a result, the distribution of the columnar protrusions 112 and 122 in the pressure sensor 100 is not uniform with respect to the distribution of the columnar protrusions 212 and 222 in the pressure sensor 200. This non-uniformity makes the pressure sensor 100 soft and sensitive. That is, the elastic sheet 120 is easily deformed between the columnar protrusions 112 where the columnar protrusions 122 are not disposed (the elastic sheet 120 is largely deformed by a low pressure).

以上のように，圧力センサ１００，２００には，柔らかく高感度か，硬く丈夫かの相違がある。前者は，感度より耐久性を優先する場合，後者は，耐久性より感度を優先する場合に適する。   As described above, the pressure sensors 100 and 200 have a difference between soft and high sensitivity and hard and strong. The former is suitable when durability is prioritized over sensitivity, and the latter is suitable when sensitivity is prioritized over durability.

（その他の実施形態）
本発明の実施形態は上記の実施形態に限られず拡張，変更可能であり，拡張，変更した実施形態も本発明の技術的範囲に含まれる。 (Other embodiments)
Embodiments of the present invention are not limited to the above-described embodiments, and can be expanded and modified. The expanded and modified embodiments are also included in the technical scope of the present invention.

本発明の第１実施形態に係る圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor which concerns on 1st Embodiment of this invention. 第１実施形態に係る弾性体シートを上面から見た状態を表す上面図である。It is a top view showing the state which looked at the elastic body sheet concerning a 1st embodiment from the upper surface. 第１実施形態に係るフレキシブル基板，配線基板を表す上面図である。It is a top view showing the flexible substrate and wiring board which concern on 1st Embodiment. 本発明の比較例に係る圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor which concerns on the comparative example of this invention. 比較例に係る弾性体シートを上面から見た状態を表す上面図である。It is a top view showing the state which looked at the elastic body sheet concerning a comparative example from the upper surface. 比較例に係るフレキシブル基板，配線基板を表す上面図である。It is a top view showing the flexible substrate and wiring board which concern on a comparative example. 製造中の圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor in manufacture. 製造中の圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor in manufacture. 製造中の圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor in manufacture. 製造中の圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor in manufacture. 製造中の圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor in manufacture. 圧力が印加された圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor to which the pressure was applied. 圧力センサの静電容量を検出するための回路構成を表す模式図である。It is a schematic diagram showing the circuit structure for detecting the electrostatic capacitance of a pressure sensor. 容量検出回路の内部構成を表す回路図である。It is a circuit diagram showing the internal structure of a capacity | capacitance detection circuit. 本発明の第２実施形態に係る圧力センサを表す断面図である。It is sectional drawing showing the pressure sensor which concerns on 2nd Embodiment of this invention. 第２実施形態に係る弾性体シートを上面から見た状態を表す上面図である。It is a top view showing the state which looked at the elastic body sheet concerning a 2nd embodiment from the upper surface. 第２実施形態に係るフレキシブル基板，配線基板を表す上面図である。It is a top view showing the flexible substrate and wiring board which concern on 2nd Embodiment.

符号の説明Explanation of symbols

１００…圧力センサ，１１０，１２０…弾性体シート，１１１，１２１…シート本体，１１２，１２２…柱状突起，１１３…土手，１３０，１４０…フレキシブル基板，１３１，１４１…ベースフィルム，１３２…走査電極，１４２…検出電極，１３３，１４３…スルーホール，１５０…配線基板，１５１…ベースフィルム，１５２…配線，１５３，１５４…シールド電極，１６０…絶縁フィルム，１７０…カバー，１８０…容量検出回路，１８１…変換回路，１８２…整流回路，１８３…ＡＤ変換回路，１８４…オペアンプ，１８５…コンデンサ，１９０…データ収集部   DESCRIPTION OF SYMBOLS 100 ... Pressure sensor, 110, 120 ... Elastic body sheet, 111, 121 ... Sheet main body, 112, 122 ... Columnar protrusion, 113 ... Bank, 130, 140 ... Flexible substrate, 131, 141 ... Base film, 132 ... Scan electrode, 142 ... detection electrode, 133,143 ... through hole, 150 ... wiring substrate, 151 ... base film, 152 ... wiring, 153,154 ... shield electrode, 160 ... insulating film, 170 ... cover, 180 ... capacitance detection circuit, 181 ... Conversion circuit, 182... Rectification circuit, 183... AD conversion circuit, 184... Operational amplifier, 185.

Claims (6)

第１の弾性基板と，
前記第１の弾性基板の主面に設けられた複数の第１の突起部と，
前記第１の弾性基板の前記主面側に配置され，複数の第１の電極と，複数の第１の穴部と，を有する第１のフレキシブル基板と，
前記第１のフレキシブル基板と対向して配置され，複数の第２の電極と，複数の第２の穴部と，を有する第２のフレキシブル基板と，
前記第２のフレキシブル基板の前記第１のフレキシブル基板と対向する面とは反対の面側に配置される第２の弾性基板と，を具備し，
前記第１の突起部は，前記複数の第１の穴部をそれぞれ貫通し，前記第２のフレキシブル基板と近接または接触する先端部分を有し，
前記第２の突起部は，前記複数の第２の穴部をそれぞれ貫通し，前記第１のフレキシブル基板と近接または接触する先端部分を有する，
ことを特徴とする圧力センサ。 A first elastic substrate;
A plurality of first protrusions provided on the main surface of the first elastic substrate;
A first flexible substrate disposed on the main surface side of the first elastic substrate and having a plurality of first electrodes and a plurality of first holes;
A second flexible substrate disposed opposite to the first flexible substrate and having a plurality of second electrodes and a plurality of second holes;
A second elastic substrate disposed on a surface opposite to the surface facing the first flexible substrate of the second flexible substrate,
Each of the first protrusions has a tip portion that passes through each of the plurality of first holes and is close to or in contact with the second flexible substrate;
Each of the second protrusions has a tip portion that penetrates each of the plurality of second holes and is close to or in contact with the first flexible substrate;
A pressure sensor characterized by that. 前記第１，第２の突起部が，列をなして交互に配置される
ことを特徴とする請求項１記載の圧力センサ。 The pressure sensor according to claim 1, wherein the first and second protrusions are alternately arranged in a row. 前記第１の突起部が，第１の列をなして配置され，前記第２の突起部が，この第１の列と異なる第２の列をなして配置される，
ことを特徴とする請求項１に記載の圧力センサ。 The first protrusions are arranged in a first row, and the second protrusions are arranged in a second row different from the first row;
The pressure sensor according to claim 1. 前記第１，第２の突起部が，前記第１，第２の弾性基板と一体的に構成される
ことを特徴とする請求項１乃至３のいずれか１項に記載の圧力センサ。 The pressure sensor according to any one of claims 1 to 3, wherein the first and second protrusions are configured integrally with the first and second elastic substrates. 前記第１，第２の突起部が，弾性材料から構成される
ことを特徴とする請求項１乃至４のいずれか１項に記載の圧力センサ。 The pressure sensor according to any one of claims 1 to 4, wherein the first and second protrusions are made of an elastic material. 前記第１，第２の電極間の容量を検出する容量検出部
をさらに具備することを特徴とする請求項１乃至５のいずれか１項に記載の圧力センサ。 The pressure sensor according to claim 1, further comprising a capacitance detection unit that detects a capacitance between the first and second electrodes.
JP2007162623A 2007-06-20 2007-06-20 Pressure sensor Withdrawn JP2009002740A (en)

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Cited By (6)

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WO2011045837A1 (en) * 2009-10-14 2011-04-21 国立大学法人東北大学 Sheet-like tactile sensor system
JP2011089923A (en) * 2009-10-23 2011-05-06 Asahi Kasei Fibers Corp Sensing member and sensor provided with the sensing member
WO2011078595A2 (en) * 2009-12-23 2011-06-30 전자부품연구원 Pressure sensor using a flexible substrate, and method for manufacturing a 5.1 channel microphone using same
JP2014520638A (en) * 2011-07-14 2014-08-25 エムシー１０ インコーポレイテッド Detection of force on foot or footwear
EP2517481A4 (en) * 2009-12-22 2015-06-03 Mh Acoustics Llc Surface-mounted microphone arrays on flexible printed circuit boards
EP2698616B1 (en) * 2012-08-17 2019-10-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flat compressible volume capacitive sensor for measuring pressure and/or for the measurement or detection of deformations

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EP2490004A4 (en) * 2009-10-14 2014-08-06 Univ Tohoku Sheet-like tactile sensor system
JP5417454B2 (en) * 2009-10-14 2014-02-12 国立大学法人東北大学 Sheet-like tactile sensor system
US8613231B2 (en) 2009-10-14 2013-12-24 Tohoku University Sheet-like tactile sensor system
WO2011045837A1 (en) * 2009-10-14 2011-04-21 国立大学法人東北大学 Sheet-like tactile sensor system
TWI408036B (en) * 2009-10-14 2013-09-11 Univ Tohoku Sheet-like touch sensor system
EP2490004A1 (en) * 2009-10-14 2012-08-22 Tohoku University Sheet-like tactile sensor system
JP2011089923A (en) * 2009-10-23 2011-05-06 Asahi Kasei Fibers Corp Sensing member and sensor provided with the sensing member
EP2517481A4 (en) * 2009-12-22 2015-06-03 Mh Acoustics Llc Surface-mounted microphone arrays on flexible printed circuit boards
US9307326B2 (en) 2009-12-22 2016-04-05 Mh Acoustics Llc Surface-mounted microphone arrays on flexible printed circuit boards
KR101145665B1 (en) 2009-12-23 2012-05-24 전자부품연구원 Manufacturing method of pressure sensors and 5.1 channel microphones using flexible substrates
WO2011078595A3 (en) * 2009-12-23 2011-11-10 전자부품연구원 Pressure sensor using a flexible substrate, and method for manufacturing a 5.1 channel microphone using same
WO2011078595A2 (en) * 2009-12-23 2011-06-30 전자부품연구원 Pressure sensor using a flexible substrate, and method for manufacturing a 5.1 channel microphone using same
JP2014520638A (en) * 2011-07-14 2014-08-25 エムシー１０ インコーポレイテッド Detection of force on foot or footwear
EP2698616B1 (en) * 2012-08-17 2019-10-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flat compressible volume capacitive sensor for measuring pressure and/or for the measurement or detection of deformations

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