JP2009000596A - Coating liquid supply system - Google Patents

Coating liquid supply system Download PDF

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Publication number
JP2009000596A
JP2009000596A JP2007161978A JP2007161978A JP2009000596A JP 2009000596 A JP2009000596 A JP 2009000596A JP 2007161978 A JP2007161978 A JP 2007161978A JP 2007161978 A JP2007161978 A JP 2007161978A JP 2009000596 A JP2009000596 A JP 2009000596A
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coating liquid
tank
slit nozzle
pump
supply system
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Futoshi Shimai
太 島井
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating supply system which is capable of applying a large amount of a coating liquid with a constant temperature at a breath. <P>SOLUTION: A pump 8 of a second circulation pathway 3 is always driven to keep the temperature of a development solution in a tank 1 constant. In this state, a pump 4 of a first circulation pathway 2 is driven to send the development solution pumped out by the pump 4 to a slit nozzle 6. At this time, if an on-off valve 7 is closed, the development solution supplied into the slit nozzle 6 flows down from a slit like discharge port 6d to the lower part in a state like a curtain and is supplied to the surface of a substrate to be treated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、半導体ウェーハやガラス基板などの被処理基板の表面に現像液などの塗布液を供給するシステムに関する。   The present invention relates to a system for supplying a coating solution such as a developer to the surface of a substrate to be processed such as a semiconductor wafer or a glass substrate.

スリットノズルを用いて被処理基板の表面にレジストなどの塗布液を供給するシステムとして特許文献１に開示されるものが知られている。このシステムは図３に示すように、レジストを貯留するタンク１００と、タンク１００内のレジストを取り出して再びタンク１００に戻す循環用配管１０１を備え、循環用配管１０１の途中にポンプ１０２、温調装置１０３、フィルター１０４、スリットノズル１０５、開閉弁１０６を設けている。   A system disclosed in Patent Document 1 is known as a system that supplies a coating liquid such as a resist to the surface of a substrate to be processed using a slit nozzle. As shown in FIG. 3, this system includes a tank 100 for storing resist, and a circulation pipe 101 for taking out the resist in the tank 100 and returning it to the tank 100 again. A device 103, a filter 104, a slit nozzle 105, and an on-off valve 106 are provided.

そして、ポンプ１０２で汲み出したレジストを温調装置１０３で所定の温度とし、これをスリットノズル１０５まで送り込む。このとき開閉弁１０６を閉じることでスリットノズル１０５内に供給されたレジストはノズルからカーテン状になって下方に流下し、被処理基板の表面に供給される。また開閉弁１０６を開とするとスリットノズル１０５内に供給されたレジストはそのまま循環用配管１０１を経由してタンク１００に戻される。   Then, the resist pumped out by the pump 102 is set to a predetermined temperature by the temperature control device 103 and is sent to the slit nozzle 105. At this time, by closing the on-off valve 106, the resist supplied into the slit nozzle 105 flows into the curtain from the nozzle and flows downward, and is supplied to the surface of the substrate to be processed. When the on-off valve 106 is opened, the resist supplied into the slit nozzle 105 is returned to the tank 100 via the circulation pipe 101 as it is.

特開平１１−１５４６４１号公報Japanese Patent Application Laid-Open No. 11-154641

塗布液がレジストの場合には、一気に多量のレジストを被処理基板の表面に供給する必要はないが、塗布液が現像液の場合には、一定温度の現像液を一気且つ多量に被処理基板の表面に供給する必要がある。
このような要望があるが、特許文献１に開示されるシステムでは、ポンプとスリットノズルとの間に温調装置が設けられているため、この温調装置の抵抗によって十分な量の現像液を供給することができない。 When the coating solution is a resist, it is not necessary to supply a large amount of resist to the surface of the substrate to be processed at a stretch. Need to be fed to the surface.
Although there is such a request, in the system disclosed in Patent Document 1, since a temperature control device is provided between the pump and the slit nozzle, a sufficient amount of developer is supplied by the resistance of the temperature control device. It cannot be supplied.

上記課題を解決するため本発明に係る塗布液供給システムは、塗布液を貯留するタンクと、タンク内のレジストを取り出して再びタンクに戻す第１及び第２の循環経路を備え、前記第１の循環経路には上流側から順にポンプ、フィルター、スリットノズル及び開閉弁が設けられ、前記第２の循環経路には上流側から順にポンプ及び温調装置が設けられた構成とした。   In order to solve the above problems, a coating liquid supply system according to the present invention includes a tank that stores a coating liquid, and first and second circulation paths that take out a resist in the tank and return it to the tank again. The circulation path is provided with a pump, a filter, a slit nozzle, and an on-off valve in order from the upstream side, and the pump and the temperature control device are sequentially provided from the upstream side on the second circulation path.

循環経路にスリットノズルを設けると、スリットノズルの一端からタンクからの塗布液が供給され、他端からタンクへ塗布液が戻される構造となる。この場合、塗布液が供給される一端側の流路の径と塗布液が戻される他端側の流路の径は同寸法とする。   When the slit nozzle is provided in the circulation path, the coating liquid is supplied from one end of the slit nozzle and the coating liquid is returned to the tank from the other end. In this case, the diameter of the flow path on one end side to which the coating liquid is supplied and the diameter of the flow path on the other end side to which the coating liquid is returned are the same.

尚、塗布液が供給される一端側の流路の径よりも塗布液が戻される他端側の流路の径を大きく設定してもよい。このようにすることで、塗布液が戻される他端側にあっては一端側に比べて圧力損失があるが、この圧力損失をカバーすることができる。   The diameter of the flow path on the other end side where the coating liquid is returned may be set larger than the diameter of the flow path on the one end side to which the coating liquid is supplied. By doing in this way, although there exists a pressure loss in the other end side where a coating liquid is returned compared with one end side, this pressure loss can be covered.

塗布液としては特に限定されないが、一定温度の塗布液を一気に且つ大量に塗布するという要請があるのは現像液である。   The coating solution is not particularly limited, but a developer is required to apply a constant temperature coating solution at once and in large quantities.

本発明によれば、第１及び第２の循環経路を設け、第２の循環経路は温調専用としたので、タンク内に一定温度に調整された塗布液を保持することができ、その結果、スリットノズルを設けた第１の循環経路には温調装置が不要になり、十分な量の塗布液を安定してスリットノズルから吐出することができる。
したがって、短い時間で、現像液を被処理基板上面に厚く盛り付けるパドル型の現像などに極めて有効である。 According to the present invention, the first and second circulation paths are provided, and the second circulation path is dedicated to temperature control, so that the coating liquid adjusted to a constant temperature can be held in the tank, and as a result. The first circulation path provided with the slit nozzle does not require a temperature control device, and a sufficient amount of coating liquid can be stably discharged from the slit nozzle.
Therefore, it is extremely effective for paddle type development in which the developer is thickly deposited on the upper surface of the substrate to be processed in a short time.

以下に本発明の最適な実施例を添付図面に基づいて説明する。図１は本発明に係る塗布液供給システムの全体図、図２（ａ）はスリットノズルの入口側の断面図、（ｂ）はスリットノズルの出口側の断面図である。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. FIG. 1 is an overall view of a coating liquid supply system according to the present invention, FIG. 2 (a) is a sectional view on the inlet side of the slit nozzle, and (b) is a sectional view on the outlet side of the slit nozzle.

塗布液供給システムは、塗布液としての現像液を貯留するタンク１と、このタンク１内のレジストを取り出して再びタンク１に戻す第１及び第２の循環経路２、３を備えている。第１及び第２の循環経路２、３は配管にて構成されている。   The coating solution supply system includes a tank 1 that stores a developing solution as a coating solution, and first and second circulation paths 2 and 3 that take out the resist in the tank 1 and return it to the tank 1 again. The first and second circulation paths 2 and 3 are constituted by piping.

第１の循環経路２には上流側から順に、ポンプ４、フィルター５、スリットノズル６及び開閉弁７を設けている。   The first circulation path 2 is provided with a pump 4, a filter 5, a slit nozzle 6 and an on-off valve 7 in order from the upstream side.

また、第２の循環経路３には上流側から順に、ポンプ８、温調装置９及びフィルター１０を設けている。フィルター１０については必ずしも設ける必要はない。また、温調装置９の構造として図示例では熱交換器を示しているがこれには限定されない。   The second circulation path 3 is provided with a pump 8, a temperature control device 9, and a filter 10 in order from the upstream side. The filter 10 is not necessarily provided. Moreover, although the heat exchanger is shown in the example of illustration as a structure of the temperature control apparatus 9, it is not limited to this.

前記スリットノズル６は左右の半体６ａ、６ｂからなり、これら半体６ａ、６ｂの間に流路６ｃが形成され、この流路６ｃにつながるスリット状吐出口６ｄが下方に向かって開口している。   The slit nozzle 6 is composed of left and right halves 6a and 6b. A channel 6c is formed between the halves 6a and 6b, and a slit-like discharge port 6d connected to the channel 6c opens downward. Yes.

そして、本実施例にあっては、図２（ａ）に示すように塗布液が供給される一端側の流路６ｃの幅Ｗ１を狭く（流路断面積を小さく）、（ｂ）に示すように塗布液が戻される他端側の流路６ｃの幅Ｗ２を広く（流路断面積を大きく）設定し、スリット状吐出口６ｄ全体として均一塗布が行えるようにしている。   In the present embodiment, as shown in FIG. 2A, the width W1 of the flow path 6c on one end side to which the coating liquid is supplied is narrowed (the cross-sectional area of the flow path is small), and shown in FIG. As described above, the width W2 of the flow path 6c on the other end side where the coating liquid is returned is set wide (the cross-sectional area of the flow path is large) so that uniform application can be performed as the entire slit-like discharge port 6d.

以上において、第２の循環経路３のポンプ８は常時駆動し、タンク１内の現像液の温度を一定に維持している。この状態で、第１の循環経路２のポンプ４を駆動し、ポンプ４で汲み出した現像液をスリットノズル６まで送り込む。このとき開閉弁７を閉じておくと、スリットノズル６内に供給された現像液はスリット状吐出口６ｄからカーテン状になって下方に流下し、被処理基板Ｗの表面に供給される。   In the above, the pump 8 of the second circulation path 3 is always driven to keep the temperature of the developer in the tank 1 constant. In this state, the pump 4 of the first circulation path 2 is driven, and the developer pumped out by the pump 4 is sent to the slit nozzle 6. At this time, when the on-off valve 7 is closed, the developer supplied into the slit nozzle 6 flows into the curtain-like shape from the slit-like discharge port 6d and flows downward, and is supplied to the surface of the substrate W to be processed.

また開閉弁７を開とすると、スリットノズル６内に供給された現像液はそのまま循環経路２を経由してタンク１に戻される。再び第２の循環経路３によって温度管理される。   When the on-off valve 7 is opened, the developer supplied into the slit nozzle 6 is returned to the tank 1 via the circulation path 2 as it is. Again, the temperature is controlled by the second circulation path 3.

本発明に係る塗布液供給システムの全体図Overall view of coating liquid supply system according to the present invention （ａ）はスリットノズルの入口側の断面図、（ｂ）はスリットノズルの出口側の断面図(A) is a sectional view on the inlet side of the slit nozzle, (b) is a sectional view on the outlet side of the slit nozzle. 従来の塗布液供給システムの全体図Overall view of conventional coating solution supply system

符号の説明Explanation of symbols

１…タンク、２…第１の循環経路、３…第２の循環経路、４，８…ポンプ、５…フィルター、６…スリットノズル、６ａ，６ｂ…スリットノズル半体、６ｃ…流路、６ｄ…スリット状吐出口、７…開閉弁、９…温調装置，１０…フィルター、１００…タンク、１０１…循環用配管、１０２…ポンプ、１０３…温調装置、１０４…フィルター、１０５…スリットノズル、１０６…開閉弁、Ｗ１…一端側の流路の径、Ｗ２…他端側の流路の径。   DESCRIPTION OF SYMBOLS 1 ... Tank, 2 ... 1st circulation path, 3 ... 2nd circulation path, 4, 8 ... Pump, 5 ... Filter, 6 ... Slit nozzle, 6a, 6b ... Slit nozzle half body, 6c ... Flow path, 6d DESCRIPTION OF SYMBOLS ... Slit discharge port, 7 ... Open / close valve, 9 ... Temperature control device, 10 ... Filter, 100 ... Tank, 101 ... Circulation piping, 102 ... Pump, 103 ... Temperature control device, 104 ... Filter, 105 ... Slit nozzle, 106: On-off valve, W1: Diameter of the flow path on one end side, W2: Diameter of the flow path on the other end side.

Claims (3)

塗布液を貯留するタンクと、タンク内のレジストを取り出して再びタンクに戻す第１及び第２の循環経路を備え、前記第１の循環経路には上流側から順にポンプ、フィルター、スリットノズル及び開閉弁が設けられ、前記第２の循環経路には上流側から順にポンプ及び温調装置が設けられていることを特徴とする塗布液供給システム。 A tank for storing the coating liquid, and first and second circulation paths for taking out the resist in the tank and returning it to the tank again. The first circulation path has a pump, a filter, a slit nozzle, and an open / close in order from the upstream side. A coating liquid supply system, wherein a valve is provided, and a pump and a temperature control device are provided in order from the upstream side in the second circulation path. 請求項１に記載の塗布液供給システムにおいて、前記スリットノズルは一端からタンクからの塗布液が供給され、他端からタンクへ塗布液が戻され、且つ塗布液が戻される他端側のスリット状吐出口の幅は、塗布液が供給される一端側のスリット状吐出口の幅よりも広く設定されていることを特徴とする塗布液供給システム。 2. The coating liquid supply system according to claim 1, wherein the slit nozzle is supplied with a coating liquid from a tank from one end, is returned to the tank from the other end, and is slit-like on the other end side where the coating liquid is returned. The width of the discharge port is set wider than the width of the slit-shaped discharge port on one end side to which the coating solution is supplied. 請求項１または請求項２に記載の塗布液供給システムにおいて、前記塗布液は現像液であることを特徴とする塗布液供給システム。






3. The coating solution supply system according to claim 1, wherein the coating solution is a developer.






JP2007161978A 2007-06-20 2007-06-20 Coating liquid supply system Pending JP2009000596A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029973A (en) * 2013-08-06 2015-02-16 大日本印刷株式会社 Coating system and coating method
CN110780547A (en) * 2018-07-30 2020-02-11 夏普株式会社 Liquid container device
WO2020065909A1 (en) * 2018-09-28 2020-04-02 シャープ株式会社 Slit coater, coating method, and display device production method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03202488A (en) * 1989-12-29 1991-09-04 Nec Corp Plating device
JPH11319675A (en) * 1998-05-13 1999-11-24 Toppan Printing Co Ltd Coating head
JP2001009342A (en) * 1999-06-28 2001-01-16 Dainippon Printing Co Ltd Die head

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03202488A (en) * 1989-12-29 1991-09-04 Nec Corp Plating device
JPH11319675A (en) * 1998-05-13 1999-11-24 Toppan Printing Co Ltd Coating head
JP2001009342A (en) * 1999-06-28 2001-01-16 Dainippon Printing Co Ltd Die head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029973A (en) * 2013-08-06 2015-02-16 大日本印刷株式会社 Coating system and coating method
CN110780547A (en) * 2018-07-30 2020-02-11 夏普株式会社 Liquid container device
WO2020065909A1 (en) * 2018-09-28 2020-04-02 シャープ株式会社 Slit coater, coating method, and display device production method

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