JP2008527424A5 - - Google Patents

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Publication number
JP2008527424A5
JP2008527424A5 JP2007549671A JP2007549671A JP2008527424A5 JP 2008527424 A5 JP2008527424 A5 JP 2008527424A5 JP 2007549671 A JP2007549671 A JP 2007549671A JP 2007549671 A JP2007549671 A JP 2007549671A JP 2008527424 A5 JP2008527424 A5 JP 2008527424A5
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JP
Japan
Prior art keywords
conductive member
electrode
conductive
contact
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007549671A
Other languages
English (en)
Other versions
JP2008527424A (ja
JP5255279B2 (ja
Filing date
Publication date
Priority claimed from US11/025,110 external-priority patent/US7189991B2/en
Application filed filed Critical
Publication of JP2008527424A publication Critical patent/JP2008527424A/ja
Publication of JP2008527424A5 publication Critical patent/JP2008527424A5/ja
Application granted granted Critical
Publication of JP5255279B2 publication Critical patent/JP5255279B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

  1. 第１のピクセル駆動回路、第１の導電性部材、および第２の導電性部材を含む基板であって、前記第１および第２の導電性部材が互いに隔置され、前記第１の導電性部材が前記第１のピクセル駆動回路に接続され、前記第２の導電性部材が電力伝送線の一部である、基板と、
    第１の電子部品
    前記第１の導電性部材と接触する第１の電極、
    前記第２の導電性部材に接続されるが接触しない第２の電極、および
    前記第１の電極と前記第２の電極との間にある有機層
    を含む第１の電子部品と、
    第３の導電性部材であって
    前記第２の電極および前記第２の導電性部材に接続され、かつ
    前記第２の導電性部材と接触する
    第３の導電性部材と
    を備えたことを特徴とする電子デバイス。
JP2007549671A 2004-12-29 2005-12-29 電極を基板内の他の導電性部材に接続する導電性部材を含む電子デバイス、および電子デバイスを形成するためのプロセス Expired - Fee Related JP5255279B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/025,110 2004-12-29
US11/025,110 US7189991B2 (en) 2004-12-29 2004-12-29 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
PCT/US2005/047519 WO2006072024A2 (en) 2004-12-29 2005-12-29 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices

Publications (3)

Publication Number Publication Date
JP2008527424A JP2008527424A (ja) 2008-07-24
JP2008527424A5 true JP2008527424A5 (ja) 2009-02-19
JP5255279B2 JP5255279B2 (ja) 2013-08-07

Family

ID=36610342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007549671A Expired - Fee Related JP5255279B2 (ja) 2004-12-29 2005-12-29 電極を基板内の他の導電性部材に接続する導電性部材を含む電子デバイス、および電子デバイスを形成するためのプロセス

Country Status (7)

Country Link
US (2) US7189991B2 (ja)
EP (1) EP1839336A4 (ja)
JP (1) JP5255279B2 (ja)
KR (1) KR101261653B1 (ja)
CN (1) CN100505288C (ja)
TW (1) TWI377711B (ja)
WO (1) WO2006072024A2 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189991B2 (en) * 2004-12-29 2007-03-13 E. I. Du Pont De Nemours And Company Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
US7563392B1 (en) * 2004-12-30 2009-07-21 E.I. Du Pont De Nemours And Company Organic conductive compositions and structures
DE102005037290A1 (de) * 2005-08-08 2007-02-22 Siemens Ag Flachbilddetektor
US7642109B2 (en) * 2005-08-29 2010-01-05 Eastman Kodak Company Electrical connection in OLED devices
US7700471B2 (en) * 2005-12-13 2010-04-20 Versatilis Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
US7638416B2 (en) * 2005-12-13 2009-12-29 Versatilis Llc Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices
JP5191650B2 (ja) * 2005-12-16 2013-05-08 シャープ株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
US8247824B2 (en) * 2005-12-19 2012-08-21 Matthew Stainer Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
US7314786B1 (en) * 2006-06-16 2008-01-01 International Business Machines Corporation Metal resistor, resistor material and method
US8153029B2 (en) * 2006-12-28 2012-04-10 E.I. Du Pont De Nemours And Company Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof
US8227877B2 (en) * 2010-07-14 2012-07-24 Macronix International Co., Ltd. Semiconductor bio-sensors and methods of manufacturing the same
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US20230087088A1 (en) * 2021-09-23 2023-03-23 Apple Inc. Local Passive Matrix Displays

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JP3530362B2 (ja) * 1996-12-19 2004-05-24 三洋電機株式会社 自発光型画像表示装置
KR100257811B1 (ko) * 1997-10-24 2000-06-01 구본준 액정표시장치의 기판의 제조방법
TW484238B (en) * 2000-03-27 2002-04-21 Semiconductor Energy Lab Light emitting device and a method of manufacturing the same
KR100495702B1 (ko) * 2001-04-13 2005-06-14 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
KR100437475B1 (ko) * 2001-04-13 2004-06-23 삼성에스디아이 주식회사 평판 디스플레이 장치용 표시 소자 제조 방법
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TWI362128B (en) * 2002-03-26 2012-04-11 Semiconductor Energy Lab Light emitting device and method of manufacturing the same
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US7189991B2 (en) * 2004-12-29 2007-03-13 E. I. Du Pont De Nemours And Company Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
KR100700650B1 (ko) * 2005-01-05 2007-03-27 삼성에스디아이 주식회사 유기 전계 발광 장치 및 그 제조 방법
US7554261B2 (en) * 2006-05-05 2009-06-30 Eastman Kodak Company Electrical connection in OLED devices

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