JP2008527067A5 - - Google Patents

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Publication number
JP2008527067A5
JP2008527067A5 JP2007548921A JP2007548921A JP2008527067A5 JP 2008527067 A5 JP2008527067 A5 JP 2008527067A5 JP 2007548921 A JP2007548921 A JP 2007548921A JP 2007548921 A JP2007548921 A JP 2007548921A JP 2008527067 A5 JP2008527067 A5 JP 2008527067A5
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Japan
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component
parts
weight
amount
composition
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JP2007548921A
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Japanese (ja)
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JP5236950B2 (en
JP2008527067A (en
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Priority claimed from JP2005000604A external-priority patent/JP2006188580A/en
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Priority to JP2007548921A priority Critical patent/JP5236950B2/en
Publication of JP2008527067A publication Critical patent/JP2008527067A/en
Publication of JP2008527067A5 publication Critical patent/JP2008527067A5/ja
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Claims (6)

少なくとも1種のエチレン/C3〜C20α−オレフィン共重合体を含む第1の成分、
前記第1の成分100重量部につき6〜12重量部の量の、少なくとも1種のエチレン/(メタ)アクリル酸エステル共重合体を含む第2の成分、
前記第1の成分100重量部につき50〜200重量部の量の、少なくとも1種の粘着付与樹脂を含む、前記第1および前記第2の成分と相溶性の第3の成分
を含むホットメルト接着組成物。
First component comprising at least one ethylene / C 3 ~C 20 α- olefin copolymers,
A second component comprising at least one ethylene / (meth) acrylate copolymer in an amount of 6 to 12 parts by weight per 100 parts by weight of the first component;
Hot melt adhesion comprising a third component compatible with the first and second components in an amount of 50-200 parts by weight per 100 parts by weight of the first component, comprising at least one tackifying resin. Composition.
前記α−オレフィンが、1−オクテンを含む請求項に記載の組成物。 The α- olefin composition of claim 1 comprising 1-octene. 前記エチレン/C3〜C20α−オレフィン共重合体が、150〜2500g/10分のメルトインデックスを有する請求項に記載の組成物。 The composition according to claim 2 , wherein the ethylene / C 3 to C 20 α-olefin copolymer has a melt index of 150 to 2500 g / 10 minutes. 前記(メタ)アクリル酸エステルが、C1〜C8アルキル(メタ)アクリル酸エステルを含む請求項1〜のいずれか1項に記載の組成物。 The (meth) acrylic acid ester, C 1 -C 8 alkyl (meth) composition according to any one of claim 1 to 3 including an acrylic acid ester. 少なくとも1種のワックスをさらに含有する請求項1〜のいずれか1項に記載の組成物。 The composition according to any one of claims 1 to 4 , further comprising at least one wax. 前記第3の成分が、前記第1の成分100重量部につき40〜150重量部の量の、前記第1の成分と相溶性の第1の粘着付与樹脂、および前記第1の成分100重量部につき10〜50重量部の量の、前記第2の成分と相溶性の第2の粘着付与樹脂を含む請求項3に記載の組成物。   The third component is a first tackifying resin compatible with the first component in an amount of 40 to 150 parts by weight per 100 parts by weight of the first component, and 100 parts by weight of the first component. The composition of claim 3 comprising a second tackifying resin compatible with the second component in an amount of 10 to 50 parts by weight per unit.
JP2007548921A 2005-01-05 2005-12-29 Hot melt adhesive composition Active JP5236950B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007548921A JP5236950B2 (en) 2005-01-05 2005-12-29 Hot melt adhesive composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005000604 2005-01-05
JP2005000604A JP2006188580A (en) 2005-01-05 2005-01-05 Hot melt adhesive composition
PCT/IB2005/004177 WO2006082478A2 (en) 2005-01-05 2005-12-29 Hot melt adhesive composition
JP2007548921A JP5236950B2 (en) 2005-01-05 2005-12-29 Hot melt adhesive composition

Publications (3)

Publication Number Publication Date
JP2008527067A JP2008527067A (en) 2008-07-24
JP2008527067A5 true JP2008527067A5 (en) 2009-02-19
JP5236950B2 JP5236950B2 (en) 2013-07-17

Family

ID=36694453

Family Applications (2)

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JP2005000604A Pending JP2006188580A (en) 2005-01-05 2005-01-05 Hot melt adhesive composition
JP2007548921A Active JP5236950B2 (en) 2005-01-05 2005-12-29 Hot melt adhesive composition

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2005000604A Pending JP2006188580A (en) 2005-01-05 2005-01-05 Hot melt adhesive composition

Country Status (3)

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JP (2) JP2006188580A (en)
KR (1) KR101184492B1 (en)
WO (1) WO2006082478A2 (en)

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JP5584851B2 (en) * 2008-08-06 2014-09-10 東亞合成株式会社 Hot melt adhesive composition for edge sticking and edge sticking method
JP6023399B2 (en) * 2010-12-27 2016-11-09 ヘンケルジャパン株式会社 Hot melt adhesive
JP5789382B2 (en) * 2011-02-25 2015-10-07 ヘンケルジャパン株式会社 Hot melt adhesive
JP5875850B2 (en) * 2011-12-16 2016-03-02 東京応化工業株式会社 Laminate and separation method
JP2014009255A (en) 2012-06-28 2014-01-20 Henkel Japan Ltd Hot melt adhesive
JP2014009256A (en) 2012-06-28 2014-01-20 Henkel Japan Ltd Hot melt adhesive
EP2872552A4 (en) * 2012-07-10 2016-03-09 Adhesive Technologies Inc Method and apparatus for modifying polymer compositions
JP6028998B2 (en) * 2012-09-10 2016-11-24 日立化成株式会社 Corrugated hot melt resin composition
US20140079897A1 (en) * 2012-09-14 2014-03-20 Henkel Corporation Adhesive Compositions and Use Thereof
CN104411794B (en) * 2012-09-19 2016-04-06 埃克森美孚化学专利公司 The binder composition of allyl and ethene-based polyalcohol
JP6159118B2 (en) * 2013-03-28 2017-07-05 日東電工株式会社 Filter filter production equipment
JP2014234399A (en) 2013-05-30 2014-12-15 ヘンケルジャパン株式会社 Hot melt adhesive
JP6336743B2 (en) * 2013-11-29 2018-06-06 ヘンケルジャパン株式会社 Hot melt adhesive
JP6438222B2 (en) 2014-06-30 2018-12-12 ヘンケルジャパン株式会社 Hot melt adhesive
JP6104974B2 (en) * 2015-04-03 2017-03-29 ヘンケルジャパン株式会社 Hot melt adhesive
JP6914522B2 (en) * 2017-08-10 2021-08-04 積水フーラー株式会社 Hot melt adhesive
JP7039004B2 (en) * 2017-12-27 2022-03-22 積水フーラー株式会社 Hot melt adhesive
JP7245038B2 (en) * 2018-12-13 2023-03-23 ヘンケルジャパン株式会社 hot melt adhesive
EP3839002A1 (en) 2019-12-20 2021-06-23 Bostik Sa Hot-melt adhesive composition
JP2022093032A (en) * 2020-12-11 2022-06-23 ヘンケルジャパン株式会社 Hot melt adhesive
JP2022093034A (en) * 2020-12-11 2022-06-23 ヘンケルジャパン株式会社 Hot melt adhesive

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JPS6096676A (en) * 1983-10-31 1985-05-30 Du Pont Mitsui Polychem Co Ltd Hot-melt adhesive composition
DE69110515T2 (en) * 1990-03-28 1996-02-15 Mitsui Toatsu Chemicals Hot-melt adhesive adhering to oily surfaces and a non-slip processing method for metallic cover plates.
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US6107403A (en) 1995-02-28 2000-08-22 Basf Corporation Coating composition containing hydroxyl groups, and its use in processes for the production of coatings
US6107430A (en) * 1996-03-14 2000-08-22 The Dow Chemical Company Low application temperature hot melt adhesive comprising ethylene α-olefin
JP2000096015A (en) * 1998-09-21 2000-04-04 Toyo Ink Mfg Co Ltd Hot-melt type adhesive for heat-sensitive label, heat- sensitive label and peeling of the same
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JP2006188580A (en) * 2005-01-05 2006-07-20 Nippon Fuller Kk Hot melt adhesive composition

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