JP2008527067A5 - - Google Patents
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- JP2008527067A5 JP2008527067A5 JP2007548921A JP2007548921A JP2008527067A5 JP 2008527067 A5 JP2008527067 A5 JP 2008527067A5 JP 2007548921 A JP2007548921 A JP 2007548921A JP 2007548921 A JP2007548921 A JP 2007548921A JP 2008527067 A5 JP2008527067 A5 JP 2008527067A5
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- 239000005977 Ethylene Substances 0.000 claims 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000004711 α-olefin Substances 0.000 claims 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-Octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
Claims (6)
前記第1の成分100重量部につき6〜12重量部の量の、少なくとも1種のエチレン/(メタ)アクリル酸エステル共重合体を含む第2の成分、
前記第1の成分100重量部につき50〜200重量部の量の、少なくとも1種の粘着付与樹脂を含む、前記第1および前記第2の成分と相溶性の第3の成分
を含むホットメルト接着組成物。 First component comprising at least one ethylene / C 3 ~C 20 α- olefin copolymers,
A second component comprising at least one ethylene / (meth) acrylate copolymer in an amount of 6 to 12 parts by weight per 100 parts by weight of the first component;
Hot melt adhesion comprising a third component compatible with the first and second components in an amount of 50-200 parts by weight per 100 parts by weight of the first component, comprising at least one tackifying resin. Composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007548921A JP5236950B2 (en) | 2005-01-05 | 2005-12-29 | Hot melt adhesive composition |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005000604 | 2005-01-05 | ||
JP2005000604A JP2006188580A (en) | 2005-01-05 | 2005-01-05 | Hot melt adhesive composition |
PCT/IB2005/004177 WO2006082478A2 (en) | 2005-01-05 | 2005-12-29 | Hot melt adhesive composition |
JP2007548921A JP5236950B2 (en) | 2005-01-05 | 2005-12-29 | Hot melt adhesive composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008527067A JP2008527067A (en) | 2008-07-24 |
JP2008527067A5 true JP2008527067A5 (en) | 2009-02-19 |
JP5236950B2 JP5236950B2 (en) | 2013-07-17 |
Family
ID=36694453
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005000604A Pending JP2006188580A (en) | 2005-01-05 | 2005-01-05 | Hot melt adhesive composition |
JP2007548921A Active JP5236950B2 (en) | 2005-01-05 | 2005-12-29 | Hot melt adhesive composition |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005000604A Pending JP2006188580A (en) | 2005-01-05 | 2005-01-05 | Hot melt adhesive composition |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP2006188580A (en) |
KR (1) | KR101184492B1 (en) |
WO (1) | WO2006082478A2 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006188580A (en) * | 2005-01-05 | 2006-07-20 | Nippon Fuller Kk | Hot melt adhesive composition |
US20090078590A1 (en) | 2008-01-21 | 2009-03-26 | Smith Dennis R | Ultrasecure card package |
JP5584851B2 (en) * | 2008-08-06 | 2014-09-10 | 東亞合成株式会社 | Hot melt adhesive composition for edge sticking and edge sticking method |
JP6023399B2 (en) * | 2010-12-27 | 2016-11-09 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP5789382B2 (en) * | 2011-02-25 | 2015-10-07 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP5875850B2 (en) * | 2011-12-16 | 2016-03-02 | 東京応化工業株式会社 | Laminate and separation method |
JP2014009255A (en) | 2012-06-28 | 2014-01-20 | Henkel Japan Ltd | Hot melt adhesive |
JP2014009256A (en) | 2012-06-28 | 2014-01-20 | Henkel Japan Ltd | Hot melt adhesive |
EP2872552A4 (en) * | 2012-07-10 | 2016-03-09 | Adhesive Technologies Inc | Method and apparatus for modifying polymer compositions |
JP6028998B2 (en) * | 2012-09-10 | 2016-11-24 | 日立化成株式会社 | Corrugated hot melt resin composition |
US20140079897A1 (en) * | 2012-09-14 | 2014-03-20 | Henkel Corporation | Adhesive Compositions and Use Thereof |
CN104411794B (en) * | 2012-09-19 | 2016-04-06 | 埃克森美孚化学专利公司 | The binder composition of allyl and ethene-based polyalcohol |
JP6159118B2 (en) * | 2013-03-28 | 2017-07-05 | 日東電工株式会社 | Filter filter production equipment |
JP2014234399A (en) | 2013-05-30 | 2014-12-15 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP6336743B2 (en) * | 2013-11-29 | 2018-06-06 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP6438222B2 (en) | 2014-06-30 | 2018-12-12 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP6104974B2 (en) * | 2015-04-03 | 2017-03-29 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP6914522B2 (en) * | 2017-08-10 | 2021-08-04 | 積水フーラー株式会社 | Hot melt adhesive |
JP7039004B2 (en) * | 2017-12-27 | 2022-03-22 | 積水フーラー株式会社 | Hot melt adhesive |
JP7245038B2 (en) * | 2018-12-13 | 2023-03-23 | ヘンケルジャパン株式会社 | hot melt adhesive |
EP3839002A1 (en) | 2019-12-20 | 2021-06-23 | Bostik Sa | Hot-melt adhesive composition |
JP2022093032A (en) * | 2020-12-11 | 2022-06-23 | ヘンケルジャパン株式会社 | Hot melt adhesive |
JP2022093034A (en) * | 2020-12-11 | 2022-06-23 | ヘンケルジャパン株式会社 | Hot melt adhesive |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096676A (en) * | 1983-10-31 | 1985-05-30 | Du Pont Mitsui Polychem Co Ltd | Hot-melt adhesive composition |
DE69110515T2 (en) * | 1990-03-28 | 1996-02-15 | Mitsui Toatsu Chemicals | Hot-melt adhesive adhering to oily surfaces and a non-slip processing method for metallic cover plates. |
FR2721039B1 (en) * | 1994-06-13 | 1997-04-04 | Atochem Elf Sa | Hot melt adhesives based on ethylene - (meth) acrylate copolymers. |
US6107403A (en) | 1995-02-28 | 2000-08-22 | Basf Corporation | Coating composition containing hydroxyl groups, and its use in processes for the production of coatings |
US6107430A (en) * | 1996-03-14 | 2000-08-22 | The Dow Chemical Company | Low application temperature hot melt adhesive comprising ethylene α-olefin |
JP2000096015A (en) * | 1998-09-21 | 2000-04-04 | Toyo Ink Mfg Co Ltd | Hot-melt type adhesive for heat-sensitive label, heat- sensitive label and peeling of the same |
JP4385562B2 (en) * | 2002-02-20 | 2009-12-16 | 東ソー株式会社 | Hot melt adhesive composition |
US20040236002A1 (en) * | 2003-05-19 | 2004-11-25 | Aziz Hassan | Novel multifunctional polymer for use in hot melt adhesive applications |
US7223814B2 (en) * | 2003-11-17 | 2007-05-29 | Eastman Chemical Company | Hot melt adhesives with improved performance window |
DE602005014443D1 (en) * | 2004-01-08 | 2009-06-25 | Du Pont | ETHYLENE COPOLYMERS AND POLYOLEFIN CONTAINING COMPOSITION |
AU2005275080B2 (en) * | 2004-07-15 | 2010-12-23 | E.I. Dupont De Nemours And Company | Composition comprising ethylene-acrylate copolymer and polyolefin and tackifier |
AU2005275079B2 (en) * | 2004-07-15 | 2010-12-09 | E.I. Dupont De Nemours And Company | Composition comprising ethylene copolymers and polyolefins |
JP2006188580A (en) * | 2005-01-05 | 2006-07-20 | Nippon Fuller Kk | Hot melt adhesive composition |
-
2005
- 2005-01-05 JP JP2005000604A patent/JP2006188580A/en active Pending
- 2005-12-29 KR KR1020077015397A patent/KR101184492B1/en active IP Right Grant
- 2005-12-29 JP JP2007548921A patent/JP5236950B2/en active Active
- 2005-12-29 WO PCT/IB2005/004177 patent/WO2006082478A2/en not_active Application Discontinuation
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