JP2008311282A - Heat pipe-type cooler - Google Patents

Heat pipe-type cooler Download PDF

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JP2008311282A
JP2008311282A JP2007155058A JP2007155058A JP2008311282A JP 2008311282 A JP2008311282 A JP 2008311282A JP 2007155058 A JP2007155058 A JP 2007155058A JP 2007155058 A JP2007155058 A JP 2007155058A JP 2008311282 A JP2008311282 A JP 2008311282A
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heat pipe
heat
type cooler
cooling fins
rows
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JP5148931B2 (en
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Kimiharu Arimatsu
公治 有松
Tsuguo Sato
次生 佐藤
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Toshiba Mitsubishi Electric Industrial Systems Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/34—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently cool each semiconductor device even if any temperature difference arises between semiconductor devices attached to both sides of a heat receiving block of a heat pipe-type cooler, respectively. <P>SOLUTION: A heat pipe-type cooler 1 is equipped with: a heat receiving block 2 of a rectangular parallelepiped form in which there are formed primary and secondary element clamp faces 2a, 2b for attaching flat semiconductor elements to facing surfaces; a plurality of heat pipes 3 attached to a face 2c positioned between the facing primary and secondary element clamp faces 2a, 2b of the heat receiving block 2; and a plurality of sheets of cooling fins 4a, 4b provided in heat discharge parts of these the plurality of heat pipes 3. The plurality of heat pipes 3 are distributed and arranged so as to be isolated to a first heat pipe sequence 3a which is distributed and arranged at the primary element clamp face 2a side, and a second heat pipe sequence 3b which is distributed and arranged at the secondary element clamp face 2b side, and constituted so as to be independently radiated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば電力変換装置における平型半導体素子の冷却用に用いられるヒートパイプ式冷却器に関するものである。   The present invention relates to a heat pipe type cooler used for cooling a flat semiconductor element in a power conversion device, for example.

近年、電力変換装置では、電力用半導体素子の大容量化、高速化に伴い、発熱損失の増大が問題となっている。このため電力用半導体素子用冷却器の冷却効率の向上を図り、発熱損失の増大に対応して装置の大型化を避けることが重要な技術課題となっている。   In recent years, an increase in heat generation loss has become a problem with power conversion devices as the capacity and speed of power semiconductor elements increase. For this reason, it is an important technical problem to improve the cooling efficiency of the cooler for power semiconductor elements and to avoid an increase in the size of the device in response to an increase in heat loss.

電力変換装置における電力用半導体素子としては、平型に構成されるダイオード、サイリスタ、ＧＴＯ、ＩＧＢＴなどが用いられ、その冷却器にはヒートパイプ式冷却器が用いられている。   As a power semiconductor element in the power converter, a flat diode, thyristor, GTO, IGBT, or the like is used, and a heat pipe cooler is used as the cooler.

ヒートパイプ式冷却器は、平型半導体素子が取り付けられる直方体状の受熱ブロックと、この受熱ブロックに取り付けられ、それぞれ受熱部および放熱部を有し、放熱部に複数枚の冷却フィンが取り付けられた複数本のヒートパイプとを備えている。   The heat pipe type cooler has a rectangular parallelepiped heat receiving block to which a flat semiconductor element is attached, and is attached to the heat receiving block, each having a heat receiving portion and a heat radiating portion, and a plurality of cooling fins are attached to the heat radiating portion. And a plurality of heat pipes.

ヒートパイプは、銅やアルミニウム等の熱伝導性の良い金属からなる円筒管の内部に純水等の冷媒を封入して構成されている（特許文献１，２参照）。   The heat pipe is configured by enclosing a coolant such as pure water in a cylindrical tube made of a metal having good thermal conductivity such as copper or aluminum (see Patent Documents 1 and 2).

この種のヒートパイプ式冷却器においては、平型半導体素子の構造上、その両面を冷却する必要があることから、特許文献１の図９（ａ）に記載されているように、１個の平型半導体素子を２個のヒートパイプ式冷却器の受熱ブロックで挟むようにして使用する構成が一般的である。   In this type of heat pipe type cooler, because both sides of the flat semiconductor element need to be cooled, as shown in FIG. In general, a flat semiconductor element is used so as to be sandwiched between heat receiving blocks of two heat pipe type coolers.

また電力変換装置では、その回路構成から複数個の平型半導体素子が用いられるので、これら複数個の半導体素子を、特許文献１の図９（ｂ）に記載されているように、複数個のヒートパイプ式冷却器の間に配設し、一括して積層したスタック構造として構成している。
特開２００４−１７２６３９号公報 特開２００６−２６９６２９号公報 In addition, since a plurality of flat semiconductor elements are used in the power conversion device due to its circuit configuration, the plurality of semiconductor elements can be combined with a plurality of semiconductor elements as described in FIG. It is arranged between heat pipe type coolers and is configured as a stack structure in which the layers are stacked together.
Japanese Patent Application Laid-Open No. 2004-172639 JP 2006-269629 A

しかしながら、上記のようなヒートパイプ式冷却器を用いた平型半導体素子の冷却構造では、ヒートパイプ式冷却器の受熱ブロックの両側に取り付けられる平型半導体素子の温度上昇に差が生じた場合、温度の低い側の平型半導体素子の冷却効率が低下する問題があった。   However, in the flat semiconductor element cooling structure using the heat pipe type cooler as described above, when there is a difference in temperature rise of the flat type semiconductor element mounted on both sides of the heat receiving block of the heat pipe type cooler, There has been a problem that the cooling efficiency of the flat semiconductor element on the lower temperature side is lowered.

本発明は、上述のような従来技術の問題を解決するためになされたものであり、その目的とするところは、ヒートパイプ式冷却器の受熱ブロックの両側にそれぞれ取り付けられる平型半導体素子相互に温度差が生じる場合であっても、それぞれの平型半導体素子を効率よく冷却することのできるヒートパイプ式冷却器を提供することにある。   The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to provide flat semiconductor elements mounted on both sides of a heat receiving block of a heat pipe type cooler. An object of the present invention is to provide a heat pipe type cooler capable of efficiently cooling each flat semiconductor element even when a temperature difference occurs.

上記目的を達成するために本発明によるヒートパイプ式冷却器は、対向する面に平型半導体素子を取り付ける第１および第２の素子取付面が設けられた直方体形状の受熱ブロックと、この受熱ブロックの対向する第１および第２の素子取付面の間に位置する面に取り付けられた複数本のヒートパイプと、これら複数本のヒートパイプの放熱部に設けられた複数枚の冷却フィンと、を備え、複数本のヒートパイプが、第１の素子取付面側に配設される第１のヒートパイプ列と、第２の素子取付面側に配設される第２のヒートパイプ列に分離して配設されていることを特徴とする。   In order to achieve the above object, a heat pipe cooler according to the present invention includes a rectangular parallelepiped heat receiving block provided with first and second element mounting surfaces for mounting a flat semiconductor element on opposite surfaces, and the heat receiving block. A plurality of heat pipes mounted on a surface located between the first and second element mounting surfaces facing each other, and a plurality of cooling fins provided in a heat radiation portion of the plurality of heat pipes. The plurality of heat pipes are separated into a first heat pipe row disposed on the first element mounting surface side and a second heat pipe row disposed on the second element mounting surface side. It is characterized by being arranged.

本発明によれば、第１の素子取付面に取り付けられる平型半導体素子からの熱は、その近傍に位置する第１のヒートパイプ列のヒートパイプを介して冷却フィンから放熱され、第２の素子取付面に取り付けられる平型半導体素子からの熱は、その近傍に位置する第２のヒートパイプ列のヒートパイプを介して冷却フィンから放熱されることになり、第１および第２の素子取付面に温度差が生じても効率よく放熱することができる。   According to the present invention, the heat from the flat semiconductor element attached to the first element attachment surface is dissipated from the cooling fin via the heat pipe of the first heat pipe array located in the vicinity thereof, and the second The heat from the flat semiconductor element attached to the element attachment surface is dissipated from the cooling fin through the heat pipe of the second heat pipe array located in the vicinity thereof, so that the first and second element attachments are performed. Even if a temperature difference occurs on the surface, heat can be efficiently radiated.

以下、本発明によるヒートパイプ式冷却器の実施の形態について図面を参照して説明する。図１（ａ）ないし（ｄ）は、本発明による第１の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の左側面図、（ｃ）は（ａ）の右側面図、（ｄ）は（ａ）の上面図である。図１（ａ）ないし（ｄ）において、ヒートパイプ式冷却器１は、直方体形状の受熱ブロック２と、複数本のヒートパイプ３と、複数枚の冷却フィン４ａ，４ｂとを備えている。   Embodiments of a heat pipe type cooler according to the present invention will be described below with reference to the drawings. FIGS. 1A to 1D show a heat pipe type cooler according to a first embodiment of the present invention, where FIG. 1A is a front view, FIG. 1B is a left side view of FIG. c) is a right side view of (a), and (d) is a top view of (a). 1A to 1D, a heat pipe cooler 1 includes a rectangular parallelepiped heat receiving block 2, a plurality of heat pipes 3, and a plurality of cooling fins 4a and 4b.

受熱ブロック２は、高い熱伝導性を有する金属で直方体形状に構成され、その対向する面に平型半導体素子を取り付ける第１および第２の素子取付面２ａ，２ｂが設けられている。複数本のヒートパイプ３は、それぞれ円筒管の内部に冷媒を封入して構成されており、受熱部および放熱部を有している。   The heat receiving block 2 is formed in a rectangular parallelepiped shape with a metal having high thermal conductivity, and first and second element mounting surfaces 2a and 2b for mounting a flat semiconductor element are provided on opposing surfaces thereof. The plurality of heat pipes 3 are each configured by enclosing a refrigerant in a cylindrical tube, and have a heat receiving portion and a heat radiating portion.

これら複数本のヒートパイプ３は、受熱ブロック２の対向する第１および第２の素子取付面２ａ，２ｂの間に位置する面２ｃに、それぞれの受熱部が所定の間隔をおいて埋設されるように取り付けられており、また第１の素子取付面２ａ側に配設される第１のヒートパイプ列３ａと、第２の素子取付面２ｂ側に配設される第２のヒートパイプ列３ｂに分離して配設されている。   Each of the plurality of heat pipes 3 is embedded in a surface 2c positioned between the first and second element mounting surfaces 2a and 2b facing each other in the heat receiving block 2 with a predetermined interval. The first heat pipe row 3a disposed on the first element mounting surface 2a side and the second heat pipe row 3b disposed on the second element mounting surface 2b side. Are arranged separately.

第１のヒートパイプ列３ａを構成する複数本（図示では３本）のヒートパイプ３の放熱部には、これらヒートパイプ３に共通に複数枚の冷却フィン４ａがヒートパイプ３の軸方向に沿って所定の間隔をおいて設けられており、また第２のヒートパイプ列３ｂを構成する複数本（図示では３本）のヒートパイプ３の放熱部には、これらヒートパイプ３に共通に複数枚の冷却フィン４ｂがヒートパイプ３の軸方向に沿って所定の間隔をおいて設けられている。   A plurality of (three in the drawing) heat pipes 3 constituting the first heat pipe row 3 a have a plurality of cooling fins 4 a along the axial direction of the heat pipe 3 in common with the heat pipes 3. In addition, a plurality of (three in the figure) heat pipes 3 constituting the second heat pipe row 3b are provided in common in the heat pipes 3 in the heat dissipating part. The cooling fins 4b are provided at predetermined intervals along the axial direction of the heat pipe 3.

各冷却フィン４ａ，４ｂは、第１および第２の素子取付面２ａ，２ｂの対向する方向に対して直交する方向に給排気が行われるように、両端部が傾斜するように折り曲げられている。   Each cooling fin 4a, 4b is bent so that both ends thereof are inclined so that air supply / exhaust is performed in a direction orthogonal to the direction in which the first and second element mounting surfaces 2a, 2b oppose each other. .

これにより、第１の素子取付面２ａに取り付けられる図示しない平型半導体素子からの熱は，その近傍に位置する第１のヒートパイプ列３ａのヒートパイプ３を介して冷却フィン４ａから放熱され、第２の素子取付面２ｂに取り付けられる図示しない平型半導体素子からの熱は、その近傍に位置する第２のヒートパイプ列３ｂのヒートパイプ３を介して冷却フィン４ｂから放熱されることになる。   Thereby, heat from a flat semiconductor element (not shown) attached to the first element attachment surface 2a is dissipated from the cooling fin 4a via the heat pipe 3 of the first heat pipe row 3a located in the vicinity thereof, Heat from a flat semiconductor element (not shown) attached to the second element attachment surface 2b is radiated from the cooling fin 4b through the heat pipe 3 of the second heat pipe row 3b located in the vicinity thereof. .

また図示しないが、第２の素子取付面２ｂに取り付けられる平型半導体素子の反対側にさらにヒートパイプ式冷却器を配設するようにして複数個の半導体素子とヒートパイプ式冷却器を交互に積層するスタック構造とした場合においても、１個の平型半導体素子は、その両側の近傍に位置するヒートパイプ列によって確実に放熱されることになり、隣合う平型半導体素子との間で発熱に温度差が生じても、その影響を受けることなく効率的に冷却されることになる。   Although not shown, a plurality of semiconductor elements and heat pipe type coolers are alternately arranged so that a heat pipe type cooler is further arranged on the opposite side of the flat type semiconductor element attached to the second element attachment surface 2b. Even in the case of a stacked stack structure, one flat semiconductor element is surely dissipated heat by a heat pipe array located in the vicinity of both sides, and heat is generated between adjacent flat semiconductor elements. Even if a temperature difference occurs, the cooling is efficiently performed without being affected by the difference.

図２（ａ）および（ｂ）は、本発明による第２の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。本実施の形態が第１の実施の形態と異なる点は、第１および第２のヒートパイプ列３ａ，３ｂの冷却フィン１４ａ，１４ｂは、ヒートパイプ３の軸方向の取付位置を相対的に長さLだけずらして２列の冷却フィン１４ａ，１４ｂが千鳥状配置となるように構成されているところにある。長さLは、たとえば、冷却フィン１４ａ，１４ｂのピッチ（ヒートパイプ３の軸方向）の半分である。   2A and 2B show a heat pipe type cooler according to a second embodiment of the present invention, in which FIG. 2A is a front view and FIG. 2B is a right side view of FIG. . This embodiment is different from the first embodiment in that the cooling fins 14a and 14b of the first and second heat pipe rows 3a and 3b are relatively long in the axial mounting position of the heat pipe 3. The two cooling fins 14a and 14b are arranged so as to be in a staggered arrangement with a shift of L. The length L is, for example, half of the pitch of the cooling fins 14a and 14b (the axial direction of the heat pipe 3).

これにより、各ヒートパイプ列３ａ，３ｂは、互いの冷却フィン１４ａ，１４ｂにおける冷却風の流れが分離し、それぞれ円滑な流れが構成されることから、第１および第２の素子取付面２ａ，２ｂの放熱効率を向上させることができる。   Thereby, since each heat pipe row | line | column 3a, 3b isolate | separates the flow of the cooling air in mutual cooling fins 14a, 14b and each comprises a smooth flow, 1st and 2nd element attachment surface 2a, The heat radiation efficiency of 2b can be improved.

図３（ａ）および（ｂ）は、本発明による第３の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。本実施の形態が第１の実施の形態と異なる点は、第１および第２のヒートパイプ列３ａ，３ｂの冷却フィン２４ａ，２４ｂが、それぞれ近傍に位置する素子取付面２ａ，２ｂ側から吸気し、第１および第２のヒートパイプ列３ａ，３ｂの間から排気するように両端部を傾斜させて構成されているところにある。   3 (a) and 3 (b) show a heat pipe type cooler according to a third embodiment of the present invention, where (a) is a front view and (b) is a right side view of (a). . This embodiment is different from the first embodiment in that the cooling fins 24a and 24b of the first and second heat pipe rows 3a and 3b are sucked from the element mounting surfaces 2a and 2b, respectively, located in the vicinity. However, both ends are inclined so as to exhaust air from between the first and second heat pipe rows 3a and 3b.

各冷却フィン２４ａ，２４ｂは、第１および第２の素子取付面２ａ，２ｂの対向する方向と同じ方向であるが、ヒートパイプ式冷却器１の外側から内側にそれぞれ独立して給排気が行われる。   The cooling fins 24a and 24b are in the same direction as the opposing directions of the first and second element mounting surfaces 2a and 2b, but supply and exhaust air independently from the outside to the inside of the heat pipe cooler 1. Is called.

これにより、第１の素子取付面２ａからの熱は，その近傍に位置する第１のヒートパイプ列３ａの冷却フィン２４ａから放出され、第２の素子取付面２ｂからの熱は、その近傍に位置する第２のヒートパイプ列３ｂの冷却フィン２４ｂから放出され、各ヒートパイプ列３ａ，３ｂの放熱系統が相互に干渉することなく独立して放熱を行うことから、第１および第２の素子取付面２ａ，２ｂの放熱効率を向上させることができる。   Thereby, the heat from the first element mounting surface 2a is released from the cooling fins 24a of the first heat pipe row 3a located in the vicinity thereof, and the heat from the second element mounting surface 2b is in the vicinity thereof. The first and second elements are released from the cooling fins 24b of the second heat pipe row 3b positioned and the heat radiation systems of the heat pipe rows 3a and 3b independently radiate without interfering with each other. The heat radiation efficiency of the mounting surfaces 2a and 2b can be improved.

図４（ａ）および（ｂ）は、本発明による第４の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。本実施の形態が第３の実施の形態と異なる点は、第１および第２のヒートパイプ列３ａ，３ｂの冷却フィン３４ａ，３４ｂが、それぞれ第１および第２のヒートパイプ列３ａ，３ｂの間から吸気し、近傍に位置する素子取付面２ａ，２ｂ側から排気するように両端部を傾斜させて構成されているところにある。   4 (a) and 4 (b) show a heat pipe type cooler according to a fourth embodiment of the present invention, where (a) is a front view and (b) is a right side view of (a). . This embodiment differs from the third embodiment in that the cooling fins 34a and 34b of the first and second heat pipe rows 3a and 3b are different from those of the first and second heat pipe rows 3a and 3b, respectively. Both ends are inclined so that air is taken in from between and exhausted from the element mounting surfaces 2a and 2b located in the vicinity.

本実施の形態においても、第３の実施の形態と同様に、第１の素子取付面２ａからの熱は，第１のヒートパイプ列３ａの冷却フィン３４ａから放出され、第２の素子取付面２ｂからの熱は、第２のヒートパイプ列３ｂの冷却フィン３４ｂから放出されることになり、各ヒートパイプ列３ａ，３ｂの放熱系統が相互に干渉することなく独立して放熱を行うので、第１および第２の素子取付面２ａ，２ｂの放熱効率を向上させることができる。   Also in the present embodiment, similarly to the third embodiment, heat from the first element mounting surface 2a is released from the cooling fins 34a of the first heat pipe row 3a, and the second element mounting surface. The heat from 2b is released from the cooling fins 34b of the second heat pipe row 3b, and the heat radiation systems of the heat pipe rows 3a and 3b perform heat radiation independently without interfering with each other. The heat radiation efficiency of the first and second element mounting surfaces 2a and 2b can be improved.

図５（ａ）ないし（ｃ）は、本発明による第５の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図、（ｃ）は（ａ）の上面図である。
本実施の形態が第１の実施の形態と異なる点は、第１および第２のヒートパイプ列３ａ，３ｂの冷却フィン４４が、第１および第２のヒートパイプ列３ａ，３ｂの各ヒートパイプ３に共通に一体に取り付けられており、その第１および第２のヒートパイプ列３ａ，３ｂの間に位置する部分に通気口５が形成されているところにある。 FIGS. 5A to 5C show a heat pipe type cooler according to a fifth embodiment of the present invention, where FIG. 5A is a front view, FIG. 5B is a right side view of FIG. c) is a top view of (a).
The present embodiment is different from the first embodiment in that the cooling fins 44 of the first and second heat pipe rows 3a and 3b are used as the heat pipes of the first and second heat pipe rows 3a and 3b. The air vent 5 is formed in a portion located between the first and second heat pipe rows 3a and 3b.

これにより、冷却フィン４ａ，４ｂは、両端部の傾斜により流れる冷却風のみならず、通気口５を上昇する冷却風も取り込んで放熱することができ、しかも対峙する第１および第２のヒートパイプ列３ａ，３ｂの熱的な干渉も低減されることになるので、第１および第２の素子取付面２ａ，２ｂの放熱効率を向上させることができる。   As a result, the cooling fins 4a and 4b can take in not only the cooling air flowing due to the inclination of both ends but also the cooling air rising up the vent hole 5, and can dissipate heat, and the first and second heat pipes facing each other. Since thermal interference between the rows 3a and 3b is also reduced, the heat radiation efficiency of the first and second element mounting surfaces 2a and 2b can be improved.

（ａ）ないし（ｄ）は、本発明による第１の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の左側面図、（ｃ）は（ａ）の右側面図、（ｄ）は（ａ）の上面図である。(A) thru | or (d) show the heat pipe type cooler based on 1st Embodiment by this invention, (a) is a front view, (b) is a left view of (a), (c) (A) is a right side view of (a), (d) is a top view of (a). （ａ）および（ｂ）は、本発明による第２の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。(A) And (b) shows the heat pipe type cooler based on 2nd Embodiment by this invention, (a) is a front view, (b) is a right view of (a). （ａ）および（ｂ）は、本発明による第３の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。(A) And (b) shows the heat pipe type cooler based on 3rd Embodiment by this invention, (a) is a front view, (b) is a right view of (a). （ａ）および（ｂ）は、本発明による第４の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図である。(A) And (b) shows the heat pipe type cooler based on 4th Embodiment by this invention, (a) is a front view, (b) is a right view of (a). （ａ）ないし（ｃ）は、本発明による第５の実施の形態に係るヒートパイプ式冷却器を示し、（ａ）は正面図、（ｂ）は（ａ）の右側面図、（ｃ）は（ａ）の上面図である。(A) thru | or (c) show the heat pipe type cooler which concerns on 5th Embodiment by this invention, (a) is a front view, (b) is a right view of (a), (c) FIG. 3 is a top view of (a).

符号の説明Explanation of symbols

１：ヒートパイプ式冷却器
２：受熱ブロック
２ａ，２ｂ：素子取付面
３：ヒートパイプ
３ａ，３ｂ：ヒートパイプ列
４ａ，４ｂ，１４ａ，１４ｂ，２４ａ，２４ｂ，３４ａ，３４ｂ，４４：冷却フィン
５：通気口 1: Heat pipe type cooler 2: Heat receiving block 2a, 2b: Element mounting surface 3: Heat pipe 3a, 3b: Heat pipe row 4a, 4b, 14a, 14b, 24a, 24b, 34a, 34b, 44: Cooling fin 5 :vent

Claims (7)

対向する面に平型半導体素子を取り付ける第１および第２の素子取付面が設けられた直方体形状の受熱ブロックと、
この受熱ブロックの対向する第１および第２の素子取付面の間に位置する面に取り付けられた複数本のヒートパイプと、
これら複数本のヒートパイプの放熱部に設けられた複数枚の冷却フィンと、
を備え、前記複数本のヒートパイプが、前記第１の素子取付面側に配設される第１のヒートパイプ列と、前記第２の素子取付面側に配設される第２のヒートパイプ列に分離して配設されていることを特徴とするヒートパイプ式冷却器。 A rectangular parallelepiped heat receiving block provided with first and second element mounting surfaces for mounting a flat semiconductor element on opposite surfaces;
A plurality of heat pipes attached to a surface located between the first and second element mounting surfaces facing each other of the heat receiving block;
A plurality of cooling fins provided in the heat dissipating part of the plurality of heat pipes;
A plurality of heat pipes, a first heat pipe array disposed on the first element mounting surface side, and a second heat pipe disposed on the second element mounting surface side A heat pipe type cooler, wherein the cooler is arranged in rows. 前記第１および第２のヒートパイプ列に、互いに独立した複数枚の冷却フィンが設けられていることを特徴とする請求項１に記載のヒートパイプ式冷却器。   The heat pipe type cooler according to claim 1, wherein a plurality of cooling fins independent of each other are provided in the first and second heat pipe rows. 前記第１および第２のヒートパイプ列の冷却フィンは、前記第１および第２の素子取付面の対向する方向と直交する方向に給排気が行われるように構成されていることを特徴とする請求項１または２に記載のヒートパイプ式冷却器。   The cooling fins of the first and second heat pipe rows are configured to be supplied and exhausted in a direction orthogonal to a direction in which the first and second element mounting surfaces are opposed to each other. The heat pipe type cooler according to claim 1 or 2. 前記第１および第２のヒートパイプ列の冷却フィンは、前記ヒートパイプの軸方向の取付位置を異ならせて千鳥状配置となるように構成されていることを特徴とする請求項１ないし３のいずれかに記載のヒートパイプ式冷却器。   The cooling fins of the first and second heat pipe rows are configured to have a staggered arrangement with different mounting positions in the axial direction of the heat pipes. The heat pipe type cooler according to any one of the above. 前記第１および第２のヒートパイプ列の冷却フィンは、それぞれ近傍に位置する素子取付面側から吸気し、前記第１および第２のヒートパイプ列の間から排気するように構成されていることを特徴とする請求項２に記載のヒートパイプ式冷却器。   The cooling fins of the first and second heat pipe rows are configured to take in air from the element mounting surface side located in the vicinity and exhaust from between the first and second heat pipe rows, respectively. The heat pipe type cooler according to claim 2. 前記第１および第２のヒートパイプ列の冷却フィンは、それぞれ前記第１および第２のヒートパイプ列の間から吸気し、それぞれ近傍に位置する素子取付面側から排気するように構成されていることを特徴とする請求項２に記載のヒートパイプ式冷却器。   The cooling fins of the first and second heat pipe rows are configured to take in air from between the first and second heat pipe rows and exhaust from the element mounting surface side located in the vicinity, respectively. The heat pipe type cooler according to claim 2 characterized by things. 前記第１および第２のヒートパイプ列の冷却フィンは、前記第１および第２のヒートパイプ列に共通に一体に取り付けられ、前記第１および第２のヒートパイプ列の間に位置する部分に通気口が形成されていることを特徴とする請求項１に記載のヒートパイプ式冷却器。   The cooling fins of the first and second heat pipe rows are integrally attached in common to the first and second heat pipe rows, and are located between the first and second heat pipe rows. The heat pipe type cooler according to claim 1, wherein a vent is formed.
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JP2012021698A (en) * 2010-07-14 2012-02-02 Ntec Co Ltd Radiation fin and radiator
WO2012038046A3 (en) * 2010-09-24 2012-08-23 Rawema Countertrade Handelsgesellschaft Mbh Heat exchanger
JP2014224652A (en) * 2013-05-16 2014-12-04 古河電気工業株式会社 Heat sink
WO2016075742A1 (en) * 2014-11-10 2016-05-19 古河電気工業株式会社 Heat sink

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CN111478624B (en) * 2020-04-09 2021-07-16 中国科学院上海应用物理研究所 Hot end seat, thermoelectric power generation system, liquid reactor and operation method and application thereof

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JPH06276741A (en) * 1993-03-17 1994-09-30 Toshiba Corp Heat sink for semiconductor element
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Publication number Priority date Publication date Assignee Title
FR2946420A1 (en) * 2009-06-05 2010-12-10 Ls Mtron Ltd Oil cooler for power steering device of vehicle, has turbulence producing device whose surface is in contact with inner peripheral surface of tube to transfer heat from oil to exterior of tube, where device is inserted into tube
JP2012021698A (en) * 2010-07-14 2012-02-02 Ntec Co Ltd Radiation fin and radiator
WO2012038046A3 (en) * 2010-09-24 2012-08-23 Rawema Countertrade Handelsgesellschaft Mbh Heat exchanger
JP2014224652A (en) * 2013-05-16 2014-12-04 古河電気工業株式会社 Heat sink
WO2016075742A1 (en) * 2014-11-10 2016-05-19 古河電気工業株式会社 Heat sink
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CN107076521B (en) * 2014-11-10 2019-05-07 古河电气工业株式会社 Radiator

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