JP2008300394A - Substrate joining device and substrate joining method - Google Patents

Substrate joining device and substrate joining method Download PDF

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JP2008300394A
JP2008300394A JP2007141592A JP2007141592A JP2008300394A JP 2008300394 A JP2008300394 A JP 2008300394A JP 2007141592 A JP2007141592 A JP 2007141592A JP 2007141592 A JP2007141592 A JP 2007141592A JP 2008300394 A JP2008300394 A JP 2008300394A
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JP2008300394A5 (en
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Masahiro Yoshihashi
正博 吉橋
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Nikon Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate joining device capable of measuring the gap between substrates with high precision when various substrates including wafers are joined. <P>SOLUTION: The substrate joining device includes a first substrate holding means (101) of holding a first set of substrates (W1), a second substrate holding means (201) of holding a second set of substrates (W2), and a moving means (205) of moving at least one of the first and second substrate holding means in a direction perpendicular to surfaces of the substrates. The substrate joining device further includes a lighting means (403) of irradiating side faces of the first and second sets of substrates with light, a camera (401) which photographs the side faces of the first and second sets of substrates from a position facing the lighting means across the first and second sets of substrates, and an image processing means (405) of obtaining a value of the gap between the first and second sets of substrates from an image that the camera photographs. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ウエハなど複数の基板を接合させる基板接合装置および基板接合方法に関する。   The present invention relates to a substrate bonding apparatus and a substrate bonding method for bonding a plurality of substrates such as a wafer.

半導体集積回路を使用するノートパソコンや携帯電話などは、近年、ますます高度の機能を備えるようになっている。この結果、半導体集積回路の高密度化、高機能化の要求が高まっている。   In recent years, notebook computers and mobile phones that use semiconductor integrated circuits have become increasingly sophisticated. As a result, there is an increasing demand for higher density and higher functionality of semiconductor integrated circuits.

半導体集積回路の高密度化、高機能化のための一つの方法は、ウエハなどの基板を接合し、基板を積層させることである。   One method for increasing the density and functionality of semiconductor integrated circuits is to bond substrates such as wafers and stack the substrates.

基板を接合させる場合には、たとえば、ウエハの電極同士を接合させる必要があるので、互いに位置合わせして接合させる必要がある。基板を位置合わせして接合させるには、一対の基板保持手段を備える基板接合装置を使用する。ここで、接合させる基板を第１および第２の基板とする。まず、第１および第２の基板を、それぞれ一対の基板保持手段に位置合わせして保持させる。つぎに、一対の基板保持手段を位置合わせした状態で、一対の基板保持手段の少なくとも一方を移動させることによって第１および第２の基板を接合させる。   In the case of bonding the substrates, for example, since it is necessary to bond the electrodes of the wafer, they need to be aligned and bonded to each other. In order to align and bond the substrates, a substrate bonding apparatus including a pair of substrate holding means is used. Here, the substrates to be bonded are first and second substrates. First, the first and second substrates are respectively positioned and held by a pair of substrate holding means. Next, with the pair of substrate holding means aligned, at least one of the pair of substrate holding means is moved to join the first and second substrates.

上記のような基板接合装置は、たとえば、特許文献１に記載されている。   Such a substrate bonding apparatus is described in Patent Document 1, for example.

特開２００５−３０２８５８号公報JP 2005-302858 A

一対の基板保持手段の少なくとも一方を移動させることによって第１および第２の基板を接合させる際に、第１および第２の基板の間のギャップの値を測定し、該値にしたがって基板保持手段を移動させながら接合させるのが好ましい。   When the first and second substrates are joined by moving at least one of the pair of substrate holding means, the value of the gap between the first and second substrates is measured, and the substrate holding means is determined according to the value. It is preferable to join them while moving them.

第１および第２の基板の間のギャップの値を測定するために、一対の基板保持手段に、距離測定用の静電容量センサや渦電流センサを設置して一対の基板保持手段間の距離を測定し、基板の厚さが既知として基板間のギャップを推定する方法がある。しかし、この方法では、基板の厚さを既知とするので、高精度で測定することはできず、また、基板面の傾きなどを測定することはできない。   In order to measure the value of the gap between the first and second substrates, a distance measuring capacitance sensor or eddy current sensor is installed in the pair of substrate holding means, and the distance between the pair of substrate holding means There is a method of estimating the gap between the substrates, assuming that the thickness of the substrate is known. However, since the thickness of the substrate is known in this method, it cannot be measured with high accuracy, and the inclination of the substrate surface cannot be measured.

また、液晶表示パネルなどの透明な基板の場合には、第１の基板の位置合わせマークと第２の基板の位置合わせマークを基板面の上部または下部から観察し、該位置合わせマークのフォーカス位置を測定することによって、基板間のギャップを推定する方法がある。しかし、ウエハは透明でないので、この方法はウエハには使用することができず、また、この方法によって基板面の傾きを測定するのは困難である。   In the case of a transparent substrate such as a liquid crystal display panel, the alignment mark of the first substrate and the alignment mark of the second substrate are observed from the upper or lower portion of the substrate surface, and the focus position of the alignment mark is measured. There is a method of estimating the gap between the substrates by measuring. However, since the wafer is not transparent, this method cannot be used for the wafer, and it is difficult to measure the tilt of the substrate surface by this method.

そこで、ウエハを含む種々の基板を接合させる際に基板間のギャップを高精度で測定することのできる基板接合装置および基板接合方法に対するニーズがある。   Therefore, there is a need for a substrate bonding apparatus and a substrate bonding method that can measure a gap between substrates with high accuracy when bonding various substrates including a wafer.

本発明による基板接合装置は、第１の組の基板および第２の組の基板を接合させる基板接合装置である。本発明による基板接合装置は、前記第１の組の基板を保持する第１の基板保持手段と、前記第２の組の基板を保持する第２の基板保持手段と、前記第１および第２の基板保持手段の内の少なくとも一方を、基板の面と垂直な方向に移動させる移動手段と、を備える。本発明による基板接合装置は、前記第１および第２の組の基板の側面に光を照射する照明手段と、前記第１および第２の組の基板を隔てて、前記照明手段と対向する位置から、前記第１の組の基板および第２の組の基板の側面を撮影するカメラと、前記カメラの撮影した画像から、前記第１および第２の組の基板の間のギャップの値を求める画像処理手段と、をさらに備えたことを特徴とする。   A substrate bonding apparatus according to the present invention is a substrate bonding apparatus that bonds a first set of substrates and a second set of substrates. The substrate bonding apparatus according to the present invention includes a first substrate holding unit that holds the first set of substrates, a second substrate holding unit that holds the second set of substrates, and the first and second units. Moving means for moving at least one of the substrate holding means in a direction perpendicular to the surface of the substrate. In the substrate bonding apparatus according to the present invention, a lighting unit that irradiates light to side surfaces of the first and second sets of substrates, and a position facing the lighting unit with the first and second sets of substrates being separated from each other. From the camera that images the side surfaces of the first set of substrates and the second set of substrates and the image captured by the camera, the value of the gap between the first and second sets of substrates is obtained. And an image processing means.

本発明による基板接合方法は、基板接合装置によって、第１の組の基板および第２の組の基板を接合させる基板接合方法である。本発明による基板接合方法は、前記第１および第２の組の基板の側面を照射する照明装置と、前記第１および第２の組の基板を隔てて、対向する位置に設置されたカメラによって、前記第１および第２の組の基板の側面の画像を取得するステップと、取得した画像を処理し、前記第１および第２の組の基板間のギャップの情報を求めるステップと、を含むことを特徴とする。   The substrate bonding method according to the present invention is a substrate bonding method in which a first set of substrates and a second set of substrates are bonded by a substrate bonding apparatus. The substrate bonding method according to the present invention includes a lighting device that irradiates the side surfaces of the first and second sets of substrates, and a camera installed at a position facing the first and second sets of substrates. Obtaining a side image of the first and second sets of substrates, and processing the acquired images to determine information about a gap between the first and second sets of substrates. It is characterized by that.

本発明においては、第１および第２の組の基板を隔てて、照明手段と対向する位置から、第１の組の基板および第２の組の基板の側面を撮影して画像を採取するので、照明光が、丸みを有する基板のエッジで反射されることはなく、基板のエッジの形状の、高精度の画像を得ることができる。したがって、第１および第２の組の基板の間のギャップの値を高い精度で求めることができる。   In the present invention, since the first and second sets of substrates are separated and the side surfaces of the first set of substrates and the second set of substrates are photographed from a position facing the illumination means, images are collected. The illumination light is not reflected by the edge of the substrate having roundness, and a highly accurate image of the shape of the edge of the substrate can be obtained. Therefore, the value of the gap between the first and second sets of substrates can be obtained with high accuracy.

本発明によれば、ウエハを含む種々の基板を接合させる際に基板間のギャップを高精度で測定することのできる基板接合装置および基板接合方法が得られる。   According to the present invention, it is possible to obtain a substrate bonding apparatus and a substrate bonding method capable of measuring a gap between substrates with high accuracy when bonding various substrates including a wafer.

図１は、本発明の一実施形態による、基板接合装置の構成を示す図である。   FIG. 1 is a diagram illustrating a configuration of a substrate bonding apparatus according to an embodiment of the present invention.

本実施形態による基板接合装置は、上部フレーム３０１と下部フレーム３０３とを含む。また、基板接合装置は、上部フレーム３０１に設置された第１のステージ１０５と、第１のステージ１０５に設置された第１の中間プレート１０３と、第１の中間プレート１０３に設置された第１の基板ホルダ（基板保持手段）１０１と、を含む。第１の基板ホルダ１０１は、第１の基板Ｗ１を保持する。基板Ｗ１は、複数の基板を接合した基板の組であってもよい。さらに、基板接合装置は、下部フレーム３０３に設置された第２のステージ２０５と、第２のステージ２０５に設置された第２の中間プレート２０３と、第２の中間プレート２０３に設置された第２の基板ホルダ（基板保持手段）２０１と、を含む。第２の基板ホルダ２０１は、第２の基板Ｗ２を保持する。基板Ｗ２は、複数の基板を接合した基板の組であってもよい。   The substrate bonding apparatus according to the present embodiment includes an upper frame 301 and a lower frame 303. Further, the substrate bonding apparatus includes a first stage 105 installed on the upper frame 301, a first intermediate plate 103 installed on the first stage 105, and a first stage installed on the first intermediate plate 103. Substrate holder (substrate holding means) 101. The first substrate holder 101 holds the first substrate W1. The substrate W1 may be a set of substrates obtained by bonding a plurality of substrates. Further, the substrate bonding apparatus includes a second stage 205 installed on the lower frame 303, a second intermediate plate 203 installed on the second stage 205, and a second stage installed on the second intermediate plate 203. Substrate holder (substrate holding means) 201. The second substrate holder 201 holds the second substrate W2. The substrate W2 may be a set of substrates obtained by bonding a plurality of substrates.

第１の基板ホルダ１０１および第２の基板ホルダ２０１は、静電チャックまたは真空チャックによって基板を保持するように構成してもよい。   The first substrate holder 101 and the second substrate holder 201 may be configured to hold the substrate by an electrostatic chuck or a vacuum chuck.

ここで、基板面をＸＹ面とし、基板面の中心を通り基板面に垂直な軸をＺ軸とする。第１のステージ１０５は、位置調整のために、Ｘ、Ｙ軸方向に移動可能であり、Ｚ軸の周りに回転可能なように構成される。また、第２のステージ２０５は、位置調整のために、Ｘ、Ｙ軸方向に移動可能であり、Ｚ軸の周りに回転可能であり、さらに、Ｘ軸およびＹ軸の周りに面を傾けることができるように構成される。第２のステージ２０５は、さらに、Ｚ軸方向に移動可能に構成される。第１のステージ１０５および第２のステージ２０５の動作は、駆動系制御装置４０９によって制御される。駆動系制御装置４０９は、たとえば、第２のステージ２０５のＺ軸方向の位置など、制御対象の位置情報を把握しているのが好ましい。   Here, the substrate surface is defined as an XY plane, and an axis passing through the center of the substrate surface and perpendicular to the substrate surface is defined as a Z axis. The first stage 105 is configured to be movable in the X and Y axis directions and to be rotatable around the Z axis for position adjustment. Further, the second stage 205 can be moved in the X and Y axis directions for position adjustment, can be rotated around the Z axis, and can be tilted around the X axis and the Y axis. It is configured to be able to. The second stage 205 is further configured to be movable in the Z-axis direction. The operations of the first stage 105 and the second stage 205 are controlled by the drive system controller 409. The drive system control device 409 preferably knows position information of the control target such as the position of the second stage 205 in the Z-axis direction, for example.

本実施形態においては、第１および第２のステージの両方が位置調整のためにＸ、Ｙ軸方向に移動可能に構成したが、一方のみが位置調整のためにＸ、Ｙ軸方向に移動可能に構成してもよい。また、本実施形態においては、第２のステージのみがＺ軸方向に移動可能に構成したが、第１のステージのみ、または第１および第２のステージの両方がＺ軸方向に移動可能に構成してもよい。また、本実施形態においては、第２のステージのみがＸ軸およびＹ軸の周りに面を傾けることができるように構成したが、第１のステージのみ、または第１および第２のステージの両方がＸ軸およびＹ軸の周りに面を傾けることができるように構成してもよい。   In the present embodiment, both the first and second stages are configured to be movable in the X and Y axis directions for position adjustment, but only one of them is movable in the X and Y axis directions for position adjustment. You may comprise. In the present embodiment, only the second stage is configured to be movable in the Z-axis direction, but only the first stage or both the first and second stages are configured to be movable in the Z-axis direction. May be. Further, in the present embodiment, only the second stage is configured to be able to tilt the surface around the X axis and the Y axis, but only the first stage or both the first and second stages. May be configured such that the surface can be tilted around the X axis and the Y axis.

図１に示すように、基板Ｗ１および基板Ｗ２の側面に光を照射するように照明装置４０３が設置される。図１に示すように、照明装置４０３は、下部フレーム３０３に固定してもよい。あるいは、上部フレーム３０１に固定してもよい。照明装置４０３として、たとえば、市販の青色発光ダイオード・バーを使用してもよい。   As shown in FIG. 1, an illumination device 403 is installed so as to irradiate light to the side surfaces of the substrate W1 and the substrate W2. As shown in FIG. 1, the lighting device 403 may be fixed to the lower frame 303. Alternatively, it may be fixed to the upper frame 301. For example, a commercially available blue light-emitting diode bar may be used as the lighting device 403.

図１に示すように、基板Ｗ１および基板Ｗ２を隔てて、照明装置４０３と対向する位置に、基板Ｗ１および基板Ｗ２の側面を撮影するようにカメラ４０１が設置される。図１に示すように、カメラ４０１は、下部フレーム３０３に固定してもよい。あるいは、上部フレーム３０１に固定してもよい。   As shown in FIG. 1, a camera 401 is installed at a position facing the illumination device 403 across the substrate W1 and the substrate W2 so as to photograph the side surfaces of the substrate W1 and the substrate W2. As shown in FIG. 1, the camera 401 may be fixed to the lower frame 303. Alternatively, it may be fixed to the upper frame 301.

図２は、本発明の一実施形態による基板接合装置の、照明装置およびカメラの構成を示す図である。   FIG. 2 is a diagram illustrating the configuration of the illumination device and the camera of the substrate bonding apparatus according to the embodiment of the present invention.

図３は、本発明の一実施形態による基板接合装置の、照明装置およびカメラの側面を示す図である。   FIG. 3 is a view showing a side surface of the lighting device and the camera of the substrate bonding apparatus according to the embodiment of the present invention.

図２および３に示すように、照明装置４０３Ａおよびカメラ４０１Ａは、基板を隔てて対向する位置に配置される。また、照明装置４０３Ｂおよびカメラ４０１Ｂは、基板を隔てて対向する位置に配置される。このように配置することにより、照明装置４０３Ａまたは４０３Ｂに放射された照明光が、丸みを有する基板（ウエハ）の周縁部で反射されることはなく、カメラ４０１Ａまたは４０１Ｂによって、基板（ウエハ）の周縁部の形状の、高精度の画像を得ることができる。また、上記の配置において、照明装置４０３Ａおよびカメラ４０１Ａを結ぶ直線は、照明装置４０３Ｂおよびカメラ４０１Ｂを結ぶ直線と直交する。上記２本の直線を、先に説明したＸ軸およびＹ軸と一致させれば、後で説明するように、測定結果にしたがって、第２のステージ２０５をＸ軸およびＹ軸の周りに面を傾けて基板Ｗ２の面の傾きを調整することができるので都合がよい。   As shown in FIGS. 2 and 3, the illumination device 403A and the camera 401A are arranged at positions facing each other with a substrate interposed therebetween. In addition, the lighting device 403B and the camera 401B are arranged at positions facing each other with a substrate interposed therebetween. By arranging in this way, the illumination light emitted to the illumination device 403A or 403B is not reflected by the peripheral edge of the round substrate (wafer), and the camera 401A or 401B causes the substrate (wafer) to be reflected. A highly accurate image of the shape of the peripheral edge can be obtained. In the above arrangement, a straight line connecting the lighting device 403A and the camera 401A is orthogonal to a straight line connecting the lighting device 403B and the camera 401B. If the two straight lines coincide with the X-axis and Y-axis described above, the surface of the second stage 205 is placed around the X-axis and Y-axis according to the measurement result, as will be described later. It is convenient because the tilt of the surface of the substrate W2 can be adjusted by tilting.

図１に示すように、基板接合装置は、カメラ４０１および照明装置４０３を制御する撮像系制御装置４０７およびカメラ４０１の撮影した画像を処理する画像処理装置４０５を備える。   As shown in FIG. 1, the substrate bonding apparatus includes an imaging system control device 407 that controls a camera 401 and an illumination device 403 and an image processing device 405 that processes an image captured by the camera 401.

撮像系制御装置４０７は、カメラ４０１、照明装置４０３、画像処理装置４０５および駆動系制御装置４０９に接続される。   The imaging system control device 407 is connected to the camera 401, the illumination device 403, the image processing device 405, and the drive system control device 409.

画像処理装置４０５は、カメラ４０１および撮像系制御装置４０７に接続される。   The image processing device 405 is connected to the camera 401 and the imaging system control device 407.

図４は、カメラ４０１、照明装置４０３、画像処理装置４０５および撮像系制御装置４０７によってギャップの情報を求め、該ギャップの情報にしたがって駆動系制御装置４０９によってステージの位置を制御する、本発明の一実施形態による基板接合方法を示す流れ図である。   FIG. 4 shows the gap information obtained by the camera 401, the illumination device 403, the image processing device 405, and the imaging system control device 407, and the stage position is controlled by the drive system control device 409 in accordance with the gap information. 3 is a flowchart illustrating a substrate bonding method according to an embodiment.

ステップＳ４０１０において、撮像系制御装置４０７は、駆動系制御装置４０９から第２のステージ２０５の位置の情報を獲得し、基板Ｗ１および基板Ｗ２の側面を撮影することができるようにカメラ４０１および照明装置４０３の設定を行う。たとえば、Ｚ軸方向に第１のステージ１０５に向けて移動中の第２のステージ２０５と、第１のステージ１０５との間の距離が第１の所定の値以下となったときにカメラ４０１および照明装置４０３の設定を開始するようにしてもよい。   In step S4010, the imaging system control device 407 acquires information on the position of the second stage 205 from the drive system control device 409, and can shoot the side surfaces of the substrate W1 and the substrate W2, and the camera 401 and the illumination device. 403 is set. For example, when the distance between the second stage 205 that is moving toward the first stage 105 in the Z-axis direction and the first stage 105 becomes equal to or less than a first predetermined value, the camera 401 and You may make it start the setting of the illuminating device 403. FIG.

ステップＳ４０２０において、カメラ４０１は、駆動系制御装置４０９から第２のステージ２０５の位置の情報を獲得した撮像系制御装置４０７からの指示にしたがって基板Ｗ１およびＷ２の側面の画像を取得する。たとえば、Ｚ軸方向に第１のステージ１０５に向けて移動中の第２のステージ２０５と、第１のステージ１０５との間の距離が、第１の所定の値より小さい第２の所定の値以下となったときに基板Ｗ１およびＷ２の側面の画像を取得するようにしてもよい。   In step S4020, the camera 401 acquires the images of the side surfaces of the substrates W1 and W2 in accordance with the instruction from the imaging system control device 407 that acquired the position information of the second stage 205 from the drive system control device 409. For example, the second predetermined value in which the distance between the second stage 205 moving toward the first stage 105 in the Z-axis direction and the first stage 105 is smaller than the first predetermined value. You may make it acquire the image of the side surface of the board | substrates W1 and W2 when it becomes below.

ステップＳ４０３０において、画像処理装置４０５は、撮像系制御装置４０７からの指示にしたがってカメラ４０１の取得した画像を受け取り、該画像の処理を行い、接合される一対の基板間のギャップの情報を求める。   In step S4030, the image processing device 405 receives an image acquired by the camera 401 in accordance with an instruction from the imaging system control device 407, processes the image, and obtains information on a gap between the pair of substrates to be bonded.

図５は、カメラ４０１Ａによって撮影された基板Ｗ１および基板Ｗ２の側面の画像を示す図である。ここで、照明装置４０３Ａとカメラ４０１Ａとを結ぶ直線は、Ｘ軸と一致しているとする。図５において、斜線を加えた部分は基板Ｗ１および基板Ｗ２を示し、符号Ｇを付した部分は、２枚の基板の間のギャップを示す。図５において、基板Ｗ１の面は水平であるが、基板Ｗ２の面は水平方向に対して所定の角度で傾いている。本方法によれば、基板間のギャップに加え、このような基板面の傾きを測定することができる。   FIG. 5 is a diagram illustrating images of the side surfaces of the substrate W1 and the substrate W2 captured by the camera 401A. Here, it is assumed that a straight line connecting the lighting device 403A and the camera 401A coincides with the X axis. In FIG. 5, the hatched portions indicate the substrate W1 and the substrate W2, and the portion denoted by the reference symbol G indicates a gap between the two substrates. In FIG. 5, the surface of the substrate W1 is horizontal, but the surface of the substrate W2 is inclined at a predetermined angle with respect to the horizontal direction. According to this method, in addition to the gap between the substrates, such a tilt of the substrate surface can be measured.

カメラ４０１のレンズの画角は、一例として、
0.75mm X 1mm
であり、画素数は、たとえば、
1200 X 1600
である。この結果、１画素の１辺は０．６２５マイクロメータに対応する。したがって、１マイクロメータ以内の精度で、２枚の基板の間のギャップを測定することができる。 As an example, the angle of view of the lens of the camera 401 is
0.75mm X 1mm
And the number of pixels is, for example,
1200 x 1600
It is. As a result, one side of one pixel corresponds to 0.625 micrometers. Therefore, the gap between the two substrates can be measured with an accuracy within 1 micrometer.

ステップＳ４０４０において、画像処理装置４０５は、求めた、一対の基板間のギャップの情報を、撮像系制御装置４０７を経由して駆動系制御装置４０９に送る。あるいは、画像処理装置４０５は、一対の基板間のギャップの情報を直接駆動系制御装置４０９に送ってもよい。駆動系制御装置４０９は、受け取った一対の基板間のギャップの情報にしたがって、第２のステージ２０５をＺ軸方向に移動させ、または、Ｘ軸またはＹ軸の周りに第２のステージ２０５の面を傾けて、基板Ｗ１および基板Ｗ２の面を互いに平行とする。   In step S <b> 4040, the image processing apparatus 405 sends the obtained information on the gap between the pair of substrates to the drive system control apparatus 409 via the imaging system control apparatus 407. Alternatively, the image processing device 405 may send information on the gap between the pair of substrates directly to the drive system control device 409. The drive system controller 409 moves the second stage 205 in the Z-axis direction according to the received information on the gap between the pair of substrates, or the surface of the second stage 205 around the X-axis or Y-axis. Is inclined so that the surfaces of the substrate W1 and the substrate W2 are parallel to each other.

具体的に、図５に示したように、基板Ｗ２の面が水平方向に対して所定の角度で傾いている場合には、Ｘ軸の周りに第２のステージ２０５の面を傾けて、基板Ｗ２の面を水平方向とする。   Specifically, as shown in FIG. 5, when the surface of the substrate W2 is inclined at a predetermined angle with respect to the horizontal direction, the surface of the second stage 205 is inclined around the X axis, The surface of W2 is the horizontal direction.

ステップＳ４０４０における、駆動系制御装置４０９による第２のステージ２０５の調整は、画像処理装置４０５によって取得された一対の基板間のギャップの情報にしたがって、オペレータが行ってもよい。   The adjustment of the second stage 205 by the drive system control device 409 in step S4040 may be performed by the operator according to the information on the gap between the pair of substrates acquired by the image processing device 405.

本方法によれば、基板間のギャップおよび基板面の傾きを考慮して、基板面の接合状態が均一になるように基板を接合することができる。   According to this method, the substrate can be bonded so that the bonding state of the substrate surfaces becomes uniform in consideration of the gap between the substrates and the inclination of the substrate surface.

本発明の一実施形態による基板接合装置においては、基板がウエハであることを特徴とする。   In the substrate bonding apparatus according to one embodiment of the present invention, the substrate is a wafer.

本実施形態による基板接合装置によれば、接合されるウエハの間のギャップの値を高い精度で求めることができる。   According to the substrate bonding apparatus according to the present embodiment, the value of the gap between wafers to be bonded can be obtained with high accuracy.

本発明の他の実施形態による基板接合装置は、前記第１および第２の基板保持手段の内の少なくとも一方が、保持する基板の面の傾きを調整する傾き調整手段をさらに備える。本実施形態による基板接合装置は、前記画像処理手段が、前記カメラの撮影した画像から、前記第１の組の基板および前記第２の組の基板の傾きを求めるように構成されたことを特徴とする。   In a substrate bonding apparatus according to another embodiment of the present invention, at least one of the first and second substrate holding units further includes an inclination adjusting unit that adjusts an inclination of the surface of the substrate to be held. The substrate bonding apparatus according to the present embodiment is configured such that the image processing means obtains the inclinations of the first set of substrates and the second set of substrates from images taken by the camera. And

本実施形態による基板接合装置によれば、画像処理手段によって、カメラの撮影した画像から、第１の組の基板および第２の組の基板の傾きを求め、求めた基板の傾きにしたがって、傾き調整手段によって、第１および第２の組の基板の傾きを調整することができる。したがって、基板面の接合状態が均一になるように基板を接合することができる。   According to the substrate bonding apparatus according to the present embodiment, the image processing means obtains the inclinations of the first set of substrates and the second set of substrates from the images taken by the camera, and the inclination is determined according to the obtained inclination of the substrates. The inclination of the first and second sets of substrates can be adjusted by the adjusting means. Therefore, the substrates can be bonded so that the bonding state of the substrate surfaces is uniform.

本発明の他の実施形態による基板接合装置は、前記照明手段および前記カメラの対が２対であり、一方の対の照明手段とカメラを結ぶ直線が他方の対の照明手段とカメラを結ぶ直線と直交するように配置されたことを特徴とする。   In a substrate bonding apparatus according to another embodiment of the present invention, there are two pairs of the illumination means and the camera, and a straight line connecting one illumination means and the camera is a straight line connecting the other illumination means and the camera. It is characterized by being arranged so as to be orthogonal to.

本実施形態による基板接合装置によれば、互いに直交する二方向の基板面の傾きを調整することができる。   According to the substrate bonding apparatus according to the present embodiment, the inclination of the substrate surfaces in two directions orthogonal to each other can be adjusted.

本発明の一実施形態による基板接合方法によれば、前記第１および第２の組の基板間のギャップの情報を求めるステップが、前記第１の組の基板および前記第２の組の基板の傾きを求めることを含むことを特徴とする。   According to the substrate bonding method according to an embodiment of the present invention, the step of obtaining information on the gap between the first and second sets of substrates includes the step of determining the first set of substrates and the second set of substrates. The method includes obtaining an inclination.

本実施形態による基板接合方法によれば、画像処理手段によって、カメラの撮影した画像から、第１の組の基板および第２の組の基板の傾きを求めることができる。   According to the substrate bonding method according to the present embodiment, the inclination of the first set of substrates and the second set of substrates can be obtained from the image taken by the camera by the image processing means.

本発明の一実施形態による、基板接合装置の構成を示す図である。It is a figure which shows the structure of the board | substrate bonding apparatus by one Embodiment of this invention. 本発明の一実施形態による基板接合装置の、照明装置およびカメラの構成を示す図である。It is a figure which shows the structure of the illuminating device and the camera of the board | substrate joining apparatus by one Embodiment of this invention. 本発明の一実施形態による基板接合装置の、照明装置およびカメラの側面を示す図である。It is a figure which shows the side surface of the illuminating device and the camera of the board | substrate joining apparatus by one Embodiment of this invention. 本発明の一実施形態による基板接合方法を示す流れ図である。3 is a flowchart illustrating a substrate bonding method according to an embodiment of the present invention. カメラによって撮影された、接合される基板の側面の画像を示す図である。It is a figure which shows the image of the side surface of the board | substrate to be joined image | photographed with the camera.

符号の説明Explanation of symbols

１０１…第１の基板ホルダ、１０５…第１のステージ、２０１…第２の基板ホルダ、２０５…第２のステージ、４０１…カメラ、４０３…照明装置、４０５…画像処理装置、４０７…撮像系制御装置、４０９…駆動系制御装置 DESCRIPTION OF SYMBOLS 101 ... 1st board | substrate holder, 105 ... 1st stage, 201 ... 2nd board | substrate holder, 205 ... 2nd stage, 401 ... Camera, 403 ... Illuminating device, 405 ... Image processing apparatus, 407 ... Imaging system control Device, 409... Drive system control device

Claims (6)

第１の組の基板および第２の組の基板を接合させる基板接合装置であって、
前記第１の組の基板を保持する第１の基板保持手段と、
前記第２の組の基板を保持する第２の基板保持手段と、
前記第１および第２の基板保持手段の内の少なくとも一方を、基板の面と垂直な方向に移動させる移動手段と、
前記第１および第２の組の基板の側面に光を照射する照明手段と、
前記第１および第２の組の基板を隔てて、前記照明手段と対向する位置から、前記第１の組の基板および第２の組の基板の側面を撮影するカメラと、
前記カメラの撮影した画像から、前記第１および第２２の組の基板の間のギャップの値を求める画像処理手段と、を備えたことを特徴とする基板接合装置。 A substrate bonding apparatus for bonding a first set of substrates and a second set of substrates,
First substrate holding means for holding the first set of substrates;
Second substrate holding means for holding the second set of substrates;
Moving means for moving at least one of the first and second substrate holding means in a direction perpendicular to the surface of the substrate;
Illuminating means for irradiating light to side surfaces of the first and second sets of substrates;
A camera that images the side surfaces of the first set of substrates and the second set of substrates from a position facing the illumination means across the first and second sets of substrates;
Image processing means for obtaining a gap value between the first and twenty-second sets of substrates from images taken by the camera. 基板がウエハであることを特徴とする請求項１に記載の基板接合装置。   The substrate bonding apparatus according to claim 1, wherein the substrate is a wafer. 前記第１および第２の基板保持手段の内の少なくとも一方が、保持する基板の面の傾きを調整する傾き調整手段をさらに備え、
前記画像処理手段が、前記カメラの撮影した画像から、前記第１の組の基板および前記第２の組の基板の傾きを求めるように構成されたことを特徴とする請求項１または２に記載の基板接合装置。 At least one of the first and second substrate holding means further comprises an inclination adjusting means for adjusting the inclination of the surface of the substrate to be held,
The said image processing means is comprised so that the inclination of a said 1st group of board | substrate and a said 2nd group of board | substrate may be calculated | required from the image image | photographed by the said camera. Board bonding equipment. 前記照明手段および前記カメラの対が２対であり、一方の対の照明手段とカメラを結ぶ直線が他方の対の照明手段とカメラを結ぶ直線と直交するように配置されたことを特徴とする請求項１から３のいずれか１項に記載の基板接合装置。   There are two pairs of the illumination means and the camera, and a straight line connecting one pair of the illumination means and the camera is arranged to be orthogonal to a straight line connecting the other pair of illumination means and the camera. The substrate bonding apparatus according to any one of claims 1 to 3. 基板接合装置によって、第１の組の基板および第２の組の基板を接合させる基板接合方法であって、
前記第１および第２の組の基板の側面を照射する照明装置と、前記第１および第２の組の基板を隔てて、対向する位置に設置されたカメラによって、前記第１および第２の組の基板の側面の画像を取得するステップと、
取得した画像を処理し、前記第１および第２の組の基板間のギャップの情報を求めるステップと、を含む基板接合方法。 A substrate bonding method for bonding a first set of substrates and a second set of substrates by a substrate bonding apparatus,
The lighting device for illuminating the side surfaces of the first and second sets of substrates and the cameras installed at positions facing each other across the first and second sets of substrates. Acquiring an image of a side of a set of substrates;
Processing the acquired image to determine information on a gap between the first and second sets of substrates. 前記第１および第２の組の基板間のギャップの情報を求めるステップが、前記第１の組の基板および前記第２の組の基板の傾きを求めることを含むことを特徴とする請求項５に記載の基板接合方法。
6. The step of determining information on a gap between the first and second sets of substrates includes determining an inclination of the first set of substrates and the second set of substrates. The substrate bonding method according to 1.
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JP7284274B2 (en) 2019-01-18 2023-05-30 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Measuring device and method for determining the course of joining waves

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