JP2008300158A - Light source substrate, light source device, and light source cooling system - Google Patents

Light source substrate, light source device, and light source cooling system Download PDF

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JP2008300158A
JP2008300158A JP2007144335A JP2007144335A JP2008300158A JP 2008300158 A JP2008300158 A JP 2008300158A JP 2007144335 A JP2007144335 A JP 2007144335A JP 2007144335 A JP2007144335 A JP 2007144335A JP 2008300158 A JP2008300158 A JP 2008300158A
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light source
cooling
coolant
cooling jacket
jacket
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Masato Fukagaya
正人 深萱
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SOHKI KK
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently cool a semiconductor light source such as an LED using a thin jacket in which cooling liquid passes. <P>SOLUTION: A plurality of LEDs 12 are mounted on a conductor layer 13 of a light source substrate 11, and heat of the LEDs is transmitted to a cooling jacket through an insulating layer 14. The cooling jacket 15 is made a joint structure of a plurality of sheets of copper thin plates 23 and a through passage 16 to pass cooling liquid is formed on the jointing face of the copper thin plates 23. Circulation piping of the cooling liquid is connected to the through passage 16 and a pump, a radiator, and a reservoir are installed on the piping. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ＬＥＤ（発光ダイオード）等の半導体光源を冷却する機能を備えた光源基板と、該基板を用いた光源装置と、該装置に好適な光源冷却システムとに関する。   The present invention relates to a light source substrate having a function of cooling a semiconductor light source such as an LED (light emitting diode), a light source device using the substrate, and a light source cooling system suitable for the device.

近年、各種表示装置において、小電力で長寿命のＬＥＤが多用されている。多数のＬＥＤに比較的大きな電流を流す用途では、ＬＥＤが発熱により発光効率を低下させたり、表示装置の動作信頼性に悪影響を及ぼしたりする。このため、従来、ＬＥＤの光源基板に冷却機能部を設けた技術が提案されている。   In recent years, LEDs with low power and long life have been frequently used in various display devices. In an application in which a relatively large current is passed through a large number of LEDs, the LEDs reduce the light emission efficiency due to heat generation, or adversely affect the operational reliability of the display device. For this reason, conventionally, a technique in which a cooling function unit is provided on a light source substrate of an LED has been proposed.

例えば、図５に示すように、特許文献１に記載された光源基板５１は、アルミニウム製の冷却ベース５２の表面に絶縁層５３を介して金属板５４を貼り付け、金属板５４にマウントされたＬＥＤ５５の発熱を金属板５４と絶縁層５３を介して冷却ベース５２に回収するように構成されている。   For example, as shown in FIG. 5, the light source substrate 51 described in Patent Document 1 is mounted on the metal plate 54 by attaching a metal plate 54 to the surface of an aluminum cooling base 52 via an insulating layer 53. The heat generated by the LED 55 is collected in the cooling base 52 via the metal plate 54 and the insulating layer 53.

図６に示すように、特許文献２に記載された光源基板６１は、金属製ジャケット６２のキャビティ６３に冷却液６４を密閉し、モータ６５により回転羽根６６を駆動し、金属板６７上にマウントされたＬＥＤ６８の発熱を冷却液６４に蓄え、冷却液６４の蓄熱をジャケット６２下部の空冷フィン６９から放散させるように構成されている。   As shown in FIG. 6, the light source substrate 61 described in Patent Document 2 is mounted on a metal plate 67 by sealing a cooling liquid 64 in a cavity 63 of a metal jacket 62 and driving a rotary blade 66 by a motor 65. The generated heat of the LED 68 is stored in the cooling liquid 64, and the heat storage of the cooling liquid 64 is dissipated from the air cooling fins 69 below the jacket 62.

特開２００１−３３２７６８号公報JP 2001-332768 A 特開２００５−６２４１９号公報JP 2005-62419 A

ところが、特許文献１の光源基板５１によると、ＬＥＤ５５を冷却する能力が冷却ベース５２の熱容量に依存しているため、多数のＬＥＤ５５に大きな電流を流す場合に、厚手の冷却ベース５２を使用する必要があり、光源基板５１の質量および嵩が増加するという問題点があった。   However, according to the light source substrate 51 of Patent Document 1, since the ability to cool the LEDs 55 depends on the heat capacity of the cooling base 52, it is necessary to use the thick cooling base 52 when a large current flows through a large number of LEDs 55. There is a problem that the mass and bulk of the light source substrate 51 increase.

特許文献２の光源基板６１によると、冷却液６４がジャケット６２に密閉されているので、冷却液６４を撹拌するための回転羽根６６やモータ６５を装備する必要があるうえ、冷却液６４の放熱を促すための空冷フィン６９が不可欠になり、光源基板６１の構成が複雑かつ大型化するという問題点があった。   According to the light source substrate 61 of Patent Document 2, since the cooling liquid 64 is sealed in the jacket 62, it is necessary to equip the rotating blade 66 and the motor 65 for stirring the cooling liquid 64 and to dissipate the cooling liquid 64. Therefore, there is a problem that the structure of the light source substrate 61 is complicated and large.

本発明の目的は、上記課題を解決し、ＬＥＤ等の半導体光源を小型かつ簡単な構成で効率よく冷却できる光源基板と、該基板を用いた光源装置と、該装置を冷却するシステムとを提供することにある。   An object of the present invention is to solve the above-mentioned problems and provide a light source substrate capable of efficiently cooling a semiconductor light source such as an LED with a small and simple configuration, a light source device using the substrate, and a system for cooling the device. There is to do.

上記の課題を解決するために、本発明の光源基板は、半導体光源がマウントされる導体層と、導体層を電気絶縁する絶縁層と、絶縁層を介して半導体光源の発熱を奪う冷却ジャケットとを備え、冷却ジャケットが複数枚の金属薄板を接合して構成され、該金属薄板の接合面に冷却液を通過させる貫通路が形成されていることを特徴とする。   In order to solve the above-described problems, a light source substrate of the present invention includes a conductor layer on which a semiconductor light source is mounted, an insulating layer that electrically insulates the conductor layer, and a cooling jacket that takes away heat from the semiconductor light source through the insulating layer. And a cooling jacket is formed by joining a plurality of thin metal plates, and a through passage through which a cooling liquid passes is formed on a joining surface of the thin metal plates.

ここで、半導体光源はＬＥＤに限定されず、レーザーダイオードやＥＬ(エレクトロルミネッセンス)等を導体層にマウントすることができる。導体層には、銅またはアルミニウム等の導電性材料を使用できる。絶縁層には、エポキシ、ポリイミド、ポリエーテルイミド、ポリエーテルエーテルケトン、液晶ポリマー等の樹脂材料を使用できる。   Here, the semiconductor light source is not limited to the LED, and a laser diode, EL (electroluminescence) or the like can be mounted on the conductor layer. A conductive material such as copper or aluminum can be used for the conductor layer. Resin materials such as epoxy, polyimide, polyetherimide, polyetheretherketone, and liquid crystal polymer can be used for the insulating layer.

冷却ジャケットの金属薄板には、熱伝導性に優れた金属材料、例えば、アルミニウム、銅、チタン、銀、またはこれらの合金材料を使用できる。一枚の金属薄板の厚さは０．１ｍｍ〜２．０ｍｍ、薄板の枚数は２〜１０枚程度であり、どちらも光源の数や用途または冷却ジャケットの厚さに応じて適宜に選択できる。   For the metal thin plate of the cooling jacket, a metal material excellent in thermal conductivity, for example, aluminum, copper, titanium, silver, or an alloy material thereof can be used. The thickness of one metal thin plate is 0.1 mm to 2.0 mm, and the number of thin plates is about 2 to 10, both of which can be appropriately selected according to the number of light sources, the application, or the thickness of the cooling jacket.

冷却ジャケットの貫通路は、例えば、金属薄板の接合面に溝を加工することによって形成される。溝加工にあたっては、レーザエッチング、ウエットエッチング、切削等の手段を採用できる。相接合する二枚の金属薄板のうち、一方の薄板の接合面に溝を加工し、これを他方の薄板で塞いで貫通路を形成できる。あるいは、両方の薄板の接合面にそれぞれ溝を加工し、接合により断面積の大きな貫通路を形成することも可能である。   The through path of the cooling jacket is formed, for example, by machining a groove in the joining surface of the thin metal plate. In the groove processing, laser etching, wet etching, cutting, or the like can be employed. Of the two metal thin plates to be phase-joined, a groove can be formed on the joint surface of one thin plate, and this can be closed with the other thin plate to form a through path. Or it is also possible to process a groove | channel on the joining surface of both the thin plates, respectively, and to form a penetration path with a big cross-sectional area by joining.

金属薄板の接合には、ホットプレス法を好ましく採用できる。例えば、複数枚の銅薄板を表面処理した後にホットプレスにより直接接合してもよく、接合材（ろう材）を介して接合してもよい。接合材としては、ＡｕＳｎ、ＡｇＳｎ、ＳｎＣｕ、ＳｎＡｇＣｕ、ＡｕＳｉ、ＳｎＡｇＢｉ、ＳｎＡｇＢｉＣｕ等の共晶材料を好ましく使用できる。なお、貫通路に通過させる冷却液としては、水、エチレングリコール等の水溶液、シリコン系オイルなど、高流動性の液冷媒を使用できる。   A hot press method can be preferably used for joining the thin metal plates. For example, after surface-treating a plurality of copper thin plates, they may be directly joined by hot pressing, or may be joined via a joining material (brazing material). As the bonding material, eutectic materials such as AuSn, AgSn, SnCu, SnAgCu, AuSi, SnAgBi, and SnAgBiCu can be preferably used. In addition, as the coolant that passes through the through passage, a highly fluid liquid refrigerant such as water, an aqueous solution of ethylene glycol, or silicon oil can be used.

本発明の光源装置は、半導体光源がマウントされる導体層と、導体層を電気絶縁する絶縁層と、絶縁層を介して半導体光源の発熱を奪う冷却ジャケットとからなる光源基板を備え、冷却ジャケットが複数枚の金属薄板を接合して構成され、該金属薄板の接合面に冷却液を通過させる貫通路が形成され、導体層に所要パターンの配線回路が形成され、該配線回路に半導体光源の電極を接続したことを特徴とする。   A light source device of the present invention includes a light source substrate including a conductive layer on which a semiconductor light source is mounted, an insulating layer that electrically insulates the conductive layer, and a cooling jacket that removes heat from the semiconductor light source via the insulating layer. Is formed by joining a plurality of thin metal plates, a through passage is formed on the joining surface of the thin metal plates to allow a coolant to pass through, a wiring circuit having a required pattern is formed in the conductor layer, and a semiconductor light source is formed in the wiring circuit. The electrode is connected.

本発明の光源冷却システムは、上記光源装置を冷却するシステムであって、冷却液を光源基板の冷却ジャケットに循環させる配管を備え、該配管上に、冷却液を冷却ジャケットの貫通路に供給するポンプと、貫通路から吐出された冷却液を冷却するラジエータと、余剰の冷却液を貯留するリザーバーとを設けたことを特徴とする。   The light source cooling system of the present invention is a system for cooling the light source device, and includes a pipe for circulating the cooling liquid to the cooling jacket of the light source substrate, and supplies the cooling liquid to the through path of the cooling jacket on the pipe. A pump, a radiator that cools the coolant discharged from the through passage, and a reservoir that stores excess coolant are provided.

また、本発明の光源冷却システムは、冷却液の漏れや枯渇、ポンプやラジエータの故障等に備え、冷却ジャケットに放熱フィンを取り付けたことを特徴とする。   Further, the light source cooling system of the present invention is characterized in that a radiating fin is attached to the cooling jacket in preparation for leakage or depletion of the coolant, failure of the pump or radiator, and the like.

本発明によれば、半導体光源の発熱を冷却ジャケットに伝え、貫通路を通過する冷却液に回収し、冷却液を基板外部へ速やかに排出することで、半導体光源を効率よく冷却できる。冷却ジャケットを複数枚の金属薄板で構成したので、光源基板を薄くし、光源装置を小型化できる。特に、貫通路を金属薄板の接合面に形成したので、冷却ジャケットをエッチング等の手段で簡単かつ安価に製作できる。   According to the present invention, the semiconductor light source can be efficiently cooled by transmitting the heat generated by the semiconductor light source to the cooling jacket, collecting it in the coolant passing through the through passage, and quickly discharging the coolant to the outside of the substrate. Since the cooling jacket is composed of a plurality of thin metal plates, the light source substrate can be made thinner and the light source device can be downsized. In particular, since the through path is formed on the joining surface of the thin metal plate, the cooling jacket can be easily and inexpensively manufactured by means such as etching.

以下、本発明の実施形態を図面に基づいて説明する。図１は光源冷却システム１の全体的な構成を示す。図２は該システム１に組み込まれた光源装置２を図１のＡ−Ａ線で破断して示す。図３は該光源装置２の基板１１を図１のＢ−Ｂ線で破断して示す。図４は光源基板１１の変更例を示す。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows the overall configuration of the light source cooling system 1. FIG. 2 shows the light source device 2 incorporated in the system 1 cut along the line AA in FIG. FIG. 3 shows the substrate 11 of the light source device 2 cut along the line BB in FIG. FIG. 4 shows a modification of the light source substrate 11.

図１に示す光源冷却システム１は、光源装置２に冷却液３を循環させる配管４を備えている。配管４上には、冷却液３を光源装置２の入口側コネクタ５に供給するポンプ６と、光源装置２の出口側コネクタ７から吐出された冷却液３を冷却するラジエータ８と、余剰の冷却液３を貯留するリザーバー９とが設けられている。   A light source cooling system 1 shown in FIG. 1 includes a pipe 4 that circulates a coolant 3 in a light source device 2. On the pipe 4, a pump 6 that supplies the coolant 3 to the inlet-side connector 5 of the light source device 2, a radiator 8 that cools the coolant 3 discharged from the outlet-side connector 7 of the light source device 2, and excess cooling A reservoir 9 for storing the liquid 3 is provided.

図２に示すように、光源装置２は厚さ１ｍｍ程度の平板形の光源基板１１を備えている。光源基板１１は、半導体光源としての多数のＬＥＤ１２がマウントされる導体層１３と、導体層１３を電気的に絶縁する絶縁層１４と、絶縁層１４を介してＬＥＤ１２の発熱を奪う冷却ジャケット１５とから構成されている。   As shown in FIG. 2, the light source device 2 includes a flat light source substrate 11 having a thickness of about 1 mm. The light source substrate 11 includes a conductor layer 13 on which a large number of LEDs 12 as semiconductor light sources are mounted, an insulating layer 14 that electrically insulates the conductor layer 13, and a cooling jacket 15 that deprives the LED 12 of heat generation via the insulating layer 14. It is composed of

冷却ジャケット１５には、冷却水３を通過させる貫通路１６がジャケット１５の全長にわたって延びるように形成されている。貫通路１６の一端には冷却水３の入口１７が設けられ、入口１７にコネクタ５が接続されている。貫通路１６の他端には冷却水３の出口１８が設けられ、出口１８にコネクタ７が接続されている。   A through passage 16 through which the cooling water 3 passes is formed in the cooling jacket 15 so as to extend over the entire length of the jacket 15. An inlet 17 for the cooling water 3 is provided at one end of the through passage 16, and the connector 5 is connected to the inlet 17. An outlet 18 for the cooling water 3 is provided at the other end of the through passage 16, and the connector 7 is connected to the outlet 18.

図３に示すように、光源基板１１の導体層１３には、所要パターンの配線回路２０が形成され、配線回路２０にＬＥＤ１２の電極２１が接続されている。ＬＥＤ１２の発光チップ２２は導体層１３にマウントされ、発光チップ２２の発熱が導体層１３と絶縁層１４を介して冷却ジャケット１５に伝わるようになっている。   As shown in FIG. 3, a wiring circuit 20 having a required pattern is formed on the conductor layer 13 of the light source substrate 11, and the electrode 21 of the LED 12 is connected to the wiring circuit 20. The light emitting chip 22 of the LED 12 is mounted on the conductor layer 13, and heat generated by the light emitting chip 22 is transmitted to the cooling jacket 15 through the conductor layer 13 and the insulating layer 14.

冷却ジャケット１５は、厚さ０．５ｍｍ程度の二枚の銅薄板２３を接合材２４を介してホットプレスにより接合して構成されている。両方の銅薄板２３の接合面には、同じ部位に複数本の溝２５がハーフエッチングにより加工されている。そして、二枚の銅薄板２３を接合することにより、冷却ジャケット１５に貫通路１６が形成されている。   The cooling jacket 15 is configured by joining two copper thin plates 23 having a thickness of about 0.5 mm through a joining material 24 by hot pressing. A plurality of grooves 25 are processed by half etching at the same portion on the joint surface of both the copper thin plates 23. And the penetration path 16 is formed in the cooling jacket 15 by joining the two copper thin plates 23.

上記構成の光源基板１１においては、ＬＥＤ１２の発熱が冷却ジャケット１５に伝わり、貫通路１６を流れる冷却液３に回収される。温度上昇した冷却液３はポンプ６により冷却ジャケット１５から光源基板１１の外部へ速やかに排出され、ラジエータ８で冷却された後に、ジャケット１５に還流する。従って、冷却液を密閉する従来の光源基板（図６参照）と比較し、ＬＥＤ１２を簡単かつ薄型の冷却ジャケット１５で効率よく冷却することができる。   In the light source substrate 11 having the above-described configuration, the heat generated by the LEDs 12 is transmitted to the cooling jacket 15 and is collected in the cooling liquid 3 flowing through the through passage 16. The coolant 3 whose temperature has risen is quickly discharged from the cooling jacket 15 to the outside of the light source substrate 11 by the pump 6, cooled by the radiator 8, and then returned to the jacket 15. Accordingly, the LED 12 can be efficiently cooled by the simple and thin cooling jacket 15 as compared with the conventional light source substrate (see FIG. 6) that seals the cooling liquid.

本発明は上記実施例に限定されるものではなく、以下に例示するように、発明の趣旨を逸脱しない範囲で各部の形状や構成を適宜に変更して実施することも可能である。   The present invention is not limited to the above-described embodiments, and can be implemented by appropriately changing the shape and configuration of each part without departing from the spirit of the invention, as exemplified below.

（１）図４示すように、冷却ジャケット１５の下側の銅薄板２３に放熱フィン２７を接着剤２８で取り付けること。こうすれば、冷却ジャケット１５の蓄熱の一部を放熱フィン２７で放散させ、光源冷却システム１の冷却能力をさらに高めることができる。また、システム１の異常時に、放熱フィン２７を主動的に機能させ、ＬＥＤ１２の寿命低下や破壊を未然に防止することが可能となる。 (1) As shown in FIG. 4, heat radiation fins 27 are attached to the copper thin plate 23 below the cooling jacket 15 with an adhesive 28. In this way, a part of the heat storage in the cooling jacket 15 can be dissipated by the radiation fins 27, and the cooling capacity of the light source cooling system 1 can be further enhanced. Further, when the system 1 is abnormal, the heat dissipating fins 27 are allowed to function principally to prevent the LED 12 from being shortened in life or destroyed.

（２）図３に示す光源基板１１において、銅薄板２３の接合枚数を増やし、冷却ジャケット１５の貫通路１６を二段、三段またはそれ以上の多段に形成すること。
（３）図２に示す光源装置２において、ＬＥＤ１２にかえ、レーザーダイオードを導体層１３にマウントすること。 (2) In the light source substrate 11 shown in FIG. 3, the number of the copper thin plates 23 to be joined is increased, and the through passage 16 of the cooling jacket 15 is formed in two, three, or more stages.
(3) In the light source device 2 shown in FIG. 2, a laser diode is mounted on the conductor layer 13 instead of the LED 12.

本発明の一実施例を示す光源冷却システムの斜視図である。It is a perspective view of the light source cooling system which shows one Example of this invention. 該システムの光源装置を示す断面図である。It is sectional drawing which shows the light source device of this system. 該光源装置の光源基板を詳細に示す断面図である。It is sectional drawing which shows the light source board | substrate of this light source device in detail. 本発明の変更例を示す光源基板の断面図である。It is sectional drawing of the light source board | substrate which shows the example of a change of this invention. 従来の光源基板を示す斜視図である。It is a perspective view which shows the conventional light source board | substrate. 従来の別の光源基板を示す断面図である。It is sectional drawing which shows another conventional light source board | substrate.

符号の説明Explanation of symbols

１ 光源冷却システム
２ 光源装置
３ 冷却液
４ 配管
６ ポンプ
８ ラジエータ
９ リザーバー
１１ 光源基板
１２ ＬＥＤ
１３ 導体層
１４ 絶縁層
１５ 冷却ジャケット
１６ 貫通路
２０ 配線回路
２１ 電極
２３ 銅薄板
２７ 放熱フィン DESCRIPTION OF SYMBOLS 1 Light source cooling system 2 Light source device 3 Coolant 4 Piping 6 Pump 8 Radiator 9 Reservoir 11 Light source board 12 LED
DESCRIPTION OF SYMBOLS 13 Conductor layer 14 Insulating layer 15 Cooling jacket 16 Through-path 20 Wiring circuit 21 Electrode 23 Copper thin plate 27 Radiation fin

Claims (4)

半導体光源がマウントされる導体層と、導体層を電気絶縁する絶縁層と、絶縁層を介して半導体光源の発熱を奪う冷却ジャケットとを備え、冷却ジャケットが複数枚の金属薄板を接合して構成され、該金属薄板の接合面に冷却液を通過させる貫通路が形成されていることを特徴とする光源基板。   A conductor layer on which a semiconductor light source is mounted, an insulating layer that electrically insulates the conductor layer, and a cooling jacket that takes away heat from the semiconductor light source through the insulating layer, and the cooling jacket is formed by joining multiple thin metal plates And a through-passage through which the coolant passes is formed in the joint surface of the thin metal plate. 請求項１に記載された光源基板の導体層に所要パターンの配線回路を形成し、該配線回路に半導体光源の電極を接続したことを特徴とする光源装置。   2. A light source device comprising: a wiring circuit having a required pattern formed on a conductor layer of a light source substrate according to claim 1; and an electrode of a semiconductor light source connected to the wiring circuit. 請求項２に記載された光源装置を冷却するシステムであって、冷却液を冷却ジャケットに循環させる配管を備え、該配管上に、冷却液を貫通路に供給するポンプと、貫通路から吐出された冷却液を冷却するラジエータと、余剰の冷却液を貯留するリザーバーとを設けたことを特徴とする光源冷却システム。   A system for cooling the light source device according to claim 2, comprising a pipe for circulating a coolant through a cooling jacket, and a pump for supplying the coolant to the through path on the pipe and being discharged from the through path. A light source cooling system comprising: a radiator that cools the cooled coolant; and a reservoir that stores excess coolant. 前記冷却ジャケットに放熱フィンを取り付けたことを特徴とする請求項３記載の光源冷却システム。   The light source cooling system according to claim 3, wherein a radiation fin is attached to the cooling jacket.
JP2007144335A 2007-05-31 2007-05-31 Light source substrate, light source device, and light source cooling system Pending JP2008300158A (en)

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