JP2008277620A - Uniformly heating apparatus - Google Patents

Uniformly heating apparatus Download PDF

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JP2008277620A
JP2008277620A JP2007121005A JP2007121005A JP2008277620A JP 2008277620 A JP2008277620 A JP 2008277620A JP 2007121005 A JP2007121005 A JP 2007121005A JP 2007121005 A JP2007121005 A JP 2007121005A JP 2008277620 A JP2008277620 A JP 2008277620A
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plate
flow path
heat
heating element
form member
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JP5153201B2 (en
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Tetsuro Ogushi
哲朗 大串
Hisaaki Yamakage
久明 山蔭
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Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
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Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a uniformly heating apparatus capable of uniformly heating a heated object. <P>SOLUTION: The uniformly heating apparatus includes a first plate-form member on whose front surface an object is mounted, a second plate-form member disposed in parallel with the first plate-form member, flow paths formed between the first and second plate-form members, operating fluids provided respectively in the flow paths, and heat-generating bodies provided on the rear surface of the second plate-form member and provided respectively along the flow paths. The operating fluids are so heated, respectively by the heat generating bodies as to be evaporated and liquidized on the rear surface of the first plate-form member and as to heat thereby the first plate-form member. This uniformly heating apparatus has boil-heat-transfer promoting bodies, respectively in the flow paths present on the second plate-form member. Alternatively, the uniformly heating apparatus has grooves, respectively along the flow paths and in the rear surface of the second plate-form member; the heat-generating bodies are provided respectively in the grooves; and further, the second plate-form member portions present on the respective grooves are formed to be thin-walled portions. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、均熱装置に関し、特に、合成樹脂成形品や半導体ウエハなどを定盤上で均一に加熱する均熱装置に関する。   The present invention relates to a soaking device, and more particularly, to a soaking device that uniformly heats a synthetic resin molded product, a semiconductor wafer or the like on a surface plate.

図１１は、全体が５００で表される、従来の均熱装置の上面図であり、図１２は、図１１をＸＩＩ−ＸＩＩ方向に見た場合の断面図である。理解を助けるために、図１１の右半分には、第１板状部材１を除去した内部構造を示している。   FIG. 11 is a top view of a conventional heat equalizing apparatus, generally denoted by 500, and FIG. 12 is a cross-sectional view of FIG. 11 viewed in the XII-XII direction. In order to facilitate understanding, the right half of FIG. 11 shows the internal structure from which the first plate-like member 1 is removed.

図１１、１２に示すように、均熱装置５００は、第１板状部材１と、第２板状部材２と、その周囲に設けられた側壁部５とを含む。第１板状部材１、第２板状部材２は、表面が平坦な略円板状の部材からなり、第１板状部材１は、加熱対象物（図示せず）が上面に載置される定盤となっている。
第１板状部材１と第２板状部材２との間には支柱部７が形成され、その間が流路３となっている。流路３は略同心円状に形成されると共に、それぞれの流路３を接続するように、半径方向にも流路３０が形成されている。流路３、３０は、外気に対して密閉状態であり、排気された後に所定量の作動液４が入れられている。 As shown in FIGS. 11 and 12, the soaking device 500 includes a first plate-like member 1, a second plate-like member 2, and a side wall portion 5 provided around the first plate-like member 1. The 1st plate-shaped member 1 and the 2nd plate-shaped member 2 consist of a substantially disk-shaped member with a flat surface, and the 1st plate-shaped member 1 has a heating target object (not shown) mounted on the upper surface. It is a surface plate.
A support column 7 is formed between the first plate-like member 1 and the second plate-like member 2, and the flow path 3 is formed therebetween. The flow paths 3 are formed substantially concentrically, and the flow paths 30 are also formed in the radial direction so as to connect the flow paths 3. The flow paths 3 and 30 are in a sealed state with respect to the outside air, and a predetermined amount of the hydraulic fluid 4 is put in after being exhausted.

第２板状部材２の流路３の下部には、流路３に沿って略同心円状の発熱体６が設けられている。発熱体６には、例えばシーズヒータやバンドヒータが使用される。発熱体６から供給された熱は、第２板状部材２を介して作動液４に伝えられる。加熱された作動液４は、蒸気となって流路３内に拡散し、流路３内の温度が最も低い上面（第１板状部材１の裏面）で凝縮潜熱として熱を放出し液化する。かかる工程により、第１板状部材１が加熱され、その上に載置された加熱対象物が加熱される。
特開２０００−２３６０１３号公報 A substantially concentric heating element 6 is provided along the flow path 3 below the flow path 3 of the second plate-like member 2. For example, a sheathed heater or a band heater is used as the heating element 6. The heat supplied from the heating element 6 is transmitted to the hydraulic fluid 4 through the second plate member 2. The heated hydraulic fluid 4 becomes vapor and diffuses in the flow path 3, and liquefies by releasing heat as latent heat of condensation on the upper surface (back surface of the first plate-like member 1) having the lowest temperature in the flow path 3. . By this process, the 1st plate-shaped member 1 is heated and the heating target object mounted on it is heated.
JP 2000-2336013 A

しかしながら、均熱装置５００では、発熱体６から第２板状部材２に供給された熱が、作動液４以外に、支持体７を介して第１板状部材１に伝えられる。このため、第１板状部材１の表面温度が十分に均一とはならず、対象物の温度が場所によりばらつくという問題があった。   However, in the soaking apparatus 500, the heat supplied from the heating element 6 to the second plate member 2 is transmitted to the first plate member 1 via the support body 7 in addition to the hydraulic fluid 4. For this reason, the surface temperature of the 1st plate-shaped member 1 did not become sufficiently uniform, but there existed a problem that the temperature of a target object varied with places.

そこで、本発明は、定盤上の対象物を均一に加熱することができる均熱装置の提供を目的とする。   Then, an object of this invention is to provide the heat equalizing apparatus which can heat the target object on a surface plate uniformly.

本発明は、対象物を載置する上面を有する第１板状部材と、第１板状部材に平行に配置された第２板状部材と、第１板状部材と第２板状部材との間に形成された流路と、流路内に設けられた作動液と、流路に沿って、第２板状部材の下面に設けられた発熱体とを含み、発熱体により加熱された作動液が蒸発し、第１板状部材の裏面で液化することにより、第１板状部材を加熱する均熱装置であって、流路内の、第２板状部材の上に、沸騰伝熱促進体が設けられたことを特徴とする均熱装置である。   The present invention includes a first plate-like member having an upper surface on which an object is placed, a second plate-like member disposed in parallel to the first plate-like member, a first plate-like member, and a second plate-like member. And a heating fluid provided in the channel, and a heating element provided on the lower surface of the second plate member along the channel, and heated by the heating element The working fluid evaporates and liquefies on the back surface of the first plate-like member, thereby heating the first plate-like member, and is transferred to the boiling plate on the second plate-like member in the flow path. A heat equalizing device characterized in that a heat accelerator is provided.

また、本発明は、対象物を載置する上面を有する第１板状部材と、第１板状部材に平行に配置された第２板状部材と、第１板状部材と第２板状部材との間に形成された流路と、流路内に設けられた作動液と、流路に沿って、第２板状部材の下面に設けられた発熱体とを含み、発熱体により加熱された作動液が蒸発し、第１板状部材の裏面で液化することにより、第１板状部材を加熱する均熱装置であって、第２板状部材の裏面に、流路に沿って溝部を有し、溝部内に発熱体が設けられるとともに、溝部上の第２板状部材を薄肉部としたことを特徴とする均熱装置である。   The present invention also includes a first plate-like member having an upper surface on which an object is placed, a second plate-like member arranged in parallel to the first plate-like member, a first plate-like member, and a second plate-like member. Including a flow path formed between the members, a working fluid provided in the flow path, and a heating element provided on the lower surface of the second plate-like member along the flow path. The heated working fluid evaporates and liquefies on the back surface of the first plate member, thereby heating the first plate member, and on the back surface of the second plate member along the flow path. The heat equalizing device includes a groove portion, a heating element is provided in the groove portion, and the second plate member on the groove portion is a thin wall portion.

このように、本発明にかかる均熱装置では、薄肉部上の作動液を介して定盤に熱が伝えされ、定盤上の対象物を均一に加熱することができる。   Thus, in the heat equalizing apparatus according to the present invention, heat is transmitted to the surface plate via the working fluid on the thin wall portion, and the object on the surface plate can be heated uniformly.

以下に、図面を参照しながら、本発明の好適な実施の形態について説明する。なお、本発明では、「上」、「下」、「左」、「右」およびこれらの用語を含む名称を適宜使用するが、これらの方向は図面を参照した発明の理解を容易にするために用いるものであり、実施形態を上下反転、あるいは任意の方向に回転した形態も、当然に本願発明の技術的範囲に含まれる。   Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the present invention, “top”, “bottom”, “left”, “right” and names including these terms are used as appropriate, but these directions are for easy understanding of the invention with reference to the drawings. Of course, embodiments in which the embodiment is inverted upside down or rotated in an arbitrary direction are also included in the technical scope of the present invention.

実施の形態１．
図１は、全体が１００で表される、本発明の実施の形態１にかかる均熱装置の上面図であり、図２は、裏面図である。図１では、理解を容易にするために、第１板状部材１を除去した状態を示している。また、図３、４は、それぞれ、図１を、ＩＩＩ−ＩＩＩ方向、ＩＶ−ＩＶ方向に見た場合の断面図である。更に、図５は、図３において点線で囲まれたＡの部分の拡大図である。図１〜５において、図１１、１２と同一符号は、同一または相当箇所を示す。 Embodiment 1 FIG.
FIG. 1 is a top view of the heat equalizing apparatus according to the first embodiment of the present invention, the whole being represented by 100, and FIG. 2 is a back view. FIG. 1 shows a state where the first plate-like member 1 is removed for easy understanding. 3 and 4 are cross-sectional views when FIG. 1 is viewed in the III-III direction and the IV-IV direction, respectively. 5 is an enlarged view of a portion A surrounded by a dotted line in FIG. 1 to 5, the same reference numerals as those in FIGS. 11 and 12 indicate the same or corresponding portions.

均熱装置１００は、略平行に設けられた第１板状部材１および第２板状部材２と、その周囲に設けられた側壁部５とを含む。第１板状部材１、第２板状部材２は、表面が平坦な略円板状の部材からなり、第１板状部材１は、上面に加熱対象物（図示せず）が載置される定盤となっている。第１板状部材１、第２板状部材２の材料には、例えば銅やアルミニウムが用いられる。   The heat equalizing device 100 includes a first plate-like member 1 and a second plate-like member 2 provided substantially in parallel, and a side wall portion 5 provided around the first plate-like member 1 and the second plate-like member 2. The 1st plate-shaped member 1 and the 2nd plate-shaped member 2 consist of a substantially disk-shaped member with the flat surface, and the 1st plate-shaped member 1 mounts a heating target object (not shown) on the upper surface. It is a surface plate. For example, copper or aluminum is used as the material of the first plate member 1 and the second plate member 2.

第１板状部材１と第２板状部材２との間には支柱部７が略同心円状に形成され、その間が流路３となっている。また、それぞれの流路３を接続するように、半径方向にも流路３０が形成されている。流路３、３０は、外気に対して密閉状態であり、排気された後に所定量の作動液４が入れられている。   Between the first plate-like member 1 and the second plate-like member 2, a support column portion 7 is formed in a substantially concentric circle shape, and a flow path 3 is formed therebetween. Moreover, the flow path 30 is also formed in the radial direction so as to connect the respective flow paths 3. The flow paths 3 and 30 are in a sealed state with respect to the outside air, and a predetermined amount of the hydraulic fluid 4 is put in after being exhausted.

また、図５に詳しく示したように、流路３の下部の第２板状部材２には、略同心円状の溝部２１が、流路３に沿って設けられている。溝部２１上に残された第２板状部材２は、薄肉部４１となっている。溝部２１の中央には、溝部２１に沿って、略同心円状に発熱体６が設けられている。発熱体６には、例えばシーズヒータやバンドヒータが使用される。   As shown in detail in FIG. 5, a substantially concentric groove 21 is provided along the flow path 3 in the second plate-like member 2 below the flow path 3. The second plate-like member 2 left on the groove portion 21 is a thin portion 41. In the center of the groove portion 21, the heating element 6 is provided in a substantially concentric manner along the groove portion 21. For example, a sheathed heater or a band heater is used as the heating element 6.

薄肉部４１を補強するために、発熱体６の両側の溝部２１内には、補強部材４２が埋め込まれている。補強部材４２には、耐熱性が高く熱伝度率の小さい材料を用いることが好ましく、例えばステンレス鋼が用いられる。   In order to reinforce the thin portion 41, reinforcing members 42 are embedded in the groove portions 21 on both sides of the heating element 6. For the reinforcing member 42, it is preferable to use a material having high heat resistance and a low thermal conductivity, and for example, stainless steel is used.

更に、溝部２１上の第２板状部材２の表面には、流路３に沿って、同心円状に多孔質部材５１が設けられている。多孔質部材５１は、例えば、金属粒子の焼結体や発泡金属からなり、材料には、銅等が用いられる。多孔質部材５１の孔径は、作動液４が沸騰する時の沸騰熱伝達率ｈが大きくなるように、作動液４の種類や発熱体６の加熱温度に応じて調整される。例えば、作動液４に水を用い、加熱温度を６０℃〜１２０℃程度とした場合、孔径は約数百μｍであることが好ましく、加熱温度を２０℃〜６０℃程度とした場合、孔径は約１ｍｍであることが好ましい。多孔質部材５１は、金属粒子を第２板状部材２の上面に、メッキ法あるいは焼結法などにより形成される。   Furthermore, a concentric porous member 51 is provided along the flow path 3 on the surface of the second plate-like member 2 on the groove portion 21. The porous member 51 is made of, for example, a sintered body of metal particles or a foam metal, and copper or the like is used as the material. The pore diameter of the porous member 51 is adjusted according to the type of the hydraulic fluid 4 and the heating temperature of the heating element 6 so that the boiling heat transfer coefficient h when the hydraulic fluid 4 boils increases. For example, when water is used for the hydraulic fluid 4 and the heating temperature is about 60 ° C. to 120 ° C., the pore diameter is preferably about several hundred μm, and when the heating temperature is about 20 ° C. to 60 ° C., the pore diameter is Preferably it is about 1 mm. The porous member 51 is formed of metal particles on the upper surface of the second plate-like member 2 by a plating method or a sintering method.

流路３、３０には所定量の作動液４が入れられている。作動液４には、上述のように例えば水が用いられる。特に、第１板状部材１、第２板状部材２、多孔質部材５１に銅を用いた場合、作動液４として水を使用することが好ましい。   A predetermined amount of hydraulic fluid 4 is placed in the flow paths 3 and 30. For example, water is used for the hydraulic fluid 4 as described above. In particular, when copper is used for the first plate member 1, the second plate member 2, and the porous member 51, it is preferable to use water as the working fluid 4.

次に、本実施の形態１にかかる均熱装置１００の加熱動作について説明する。加熱される対象物は、第１板状部材１の上（定盤）に載置される。
発熱体６から供給された熱は、薄肉部４１を介して多孔質材料５１に伝えられる。続いて、多孔質材料５１に接した作動液４が加熱され、蒸気となって流路３内の空間に拡散する（図４中に、矢印で記載）。この蒸気は流路３内の温度の低い上面（第１板状部材１の裏面）で凝縮して熱を放出し、液化する。液化した作動液４は、流路３の内部で下方に落下して還流する。
かかる動作が繰り返されることにより、流路３内では、場所による温度差がなくなる。また、発熱体６から第１板状部材１に熱が輸送され、第１板状部材１の表面が均一な温度に加熱される。 Next, the heating operation of the heat equalizer 100 according to the first embodiment will be described. The object to be heated is placed on the first plate member 1 (the surface plate).
The heat supplied from the heating element 6 is transmitted to the porous material 51 through the thin portion 41. Subsequently, the working fluid 4 in contact with the porous material 51 is heated and becomes vapor to diffuse into the space in the flow path 3 (indicated by an arrow in FIG. 4). This steam condenses on the upper surface (the rear surface of the first plate-like member 1) having a low temperature in the flow path 3 to release heat and liquefy. The liquefied hydraulic fluid 4 falls down inside the flow path 3 and refluxes.
By repeating this operation, there is no temperature difference depending on the location in the flow path 3. Further, heat is transported from the heating element 6 to the first plate-like member 1, and the surface of the first plate-like member 1 is heated to a uniform temperature.

特に、均熱装置１００では、発熱体６から供給された熱は、まず、第２板状部材２の薄肉部４１に伝えられる。薄肉部４１は膜厚が薄いため、熱は、平面方向（横方向）に殆ど拡散することなく、直上の多孔質部材５１に伝えられる。多孔質部材５１の気孔内部で作動液４が加熱され、沸騰気泡を生成する。多孔質部材５１の孔は、伝熱表面積を大きくする作用のほかに、沸騰気泡核を多数持つという作用も有する。これらの多孔質部材５１の作用により、効果的に沸騰伝熱が生じることとなる。   In particular, in the soaking apparatus 100, the heat supplied from the heating element 6 is first transmitted to the thin portion 41 of the second plate member 2. Since the thin portion 41 is thin, heat is transferred to the porous member 51 immediately above without substantially diffusing in the plane direction (lateral direction). The hydraulic fluid 4 is heated inside the pores of the porous member 51 to generate boiling bubbles. The holes of the porous member 51 have an effect of having many boiling bubble nuclei in addition to the effect of increasing the heat transfer surface area. By the action of these porous members 51, boiling heat transfer is effectively generated.

このような構造を有することにより、均熱装置１００では、発熱体６と作動液４との温度差が１〜２Ｋという非常に小さな温度差で、作動液４が沸騰する。このため、薄肉部４１の温度上昇は小さくなり、支柱部７への熱の流れも殆ど発生しない。この結果、従来のように支柱７部を介して第１板状部材１に熱が伝わることがなく、第１板状部材１の表面温度が均一化される。   By having such a structure, in the soaking apparatus 100, the working fluid 4 boils at a very small temperature difference of 1-2K between the heating element 6 and the working fluid 4. For this reason, the temperature rise of the thin part 41 becomes small, and the flow of the heat to the support | pillar part 7 hardly generate | occur | produces. As a result, heat is not transmitted to the first plate-like member 1 through the support column 7 as in the prior art, and the surface temperature of the first plate-like member 1 is made uniform.

かかる第１板状部材１の表面温度の均一化について、図６、７を参照しながら、更に詳しく説明する。例えば、図６に示すように、発熱体６と支柱部７との間の距離Ｌを１０ｍｍとする。また、薄肉部４１は銅からなるものとし、薄肉部４１の板厚をｔｍｍとする。   The uniformity of the surface temperature of the first plate-like member 1 will be described in more detail with reference to FIGS. For example, as shown in FIG. 6, a distance L between the heating element 6 and the support column 7 is set to 10 mm. The thin portion 41 is made of copper, and the thickness of the thin portion 41 is tmm.

図７は、作動液４の沸騰熱伝達率（ｈ）を１０００、５０００、１００００Ｗ／ｍ２Ｋの３種類とした場合の、薄肉部４１の板厚（ｔ）と、端面温度上昇との関係である。 FIG. 7 shows the relationship between the plate thickness (t) of the thin-walled portion 41 and the end face temperature rise when the boiling heat transfer coefficient (h) of the hydraulic fluid 4 is 1000, 5000, and 10000 W / m 2 K. It is.

ここで、端面温度は、薄肉部４１と支柱部７との接点、即ち、発熱体６から距離Ｌ（＝１０ｍｍ）だけ離れた位置での、薄肉部４１の表面温度として測定される。
また、沸騰熱伝達率（ｈ）は、多孔質部材５１の孔径等で調整できる。例えば、多孔質部材５１を用いないときの沸騰熱伝達（ｈ）は１０００Ｗ／ｍ２Ｋであり、孔径を調整することにより、沸騰熱伝達（ｈ）を５０００および１００００Ｗ／ｍ２Ｋとする。 Here, the end surface temperature is measured as the surface temperature of the thin portion 41 at the contact point between the thin portion 41 and the support portion 7, that is, at a position away from the heating element 6 by a distance L (= 10 mm).
Further, the boiling heat transfer coefficient (h) can be adjusted by the pore diameter of the porous member 51 or the like. For example, boiling heat transfer when using no porous member 51 (h) is 1000W / m 2 K, by adjusting the hole diameter, boiling heat transfer to (h) and 5000 and 10000W / m 2 K.

図７に示すように、沸騰熱伝達率（ｈ）が大きいほど、また薄肉部４１の板厚（ｔ）が薄いほど、端面での温度上昇は小さくなることが分かる。端面での温度上昇を抑えることにより、支柱部７を通る熱の移動が抑制され、第１板状部材１の温度は、作動液４の蒸気による熱伝達により制御されることとなる。この結果、第１板状部材１の温度の均一性が向上する。   As shown in FIG. 7, it can be understood that the temperature rise at the end face decreases as the boiling heat transfer coefficient (h) increases and the plate thickness (t) of the thin portion 41 decreases. By suppressing the temperature rise at the end face, the movement of heat through the support column 7 is suppressed, and the temperature of the first plate-like member 1 is controlled by heat transfer by the vapor of the working fluid 4. As a result, the temperature uniformity of the first plate-like member 1 is improved.

例えば、上述のように多孔質部材５１を用いない時の沸騰熱伝達（ｈ）は１０００Ｗ／ｍ２Ｋ程度であり、この場合は、薄肉部４１の板厚（ｔ）を０．１ｍｍと薄くしても、端面の温度上昇は０．１Ｋ以下とはならない。
これに対し、多孔質部材５１を用いて沸騰熱伝達（ｈ）を１００００Ｗ／ｍ２Ｋとすると、薄肉部４１の板厚（ｔ）は０．６ｍｍであっても、端面の温度上昇を０．１Ｋとすることができる。 For example, the boiling heat transfer (h) when the porous member 51 is not used as described above is about 1000 W / m 2 K. In this case, the plate thickness (t) of the thin portion 41 is as thin as 0.1 mm. Even so, the temperature rise at the end face is not less than 0.1K.
On the other hand, if the boiling heat transfer (h) is 10000 W / m 2 K using the porous member 51, the temperature rise of the end face is reduced to 0 even if the plate thickness (t) of the thin portion 41 is 0.6 mm. .1K.

このように、本実施の形態１にかかる均熱装置１００では、薄肉部４１と多孔質部材５１を設けることにより、第１板状部材１の温度の均一性が向上する。なお、均熱装置１００では、薄肉部４１と多孔質部材５１の双方を設けたが、いずれか一方のみを設けてもかまわない。この場合にも第１板状部材１の温度の均一性が向上する。   Thus, in the heat equalizing apparatus 100 according to the first embodiment, by providing the thin portion 41 and the porous member 51, the temperature uniformity of the first plate-like member 1 is improved. In the heat equalizing device 100, both the thin portion 41 and the porous member 51 are provided, but only one of them may be provided. Also in this case, the temperature uniformity of the first plate-like member 1 is improved.

また、本実施の形態１にかかる均熱装置１００では、補強部材４２を設けることにより、薄肉部４１の強度を向上させ、均熱装置１００の持ち運びや設置時の取り扱いが容易となる。   Further, in the heat equalizing device 100 according to the first embodiment, by providing the reinforcing member 42, the strength of the thin portion 41 is improved, and the heat equalizing device 100 is easily carried and handled during installation.

実施の形態２．
図８は、全体が２００で表される、本発明の実施の形態２にかかる均熱装置の断面図であり、図３のＡの部分に相当する。図８中、図１〜３と同一符号は、同一または相当箇所を示す。 Embodiment 2. FIG.
FIG. 8 is a cross-sectional view of the heat equalizing apparatus according to the second embodiment of the present invention, the whole being represented by 200, and corresponds to a portion A in FIG. In FIG. 8, the same reference numerals as those in FIGS.

均熱装置２００では、均熱装置１００の多孔質部材５１に代えて、薄肉部４１の上に、沸騰熱伝達促進体６１が設けられている。沸騰熱伝達促進体６１は、複数の溝部を表面に設けて表面積を大きくした板状体からなる。溝部の底角は、１５°〜４５°程度が好ましく、好適には略３０°である。また、材料には例えば銅が使用される。他の構造は、上述の均熱装置１００と同じである。   In the heat equalizing apparatus 200, a boiling heat transfer promoting body 61 is provided on the thin portion 41 instead of the porous member 51 of the heat equalizing apparatus 100. The boiling heat transfer promoting body 61 is made of a plate-like body having a plurality of grooves on the surface to increase the surface area. The bottom angle of the groove is preferably about 15 ° to 45 °, and preferably about 30 °. For example, copper is used as the material. The other structure is the same as that of the above-described soaking apparatus 100.

このように、多孔質部材５１に代えて沸騰熱伝達促進体６１を用いることにより、作動液３と沸騰熱伝達促進体６１との接触面積が大きくなる。また、溝部の底部（底角近傍）が沸騰気泡核を多数有するため、沸騰効率が向上する。この結果、沸騰熱伝達率ｈが大きくなる。   Thus, by using the boiling heat transfer promoting body 61 instead of the porous member 51, the contact area between the hydraulic fluid 3 and the boiling heat transfer promoting body 61 is increased. Moreover, since the bottom part (near the bottom angle) of the groove part has many boiling bubble nuclei, the boiling efficiency is improved. As a result, the boiling heat transfer coefficient h increases.

このように、多孔質部材５１に代えて沸騰熱伝達促進体６１を用いることによっても、沸騰熱伝達率（ｈ）を増大させることができ、端面温度の上昇を抑制できる。この結果、第１板状部材１の温度の均一性が向上する。   Thus, it is possible to increase the boiling heat transfer coefficient (h) by using the boiling heat transfer promoter 61 instead of the porous member 51, and to suppress an increase in the end surface temperature. As a result, the temperature uniformity of the first plate-like member 1 is improved.

なお、ここでは、沸騰熱伝達促進体６１として、複数の溝部を表面に形成した板状体を用いたが、例えば底角が１５°〜４５°程度の凹部を設けても構わない。   Here, as the boiling heat transfer promoting body 61, a plate-like body having a plurality of grooves formed on the surface thereof is used. However, for example, a recess having a base angle of about 15 ° to 45 ° may be provided.

実施の形態３．
図９は、全体が３００で表される、本発明の実施の形態３にかかる均熱装置の断面図であり、図１のＩＩＩ−ＩＩＩ方向に見た場合の断面に相当する。図９中、図１〜３と同一符号は、同一または相当箇所を示す。 Embodiment 3 FIG.
FIG. 9 is a cross-sectional view of the heat equalizing apparatus according to the third embodiment of the present invention, the whole being represented by 300, and corresponds to a cross section when viewed in the III-III direction of FIG. 9, the same reference numerals as those in FIGS. 1 to 3 denote the same or corresponding parts.

本実施の形態にかかる均熱装置３００は、発熱体６を有する均熱装置１００に、更に冷却器７１を設けた構造となっている。均熱装置３００では、第１板状部材１（定盤）を加熱して第１板状部材１上の対象物を加熱し、所定の処理を行った後に、冷却器７１を用いて対象物を急速に冷却することができる。   The soaking device 300 according to the present embodiment has a structure in which a cooler 71 is further provided in the soaking device 100 having the heating element 6. In the heat equalizing device 300, the first plate-like member 1 (surface plate) is heated to heat the object on the first plate-like member 1, and after performing a predetermined process, the object is used using the cooler 71. Can be cooled rapidly.

均熱装置３００では、薄肉部４１が形成されない、例えば第２板状部材２の中央部分の下部に冷却器７１が設けられている。冷却器７１には、例えばペルチェ素子や冷却水を用いた水冷装置が使用される。
また、冷却器７１の上方の流路３内には、作動液４と第１板状部材１の裏面との中間位置に隔壁板７２が設けられている。隔壁板７２には、例えば、傘状や半球状の金属板が用いられる。他の構造は、上述の均熱装置１００と同じである。 In the heat equalizer 300, the cooler 71 is provided in the lower part of the center part of the 2nd plate-shaped member 2, for example, in which the thin part 41 is not formed. For the cooler 71, for example, a Peltier element or a water cooling device using cooling water is used.
A partition plate 72 is provided in the flow path 3 above the cooler 71 at an intermediate position between the hydraulic fluid 4 and the back surface of the first plate-like member 1. For the partition plate 72, for example, an umbrella-shaped or hemispherical metal plate is used. The other structure is the same as that of the above-described soaking apparatus 100.

かかる均熱装置３００では、第１板状部材１（定盤）上の対象物を加熱した後、冷却器７１により、第１板状部材１が支柱部７を介して効果的に冷却される。この結果、第１板状部材１上の対象物の迅速な冷却が可能となる。   In the soaking apparatus 300, after the object on the first plate-like member 1 (surface plate) is heated, the first plate-like member 1 is effectively cooled via the support column 7 by the cooler 71. . As a result, the object on the first plate-like member 1 can be quickly cooled.

冷却器７１が作動している場合、流路３内では、発熱体６の上方から蒸発した作動液４が、流路３内を冷却器７１の方に移動して冷却器７１の上方で冷却、凝集される。
一方、流路３内には、残留空気や発生した水素などの非凝縮性ガス７３も存在するが、これらの非凝縮性ガス７３は、作動液４の移動に伴って流路３内を冷却器７１の方に移動する。均熱装置３００では、冷却器７１の上方に隔壁板７２が設けられ、隔壁板７２の内部に、非凝縮性ガス７３が流れ込み、滞留する。この結果、第１板状部材１の裏面で、非凝縮性ガス７３が、気体状の作動液４の凝縮を妨げるのを防止でき、第１板状部材１の温度が均一化される。 When the cooler 71 is operating, in the flow path 3, the working fluid 4 evaporated from above the heating element 6 moves in the flow path 3 toward the cooler 71 and is cooled above the cooler 71. Agglomerated.
On the other hand, non-condensable gases 73 such as residual air and generated hydrogen are also present in the flow path 3, but these non-condensable gases 73 cool the flow path 3 as the working fluid 4 moves. Move toward vessel 71. In the heat equalizing device 300, the partition plate 72 is provided above the cooler 71, and the non-condensable gas 73 flows into the partition plate 72 and stays therein. As a result, it is possible to prevent the non-condensable gas 73 from hindering the condensation of the gaseous working fluid 4 on the back surface of the first plate-like member 1, and the temperature of the first plate-like member 1 is made uniform.

なお、本実施の形態３にかかる冷却器７１は、均熱装置２００や、後述の均熱装置４００にも適用することができる。   The cooler 71 according to the third embodiment can also be applied to the soaking device 200 and the soaking device 400 described later.

実施の形態４．
図１０は、全体が４００で表される、本発明の実施の形態４にかかる均熱装置の断面図であり、図１のＩＩＩ−ＩＩＩ方向に見た場合の断面に相当する。図１０中、図１〜３と同一符号は、同一または相当箇所を示す。 Embodiment 4 FIG.
FIG. 10 is a cross-sectional view of the heat equalizing device according to the fourth embodiment of the present invention, which is indicated as a whole by 400, and corresponds to a cross section when viewed in the III-III direction of FIG. 10, the same reference numerals as those in FIGS. 1 to 3 denote the same or corresponding parts.

図１０に示すように、均熱装置４００では、流路３に沿って第２板状部材２が内側に折り曲げられ、折り曲げられた薄肉部４１の下方には、薄肉部４１に接するように発熱体６が設けられている。発熱体６は、少なくとも一部が、第２板状部材２の上面より流路３側に配置されている。   As shown in FIG. 10, in the heat equalizer 400, the second plate-like member 2 is bent inward along the flow path 3, and heat is generated below the bent thin portion 41 so as to be in contact with the thin portion 41. A body 6 is provided. At least a part of the heating element 6 is disposed on the flow path 3 side from the upper surface of the second plate-like member 2.

かかる構造では、発熱体６から支柱部７までの距離が長くなるため、発熱体６と支柱部７との間の熱抵抗が大きくなる。この結果、支柱部７に流れ、支柱部７を介しての第１板状部材１に伝達される熱量が低減され、第１板状部材１の温度が均一化される。また、発熱体６の熱が外気に触れる面積が小さくなるため、発熱体６から外気に逃げる熱量が小さくなり、加熱効率が向上する。   In such a structure, since the distance from the heating element 6 to the column part 7 becomes long, the thermal resistance between the heating element 6 and the column part 7 increases. As a result, the amount of heat that flows to the column portion 7 and is transmitted to the first plate-like member 1 via the column portion 7 is reduced, and the temperature of the first plate-like member 1 is made uniform. Moreover, since the area where the heat of the heating element 6 comes into contact with the outside air becomes small, the amount of heat that escapes from the heating element 6 to the outside air becomes small, and the heating efficiency is improved.

本発明の実施の形態１にかかる均熱装置の上面図である。It is a top view of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の裏面図である。It is a reverse view of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる均熱装置の、薄肉部の板厚（ｔ）と端面温度上昇との関係である。It is the relationship between the plate | board thickness (t) of a thin part, and an end surface temperature rise of the heat equalization apparatus concerning Embodiment 1 of this invention. 本発明の実施の形態２にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 2 of this invention. 本発明の実施の形態３にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 3 of this invention. 本発明の実施の形態４にかかる均熱装置の断面図である。It is sectional drawing of the heat equalization apparatus concerning Embodiment 4 of this invention. 従来の均熱装置の上面図である。It is a top view of the conventional heat equalizer. 従来の均熱装置の断面図である。It is sectional drawing of the conventional heat equalization apparatus.

符号の説明Explanation of symbols

１ 第１板状部材（定盤）、２ 第２板状部材、３ 流路、４ 作動液、５ 側壁部、６ 発熱体、７ 支柱部、２１ 溝部、３０ 流路、４１ 薄肉部、４２ 補強部材、５１ 多孔質部材、１００ 均熱装置。   DESCRIPTION OF SYMBOLS 1 1st plate-shaped member (surface plate), 2nd plate-shaped member, 3 flow path, 4 hydraulic fluid, 5 side wall part, 6 heating element, 7 support | pillar part, 21 groove part, 30 flow path, 41 thin part, 42 Reinforcing member, 51 porous member, 100 soaking device.

Claims (9)

対象物を載置する上面を有する第１板状部材と、
該第１板状部材に平行に配置された第２板状部材と、
該第１板状部材と該第２板状部材との間に形成された流路と、
該流路内に設けられた作動液と、
該流路に沿って、該第２板状部材の下面に設けられた発熱体とを含み、
該発熱体により加熱された作動液が蒸発し、該第１板状部材の裏面で液化することにより、該第１板状部材を加熱する均熱装置であって、
該流路内の、該第２板状部材の上に、沸騰伝熱促進体が設けられたことを特徴とする均熱装置。 A first plate member having an upper surface on which the object is placed;
A second plate member disposed in parallel to the first plate member;
A flow path formed between the first plate member and the second plate member;
A working fluid provided in the flow path;
A heating element provided on the lower surface of the second plate-shaped member along the flow path,
A soaking device that heats the first plate-like member by evaporating the working fluid heated by the heating element and liquefying on the back surface of the first plate-like member,
A heat equalizing apparatus, wherein a boiling heat transfer promoting body is provided on the second plate-like member in the flow path. 対象物を載置する上面を有する第１板状部材と、
該第１板状部材に平行に配置された第２板状部材と、
該第１板状部材と該第２板状部材との間に形成された流路と、
該流路内に設けられた作動液と、
該流路に沿って、該第２板状部材の下面に設けられた発熱体とを含み、
該発熱体により加熱された作動液が蒸発し、該第１板状部材の裏面で液化することにより、該第１板状部材を加熱する均熱装置であって、
該第２板状部材の裏面に、該流路に沿って溝部を有し、該溝部内に発熱体が設けられるとともに、該溝部上の該第２板状部材を薄肉部としたことを特徴とする均熱装置。 A first plate member having an upper surface on which the object is placed;
A second plate member disposed in parallel to the first plate member;
A flow path formed between the first plate member and the second plate member;
A working fluid provided in the flow path;
A heating element provided on the lower surface of the second plate-shaped member along the flow path,
A soaking device that heats the first plate-like member by evaporating the working fluid heated by the heating element and liquefying on the back surface of the first plate-like member,
The back surface of the second plate member has a groove portion along the flow path, a heating element is provided in the groove portion, and the second plate member on the groove portion is a thin portion. Soaking device. 上記第１板状部材と上記第２板状部材が、円板状の部材であり、上記流路と上記発熱体が、同心円状に配置されたことを特徴とする請求項１または２に記載の均熱装置。   The said 1st plate-shaped member and the said 2nd plate-shaped member are disk-shaped members, The said flow path and the said heat generating body are arrange | positioned concentrically, The Claim 1 or 2 characterized by the above-mentioned. Soaking device. 上記沸騰伝熱促進体が、多孔質部材からなることを特徴とする請求項１または３に記載の均熱装置。   The heat equalizing apparatus according to claim 1 or 3, wherein the boiling heat transfer promoting body is made of a porous member. 上記多孔質部材が、上記第２板状部材に焼結した銅粒子の焼結体からなることを特徴とする請求項４に記載の均熱装置。   The soaking apparatus according to claim 4, wherein the porous member is made of a sintered body of copper particles sintered on the second plate-like member. 上記溝部の上記発熱体の周囲に、補強部材が設けられたことを特徴とする請求項２または３に記載の均熱装置。   The heat equalizing apparatus according to claim 2 or 3, wherein a reinforcing member is provided around the heating element in the groove portion. 上記薄肉部が、上記流路内に湾曲し、その中に上記発熱体が設けられたことを特徴とする請求項２または３に記載の均熱装置。   The heat equalizing apparatus according to claim 2 or 3, wherein the thin portion is curved in the flow path, and the heating element is provided therein. 上記第２板状部材の裏面に、冷却器が設けられたことを特徴とする請求項１〜７のいずれか１項に記載の均熱装置。   The heat equalizing apparatus according to any one of claims 1 to 7, wherein a cooler is provided on a back surface of the second plate-shaped member. 上記冷却器の上方の、上記第１板状基板と上記作動液との間の上記流路内に、隔壁板が設けられたことを特徴とする請求項８に記載の均熱装置。   The heat equalizing apparatus according to claim 8, wherein a partition plate is provided in the flow path between the first plate-like substrate and the hydraulic fluid above the cooler.
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JP7481536B1 (en) 2022-12-26 2024-05-10 ナノテック・カンパニー・リミテッド Heater Plates for Substrate Processing

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JPH10249863A (en) * 1997-03-13 1998-09-22 Mitsubishi Electric Corp Soaking apparatus
JP2000236013A (en) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp Equalizer
JP2003053741A (en) * 2001-08-20 2003-02-26 Mitsubishi Electric Corp Heat leveling apparatus

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Publication number Priority date Publication date Assignee Title
JPS5563397A (en) * 1978-10-31 1980-05-13 Mitsubishi Electric Corp Manufacture of bolling heat transmission surface
JPH08327257A (en) * 1995-05-30 1996-12-13 Fujikura Ltd Heat pipe and manufacture thereof
JPH10249863A (en) * 1997-03-13 1998-09-22 Mitsubishi Electric Corp Soaking apparatus
JP2000236013A (en) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp Equalizer
JP2003053741A (en) * 2001-08-20 2003-02-26 Mitsubishi Electric Corp Heat leveling apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7481536B1 (en) 2022-12-26 2024-05-10 ナノテック・カンパニー・リミテッド Heater Plates for Substrate Processing

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