JP2008248007A - 樹脂組成物添加用無機粉末及び樹脂組成物 - Google Patents
樹脂組成物添加用無機粉末及び樹脂組成物 Download PDFInfo
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Abstract
【解決手段】体積基準の粒度分布上に1以上の曲がり点をもち、該曲がり点における粒径が1μm以上20μm以下であり、全体を基準とした体積平均粒径並びにD50が6μm以上50μm未満であり、15μm以上70μm以下の粒径をもつ粒子の平均円形度が0.950以上であることを特徴とする。ここで、本明細書における粒度分布はそれ以下の粒径にて粒子が存在しない粒径を任意に選択した上で、その選択した粒径に所定数を順次乗じた値をもつ粒径における頻度体積を測定して算出する。曲がり点は、この粒度分布の各点において接線を求め、その接線の内で、傾きが正であり、傾きの値が減少から増加に転じる極小値を示す点を「曲がり点」とする。
【選択図】なし
Description
全体を基準とした体積平均粒径並びにD50が6μm以上50μm未満であり、
15μm以上70μm以下の粒径をもつ粒子の平均円形度が0.950以上であることを特徴とする。
本発明の樹脂組成物添加用無機粉末について、以下、実施形態に基づき詳細に説明を行う。本実施形態の樹脂組成物添加用無機粉末は体積基準での粒度分布に特徴を有する。具体的には、体積基準の粒度分布上に1以上の曲がり点をもつものである。その曲がり点における粒径は1μm以上20μm以下である。曲がり点における粒径としては3μm以上であることが望ましい。また、10μm以下であることが望ましい。
本実施形態の樹脂組成物は前述の本実施形態の樹脂組成物添加用無機粉末とその樹脂組成物添加用無機粉末を分散する分散用樹脂組成物とから構成される。樹脂組成物添加用無機粉末については前述の通りなので記載を省略する。樹脂組成物添加用無機粉末は全体の質量を基準として70質量%以上含有することが望ましい。更に、その他の添加剤として、離型剤(カルナバワックスなど)などを添加することができる。
天然ケイ石を粉砕した後、高温火炎中に搬送気体と共に投入するいわゆる溶融法にて非晶質シリカ粉末を得た。火炎投入前の粒度分布、火炎条件、分級操作、配合により表1に示す粒度分布になるように調製し各試験例の試験試料(樹脂組成物添加用無機粉末)とした。いずれのシリカ粉末についても結晶化率は1%未満(非晶質率は99%以上)であり、平均円形度は0.9以上であった。
各試験例の樹脂組成物を用いて流動性試験と成形性試験とを行った。
Claims (4)
- 体積基準の粒度分布上に1以上の曲がり点をもち、該曲がり点における粒径が1μm以上20μm以下であり、
全体を基準とした体積平均粒径並びにD50が6μm以上50μm未満であり、
15μm以上70μm以下の粒径をもつ粒子の平均円形度が0.950以上であることを特徴とする樹脂組成物添加用無機粉末。 - BET法により測定した比表面積が1.5m2/g〜3.5m2/gである請求項1に記載の樹脂組成物添加用無機粉末。
- 結晶化率が2%未満の非晶質シリカから形成される請求項1又は2に記載の樹脂組成物添加用無機粉末。
- 請求項1〜3のいずれかに記載の樹脂組成物添加用無機粉末からなるフィラーと、該フィラーを分散する分散用樹脂組成物とを有することを特徴とする樹脂組成物。
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JP2003110065A (ja) * | 2001-10-01 | 2003-04-11 | Denki Kagaku Kogyo Kk | 球状無機質粉末およびその用途 |
JP2003137529A (ja) * | 2001-10-25 | 2003-05-14 | Denki Kagaku Kogyo Kk | 球状無機質粉末および用途 |
JP2004059343A (ja) * | 2002-07-25 | 2004-02-26 | Denki Kagaku Kogyo Kk | 無機質粉末およびこれを充填した樹脂組成物 |
JP2005225970A (ja) * | 2004-02-12 | 2005-08-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2007051187A (ja) * | 2005-08-16 | 2007-03-01 | Admatechs Co Ltd | 微小粒子含有組成物 |
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