JP2008210593A - Illuminating device - Google Patents

Illuminating device Download PDF

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Publication number
JP2008210593A
JP2008210593A JP2007044691A JP2007044691A JP2008210593A JP 2008210593 A JP2008210593 A JP 2008210593A JP 2007044691 A JP2007044691 A JP 2007044691A JP 2007044691 A JP2007044691 A JP 2007044691A JP 2008210593 A JP2008210593 A JP 2008210593A
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Japan
Prior art keywords
heat
lighting device
led
instrument housing
fins
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JP2007044691A
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Japanese (ja)
Inventor
Hiroyuki Sako
浩行 迫
Shigeaki Yamazaki
茂章 山崎
Ryoji Yokoya
良二 横谷
Satoru Mori
哲 森
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Priority to JP2007044691A priority Critical patent/JP2008210593A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination device in which current amount flowing in an LED is increased and light output can be improved without large-sizing the fixture main body for heat radiation by making a structure to promote heat radiation property of a fixture cabinet. <P>SOLUTION: This illumination fixture is equipped with an LED mounting heat radiation substrate 6 on which the LED 5 is mounted and which is joined at the inner face of the fixture cabinet 1 via a heat insulating means 9, a plurality of heat radiation fins 4 vertically installed at predetermined intervals on the outer surface at the bottom of the fixture cabinet 1, and a heat radiation body 7a which is joined penetrating the bottom part of the fixture cabinet 1 and which on the bottom part outer face of the fixture cabinet 1 is exposed at a position communicated with a space S formed by the neighboring two heat radiation fins 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、内部にＬＥＤを収めた器状である器具筐体の底部外面に、放熱フィンを設けている照明装置に関するものである。   The present invention relates to an illuminating device in which heat dissipating fins are provided on an outer surface of a bottom portion of a fixture housing that is a container shape in which LEDs are housed.

従来から、特許文献１に示されるような照明装置が知られている。特許文献１に記載の照明装置は図７に示すように、器状の器具筐体１０１の内底面にＬＥＤ１０２を設け、底部外面に放熱フィン１０３を設けている。   Conventionally, an illuminating device as shown in Patent Document 1 is known. As shown in FIG. 7, the lighting device described in Patent Document 1 includes an LED 102 on the inner bottom surface of a vessel-shaped instrument housing 101 and a heat dissipating fin 103 on the outer surface of the bottom.

これにより、ＬＥＤ１０２の熱を放熱フィン１０３により放熱し、その結果、ＬＥＤ１０２に流す電流量を増やし、光出力を向上させることができる。
特開２００２−０９３２０６号公報 As a result, the heat of the LED 102 is radiated by the radiation fin 103, and as a result, the amount of current flowing through the LED 102 can be increased and the light output can be improved.
Japanese Patent Laid-Open No. 2002-093206

しかし、このような放熱フィン１０３を設けただけでは、ある程度の放熱はできるものの、ＬＥＤ１０２に流す電流量を一定以上増やすことができず、光出力を一定以上向上させることができない。また、放熱フィン１０３のみによる放熱の機構を鑑みれば、器具筐体１０１を小型化することができないという問題があった。   However, although only a certain amount of heat can be radiated by providing such heat radiation fins 103, the amount of current flowing through the LED 102 cannot be increased beyond a certain level, and the light output cannot be improved beyond a certain level. Further, in view of the heat dissipation mechanism using only the radiation fins 103, there is a problem that the instrument housing 101 cannot be reduced in size.

本発明は、上記課題を解決するためになされたものであり、放熱フィンを器具筐体の底部外面に設置した照明装置において、器具筐体の放熱性を高める構造とすることで、放熱のために器具筐体を大型化することなく、ＬＥＤに流す電流量を増やして、光出力を向上させることができる照明装置を提供することを目的とする。   The present invention has been made in order to solve the above-described problems, and in a lighting device in which a heat dissipating fin is installed on the outer surface of the bottom of an instrument housing, the heat dissipation performance of the instrument housing is improved, so that heat can be dissipated. An object of the present invention is to provide an illumination device capable of improving the light output by increasing the amount of current flowing through the LED without increasing the size of the instrument housing.

上記課題を解決するために、請求項１に記載の照明装置は、内部にＬＥＤが収納された器状である器具筐体を有し、当該器具筐体の開口部が下側を向くように設けられる照明装置であって、ＬＥＤを実装し、熱絶縁手段を介して器具筐体の内面に接合されるＬＥＤ実装放熱基板と、器具筐体の底部外面に間隔を空けて立設される複数の放熱フィンと、器具筐体の底部を貫通して、ＬＥＤ実装放熱基板に接合され、器具筐体の底部外面において、隣り合う２つの放熱フィンにより形成された空間に連通する位置で露出する放熱体と、を備えることを特徴とする。   In order to solve the above-mentioned problem, the lighting device according to claim 1 has a device-like appliance housing in which an LED is housed, and an opening of the appliance housing faces downward. A lighting device provided, wherein an LED is mounted on an LED mounting heat dissipating board, which is mounted on an inner surface of an appliance housing via a thermal insulating means, and a plurality of units are installed on the outer surface of the bottom of the appliance housing with a space therebetween. Heat radiation fin and the bottom of the appliance housing, joined to the LED mounting heat dissipation substrate, and exposed on the outer surface of the bottom of the appliance housing at a position communicating with the space formed by two adjacent radiation fins And a body.

請求項２に記載の発明は、上記請求項１に記載の照明装置において、複数の放熱フィンが器具筐体の底部外面の略中央から放射状に設けられていることを特徴とする。   According to a second aspect of the present invention, in the illuminating device according to the first aspect, the plurality of heat radiation fins are provided radially from substantially the center of the bottom outer surface of the instrument housing.

請求項３に記載の発明は、上記請求項２に記載の照明装置において、放射状に設けられた複数の放熱フィンの略中央に棒状の放熱体が設けられていることを特徴とする。   According to a third aspect of the present invention, in the illumination device according to the second aspect, a rod-shaped heat radiating body is provided at substantially the center of the plurality of radiating fins provided in a radial shape.

請求項４に記載の発明は、上記請求項１に記載の照明装置において、複数の放熱フィンが略平行に設けられていることを特徴とする。   According to a fourth aspect of the present invention, in the lighting device according to the first aspect, a plurality of heat radiation fins are provided substantially in parallel.

請求項５に記載の発明は、上記請求項４に記載の照明装置において、略平行に設けられた複数の放熱フィンと交差する板状の放熱体が設けられていることを特徴とする。   According to a fifth aspect of the present invention, in the illumination device according to the fourth aspect of the present invention, a plate-like heat dissipating member that intersects with a plurality of heat dissipating fins provided substantially in parallel is provided.

請求項６に記載の発明は、上記請求項１〜５のいずれか１項に記載の照明装置において、放熱フィンが放熱体の露出している部分より高く立設されていることを特徴とする。   The invention according to claim 6 is the lighting device according to any one of claims 1 to 5, characterized in that the radiation fins are erected higher than the exposed part of the radiator. .

請求項７に記載の発明は、上記請求項１〜６のいずれか１項に記載の照明装置において、熱絶縁手段として、熱絶縁シートを用いることを特徴とする。   The invention described in claim 7 is characterized in that, in the lighting device according to any one of claims 1 to 6, a heat insulating sheet is used as the heat insulating means.

本発明によれば、ＬＥＤの熱が効率よく放熱されるため、放熱のために器具筐体を大型化することなく、ＬＥＤに流す電流量を増やして、光出力を向上させることができる。   According to the present invention, since the heat of the LED is efficiently radiated, the amount of current flowing through the LED can be increased and the light output can be improved without increasing the size of the instrument housing for radiating heat.

以下、図面を参照しながら本発明の実施の形態について説明する。以下の説明では具体例を挙げて本発明を説明する場合があるが、本発明は以下の具体例に限定されない。
（実施形態１）
実施形態１に係る照明装置の斜視図を図１に、要部概略断面図を図２にそれぞれ示す。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the present invention may be described with specific examples, but the present invention is not limited to the following specific examples.
(Embodiment 1)
FIG. 1 is a perspective view of a lighting device according to Embodiment 1, and FIG.

本実施形態に係る照明装置は、図１および図２に示すように、内部にＬＥＤ５を収納した器状である器具筐体１の底部外面に、ＬＥＤ５に電力を供給する電源装置２を、アーム部３を介して、器具筐体１外周の外側領域に位置するように設けている。そして、複数の放熱フィン４を器具筐体１の底部外面に立設し、この放熱フィン４にアーム部３を結合させて、アーム部３を器具筐体１外周の外側領域に突出するように設けている。この照明装置は、器具筐体１の開口部が下側を向くように設けられている。   As shown in FIG. 1 and FIG. 2, the lighting device according to the present embodiment includes a power supply device 2 that supplies power to the LED 5 on the outer surface of the bottom of the instrument housing 1 that is a container-like shape that houses the LED 5. It is provided so as to be located in the outer region of the outer periphery of the instrument housing 1 via the part 3. Then, a plurality of radiating fins 4 are erected on the outer surface of the bottom of the instrument housing 1, and the arm part 3 is coupled to the radiating fins 4 so that the arm part 3 protrudes to the outer region of the outer periphery of the instrument casing 1. Provided. This illuminating device is provided so that the opening part of the instrument housing | casing 1 may face down.

本実施形態に係る照明装置は、天井に設けられた取付け孔に挿入させることで設置されるダウンライトである。   The lighting device according to the present embodiment is a downlight that is installed by being inserted into an attachment hole provided in the ceiling.

以下、本実施形態に係る照明装置を具体的詳細に説明する。   Hereinafter, the lighting device according to the present embodiment will be described in detail.

器具筐体１は、図１および図２に示すように、円盤状の底部と、底部の外周縁から下方に延設された円筒部と、円筒部の下端から外側に延設されて円筒部を取り囲む縁部と、を一体に有する形状に形成されている。図示されていないが、外付けされている電源装置２に電気的に接続される接続部（コネクタ）が底部内面の中央付近に設けられている。なお、器具筐体１は、例えば、アルミニウムなどからなる。   As shown in FIGS. 1 and 2, the instrument housing 1 includes a disk-shaped bottom portion, a cylindrical portion extending downward from the outer peripheral edge of the bottom portion, and a cylindrical portion extending outward from the lower end of the cylindrical portion. And an edge portion that surrounds the substrate. Although not shown, a connection portion (connector) that is electrically connected to the externally attached power supply device 2 is provided near the center of the inner surface of the bottom portion. The instrument housing 1 is made of, for example, aluminum.

この器具筐体１の底部内面にはＬＥＤ実装放熱基板６が設けられている。このＬＥＤ実装放熱基板６は、ＬＥＤ５、コンデンサ、トランジスタ等の電子部品が実装された器具筐体１内に収納される円状のＬＥＤユニット（プリント基板）である。そして、図示されていないが、器具筐体１に設けられた接続部にコネクタ接続される接続部をＬＥＤ実装放熱基板６の上面中央に備えている。また、ＬＥＤ実装放熱基板６と器具筐体１とは、熱絶縁手段を介して、接合されている。本実施形態では、ＬＥＤ実装放熱基板６と器具筐体１との間に、熱絶縁シート９が設けられている。熱絶縁シート９の熱抵抗は高いほうが好ましい。   An LED mounting heat dissipation substrate 6 is provided on the inner surface of the bottom of the appliance housing 1. The LED mounting heat dissipation board 6 is a circular LED unit (printed board) housed in the instrument housing 1 on which electronic components such as LEDs 5, capacitors, and transistors are mounted. And although not shown in figure, the connection part connected by the connector to the connection part provided in the instrument housing | casing 1 is provided in the upper surface center of the LED mounting heat dissipation board 6. FIG. Moreover, the LED mounting heat radiating substrate 6 and the appliance housing 1 are joined via a thermal insulating means. In the present embodiment, a heat insulating sheet 9 is provided between the LED mounting heat dissipation substrate 6 and the instrument housing 1. It is preferable that the thermal insulation sheet 9 has a high thermal resistance.

各ＬＥＤ５は、レンズ体８で覆われている。このレンズ体８は、例えば絶縁性の樹脂成形により形成され、ＬＥＤ５の光を制御する。   Each LED 5 is covered with a lens body 8. The lens body 8 is formed by, for example, insulating resin molding, and controls the light of the LED 5.

なお、レンズ体８及びＬＥＤ実装放熱基板６は器具筐体１内に着脱自在に収納されるようになっていてもよい。   The lens body 8 and the LED mounting heat radiating substrate 6 may be detachably accommodated in the instrument housing 1.

また、器具筐体１の底部外面には、複数の放熱フィン４が間隔を空けて一面に立設されている。この放熱フィン４はアルミニウムなどから略矩形状に形成されている。各放熱フィン４は器具筐体１と一体となっており、放射状に立設されている。ここで、隣り合う放熱フィン４，４の間には、空間Ｓが形成される。なお、放熱フィン４は、天井に設けられた取付け孔に収納されるようなデザインに構成される。   A plurality of radiating fins 4 are erected on the outer surface of the bottom of the instrument housing 1 at intervals. The heat radiating fins 4 are formed in a substantially rectangular shape from aluminum or the like. Each radiating fin 4 is integrated with the appliance housing 1 and is erected in a radial pattern. Here, a space S is formed between the adjacent radiation fins 4 and 4. In addition, the radiation fin 4 is comprised so that it may be accommodated in the attachment hole provided in the ceiling.

一部の放熱フィン４には、くの字状に曲げ加工されたアーム部３が接合されている。このアーム部３は板状であり、アルミニウム等からなる。そして、器具筐体１外周の外側領域に対して下方に傾斜するように突出している。このアーム部３の下面には、ＬＥＤ５に電力を供給する電源装置２が設けられている。なお、電源装置２は、アーム部３の先端付近に設けられるとよい。以上のような構成により、上昇していくＬＥＤ５の熱が電源装置２の方へ伝わりにくくなる。また、電源装置２から発生する熱がＬＥＤ５へ伝わりにくくなる。   A part of the heat radiation fins 4 is joined with an arm portion 3 bent into a dogleg shape. The arm portion 3 has a plate shape and is made of aluminum or the like. And it protrudes so that it may incline downward with respect to the outer side area | region of the instrument housing | casing 1 outer periphery. On the lower surface of the arm portion 3, a power supply device 2 for supplying power to the LED 5 is provided. The power supply device 2 is preferably provided near the tip of the arm portion 3. With the configuration as described above, the heat of the rising LED 5 is not easily transmitted to the power supply device 2. Further, the heat generated from the power supply device 2 is not easily transmitted to the LED 5.

そして、ＬＥＤ実装放熱基板６には、棒状の放熱体７ａが熱的に接続され、放射状になっている放熱フィン４の略中央に器具筐体１から突出している。熱的に接続する手段として、ＬＥＤ実装放熱基板６と放熱体７ａとを同材料、同材質にする手段が例示できる。ここで、放熱体７ａに人が触れないように、突出している放熱体７ａの上に、一部の放熱フィン４が中央で交差して、放熱体７ａの上を覆うように構成される。   Then, a rod-like heat radiating body 7a is thermally connected to the LED mounting heat radiating board 6 and protrudes from the appliance housing 1 at the approximate center of the radiating heat radiating fins 4. As a means for thermally connecting, a means for making the LED mounting heat dissipating substrate 6 and the heat dissipating body 7a the same material and the same material can be exemplified. Here, in order to prevent a person from touching the heat radiating body 7a, a part of the heat radiating fins 4 intersects the center of the projecting heat radiating body 7a to cover the heat radiating body 7a.

次に、図２を参照しながら、放熱のメカニズムについて説明する。   Next, the mechanism of heat dissipation will be described with reference to FIG.

まず、ＬＥＤ５の熱がＬＥＤ実装放熱基板６に伝わり、その熱がそのまま放熱体７ａに伝わる。ここで、放熱体７ａの温度は、ＬＥＤ実装放熱基板６の温度とほぼ同じになる。   First, the heat of the LED 5 is transmitted to the LED mounting heat radiating substrate 6, and the heat is transmitted as it is to the heat radiating body 7a. Here, the temperature of the heat radiating body 7a is substantially the same as the temperature of the LED mounting heat radiating substrate 6.

一方、熱絶縁シート９が設けられている部分についても、熱抵抗が高いものの、ＬＥＤ実装放熱基板６に伝わったＬＥＤ５の熱は、器具筐体１に伝わり、この器具筐体１に伝わった熱が放熱フィン４に伝わる。   On the other hand, although the thermal insulation sheet 9 is also provided with a high thermal resistance, the heat of the LED 5 transmitted to the LED mounting heat radiating substrate 6 is transmitted to the instrument housing 1 and the heat transmitted to the instrument housing 1. Is transmitted to the radiation fin 4.

放熱フィン４に伝わった熱は、その表面から熱放出されて、器具筐体１の温度を下げ、さらには、ＬＥＤ実装放熱基板６の温度を下げる。   The heat transmitted to the heat radiating fins 4 is released from the surface to lower the temperature of the instrument housing 1 and further lower the temperature of the LED mounting heat radiating board 6.

ここで、放熱体７ａの温度は、放熱フィン４の温度より高いため、放熱体７ａからの熱上昇気流Ｘの速度は、放熱フィン４からの熱上昇気流Ｗの速度よりも大きい。熱上昇気流Ｘと熱上昇気流Ｗとの速度の差により、隣り合う放熱フィン４，４により形成された空間Ｓに対流Ｙが発生する。そして、対流Ｙにより、器具筐体１の外部からの対流Ｚが発生する。   Here, since the temperature of the heat radiating body 7 a is higher than the temperature of the heat radiating fin 4, the speed of the heat rising air flow X from the heat radiating body 7 a is larger than the speed of the heat rising air flow W from the heat radiating fin 4. Due to the difference in velocity between the heat rising air flow X and the heat rising air flow W, a convection Y is generated in the space S formed by the adjacent radiating fins 4 and 4. Then, convection Z from the outside of the instrument housing 1 is generated by the convection Y.

なお、放熱体７ａ上部の温度を限りなくＬＥＤ実装放熱基板６の温度と同じにすることで、熱上昇気流Ｘの速度が大きくなり、上記対流効果が向上する。   In addition, the speed of the heat rising airflow X becomes large and the said convection effect improves by making the temperature of the heat radiator 7a upper limit the same as the temperature of the LED mounting heat dissipation board 6.

したがって、ＬＥＤ５の熱が効率よく放熱されるため、放熱のために器具筐体１を大型化することなく、ＬＥＤに流す電流量を増やして、光出力を向上させることができる。
（実施形態２）
実施形態２に係る照明装置の斜視図を図３に、上面図を図４にそれぞれ示す。また、図５は、図４におけるＡ−Ａ断面図であり、図６は、図４におけるＢ−Ｂ断面図である。 Therefore, since the heat of the LED 5 is efficiently radiated, the amount of current flowing through the LED can be increased and the light output can be improved without increasing the size of the instrument housing 1 for radiating heat.
(Embodiment 2)
FIG. 3 is a perspective view of the lighting device according to the second embodiment, and FIG. 4 is a top view thereof. 5 is a cross-sectional view taken along line AA in FIG. 4, and FIG. 6 is a cross-sectional view taken along line BB in FIG.

実施形態１と同じ点については、説明を省略し、実施形態１と異なる点について、以下に説明する。   Description of the same points as in the first embodiment will be omitted, and points different from the first embodiment will be described below.

器具筐体１の底部外面には、複数の放熱フィン４が間隔を空けて一面に立設されている。この放熱フィン４はアルミニウムなどから略矩形状に形成されている。放熱フィン４は、器具筐体１と一体となっており、各放熱フィン４が略平行になるように立設されている。ここで、隣り合う放熱フィン４，４の間には、空間Ｓが形成される。   A plurality of radiating fins 4 are erected on the outer surface of the bottom of the instrument housing 1 at intervals. The heat radiating fins 4 are formed in a substantially rectangular shape from aluminum or the like. The radiating fins 4 are integrated with the appliance housing 1 and are erected so that the radiating fins 4 are substantially parallel to each other. Here, a space S is formed between the adjacent radiation fins 4 and 4.

外側の放熱フィン４の一つには、くの字状に曲げ加工されたアーム部３が引っ掛けられるように接合されている。このアーム部３は、板状であり、アルミニウム等からなる。そして、器具筐体１外周の外側領域に対して下方に傾斜するように突出している。   One of the outer radiating fins 4 is joined so as to be hooked by the arm portion 3 bent into a dogleg shape. The arm portion 3 has a plate shape and is made of aluminum or the like. And it protrudes so that it may incline downward with respect to the outer side area | region of the instrument housing | casing 1 outer periphery.

また、本実施形態では、実施形態１における棒状の放熱体７ａの代わりに、板状の放熱体７ｂがＬＥＤ実装放熱基板６に熱的に接続され、略平行になっている放熱フィン４と直角に交差するように器具筐体１から露出している。熱的に接続する手段として、ＬＥＤ実装放熱基板６と放熱体７ｂとを同材料、同材質にする手段が例示できる。ここで、放熱体７ｂに人が触れないように、放熱フィン４が放熱体７ｂの上を覆うように構成される。   Moreover, in this embodiment, instead of the rod-shaped radiator 7a in the first embodiment, a plate-like radiator 7b is thermally connected to the LED mounting radiator board 6 and perpendicular to the radiation fins 4 that are substantially parallel to each other. It is exposed from the instrument housing 1 so as to intersect with. As a means for thermally connecting, a means for making the LED mounting heat radiating substrate 6 and the heat radiating body 7b the same material and the same material can be exemplified. Here, the heat radiating fins 4 are configured to cover the heat radiating body 7b so that a person does not touch the heat radiating body 7b.

次に、図６を参照しながら、放熱のメカニズムについて説明する。   Next, the mechanism of heat dissipation will be described with reference to FIG.

まず、ＬＥＤ５の熱がＬＥＤ実装放熱基板６に伝わり、その熱がそのまま放熱体７ｂに伝わる。ここで、放熱体７ｂの温度は、ＬＥＤ実装放熱基板６の温度とほぼ同じになる。   First, the heat of the LED 5 is transmitted to the LED mounting heat radiating substrate 6, and the heat is transmitted to the heat radiating body 7b as it is. Here, the temperature of the heat radiating body 7b is substantially the same as the temperature of the LED mounting heat radiating substrate 6.

一方、熱絶縁シート９が設けられている部分についても、熱抵抗が高いものの、ＬＥＤ実装放熱基板６に伝わったＬＥＤ５の熱は、器具筐体１に伝わり、この器具筐体１に伝わった熱が放熱フィン４に伝わる。   On the other hand, although the thermal insulation sheet 9 is also provided with a high thermal resistance, the heat of the LED 5 transmitted to the LED mounting heat radiating substrate 6 is transmitted to the instrument housing 1 and the heat transmitted to the instrument housing 1. Is transmitted to the radiation fin 4.

放熱フィン４に伝わった熱は、その表面から熱放出されて、器具筐体１の温度を下げ、さらには、ＬＥＤ実装放熱基板６の温度を下げる。   The heat transmitted to the heat radiating fins 4 is released from the surface to lower the temperature of the instrument housing 1 and further lower the temperature of the LED mounting heat radiating board 6.

ここで、放熱体７ｂの温度は、放熱フィン４の温度より高いため、放熱体７ｂからの熱上昇気流Ｘの速度は、放熱フィン４からの熱上昇気流Ｗの速度よりも大きい。熱上昇気流Ｘと熱上昇気流Ｗとの速度の差により、隣り合う放熱フィン４，４により形成された空間Ｓに対流Ｙが発生する。そして、対流Ｙにより、器具筐体１の外部からの対流Ｚが発生する。   Here, since the temperature of the heat radiating body 7 b is higher than the temperature of the heat radiating fin 4, the speed of the heat rising air flow X from the heat radiating body 7 b is larger than the speed of the heat rising air flow W from the heat radiating fin 4. Due to the difference in velocity between the heat rising air flow X and the heat rising air flow W, a convection Y is generated in the space S formed by the adjacent radiating fins 4 and 4. Then, convection Z from the outside of the instrument housing 1 is generated by the convection Y.

なお、放熱体７ｂ上部の温度を限りなくＬＥＤ実装放熱基板６の温度と同じにすることで、熱上昇気流Ｘの速度が大きくなり、上記対流効果が向上する。   In addition, the speed of the heat rising airflow X becomes large and the said convection effect improves by making the temperature of the heat radiator 7b upper limit the same as the temperature of the LED mounting heat dissipation board 6.

したがって、本発明によれば、ＬＥＤ５の熱が効率よく放熱されるため、放熱のために器具筐体１を大型化することなく、ＬＥＤ５に流す電流量を増やして、光出力を向上させることができる。   Therefore, according to the present invention, since the heat of the LED 5 is efficiently radiated, the amount of current flowing through the LED 5 can be increased and the light output can be improved without increasing the size of the instrument housing 1 for radiating heat. it can.

実施形態１の照明装置を示す斜視図である。It is a perspective view which shows the illuminating device of Embodiment 1. FIG. アーム部と電源装置を除いた同照明装置を示す断面図である。It is sectional drawing which shows the same illuminating device except an arm part and a power supply device. 実施形態２の照明装置を示す斜視図である。It is a perspective view which shows the illuminating device of Embodiment 2. アーム部と電源装置を除いた同照明装置を示す上面図である。It is a top view which shows the same illuminating device except an arm part and a power supply device. アーム部と電源装置を除いた同照明装置を示す図４におけるＡ−Ａ断面図である。It is AA sectional drawing in FIG. 4 which shows the same illuminating device except an arm part and a power supply device. アーム部と電源装置を除いた同照明装置を示す図４におけるＢ−Ｂ断面図である。It is BB sectional drawing in FIG. 4 which shows the same illuminating device except an arm part and a power supply device. 従来例の照明装置を示す断面図である。It is sectional drawing which shows the illuminating device of a prior art example.

符号の説明Explanation of symbols

１ 器具筐体
２ 電源装置
３ アーム部
４ 放熱フィン
５ ＬＥＤ
６ ＬＥＤ実装放熱基板
７ａ、７ｂ 放熱体
８ レンズ体
９ 熱絶縁シート（熱絶縁手段）
Ｓ 空間 DESCRIPTION OF SYMBOLS 1 Instrument housing | casing 2 Power supply device 3 Arm part 4 Radiation fin 5 LED
6 LED mounting heat dissipation board 7a, 7b Heat dissipation body 8 Lens body 9 Thermal insulation sheet (thermal insulation means)
S space

Claims (7)

内部にＬＥＤが収納された器状である器具筐体を有し、当該器具筐体の開口部が下側を向くように設けられる照明装置であって、
ＬＥＤを実装し、熱絶縁手段を介して器具筐体の内面に接合されるＬＥＤ実装放熱基板と、
器具筐体の底部外面に間隔を空けて立設される複数の放熱フィンと、
器具筐体の底部を貫通して、ＬＥＤ実装放熱基板に接合され、器具筐体の底部外面において、隣り合う２つの放熱フィンにより形成された空間に連通する位置で露出する放熱体と、
を備えることを特徴とする照明装置。 It is a lighting device that has an instrument housing that is a container shape in which LEDs are housed, and is provided so that the opening of the instrument housing faces downward.
LED mounting heat dissipating board which mounts LED and is joined to the inner surface of the instrument housing via thermal insulation means;
A plurality of heat dissipating fins erected on the outer surface of the bottom of the instrument housing at intervals,
A radiator that penetrates the bottom of the instrument housing, is bonded to the LED mounting heat dissipation substrate, and is exposed at a position communicating with the space formed by two adjacent radiation fins on the bottom outer surface of the instrument casing;
A lighting device comprising: 複数の放熱フィンが器具筐体の底部外面の略中央から放射状に設けられていることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein a plurality of heat radiation fins are provided radially from substantially the center of the outer surface of the bottom of the appliance housing. 放射状に設けられた複数の放熱フィンの略中央に棒状の放熱体が設けられていることを特徴とする請求項２に記載の照明装置。   The lighting device according to claim 2, wherein a rod-shaped heat radiator is provided at substantially the center of the plurality of radiation fins provided radially. 複数の放熱フィンが略平行に設けられていることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein a plurality of heat radiation fins are provided substantially in parallel. 略平行に設けられた複数の放熱フィンと交差する板状の放熱体が設けられていることを特徴とする請求項４に記載の照明装置。   The lighting device according to claim 4, wherein a plate-like heat dissipating member intersecting with the plurality of heat dissipating fins provided substantially in parallel is provided. 放熱フィンが放熱体の露出している部分より高く立設されていることを特徴とする請求項１〜５のいずれか１項に記載の照明装置。   The lighting device according to any one of claims 1 to 5, wherein the radiation fins are erected higher than a portion where the radiator is exposed. 熱絶縁手段として、熱絶縁シートを用いることを特徴とする請求項１〜６のいずれか１項に記載の照明装置。   The lighting device according to claim 1, wherein a heat insulating sheet is used as the heat insulating means.
JP2007044691A 2007-02-23 2007-02-23 Illuminating device Pending JP2008210593A (en)

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